CA1183402A - Orifice plate for ink jet printing machines - Google Patents

Orifice plate for ink jet printing machines

Info

Publication number
CA1183402A
CA1183402A CA000397497A CA397497A CA1183402A CA 1183402 A CA1183402 A CA 1183402A CA 000397497 A CA000397497 A CA 000397497A CA 397497 A CA397497 A CA 397497A CA 1183402 A CA1183402 A CA 1183402A
Authority
CA
Canada
Prior art keywords
areas
substrate
forming
orifice plate
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000397497A
Other languages
French (fr)
Inventor
Joel M. Pollack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of CA1183402A publication Critical patent/CA1183402A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Abstract

ABSTRACT OF THE DISCLOSURE
An orifice plate for use in ink jet printing machines is produced by an electroplating technique. The plate is bilaminar with nickel being plated onto copper to form a substantially rigid structure.

Description

334Qæ

AN ORIFICE PL~TE FOR INK J~T PRINTING MACHINES
This invention relates generally to ink jet printing machines, and more particularly concerns an orifice plate for use therein.
In ink iet printing systems, a jet of ink is formed by forcing ink under pressure through a nozzle. The jet of ink can be made to break up into droplets of substantially equal size and spacing by vibrating the nozzle or by otherwise ereating a periodic pressure or velocity perturbation on the jet, preferably in the vicinity of the nozzle orifice. Printing is effected by controlling the flight of the droplets to a target such as paper. Significant characteristics of ink jet printing applications are the size of respective nozzles, spacial distribution of the nozzles in an array and the technique for creating the periodic perturbations on the jet. Such factors affect the velocity uniformity of the fluid emitted from the respective nozzle, dire~
tionality of the respective droplets, and breakoff distance of individual droplets.
One of the critical requirements in an ink jet printing machine is the orifice plate which will produce several hundred jets of ink whieh are precisely positioned, precisely parallel, and precisely uniform. The orifice plate must also be compatible with the ink compositions used, and must be resistant to corrosion by the ink. Hereinbefore, orifice plates were fabrieated by using electroforming techniques. This approach yielded orifices with acceptaMe accuracy but which were difficult to mount. ~y the nature of this process, holes are adequately formed in materials of less than two mils thick.
Generally, nickel, which exhibits high tensil strength, is utilized. However, nickel is very flexible. The orifice plate is desirably rigid and thin to define a plane for the orifices.
Various approaches have been devised for constructing thin plates.
The following disclosures appear to be relevant to ink jet printing systems:
U.S. Patent No. 3,701,998 Patentee: Mathis Issued: October 31,197 2 U.S. Patent No. 3,726,770 Patentee: Futterer Tssued: April 10, ]973 ,~

3~

U.S. Patent No. 3~94~,410 Patentee~ Bassous et al.
Issued: April 6,1976 5U~S. Patent No. 4,007,464 Patentee: Bassous et al.
Issuedo February 8,1977 U3. Paterlt No. 4,031,561 Patentee: Paranjpe Issued- June 21,1977 U~S. Patent No. 4,058,432 Patentee~ Schuster-Woldan et al.
15 Issued: November 15,1!377 UOS. Patent No. 4,184,925 Patentee: Kenwcrthy Issued: January 22,1380 IBM Technical Disclosure Bulletin \Fol. 21, No. 11 Author: Gould, Jr.
DateO April~ 1979 The relevant portions of the foregoing disclosures may be briefly summarized as follows-Mathis discloses a jet drop recorder having a recording head comprising an orifice plate attached to a fluid supply manifold. The or;fice 30 plate is preferably formed of a relatively stiff material such as stainless steel or nickel coated berylium-copper but is relatively thin to provide the required fle~ibility for direct contact stimulation.
Futterer describes a process for producing a master negative suitable for the production of a number of perforated foils. An alkali resistant35 metal base plate is covered with a pattern of areas of insulating material, also stable in an alkali bath. The unit is then suspendecl in an acid tin bath. A thin ~3~

coating is applied by electroplating the free areas of the metal base plate.
The surface of the tin coating is passivated in a bichromate solution and rinsedin clear water. The master negative is then placed in an electrolytic bath for depositing a perforated foil of nickel thereon. The areas of insulating materialmay be formed by etching the metal base plate and filling the etched layers with insulating material.
Bassous et al. ('410) discloses a jet nozzle for use in ink jet printing.
A small recess is chemically etched into the surface of a single crystalline silicon wafer. Thereafter, a P layer is diffused into the layer except for a portion thereof which is masked during the diffusion. A pyramidal opening is chemically etched on the entrance side of the crystal wafer with the orifice region being concomitantly etched. The wafer is oxidized to forrn an insulation layer therein. This converts the P membrane to a silicon dioxide m embrane.
Bassous et al. ('464) describes a process for producing an aperture in a single crystal wa~er to form a jet no2zle or an array of such jet nozzles.
The polished silicon wafer is cleaned and oxidized to forn~ a silicon dioxide film. The oxidized wafer is then eoated on opposed sides with a photoresist material. A nozzle base hole pattern is exposed and developed in the photoresist layer. The silicon dioxide layer in the opening is etched away. The photoresist is then removed from both sides of the wafer and a silicon dioxide film grown over the surface of the wafer.
Paranjpe discloses a jet drop recorder including an orifice plate having two rows of orifices which ereate two rows of drop streams. The orifice plate is soldered or otherwise bonded to an orifice plate holder mounted within a manifold block to create a cavity for holding a supply of electrically conductive ink.
Schuster-Woldan et al. describes a process for producing a metal grid with a supporting frame. A thin layer of photopolymer material is applied on the metal carrier. A photolit}hographie process is employed to produce a galvanic resistant coating. The metal grid is formed by galvanic path depositing metal on portions of the metal carrier not protected by the photopolymeric material. After the metal grid is formed, the photopolymeric material is removed and an etch resistant covering applied to the edges of the ~5 carrier. The carrier is then selectively etched away to leave the metal grid firmly attached thereto along the border regions.

~3~

Kenworthy discloses a plating technique for fabri-cating an orifice plate for a jet drop recorder. A sheet of stainless steel is coated on both sides with a photo-resist material. The photoresist is then exposed through suitable masks and developed to form cylindrical photo-resist peg areas on both sides of the sheet. Nickel ~s then plated on the sheet until the height thereof covers the peg edges. ~ larger diameter photoresist plug is then formed over each photoresist peg. Nickel p~ating is then continued until the ~eight is level with th~ plug. The photoresist and plate are then dissolved and peeled from the nickel forming two solid homogeneous orifice platec.
Gould7 Jr. describes ink pumps having a brass mandrel coupled to an aluminum mandrel and nickel or nickel plated bellows. ~fter forming the bellows, the aluminum mandrel is exposed and etched away.
An aspect of the invention is as follows:
A me~hod of producing an orifice plate for use in an ink jet printing system, including the steps of: pro-viding a s~bs~rate attached to a support; forming apattern of electrically insulated areas on the surface of the substrate opposed to the support; electroplating the uninsulated areas of the surface of the substrate opposed to the support, separating the substrate from the ?5 support; and removing the selected areas of the substrate to produce an orifice plate.
Other aspects of the present invention will become apparent as the following description proceeds and upon reference to the drawings~ in which:
Figure 1 i5 a sectional elevational view showing electroplating of the orifice plate; and Figure 2 is a sectional elevational view depicting the fabricat:ed orifice plate~
While the present invention will hereinafter be described in connection with a preferred method of construc-tion, it will be understood that it is not intended to qr~
~5 J~3~

-4a~
limit the invention to that method of construction. On the contrary, it is intended to cover all alternatives, modifi~
cations and equivalents as may be included within the spirit and scope of the invention as defined by the append e~ claims.
For a general understanding of the features of the present invention, reference is made to the drawings. In the drawings~ like reference numerals have been used throughout to designate identical elements. The drawlngs schematically d~pict thè process for forming the orifice plate of the .

`.~3 3~

--s--present invelltion. It will become apparent frorrl the ~o]lowlng discussion thatthe orifice plate may be formed by other approaches and is not necessflrily limited to the particular method of construction shown herein.
As shown in Figure 1~ orifice plate 10 is formed by ~il`St selectin~ a suitable support plate 12, such as a plate of stainless steel. This stninless steel plflte may be as thick as necessary to insure that it will rem~in flat ~nd true.A copper substrate 14 is attached to support plate 12. Copper substral;e 14 rnaybe secured to support plate 12 by havillg the rnE~grinal regions outside of the are~ of the orifice plate ;tsele, rlttached by ndhesive to support pllte 12.
Alternatively, it rnay be eastened by threaded screws or othe1 suitable meQrls~
C~opper xubstrate 14 is then coated in known fnshion with a photoresist Illflterialt WtliCh i9 exposed through f~ suitable mask to form a pattern of ~ylindrical arens 16 on the side of copper substrate 14 opposecl from support pl~te 12. Cylindrical areas 16 remain on copper substrate 1~ after the photoresist is developed and the unexposed resist washed away.
Copper substrate 12 is then plated with nickel 18 to form a lamellar layer thereon. Nickel is preferred since it provides adequate strength and when overcoated with a gold alloy7 is compatible with current ink compositions used in ink jet printing systems, thereby reducing corrosion o~ the orifices to a minimum. The plating may be done, for example, by electropllting the substrate 14 in a suitable solution. I)uring such an electroplating process, thenickel 18 i5 formed on the areas of substrate 14 which are conductive. Tllus, nonickel plates on top of cylindrical areas 16. As the nickel plate 18 reaches andplates above the top of cylindrical area 16, the plating begins to creep inwardly across the top edges of cylindrical area 16, since the nickel around the edges of cylindrical area 16 is conductive, inducing plating in a radial direction acrossthe top of the cylindrieal area as well as in the outwardly direction away from substrate 14. The plating is continued until the openillg over cylindrical areas16 has been closed by the nickel to the exact diameters desired for forming and defining orifice 20 in orifice plate 10. Preferably, copper substrate 14 is about 90 mils thick with nickel layer 18 being about 1 mil thick.
Next, orifice plate 10, i.e. copper substrate 14 and nickel plating 18 are removed from metal support 12. With continued reference to Figure 2, a sheet of photoresist material is laminated to the side of copper substrate 14 opposed from nickel plating 18. The laminated sheet of photoresist material is exposed through suitable masks to form a series vf cylindrical areas substan-a~

tially c~axial with orifices 20 in nickel plating 18. The cylindrical arefls arethe non-exposed and non-developed areas of the photoresist sheet laminate.
Thus, only the cylindr;cal are~s of the laminated sheet of resist will be subsequently dissolved and washed away. After applying the etch le3istanee 5 photoresist to the selected areas of the copper, the copper substrate is selectively etched away in all areas except the areas which ~re protected hy the photoresist. ~fter etching, any resist remaining on orieice plate l(1 is dissolved and washed away.
To selectively etch copper substrate l~, without attacking nickcl 10 substrat~3 18, the etching is accornplishec1 with a selective etching ugent.
~3tching agents of this type are usec1 for exarnple in the production of evaporative mas1cs in accordance with the substrative technique and described in relevant literature. For example, an ammonia sodiurn-chlolide etching agent attaelcs only copper and will not attack nickel. Exit port 22 is of a 15 larger diameter than entrance port 24 of orifice 20. In this way, a pair of co-axial cylinders define orifice 20.
In addition to forming the orifices in plate l0, holes for mounting the plate to the ink drop generator can be incorporated in a similar manner.
Moreover, if desired, a pattern of O-ring grooves may also be formed on plate 20 l0. Upon completion of the entire structure, orifice plate l0 is passivated by gold plating. This further insures that orifice plate la resists chemical and electrochemical attack by the inlc employed in the ink jet printing system.
One skilled in the art will appreciate that while copper has been described as the substrate other suitable materials such as brass may be 25 employed in lieu thereof.
In recapitulation, the orifice plate of the present invention is formed by a process of electroplating a nickel layer onto a copper substrate secured to a support plate. Orifices are selectively formed in this bilaminar structure by chemically etching selected areas OI the copper to form holes 30 therein substantially co-axial with the apertures in the nickel layer. Ther~
after, the entire plate is passivated by being gold plated. In this manner, a substantially rigid highly accurate orifice plate is fabricated.
It is~ thereIore, apparent that there has been provided in accor-dance with the present invention, a bilaminar orifice plate which fully satisfies 35 the aims and advantages hereinbefore set forth. While this invention has beendescribed in conjunction with a specific method of fabrication thereof3 it is --7 ~

evident that mRny alternatives, modifications and variations will be upparent to those skilled in the art. Accordirlgly, it is intended -to embrace all such alternatives, modifications, and variations as fall within the spirit and broad scope o the appended claims.

Claims (15)

WHAT IS CLAIMED IS:
1. A method of producing an orifice plate for use in an ink jet printing system, including the steps of:
providing a substrate attached to a support;
forming a pattern of electrically insulated areas on the surface of the substrate opposed to the support;
electroplating the uninsulated areas of the surface of the substrate opposed to the support;
separating the substrate from the support; and removing the selected areas of the substrate to produce an orifice plate.
2. A method according to claim 1, wherein said step of removing includes the step of forming a pattern of chemically resistant areas in the non-electroplated surface of the substrate to protect selected areas thereof; and dissolving the non-protected areas of the substrate.
3. A method according to claim 2, wherein said step of electro-plating includes the step of electroplating inwardly across the top edges of the insulated areas.
4. A method according to claim 3, wherein said step of forming electrically insulated areas includes the step of forming cylindrical areas of electrical insulation.
5. A method according to claim 4, wherein said step of forming chemically resistant areas includes the step of forming non-chemically resis-tant cylindrical areas having a diameter greater than the diameter of the areas of electrical insulation.
6. A method according to claim 5, wherein said step of electro-plating includes the step of electroplating with a material other than the substrate material to form a non-homogeneous orifice plate.
7. A method according to claim 6, wherein said step of pro-viding includes the step of securing a copper substrate to a metal support plate.
8. A method according to claim 6, wherein said step of pro-viding includes the step of securing a brass substrate to a metal support plate.
9. A method according to claim 8, wherein said step of electroplating includes the step of electroplating with nickel to form a bilaminar orifice plate.
10. A method according to claim 9, wherein said step of forming chemically resistant areas includes the steps of:
laminating a sheet film of resist to the non-electroplated surface of the substrate;
exposing the resist to form a pattern of non-exposed circular areas thereon;
developing the exposed areas of the resist; and dissolving the non-exposed areas of resist.
11. A method according to claim 10, wherein said step of dissolving the non-protected areas of the substrate includes etching the non-protected areas of the substrate to form circular apertures in the substrate substantially co-axial with the cylindrical areas in the nickel electroplated thereon.
12. A method according to claim 11, wherein said step of electro-plating with nickel includes the step of electroplating a 1 mil thick layer of nickel on a 90 mil thick substrate.
13. A method according to claim 2, further including the step of passivating at least the electroplated material with a material chemically resistant to the ink composition used in the ink jet printing system.
14. A method according to claim 13, wherein said step of passivating includes the step of passivating with a gold alloy.
15. A method according to claim 2, further including the step of forming at least one groove in the substrate suitable for receiving a sealing member therein.
CA000397497A 1981-03-19 1982-03-03 Orifice plate for ink jet printing machines Expired CA1183402A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US245,422 1981-03-19
US06/245,422 US4374707A (en) 1981-03-19 1981-03-19 Orifice plate for ink jet printing machines

Publications (1)

Publication Number Publication Date
CA1183402A true CA1183402A (en) 1985-03-05

Family

ID=22926585

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000397497A Expired CA1183402A (en) 1981-03-19 1982-03-03 Orifice plate for ink jet printing machines

Country Status (5)

Country Link
US (1) US4374707A (en)
EP (1) EP0061303B1 (en)
JP (1) JPS57174272A (en)
CA (1) CA1183402A (en)
DE (1) DE3269281D1 (en)

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EP0061303A1 (en) 1982-09-29
DE3269281D1 (en) 1986-04-03
US4374707A (en) 1983-02-22
JPH0213909B2 (en) 1990-04-05
EP0061303B1 (en) 1986-02-26
JPS57174272A (en) 1982-10-26

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