CA2041461C - Circuit pack cooling using perforations - Google Patents
Circuit pack cooling using perforationsInfo
- Publication number
- CA2041461C CA2041461C CA002041461A CA2041461A CA2041461C CA 2041461 C CA2041461 C CA 2041461C CA 002041461 A CA002041461 A CA 002041461A CA 2041461 A CA2041461 A CA 2041461A CA 2041461 C CA2041461 C CA 2041461C
- Authority
- CA
- Canada
- Prior art keywords
- circuit
- perforations
- channel
- circuit board
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.
Description
CIRCUIT PACK COOLING USING PERFORATIONS
Background of the Invention This invention relates to forced air cooling of circuit packs which are arranged in a stacked configuration.
The density of heat generating components in electronic circuit packs continues to rise, bringing with it increased concern about proper cooling of the circuits. Forced fluid cooling is expected to be a necessity in the near future, and several proposals have already been made to facilitate such cooling. For example, jet impingement of air onto the heat generating component can be provided through separate plenums (see, e.g., U.S. Pat. No.
4,851,965), or through the circuit board assembly itself. It has also been suggested that air can be blown onto the components through holes in the enclosures or shields surrounding the circuit components (see, e.g., U.S. Pat. No. 4,393,437 and U.S. Pat.
No. 4,408,255). It has been suggested further that holes in the circuit boards themselves could allow air to impinge on components in circuit packs which are stacked (see U.S.
Pat. No. 4,399,484).
In stacked configurations which are open and where the air is flowing essentially parallel to the circuit packs, there is a problem of stagnant air pockets forming in areas between components. This problem can be solved by introducing turbulators on the wall facing the circuit pack components.
It is desirable to provide an alternative solution to this problem which has thepotential for lower cost.
Summary of the Invention In accordance with one aspect of the present invention there is provided a fluidcooled circuit pack assembly comprising: a first circuit board having a front surface with a first array of heat generating components mounted thereon; a second circuit board with a front and back surface, the front surface having a second array of heat generating components mounted thereon and the back surface disposed opposite to the front surface of the first circuit board and in spaced relationship thereto so as to form a channel for the flow of cooling fluid over said first array of components in a direction essentially parallel to said surfaces; and an array of perforations defined through the front and back surfaces of the second circuit board so that flow of cooling fluid in the channel causes fluid above the front surface of the second circuit board to be drawn into the channel as a result of differential pressure between the channel and areas of stagnant fluid between the components of the second array.
- 20~1461 Brief Description of the Drawin~
These and other features of the invention are delineated in detail in the following description. In the drawing:
FIG. 1 is a side view of a circuit pack assembly including a fluid flow S pattern in accordance with a prior art configuration;
FM. 2 is a side view of a circuit pack assembly including a fluid flow pattern in accordance with an embodiment of the invention; and FIG. 3 is a top view of a portion of the assembly in FIG. 2 in accordance with the same embodiment.
It will be appreciated that, for purposes of illustration, these figures are not n~cess~rily drawn to scale.
Detailed Description FIG. 1 illustrates a typical circuit packet assembly which includes two circuit boards, 10 and 11, in a stacked configuration. Each circuit board includes at 15 least one heat generating com~ollent, e.g., 12 and 13, mounted on the front surface of the circuit board. Two channels for the flow of fluid, in~lir~t~l by the arrows, are shown. One is provided between the back surface of circuit board 11 and the front surface of circuit board 10. The other channel is provided between the front surface of circuit board 11 and another surface 14, which could be a cover or another circuit 20 board in the stack. It will be appreciated that several such channels are formed in a typical shelf of circuit packs.
The fluid, which can be air or liquid, is forced into the channel by some means, such as a fan 15, in a direction which is ess~nti~lly parallel to the surfaces of the circuit boards. As the air impinges on the coll.l)ollellts, the flow is as 25 schematically illustrated. It will be noted that areas of stagnant air tend to form between the coml)o.lents in both channels, thereby inhibiting effective cooling.FIGS. 2 and 3 illustrate, in side and top views, respectively, a circuit pack assembly with improved cooling in accordance with the invention. The assembly, again, includes circuit boards, 20 and 21, with components, e.g. 22 and 23, 30 mounted on their front surfaces. Two channels are also shown, one formed between boards 20 and 21 and one formed between board 21 and surface 24. Air is forced into the channels by fan 25 in a direction essentially parallel to the boards as before.
Here, however, an array of fairly large perforations, e.g. 2~29, are formed through board 21 adjacent to each component. As illustrated in FIG. 3, these perforations 35 preferably extend the full length of each component, which is typically 1-2.5 cm.
204146f Also, the ~e~ro.~lions are fairly wide, i.e., at least 0.60 cm, in order to provide the improved cooling capabilities.
It will be appreciated that air is forced into the ch~nnel~, as before, essenti~lly parallel to boards 20 and 21 and surface 24. Here, however, the air in the 5 channel just below board 21 will be moving at a faster rate than the stagnant areas adjacent to the components in the channel above board 21. According to Bernoulli's principle, this will result in areas of lesser pressure below the holes 26-29, thereby causing air from the channel above board 21 to be sucked into the channel below.The areas of st~gn~nt air in the channel bounded by board 21 and cover 24 will, 10 therefore, be dissipated. In addition, the areas of st~gn~nt air in the channel bounded by 20 and 21 will also tend to break up as a result of the increased air turbulence caused by the air being sucked into the channel from above. Further, the components (e.g., 22) on board 20 can receive direct impingement of the cooling fluid through the perforations. F.nh~nced cooling of the components in both channels 15 is, thelGfo~, re~li7~
For optimulll results, the perforations 26-29 should be located adjacent to each heat ge.le.ating component in the path of the air flow as shown in FIG. 3.
Fluid flow should, preferably, be at least 0.75 m/s to ensure that adequate amounts of fluid will be drawn through the perforations. The area of each perforation should be 20 at least 0.6 cm2 for the same reason.
While the invention has been illustrated with the use of surface mount components 22 and 23, boards which include through-hole mounted components can also benefit by placing the perforations ~ cent to the through-holes. Known cooling fluids, other than air, can also be employed.
Various ~l~lition~l modifications will become app~G.It to those skilled in the art. All such variations which basically rely on the teachings through which the invention has advanced the art are properly considered within the scope of the invention.
Background of the Invention This invention relates to forced air cooling of circuit packs which are arranged in a stacked configuration.
The density of heat generating components in electronic circuit packs continues to rise, bringing with it increased concern about proper cooling of the circuits. Forced fluid cooling is expected to be a necessity in the near future, and several proposals have already been made to facilitate such cooling. For example, jet impingement of air onto the heat generating component can be provided through separate plenums (see, e.g., U.S. Pat. No.
4,851,965), or through the circuit board assembly itself. It has also been suggested that air can be blown onto the components through holes in the enclosures or shields surrounding the circuit components (see, e.g., U.S. Pat. No. 4,393,437 and U.S. Pat.
No. 4,408,255). It has been suggested further that holes in the circuit boards themselves could allow air to impinge on components in circuit packs which are stacked (see U.S.
Pat. No. 4,399,484).
In stacked configurations which are open and where the air is flowing essentially parallel to the circuit packs, there is a problem of stagnant air pockets forming in areas between components. This problem can be solved by introducing turbulators on the wall facing the circuit pack components.
It is desirable to provide an alternative solution to this problem which has thepotential for lower cost.
Summary of the Invention In accordance with one aspect of the present invention there is provided a fluidcooled circuit pack assembly comprising: a first circuit board having a front surface with a first array of heat generating components mounted thereon; a second circuit board with a front and back surface, the front surface having a second array of heat generating components mounted thereon and the back surface disposed opposite to the front surface of the first circuit board and in spaced relationship thereto so as to form a channel for the flow of cooling fluid over said first array of components in a direction essentially parallel to said surfaces; and an array of perforations defined through the front and back surfaces of the second circuit board so that flow of cooling fluid in the channel causes fluid above the front surface of the second circuit board to be drawn into the channel as a result of differential pressure between the channel and areas of stagnant fluid between the components of the second array.
- 20~1461 Brief Description of the Drawin~
These and other features of the invention are delineated in detail in the following description. In the drawing:
FIG. 1 is a side view of a circuit pack assembly including a fluid flow S pattern in accordance with a prior art configuration;
FM. 2 is a side view of a circuit pack assembly including a fluid flow pattern in accordance with an embodiment of the invention; and FIG. 3 is a top view of a portion of the assembly in FIG. 2 in accordance with the same embodiment.
It will be appreciated that, for purposes of illustration, these figures are not n~cess~rily drawn to scale.
Detailed Description FIG. 1 illustrates a typical circuit packet assembly which includes two circuit boards, 10 and 11, in a stacked configuration. Each circuit board includes at 15 least one heat generating com~ollent, e.g., 12 and 13, mounted on the front surface of the circuit board. Two channels for the flow of fluid, in~lir~t~l by the arrows, are shown. One is provided between the back surface of circuit board 11 and the front surface of circuit board 10. The other channel is provided between the front surface of circuit board 11 and another surface 14, which could be a cover or another circuit 20 board in the stack. It will be appreciated that several such channels are formed in a typical shelf of circuit packs.
The fluid, which can be air or liquid, is forced into the channel by some means, such as a fan 15, in a direction which is ess~nti~lly parallel to the surfaces of the circuit boards. As the air impinges on the coll.l)ollellts, the flow is as 25 schematically illustrated. It will be noted that areas of stagnant air tend to form between the coml)o.lents in both channels, thereby inhibiting effective cooling.FIGS. 2 and 3 illustrate, in side and top views, respectively, a circuit pack assembly with improved cooling in accordance with the invention. The assembly, again, includes circuit boards, 20 and 21, with components, e.g. 22 and 23, 30 mounted on their front surfaces. Two channels are also shown, one formed between boards 20 and 21 and one formed between board 21 and surface 24. Air is forced into the channels by fan 25 in a direction essentially parallel to the boards as before.
Here, however, an array of fairly large perforations, e.g. 2~29, are formed through board 21 adjacent to each component. As illustrated in FIG. 3, these perforations 35 preferably extend the full length of each component, which is typically 1-2.5 cm.
204146f Also, the ~e~ro.~lions are fairly wide, i.e., at least 0.60 cm, in order to provide the improved cooling capabilities.
It will be appreciated that air is forced into the ch~nnel~, as before, essenti~lly parallel to boards 20 and 21 and surface 24. Here, however, the air in the 5 channel just below board 21 will be moving at a faster rate than the stagnant areas adjacent to the components in the channel above board 21. According to Bernoulli's principle, this will result in areas of lesser pressure below the holes 26-29, thereby causing air from the channel above board 21 to be sucked into the channel below.The areas of st~gn~nt air in the channel bounded by board 21 and cover 24 will, 10 therefore, be dissipated. In addition, the areas of st~gn~nt air in the channel bounded by 20 and 21 will also tend to break up as a result of the increased air turbulence caused by the air being sucked into the channel from above. Further, the components (e.g., 22) on board 20 can receive direct impingement of the cooling fluid through the perforations. F.nh~nced cooling of the components in both channels 15 is, thelGfo~, re~li7~
For optimulll results, the perforations 26-29 should be located adjacent to each heat ge.le.ating component in the path of the air flow as shown in FIG. 3.
Fluid flow should, preferably, be at least 0.75 m/s to ensure that adequate amounts of fluid will be drawn through the perforations. The area of each perforation should be 20 at least 0.6 cm2 for the same reason.
While the invention has been illustrated with the use of surface mount components 22 and 23, boards which include through-hole mounted components can also benefit by placing the perforations ~ cent to the through-holes. Known cooling fluids, other than air, can also be employed.
Various ~l~lition~l modifications will become app~G.It to those skilled in the art. All such variations which basically rely on the teachings through which the invention has advanced the art are properly considered within the scope of the invention.
Claims (6)
1. A fluid cooled circuit pack assembly comprising:
a first circuit board having a front surface with a first array of heat generating components mounted thereon;
a second circuit board with a front and back surface, the front surface having a second array of heat generating components mounted thereon and the backsurface disposed opposite to the front surface of the first circuit board and in spaced relationship thereto so as to form a channel for the flow of cooling fluid over said first array of components in a direction essentially parallel to said surfaces; and an array of perforations defined through the front and back surfaces of the second circuit board so that flow of cooling fluid in the channel causes fluid above the front surface of the second circuit board to be drawn into the channel as a result of differential pressure between the channel and areas of stagnant fluid between the components of the second array.
a first circuit board having a front surface with a first array of heat generating components mounted thereon;
a second circuit board with a front and back surface, the front surface having a second array of heat generating components mounted thereon and the backsurface disposed opposite to the front surface of the first circuit board and in spaced relationship thereto so as to form a channel for the flow of cooling fluid over said first array of components in a direction essentially parallel to said surfaces; and an array of perforations defined through the front and back surfaces of the second circuit board so that flow of cooling fluid in the channel causes fluid above the front surface of the second circuit board to be drawn into the channel as a result of differential pressure between the channel and areas of stagnant fluid between the components of the second array.
2. The circuit pack assembly according to claim 1 wherein the perforations are at least 0.60 cm wide and extend the length of an adjacent heat generating component.
3. The circuit pack assembly according to claim 1 wherein the perforations have an area of at least 0.6 cm2.
4. The circuit pack assembly according to claim 1 further comprising means for forcing fluid into said channel in a direction essentially parallel to the circuit boards.
5. The circuit pack assembly according to claim 4 wherein the means produced a fluid flow with a velocity of at least 0.75 m/s.
6. The circuit pack assembly according to claim 1 wherein the perforations are placed in the second circuit board adjacent side of each component which is perpendicular to the flow of cooling fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/542,613 US5121290A (en) | 1990-06-25 | 1990-06-25 | Circuit pack cooling using perforations |
| US542,613 | 1990-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2041461A1 CA2041461A1 (en) | 1991-12-26 |
| CA2041461C true CA2041461C (en) | 1997-05-20 |
Family
ID=24164577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002041461A Expired - Fee Related CA2041461C (en) | 1990-06-25 | 1991-04-29 | Circuit pack cooling using perforations |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5121290A (en) |
| EP (1) | EP0463782B1 (en) |
| JP (1) | JPH088425B2 (en) |
| KR (1) | KR100228367B1 (en) |
| AU (1) | AU629751B2 (en) |
| CA (1) | CA2041461C (en) |
| DE (1) | DE69102497T2 (en) |
| ES (1) | ES2055961T3 (en) |
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|---|---|---|---|---|
| JPH05299858A (en) * | 1991-06-25 | 1993-11-12 | Nec Corp | Structure of electronic device with many printed circuit boards |
| JP3069819B2 (en) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink |
| US6123145A (en) * | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
| US6457654B1 (en) | 1995-06-12 | 2002-10-01 | Georgia Tech Research Corporation | Micromachined synthetic jet actuators and applications thereof |
| US5896268A (en) * | 1997-08-11 | 1999-04-20 | Abacon Telecommunications Corporation | Enclosure for high-density subscriber line modules |
| US6292556B1 (en) | 1997-11-06 | 2001-09-18 | Anacapa Technology, Inc. | Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction |
| US6588497B1 (en) * | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
| US6785138B1 (en) | 2002-09-05 | 2004-08-31 | Added Communications Of Georgia, Inc. | Repeater case for HDSL modules |
| US6902299B2 (en) * | 2003-02-27 | 2005-06-07 | Cantronic Systems Inc. | Long distance illuminator |
| US20040257763A1 (en) * | 2003-06-17 | 2004-12-23 | International Business Machines Corporation | Internal hard disc drive scalability using mezzanine backplane technology |
| ITMI20040105A1 (en) * | 2004-01-27 | 2004-04-27 | Rg Group Spa | DISPLACEMENT AIR CONDITIONER WITH AIR DIFFUSION IN THE ADHERENT VEIN |
| US20070089902A1 (en) * | 2005-10-25 | 2007-04-26 | Tourne Joseph A | Circuit board having a multi-signal via |
| US20080151052A1 (en) * | 2006-11-01 | 2008-06-26 | Videolarm, Inc. | Infrared illuminator with variable beam angle |
| US20100328466A1 (en) * | 2006-11-01 | 2010-12-30 | Videolarm, Inc. | Infrared illuminator with variable beam angle |
| US7557303B2 (en) * | 2006-12-18 | 2009-07-07 | Lsi Corporation | Electronic component connection support structures including air as a dielectric |
| JP4814132B2 (en) * | 2007-03-20 | 2011-11-16 | ダイトロンテクノロジー株式会社 | Semiconductor device inspection equipment |
| JP4719187B2 (en) * | 2007-06-15 | 2011-07-06 | トヨタ自動車株式会社 | Semiconductor device cooling structure |
| US7595999B2 (en) * | 2007-06-21 | 2009-09-29 | Dell Products L.P. | System and method for coupling an integrated circuit to a circuit board |
| US8537548B2 (en) * | 2008-01-29 | 2013-09-17 | Intel Corporation | Method, apparatus and computer system for vortex generator enhanced cooling |
| US20090194831A1 (en) * | 2008-02-01 | 2009-08-06 | Custom Sensors & Technologies, Inc. | Integrated cavity in pcb pressure sensor |
| TWI378761B (en) * | 2008-09-12 | 2012-12-01 | Pegatron Corp | Heat-dissipating device and method |
| US7961462B2 (en) * | 2009-05-28 | 2011-06-14 | Alcatel Lucent | Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components |
| FR2948485B1 (en) * | 2009-07-24 | 2011-10-21 | Sagem Comm | HOST DEVICE FOR HARD DISK |
| JP5265012B2 (en) * | 2009-08-31 | 2013-08-14 | 富士通株式会社 | Electronics |
| US9075581B2 (en) | 2011-04-19 | 2015-07-07 | Germane Systems, Llc | Apparatus and method for cooling electrical components of a computer |
| JP5275412B2 (en) * | 2011-06-08 | 2013-08-28 | 株式会社東芝 | Electronic components |
| US20130308266A1 (en) * | 2011-11-10 | 2013-11-21 | Jason A. Sullivan | Providing and dynamically mounting and housing processing control units |
| IN2013MU01205A (en) * | 2013-03-28 | 2015-04-10 | Control Tech Ltd | |
| JP6225477B2 (en) * | 2013-05-16 | 2017-11-08 | 富士通株式会社 | Electronics |
| US20150036292A1 (en) * | 2013-08-01 | 2015-02-05 | Lear Corporation | Electrical Device for Use in an Automotive Vehicle and Method for Cooling Same |
| JP2016207928A (en) * | 2015-04-27 | 2016-12-08 | ファナック株式会社 | Heat sink for cooling multiple heating components |
| CN106356344B (en) * | 2016-09-08 | 2019-03-05 | 华进半导体封装先导技术研发中心有限公司 | Air-cooled heat dissipation structure and manufacturing method based on three-dimensional stacked encapsulation |
| JP2020064941A (en) * | 2018-10-16 | 2020-04-23 | 住友電装株式会社 | Circuit structure and electric connection box |
| CN112930077B (en) * | 2019-12-06 | 2023-11-07 | 台达电子工业股份有限公司 | Cooling system suitable for power supply module |
| US20220397598A1 (en) * | 2019-12-25 | 2022-12-15 | Enplas Corporation | Air blow guide member, test device unit, test device, electrical component socket, and test device including a plurality of the electrical component sockets |
| GB2602341B (en) * | 2020-12-23 | 2023-11-08 | Yasa Ltd | Semiconductor cooling arrangement with improved baffle |
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| US2187011A (en) * | 1937-03-13 | 1940-01-16 | Paul F Braden | Cooling means for an electrical apparatus |
| DE2107549A1 (en) * | 1970-02-19 | 1971-09-02 | Texas Instruments Inc | Carrier of an electronic circuit with a collecting system with heat conduction properties for all directions |
| US3967874A (en) * | 1975-09-30 | 1976-07-06 | Calabro Anthony Denis | Uniformly cooled printed circuit board mounting assembly |
| JPS5554997U (en) * | 1978-10-11 | 1980-04-14 | ||
| GB2033668B (en) * | 1978-11-11 | 1983-01-06 | Ferranti Ltd | Circuit assemblies |
| US4277816A (en) * | 1979-05-29 | 1981-07-07 | International Business Machines Corporation | Electronic circuit module cooling |
| US4399485A (en) * | 1980-03-24 | 1983-08-16 | Ampex Corporation | Air baffle assembly for electronic circuit mounting frame |
| JPS5719864A (en) * | 1980-07-09 | 1982-02-02 | Nec Corp | Route searching system |
| AT374034B (en) * | 1980-07-18 | 1984-03-12 | Siemens Ag Oesterreich | COMPONENT ARRANGEMENT FOR THE CONTROL UNIT OF A DATA PROCESSING SYSTEM |
| US4408255A (en) * | 1981-01-12 | 1983-10-04 | Harold Adkins | Absorptive electromagnetic shielding for high speed computer applications |
| US4399484A (en) * | 1981-03-10 | 1983-08-16 | The United States Of America As Represented By The Secretary Of The Air Force | Integral electric module and assembly jet cooling system |
| JPS5916195U (en) * | 1982-07-21 | 1984-01-31 | 三菱電機株式会社 | Electronics |
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| US4851965A (en) * | 1987-03-09 | 1989-07-25 | Unisys Corporation | Directed air management system for cooling multiple heat sinks |
| US4839774A (en) * | 1988-01-25 | 1989-06-13 | Digital Equipment Corporation | Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board |
| JPH0286498A (en) * | 1988-09-22 | 1990-03-27 | Ricoh Co Ltd | Bookbinding device |
-
1990
- 1990-06-25 US US07/542,613 patent/US5121290A/en not_active Expired - Lifetime
-
1991
- 1991-04-29 CA CA002041461A patent/CA2041461C/en not_active Expired - Fee Related
- 1991-06-04 AU AU78168/91A patent/AU629751B2/en not_active Ceased
- 1991-06-17 EP EP91305472A patent/EP0463782B1/en not_active Expired - Lifetime
- 1991-06-17 DE DE69102497T patent/DE69102497T2/en not_active Expired - Fee Related
- 1991-06-17 ES ES91305472T patent/ES2055961T3/en not_active Expired - Lifetime
- 1991-06-18 KR KR1019910010049A patent/KR100228367B1/en not_active IP Right Cessation
- 1991-06-25 JP JP3178983A patent/JPH088425B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69102497T2 (en) | 1994-10-06 |
| KR100228367B1 (en) | 1999-11-01 |
| US5121290A (en) | 1992-06-09 |
| EP0463782A3 (en) | 1992-05-06 |
| CA2041461A1 (en) | 1991-12-26 |
| EP0463782A2 (en) | 1992-01-02 |
| JPH088425B2 (en) | 1996-01-29 |
| AU7816891A (en) | 1992-01-30 |
| EP0463782B1 (en) | 1994-06-15 |
| AU629751B2 (en) | 1992-10-08 |
| ES2055961T3 (en) | 1994-09-01 |
| JPH04233300A (en) | 1992-08-21 |
| DE69102497D1 (en) | 1994-07-21 |
| KR920002004A (en) | 1992-01-30 |
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