CA2062803A1 - Heat sink assembly - Google Patents

Heat sink assembly

Info

Publication number
CA2062803A1
CA2062803A1 CA2062803A CA2062803A CA2062803A1 CA 2062803 A1 CA2062803 A1 CA 2062803A1 CA 2062803 A CA2062803 A CA 2062803A CA 2062803 A CA2062803 A CA 2062803A CA 2062803 A1 CA2062803 A1 CA 2062803A1
Authority
CA
Canada
Prior art keywords
circuit
spring
heat sink
hooked
posi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2062803A
Other languages
French (fr)
Other versions
CA2062803C (en
Inventor
Michael George Galich
Dale Gordon Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2062803A1 publication Critical patent/CA2062803A1/en
Application granted granted Critical
Publication of CA2062803C publication Critical patent/CA2062803C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal

Abstract

A heat sink/electromagnetic shield assembly for a circuit ele-ment (22) disposed upon a circuit board (20). A spring clip (24) con-taining at least one hooked projection (32) forming the spring is posi-tioned in a confronting relationship with the circuit element (22). A
U-shaped housing (26) is slidingly positioned over the circuit ele-ment (22) and the spring clip (24) to enclose the circuit element (22) and to compress the hooked projection (32) which forms the spring.
Compression of the hooked projection (32) causes the hooked pro-jection (32) to exert a spring force to retain the housing (26) in posi-tion about the circuit element (22). The assembly may be constructed in line during construction of the electrical circuit (22) disposed upon the circuit board (20).
CA002062803A 1990-04-30 1991-04-17 Heat sink assembly Expired - Fee Related CA2062803C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51684390A 1990-04-30 1990-04-30
US516,843 1990-04-30

Publications (2)

Publication Number Publication Date
CA2062803A1 true CA2062803A1 (en) 1991-10-31
CA2062803C CA2062803C (en) 1996-06-18

Family

ID=24057315

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002062803A Expired - Fee Related CA2062803C (en) 1990-04-30 1991-04-17 Heat sink assembly

Country Status (5)

Country Link
US (1) US5122480A (en)
AR (1) AR244465A1 (en)
CA (1) CA2062803C (en)
MX (1) MX171814B (en)
WO (1) WO1991017567A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
US6266244B1 (en) * 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
US6997748B1 (en) * 2005-03-07 2006-02-14 Cheng Uei Precision Industry Co., Ltd. Shielded shell for electronic connector
US20090161318A1 (en) * 2007-12-19 2009-06-25 Dialogic Corporation Thermal management systems and methods
CN101819455A (en) * 2009-02-27 2010-09-01 鸿富锦精密工业（深圳）有限公司 Mainboard heat ink
TWI661755B (en) * 2017-10-13 2019-06-01 和碩聯合科技股份有限公司 Mounting device on a circuit board and method for mounting an object on a circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1534883A (en) * 1976-10-25 1978-12-06 Redpoint Ltd Socket and heat sink for an electronic component
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
US4599680A (en) * 1983-09-26 1986-07-08 Southwest Research Institute Packaging arrangement for spacecraft computer
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4710852A (en) * 1986-09-26 1987-12-01 General Motors Corporation Spring retainer for encapsulated semiconductor device
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US5019942A (en) * 1987-11-30 1991-05-28 Thermalloy Incorporated Insulating apparatus for electronic device assemblies
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors

Also Published As

Publication number Publication date
WO1991017567A1 (en) 1991-11-14
AR244465A1 (en) 1993-10-29
MX171814B (en) 1993-11-16
CA2062803C (en) 1996-06-18
US5122480A (en) 1992-06-16

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed