CA1046683A - Process for preparing photosensitive polymer - Google Patents
Process for preparing photosensitive polymerInfo
- Publication number
- CA1046683A CA1046683A CA193,832A CA193832A CA1046683A CA 1046683 A CA1046683 A CA 1046683A CA 193832 A CA193832 A CA 193832A CA 1046683 A CA1046683 A CA 1046683A
- Authority
- CA
- Canada
- Prior art keywords
- group
- polymer
- carboxylic acid
- halogen atom
- unsaturated carboxylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
- C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
- C08G65/3324—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic
- C08G65/3326—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof cyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/333—Polymers modified by chemical after-treatment with organic compounds containing nitrogen
- C08G65/33396—Polymers modified by chemical after-treatment with organic compounds containing nitrogen having oxygen in addition to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G85/00—General processes for preparing compounds provided for in this subclass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Abstract
ABSTRACT OF THE DISCLOSURE
The present invention provides a process for preparing a photosensitive polymer by reacting a polymer having an active halogen atom with an .alpha.,.beta.-unsturated carboxylic acid having the formula (I).
Ar-(YC = CX)n - ? - OH (I) wherein X and Y reprerent hydrogen atom, halogen atom, cyano group or nitro group; Ar represents an aryl group which can be substituted with a nitro or cyano group and m is 1 or 2, in an aprotic polar solvent, which is characterized in that the reaction is conducted in the presence of a bicyclic amidine having the formula (II) wherein R1 represents C1-11 alkylene group which can be substitutcd by a lower alkyl group and R2 represents propylene group which can be substituted by a lower alkyl group. A photosensitive composition may be made by dissolving the photosensitive polymer in a suitable solvent, and adding a conventional sensitizer, if necessary with a stabilizer plasticizer and various dyes and pigments.
The photosensitive compositions can be used as photoresists for preparation of printed circuits, for preparation of IC, for chemical milling, for printing plates for relief printing and intaglio processes and for photoprinting plates. They can also be used as photocurable paint, and as photoadhesives.
The present invention provides a process for preparing a photosensitive polymer by reacting a polymer having an active halogen atom with an .alpha.,.beta.-unsturated carboxylic acid having the formula (I).
Ar-(YC = CX)n - ? - OH (I) wherein X and Y reprerent hydrogen atom, halogen atom, cyano group or nitro group; Ar represents an aryl group which can be substituted with a nitro or cyano group and m is 1 or 2, in an aprotic polar solvent, which is characterized in that the reaction is conducted in the presence of a bicyclic amidine having the formula (II) wherein R1 represents C1-11 alkylene group which can be substitutcd by a lower alkyl group and R2 represents propylene group which can be substituted by a lower alkyl group. A photosensitive composition may be made by dissolving the photosensitive polymer in a suitable solvent, and adding a conventional sensitizer, if necessary with a stabilizer plasticizer and various dyes and pigments.
The photosensitive compositions can be used as photoresists for preparation of printed circuits, for preparation of IC, for chemical milling, for printing plates for relief printing and intaglio processes and for photoprinting plates. They can also be used as photocurable paint, and as photoadhesives.
Description
-~046683 The present invention relates to a process for prepar-ing a photosensitive polymer. More particularly, the present invention relates to a process for preparing a photosensitive polymer having an active halogen atom reacted with an unsaturated carboxylic acid, e.g., cinnamic acid.
It is known that cinnamic acid and derivatives thereof can be photodimerized. It is also known that photosensitive poly-mers prepared by reacting cinnamic acid with polyvinyl alcohol or cellulose, can be cross-linked by an irradiation of light to form insoluble polymers, and the polymers have been used in various fields.
It has further been proposed to introduce a cinnamic acid residual group to a polyether type polymer so as to impart high mechanical propertiss and solvent resistivity to the polymer.
There are two methods of preparation of the photosensitive poly-mers, namely:
tl) homopolymerization or copolymerization of a poly-merizable monomer having the photosensitive group; and .... .
It is known that cinnamic acid and derivatives thereof can be photodimerized. It is also known that photosensitive poly-mers prepared by reacting cinnamic acid with polyvinyl alcohol or cellulose, can be cross-linked by an irradiation of light to form insoluble polymers, and the polymers have been used in various fields.
It has further been proposed to introduce a cinnamic acid residual group to a polyether type polymer so as to impart high mechanical propertiss and solvent resistivity to the polymer.
There are two methods of preparation of the photosensitive poly-mers, namely:
tl) homopolymerization or copolymerization of a poly-merizable monomer having the photosensitive group; and .... .
(2) substitution of the photosensitive group into a polymer having an active group to which the photosensitive group can be introduced.
This invention relates to a preparation of a photosen-, . . .
i sitive polymer by a reaction with a polymer, i.e., process (2).
The inventors have proposed the following process for reacting :,:
cinnamic acid group or a like with a polymer having a halogen atom to introduce said group.
; The polymer having a halogen atom is reacted with a I salt of an ~,~-unsaturated carboxylic acid having the formulaJ
(I) 30` Ar-(YC = CX)n - C - OH (I) ~ wherei~ X and Y represent hydrogen atom, halogen atom, cyano i group or nitro group and Ar represents an unsubstituted aryl group or such a group substituted by nitro or cyano group and n represents an integer of 1 or 2, in a polar solvent. The cation for forming the salt can be a metal salt, e.g. ~, Na, Li or a quaternary ammonium salt, e.g. tetraethyl ammonium, tetramethyl ammonium, trimethylbenzyl ammonium, etc.
However, the proposed process has the following disad-vantages:
(1) The reaction operation and control have not been easy, because the reaction system has been heterogeneous. As the property of the photosensitive polymer is usually changed depend-ing upon a substitution rate of the halogen atom in the polymer, it has been necessary to precisely control the substitution rate.
Accordingly, the fact that the reaction control is not easy, is a serious disadvantage in practice.
(2) The salt of an a,~-unsaturated carboxylic acid must be prepared or the a,~-unsaturated carboxylic acid and a hydroxide of said base have been added and water formed by the reaction must be removed in the reaction, as the reaction has been adversely affected by the presence of a protonic material, e.g. water so that the reaction velocity has been decreased.
Accordingly, it has been desirable to eliminate such a trouble-some step.
This invention relates to a preparation of a photosen-, . . .
i sitive polymer by a reaction with a polymer, i.e., process (2).
The inventors have proposed the following process for reacting :,:
cinnamic acid group or a like with a polymer having a halogen atom to introduce said group.
; The polymer having a halogen atom is reacted with a I salt of an ~,~-unsaturated carboxylic acid having the formulaJ
(I) 30` Ar-(YC = CX)n - C - OH (I) ~ wherei~ X and Y represent hydrogen atom, halogen atom, cyano i group or nitro group and Ar represents an unsubstituted aryl group or such a group substituted by nitro or cyano group and n represents an integer of 1 or 2, in a polar solvent. The cation for forming the salt can be a metal salt, e.g. ~, Na, Li or a quaternary ammonium salt, e.g. tetraethyl ammonium, tetramethyl ammonium, trimethylbenzyl ammonium, etc.
However, the proposed process has the following disad-vantages:
(1) The reaction operation and control have not been easy, because the reaction system has been heterogeneous. As the property of the photosensitive polymer is usually changed depend-ing upon a substitution rate of the halogen atom in the polymer, it has been necessary to precisely control the substitution rate.
Accordingly, the fact that the reaction control is not easy, is a serious disadvantage in practice.
(2) The salt of an a,~-unsaturated carboxylic acid must be prepared or the a,~-unsaturated carboxylic acid and a hydroxide of said base have been added and water formed by the reaction must be removed in the reaction, as the reaction has been adversely affected by the presence of a protonic material, e.g. water so that the reaction velocity has been decreased.
Accordingly, it has been desirable to eliminate such a trouble-some step.
(3) It is not preferable to include an alkali metal, even through it is at a ppm level, in the photosensitive polymer used in electronics field. When the salt of an a,~-unsaturated carboxylic acid contain a cation of K, ~a or Li, the photosensi-tiVe polymer has been contaminated with said cation so as to pro-vide the disadvantageous affect to electric characteristics.
The present invention provides a process for readily 30 preparing a photosensitive polymer having essentially no contam-ination under well controlled condition.
According to the present invention there is provided a ~ -, .
10~6683 process for the preparation of a photosensitive polymer which comprises reacting a polymer having an active halogen atom with the a,~-unsaturated carboxylic acid having the formula ~I] in an aprotic polar solvent, in the presence of a bicyclic amidine (diazabicyclic alkene) having the formula [II]
~ C===N ~ [II]
Rl I R
~ N ~ 2 wherein Rl represents Cl 11 alkylene group which can be substi-tuted with a lower alkyl group and R2 represents propylene group which can be substituted with a lower alkyl group.
Suitable polymers having an active halogen atom are preferably halogen containing polyethers such as homopolymers of a halogen containing epoxy compound e.g. epichlorohydrin, epi-bromohydrin, 1,2-dichloro-3,4-epoxybutane, 1,1-dichloro-2,3-epoxypropane, 3,3-bis(chloromethyl) oxetane or 3,3-bis(bromo-methyl)oxetane. The polymers can be copolymers formed by copoly-merizing said halogen containing epoxy compound with an alkylene-~0 oxide e.g. ethylene oxide, propylene oxide or butylene oxide; or .; .
an epoxyether e.g. methylglycidylether or phenylglycidylether;
or an oxetane (trimethyleneoxide) e.g. oxetane, 3-methyloxetane, ~; or 3,3-dimethyloxetane or an epoxy compound e.g. styrene oxide.
The polymers may also be other halogen containing vinyl polymers ~`
such as polyvinylchloride, copolymers of vinylchloride-vinyl-acetate; polymers of vinylethers e.g. ~-chloroethylvinylether;
or acrylicpolymers suchas 2-chloroethyl acrylate. The polymers having an active halogen atom are preferably used in the process of the invention.
Suitable a,~-unsaturated carboxylic acids having the formula [I] include, for example, cinnamic acid, cinnamylidene acetic acid, ~-nitrocinnamic acid, ~-cyanocinnamic acid, ~-(1)-naphthylacrylic acid ~r ~-(9)-anthryl acrylic acid.
:
The bicyclic amidines have the fo~mula [II] wherein R
represents cl 11 alkylene group or a lower alkyl (especially methyl) substituted Cl ~ alkylene group; and R2 represents propylene group or a lower alkyl (especially methyl) substituted propylene group are pre~erred.
Suitable bicyclic amidines include 1,5-diazabicyclo [4.2.0] octene-5; 1,5-diazabicyclo[~.3.0] nonene-5;
1,5-dia~a-3-methylbicyclo[4.3.0] nonene-5;
1,5-diazabicyclo[4.4.0] decene~5;
1,5-diaza-10-methylbicyclo[4.4.0] decene-5;
1,8-diazabicyclo[5.4.0] undecene-7 (hereinafter referring to as DBU);
1,9-diazabicyclo[6.4.0] dodecene-8;
1,10-diazabicyclo[7.4.0] tridecene-9; and 1,14-diazabicyclo[11.4.0] heptadecene-13i It is especially effective to use the bicyclic amidine wherein Rl represents C3_5 ~e~e-group. The bicycllc amidines can be usually prepared by reacting a lactam having 1-12 carbon atoms with acrylonitrile.
In the process of the invention, it is necessary to react the polymer having an active halogen atom with the ~ f-unsaturated carboxylic acid in an aprotic solvent in the presence of said bicyclic amidine.
Suitable aprotic solvents include dimethylformamide, diethylformamide, dimethylacetoamide, tetramethylurea, dimethyl-sulfoxide, hexamethylphosphoric triamide, or N-methylpyrrolidone.
There are various methods of providing the bicyclic amidine in the reaction of the polymer having an active halogen atom with thec~,~ -unsaturated carboxylic acid. For example, the polymer having an active halogen atom may be dissolved in the aprotic polar solvent and then the 4,~ -unsaturated carboxy-lic acid and the bicyclic amidine added.
The present invention provides a process for readily 30 preparing a photosensitive polymer having essentially no contam-ination under well controlled condition.
According to the present invention there is provided a ~ -, .
10~6683 process for the preparation of a photosensitive polymer which comprises reacting a polymer having an active halogen atom with the a,~-unsaturated carboxylic acid having the formula ~I] in an aprotic polar solvent, in the presence of a bicyclic amidine (diazabicyclic alkene) having the formula [II]
~ C===N ~ [II]
Rl I R
~ N ~ 2 wherein Rl represents Cl 11 alkylene group which can be substi-tuted with a lower alkyl group and R2 represents propylene group which can be substituted with a lower alkyl group.
Suitable polymers having an active halogen atom are preferably halogen containing polyethers such as homopolymers of a halogen containing epoxy compound e.g. epichlorohydrin, epi-bromohydrin, 1,2-dichloro-3,4-epoxybutane, 1,1-dichloro-2,3-epoxypropane, 3,3-bis(chloromethyl) oxetane or 3,3-bis(bromo-methyl)oxetane. The polymers can be copolymers formed by copoly-merizing said halogen containing epoxy compound with an alkylene-~0 oxide e.g. ethylene oxide, propylene oxide or butylene oxide; or .; .
an epoxyether e.g. methylglycidylether or phenylglycidylether;
or an oxetane (trimethyleneoxide) e.g. oxetane, 3-methyloxetane, ~; or 3,3-dimethyloxetane or an epoxy compound e.g. styrene oxide.
The polymers may also be other halogen containing vinyl polymers ~`
such as polyvinylchloride, copolymers of vinylchloride-vinyl-acetate; polymers of vinylethers e.g. ~-chloroethylvinylether;
or acrylicpolymers suchas 2-chloroethyl acrylate. The polymers having an active halogen atom are preferably used in the process of the invention.
Suitable a,~-unsaturated carboxylic acids having the formula [I] include, for example, cinnamic acid, cinnamylidene acetic acid, ~-nitrocinnamic acid, ~-cyanocinnamic acid, ~-(1)-naphthylacrylic acid ~r ~-(9)-anthryl acrylic acid.
:
The bicyclic amidines have the fo~mula [II] wherein R
represents cl 11 alkylene group or a lower alkyl (especially methyl) substituted Cl ~ alkylene group; and R2 represents propylene group or a lower alkyl (especially methyl) substituted propylene group are pre~erred.
Suitable bicyclic amidines include 1,5-diazabicyclo [4.2.0] octene-5; 1,5-diazabicyclo[~.3.0] nonene-5;
1,5-dia~a-3-methylbicyclo[4.3.0] nonene-5;
1,5-diazabicyclo[4.4.0] decene~5;
1,5-diaza-10-methylbicyclo[4.4.0] decene-5;
1,8-diazabicyclo[5.4.0] undecene-7 (hereinafter referring to as DBU);
1,9-diazabicyclo[6.4.0] dodecene-8;
1,10-diazabicyclo[7.4.0] tridecene-9; and 1,14-diazabicyclo[11.4.0] heptadecene-13i It is especially effective to use the bicyclic amidine wherein Rl represents C3_5 ~e~e-group. The bicycllc amidines can be usually prepared by reacting a lactam having 1-12 carbon atoms with acrylonitrile.
In the process of the invention, it is necessary to react the polymer having an active halogen atom with the ~ f-unsaturated carboxylic acid in an aprotic solvent in the presence of said bicyclic amidine.
Suitable aprotic solvents include dimethylformamide, diethylformamide, dimethylacetoamide, tetramethylurea, dimethyl-sulfoxide, hexamethylphosphoric triamide, or N-methylpyrrolidone.
There are various methods of providing the bicyclic amidine in the reaction of the polymer having an active halogen atom with thec~,~ -unsaturated carboxylic acid. For example, the polymer having an active halogen atom may be dissolved in the aprotic polar solvent and then the 4,~ -unsaturated carboxy-lic acid and the bicyclic amidine added.
- 4 --~- . . . ~ -. - . -104~683 The ~ unsaturated carboxylic acid may be reacted with the bicyclic amidine to form the salt, and the salt is added to the solution of the polymer having an active halogen atom in the aprotic polar solvent. The a,~-unsaturated carboxylic acid and the bicyclic amidine may be dissolved in the aprotic polar sol- `
vent and the polymer having an active halogen atom is dissolved in the solution.
An amount of the bicyclic amidine is not limited and can be discretionally selected, however it is preferable to add about equimolar ratio to the a,~-unsaturated carboxylic acid.
The reaction is usually conducted at a room temperatùre to 100C in an inert gas atmosphere. It is not preferable to conduct the reaction at higher than 100C because of the possi-bility of gelation of the polymer. After the reaction, the reaction mixture is poured in a poor solvent to precipitate the photo-sensitive polymer.
In accordance with the process of the invention, the photosensitive polymer prepared by substituting a part or most parts of the active halogen atom of the polymer with the ,~-unsaturated carboxylic acid residual group, is obtained. Thephotosensitive polymer has excellent properties, is readily useable and is stable. As the reaction system is completely . . .
homogeneous,reaction control is easy. As no water is preset in the reaction system, no disadvantageous effect is caused in the reaction. The photosensitive polymer is not contaminated with . ~ .
, an alkali metal compound. Even though~ a small amount of the bicyclic amidine is included in the photosensitive poIymer, the effect to electrical characteristic is small compared with that produced by contamination of alkali metal compound.
''''':: : '' :
vent and the polymer having an active halogen atom is dissolved in the solution.
An amount of the bicyclic amidine is not limited and can be discretionally selected, however it is preferable to add about equimolar ratio to the a,~-unsaturated carboxylic acid.
The reaction is usually conducted at a room temperatùre to 100C in an inert gas atmosphere. It is not preferable to conduct the reaction at higher than 100C because of the possi-bility of gelation of the polymer. After the reaction, the reaction mixture is poured in a poor solvent to precipitate the photo-sensitive polymer.
In accordance with the process of the invention, the photosensitive polymer prepared by substituting a part or most parts of the active halogen atom of the polymer with the ,~-unsaturated carboxylic acid residual group, is obtained. Thephotosensitive polymer has excellent properties, is readily useable and is stable. As the reaction system is completely . . .
homogeneous,reaction control is easy. As no water is preset in the reaction system, no disadvantageous effect is caused in the reaction. The photosensitive polymer is not contaminated with . ~ .
, an alkali metal compound. Even though~ a small amount of the bicyclic amidine is included in the photosensitive poIymer, the effect to electrical characteristic is small compared with that produced by contamination of alkali metal compound.
''''':: : '' :
- 5 -.~ ,.
- ., ~ ~ . - . - - . . , . , . .:
~046683 The photosensitive composition can be prepared by dis-solving the photosensitive polymer of the invention in a suitable solvent e.g. chlorobenzene, xylene, methylcellosolve acetate, ethylcellosolve acetate and pentoxone and adding a conventional sensitizer e.g. picramide, nitronaphthalene, 5-nitroacenaphthene, 2-nitrofluorene, benzophenone, Michler's ketone, naphthoquinone, anthraquinone, 2,3-diphenylanthraquinone and benzathrone, and if necessar~, with a stabilizer of hydroquinone, t-butylcatechol; a plasticizer e.g. triacetin, triethyleneglycol dipropionate, and various dyes and pigments. The photosensitive compositions can be used for various applications. For example, they may be used as photoresists for preparation of printed circuits, for prepara-tion of IC, for chemical milling, for printing plates for relief printing and intaglio processes and for photoprinting plates.
They can also be used as a photocurable paintor a photoadhesive.
The present invention will be further illustrated by way of the following Examples.
[Example 1]
10 g of polyepichlorohydrin having a reduced specific viscosity ~SP/C = 0.97 (0.2 g/dl benzene sol. at 30C) was dis-solved in 342 ml of dimethylformamide and 20.8 g of cinnamic acid and 21.4 g of DBU were added. A homogeneous solution was formed. The reaction was conducted at 85C for 10 hours with stirring in an argon atmosphere. The reaction was always con-ducted in homogeneous system. A part of the reaction mixture was sampled and the chlorine ion formed by the reaction was measured with silver nitrate by a potentiometric titration method. It was found that 58% of the chlorine atoms of the poly-epichlorohydrin was replaced with cinnamic acid radicals.
The reaction mixture was poured in about2 1 of methanol "'":
:'
- ., ~ ~ . - . - - . . , . , . .:
~046683 The photosensitive composition can be prepared by dis-solving the photosensitive polymer of the invention in a suitable solvent e.g. chlorobenzene, xylene, methylcellosolve acetate, ethylcellosolve acetate and pentoxone and adding a conventional sensitizer e.g. picramide, nitronaphthalene, 5-nitroacenaphthene, 2-nitrofluorene, benzophenone, Michler's ketone, naphthoquinone, anthraquinone, 2,3-diphenylanthraquinone and benzathrone, and if necessar~, with a stabilizer of hydroquinone, t-butylcatechol; a plasticizer e.g. triacetin, triethyleneglycol dipropionate, and various dyes and pigments. The photosensitive compositions can be used for various applications. For example, they may be used as photoresists for preparation of printed circuits, for prepara-tion of IC, for chemical milling, for printing plates for relief printing and intaglio processes and for photoprinting plates.
They can also be used as a photocurable paintor a photoadhesive.
The present invention will be further illustrated by way of the following Examples.
[Example 1]
10 g of polyepichlorohydrin having a reduced specific viscosity ~SP/C = 0.97 (0.2 g/dl benzene sol. at 30C) was dis-solved in 342 ml of dimethylformamide and 20.8 g of cinnamic acid and 21.4 g of DBU were added. A homogeneous solution was formed. The reaction was conducted at 85C for 10 hours with stirring in an argon atmosphere. The reaction was always con-ducted in homogeneous system. A part of the reaction mixture was sampled and the chlorine ion formed by the reaction was measured with silver nitrate by a potentiometric titration method. It was found that 58% of the chlorine atoms of the poly-epichlorohydrin was replaced with cinnamic acid radicals.
The reaction mixture was poured in about2 1 of methanol "'":
:'
- 6 -i,,, . - ., .. . - .. .. : . . - . - - : . , .
.:
to precipitate polymer ~nd the cake polymer was cut and washed with -methanol and was dried.
The infrared spectrum and elementary analysis of the resulting polymer showed that the polymer has the following formula tCH2 - CH ~ ~~ .56 ~~ CH2 \ ~ .44 CH20C - CH = CH ~ CH2 - C~
, O
~Example 2]
2.5 g of polyepichlorohydrin (~ SP/C = 1.05) was dissolved in 81.2 m~ of N-methylpyrrolidone and 5.2 g of cinnamic acid and `
5.3 g of DBU were added and the reaction was conducted at 80C for
.:
to precipitate polymer ~nd the cake polymer was cut and washed with -methanol and was dried.
The infrared spectrum and elementary analysis of the resulting polymer showed that the polymer has the following formula tCH2 - CH ~ ~~ .56 ~~ CH2 \ ~ .44 CH20C - CH = CH ~ CH2 - C~
, O
~Example 2]
2.5 g of polyepichlorohydrin (~ SP/C = 1.05) was dissolved in 81.2 m~ of N-methylpyrrolidone and 5.2 g of cinnamic acid and `
5.3 g of DBU were added and the reaction was conducted at 80C for
7.5 hours as described in Example 1, 47% of chlorine atoms of the , polyepichlorohydrin were replaced with cinnamic acid radical.
[Example 3]
The process of Example 1 was repeated using the same conditions except excess of 1~5-diazabicyclo [4.3.0] nonene-5 was ; used instead of DBU. 54% of chlorine atoms of the polyepichloro-hydrin was replaced with cinnamic acid radicàl.
., .
. ' .
.~
~ 30 ( , : ~:
[Example 3]
The process of Example 1 was repeated using the same conditions except excess of 1~5-diazabicyclo [4.3.0] nonene-5 was ; used instead of DBU. 54% of chlorine atoms of the polyepichloro-hydrin was replaced with cinnamic acid radicàl.
., .
. ' .
.~
~ 30 ( , : ~:
Claims (11)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In a process for preparing a photosensitive polymer by reacting a polymer having an active halogen atom selected from the group consisting of halogen-containing poly-ethers, halogen-containing vinyl polymers, halogen-containing polyvinylethers and halogen-containing acryl polymers with an unsaturated carboxylic acid having the formula (I) Ar-(YC = CX)n - ? - OH (I) wherein X and Y represent hydrogen atom, halogen atom, cyano group or nitro group; Ar represents an aryl group which can be substituted with a nitro or cyano group and n is 1 or 2, in an aprotic polar solvent, an improvement which is characterized in that the reaction is conducted in the presence of a bicyclic amidine having the formula (II) (II) wherein R1 represents C1-11 alkylene group which can be sub-stituted by a lower alkyl and R2 represents propylene group which can be substituted by a lower alkyl group.
2. A process as claimed in claim 1 wherein R1 is a C1-11 alkylene group or methyl C1-11 alkylene group; and R2 is a propylene group or methyl propylene group.
3. A process as claimed in claim 1 wherein 5 - 100%
of the active halogen atoms in said polymer is replaced with the unsaturated carboxylic radical.
of the active halogen atoms in said polymer is replaced with the unsaturated carboxylic radical.
4. A process as claimed in claim 1, 2 or 3 wherein 0.1 - 10 molar ratio of the bicyclic amidine to the unsaturated carboxylic acid is added.
5. A process as claimed in claim 1, 2 or 3 wherein 0.5 - 5 molar ratio of bicyclic amidine to .alpha.,.beta.-unsaturated carboxylic acid is added.
6. A process as claimed in claim 1, 2 or 3 wherein said bicyclic amidine is added together with the .alpha.,.beta.-unsaturated carboxylic acid in a solution of the polymer having an active halogen atom in the aprotic polar solvent.
7. A process as claimed in claim 1, 2 or 3 wherein said bicyclic amidine and the .alpha.,.beta.-unsaturated carboxylic acid are dissolved in the solvent and the polymer having an active halogen atom is added in the solution.
8. A process as claimed in claim 1, 2 or 3 wherein the reaction is conducted at a room temperature to 100°C in a homogeneous condition.
9. A process as claimed in claim 1, 2 or 3 in which R1 is a C3-C5 alkylene group.
10. A process as claimed in claim 1 in which the polymer having an active halogen atom is a halogen containing polyether.
11. A process as claimed in claim 1, 2 or 3 in which the carboxylic acid is cinnamic acid, the polymer having active halogen is a polyepichlorohydrin and the amidine is 1,8-diaza-bicyclo[5.4.0]undecene-7 or 1,5-diazabicyclo[4,3,0]nonene-5.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48025270A JPS5116235B2 (en) | 1973-03-03 | 1973-03-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1046683A true CA1046683A (en) | 1979-01-16 |
Family
ID=12161322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA193,832A Expired CA1046683A (en) | 1973-03-03 | 1974-03-01 | Process for preparing photosensitive polymer |
Country Status (8)
Country | Link |
---|---|
US (1) | US3923703A (en) |
JP (1) | JPS5116235B2 (en) |
CA (1) | CA1046683A (en) |
DE (1) | DE2410066A1 (en) |
FR (1) | FR2219955B1 (en) |
GB (1) | GB1404927A (en) |
IT (1) | IT1004348B (en) |
NL (1) | NL7401941A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4165418A (en) * | 1971-04-15 | 1979-08-21 | Imperial Chemical Industries Limited | Paint manufacture |
JPS5744144Y2 (en) * | 1979-11-17 | 1982-09-29 | ||
US4518473A (en) * | 1981-08-06 | 1985-05-21 | The Upjohn Company | Compositions and process |
US4446247A (en) * | 1981-08-06 | 1984-05-01 | The Upjohn Company | Compositions and process |
US4425208A (en) | 1981-08-06 | 1984-01-10 | The Upjohn Company | Compositions and process |
DE3227552A1 (en) * | 1982-07-23 | 1984-01-26 | Dynamit Nobel Ag, 5210 Troisdorf | COPOLYMERISATE WITH ETHYLENICALLY UNSATURATED BASIC BLOCKS AND SEVERAL FUNCTIONAL GROUPS |
JPS61201239A (en) * | 1985-03-04 | 1986-09-05 | Agency Of Ind Science & Technol | Light information recording composition |
JPS61150569U (en) * | 1985-03-12 | 1986-09-17 | ||
JPS6317901Y2 (en) * | 1985-04-26 | 1988-05-20 | ||
US5824717A (en) * | 1988-05-27 | 1998-10-20 | Exxon Chemical Patents Inc. | Peroxide and radiation curable compositions containing isobutylenene copolymers having acrylate functionality |
JPH06504628A (en) * | 1990-12-20 | 1994-05-26 | エクソン・ケミカル・パテンツ・インク | UV/EB curable butyl copolymers for lithography and anti-corrosion coating applications |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929683B1 (en) * | 1970-09-16 | 1974-08-06 |
-
1973
- 1973-03-03 JP JP48025270A patent/JPS5116235B2/ja not_active Expired
-
1974
- 1974-02-08 US US440770A patent/US3923703A/en not_active Expired - Lifetime
- 1974-02-13 FR FR7404859A patent/FR2219955B1/fr not_active Expired
- 1974-02-13 NL NL7401941A patent/NL7401941A/xx not_active Application Discontinuation
- 1974-03-01 GB GB936274A patent/GB1404927A/en not_active Expired
- 1974-03-01 CA CA193,832A patent/CA1046683A/en not_active Expired
- 1974-03-02 DE DE2410066A patent/DE2410066A1/en not_active Withdrawn
- 1974-03-04 IT IT48932/74A patent/IT1004348B/en active
Also Published As
Publication number | Publication date |
---|---|
FR2219955B1 (en) | 1976-10-08 |
NL7401941A (en) | 1974-09-05 |
FR2219955A1 (en) | 1974-09-27 |
US3923703A (en) | 1975-12-02 |
DE2410066A1 (en) | 1974-09-19 |
JPS49113887A (en) | 1974-10-30 |
IT1004348B (en) | 1976-07-10 |
JPS5116235B2 (en) | 1976-05-22 |
GB1404927A (en) | 1975-09-03 |
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