CA1249350A - High frequency connector - Google Patents
High frequency connectorInfo
- Publication number
- CA1249350A CA1249350A CA000484721A CA484721A CA1249350A CA 1249350 A CA1249350 A CA 1249350A CA 000484721 A CA000484721 A CA 000484721A CA 484721 A CA484721 A CA 484721A CA 1249350 A CA1249350 A CA 1249350A
- Authority
- CA
- Canada
- Prior art keywords
- center conductor
- connector
- shell
- center
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/52—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2103/00—Two poles
Abstract
ABSTRACT
A high frequency connector for interconnecting a microstrip circuit and an external circuit. That portion of a center conductor which is adjacent to the microstrip circuit is deviated from the axis of the connector and resiliently supported, thereby eliminating an intermediary element for interconnection to promote easy and positive interconnection. The connector is desirably applicable to TEM mode waves lying in the frequency band of 0. 3-30 GHz.
A high frequency connector for interconnecting a microstrip circuit and an external circuit. That portion of a center conductor which is adjacent to the microstrip circuit is deviated from the axis of the connector and resiliently supported, thereby eliminating an intermediary element for interconnection to promote easy and positive interconnection. The connector is desirably applicable to TEM mode waves lying in the frequency band of 0. 3-30 GHz.
Description
935~
-1- 70~315-31 BACKGROUND OF THE INVENTION
The present invention relates to a high frequency connector adapted for interconnecting a microstrip circuit and an external circuit and, more particularly, to a connector structure suited to connect transverse electromagnetic mode (TEM) waves which lie in a 0.3-30 GHz frequency band.
The background of the invention and the invention it-self are illustrated in the accompanying drawings, in which:
Figs. 1 and 2 are sections each showing a prior art high frequency connector;
Fig. 3 is a section of a high frequency connector embodying the present invention;
Figs. 4 and 5 show the connector of Fig. 3 mounted on a housing, which has a microstrip substrate therein, as well as a mounting procedure;
Fig. 6 is a section of a connector in accordance with another embodiment of the present invention;
Fig. 7 shows the connector of Fig. 6 mounted on a housing, which has a microstrip substrate therein, as well as a mounting procedure;
Fig. 8 is a section of a connector in accordance with another embodiment of the present invention;
Fig. 9 shows the connector of Fig. 8 mounted on a housing which has a microstrip substrate therein, as well as a mounting procedure;
Figs. 10 and 11 are sections of a connector in accor-. ..~
~g
-1- 70~315-31 BACKGROUND OF THE INVENTION
The present invention relates to a high frequency connector adapted for interconnecting a microstrip circuit and an external circuit and, more particularly, to a connector structure suited to connect transverse electromagnetic mode (TEM) waves which lie in a 0.3-30 GHz frequency band.
The background of the invention and the invention it-self are illustrated in the accompanying drawings, in which:
Figs. 1 and 2 are sections each showing a prior art high frequency connector;
Fig. 3 is a section of a high frequency connector embodying the present invention;
Figs. 4 and 5 show the connector of Fig. 3 mounted on a housing, which has a microstrip substrate therein, as well as a mounting procedure;
Fig. 6 is a section of a connector in accordance with another embodiment of the present invention;
Fig. 7 shows the connector of Fig. 6 mounted on a housing, which has a microstrip substrate therein, as well as a mounting procedure;
Fig. 8 is a section of a connector in accordance with another embodiment of the present invention;
Fig. 9 shows the connector of Fig. 8 mounted on a housing which has a microstrip substrate therein, as well as a mounting procedure;
Figs. 10 and 11 are sections of a connector in accor-. ..~
~g
-2- ~ 70815-31 dance with another embodiment of the present invention which is positioned perpendicularly to a microstrip substrate;
Fig. 12 is a perspective view of a portion of the microstrip substrate with which the tip of a center conductor of the connector shown in any of Figs. 3-11 makes contact;
Fig. 13 is a plan view of the substrate portion of Fig. 12;
Fig. 14 is a perspec-tive view of a modification to the substrate portion shown in Fig. 12;
Fig. 15 shows a manner of contact between a connector center conductor and a microstrip substrate conductor;
Figs. 16A-16D show ~arious configurations of that por-tion of a connector center conductor which makes contact with a microstrip substrate;
Fig. 17 is a diagram explanatory of calculation asso-ciated with a cantilever which represents a connector center conductor;
Fig. 18 is a perspective view of a pair of clamp jigs adapted to determine an amount deviation of a connector center conductor;
Fig. 19 is a section of the clamp jig shown in Fig.
18; and Figs. 20A-20C are front viewsof different slit con-figurations which may be provided in a connector center conductor.
A microstrip substrate is an implementation recently developed for the circuit construction of various equipments of the .....
~L249~5(~
-2a- 70815-31 kind which use the microwave band. ~ne of the major problems with a microstrip substrate is the interconnection between the substrate and an external circuit. Figs. 1 and 2 show different prior art connectors which may be used to interconnect a conductor section of a microstrip substrate, which is received in a housing, to a coaxial cable. In Fig. 1, a connector 10 is fit in a bore 18 formed in a wall 16 of a housing 12, which accommodates a micro-strip substrate 14 therein. Specifically, the connector 10 com-prises a shell 20 provided with a flange 22 and a male screw 24 which is to mate with an external circuit, an intermediary inser-tion member 26 coupled in the shell 20 and in the bore 18 of the wall 16 of the housing 12, and a center conductor 28 supported by an insulator 30 inside the hollow shell 20 and insertion member 26. Before mounting the connector 10 to the housing 12, the micro-strip substrate 14 is fixed in a predetermined position inside the housing 12. Then, the insertion member 26 of the connector 10 is inserted into the bore 18 of the housing 12, then a center con-ductor pin 34 provided with a connecting ribbon 32 beforehand is inserted into a slitted portion 28a of the center conductor 28 from inside ~.
~;249350 the housing 12, and then the ribbon 14 is soldered to a corresponding conductor portion on the substrate 14.
In Fig. 2, a prior art connector 36 of the type using a glass bead 3Y is shown. The bead 38 comprises a tube 39 made of metal and a center conductor pin 40 which is fixed in place by glass 42 at the center of the tube 38. In assembly, the bead 38 is inserted into the housing 12 ~o align with a conductor on the microstrip substrate 14, then solder is poured into a bore 44 provided in the upper end of the housing 12 so as to fix the bead 38 in place, then the center conductor pin 40 and a conductor portion of the substrate 14 are soldered to each other, and then the connector 36 is screwed into the housing 12.
The problem with the connector configuration shown in Fig.
l is that due to the substantial inductive impedance of the ribbon
Fig. 12 is a perspective view of a portion of the microstrip substrate with which the tip of a center conductor of the connector shown in any of Figs. 3-11 makes contact;
Fig. 13 is a plan view of the substrate portion of Fig. 12;
Fig. 14 is a perspec-tive view of a modification to the substrate portion shown in Fig. 12;
Fig. 15 shows a manner of contact between a connector center conductor and a microstrip substrate conductor;
Figs. 16A-16D show ~arious configurations of that por-tion of a connector center conductor which makes contact with a microstrip substrate;
Fig. 17 is a diagram explanatory of calculation asso-ciated with a cantilever which represents a connector center conductor;
Fig. 18 is a perspective view of a pair of clamp jigs adapted to determine an amount deviation of a connector center conductor;
Fig. 19 is a section of the clamp jig shown in Fig.
18; and Figs. 20A-20C are front viewsof different slit con-figurations which may be provided in a connector center conductor.
A microstrip substrate is an implementation recently developed for the circuit construction of various equipments of the .....
~L249~5(~
-2a- 70815-31 kind which use the microwave band. ~ne of the major problems with a microstrip substrate is the interconnection between the substrate and an external circuit. Figs. 1 and 2 show different prior art connectors which may be used to interconnect a conductor section of a microstrip substrate, which is received in a housing, to a coaxial cable. In Fig. 1, a connector 10 is fit in a bore 18 formed in a wall 16 of a housing 12, which accommodates a micro-strip substrate 14 therein. Specifically, the connector 10 com-prises a shell 20 provided with a flange 22 and a male screw 24 which is to mate with an external circuit, an intermediary inser-tion member 26 coupled in the shell 20 and in the bore 18 of the wall 16 of the housing 12, and a center conductor 28 supported by an insulator 30 inside the hollow shell 20 and insertion member 26. Before mounting the connector 10 to the housing 12, the micro-strip substrate 14 is fixed in a predetermined position inside the housing 12. Then, the insertion member 26 of the connector 10 is inserted into the bore 18 of the housing 12, then a center con-ductor pin 34 provided with a connecting ribbon 32 beforehand is inserted into a slitted portion 28a of the center conductor 28 from inside ~.
~;249350 the housing 12, and then the ribbon 14 is soldered to a corresponding conductor portion on the substrate 14.
In Fig. 2, a prior art connector 36 of the type using a glass bead 3Y is shown. The bead 38 comprises a tube 39 made of metal and a center conductor pin 40 which is fixed in place by glass 42 at the center of the tube 38. In assembly, the bead 38 is inserted into the housing 12 ~o align with a conductor on the microstrip substrate 14, then solder is poured into a bore 44 provided in the upper end of the housing 12 so as to fix the bead 38 in place, then the center conductor pin 40 and a conductor portion of the substrate 14 are soldered to each other, and then the connector 36 is screwed into the housing 12.
The problem with the connector configuration shown in Fig.
l is that due to the substantial inductive impedance of the ribbon
3 2 the voltage standing-wave ratio (VSWR) is high at frequencies higher than several gi~aherzs. Another ~roblem is that the connection of the ribbon 3 2 requires extra steps.
Meanwhile, the connector configuration shown in Fig. 2 is disadvantageous in that a considerable number of steps are necessary for the bead 38 to be fixed in place by solder, which is pour~d into the bore 44 of the housing 12, and in that the manipulation for replacing the microstriP substrate is intricate.
In addition, both the connectors shown in Figs. 1 and 2 are expensive to produce and need expensive structural parts.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a high frequency connector which interconnects a microstrip circuit and an external circuit with a desirable microwave tranSlniSSiOn 0 characteristic.
It is another object of the present invention to provide a high frequency connector for interconnecting a microstrip circuit and an external circuit which is simple in construction and eas~ to assem ble.
It is another object of the present invention to provide a 1249~50
Meanwhile, the connector configuration shown in Fig. 2 is disadvantageous in that a considerable number of steps are necessary for the bead 38 to be fixed in place by solder, which is pour~d into the bore 44 of the housing 12, and in that the manipulation for replacing the microstriP substrate is intricate.
In addition, both the connectors shown in Figs. 1 and 2 are expensive to produce and need expensive structural parts.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a high frequency connector which interconnects a microstrip circuit and an external circuit with a desirable microwave tranSlniSSiOn 0 characteristic.
It is another object of the present invention to provide a high frequency connector for interconnecting a microstrip circuit and an external circuit which is simple in construction and eas~ to assem ble.
It is another object of the present invention to provide a 1249~50
-4 ~ 70815-31 generally improved high frequency connector.
Accordingly, the present invention provides a connec-tor for interconnecting a high frequency circuit, accommodated within a housing having a bore, with an external circuit, the con-nector comprising: a tubular shell made of metal for mounting in the bore of the housing, said tubular shel.l including a hollow portion which functions as an external conductor, the shell fur-ther comprising a mating portion which is engageable in said bore;
an elongate center conductor extending on and along a center axis of said hollow portion of said shell for connection at one end portion to the high frequency circuit and for connection at the other end portion to the external circuit, said one end portion of the center conductor being made of spring material and being dis-placed relative to the center axis of the hollow portion of the shell such that the center conductor has a curve whi.ch is equival-ent to approximately a displacement curve of a cantilever prior to connection with the high frequency circuit; and a support mem-ber made of insulating material for supporting said center conduc-tor in the hollow portion of the shell; the center conductor being cantilevered by said support member at a point of the center con-ductor which is remote from said one end portion and which is adjacent to said other end portion, a tip of said one end portion being free and movable toward the center axis of the hollow por-tion upon connection of the high frequency circuit, the center conductor thereby approaching coincidence with said center axis.
In accordance with the present invention, a high fre--4a- 70815-31 quency connector for interconnecting a microstrip circuit and an external circuit is provided. That portion of a center conduc-tor which is adjacent to the microstrip circuit is deviated from the axis of the connector and resiliently supported, thereby eliminating an intermediary element for interconnection to promote easy and positive interconnection. The connector is desirably applicable to TEM mode waves lying in the frequency band of 0.3-30 GHz.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description taken with the accompanying drawings.
DESCRIPTION OF THE PREFERRED EMB~DIMENTS
While the high frequency connector of the present invention is suscaptible of numerous phYsical embodiments, dependin~ upon the environment and requirements of use, substantial numbers of
Accordingly, the present invention provides a connec-tor for interconnecting a high frequency circuit, accommodated within a housing having a bore, with an external circuit, the con-nector comprising: a tubular shell made of metal for mounting in the bore of the housing, said tubular shel.l including a hollow portion which functions as an external conductor, the shell fur-ther comprising a mating portion which is engageable in said bore;
an elongate center conductor extending on and along a center axis of said hollow portion of said shell for connection at one end portion to the high frequency circuit and for connection at the other end portion to the external circuit, said one end portion of the center conductor being made of spring material and being dis-placed relative to the center axis of the hollow portion of the shell such that the center conductor has a curve whi.ch is equival-ent to approximately a displacement curve of a cantilever prior to connection with the high frequency circuit; and a support mem-ber made of insulating material for supporting said center conduc-tor in the hollow portion of the shell; the center conductor being cantilevered by said support member at a point of the center con-ductor which is remote from said one end portion and which is adjacent to said other end portion, a tip of said one end portion being free and movable toward the center axis of the hollow por-tion upon connection of the high frequency circuit, the center conductor thereby approaching coincidence with said center axis.
In accordance with the present invention, a high fre--4a- 70815-31 quency connector for interconnecting a microstrip circuit and an external circuit is provided. That portion of a center conduc-tor which is adjacent to the microstrip circuit is deviated from the axis of the connector and resiliently supported, thereby eliminating an intermediary element for interconnection to promote easy and positive interconnection. The connector is desirably applicable to TEM mode waves lying in the frequency band of 0.3-30 GHz.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description taken with the accompanying drawings.
DESCRIPTION OF THE PREFERRED EMB~DIMENTS
While the high frequency connector of the present invention is suscaptible of numerous phYsical embodiments, dependin~ upon the environment and requirements of use, substantial numbers of
5 the herein shown and described embodiments have been made, tested and used, and all have performed in an emin~ntly satisfactory manner.
Referring to ~ig. 3, a connector embodying the present invention is shown and generally designated by the reference 1~ numeral 50. Fig. 4 shows the connector of Fig. 3 in a position mounted on a housing 66 which has a microstrip circuit therein.
As shown, the connector 50 comprises a shell 52 which i~cludes a mating member 54 which in turn is provided with a male screw 56 and a flange 58, and an insulator 60 for supporting a center 15 conductor 62. The left end of the center conductor 62 as viewed in Fig. 3 is rigidly retained by the insulator 60 inside the male screw 5fi.
A characteristic feature of the illustrative embodiment is that the center conductor 62 is cantilevered at its side (right-hand 2 0 side as viewed in Fig. 3 ) adapted to connect to a microstrip circuit and terminates at a free end at that side. In addition, the tip 62a of the center conductor 62 is deviated from the axis of the shell 52 and mechanically movable within a certain limited range. The insulator 60 is made of tetrafluoroethylene, or Teflon ~trade name), or like low-loss dielectric material. The insulator 6 0 and center conductor 62 are prevented from rotating relative to the shell 52 by resin 64 whichis injscted and then cured. In Fig. 4, the lengt~wise dimention of a projection included in the mating member 54 coincides with the depth of a 30 bore 66a provided in the housing 66 within the range of machining errors, so that the relative position between the center conductor 6 2 and the microstrip substrate 6 3 is adequately restricted. The center conductor 62 has a slit 62b at its left end as seen in the drawings in which a center conductor 35 of another connector is eIIgageable.
~2493~0 Two different methods are available for mounting the connector 50 on the housing 66. One of them is such that, as shown in Fi~. 4, the microstrip substrate 68 is fixed to the housing 66, then the connector 50 is inserted into t~e housing 66 5 with the tip 62a of the center conductor 62 directed upwardly, and then the connector 50 is rotated 180 degrees about its axis to cause the conductor tip 62a to abut against a conductor surface on the microstrip substrate 68 under predetermined pressure. Preferably, a thin sheet 70 of polyester or polyimid, 10 for example, is placed between the conductor tip 62a and the substrate 68 in order to a~oid possible damage to the conductor surface on the substrate 68. The other method is such $hat, as shown in Fig. 5, the conductor tip 62a is raised by means of a wire 72 and then the microstrip substrate 68 is inserted as 15 indicated by an arrow to a predetermined fixing Position.
Th~ conductor tip 62 a may be formed using a shape-memorizing alloy. In such a case, the connector 50 will be inserted into the housing 66 after processing, such as cooling, the deformable conductor tip 62a to a temperature other than 20 room temperature to straighten it; upon return to room temperature, the conductor tip 62a will show a given amount of deviation to exert an adequate contact pressure on the substrate 68.
Referring to Figs. 6 and 7, another embodiment of the 25 present in~ention is shown. A connector, generally 74, in accordance with this particular embodiment has the mating member 54 of the shell 52 which is relatiYely short, the bore 66a in the housing 66 being correspondingly reduced in depth. As shown in Fig. 7, the connector 74 with such a configuration is 30 held in an inclined position and then inserted into the bore 66a.
Such eliminates the need for handling the conductor tip 62a in the manner shown in Fig. 5.
In any of the two embodiments described abo~e, after the connector 5 U or 74 has been coupled in the housing 66, the 35 flange 58 is fastened to the housing 66 by means of screws or ~L2493~i0 the like ~not shown).
Referring to Fig. 8, another embodiment of the present invention is shown. A connector, generally 7 6, has the insulator 60 for supporting the center conductor 62 which is 5 relatively short. Specifically, the dielectric which supports the center conductor 62 is dimensioned as small as possible so that the CeTlter conductor 6 2 may be surrounded by air, thereby increasing the cutoff frequency for needless modes. The connector 76 is shown in a mounted position in Fig. 9.
Referring to Figs. 10 and 11, another embodiment of the present invention is shown in which a connector 78 or 80 is mounted to the housing 6 6 such that the center conductor 6 extends Perpendicular to the microstrip substrate 6 8. In Fig.
10, the shell 52 is provided with a relatively long mating 15 member 54 while, in Fig. 11, it is provided with a relatively short mating member 54. In any of the configurations shown in Figs. 10 and 11, as shown in Fig. 12, a generally L-shaped conductor piece, or contact, 84 is thermally bonded or soldered to an end of a conductor 82 which is provided on the surface of 20 the microstrip substrate 68. This particular portion of the substrate 68 is shown in a plan view in Fig. 13. Alternatively, as shown in Fig. 14, a side conductor 86 may be provided on the substrate 68 by baking a conductor paste.
As shown in Fig. 15, the conductor tip 62a having a circular 25 cross-section makes line-to-line contact with the conductor 82 on the substrate 68. Conductors havin~ a circular cross-section are inexpensive to produce and, therefore, suitably applicable to general-purpose high frequency connectors. However, concerning millimeter wave applications, contacting Portions of 30 the center conductors should preferably be machined in order to allow a minimum of discontinuity of the line. Preferred configurations of the contacting portions of a center conductor are shown in sections in Figs. 16A-16D. In Fig. 16A, a flat surface 8 8 which extends in one direction is included in the 35 contact surface of the center conductor. In Fig. 16B, flat 3L2L~ 351~
surfaces 90 extend in three different directions each conforming to the width of a conductor on the substrate 68. In Fig. 16C, a lug 92 havin~ a rectangular section protrudes from the centeF
conductor; this confi~uration is desirably applicable to the 5 embodiment of Figs. 10 and ll in which the center conductor 62 and the substrate 68 are perpendicular to each other. To further enhance the contact, the lug 92 shown in Fig. 16C may be provided with a recess 94 in a lower part thereof, as shown in Fi~. lliD
, _ _ ~ 35~
As described above, the connector in accordance with any of the foregoing embodiments is capabie of holding the center conductor 6 2 in contact wîth the conductor surface on the microstrip substrate 6 B under adequate PreSSure. While the contact pressure in terms of normal component of a force of the contact surface is generally regarded acceptable if on the order of 0. 2 N (Newton~ in the case of gold (Au)-to-gold contact, it should preferably be abou~ 5-12 N takin~ into account possible silver (Ag)-to-silver contact and entry of impurities between the contact surfaces. The ma~nitude of the normal component of a force on the contact surface will be described with reference to Fig. l 7.
Referring to Fi~. 17, assume that the center conductor 62 has a length t in a cantilevered position, and that the free end of lS the length I is at a coordinate x = 0. A perpendicular load W
acting on the free end causes the cantilever to deform in a direction y by an amount which is expressed as y = W (X3 - 3 t2 x + 2 13)
Referring to ~ig. 3, a connector embodying the present invention is shown and generally designated by the reference 1~ numeral 50. Fig. 4 shows the connector of Fig. 3 in a position mounted on a housing 66 which has a microstrip circuit therein.
As shown, the connector 50 comprises a shell 52 which i~cludes a mating member 54 which in turn is provided with a male screw 56 and a flange 58, and an insulator 60 for supporting a center 15 conductor 62. The left end of the center conductor 62 as viewed in Fig. 3 is rigidly retained by the insulator 60 inside the male screw 5fi.
A characteristic feature of the illustrative embodiment is that the center conductor 62 is cantilevered at its side (right-hand 2 0 side as viewed in Fig. 3 ) adapted to connect to a microstrip circuit and terminates at a free end at that side. In addition, the tip 62a of the center conductor 62 is deviated from the axis of the shell 52 and mechanically movable within a certain limited range. The insulator 60 is made of tetrafluoroethylene, or Teflon ~trade name), or like low-loss dielectric material. The insulator 6 0 and center conductor 62 are prevented from rotating relative to the shell 52 by resin 64 whichis injscted and then cured. In Fig. 4, the lengt~wise dimention of a projection included in the mating member 54 coincides with the depth of a 30 bore 66a provided in the housing 66 within the range of machining errors, so that the relative position between the center conductor 6 2 and the microstrip substrate 6 3 is adequately restricted. The center conductor 62 has a slit 62b at its left end as seen in the drawings in which a center conductor 35 of another connector is eIIgageable.
~2493~0 Two different methods are available for mounting the connector 50 on the housing 66. One of them is such that, as shown in Fi~. 4, the microstrip substrate 68 is fixed to the housing 66, then the connector 50 is inserted into t~e housing 66 5 with the tip 62a of the center conductor 62 directed upwardly, and then the connector 50 is rotated 180 degrees about its axis to cause the conductor tip 62a to abut against a conductor surface on the microstrip substrate 68 under predetermined pressure. Preferably, a thin sheet 70 of polyester or polyimid, 10 for example, is placed between the conductor tip 62a and the substrate 68 in order to a~oid possible damage to the conductor surface on the substrate 68. The other method is such $hat, as shown in Fig. 5, the conductor tip 62a is raised by means of a wire 72 and then the microstrip substrate 68 is inserted as 15 indicated by an arrow to a predetermined fixing Position.
Th~ conductor tip 62 a may be formed using a shape-memorizing alloy. In such a case, the connector 50 will be inserted into the housing 66 after processing, such as cooling, the deformable conductor tip 62a to a temperature other than 20 room temperature to straighten it; upon return to room temperature, the conductor tip 62a will show a given amount of deviation to exert an adequate contact pressure on the substrate 68.
Referring to Figs. 6 and 7, another embodiment of the 25 present in~ention is shown. A connector, generally 74, in accordance with this particular embodiment has the mating member 54 of the shell 52 which is relatiYely short, the bore 66a in the housing 66 being correspondingly reduced in depth. As shown in Fig. 7, the connector 74 with such a configuration is 30 held in an inclined position and then inserted into the bore 66a.
Such eliminates the need for handling the conductor tip 62a in the manner shown in Fig. 5.
In any of the two embodiments described abo~e, after the connector 5 U or 74 has been coupled in the housing 66, the 35 flange 58 is fastened to the housing 66 by means of screws or ~L2493~i0 the like ~not shown).
Referring to Fig. 8, another embodiment of the present invention is shown. A connector, generally 7 6, has the insulator 60 for supporting the center conductor 62 which is 5 relatively short. Specifically, the dielectric which supports the center conductor 62 is dimensioned as small as possible so that the CeTlter conductor 6 2 may be surrounded by air, thereby increasing the cutoff frequency for needless modes. The connector 76 is shown in a mounted position in Fig. 9.
Referring to Figs. 10 and 11, another embodiment of the present invention is shown in which a connector 78 or 80 is mounted to the housing 6 6 such that the center conductor 6 extends Perpendicular to the microstrip substrate 6 8. In Fig.
10, the shell 52 is provided with a relatively long mating 15 member 54 while, in Fig. 11, it is provided with a relatively short mating member 54. In any of the configurations shown in Figs. 10 and 11, as shown in Fig. 12, a generally L-shaped conductor piece, or contact, 84 is thermally bonded or soldered to an end of a conductor 82 which is provided on the surface of 20 the microstrip substrate 68. This particular portion of the substrate 68 is shown in a plan view in Fig. 13. Alternatively, as shown in Fig. 14, a side conductor 86 may be provided on the substrate 68 by baking a conductor paste.
As shown in Fig. 15, the conductor tip 62a having a circular 25 cross-section makes line-to-line contact with the conductor 82 on the substrate 68. Conductors havin~ a circular cross-section are inexpensive to produce and, therefore, suitably applicable to general-purpose high frequency connectors. However, concerning millimeter wave applications, contacting Portions of 30 the center conductors should preferably be machined in order to allow a minimum of discontinuity of the line. Preferred configurations of the contacting portions of a center conductor are shown in sections in Figs. 16A-16D. In Fig. 16A, a flat surface 8 8 which extends in one direction is included in the 35 contact surface of the center conductor. In Fig. 16B, flat 3L2L~ 351~
surfaces 90 extend in three different directions each conforming to the width of a conductor on the substrate 68. In Fig. 16C, a lug 92 havin~ a rectangular section protrudes from the centeF
conductor; this confi~uration is desirably applicable to the 5 embodiment of Figs. 10 and ll in which the center conductor 62 and the substrate 68 are perpendicular to each other. To further enhance the contact, the lug 92 shown in Fig. 16C may be provided with a recess 94 in a lower part thereof, as shown in Fi~. lliD
, _ _ ~ 35~
As described above, the connector in accordance with any of the foregoing embodiments is capabie of holding the center conductor 6 2 in contact wîth the conductor surface on the microstrip substrate 6 B under adequate PreSSure. While the contact pressure in terms of normal component of a force of the contact surface is generally regarded acceptable if on the order of 0. 2 N (Newton~ in the case of gold (Au)-to-gold contact, it should preferably be abou~ 5-12 N takin~ into account possible silver (Ag)-to-silver contact and entry of impurities between the contact surfaces. The ma~nitude of the normal component of a force on the contact surface will be described with reference to Fig. l 7.
Referring to Fi~. 17, assume that the center conductor 62 has a length t in a cantilevered position, and that the free end of lS the length I is at a coordinate x = 0. A perpendicular load W
acting on the free end causes the cantilever to deform in a direction y by an amount which is expressed as y = W (X3 - 3 t2 x + 2 13)
6 EI
where E is a Young's modulus determined by the material of the cantilever, and I a sectional secondary moment determined by the sectional shape of the cantilever. In the above equation, 25 assuming that the displacement in the direction y is ~, ~= W 13 30 Therefore, where the normal component of a force necessary for the above-mentioned contact surface is W, it suffices to select an amount of deviation of the center conductor 62 which is equal to or greater than ~ which is produced by the above equation. In practice, the deviation ~ of the center conductor 62 is preferab1y 3 5 accomplished by holdin$ the center conductor 6 2 beween a Pair :~2493~0 ~10-of clamp iigs 96 and 98 as shown in Fig. 1~ and applying heat thereto. The jigs 96 and 98 are shown in a section in Fig. 19 together with the center conductor 62 held therebetween. The deviation ~ is variable with the thickness of a spacer 100.
The slit 62a provided in the center conductor adjacent to an external circuit may have any suitable configuration such as shown in Figs. 20A-20B.
In summary, it will be seeII that the present in~ention provides a hi~h frequency connector which achieves ~arious advantages as enumerated below:
(1 ) A microstrip circuit and a center conductor of a connector are directly connected to eliminate the need for an extra part otherwise required for the interconnection;
(2) Therefore, the interconnection is set up by a minimum number of steps;
(3) The interconnection is significantly stable partly because the circuit and the center conductor are constantly held in contact under predetermined pressure and partly ~ecause the center conductor absorbs any small error possibly developing in the distance between the circuit and the connector;
(4) The interconnection work is simple and does not require any skill;
(5 ) Since the contact pressure between the circuit and the center conductor is constant, the circuit is prevented from being damaBed at the point of interconnection;
(6) No part is mounted on the center conductor to simplify interconnection of the center conductor to the circuit and, thereby, enhance machining precision as well as PrecisiOn of the assembly, so that an excellent high frequency transmission characteristic is attained; and
where E is a Young's modulus determined by the material of the cantilever, and I a sectional secondary moment determined by the sectional shape of the cantilever. In the above equation, 25 assuming that the displacement in the direction y is ~, ~= W 13 30 Therefore, where the normal component of a force necessary for the above-mentioned contact surface is W, it suffices to select an amount of deviation of the center conductor 62 which is equal to or greater than ~ which is produced by the above equation. In practice, the deviation ~ of the center conductor 62 is preferab1y 3 5 accomplished by holdin$ the center conductor 6 2 beween a Pair :~2493~0 ~10-of clamp iigs 96 and 98 as shown in Fig. 1~ and applying heat thereto. The jigs 96 and 98 are shown in a section in Fig. 19 together with the center conductor 62 held therebetween. The deviation ~ is variable with the thickness of a spacer 100.
The slit 62a provided in the center conductor adjacent to an external circuit may have any suitable configuration such as shown in Figs. 20A-20B.
In summary, it will be seeII that the present in~ention provides a hi~h frequency connector which achieves ~arious advantages as enumerated below:
(1 ) A microstrip circuit and a center conductor of a connector are directly connected to eliminate the need for an extra part otherwise required for the interconnection;
(2) Therefore, the interconnection is set up by a minimum number of steps;
(3) The interconnection is significantly stable partly because the circuit and the center conductor are constantly held in contact under predetermined pressure and partly ~ecause the center conductor absorbs any small error possibly developing in the distance between the circuit and the connector;
(4) The interconnection work is simple and does not require any skill;
(5 ) Since the contact pressure between the circuit and the center conductor is constant, the circuit is prevented from being damaBed at the point of interconnection;
(6) No part is mounted on the center conductor to simplify interconnection of the center conductor to the circuit and, thereby, enhance machining precision as well as PrecisiOn of the assembly, so that an excellent high frequency transmission characteristic is attained; and
(7) The connector is inexpensive to produce because it can be mechanically produced on a quantity basis, does not need any additional part for interconnection, and remarkably reduces the steps in~olved in the interconnection.
3 5 Various modifications will become possible for those skilled ~2~93~0 in the art after receiving the teachings of the present disclosure without departing from the scope thereof.
3 5 Various modifications will become possible for those skilled ~2~93~0 in the art after receiving the teachings of the present disclosure without departing from the scope thereof.
Claims (8)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A connector for interconnecting a high frequency cir-cuit, accommodated within a housing having a bore, with an exter-nal circuit, the connector comprising: a tubular shell made of metal for mounting in the bore of the housing, said tubular shell including a hollow portion which functions as an external conductor, the shell further comprising a mating portion which is engageable in said bore; an elongate center conductor extending on and along a center axis of said hollow portion of said shell for connection at one end portion to the high frequency circuit and for connec-tion at the other end portion of the external circuit, said one end portion of the center conductor being made of spring material and being displaced relative to the center axis of the hollow portion of the shell such that the center conductor has a curve which is equivalent to approximately a displacement curve of a cantilever prior to connection with the high frequency circuit; and a support member made of insulating material for supporting said center con-ductor in the hollow portion of the shell; the center conductor being cantilevered by said support member at a point of the center conductor which is remote from said one end portion and which is adjacent to said other end portion, a tip of said one end portion being free and movable toward the center axis of the hollow portion upon connection of the high frequency circuit, the center conductor thereby approaching coincidence with said center axis.
2. A connector as claimed in claim 1, wherein a major part of the cantilevered center conductor is positioned in the hollow portion of the shell.
3. A connector as claimed in claim 1, wherein the mating portion of the shell is relatively short, a major part of the cantilevered center conductor being positioned outside of the hollow portion of the shell.
4. A connector as claimed in claim 1, wherein said point where the center conductor is supported is remote from said one end portion by a distance which is five times the diameter of the center conductor.
5. A connector as claimed in claim 1, wherein said one end portion of the center conductor is made of a shape-memorizing alloy.
6. A connector as claimed in claim 1, wherein said one end portion of the center conductor has a circular cross-section.
7. A connector as claimed in claim 1 wherein the center conductor is slit in a portion which is adjacent to a tip of said one end of the center conductor, the tip of the center conductor being cantilevered and having a flat portion which is complemen-tary to a center conductor of a microstrip line that is to be connected with the connector.
8. A connector for interconnecting a high frequency cir-cuit, accommodated within a housing having a bore, with an exter-nal circuit, the connector comprising: a relatively short tubular shell made of metal for mounting in the bore of the housing, said tubular shell including a hollow portion which functions as an external conductor, the shell further comprising a mating portion which is engageable in said bore; an elongate center conductor extending far beyond said relatively short tubular shell, and further extending on and along a center axis of said hollow por-tion of said shell, said connector for connection at one end por-tion which extends far beyond said shell to the high frequency circuit and for connection at the other end portion to the exter-nal circuit, said one end portion of the center conductor being made of spring material and being displaced relative to the center axis of the hollow portion of the shell such that the center con-ductor has a curve which is equivalent to approximately a displace-ment curve of a cantilever; and a support member made of insulating material for supporting said center conductor in the hollow por-tion of the shell; the center conductor being cantilevered by said support member at a point of the center conductor which is remote from said one end portion and which is adjacent to said other end portion, a tip of said one portion being free and mov-able toward the center axis of the hollow portion upon connection of the high frequency circuit, the center conductor thereby ap-proaching coincidence with said center axis.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPP59-132618 | 1984-06-27 | ||
| JP59132618A JPS6113583A (en) | 1984-06-27 | 1984-06-27 | High frequency connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1249350A true CA1249350A (en) | 1989-01-24 |
Family
ID=15085540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000484721A Expired CA1249350A (en) | 1984-06-27 | 1985-06-21 | High frequency connector |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4669805A (en) |
| EP (1) | EP0170392B2 (en) |
| JP (1) | JPS6113583A (en) |
| CA (1) | CA1249350A (en) |
| DE (1) | DE3584548D1 (en) |
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| CN102977250B (en) * | 2012-12-30 | 2016-03-30 | 南京肯特复合材料有限公司 | Modified Teflon, manufacture method and the application on high frequency connectors thereof |
| EP2876747B1 (en) | 2013-11-21 | 2018-04-25 | Spinner GmbH | RF connector assembly |
| EP3432424A1 (en) | 2017-07-20 | 2019-01-23 | Spinner GmbH | Rf connector with a surface-mount interface |
| WO2019074470A1 (en) * | 2017-10-09 | 2019-04-18 | Keysight Technologies, Inc. | Hybrid coaxial cable fabrication |
| RU188349U1 (en) * | 2018-12-20 | 2019-04-09 | Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации | SUPERWIDEBAND TRANSITION |
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| US3111352A (en) * | 1959-11-16 | 1963-11-19 | Ibm | Superconductive solderless connector |
| US3239713A (en) * | 1963-03-25 | 1966-03-08 | Microwave Ass | High frequency mode transformation between balanced transmission line and waveguide, useful in travelling wave tubes |
| US3242456A (en) * | 1963-10-07 | 1966-03-22 | Itt | Electrical connector with spring pin contact |
| US3601766A (en) * | 1969-02-13 | 1971-08-24 | Vernon F Alibert | Connector device for supporting cables and for additionally providing an electrical connection |
| US3622915A (en) * | 1970-03-16 | 1971-11-23 | Meca Electronics Inc | Electrical coupler |
| US3705379A (en) * | 1971-05-14 | 1972-12-05 | Amp Inc | Connector for interconnection of symmetrical and asymmetrical transmission lines |
| US3783321A (en) * | 1972-03-23 | 1974-01-01 | Adams Russel Co Inc | Coaxial connector |
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| JPS5141696B2 (en) * | 1973-04-03 | 1976-11-11 | ||
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| US3975077A (en) * | 1975-05-12 | 1976-08-17 | Honeywell Inc. | Electrical connector |
| JPS5141696U (en) * | 1975-09-11 | 1976-03-27 | ||
| DE2603187C3 (en) * | 1976-01-28 | 1980-01-10 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Coaxial connector |
| JPS5353897U (en) * | 1976-10-09 | 1978-05-09 | ||
| US4159505A (en) * | 1977-06-16 | 1979-06-26 | The Bendix Corporation | Packaging assembly for electronic mechanism |
| JPS5422955U (en) * | 1977-07-14 | 1979-02-15 | ||
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| US4280112A (en) * | 1979-02-21 | 1981-07-21 | Eisenhart Robert L | Electrical coupler |
| FR2483131A1 (en) * | 1980-05-23 | 1981-11-27 | Radiall Sa | COAXIAL CONNECTOR ELEMENT |
| US4487465A (en) * | 1981-12-07 | 1984-12-11 | Raychem Corporation | Heat recoverable connecting device |
| US4516815A (en) * | 1982-06-07 | 1985-05-14 | Spectrum Control, Inc. | RF filter connector |
-
1984
- 1984-06-27 JP JP59132618A patent/JPS6113583A/en active Granted
-
1985
- 1985-06-21 DE DE8585304446T patent/DE3584548D1/en not_active Expired - Fee Related
- 1985-06-21 CA CA000484721A patent/CA1249350A/en not_active Expired
- 1985-06-21 EP EP85304446A patent/EP0170392B2/en not_active Expired - Lifetime
- 1985-06-21 US US06/747,658 patent/US4669805A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4669805A (en) | 1987-06-02 |
| EP0170392A2 (en) | 1986-02-05 |
| DE3584548D1 (en) | 1991-12-05 |
| EP0170392B1 (en) | 1991-10-30 |
| EP0170392B2 (en) | 2000-06-28 |
| JPS6113583A (en) | 1986-01-21 |
| JPH0312433B2 (en) | 1991-02-20 |
| EP0170392A3 (en) | 1987-08-26 |
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Legal Events
| Date | Code | Title | Description |
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| MKEX | Expiry | ||
| MKEX | Expiry |
Effective date: 20060124 |