CA2050374A1 - Heat sink for electronic circuitry - Google Patents

Heat sink for electronic circuitry

Info

Publication number
CA2050374A1
CA2050374A1 CA2050374A CA2050374A CA2050374A1 CA 2050374 A1 CA2050374 A1 CA 2050374A1 CA 2050374 A CA2050374 A CA 2050374A CA 2050374 A CA2050374 A CA 2050374A CA 2050374 A1 CA2050374 A1 CA 2050374A1
Authority
CA
Canada
Prior art keywords
insert
tce
bottom portion
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2050374A
Other languages
French (fr)
Other versions
CA2050374C (en
Inventor
Donald W. Dahringer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Donald W. Dahringer
American Telephone And Telegraph Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Donald W. Dahringer, American Telephone And Telegraph Company filed Critical Donald W. Dahringer
Publication of CA2050374A1 publication Critical patent/CA2050374A1/en
Application granted granted Critical
Publication of CA2050374C publication Critical patent/CA2050374C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

A thermally balanced electronic circuit having an element mounted on a suitable support base, a heat-sink having a bottom portion contacting the element and at least one flange projecting from the bottom portion, and a stress-balancing insert positioned on the bottom portion of the heat-sink and at least partially coextensive with the element, said bottom portion of the heat sink being secured to the element and to the insert by means of an adhesive. The insert is of a material having a coefficient of thermal expansion (TCE), .alpha.1, different from the TCE, .alpha.2, of the heat sink. The TCE of the insert may be intermediate the TCE of the heat sink and the TCE, .alpha.3, of the material of the element. Preferably, the TCE of the insert approximately matches or is equal to the TCE of the material of the element.
The element, the bottom portion of the heat-sink, the insert and the adhesive layers form a balanced "sandwich" structure. Such a structure will exhibit planar thermal expansion equivalent to the outer skins of the sandwich structure, e.g.
of the element and the insert. Expansion of the structure normal to the element and the insert accommodates the balance of the absolute volumetric change of components of the sandwich structure not accounted for in the skins.
CA002050374A 1990-10-19 1991-08-30 Heat sink for electronic circuitry Expired - Fee Related CA2050374C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US599,947 1990-10-19
US07/599,947 US5049981A (en) 1990-10-19 1990-10-19 Heat sink for electronic circitry

Publications (2)

Publication Number Publication Date
CA2050374A1 true CA2050374A1 (en) 1992-04-20
CA2050374C CA2050374C (en) 1996-06-25

Family

ID=24401772

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002050374A Expired - Fee Related CA2050374C (en) 1990-10-19 1991-08-30 Heat sink for electronic circuitry

Country Status (9)

Country Link
US (1) US5049981A (en)
EP (1) EP0481721B1 (en)
JP (1) JP3046416B2 (en)
KR (1) KR100231222B1 (en)
CN (1) CN1060924A (en)
CA (1) CA2050374C (en)
DE (1) DE69129888T2 (en)
HK (1) HK1003462A1 (en)
SG (1) SG46633A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JP2708191B2 (en) 1988-09-20 1998-02-04 株式会社日立製作所 Semiconductor device
GB9014491D0 (en) * 1990-06-29 1990-08-22 Digital Equipment Int Mounting silicon chips
US5434524A (en) * 1992-09-16 1995-07-18 International Business Machines Corporation Method of clocking integrated circuit chips
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
US5550326A (en) * 1994-07-13 1996-08-27 Parker-Hannifin Corporation Heat dissipator for electronic components
US5745344A (en) * 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5778523A (en) * 1996-11-08 1998-07-14 W. L. Gore & Associates, Inc. Method for controlling warp of electronic assemblies by use of package stiffener
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6177728B1 (en) * 1998-04-28 2001-01-23 International Business Machines Corporation Integrated circuit chip device having balanced thermal expansion
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7440280B2 (en) * 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
US20070230185A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US8553737B2 (en) 2007-12-17 2013-10-08 Oclaro Photonics, Inc. Laser emitter modules and methods of assembly
US8804246B2 (en) 2008-05-08 2014-08-12 Ii-Vi Laser Enterprise Gmbh High brightness diode output methods and devices
US20100177796A1 (en) * 2009-01-09 2010-07-15 Newport Corporation Laser device and heat sink with core to manage stress due to thermal expansion
CN102934298B (en) 2010-01-22 2016-08-03 Ii-Vi激光企业有限责任公司 The homogenization of far field fiber coupling radiation
JP5384443B2 (en) * 2010-07-28 2014-01-08 日東電工株式会社 Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device
US8644357B2 (en) 2011-01-11 2014-02-04 Ii-Vi Incorporated High reliability laser emitter modules
CN105050211A (en) * 2012-03-30 2015-11-11 张鸿鸣 Corrosion-resistant heat dissipation sheet and corrosion-resistant heat emitting sheet
CN110447166B (en) 2017-04-10 2022-03-29 株式会社村田制作所 Thermoelectric conversion element module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4227036A (en) * 1978-09-18 1980-10-07 Microwave Semiconductor Corp. Composite flanged ceramic package for electronic devices
US4408220A (en) * 1981-01-29 1983-10-04 Calabro Anthony Denis Heat dissipator for a dual in line integrated circuit package
GB8818957D0 (en) * 1988-08-10 1988-09-14 Marconi Electronic Devices Semiconductor devices

Also Published As

Publication number Publication date
HK1003462A1 (en) 1998-10-30
CN1060924A (en) 1992-05-06
JP3046416B2 (en) 2000-05-29
EP0481721B1 (en) 1998-07-29
DE69129888D1 (en) 1998-09-03
KR920008902A (en) 1992-05-28
KR100231222B1 (en) 1999-11-15
JPH04298068A (en) 1992-10-21
SG46633A1 (en) 1998-02-20
EP0481721A1 (en) 1992-04-22
US5049981A (en) 1991-09-17
CA2050374C (en) 1996-06-25
DE69129888T2 (en) 1998-12-24

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed