CA1240373A - Surface mountable microwave ic package - Google Patents

Surface mountable microwave ic package

Info

Publication number
CA1240373A
CA1240373A CA000502853A CA502853A CA1240373A CA 1240373 A CA1240373 A CA 1240373A CA 000502853 A CA000502853 A CA 000502853A CA 502853 A CA502853 A CA 502853A CA 1240373 A CA1240373 A CA 1240373A
Authority
CA
Canada
Prior art keywords
transmission line
package
microwave
carrier substrate
microwave transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000502853A
Other languages
French (fr)
Inventor
Keith E. Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Application granted granted Critical
Publication of CA1240373A publication Critical patent/CA1240373A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

ABSTRACT

A surface mountable microwave IC package uses printed transmission lines on a printed circuit board in lieu of plumbing between milled packages. A
backside co-planar waveguide is connected to a topside microstrip line by a through-hole in a carrier substrate. To compensate for inductance added by the hole and transmission line ends, a gap is adjusted to provide compensation capacitance. Hermeticity is assured by brazing lead frame over the through-hole and using a solder sealed lid. The lid provides both hermeticity and shielding.

Description

24~3~,3 SURFACE MOUNTABLE MICROWAVE IT PACKAGE

Background of the Invention ____ ______________________ Field of the Invention The present invention relates to integrated circuit (IT) packages, and more particularly to a surface mountable microwave IT package which provides high performance at a reasonable cost.

Description of the Prior Art ____ The application of microwave gallium-arsenide (Gays) integrated circuits is limited by package performance and/or complexity. Typical packages using milled metal enclosures with ceramic substrates are expensive and rarely hermetic. Hermetic enclosures, such as Caesar or NTK multi layer ceramic carriers, are limited to one to two gigahertz with reasonable performance. High performance carriers, such as the Hypcon described in US Patent No.
4,255,003 issued March 10, 1981 entitled "Electrical Connector" by William E. Berg, are expensive and complex.

What is desired is a low cost, hermetic or semi-hermetic, high performance, surface mountable Gays microwave IT carrier.
i Summary thence inn In accordance with an aspect of the invention there is provided a surface mountable microwave package comprising:
a printed circuit board having a first microwave transmission line thereon with ground pads adjacent the end of said microwave transmission line; a carrier substrate; a co-planar transmission line on the bottom of said substrate situated so as to make electrical contact with said first microwave transmission line on said ~L2~373 -lo-printed circuit board; a second microwave transmission line on the top of said carrier substrate connected to said co-planar transmission line via a metalized through-hole, an integrated circuit being connected to said second microwave transmission line; said package, during operation, having said carrier substrate placed on and connected to said printed circuit board.
Accordingly, the present invention provides a surface mountable microwave IT package which uses printed transmission lines on a printed circuit board in lieu of plumbing between milled packages. A back side co-planar wave guide line is connected to a topside micro strip line by a through-hole in a carrier substrate. To compensate for inductance added by the hole and transmission line ends, a gap is adjusted to provide compensation capacitance. ~ermeticity is lo i 12~0373
-2-a scrod my brazing a lead frame over tug thrill and Jung a solder elude lid. The lid provide both hermeticity and shielding.

The objects, advantages an novel features ox the present invention will be apparent from the following detailed description when read on conjunction with the appended claims and attached drawing.

Brief Description of the Drawing FIG. 1 to an exploded perspective view of an IT
surface mountable microwave package according to the present ~n~entio~.

FOG. 2 it a schematic view of an Bquival~nt circuit for the package ox Fig. 1.

FIG. 3 it a plan view for the hybrid circuit of the surface mountable microwave package.

FIG. 4 it a plan view Or a lead frame for the hybrid circuit of FIG. 3.

FIG. 5 1B an exploded per~pectlv2 view of an alternative embodiment of an IT surface mountable microwave package according to the present invention.

FIG. 6 it a schematic view ox an equivalent circuit for the package of Fig. 3.

FIG. 7 it a graphic view of a time domain reflectometer output for the package of Fig. 1.

124~;~7;3
-3-Description ox the Preferred Embodiment Referring now to Fig. 1, 3 and 4 a printed circuit board 10 to shown having a substrate 12 and a ground plane 14 on the bottom of the substrate. A
microstr~p transmlosion line 16 it located on the top surface of the ~ubetrate 12. Ground pads 18 ore located on thy top surface of the substrate 12 near the end 20 of the transmission fine 16, each pad having a metallized through-hole 22 to connect the pad with the ground plane 14 on the opposite wide of the substrate. A controlled impedance taper of the transmission fine end 20 brings the transmission line width down to a geometry commensurate with the surface mount package punt 19.
I A surface mountable package 24 ha a carrier eub~trate 26, typically Or a ceramic material well-known in the art, with a metallizat$on layer, or ground plane, 28 on the bottom. A portion of the ground plane 28 it removed to for a co-planer transmission line 30. The co-planar transmission line has a lead end 32 and a termination end 34. The co-planar transml~sion line 30 may be composed of an -etched lead frame brazed to the substrate metallizatlon. A micro strip transmission line 36 ha a termination on 38 and is located on the top surface of the substrate 26. A metallized through-hole 40 connects the termination ends 34, 38 of the respective transmission lines 30, 36. An IT 42 is electrically !30 connected to the micro trip transmission line 36. The pliant 19 it formed by a lead frame 21 which extends beyond the edge of the surface mount package 24. A
lid 25 may be solder sealed to the package 24 for both hermeticity and shielding.

., .

I i24~3 The eguival-nt circuit row thy clerical on the surface mountable package 24 i- reprinted in Fig 2 Two co-planar tran~mi~-lon fine 30 i- r-present-d a- a coaxial earl-, a- 1- to mlero~trip fin 36 Thy S inductance I r pronto- thy portion L of thy coplanar transmi~ion fin- 30 which crosses the gap G
between the ground plane 28 and the thrill- 40 ~etallizatlon, connecting with the termination end 34 Likewise, the inductance Mu represent the portion U
Or the ~ierostrlp transmi~lon fine 36 which alto crosses the gap G, connecting with two termination end 38 Thy capacitance XG represent- thy gap G, and can by altered by auditing thy width of the gap to compen~at for lnduetanc-- introduced by two transmission links 30, 36 and the thrill- 40 For , standard 50 ohm trainmen fin thy co-planar fine ! 30 1- 10 mill wide with a three ~11 gap on each lye Thy substrate 26 I typl¢ally 10 mull thick or alumina (Aye) or two ilk For a hot- 40 o* 10 miss dl~met-r a 15 mix annul- *or thy gap G, determined empirically For thick substrate 26 Or 25 mull- or greater the mlcrostrip transmission fine 26 may b-replay d with a co-planar triune ion fin to k -p the fin width mall Another mbodlnent 18 shown in Fig 5 A co-planar transml-~lon line o-ctlon 44 1B in the form o* a pad, and a mlcrostrlp tran~mi~lon fine 46 i- in the form Or a to referring to the equivalent circuit o* Fig 6 XG represent the capacitance of the gap G, OH
represent- the inductance of the through-hole 40, Mu ; reprint the portion U of the transmission line 46 across the gap G, and I reprint the capacitance introduced by the width step T The capacitive r acuteness XG and XT provide shunt capacitance to compensate for the inductance of the through-hole Jo .

12~03~73 For Roth embodiment the surface mountable package 24 is placed on the printed circuit board 10 Jo that the ground plane 28 contacts the ground pus 18 and - the co-planar tran~ml~eion lines 32, 44 contact the end 20 of the micro trip transmi~lon line 16 on the printed circuit board. The package 24 it then connected to two board 10 using conventional technlque6 ouch as reflow soldering. Preferably the coplanar transmission fine 32, 44 and hole 40 are lo bonded to a lead frame 21 of a material such a over*
which provides hermeticlty and ease of inspection of the reflow solder connections. the notched lead 19 give a measure ox compliance which compensates for the difference in temperature coefficients of oxpanslon between the ceramic substrate 24 and the material of the PUB substrate 12, typically Teflon or glass fiber.

The value for the virile inductances and compen~a~$ng capac~t~nce~ caused by the gap G are solved empirically simultaneously as described below such that 50 - XL+Xu~XG or SO - XH~XU-XG
for the two embodiment, respectively. A shown in Fig. 7 for the fluorite embodiment the portion of thy graph which it palliative represent inductance and the portion which is negative represents capacitance. For compensation the negative area should equal the positive area.

Thus, the present invention prude a hermetic, surface mountable microwave IT package which 1B
operable at ~requenclea up to 20 gigahertz and is relatively inexpensive.
* - Trade Mark

Claims (9)

Claims:
1. A surface mountable microwave package comprising:
a printed circuit board having a first microwave transmission line thereon with ground pads adjacent the end of said microwave transmission line;
a carrier substrate;
a co-planar transmission line on the bottom of said substrate situated so as to make electrical contact with said first microwave transmission line on said printed circuit board;
a second microwave transmission line on the top of said carrier substrate connected to said co-planar transmission line via a metalized through-hole, an integrated circuit being connected to said second microwave transmission line;
said package, during operation, having said carrier substrate placed on and connected to said printed circuit board.
2. A package as recited in claim 1 wherein said second microwave transmission line comprises a microstrip transmission line.
3. A package as recited in claim 1 wherein said second microwave transmission line comprises a co-planar transmission line.
4. A package as recited in claim 1 further comprising:
a lead frame brazed to said co-planar waveguide transmission line for sealing the electrical connection via said metallized through-hole and for connecting with said first microwave transmission line; and a solder sealed hermetic lid enclosing said carrier substrate.
5. A package as recited in claim 1 wherein said coplanar transmission line further comprises capacitive means for compensating for inductive reactances introduced by said co-planar and said second microwave transmission lines at the metallized through-hole.
6. A package as recited in claim 5 wherein said capacitive means comprises a gap surrounding the end of said co-planar transmission line and said through-hole, the width of said gap being adjusted to provide a required compensation.
7. A package as recited in claim 6 wherein said capacitive means further comprises a width step integral with and near the end of said second microwave transmission line.
8. A surface mountable microwave IC package for mounting on a printed circuit board having a first microwave transmission line, said IC package comprising:
a carrier substrate;
a co-planar waveguide transmission line on the bottom of said carrier substrate configured for connection to said first microwave transmission line; and a second microwave transmission line on the top of said carrier substrate, electrically connected to said co-planar waveguide transmission line via a metallized through-hole, to which an integrated circuit is electrically connected; and said package, during operation, having said carrier substrate placed on and connected to said printed circuit board.
9. A package as recited in claim 8 further comprising:
a lead frame brazed to said co-planar waveguide transmission line for sealing the electrical connection via said metallized through-hole and for connecting with said first microwave transmission line; and a solder sealed hermetic lid enclosing said carrier substrate.
CA000502853A 1985-04-26 1986-02-27 Surface mountable microwave ic package Expired CA1240373A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US727,946 1985-04-26
US06/727,946 US4626805A (en) 1985-04-26 1985-04-26 Surface mountable microwave IC package

Publications (1)

Publication Number Publication Date
CA1240373A true CA1240373A (en) 1988-08-09

Family

ID=24924763

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000502853A Expired CA1240373A (en) 1985-04-26 1986-02-27 Surface mountable microwave ic package

Country Status (5)

Country Link
US (1) US4626805A (en)
EP (1) EP0200291B1 (en)
JP (1) JPH07114323B2 (en)
CA (1) CA1240373A (en)
DE (1) DE3675975D1 (en)

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JPH07114323B2 (en) 1995-12-06
JPS61251059A (en) 1986-11-08
DE3675975D1 (en) 1991-01-17
EP0200291B1 (en) 1990-12-05
EP0200291A2 (en) 1986-11-05
US4626805A (en) 1986-12-02
EP0200291A3 (en) 1987-05-27

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