CA2033106A1 - Ic socket - Google Patents
Ic socketInfo
- Publication number
- CA2033106A1 CA2033106A1 CA002033106A CA2033106A CA2033106A1 CA 2033106 A1 CA2033106 A1 CA 2033106A1 CA 002033106 A CA002033106 A CA 002033106A CA 2033106 A CA2033106 A CA 2033106A CA 2033106 A1 CA2033106 A1 CA 2033106A1
- Authority
- CA
- Canada
- Prior art keywords
- positioning holes
- contacts
- socket
- mount table
- parallel relation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Abstract
ABSTRACT OF THE DISCLOSURE
An IC socket comprises a socket board having an IC mount table. Contacting portions of tips of a plurality of con-tacts arranged in parallel relation on the socket board are inserted into a plurality of positioning holes which are ar-ranged in parallel relation on a marginal portion of the IC
mount table in order to contact with corresponding contacting pieces of an IC which is placed on the IC mount table.
Dividing ridges are formed by lower ends of the partition walls on the entrance side for the contacts, which are formed between the adjacent positioning holes arranged in parallel relation.
An IC socket comprises a socket board having an IC mount table. Contacting portions of tips of a plurality of con-tacts arranged in parallel relation on the socket board are inserted into a plurality of positioning holes which are ar-ranged in parallel relation on a marginal portion of the IC
mount table in order to contact with corresponding contacting pieces of an IC which is placed on the IC mount table.
Dividing ridges are formed by lower ends of the partition walls on the entrance side for the contacts, which are formed between the adjacent positioning holes arranged in parallel relation.
Description
~33 ~
IC SOCKET
BACKGROUND OF THE INVENTION
1. Field of the Invention This invention relates to an IC socket comprising a socket board provided with an IC mount table.
IC SOCKET
BACKGROUND OF THE INVENTION
1. Field of the Invention This invention relates to an IC socket comprising a socket board provided with an IC mount table.
2. Brief Description of the Prior Art Japanese Patent Early Laid-open Publication No. Sho 63-291375 discloses an IC socket comprising a socket board provided with an IC mount table, the socket board being provided wi-th a plurality of contacts arranged in parallel relation, contacting portions of the tips of the contacts being inserted into a plurality of positioning holes arranged li}cewise in parallel relation on the marginal portion of the IC mount table to contact with contacting pieces of an IC.
In the above IC socket, the contacts implant~d in the soc~et board are positioned in the neiborhood of contacting points closest to the IC contacting pieces b~ the IC mount table so as to be correctly corresponded to the IC contacting pieces which are placed on the IC mount table.
~ Iowever, while the above IC socket has such as advantage as that the contacts and the IC contact pieces can be cor-rectly corresponded each other, it has such a short c~ming as that when the IC mount table 2 is assembled to the group of ~ .
2 ~
contacts 1 arranged in parallel relation and at micro pitches on the socket board as shown in Fig. 11, much difficulty is encountered to correctly correspond the group of positioning holes 3 arranged likewise in parallel relation and at micro pitches on the IC mount table 2 to the group of contac-ts 1 and insert the former into the latter as one group. There-fore, much labor and time are required for assembly.
Moreover, if a part of the contacts in the group of con-tacts 1 are one sided as illustrated, in addition to the above-mentioned dificulty to properly correspond and insert the positioning holes as one group, there arises another problem. That is, if the operator unfor-tunately fails to notice the existence of the one sided contacts 1 and tried hard to press the same into the IC mount table 2, the con-tacting portions of the tips o the contacts are bent and de~ormed by partition walls formed between the adjacent positioning holes 3. As a result, the IC socket including the IC mount table 2 becomes an inferior product.
SUMMARY OF T~IE INYENTION
It is therefore a general object of the present inven-tion to solve the above-mentioned problems.
As means thereof, a lower end of the entrance side of the partition wall formed between the adiacent positioning holes arranged in parallel relation as mentioned above is formed into a di~iding ridge between the adjacent positioning 2~33 ~ ~
holes, the above-mentioned one sided contact being portioned out by the dividing ridge so as to be guided into the cor-responding positioning hole.
According to the present invention, when the IC mount table is assembled to the group of contacts, the positioning holes arranged in parallel relation at micro pitches on the IC mount table are dilated by the dividing ridge, so that the positioning holes are properly corresponded to and inserted into the group of contacts with ease, and a quick assembly can be attained.
If a part of the contacts among the group of contacts is one sided, the contacting portions of the tips of the con-tacts are slidingly portioned out with the inclined surfaces formed by the dividing ridges so as to be guided to the cor-responding positioning holes.
The above and other objects, advantages and features of the present invention will become more apparent as the description proceeds upon making reference to the accompany-ing drawings.
B EF DESCRIPI'ION OF T~IE DRAWINGS
Fig. 1 is a plan view of an IC socket showing one em-bodiment of the present invention;
Fig. 2 is a sectional ~iew taken on line A-A of Fig. 1;
Fig. 3 is a plan view showing an example of parallel ar-2~33~
rangement of the positioning holes and dividing ridges;
Fig. 4 is a plan view showing another example of paral-lel arrangement of the positioning holes and the dividing ridges;
Fig. 5 is a sectional view of the positioning holes showing the configurations of the dividing ridges;
Fig. 6 is a sectional view of the positioning holes showing another example of the conigurations of the dividing ridges;
Fig. 7 is a sectional view of a socket with an IC loaded therein, wherein contacting portions of the tips of the con-tacts are already inserted in-to the positioning holes;
Fig. 8 is a sectional view of a socket with an IC loaded therein, wherein the contacting yortions of the tips of the contacts proiect from the positioning holes Fig. 9 is a sectional view of a sacket, wherein an IC is pressed by a presser cover so as to be contacted with the contacts;
Figs. lO~A), lO(B) and 10(C) are sectional views for ex-plaining the function of the dividing ridges when the IC
mount table is assembled to the contacts; and Fig. 11 is a sectional view ~or explaining a state when the conventional IC mount table is assembled to the contacts.
DETAI~ED ~ESCRIPTION OF T}IE EMBODI~ENT
2@133 ~ Q~
The embodiment of the present invention will be described hereunder with reference to Figs. 1 through 10.
The numeral 4 denotes a socket board formed of a square insulating board. The socket board 4 is provided in a central portion of its upper surface with an IC mount table 2 which can be moved upward and downward. The socket board 4 has a plurality of contacts 1 arranged in parallel relation along the outer four sides or two sides of the IC mount table 2.
The IC mount table 2 is resiliently-supported by, for example, a spring 6 disposed between the socket board 4 and the IC mount table 2. The IC mount table 2 is moved downward against the ~pring 5 and upward in accordance with -the spring 5, and held in a predetermined raised position.
The IC mount table 2 is provided with a plurality of positioning holes 3 arranged in parallel relation on the outer four sides or two sides. The positioning holes 3 are adnpted to receive contacting portions o the tips of the contacts 1 for positioning. A corresponding number of positioning holes 3 to that of contacts are arranged in parallel relaticn at contact pitches and thus at the same pitches as the IC contac-t pieces 9a as illustrated in order to catch the individual contacts 1.
On the other hand, the contacts 1 are implanted in the socket board 4 portion at the outer peripheral portion of the 2~33~
IC mount table 2. The contacts 1 have a resilient contact-ing piece la extending toward the IC mount table 2 from the implanted portion respectively, and the contacting portions lb of the tips of the resilient contacting pieces la are in-serted into the positioning holes 3 in the manner as men-tioned above. The resilient contacting pieces la of the contacts 1 are restricted sideward displacement at the con-tacting portion lb in the positioning holes 3. As a result, a relative position of the IC mount table and the contacts is established. At the same time, when the IC mount table 2 is moved forwardly and backwardly or righwardly or leftwardly in the horizontal direction by a micro-amount, the resilient contacting pieces la of the contacts are also displaced to maintain the relative position with the IC mount table 2.
Each of the positioning holes 3 arranged in parallel relation has a partition wall 6 Eormecl at a space between the fldjacent positioning holes 3 and adapted to partition the positioning holes 3 individual 1Y. A lower end of each of the parti-tion walls 6 forms a dividing ridge 1 between the adjacent positioning holes 3. The adjacent positioning holes 3 are connected through each dividing ridge 7, respec-tively. The dividing ridge 7 has a pair of downwardly in-clined surfaces 7a and 7b formed on both sides thereof and Eor portioning out the adjacent contacts which are adjacent to each other with reference to the ridge line o~ the divid-.
~33~
ing ridge 7 and guiding the contacts into the correspondingpositioning holes 3. The positioning holes 3 are dilated on the entrance side of the contacts by the inclined surfaces 7a and 7b.
Also, -the edge of the partition hole 3 on the side ad-jacent to the partition wall 6 is formed in an inclined sur-face 8 enlarging downwardly and continuously connected with the downwardly inclined surfaces 7a and 7b formed on both sides of the dividing ridge 7. That is, the positioning holes 3 are diiated rightwardly and leftwardly at spaces be-tween the adjacent positioning holes 3, and further dilated in the forward and backward direction by the inclined sur-faces 8.
As is shown in Figs. 3 or ~, the positioning holes 3 are formed in a rectangular shape, respectivelY~ Furthermore, the positioning holes 3 are arranged to have a same phase and in parallel relation throllgh the dividing ridges as shown in Fig. 3~ or otherwise the positioning holes 3 are arranged to have a different phase and in a zigzag fashion liXewise through the dividing ridges as shown in Fig. 4. The divid-ing ridges 7 of Figs. 3 and 4 are formed on short sides be-tween the adiacent positioning holes 3.
Also, in a modified embodiment of the dividing ridge 7, the pair of downwardl~ inclined surfaces 7a and 7b forming the dividing ridge 7 are ormed as far as a midway of each 2~33~
positioning hole as shown in Fig. 5, or formed as far as the exit of each positioning hole as shown in Fig. 6.
In this way, as is shown in Fig~. lO(A~ through lO(C), when the IC mount table 2 is assembled to the group of con-tacts 1 arraged in parallel relation and at micro pitches on the socket board 4, the respectively con-tacts 1 are surely portioned out rightwardly and leftwardly by the dividing ridges 7 of the partition walls 6 for partitioning the ad-jacent positioning holes 3 arranged in parallel relation and at micro pitches on the IC mount table 2. As a result, the group of positioning holes 3 can be properly corresponded to and inserted inta the group of contacts 1 as one group.
That is, even when a part of the group of contacts 1 is one sided, the contacts 1 can be correctly guided into the corresponding positioning holes 3 by slidingly portioning out the contacting portions lb of the tips of the contacts by the downwardly inclined surfaces 7a nnd 7b formed on the dividing ridges 7. In this case, as is shown in Fig. 7, the contact-ing portions of the tips of the contacts 1 are held in a state hidden into the positioning holes 3. Or as a modified embodiment shown in Fig. 8, the contacting portions of the tips of the contacts 1 are held in a state proiecting out-wardly from the exit side of the positioning holes 3.
As is shown in Fig. 7, a flat IC 9 is placed on th~ IC
mount table 2. By closing an IC presser cover 10 relative to the socket board 4 in the way as shown in Fig. 9, the IC 9 is pressed together with the IC mount table 2 downwardly against the spring 5, and as the reaction, the contacting portions lb of the tips of the contacts 1 are abutted against IC contacting pieces 9a and bent to obtain a contacting pres-sure by a restoring force thereof.
Furthermore, as is shown in Fig. 8, the flat IC 9 is contacted to the contacting portions lb of the tips of the contacts 1 proiecting from the positioning holes 3 and pLaced on the IC mount table 2. Then, as i~ shown in Fig. 9, the same contacting relation as mentioned above can be obtained by closing the IC presser cover 10 relative to the socket board 4.
As is shown in Figs. 1, 2, and 7 through 9, the peripheral four sides or two sides o~ the IC mount table 2 are projected in a pillow shape to form an IC supporting pad Il, and the positioning holes 3 are opene~ up at the IC sup-porting pads 11.
Furthermore, as is shown in Figs. 7 and 9, the IC pres-ser cover 10 is provided with an IC pressing pad 12 cor-responding to the IC supporting pade 11 and Proiecting from the inner surface o the IC presser cover 10. Angular edges 12a of the presser surface of the IC presser pad 12 and the angular edges 11a of the supporting surface of the IC sup-porting pad 11 are formed in an arcuate shape, respectively.
.~33~
The edge portion of the IC9 is held between the IC presser pad 12 and the IC supporting pad 11 to realize the contacting relation with the contacts 1. At that time, the angular edges 12a of -the presser surface and the angular edges 11a of the supporting surface are formed in an arcuate shape, respectively, in order to prevent the IC contacting pieces ~a and the outer surface of the body of the IC 9 from being damaged.
As described in the foregoing, according to the present invention, when the IC mount table is assembled to the group of contacts arranged in parallel relation and at micro pitches on the socket board, the contacts can be accurately portioned out rightwardlY and leftwardly by the dividing ridges of the partition walls for partitioning the adiacent positioning holes arranged in parallel relation and at micro pltches, and th~n the group of positioning holes can ~e properly corresponded to and inserted into the group of con-tacts as one group. As a result, the work for corresponding the group of positioning holes to the group of contacts for assembly can be performed easily and rapidly. Therefore, there can be effectively eliminated such inconvenience as to deform the contacts by mistake when the IC mount table is as-sembled.
Furthermore, even when a part of the group of contacts is one sided, the contacts can be correctly guided into the ~0 ~3~
corresponding positioning holes by slidingly portioning out the contacting portions of the tips of the contacts by the downwardly inclined surfaces for~ing the dividing ridges.
In the above IC socket, the contacts implant~d in the soc~et board are positioned in the neiborhood of contacting points closest to the IC contacting pieces b~ the IC mount table so as to be correctly corresponded to the IC contacting pieces which are placed on the IC mount table.
~ Iowever, while the above IC socket has such as advantage as that the contacts and the IC contact pieces can be cor-rectly corresponded each other, it has such a short c~ming as that when the IC mount table 2 is assembled to the group of ~ .
2 ~
contacts 1 arranged in parallel relation and at micro pitches on the socket board as shown in Fig. 11, much difficulty is encountered to correctly correspond the group of positioning holes 3 arranged likewise in parallel relation and at micro pitches on the IC mount table 2 to the group of contac-ts 1 and insert the former into the latter as one group. There-fore, much labor and time are required for assembly.
Moreover, if a part of the contacts in the group of con-tacts 1 are one sided as illustrated, in addition to the above-mentioned dificulty to properly correspond and insert the positioning holes as one group, there arises another problem. That is, if the operator unfor-tunately fails to notice the existence of the one sided contacts 1 and tried hard to press the same into the IC mount table 2, the con-tacting portions of the tips o the contacts are bent and de~ormed by partition walls formed between the adjacent positioning holes 3. As a result, the IC socket including the IC mount table 2 becomes an inferior product.
SUMMARY OF T~IE INYENTION
It is therefore a general object of the present inven-tion to solve the above-mentioned problems.
As means thereof, a lower end of the entrance side of the partition wall formed between the adiacent positioning holes arranged in parallel relation as mentioned above is formed into a di~iding ridge between the adjacent positioning 2~33 ~ ~
holes, the above-mentioned one sided contact being portioned out by the dividing ridge so as to be guided into the cor-responding positioning hole.
According to the present invention, when the IC mount table is assembled to the group of contacts, the positioning holes arranged in parallel relation at micro pitches on the IC mount table are dilated by the dividing ridge, so that the positioning holes are properly corresponded to and inserted into the group of contacts with ease, and a quick assembly can be attained.
If a part of the contacts among the group of contacts is one sided, the contacting portions of the tips of the con-tacts are slidingly portioned out with the inclined surfaces formed by the dividing ridges so as to be guided to the cor-responding positioning holes.
The above and other objects, advantages and features of the present invention will become more apparent as the description proceeds upon making reference to the accompany-ing drawings.
B EF DESCRIPI'ION OF T~IE DRAWINGS
Fig. 1 is a plan view of an IC socket showing one em-bodiment of the present invention;
Fig. 2 is a sectional ~iew taken on line A-A of Fig. 1;
Fig. 3 is a plan view showing an example of parallel ar-2~33~
rangement of the positioning holes and dividing ridges;
Fig. 4 is a plan view showing another example of paral-lel arrangement of the positioning holes and the dividing ridges;
Fig. 5 is a sectional view of the positioning holes showing the configurations of the dividing ridges;
Fig. 6 is a sectional view of the positioning holes showing another example of the conigurations of the dividing ridges;
Fig. 7 is a sectional view of a socket with an IC loaded therein, wherein contacting portions of the tips of the con-tacts are already inserted in-to the positioning holes;
Fig. 8 is a sectional view of a socket with an IC loaded therein, wherein the contacting yortions of the tips of the contacts proiect from the positioning holes Fig. 9 is a sectional view of a sacket, wherein an IC is pressed by a presser cover so as to be contacted with the contacts;
Figs. lO~A), lO(B) and 10(C) are sectional views for ex-plaining the function of the dividing ridges when the IC
mount table is assembled to the contacts; and Fig. 11 is a sectional view ~or explaining a state when the conventional IC mount table is assembled to the contacts.
DETAI~ED ~ESCRIPTION OF T}IE EMBODI~ENT
2@133 ~ Q~
The embodiment of the present invention will be described hereunder with reference to Figs. 1 through 10.
The numeral 4 denotes a socket board formed of a square insulating board. The socket board 4 is provided in a central portion of its upper surface with an IC mount table 2 which can be moved upward and downward. The socket board 4 has a plurality of contacts 1 arranged in parallel relation along the outer four sides or two sides of the IC mount table 2.
The IC mount table 2 is resiliently-supported by, for example, a spring 6 disposed between the socket board 4 and the IC mount table 2. The IC mount table 2 is moved downward against the ~pring 5 and upward in accordance with -the spring 5, and held in a predetermined raised position.
The IC mount table 2 is provided with a plurality of positioning holes 3 arranged in parallel relation on the outer four sides or two sides. The positioning holes 3 are adnpted to receive contacting portions o the tips of the contacts 1 for positioning. A corresponding number of positioning holes 3 to that of contacts are arranged in parallel relaticn at contact pitches and thus at the same pitches as the IC contac-t pieces 9a as illustrated in order to catch the individual contacts 1.
On the other hand, the contacts 1 are implanted in the socket board 4 portion at the outer peripheral portion of the 2~33~
IC mount table 2. The contacts 1 have a resilient contact-ing piece la extending toward the IC mount table 2 from the implanted portion respectively, and the contacting portions lb of the tips of the resilient contacting pieces la are in-serted into the positioning holes 3 in the manner as men-tioned above. The resilient contacting pieces la of the contacts 1 are restricted sideward displacement at the con-tacting portion lb in the positioning holes 3. As a result, a relative position of the IC mount table and the contacts is established. At the same time, when the IC mount table 2 is moved forwardly and backwardly or righwardly or leftwardly in the horizontal direction by a micro-amount, the resilient contacting pieces la of the contacts are also displaced to maintain the relative position with the IC mount table 2.
Each of the positioning holes 3 arranged in parallel relation has a partition wall 6 Eormecl at a space between the fldjacent positioning holes 3 and adapted to partition the positioning holes 3 individual 1Y. A lower end of each of the parti-tion walls 6 forms a dividing ridge 1 between the adjacent positioning holes 3. The adjacent positioning holes 3 are connected through each dividing ridge 7, respec-tively. The dividing ridge 7 has a pair of downwardly in-clined surfaces 7a and 7b formed on both sides thereof and Eor portioning out the adjacent contacts which are adjacent to each other with reference to the ridge line o~ the divid-.
~33~
ing ridge 7 and guiding the contacts into the correspondingpositioning holes 3. The positioning holes 3 are dilated on the entrance side of the contacts by the inclined surfaces 7a and 7b.
Also, -the edge of the partition hole 3 on the side ad-jacent to the partition wall 6 is formed in an inclined sur-face 8 enlarging downwardly and continuously connected with the downwardly inclined surfaces 7a and 7b formed on both sides of the dividing ridge 7. That is, the positioning holes 3 are diiated rightwardly and leftwardly at spaces be-tween the adjacent positioning holes 3, and further dilated in the forward and backward direction by the inclined sur-faces 8.
As is shown in Figs. 3 or ~, the positioning holes 3 are formed in a rectangular shape, respectivelY~ Furthermore, the positioning holes 3 are arranged to have a same phase and in parallel relation throllgh the dividing ridges as shown in Fig. 3~ or otherwise the positioning holes 3 are arranged to have a different phase and in a zigzag fashion liXewise through the dividing ridges as shown in Fig. 4. The divid-ing ridges 7 of Figs. 3 and 4 are formed on short sides be-tween the adiacent positioning holes 3.
Also, in a modified embodiment of the dividing ridge 7, the pair of downwardl~ inclined surfaces 7a and 7b forming the dividing ridge 7 are ormed as far as a midway of each 2~33~
positioning hole as shown in Fig. 5, or formed as far as the exit of each positioning hole as shown in Fig. 6.
In this way, as is shown in Fig~. lO(A~ through lO(C), when the IC mount table 2 is assembled to the group of con-tacts 1 arraged in parallel relation and at micro pitches on the socket board 4, the respectively con-tacts 1 are surely portioned out rightwardly and leftwardly by the dividing ridges 7 of the partition walls 6 for partitioning the ad-jacent positioning holes 3 arranged in parallel relation and at micro pitches on the IC mount table 2. As a result, the group of positioning holes 3 can be properly corresponded to and inserted inta the group of contacts 1 as one group.
That is, even when a part of the group of contacts 1 is one sided, the contacts 1 can be correctly guided into the corresponding positioning holes 3 by slidingly portioning out the contacting portions lb of the tips of the contacts by the downwardly inclined surfaces 7a nnd 7b formed on the dividing ridges 7. In this case, as is shown in Fig. 7, the contact-ing portions of the tips of the contacts 1 are held in a state hidden into the positioning holes 3. Or as a modified embodiment shown in Fig. 8, the contacting portions of the tips of the contacts 1 are held in a state proiecting out-wardly from the exit side of the positioning holes 3.
As is shown in Fig. 7, a flat IC 9 is placed on th~ IC
mount table 2. By closing an IC presser cover 10 relative to the socket board 4 in the way as shown in Fig. 9, the IC 9 is pressed together with the IC mount table 2 downwardly against the spring 5, and as the reaction, the contacting portions lb of the tips of the contacts 1 are abutted against IC contacting pieces 9a and bent to obtain a contacting pres-sure by a restoring force thereof.
Furthermore, as is shown in Fig. 8, the flat IC 9 is contacted to the contacting portions lb of the tips of the contacts 1 proiecting from the positioning holes 3 and pLaced on the IC mount table 2. Then, as i~ shown in Fig. 9, the same contacting relation as mentioned above can be obtained by closing the IC presser cover 10 relative to the socket board 4.
As is shown in Figs. 1, 2, and 7 through 9, the peripheral four sides or two sides o~ the IC mount table 2 are projected in a pillow shape to form an IC supporting pad Il, and the positioning holes 3 are opene~ up at the IC sup-porting pads 11.
Furthermore, as is shown in Figs. 7 and 9, the IC pres-ser cover 10 is provided with an IC pressing pad 12 cor-responding to the IC supporting pade 11 and Proiecting from the inner surface o the IC presser cover 10. Angular edges 12a of the presser surface of the IC presser pad 12 and the angular edges 11a of the supporting surface of the IC sup-porting pad 11 are formed in an arcuate shape, respectively.
.~33~
The edge portion of the IC9 is held between the IC presser pad 12 and the IC supporting pad 11 to realize the contacting relation with the contacts 1. At that time, the angular edges 12a of -the presser surface and the angular edges 11a of the supporting surface are formed in an arcuate shape, respectively, in order to prevent the IC contacting pieces ~a and the outer surface of the body of the IC 9 from being damaged.
As described in the foregoing, according to the present invention, when the IC mount table is assembled to the group of contacts arranged in parallel relation and at micro pitches on the socket board, the contacts can be accurately portioned out rightwardlY and leftwardly by the dividing ridges of the partition walls for partitioning the adiacent positioning holes arranged in parallel relation and at micro pltches, and th~n the group of positioning holes can ~e properly corresponded to and inserted into the group of con-tacts as one group. As a result, the work for corresponding the group of positioning holes to the group of contacts for assembly can be performed easily and rapidly. Therefore, there can be effectively eliminated such inconvenience as to deform the contacts by mistake when the IC mount table is as-sembled.
Furthermore, even when a part of the group of contacts is one sided, the contacts can be correctly guided into the ~0 ~3~
corresponding positioning holes by slidingly portioning out the contacting portions of the tips of the contacts by the downwardly inclined surfaces for~ing the dividing ridges.
Claims (5)
- WHAT IS CLAIMED IS:
l. In an IC socket comprising a socket board including an IC mount table, contacting portions of tips of a plurality of contacts arranged in parallel relation on said socket board being inserted into a plurality of positioning holes arranged in parallel relation on a marginal portion of said IC mount table in order to contact with corresponding contacting pieces of an IC placed on said IC mount table, the improve-ment being that dividing ridges are formed by lower ends of said partition walls on the entrance side for said contacts formed between the adjacent positioning holes arranged in parallel relation. - 2, An IC socket as claimed in claim 1, wherein said positioning holes are formed in a rectangular shape and ar-ranged in parallel relation at the same phase, said dividing ridges being formed on a rectangular side between the ad-jacent positioning holes.
- 3, An IC socket as claimed in claim 1, wherein said positioning holes are formed in a rectangular shape and ar-ranged in parallel relation at a different phase (in a zigzag fashion), said dividing ridges being formed on a rectangular side between the adjacent positioning holes.
- 4. An IC socket as claimed in claim 1, wherein a pair of downwardly inclined surfaces forming each said dividing ridge are formed as far as the midway of said positioning holes.
- 5. An IC socket as claimed in claim 1, wherein a pair of downwardly inclined surfaces forming each said dividing ridge are formed as far as the exit of said positioning holes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-149011 | 1989-12-25 | ||
| JP1989149011U JPH0711422Y2 (en) | 1989-12-25 | 1989-12-25 | IC socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2033106A1 true CA2033106A1 (en) | 1991-06-26 |
Family
ID=15465725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002033106A Abandoned CA2033106A1 (en) | 1989-12-25 | 1990-12-24 | Ic socket |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5106309A (en) |
| EP (1) | EP0435629B1 (en) |
| JP (1) | JPH0711422Y2 (en) |
| KR (1) | KR910013627A (en) |
| CA (1) | CA2033106A1 (en) |
| DE (1) | DE69023891D1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2551179Y2 (en) * | 1991-06-27 | 1997-10-22 | 山一電機株式会社 | IC socket |
| US5518410A (en) * | 1993-05-24 | 1996-05-21 | Enplas Corporation | Contact pin device for IC sockets |
| US5342206A (en) * | 1993-07-15 | 1994-08-30 | The Whitaker Corporation | Socket for direct electrical connection to an integrated circuit chip |
| DE4338656C2 (en) * | 1993-11-12 | 1995-11-16 | Multiline International Europa | Device for aligning printed circuit boards and image carriers |
| US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| US20020004320A1 (en) * | 1995-05-26 | 2002-01-10 | David V. Pedersen | Attaratus for socketably receiving interconnection elements of an electronic component |
| US6033935A (en) | 1997-06-30 | 2000-03-07 | Formfactor, Inc. | Sockets for "springed" semiconductor devices |
| US5865639A (en) * | 1996-06-25 | 1999-02-02 | Texas Instruments Incorporated | Burn-in test socket apparatus |
| US6627483B2 (en) * | 1998-12-04 | 2003-09-30 | Formfactor, Inc. | Method for mounting an electronic component |
| US6456099B1 (en) | 1998-12-31 | 2002-09-24 | Formfactor, Inc. | Special contact points for accessing internal circuitry of an integrated circuit |
| US6948946B1 (en) * | 2004-04-22 | 2005-09-27 | Ted Ju | IC socket |
| JP5064996B2 (en) * | 2007-12-21 | 2012-10-31 | 矢崎総業株式会社 | Electrical connection block |
| TWM351527U (en) * | 2008-06-16 | 2009-02-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| JP5399696B2 (en) * | 2008-12-19 | 2014-01-29 | ユニオンマシナリ株式会社 | Contact pin guide plate for bottom entry |
| CN103390826B (en) * | 2012-05-08 | 2016-02-24 | 赛恩倍吉科技顾问（深圳）有限公司 | Electric connector |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3660799A (en) * | 1969-06-17 | 1972-05-02 | Honeywell Inf Systems | Connector device |
| US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
| JPS5713738Y2 (en) * | 1976-04-13 | 1982-03-19 | ||
| JPS5389271U (en) * | 1976-12-23 | 1978-07-21 | ||
| US4331373A (en) * | 1980-03-24 | 1982-05-25 | Burroughs Corporation | Modular system with system carrier, test carrier and system connector |
| JPS5826152B2 (en) * | 1980-11-14 | 1983-06-01 | 日本電信電話株式会社 | multipole connector |
| JPS587642U (en) * | 1981-07-09 | 1983-01-18 | グンゼ株式会社 | Continuous bag making machine |
| US4718855A (en) * | 1984-12-03 | 1988-01-12 | Amp Incorporated | Socket for integrated circuit component |
| US4583806A (en) * | 1985-01-11 | 1986-04-22 | Bourns, Inc. | Low insertion-force socket for IC device |
| US4669796A (en) * | 1985-11-22 | 1987-06-02 | Wells Electronics, Inc. | RAM connector |
| US4726777A (en) * | 1986-06-10 | 1988-02-23 | Amp Incorporated | Socket for zig-zag inline package |
| US4713022A (en) | 1986-08-05 | 1987-12-15 | Pfaff Wayne | Socket for flat pack electronic device packages |
| JPS63291375A (en) * | 1987-05-22 | 1988-11-29 | Yamaichi Electric Mfg Co Ltd | Ic socket |
| JPH0517829Y2 (en) * | 1987-12-31 | 1993-05-12 |
-
1989
- 1989-12-25 JP JP1989149011U patent/JPH0711422Y2/en not_active Expired - Lifetime
-
1990
- 1990-12-21 DE DE69023891T patent/DE69023891D1/en not_active Expired - Lifetime
- 1990-12-21 EP EP90314185A patent/EP0435629B1/en not_active Expired - Lifetime
- 1990-12-24 KR KR1019900021661A patent/KR910013627A/en not_active Application Discontinuation
- 1990-12-24 CA CA002033106A patent/CA2033106A1/en not_active Abandoned
- 1990-12-26 US US07/632,734 patent/US5106309A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0711422Y2 (en) | 1995-03-15 |
| EP0435629A2 (en) | 1991-07-03 |
| EP0435629A3 (en) | 1992-07-22 |
| DE69023891D1 (en) | 1996-01-11 |
| KR910013627A (en) | 1991-08-08 |
| EP0435629B1 (en) | 1995-11-29 |
| JPH0388290U (en) | 1991-09-10 |
| US5106309A (en) | 1992-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |