CA2024662A1 - Monolithic series and parallel connected photovoltaic module - Google Patents

Monolithic series and parallel connected photovoltaic module

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Publication number
CA2024662A1
CA2024662A1 CA002024662A CA2024662A CA2024662A1 CA 2024662 A1 CA2024662 A1 CA 2024662A1 CA 002024662 A CA002024662 A CA 002024662A CA 2024662 A CA2024662 A CA 2024662A CA 2024662 A1 CA2024662 A1 CA 2024662A1
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Prior art keywords
conductive
substrate
fluid
tho
pattern
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CA002024662A
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French (fr)
Inventor
Robert Oswald
John Mongon
Peggy Weiss
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Solarex Corp
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Robert Oswald
John Mongon
Peggy Weiss
Solarex Corporation
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Publication of CA2024662A1 publication Critical patent/CA2024662A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0445PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046PV modules composed of a plurality of thin film solar cells deposited on the same substrate
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    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441Electrode arrangements specially adapted for back-contact solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0445PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H01L31/0463PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • H01L31/188Apparatus specially adapted for automatic interconnection of solar cells in a module
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/94Laser ablative material removal

Abstract

Abstract of the Disclosure A thin semiconductor device comprising a substrate and a front contact layer disposed on said substrate including a plurality of segments separated by first scribe lines, a plurality of the segments forming a submodule, and at least one of the submodule forming a module. A bus is provided for interconnecting two or more of the submodules in parallel with each other. A thin film of a semiconductor material is disposed on the front contact layer and a back contact layer disposed on the thin film of semiconductor material. The back contact layer is scribed along second scribe lines corresponding to and adjacent the first scribe lines. An interconnection is provided for interconnecting adjacent areas of the rear and back contact layers.

Description

~ h~ pxos~nl: lnYe~tlosl r~lat~s to photo1voltaic c~ aAcl, ln p~lcula~:, to a~ ~p~a~tu~ ~nd a ~ehod ~o~ ~orslllns ~ :~onol~th~c lntorconn~ct-d ~oto~oltalc modul~.

elI kno~n ln tho thln~ s~miconductor art, p~oto~olta~c c~}lo that cor~ro~t sola~ radlatlon lnto uJa~lo el~ctrlcal en~r~r c~n ~ icatod by ~d~ n~ ln siconductor ~t~uctu~o~, auc~ ao, ror ox~plo, th- a~orphou~
o~llcon PIN otructur~ dl~cloJed ln U.Q. ~ntont No. 4,06~.,521, b~tw~-n t~O el6ctrod--. onQ o~ th~ ctrod-~ typtcally ~
tran~paront to p~r~lt ~olas rad~atlo~ to r~ach t~e s~miconductor m-t~ l ThLo ~ront" olectrodo ~or con~ct) c~n b- comprlsod o~
~ thln ~Llm 11 ~ than 10 ~lcro~t-r~ ln t~lc~e~) oS
tran~ar~nt conductlv~ oxld- matorlal ou6h a~ tin oxld~ and usually i~ ~ormod b-t~-n a tran~paront ~upportLng ~ubotrate mad~
o~ glas~ or pl--ttc and tho photovolt~lc ~mlconductor m~t-rlal Tho ~baok~ ctrode ~or contact), whlch lo ~or~od on th~ ~ur~ace o~ t~- ~omlconductor mat-rial oppo-lt- th~ ~ront ~l~ctrod , ~-n r~lly co~prls-~ a t~in ~ o~ ~otal ~uo~ or oxa~le alu~ln~m. Alt-sn~tiv~ly tho b~ck cl~ctrode c~n ~o mado o~ a tran~p~ront ~torlal ~uch aJ tln o~ldo Th~ ~oltago produc-~ ~cro~ tho ol~ctrodo~ o~ ~ sln~l~
photo~ol~lc coll how~Yor 1~ ln~u~cl~nt ~o~ moo~ ~pplications ~o achl~vo ~ u~ul po~r l~voL ~om photo~oltalc somlconducto~

~ ~ ~ f~
d~lce~, lndlvidual photovoltalc ~ell~ mu8t be electrlcally conn~ad ln ~rie8 ln an array re~err~d to h~r~ln a~Aphotovolt~lc "modul~.~ A typlc~l arrangement o~ g~rio9-co~nected photovolt~lc c0118 ~ Jhown in ~
Fig. 1 Jho~o photovoltaic ~odul~ 10 comprl~ed o~ a ~lurallty o~ s~rl~s-conn-ct~d phcto~olta~ cell~ 12 ~ormed on a tr~nsparent ~ubstsat~ 14 and ~ub~scted to solar rad~atlon 16 pas~lng t~rough sub~trate 14. Each photovoltalc cell 12 lnclude~ a ~ront eloctrode 18 o~ ~r~apar~nt conduct ~ ~o ox~ de, a photovoltalc l~m~nt 20 made of a sesnlconductor matorlal, auc~ aBr ~or oxu~pl~
hydrog~n~ted amorphou~ sllicon, and a ~ack electrode 22 o~ a motal ~uch ae alumlnum or o~ a tran~parent mat-rlal auch as tln oxlde.
PhotovoltalC el~mcnt 20 can com~rl~e~ ~or exampl-, a P~N
atructur~. Adiacent ~ront oloctrodoa 18 ~re aeparated by ~rst ~ooves 2~, whlc~ ar~ ~lllod ~lth tho ~e~leonductor matorlal or photovoltalc el~m~nt~ 20. The dleloetrlc semlconductor materlal ln ~lr~t ~oovo~ 24 electrlcally in~ulatos ad~ac~nt ~ront electrodo~ 18. ~d~acont photo~oltalc elementJ 20 a~e ~opar~ted by ~ocond groo~oJ 26, whleh sre ~ ed ~lt~ tho ~et~l of b~ek ~l-ct~odos 22 to provldo a a~rlo~ connectlo~ bot~oen t~e ~ront ~lectrodo o~ ono coll and th~ baek el~ctrode o~ an ad~acont cell.
Ad~aeent ~aek el~ctrodo~ 22 axe olectr~cally ~olat~d rrom one-~noth-r by thl~d grooveo 28.
Tho thln-~lm photo~o~ta~c module o~ Flg. 1 Sypically 1~
manu~ac~ured by a depo~ltlon ~nd pattorning m~thod. One example o~ a aultable toehnl~ue ~or dopooiting ~sm~eondu¢tor ~at~rlal on a ~ub~trats 1~ ylow dlseharge ~n sllane, ~a deserlbed, ~or.

~2 ~4x~~ U- Q Pat~nt No 4, 064, 521. 5evor~1 p~tt-~n~
tecn.~lquas ar~ COMrentiOnally kno~m ~or ~on~ling the groov~a ~-p~r~tlng adinCent ph~o~olta~c C0118, includ~ng sllXJcr~ ng wlth r~ t ~a~Xs, otc!llng w~th posttiv~ or n~g~tive photoro~lst~, m~ cal oc~ibing, ol~ctrlc~ s~ar~o ~crlbln~, ond la~r ~cri~lng. ~a~r s~rlblnq and ~ilkscr~nln~ ~h thods havo ~rg~d aJ pr~ctlc~l, coot-ei~foctlv~, hlgh-~rolu~c proco~ or m~nu~cturlng thln-fllm semlconductor d~viees, lncluding ~morphou~
Jllicon photovoltaic modulo~. La~er ~cr~lng haJ an additlonal ad~rantago ovor ~ilkJcro~n~ns ~ecau~o it c~ parat~ ~d~acer~
c-118 in a multl-c-ll d-vlc~ by ~ormlng ~paration groovoa ~a~l~s wldth l~sa tba~ 25 micro~eter~, co~par-d to th~ typlc~l sllk~er~n-d ~roov~ width of approxlm~t-ly 380-500 mlcromoto~. A
photo~olt~lc modula ~abrlcatod ~lth l~-r ~c~l~inq thu4 haa a larg- p~xcontage o~ lts ~ur~ace aro~ act~voly eng~qed ~n producln~
ol~ct~lclty and, consoquontly, has a ~lghor o~icl~ncy than a ~odul~ ~br$cat~d by ~llk~cro-nlng. A ~et~od o~ laJ~r ~cslb~ng the lay~rJ of a ~hoto~oltalc module iJ d~clo~-d ln U.8. ~atont ~o. 4,292,092.
R-~-rrlng to Flg. 1, a mot~od o~ ~bricatlng a muLti-coll photo~olt~lc medulo u~lnq l~-r ~ribin~ comprise~ de~o~1tln~ ~ ~
contlnuouo ~llm o~ tr-nsp~s-nt conductlv~ oxlde on a tran~p~r-nt ~ub~trate 14, ~c~lbln~ ~lr~t ~rooveo 24 to soparat~ the tranoparent conducti~ oxld~ lnto ~ron~ oloct~odoo 13, ~br~catlng a contlnuou~ ~llm o~ ~-mlcond~ctor m~rl~l on top o~
~ront el~ctrod~ 18 and in ~lrst groovoJ 24, ~crlbln~ ~coad grooves 26 ~arall~l and ad~ac~nt to ~lr~t ~roo~e~ 24 to ~psrat~
-~ ~ 2 ~
the ~lconductor matorlal ~nto i~dlvidual ~hotovolt~lc olo~ nt-20 ~or "~eg~ntJ~) ~nd ~xpo~e portlon8 o~ ~ront ~loctrod~- 18 at :he ~ttom~ of th- 80cond groo~J, ~o~mlng a contlnuo~- ~llm o~
~otal on ~og~nt- 20 and i~ J~co~d groo~ea 26 ~o that t~o mot~l ~or~ ~loctrlcaL connoetlons with ~ront loctroda~ 18, ~nd tho~
scrl~ng t~lrd srooY~ 28 ~arallel and ad~ac nt to s~cont groo~e~
25 to ~op~ate a~d oloctricall~ i~olato adiae-nt bac~ oloctrod-~22.
A d~ nct diJadvanta~ o~ photovoltalc ~cdul~ Or tho prlo~
art ha~ h-r-tO~OrQ boon th~ unavallablll~y o~ lasga photo~oltalc ~odul-~ having th- ~loxlbllity o~ prod~clng ~ny do~ir~d volta~
output. ~y ~largo photo~oltalc ~odulo~ lt i~ ~o~nt ouch modules on th- ordor o~ on~ foot ~quar~ and largor. 3y ~small voltago output~ it 1J moant 12-15~ or 10J~.
1t 1J ~oll kno~n that th- ~oltag- output o~ a photovoltaic ~odul- ~ di~ectly rolatad to the ~umbor o~ photovoltaic ccll~
connocted ln ~-xl-~. That i9 ~ a~ t~e nu~b-r o~ c~ lncr-a~ o do~o tho volt~. In ~ la~- photo~oltalc modulc, on~ approach to contsol t~o volta~e output i~ to raduc- thc nu~be~ o~ in~ du~l cellfi ~n tho ~odul- whlla lnc~e~ lng t~olr 41Z-~ ~peci~ica,ly th-~r ~ldt~. 8uch a modul- 1~ dl~clo~d ln U.~. P~tent No.
4,5~2,2S~ uod tO :: ~L_" ~ al. ~ di~advantag~ to tho approach dl~clo~od by ~ C: IC ~ , ho~ev~r, th~t the ~ill fàctor o~
tho lndi~ldu~l c~ dac~a~e~ as the wld~A o~ th~ c-ll lnc~ases.
Thus, tho o~lcl-ncy, honce power out~ut o~ th- c-ll docreases a~
tho ~ls~ o~ th- e~ incro~os.
Th~ p~o~en~ lnventlon i~ lntend~d ~o pro~d~ a photovoltalc ~J ~ ?~ Ls t.~

~o~ul~, and a mathOd ~or ~aX~ t~at ~9 a lar~ photovolt~lc modul~, produc~ n o~timal width of the individual cells to ~axi~ize their pa~er output.
~ t lo al~o ~-lrahl- in ao~ ~pplic~tlon~, ~uch a~ tho lrta~ratton o~ photovoltalc modu~eS~nto automobllo sun~oors~ to lncse~ th~ tran~ltt~nc- o~ t through t~- photovolt41c modul-. ~h~ can bo Acco~pl~hod to a c~ ln oxtent ~y m~cing both t~ ~ront and r~-~ oontact~ ~o~ "ol~ctrod~") tr~par-nt.
Such tranap-~-nt cont~ can bo o~, ~or xumpLc, tln oxid~.
~h- tra~J~ltt~nc- o~ tho ~hotovolt~lc modul- c~n al-o b~ lncr3a~0d by saduclng t~- ~ldth o~ ~c~ c~ n t~ modulo to t~ r-~or~
lncsoa~ t~- nuDb-~ o~ Jc~ o~ ln th- photo~olt~c ~o~ul~, ~onc- lt~ llg~t tr~n~mlttanc~. A- d~cu~ d bovo, d cr-aalng coll ~ldth ha- th- Qf~ct o~ lncr---ln~ t~- ovorall voltag~ o~ th~
reaultlng ~ o-conn~ct-d p~otovolt~lc modu~o. Such hlgh volt~g-i~ not d-slrod ~or ~om~ ~ppllc~tlon~.
~ t 1~ ~u~t~-~ lnt~ndod th-t t~- p~ nt lnv~ntlo~ p~o~do a photovolt~lc ~dul~ h~vlng l~dlv~du-l c~ o~ ~duc-d ~ldth whll~
malntalnln~ th- out~u~ volta~ o~ th- p~oto~oltalc modul- a~ any d~s-d 1-~ 1.
p~ t ~3V ntlon ~l~o r-lato~ to a mothod ~or d~po~lt~ns an olong~t-d n~rso~ b nd conductl~ tt-rn. ~n prior art m~t~od~, ~uCh a~. n~-r, ~t al., ~ch conductl~o p~tt~rn~
d-~o-lt~d by a ~ cra-nlng mothod. ~llk~cs--nlng, howovor, i9 wa~t-~u~ o~ conduct~v- ~luld u~-d to ~ k- co~ductl~o patt~rn, 1 not oaclly auto~at~d, and produco~ poor roprod~clblllty. ~urt~or, ~t ~ dl~lcult ~o co~t~ol ~ho thlck~ o~ p~t~n~ produced.

; ~ ~ ? '~
~ rh y~ t in~r~nt~on i~ intondod to pro~d- a ~ thod ~or d-po$~ting an elon~ated c~nd~ctl~ patt-rn that i8 not w~to~ul o~
conductlv~ fluld usod, iq ~u8c~ptibl~ to con~putor control to ~odue~ ~produclbl~ pal~ rns snt wh~c~ produce9 a ~attern that ha~ a th~cXn~ th~t can b~ oaslly controll~d.
Addi~ional ad~anta~ o~ th0 p~o~nt lrvention ~111 b~ 80t ~orth ln part ~n th- d0Jc:~ption that ~olloll~ and in part ~111 be obv~ou~ ~ros~ that d9~cription or can b~ rn~d ~so~ pr~ctico o~
th- in~r-ntlon. T~e advantag~ o~ th- lnvontlon c~n b- realized a~d o~taln-d by th- sDet~od partlcularly polntcd out in tho app~nd~d cl-~.
,S~M~Y DF ~r~F. TNVEN'r~)N
To ovorco~o t~e probl~- o~ th- prlor art m~thod~ and in accord~nco wlth tho purpo~o o~ th- in~ntlon, a8 e~bodied and broadly de~cr~b~d h-rsln, a th~n-~llm somlconductor do~lco of tho pr-~-nt in~ontlon co~prls~ a ~ub~trat~ ~nd ~ ~ront contact layer dl~po~-d on th- ~ub~trato includlnq a plural1ty o~ ~-g~ant~
~eparatod by ~irst ~eribe lln~, a plur-llty o~ th- ~ogmonts ~or~n~ a submodulo, and at loast onc o~ th- ~ub~otulo~ ~o:m'~ a module.
Fi~t bu~ pro~rld-d ~or conn-etin~ ln p~ralleL the oub~o~ul--. A thln ~ o~ a somlconductor ~torl~l 18 dlspogod on th- ~ront ccn~-ct lay-r and a bac~ contact layer i8 digpo8ed.0n t~e t~n r or ~-~lconductor m~t-rlal. Tho back contact l~yer iB scrlbod alon~ s~eont Jcrib~ l~n~ corre~ondln~ to and ad~acent the ~s~t sc~ibe llnos. Interconnoct~on moans ~re provlded ror lntorconnectlng ~d~acent are~s o~ the ~ront and back con~act l~y~r~.
~ 180 i~ accord~nca wlth th~ pr~ont ln~ontlon, a mothod 1~
~rovid~d ~or d~pos~lng an elongat~d ~arro~ band solld conductlvo ~attoEn on 3 ~c~loonduotor 3ubGt~n~ tho~ co~lo~a d~posit~ng coAducti~e ~luid comprl~lng a conductlv- m t~lllc or or~anometalllc compo~ont 1~ an ~lon~atod narro~ band pattorn on 9UCh 9ub~ t~o and ~auslng 8uch doposltod riuld to solld~y to ~or~ ~ oolid olongatod n~rro~ band p~ttorn on such sub~trat~ ln sub~tanti~lly t~e ~am~ patt~rn as t~t ~o~med by ~uch condu~
~luld.
Furth~r, a m-thod i~ pro~lded ~or d~o-lt~n~ an olon~t~d nasro~ h~nd co~ductlve p~tto~n on ~ lconducto~ ub-tr~t-. T~
~ hod compriso- de~ooltln~ conductlvo ~luld comp~lng conduct~Yo m t~lllc or organo~talll~ c03ponont and carr~-r ~lul~
ln a na~row b~nd p~ttorn on a s2~ico~ductor oubJtrato and ~u~ n~i~lly ~o~lng th~ car~ler ~luld ~ro~ auch conduc~l~e ~luld d-po~l~ed on th~ sub~trato to ~orm ~ ool~d rolatively l~obll- ~attorn o~ tho conduc~lv- mot~ c or o~ganom-tallic com~onont on ~uch ~ubctr~to.

Th- acco~ ylng dra-~lngo, ~hlch aro incorpcr~t-d ~n and whlc~ conJtltut~ a part o~ tho sp-cl~icatlon, illustrate at loa~t ono ~ t o~ the lnvontlon and, tog-t~or with the ~crlption, o~ ln t~u princl~lo~ o~ tho lnventlon.
Flg. 1 i~ a J~o~atic por~poct~ vio~ o~ ~ prlor art photo-oolt~lc ~odul- ~rlcatod accordl~n~ to a p~or a~ mothod~
~ 158. 2ta) - 2~g) are 8 emat~c cro~ ctlonal vi~

.

~ ~J 2 L ~ $, 1 d~plctln~ thQ ~t~pB in a ~othod s'or ~rlc-t~n~ photovolt~lc Sl~o~o ha~r~n~ lag~r-Patterned b~cX l-ctrodo~
~1~. 3 ~- a ~cham-tlc top view o~ tsat- hsvlng a ~cri~ed ~ront cos~ductlvo layor di po~d thoroon ~ ~ eonnection ~t~i~ dl~pa~ed on th- :Eront conductl~ro layort F~g. 4 i~ omatic top vio~r o~ ~ su~-tr~to ha~ a RCribsd ~ron'c conductl~ y~r d~poJod t~oreosS and a conn~ct~on ~trip and bus ~r m ~- dl~po~od on tho ~ront conductlve lay~r~
F~ . 5 13 a acheD~atic top vlew o~ a Ju~-~r~t~ hurlng a scrl~ed rront conduc~iv- lay-r dl~poJ-d thoroon and a conn~ctlon ~trip dlspo~ed on th- ~ont contuctlv- layerJ
F~g. 6 J~ ~ Jch~m-tlc top ~rie~ o~ a o~-trat- ~lng .
~crlbod ~ront conductivo laye~ dl~pc~-d theroon and a connect~on ~trl~ and bu~ bar m~na di~osed on ~he ~ront conductlv~ lay~rS
Fi~. 7 ls~a ~lo~ cha~t ~howlng tho Jtop~ ~or~ormod ln dl~po~in~ a conn~ction ~trip and b~s bar m-an~ on a ~ront conducti~c l~yor) ~nd ~ 1~. 8 ~ a ache~atlc block dlagrum of an apparatu~ ~soful in pe~ro~lng th- m-thod of Fiq, 7.

~ re~Ce no~ ~11 b- ~ado ~n dota~l to the pres-ntly pro~rrod ~bo~l~ont~ o~ the invention, ~x~mpleJ Or whlch a~e illustratod in t~- acco~p-ny~ng drawing~.
Fig, 2(q) io a ach-m~tlc croJa ~ectlonal vi~ of a portion of a ~ulti-coll thln-~llm photo~oltaic modul-, d~slgn~ted geno~ally by ro~ronc~ num~r~l 110. Photovoltalc mod~l6 110 i8 comp~iged 0 a plu~al~ty Or scries-connsct4d photovo~ c cbll~ 112 rormed on a -~l~t, ~n~p~nt 8ub~trato 114. In op~ratlon, photovoltalc ~odul~ t 10 g~nerat~8 ~lect~lclty ln r~4po~9e to ~ol~ radl~tlon 116 pABO~g t~ough ~ub~trata 114, which pr-f-rably 1J ~o~od o~
gla~ ach photo~oltaic cel~. 112 lncludo~ a rront elect~od~
so~ment 118 o~ trunJp~ront co~ducti~- ox~de, ~ photovoltalc olo~n~nt 120 mad~ o~ lconductor ~at~s~ u~ s, ~or ~xu~ple, hydrogo~ated amo~phous alllcon, and a b~ck l-ctrod~ 122 o~ a m~tal ~uch a~ ~lumlnu~ os a conductlvo ~aterlal such aJ tln oxlde.
Ad~acent ~ront ~loctrodo ae~nents 118 ar- s~aratod ~y ~iSl~t groove~ 124, ~hich ar~ ~llled wit~ th0 J~lconductor ~at~rial o~
photo~oltaic olo~ nt~ 120 ~d~cont photovolt~lc olo~nts 120 are s~p~ratod hy oocond groo~oJ 126 ~nd a1JO by thlrd groo~o~ 129 ~nactivo portl~n 1~0 o~ s~iconductor ~torlal ~ ~o~i~lonod b~t~on oocond g~oo~ 126 and thlrd groov- 128 ~ortlons 130 are nlnactl~" ln th- ~n~o that thoy do not contrlbuto to the conv~r~ion o~ solar radiation 116 into oloctrici~y S~co~d groovo~ 126 ar- ~lllod wit~ th~ ~torl~l Or b-c~ oloctrod-~ 122 t~
provld~ a ~or~oa co~n~ction b~tw-~n th~ rront o~,octrodo o~ on~
c~ll and t~ bac~ atrod- o~ an ad~c~nt coll Gaps 129, locst~d ~t t~o tops o~ thlrd ~roo~-a 129, s~parat~ ~nd oloctr~cally iJolat- ~d~cont back Q1ectrodoJ 122 T~ ~thod ~o~: ~ormlnS p2 otovoltA1c ~odulo 110 no~ will bo d~crlb~d ~rit~ r~oranco to Flq~ . 2 ~) through 2 ln ~c~ord~nco wlt~ t~- ~nventlon, ~ ~ub~tanti~lly continuou~
~llm 132 o~ trsn~pa~nt conduc~lvo o~ld- mato:~al, pro~or~bly ~luor~natod tln ox~d~, 18 ~abric-tod on t~an~parent ~ub~tra~e 114 ~hown ~ Fl~ 2la) Conducti~o ox~d ~llm 132 c-n ~e ~abrlcat~d i~ a ~anne~ ~ell known in th- ~t, for ex~mple, by ~cal vapo~ d~po8i~ior~. Th~ thlekn~ or th~ tra~sp~:ont co~du~tl~re oxld~ a~y depond~ng upan tho d-Jlred application Or the p~otovoltalc ~odulQ.
Conductl~ oxld~ f11m 132 then ia ~cr~bed with a la~ o abl~to t~o conductl~ro oxld ~ato~l~l alon~ a ~irat pr~d~tormlne~
~t'co~n o~ l~neo and for~ pr~ra~ly p~r-llol r~rst g~oov~ 124, Yhlc~ dl~ ilm 132 lnto a plu~ality o~ ~rallol ~ront elect~odc~ , a~ 8~0~ ln Flg, 2~b~. U.3. ~atont No. 4,292,092 dloclo~os ono ~ultabl- l~ser ~cr~blng tochnlquo, althou~h ~talnly n4t t~ only sult~bl- technlqu-. Scriblnq can ~Q
p-r~or~-d lth-r by mo~ing tho bea~ o~ the laa-r ~lth r~p ct to t~ ~ub~t~ta or ~y ~ount~ng t~- Jubatr~t- on a X-Y tabl~ t~at ~9 mo~bl~ ~th roopect to the bes~ o~ th- la~er. Scr~blng pro~orably 18 dono ~ro~ t~o ~ont ~t~rough ~ub~trate 114) but can ~o don~ ~rom t~ bac~ ~diroctly on conduc~lvo oxld ~llm 132) a~
woll. F~rst g~oo~-- 124 ~r-~-r~bly ~ro ~bout 2g micrometors ~n ~ldth.
Aa ~o~n ~n F~g. 3, on- ~mbodi~ont o~ a ~ront contact ;ayer as shown ln accord~nco ~lth the pre~ont ln~-ntion 1J d~po od on a sub~tr~t-. ~h- ~ront co~tact layor ln ~cco~d~nco ~lth tho pr~sent ~nYontlon lnclud-o a plurallty o~ segm~nt~ ~18 soparatod by ~lr~t ~crib- lin-~ 12~. An l~olation ~erlb- 301 (a~ o~o~n ln dott-d outlin-) 14 provlded to ~n~uro th~t t~ ~d~acont s~qmont~ aro not ~hort-ol~oultod to on~ Anot~or. ~ un i~ ~I~. 3, ~g~o~t~ 110 ar~ orlontod to on~ anothor and s~paratod by rirst scr~bo l~n~
124. A plurality o~ segmant~ ar~ grou~d tog~t~or to ~orm a -~ub~odul- 304. ~t l~a~t ono Or tho ~ub~odulo~ 304 are group8d to;~t~r to ~rm ~ ~odul~- Cloarly, when t~ but ono ~ub~oduls 304 in a ~odul~, aH i~ th~ ca~- of Jub~odulos 304 ln F~g. 3~en th~ two sr~ co-extonsl~.
In on~ Æmbodl~nt o~ t~e pre8~nt inv ~tion, a~ ~ho~n-ln Flg.
3, t~o Jub~odul6a 304~a~a d~JposQd ~ldb-by-oide o~ a 8ubstrato.
~ -Y ~-~J 30y ~ch o~ t~c ~ubmodul-~inoludo~ ~ plusallty o~ ~eg~Qnt~
dl~po~od ~e-by-~d~ and ~-p~ratod by flrst 3c~ib~ lin-~ 124. A~
la ~nown, to ~ u~- o~ a photovoltaic ~odul- ~ connoctlon must bo ~or~ed to ~ach ~nd of t~- sori~a o~ photovolt~lc modul-s ln a mod~lo. In ~ dovlc- ln accordanc~ wlth tho pra~ont lnv~ntlon, 8u~h connoct~on~ ar- pro~id~d by cennoct~on ~trlp~ 306.
Con~ctlon strlp~ 306 ~nclude ~oldbr pad~ 30~ to ~hlc~ ~lr-~ can b- co~n~cted through old-rlng, ~or oxa~plo, to allow t~ modulo to bo conn~ct~d to e~u~ nt (not ~ho~n) to b~ pow r~d by tho modulo. ~ ~
~ ho t~o oub~odul-~ 304~c-n b- ~eparatod by cuttl~g t~om ap~rt alon~ cut-lln- 311.
ln anoth-r ombodlm~nt o~ th~ pro-ont lnvention, a~ ~own ln Fig. 4, t~o ~ubmodulo~ 304' ~nd 304~ ar- dlJpoJod olde-~y-sids on a ~b~tr~to. ~a~h O~ t~e ~ubmodula~ lncludo~ a ~lurallty o~
~agm6ntJ 11~ diapo9~d ~Jde-by-oldo and 8eparat-d by ~crib~ llnes 124. To t~lJ polnt, thon, th- ~ odlmont o~ ~lg. 4 ~9 ~l~llar to the embodl~ont o~ ~lg, 3. In the pr-o-nt ~mhodi~ent, ho~ovar, ~lr~t ~u8 mo~n~310 ro provldo~ ~o ~ntorconn~ct ~ubmodulos 304' and 30~ ir8t bu8 ~eano 310 a~o mado ~u~lclontly long and 90 o~ont-d ~o ~ to ~laco t~e ~rst and ~acond oubmodulo~ ln ~ t~ "~

~all-l conn~ctlo~ ltlt~ ~c~ oth-~- Th~t 1~, ~o~ ox~l-, th-po~tl~ ~ld a o~ eac~ ~modulo aro l~t-rco~noct~d a~d t~
n~g~tlv~ a~d~J 0~ ~ach ~ odulo 304' and 304~ ar- ln~-rconnoct-d to ~or~ ~ ~lngl~ ~odul~ 314. ~n th~8 ~y, t~e vol~g4 output o~
tho ~ulting modul- 1~ th~ th~ volt~o output o~ ac~ o~
~ cor.~tltuent two ~ odul~. Mor~o~ ~r, th- cur:-~t output o~
th~ ~o~ tsrico t~l~t o~ t2~c curront out~ut o~ lt~ t~o co~otltu-nt ~ o~ule~
Fig 5 sho~ another embodiment of th- pro~-nt ln~ention wherein four uhm4dule- 304-30~''' h~ve b on fabricatod on ~
singls ub-trate, each lncludlng a plurality of ~eqm0ntJ 118 ~eparated by ~cribo line~ 124 Connectlon ~trip- 306 are provid~d at ~lth~r ~nd of e~ch ~ubmodule to provide a collection ond connection point for th- pcwer output fro~
e~ch ~e~ie--connectod ~ubmodul- ~h- lndivldu~l ~ubmodule~
can be ~eparated or cut apart ~long cut-llne~ 311 and 311~
In anoth r e~bodiment of th- pre--nt invention, a~ shown in Fig 6, four ~ukmodule- 304-30~''' aro di~po-ed on a ~ub~trat- B~ch of th- uboodule- include- a plur~lity of ~egment- 118 dl-po--d ~id--by-~lde and ~op~rat d by ~crib~
lino~ 12~ To thl- po$nt, th-n, the--~bodl~nt of Plg 6 i~
~imila~ to th exxL~nt of Fig 5 In tho embodimont of Fi~ 6, ho~ r, fir-t buJ m ~n- 310 ~r- providod to int~rconn ct u~odul-s 30~ and 304' in parallol to form modulo 314 and i~t rconn-ct sukmodul-- 304 t ~ ~nd 304~ in parall~l to for2 ~odul- 314' Th- follo~lng o~mpl~ llluJtrat- the manner in which photovolt~lc modul-~ ln ~ccor~c~ wlth th~ pr---nt in~ntion can ~o m~d I ~

T~o p~oæ~nt 6xa~plo r~ t~o to thc ~ lc~tlo~s o~ tlro r~t~mo~ul00 O~ ~ t~o ~oot by ~our ~oot ~ tr~t- ~uch ar ap~t~Jho~ or ~x~ F~g 3 ~t h~ bo~ c-lculat~e th-t t~o ~u~fflodul~ could b- d~8po80d 03t J oub8t~ato, ~8C!~` h~vlr~g 2g s~ t~ lnd~vldual -g~nt J~ ould t~u~ b~ 375" x 47" ~ 9S3 ca Y 119 3B c~ G~on thl~ ~o~nt ~lz-, th-ual ~ nt r-- ~rould b- 114 c~2, ~t h~ b-~n c~lcul~t-d th~t ~ ~ ~ould b- 15V ~nd t~at ~D ~ould b- 1.200 ~p~ ~O~ ~ach ~ub~odule, wher~ ~D refer~ to the value ~t lo~d~.
The lndividual ~ubmodule~ may be ~ep~rated fro~ o~e another by, for Q~amplQ, cutting along cut-lin~ 310.

o~-nt xu~ r-l~t~o to th- ~-br~c~tlon o~ gl-modul- CO~lprl~3~ t-~0 ~u~o~ J ~o~ ln Flg ~ ~t h~ n calcul~t-cl th-t t~o u~o~ulo~ could ~- ~Jpo~od on a ~ t~at- o' t~o ~oot by gous 2'oot d ~ A~on~ odu~ ~ould includ- 2e Jog~ ntJ ~ 9a~ c~) x ~6 ~0~ 11 c~) ln slz- TheJe 8-~ nt dls~n~on- provld~ g~ ~t ~ o~ llC 33 c~2 ~nd a ~ubmo~ul- s~a o~ 32~7 2~ c~2, Th- V~D lo calcul~tod ao 1~ ~ ~nd the I~D lo 1 233 amp- By providlng a bu- to lnterconnect tho ~ubmodule- togother ln p~r~llel, a module having a v~D of 15 v can be ~chio~d h~ing an ~LD of 2 466 ampo ~ ;.
pr~-n~ ~x~pl~ r~lato~ to th~ rlc~tlon of ~ou~
~op~rat~ oub~odu~ on a two ~oot ~y ~ou~ ~oot oub~er as ~hown, ~os x~pl~ P~g 5 It_ha~ h--n calcu~-t-d that ~our ~ ~ 2 ~ ~ q ~ r~

a~od~ ould ~- dl~po--d on t~o ~ t~ato, a~ch havlng 28 ~-q2,as~t~ ntl~idual s~ nt ~lze~ ~ould thuJ ~- .37S" ~.9 cn~) x 23" ~5~,42 cSQ) to p~oY~d~ vidu~ nt ar~5o~
55.67 c~2 ~ ~ zu~ulo ar~ os' 1559 c~2, It ha~ b--n c~lcul~d th~t t2~ o~ o~ modul~ would ~- 15 v and A I~,D
o~ 5 90 ~ ~o~ s~d ou~o~ul~ .
~ n 'vlclu~l sub~odulaa can t~n b- ~p~atod alorlg cut lin~s~s ~ho~tn fn Fig. 3 to ~-~ar-t- t~- ~ous ~sbmodul~ r~Om on~
~ot~
, ~ n~
The ps~ent ex~mple relat~- to ~h~ fabrlcation of two module~, each includlng two su~module~, on a two foot by four foot ~ub~tr~to, a~ aho~n, for a~a~ple, in Flg 6 It ha~
been calculated th~t four ~u~module~ could be di~po~ed on a two foot by four foot sub~tr~t-, each ubmodule including 28 segment~ 388 in ( 985 cm) x 22 5 in (57 lS cm) in size Such ~eqm~nt dim~n-lon- produc- a ~gment as-a of 56 3i c~2 and ~ ~ubmodul- ar-a of 1577 c~2 Th- V~D i- calcul~ted A-VLD ~t 15 V and th- I~D i- ~597 ~mp- ~y pso~ld~ng a bu- to interconn-ct two u~odule~ ln p~rall-l, a modul- havlng a VLD of 15 V can b achiev d having a I~D f 1 190 ~mp~ A-~hown in Fig 6, th~ t~o modul--, 314 ~nd 31~', each including ~o psrall~l conn~ct~d ub~odulo-, can b~ ~eparated alon~ a cut lin~
The fir-t bu- m an- i- acco~pl~-h-d b~ a ~ethod in accord~nc- ~ith th pro--nt inv~ntion or depo-itlng an elong~t~d n~rro~ b~nd p~ttern on a ~ub-trat- Th~ conductive pattorn~ of thi~ ln~ntion comprl~o th- conn-ctor 8trip~ and 1~ .

~ ~ .2 L~ 2 bu~ ~r~ ~nd ~r- ~d- of conduc1:~ ~t~ lJ.
Th~ eonduc~Y~ patterno ar~ gor~o~ally m-do by d~o~ltln~
cos~duct~v~ ~luld on a ~-t~-t~ h cond~ct~ luld co~
con~uc~ ro ~t~llic or org~no~t~ conpon~nt ~uc~ a~ o~lvcg, COpp9~, ntcJc-l, alu~lnun~, sold, ~l-t~nu~, pall~dlum, or ~xtu~
t~ o~ co~tuctl~r ~lU~d l~y al-o ~r~ ~ly co~prlJ~ a C~r~ 1U1~ ~rh~ A t~- t~ J~On 0~ t~- co~duct~v-m-t~ c o~ o~gano~ e~lllc co~ponontJ T~- conduct~vo ~luid should pro~ld- a cond~ctlv~ ~lu~d ~hlch 1~ ~olatl~-ly ho~og-n-ous and o~ ~ro~-~ vl~co~lty ~or d-po-ltlo~ 1~ t~- d ~lrod patt~n Th~ vl~co~l~y ho~ld not b- ~o low -- to pxovldo a ru~y ~lu~d w~ch 1~ dl~cult to control or ~hlch ~lght a~par~ta out ~rlou-co~an-nt-, no~ ~ouldA~ ~o hl~ a~ to 91u~ d~po-ltlon oqulp~J~t or ~- d~ ul~ to patt-rn ovonly Pr-~-rably th- ca~slor ~lu~t c~n b~ o~-d ~ro~ t~- co~ductl~ ~luld ~t condltlon~ ~hlch ar-not ~xtr~o und ~ould not load to d t~r~oratlon o~ th- conduct~vo m~t-rl~l or t~- ~ub-tr~t- It 1- pr-~or~bl- th~t th- c~rrl~
~luld bo r-~o~bl~ ~y ~ub~ctl~g th- conduct~o ~u~d to 30d-~t-h~t ~or a oho~t ~rlod o~ t~s-~ h- conductl~- ~luld m~y d--~r~bly ~l-o comprl~- gl--a ~r~ts ~ch can h~ or~ a conductl~o matorl~l h~vln~ ~provod mcc2~ c~ ~tr~ nd ~ alon psop~ a to t~- au~atr~to. ~n lt~ u~, It ~ d ~ o ~t th~ ~u~u~ u~
~os ~ p~rlod ~-x d ~ooit~on on t~ ts~t- to sinter the gl~-a ~sl~ nd ~o~ co~ductl~ t~rl~ g ~- d-~ir~d ~rop~ u~raturo and t~ n-c~ or thl~ tHp~rary d~p-adlng on t~- Aatu~ o~ t~- conductl~ ~lul~ ~ncludls~ but ~32~

~r~lly r~nq~ ~om ~out SOO'C to ~bout 700'C.
h 3221, ~nu~acturod ~y M~t-ch, rnc. o~ Ælv~r~on, ~onn~ylv~ , U~, ha~ b--n ~ound to,~o a ~ult~ conduet~v-~lu~d rOr th~ typo o~ ~roc~ pa-t- comprlacd o~ Jllvor p~st~ and glaa~ ~rlt in b~nd-~ and ol~t. Sl~o ~u~ ur~
r~pr-~nt~ thl- matarl~l to b- C5~ by ~nt ~ or h~ing ~
r~ ti~rlty o~ ~ 2-0 D~ o~ and a ~s~CoJ~ty or 4-8 iccp~.
~ n ~ ~ot~od ln acco~danc- ~fit~ t~ ~t lrl~rentlon, ~J
sho~n ln ~lo~ st ~onn in ~lg. 7, conductl~ tln o~cid ~C~o) d-po~ltod on a ~ trat- ~t-p 00), ueh a- gla-~, to ~o~ a ~ron'c co~t~ct l~y-r 132. N Yt th~ conductlvo ~at~ l, p~-SerablS
o~lt~d on th- CSO layoz 132 ~-t-p ~02). ~ro~or~y, t~
con~uctlY ~t-rl~l in M t-ch 3221~ cuJ~od ~bovo, d~pen~
by ~ p~ncln~ y~t~ m~nu~ urod by U-ct~onlc Fu~lon D~lC~
h~lng a 72SD ~r~ ~d po~ltlon-d by ~ t-lc 402~ po~ition Jy~t~. T2~ ~ooltlo~ of t2~- conductlv~ ~torl~l ~olrlg acco~ h-d ps-~o~bly und r t2~- rollo rl~g condltlo~
D-poo~t~on It~te~s Acc-lo~atlon- 50~ C/~-¢
tr~lo¢lty - 7 . O " / -¢
~nap-o~ 8-tpolnt - .008 Fll~ T~lckn~ .0005~ - .0100 J'llm $,~ r~ r-d Follo~ th- d poJ~t~on of t~- con~uctlv~ s~tor~l it 1J
th~ally cus~d (-t-p 404). ~h~ pr-~-s~ly ~-s~ormed in a multi-cl~or ~y~t~ at a rate o~ 12~/~ln b~lt ~p~d (contl~uou~
b-lt) ~or a c~y tl~- o~ 1 ~lnut~ ~t 200-C th~ lre ~im~ o~ 5 m~nut~ at ~O'C.
~ o~lo~n~ tho~al cu~, th~ ~ont contact layor 132 ~J ~,J~r oc~b-d to ~orm ~c~b- lin~ 124 t~t~p ~06). S~ F-r~or~
th- ~ann-r do~cr~-d above- Followln~ r ocr~ln~ or oc~
lln~l~ 124, tb.~ r~lnl~ ~topo in th- ~br~cation o~ t~-photo~oll:~lo ~odul- a- ~ho~ ln Fls~. 2 ~c) to 2 Ig) a- ~ ~crib~d h-r~1~ 3,~e per:~ormed a~ described below.
F~g. ~ ~ho-r~ an appa~atu~ w-~u~ in C~ Ag out t~O p~o~
show~ ~n ~lo~ c~a~t ~or~ ln ~lg. 7 and d~ d ln ~o~or-nco th~r~to. A ~u~trato 114 havin~ ~ lay-~ 132 d~o~od t~o~eo- ~s ~ho~ n F~g. 2t-), ~d d~ d in r~ ncc th~r~to) ~
provld~d and plac~d on ~ convcyor bclt 500. 1~ c03duct~v~ d 502 1- dl~po~-d ~n a ro~or~roir 504 ~nd pro~ d, vl~, cond~lt 506 to ~ ~u~p ~0~. Pre~rably, pu~p 50~ 1~ a poalt~v~ dlJplacQ~-nt pu3p. Pu3p 50~ ~cro~--J th p~ u~c o~ conductlvc ll~uld 502 and ~uppl~ t long ~ condu~t 510 to ~ no~lo -~12. Conduct~v-~ ld 502 1~ rorccd out o~ nos~lo 512 nd d~oct-d ~long a ~troam 514 to~ ~d ub~tr-t~ ha~ln~ conductl~ layor 132 on lt.
~h- no2~1- 512 1J ~o~t~on-d ~la ~ x-Y-z poaltlon-r 513and a mocl~ l llnlc Sl~ pooltlon o~ nossl- Sl2 ls t~eroby d to ~o~ ~ patto~n S16 on conductlv~ l-y-r 132. ~ttorn ~16 c~n b-, ~or YUop10, ls~ t~- ~0~ o~! conduc~lv- Jtxlp~ 306, sold~ pad 30B, u~d ~ls~t bua b~- 3~0 o~ Flg~. 4 ~nd 6.
Con~yor bolt S~0 la ~ n~rglsod to ~ovo ~ub-trato 114, hav~n~ conchctiv l~y~r 132 ~nd: p~tt-rn S16 t~-xoon, lnto ~lr~t ov~n ~lt. ~hon, ~!or ~xa~pl-, canduc~ 502 la Metoc~
3211~, a~ da~c~b~d abo~to, patt~xn 51~ la ~r~od at 200-C ~or on~

-minut~ in ~ t ov n 51~- Conv~yor bclt S00 is th-n ~ncsg~2~d J~gasn l:o mow~ trato 114 ~nto ~ocond oYon 519 wh-s~upon lt ~ls~d ~ 550'C ros ~pproxi~taly ~ lnu~e~.
ould bo not-t tl~at is~ . 2~A) to 2~g), th- ~sont contact layor 132 18 ohown but t~e bu8 ~oanJ, i8 noe. ~t s~oulO. b~
undorstood, ho~o~er, th~t tho b~ i8 dl-pO~a on ~ront cont~Ct lay~ 132 ln th mannor do8cs~b-d ~o~ At~ st-pa sho~n ln Flgs. 2 ~c) to 2 ~g) aro po~o~m~d.
In accordancc wlth tho ln~rontion, a photovolt~ic ~oglon co~p~lo~d o~ a sub~tantlally contlnuou~ thln ~ 13~ o~
semlconductor mat-rlal then la ~abr~c-t-d ov~r ~ont Qlcctrodo~
8 ~nd ~n ~r~t groov~ 2q, ~ B~OWn ln F~g. 2(c). T~e ~am~conductor ~t~ l fllllnff ~lrJt groov-- 12~ p~o~ld~-~l~ctrlc~l ln~ulation b-t~on ad~c-nt ~ront l-ctrodss 113.
P~ Ably, tho ~hotovolt~lc roglon 1~ ~ade o~ hyd~og~nated amorp~ou~ ol~lco~ ln ~ conv~ntlonal PlN tructuro (not ~ho~n) and 1~ approxl~ t-ly 6000~ ln th~ck~-~J, b~ln~ co~p~40d of ~ p-layor o~ lao~ yor o~ 5200-5500~, and n n-lay-r o~ 500~.
Dopooltlo~ pr-~ora~ly 1~ ~y qlo~ dl~charqo ln Jlla~, a~
doscslbod, ror c~ampl~, ln U.S. P~tc~t No. 4,064,521.
Altornat~voly~ t~ 8-m1conductor mater~al may bc Cd8~CuIn~c2 and CdT-~
ln acco~danc~ ~th tho f~r~t ombodlmont o~ tho mot~od o~ t~l8~n~antlo~, t~o s~m~conductor ~llm 134 t~-n ls 3cxlbod ~lth ~ laser to ablato th~ s~mlconductor m~t~rlal alon~ ~ ~ocon~ prodQton~ln~d pattorn o~ llnoJ and ~o~ ~cond ~roovo~ 126, ~hlch diY~dc ~em~conducto~ 134 into a plus~l~ty o~ photovolt~lc ~l~mentJ

120, ~J ~ot~n ln h'~- 2 ~d~ F~ont ~loctroto~ lla ar~ o~od ~t tho ~otto~ o~ Jacond g~OO~ 126- Scrl~lng ~y ~- iO~O~Od ~t~
th~ ~a~ la~r w~d to Jcr~be t~ paront co~ducti~e oxld~, lay~r 132, ~Ycept that powe~ deA~lty ~8 redu~o~ to a lo~l t~t will ablat~ th~ J~tconducto~ m~t~lal s~lt~lout af~ect~ng th- conduct~v~
ox~d o~ ~ront loctrodo~ 118. ConJ-~ontly, the l~s-r ~cribing o~ ~conductor ~11~ 134 al~o c~n b~ por~o~d ~ro~ ~lt~ser sid~
o~ trato 114. Socond gsoov~ 126 pro~-sably are ~cribed od~acont and par?ll~l to ~lr~t groovo~ 12~ ~nd pr~rably ar~
approx~t-ly 100 m~c~om-tors ~n ~ldth.
in accordanc~ wlth tho method o~ th- rl~t ombodl~at o~ th~s inventlon, ~ thin ~llm 136 o~ conductl~ ~at-rl~l ~uch a~ motol, pr-~-rably alu~nu~, or ~ transparont conductor ouch.aJ tin ox~d0, th~ la ~abr~cat~d o~ r photovoltalc olomsnt- 120 and ln ~-cond groov-- ~26, ao ~ho~n in Flg. 2(o). ~h- conductlv- m~torlal ng s~con~ ~roov~ 126 pro~ldoo alectrlcal connoctiono bet~oo~
~ 136 and tho ~ortlon~ o~ ~ront eloctrodoo 118 spoo~d at tho bottom- o~ ~ocond groo~o~ 12C. Conductlvo ~llm 136 1~ for~ed, ~o~
ox~3plo, by ~p~ttorln~ o~ ot~o~ w~ no~n tochn~qu~s, t~.~
thic~no~- o~ 136 do~ndlng o~ tho lnt-nd~d appllcatlon o~ the modul-. A~ un ax~mplo, ~or ~odulo- lnt~nded to gonorat-su~icl~nt po~-r to ch~rgo 12-volt Jtorago batte~y, m~tal rilm 13 typlc~lly 1- ~ormod o~ alumlnu~ and 1~ about 7000 A thlck.
~ co~d~g to pr~or art la~r ocslblng m thod~, th~ noxt ~t~p ~ould be to ~c~lbo mot-l ~llm 136 wlt~ ~ la40r to ~lat~ tho metal along a pattsrn of l~no~ a~d ~or~ a ~0~108 of groov~ dl~ding ~11~ 136 lnto ~ plural~ty o~ bwk olec~od~. Thi4 mo~hod, a~

f~ ~ 2 ~ 3.
t~,ug~, ~o~ ~xu~ by rJ~9~ Pa~nt No. ~,292,092, h~J prov~d to b~ lmpr~ct:tcal. ~cau~ o~ t~;- h~ ct~v~ty Or ~lu~.nu~ d oth~r ~t~ls con~~tiorl-llY ~sod to ~o~ t~ cJc oloct~odc~, t~^
la~-~ u~d to ~c~b- th~l b~ck olect~Dd- t~L~I mu~ oporat~d~ at ~ni~e~tly h~h-r pow s d~lty thaR t~o-- u~-d to ~s~o ~cond g~oov~- 126 1~1 ~conducto~ 34, o~ 10 to 20 tl~-hlgh-~.
~ 0~ X~1e~ ~ mot~l t1~ 136 1J ~O~d 0~ a1U~ and ~
about 70001 thlck, ~nd 1~ th~ to ~ r~ctly ~l~t-d by ~ ~ro~ cy-doubl-d s~-od~u~:YAG la--~ ~ttl~g ll~ht h~l3g u~ol~t~ o~ ~bout 0.~3 ~c~o~t~ d op-sat-d la a ~a~0O
lc~ od, th- l-J-r ts~plc~lly ~ould ~ ~ocu~-d to ~out.23 D~ro~t~- and o~r~t-d ~t ~bout 300 ~ t~
uJod to ~ t- ~lconductor ~ ,34 and roml -cond groov~ 12~, lt pr-~-r~ly 1J d-~ocu~ct to 100 ~ro~tor~ ~d 1~ op-r~t-d ~,t about 360 ~ tt~ou~ t~- la~-r ~ ld ~ op-rat-d t ~ gt~tly lo~- r poll~r 1~1 ~o~ dlr~ct ~l~tlon o~ ~u~u~, th- r.~ r o~
p~oto~ p-r oocon~ lt ~ro~, t~-t ~-, t~- po~r don~ty o~
tho r, alao 1- ~ctlon o~ t~ ot ~1~- o~ t~ or For ~ o~s 1-~1, p~r d~lty v~ vos~y lt~ t~-s~u~r- o~ t~ r~dlu~ o~ th- pot. ~u~, ~n th- x-mpl- do~crl~od abovo, t~ r poms d n~ty r~ d ~o~ dl~ tion o~ th~
alw~ ~out 13 tl~- t~ d~-~ty ~ d to t- t~ or~hou~ a~l~eon ~
It has been found that it is difficult to prevent a laser opor~tlslg ~t tho po~P d~n~lty n-c~ y ~or dl~ t~on o~
alu~nlnu~ rros~ d~ln~ th~ und~ly~g ~conduc~or mat~rlal.

~."? ~ ., J ~

~p~ci~lcallY, tho photolrolta~c col'? beco~ shorto~ du- to molt~n ~tal ~lo~ g int~ c~ d ~roovo a~d ~l-ctrlcally conn-~lng ad~ac~nt b~cJc ol~ctrodo~, os du~ to molton m-t~l dlr~ug~g ~z~to ~c~e und~lyln~ ~nlco~ductor m~torlal a~d produc~ng ~ ~o~ ~croJc a photo~rolt~lc ~ nt. In additlon, whQr- tb~ undo~ly~ng ~lconductor Z~t-r~ J co~hprl~od o~ a~orpho~ ~lllcon, ~o havo dl~co~orod th~t th~ un~rlylnq ~orpl~oua lllcon mater~
r~cry-t~ or-ov-r, ln an amorphou~ ~lllcon PIN Jtructure dopantJ ~ro~ thQ n-l~yor or p-lay-r o~ton dl~uJ- lnto the rocrystallizod a~orphouJ ~lllcon Or th- l-layo~, ~ ha~-~oro, ln acco~d~nc- ~lth th~ ~lrJt Q~bodl~ nt o~ the proaont l~v~ntlo~ tor ~ab~ic~t~on o~ ~t~l ~llm 136, ths p~oto~olt~lc r~glonJ 120 und rlylng mot~l ~11~ 136 ~ cr~bod ~lth a la~r op~r~tod at a po~-r denJlty ou~lc~ont to ablate tha sQ~lconducto~ mat-rl~l aloAg a ~r-d4t~mlned pattorn o~ thl~d llnaJ p~rallol to and ad~c~nt ~ocond g~oovoJ 126 but ln~u~lclont to ablat- th- conductl~ ox~ta o~ ~ont oioctrodb- lla or th~
m~t~l o~ 136. Mor- ~p~ lcally, the la~or ~u~t be ope~at~d at a po~or Lov-l th~t ~111 abl~t- tho oo~lconductor mas-rlal and produ~- ~a-e- t~t ~truct~rally woak-n ~d bur8t through the portlon~ 0~ th- ~tal ~lm poJltlon~d along th~ thlrd llne~ to form ~ub~t~nti~lly continuou8 ~p- ln th~ metal ~11~ along the thlrd llno~ and ~-pasate t~Q ~ot~ lnto a ~lurallty o~ back electrod--. AJ oho~n ln Flg. 2~ hor~ th- l-aer beam~ ~r~
~ho~n ~ch~m~tlc-lly and d~Jlgnat~d ~y r8~0renc- nu~er~l~ 133, lao-~ p~tto~ln~ o~ mo~al ~ 13C by ablatlon o~ th- und~rlying ~a3lco~ductor ~ator~l ls pe~orme~ th~ou~h ~ubstrato 114.

Th~ ~thod o~ thlo invontlon fo~ p~tt-rnlng a motal ~xi~ated on a thln film o~ J~lconductor materlal c~n b~ aD~

~o th$rl ~11~ so~lcondUctor do~ ~c~- havln~ ~t~uc~uroJ d~f~ t ~ro~ ~ch~ sp~ct~lc a~bodlm~nt ohown In th~ dral~lng~ and tlscu~

h~r~n. 1~ lr~ll ba app~r~nt to tho~ or ordinary ~kill in t~o a~, ho~ev~, th- m~thod o~ th~ v~ntlon ~hould not bo sppltsd to ~t~uctu~9~ h~Ylns ril~ or lay-r8 o~ m-t-rlal dl~poJ~d on tho la~e~-ln~d~nt ~ld o~ t~ s-mlconducto~ 8uch int~onin~

r~lms or lay~rs will lntor~er~ w~th th~ pro~agatlon o~ th- la~r b-a~ to t~e ~-mlco~ductor ~ or 1~ ~uc~ lntorvonln~ ~ilm~ or lay~a ~11 lnapproprl~toly r--ct ~lt~ th la~or ~n ~ ~ann-r that ~ould, ror oxa~plo, dama~- th- r-~ultlng ~mlco~ductor dO~iC~

~ n accordanc- wlt~ thlJ ln~ontlon, ablatlng the ~mlconductor ~st-r~al o~ photovoltalc reglon~ 120 alon~ tho pattorn o~ thlrd lln~a ~ormJ thlrd groo~eJ 12a ln tho o~lcondu~tor ~at-r~al, a~
se~n ln ~l~. 2(~) Thlrd ~roov-J 128 pro~or~bly aro about 100 m~cro~ot~rJ ~ld~ and ar- Jpacod a~art ~ro~ J-cond ~roove~ 126 by lnactlvo portlon- 130 o~ ~mlconducto~ m~t-rial A- d~crlbed abo~-, th- ablatlon o~ th~ ~m~cond~ctor matorl~l ~on~orly in t~l~d groo~oo 12~ produce~ ga-ea, ror x~mplo, ~lllcon ga~ ~rom t~o ablatlon o~ ~morphou~ Jlllcon, ~hich ~tructu~ally ~eak~n and burst through t~ portlon~ o~ metal ~lm 13C overlyln~ tho abla~d ondNcto~ ~-torial to Sor~ gap~ 129 t~t ~-yarato r~lm 13 ln~o a plu~ltty o~ back ~lect~odbJ 122 Gap- 129 p~a~or~bly aro ~ubJtu~t~ally contlnuou~ ~ v~ewad along a lln~ ort~o~on~l to the plan- o~ Flg 2tO Th- las~r para~ot~r~ roquircd to produco continuou- ~p~ 129 1~ motal ~llm ,~ ~2 ..;~ ~

136 ~11, o~ cour90~ d~po~ o~ a number o~ ctors, such aJ tl~e th~c~cn~l~o and mat~ al o~ ~h- x~tal ~ , thQ ch~ract-r~tlc w~vel~ oX the la~r, th~ powo~ d~n~lty o~ th~ 1~BO~ thQ ~U1J~
rat~ Or t~e las~r, and th~ gcrlbing ~o~d rat~. W~ ha~- Sound ~at, to pa'cte~s a ~lm o~ alu~lnum ha~ng a thlck~ea~ o~ about 3000-700~A by a~lat~o~ o~ an und~rlylng a~os~hou~ Jlllcon r~lm approxi~at~ly 6000A in thlcXne~a w~th a ~ro~uoncy-~ou~led noody~lum:YAC laoer ~mitt~n~ ht ha~lng ~ longth or ~bout O.S3 mlcro~otors, ~hon tho pu~o r~t~ Or th~ or i8 about 5 kX~, and the ~oed rat~ i8 ~bout 13 cm/aoc, th- laJor ohould b~ ~ocu~-d to about 1~0 mlcro~etera ~n ~ T~Moo ~oph-rlcal~ mod~ and opor~t~d at about 320-370 m~. Undo~ tha above condltlons, wh~n t~o la~r 1B op-~t-d at lo~o than ~bout 320 m~, po~t~on~ or met~l ~llm 136 r-m~A ~ b~tdS-- ~cro~- thl~d groov - ~2~ and p~oduc~ ~crt9 betwo-n ad~cQnt c-llJ. Wh-n tho laJer 1~ op-ratod above ~bout 3~0 mW, contin~ou~ gap~ 129 a~o producod, but tho p~ror~anco Or t~ r~oultlng modul-, aa moa~urod by the ~ acto~ d~g~aded.
Alt~ough the ps-c~o cauao o~ d~gr~d-d par~or~anc~ pro~on~ly i~
un~no~n, ~o ~elle~- t~at t~o h~ghar lao-r po~or l~ol~ cau80 m~ltl~g o~ po~t~on~ o~ th- a~orphou~ ~lllcon photovolta~c l~mants th~t r~maln ~t-r ehlr~ g~oovo~ 12a aro ~blatod. ~n a~dltlon, th~
lncroa~d po~ r d~n~lt~-J cauJo ~ho la~or to cut ~nto ~ront el~ctrodo~ 119, ~blC~ lncr-~JoJ ~orl~ ro~l~t~nca and, 1~ tho po~-r den81ty 1~ ou~lcl-ntly hlgh, rondor~ th- ~odul- lnopor~bl-by cutt~n~ O~r tho ~e~loo connec~lon~ bot~on ~d~ao~nt coll~.
~ecau~ tho ovosly~n~ metal fllm i~ not molt~d by ~ho to r~lael~oly lo~ po~orod la80r u~ed~ablata th- soDlconductor a:~al ln th~,~d 9~roov~J ~28~ ~hoxts a~- not csoatod by ~oltu~
ing lntO thl~d groo~ 12a o~ dlr~u~lng ln~o th-rlylng phOtOVOlta~C r~glon~, Fu~h-~or-, tho sblatod se~lcos~ductor matorial 1J th-r~lly cool-d ~y tho overlyl~ ~tal an~ by t~ ~udd~n dXp~Olt 0~ th~ v~pors producod du~ng ~blat~o-~. T~ local coollng holp- ps-v~nt xoc~ystalllzat~on o~
u~orphou- ~llcon and t~- m~ltln~ o~ t21- o~crly~n~ m tal ril~ by th~ hot J~cos~du~tor vapo~.
~ n ~h~n ~ sontlnuou~ ga~ 129 1~ ~ormcd by ~ tlon o~ tho und~slyl~g o~mlconduc~cor ~ator~al, ~tal ~lak-J and ot~s d~r~9, do~gna~eod by ro~oronc- nu~ ral~ 1~0 in Flg. 2~i!), o2~ten r~n ~long th- dg ~ o~ ~-p 129. ~hororo~o, in ~ccordanco ~lth th~
~thod o~ thl- lnv ntlon, t~l~ d-b~ lo r~o~d by Jub~octing modul- 110 to ultra~on~c v~br-tlo~ iA a ~lu~d bath, ~r~-ra~ly ln wat~ r ~lbrat~on, tho r-~ultlng photovolta~c modulo ha~
cl~ o~ d ~a~a 129 oop-ting d~cont b-cX cloctrod~s 122.
D~br$J 140 al~o c~ b- r~ov-d by blo~rlng lt l ay ~lt~ t o~
nltrog~n or oth~r ga~ p~ d alon~ g~p~ ~.29.

~Y .

Claims (13)

1. A thin-film semiconductor device, comprising:
(A) a substrate;
(B) a front contact layer disposed on said substrate including:
(i) a plurality of segments separated by first scribe lines;
(ii) a plurality of said segments forming a submodule;
(iii) at least one of said submodules forming a module;
(C) first bus means for interconnecting two or more of the submodules in parallel with each other;
(D) a thin film of a semiconductor material disposed on said front contact layer;
(E) a back contact layer disposed on said thin film of semiconductor material, said back contact layer being scribed along second scribe lines corresponding to and adjacent said first scribe lines; and (F) interconnection means for interconnecting adjacent areas of said rear and back contact layers.
2. A thin-film semiconductor device as claimed in claim 1 wherein said thin film of a semiconductor material is scribed along third scribe lines, said interconnecting rears including portion of said back contact layer disposed in said third scribe
3. A method for depositing an elongated narrow band solid conductive pattern on a semiconductor substrate comprising:
(A) depositing conductive fluid comprising a conductive metallic or organometallic component in an elongated narrow band pattern on such substrates;
(B) causing such deposited fluid to solidify to form a solid elongated narrow band pattern on such substrate in substantially the same pattern as that formed by such conductive fluid.
4. The method of claim 3 wherein the solid narrow band conductive pattern is comprised of lines of conductive material from about 0.005 to about 1.000 inches wide and about 0.0005" to about 0.0100 inches thick.
5. A method for depositing an elongated narrow band conductive pattern on a substrate comprising:
(A) depositing conductive fluid comprising a conductive metallic or organometallic component and carrier fluid in a narrow band pattern on a semiconductor substrate;
(B) substantially removing the carrier fluid from such conductive fluid deposited on the substrate to form a solid relatively immobile pattern of the conductive metallic or organometallic component on such substrate.
6. The method of claim 3 wherein the conductive fluid is deposited from a narrow diameter orifice which such orifice is moved in the X-Y-Z direction relative to the substrate and substantially parallel to the substrate.
7. The method of claim 5 wherein the carrier fluid is removed by heating to a temperature from about 200°C to about 550°C.
8. The method of claim 5 wherein the conductive fluid comprises a conductive metal component comprising silver copper, nickel, aluminum, gold platinum, palladium, or mixtures thereof.
9. The method of claim 5 wherein the conductive fluid also comprises glass frits.
10. The method of claim 7 wherein the conductive fluid also comprises glass frits and the conductive fluid is heated to a temperature from about 500°C to about 700°C after position of such fluid on the substrate and removal of the carrier fluid, for a time sufficient to form a mechanically strong, adhesive conductive pattern.
11. The method of claim 5 wherein the narrow band conductive pattern is comprised of lines of conductive material from about 0.005 to about 1.000 inches wide and about 0.0005 to about 0.0100 inches thick.
12. The method of claim 5 wherein the semiconductor substrate includes a conductive layer.
13. The method of claim 12 wherein the conductive layer is conductive tin oxide.
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Cited By (3)

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WO1997021253A1 (en) * 1995-12-07 1997-06-12 Unisearch Ltd Solar cell contacting scheme
WO2003019674A1 (en) * 2001-08-23 2003-03-06 Pacific Solar Pty Limited Chain link metal interconnect structure
US7868248B2 (en) 2001-08-23 2011-01-11 Pacific Solar Pty Limited Chain link metal interconnect structure

Also Published As

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CN1023433C (en) 1994-01-05
JP3129728B2 (en) 2001-01-31
JPH03171675A (en) 1991-07-25
US5593901A (en) 1997-01-14
KR910007170A (en) 1991-04-30
EP0427934A2 (en) 1991-05-22
KR940006714B1 (en) 1994-07-25
EP0427934A3 (en) 1991-09-18
CN1050793A (en) 1991-04-17

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