CA2075026A1 - Method and apparatus for patterning an imaging member - Google Patents
Method and apparatus for patterning an imaging memberInfo
- Publication number
- CA2075026A1 CA2075026A1 CA002075026A CA2075026A CA2075026A1 CA 2075026 A1 CA2075026 A1 CA 2075026A1 CA 002075026 A CA002075026 A CA 002075026A CA 2075026 A CA2075026 A CA 2075026A CA 2075026 A1 CA2075026 A1 CA 2075026A1
- Authority
- CA
- Canada
- Prior art keywords
- light
- spatial light
- light modulator
- source
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Abstract
ABSTRACT OF THE PREFERRED EMBODIMENT
A device for patterning an imaging member (46) is provided. The device comprises a light source (24) which emits light rays (26). Light rays (26) pass through a collimator lens (28) to collimate the light rays (30). The light then strikes a spatial light modulator (32) which is controlled by a computer (40) to reflect the light (42). The light passes through an imaging lens (44) to magnify the pattern for striking imaging member (46). Imaging member (46) is thus patterned by changing modulator (32) by computer (40).
A device for patterning an imaging member (46) is provided. The device comprises a light source (24) which emits light rays (26). Light rays (26) pass through a collimator lens (28) to collimate the light rays (30). The light then strikes a spatial light modulator (32) which is controlled by a computer (40) to reflect the light (42). The light passes through an imaging lens (44) to magnify the pattern for striking imaging member (46). Imaging member (46) is thus patterned by changing modulator (32) by computer (40).
Description
~7~2fi METHOD AND APPARATUS FOR PAl~ERNING AN IMAGING MEMBER
RELATED APPLI ATIONS
This case is related "Method and Apparatus for Patterning an Imaging Member", IJ.S. Serial No. 453,022, which has been continued to U.S. Serial No.
7~0,511.
TECHNICAL FIELD OF THE INVENTION
This invention relates in general to techniques for forming integrated circuits or printed circuit boards, and in particular to a method and apparatus for patterning a pr~nted circuit board or an imaging member using a spatial light modulator.
BACKGROUND OF ~1~; INVENTION
In one standard process for manufacturing printed circuit boards (PCBs), a master reticle is generated by a computerized system that expo6es a one-to-one image of the desired PCB pattern on a film or other substrate. Subsequently, masks arecreated for contact printing of metallized PCB substrates that have a photoresist coating. When the resist is developed, the metal is etched to reveal the orig~nal interconnect pattern of the master reticle. The board will then be laminated together with the other boards representing the different levels of a finished PCB. I hen the fillished PCB is tested. If a design flaw, as opposed to a process flaw, is found, the entire process must be redone.
Creation of the master reticle is expensive. Af'cer the master reticle is completed, it must be transferred to a working film, which is also costly. With many flaws, this can become extremely expensive, not to mention time consuming. There 2~7~26 , is a need for a method of manufacturing PCBs that does not involve repetitive manufacture of master reticles, or periodic replacement of working reticles.
Tl-16346 2 207~026 SUMMARY OF THE ~ENTION
The present invention disclosed herein comprises a method and apparatus for patterning an imag~ng member which substantially eliminates or reduces steps associated w~th prior patterning methods and devices. The present invention allows 5 the patterning of an imaging member without the time consuming creation of an expensive set of reticles.
An embodiment of the invention would be in the printed circuit board (PCB) manufacturing process. A linear or area array device could be utilized, depending on the scale, or process speed requirement of the system. In this embodiment, a line of 10 data introduced serially to the device would be moved in parallel through the area array one line at a time, while maintaining synchronization with the area to be exposed on the imaging member. The result is a greatly reduced exposure time forthe photolithography process, compared to the use of a linear array, and a similar improvement in process speed for the PCB generation.
15 The pattern to be imaged is fed to a spatial light modulator, which images the pattern directly onto a resist coated PCB, eliminating the need for reticles andworking films.
2~7~0~6 BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete tLnderstanding of the present invention and for further advantages thereof, reference is now made to the following Detailed Description taken in conjunction with the accompanying Drawings in which:
FIGURE 1 is a perspective view of a prior art system for patterning a PCB.
FIGURE 2 is a perspective view of an apparatus for patterning a PCB in accordance with the present invention.
FIGURE 3 i9 a prior art cut away view of a deformable mirror device.
FIGURE 4 is a plan view of a deformable mirror device array.
FIGURE 5 shows the movement of the data and the board relative to each other.
, I
~. . , 20750~6 DETAILED DESCRIPIION OF THE INVENTION
In Figure 1, a prior art system for making a PCB working film is shown. Not shown in this system is the layout done on a workstation to create the necessary data for the generation of the original pattern nor the step of creating the reticle.Reticle 20 is made by a 1-to-1 exposure of the image generated in the work station. It is then positioned under a light source 12, which is focused on the reticle by lens 16. The pattern on the reticle 20 is then passed via a Diazo process to a piece of working film 22. The film i9 then exposed onto a copper clad blank PCB that is coated with resist. The pattem on the board is developed, and the board is etched.
To make the well-known layered boards that have several different levels of circ utry, the above process is done separately for each level. After the boards are all completed, they are laminated together into one board. Then the board are tested to ensure the proper circuitry is on the board.
If there is a problem with a board that requires it to be altered and manufactured, the entire process must be repeated. Obviously, this is an expensive and time consuIning process.
The present embodiment of the culTent invention is shown in Figure 2. The layout data is entered into computer 40. Light source 24, which as an example may be ultraviolet, produces rays 26 which are collected by lens 28, directed onto a spatial light modulator 32 and generally brough to focsu at the aperture of imaging lens 44.
The spatial light modualtor by selectively addressing pixel elements, causes individual portions of the illuminating beam 30 to be reflected into the lens 44 along path 42. The spatial light modulator, in this embodiment, comprises individuallycontrolled elements, such as deformable mirror devices, as an example, or liquidcrystals may be used in embodimènts using light at other frequencies.
The selection of the individual elements of the array to reflect light is completed by the computer 40 using the layout data. The computer cause~ the array to form an image of the desired circuitry upon the member 46, which is a board coated with resist, or a reticle substrate. In the fonner case, this accomplishes the same step~ as discussed above, but eliminates the need for a master reticle and the working film. The computer data file of the desired layout basically replaces the master reticle as the source of the desired image. In the latter case, it is possible to pattern reticle substrates in this manner also, for manufac~urers whose equipment requires the use of reticles.
The member 46 rests upon a movable stage 48 or moving platform that can be shifted in the x direction shown by arrow 50, and, independently in the y direction shown by arrow 62. This allows the member to be aligned and passed under the array to image the member correctly. The member is imaged in a mosaic fashion, as opposed to a linearly scanned fashion, as is typically used with a laser scanner. The member is repeatedly stepped by the computer controlled x-y stage, exposing one block of the mosaic at a time, to the light from the spatial light modulator.
The board then undergoe~ the same processes as discussed above. If a problem is found in the finished board, rather than redesigning the layout, manufacturing a new master reticle and a new working film, all that is required i8 to correct the design file and rerun the PCB. The new board can be made directly from the corrected layout data, as it is used to control the spatial light modulator.
The spatial light modulator could be one of many types. In this embodiment 5 of the present invention, a deformable mirror device (DMD) i8 used. A side view of one mirror element is shown in Figure 3. The DMD is typically manufactured monolithically in ~ilicon as a linear or an area array, but only one element is shown here. A substrate 54 is covered with metal and patterned to form the address electrodes, not shown. A spacer layer 56 is then coated on the electrode layer. A
10 layer of thin reflective metal is then deposited on top of the spacer, followed by a thick layer of the same or ~imilar metal 60. To define the mirror element 64, the thick layer 60 is patterned and etched to leave the thick metal eve~rwhere but in thè
gaps 66 and over hinges 68. Holes 62 are left in the thick layer to allow undercutting of the spacer layer 56. The resultant structure compnse~ mirror element 64 15 suspended over the air ~ap on hinges 68. When the electrode to either side of the hinge centerline of the mirror on substrata 54 is addressed, the torque rotates the mirror about the hinge, causing the light being directed onto the mirror to be deflected along a different optical path. This architecture i~ know a~ the bistable torsion beam DMD. Other configurations of the DMD could be used, including linear 20 and area arrays, and pixel element~ of differing sizes and geometric configurations.
Combinations of DMD~ could be used as well, to speed the proces~, or simply the step-and-repeat patterns.
Figure 4 shows an area array of the DMD device~. The substrate 54 show~
many reproductions of the nirror element, or cell, 64. The data can be loaded in any number of ways to coincide with the desired pattern to be projected upon the imaging member. One of those ways is sh`own by the arrows 70 and 72 in Figure 5.
The data is loaded serially into a row of cells, conceptually shown by arrow 70 . The line of cells containing mirror 64a corresponds to the line of image data 76 on the member 46 in its initial star~ing place. A~ the data is passed in parallel down the array in the direction of arrow 72 to the row of cells with 64b, the member moves in synchronization with the line of data. The line of data 76 moves with the member along direction to what had been position 78. Similarly, a~ the data move~ to the row of mirrors with 64c, the board would move to force the line of data to be at what had been position 80. The given line of information would expcse the same area on the board for as many lines as the area array contains. By this method, a flow of the old data acros~ the face of the chip is mirrored at the board at a constant location. The result is a greatly improved exposure time for the photolithography proces~, and a similar improvement in process speed.
The number of lines available in the ~patial light modulator array could exceed the number of sequential exposure~ required to fully expose the photoreo.ist layer on the PCB or the reticle substrate. The option then exists to te~ninate the parallel flow of a particular line of data across the spatial light modulator array and reduce the total light energy level impinging on the PCB or reticle. By controlling the total number of exposure lineR actually utili~ed, the exposure process can be tailored to , j 2075~26 accomrnodate process equipment and photoresist chemistry variables.
TI~
RELATED APPLI ATIONS
This case is related "Method and Apparatus for Patterning an Imaging Member", IJ.S. Serial No. 453,022, which has been continued to U.S. Serial No.
7~0,511.
TECHNICAL FIELD OF THE INVENTION
This invention relates in general to techniques for forming integrated circuits or printed circuit boards, and in particular to a method and apparatus for patterning a pr~nted circuit board or an imaging member using a spatial light modulator.
BACKGROUND OF ~1~; INVENTION
In one standard process for manufacturing printed circuit boards (PCBs), a master reticle is generated by a computerized system that expo6es a one-to-one image of the desired PCB pattern on a film or other substrate. Subsequently, masks arecreated for contact printing of metallized PCB substrates that have a photoresist coating. When the resist is developed, the metal is etched to reveal the orig~nal interconnect pattern of the master reticle. The board will then be laminated together with the other boards representing the different levels of a finished PCB. I hen the fillished PCB is tested. If a design flaw, as opposed to a process flaw, is found, the entire process must be redone.
Creation of the master reticle is expensive. Af'cer the master reticle is completed, it must be transferred to a working film, which is also costly. With many flaws, this can become extremely expensive, not to mention time consuming. There 2~7~26 , is a need for a method of manufacturing PCBs that does not involve repetitive manufacture of master reticles, or periodic replacement of working reticles.
Tl-16346 2 207~026 SUMMARY OF THE ~ENTION
The present invention disclosed herein comprises a method and apparatus for patterning an imag~ng member which substantially eliminates or reduces steps associated w~th prior patterning methods and devices. The present invention allows 5 the patterning of an imaging member without the time consuming creation of an expensive set of reticles.
An embodiment of the invention would be in the printed circuit board (PCB) manufacturing process. A linear or area array device could be utilized, depending on the scale, or process speed requirement of the system. In this embodiment, a line of 10 data introduced serially to the device would be moved in parallel through the area array one line at a time, while maintaining synchronization with the area to be exposed on the imaging member. The result is a greatly reduced exposure time forthe photolithography process, compared to the use of a linear array, and a similar improvement in process speed for the PCB generation.
15 The pattern to be imaged is fed to a spatial light modulator, which images the pattern directly onto a resist coated PCB, eliminating the need for reticles andworking films.
2~7~0~6 BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete tLnderstanding of the present invention and for further advantages thereof, reference is now made to the following Detailed Description taken in conjunction with the accompanying Drawings in which:
FIGURE 1 is a perspective view of a prior art system for patterning a PCB.
FIGURE 2 is a perspective view of an apparatus for patterning a PCB in accordance with the present invention.
FIGURE 3 i9 a prior art cut away view of a deformable mirror device.
FIGURE 4 is a plan view of a deformable mirror device array.
FIGURE 5 shows the movement of the data and the board relative to each other.
, I
~. . , 20750~6 DETAILED DESCRIPIION OF THE INVENTION
In Figure 1, a prior art system for making a PCB working film is shown. Not shown in this system is the layout done on a workstation to create the necessary data for the generation of the original pattern nor the step of creating the reticle.Reticle 20 is made by a 1-to-1 exposure of the image generated in the work station. It is then positioned under a light source 12, which is focused on the reticle by lens 16. The pattern on the reticle 20 is then passed via a Diazo process to a piece of working film 22. The film i9 then exposed onto a copper clad blank PCB that is coated with resist. The pattem on the board is developed, and the board is etched.
To make the well-known layered boards that have several different levels of circ utry, the above process is done separately for each level. After the boards are all completed, they are laminated together into one board. Then the board are tested to ensure the proper circuitry is on the board.
If there is a problem with a board that requires it to be altered and manufactured, the entire process must be repeated. Obviously, this is an expensive and time consuIning process.
The present embodiment of the culTent invention is shown in Figure 2. The layout data is entered into computer 40. Light source 24, which as an example may be ultraviolet, produces rays 26 which are collected by lens 28, directed onto a spatial light modulator 32 and generally brough to focsu at the aperture of imaging lens 44.
The spatial light modualtor by selectively addressing pixel elements, causes individual portions of the illuminating beam 30 to be reflected into the lens 44 along path 42. The spatial light modulator, in this embodiment, comprises individuallycontrolled elements, such as deformable mirror devices, as an example, or liquidcrystals may be used in embodimènts using light at other frequencies.
The selection of the individual elements of the array to reflect light is completed by the computer 40 using the layout data. The computer cause~ the array to form an image of the desired circuitry upon the member 46, which is a board coated with resist, or a reticle substrate. In the fonner case, this accomplishes the same step~ as discussed above, but eliminates the need for a master reticle and the working film. The computer data file of the desired layout basically replaces the master reticle as the source of the desired image. In the latter case, it is possible to pattern reticle substrates in this manner also, for manufac~urers whose equipment requires the use of reticles.
The member 46 rests upon a movable stage 48 or moving platform that can be shifted in the x direction shown by arrow 50, and, independently in the y direction shown by arrow 62. This allows the member to be aligned and passed under the array to image the member correctly. The member is imaged in a mosaic fashion, as opposed to a linearly scanned fashion, as is typically used with a laser scanner. The member is repeatedly stepped by the computer controlled x-y stage, exposing one block of the mosaic at a time, to the light from the spatial light modulator.
The board then undergoe~ the same processes as discussed above. If a problem is found in the finished board, rather than redesigning the layout, manufacturing a new master reticle and a new working film, all that is required i8 to correct the design file and rerun the PCB. The new board can be made directly from the corrected layout data, as it is used to control the spatial light modulator.
The spatial light modulator could be one of many types. In this embodiment 5 of the present invention, a deformable mirror device (DMD) i8 used. A side view of one mirror element is shown in Figure 3. The DMD is typically manufactured monolithically in ~ilicon as a linear or an area array, but only one element is shown here. A substrate 54 is covered with metal and patterned to form the address electrodes, not shown. A spacer layer 56 is then coated on the electrode layer. A
10 layer of thin reflective metal is then deposited on top of the spacer, followed by a thick layer of the same or ~imilar metal 60. To define the mirror element 64, the thick layer 60 is patterned and etched to leave the thick metal eve~rwhere but in thè
gaps 66 and over hinges 68. Holes 62 are left in the thick layer to allow undercutting of the spacer layer 56. The resultant structure compnse~ mirror element 64 15 suspended over the air ~ap on hinges 68. When the electrode to either side of the hinge centerline of the mirror on substrata 54 is addressed, the torque rotates the mirror about the hinge, causing the light being directed onto the mirror to be deflected along a different optical path. This architecture i~ know a~ the bistable torsion beam DMD. Other configurations of the DMD could be used, including linear 20 and area arrays, and pixel element~ of differing sizes and geometric configurations.
Combinations of DMD~ could be used as well, to speed the proces~, or simply the step-and-repeat patterns.
Figure 4 shows an area array of the DMD device~. The substrate 54 show~
many reproductions of the nirror element, or cell, 64. The data can be loaded in any number of ways to coincide with the desired pattern to be projected upon the imaging member. One of those ways is sh`own by the arrows 70 and 72 in Figure 5.
The data is loaded serially into a row of cells, conceptually shown by arrow 70 . The line of cells containing mirror 64a corresponds to the line of image data 76 on the member 46 in its initial star~ing place. A~ the data is passed in parallel down the array in the direction of arrow 72 to the row of cells with 64b, the member moves in synchronization with the line of data. The line of data 76 moves with the member along direction to what had been position 78. Similarly, a~ the data move~ to the row of mirrors with 64c, the board would move to force the line of data to be at what had been position 80. The given line of information would expcse the same area on the board for as many lines as the area array contains. By this method, a flow of the old data acros~ the face of the chip is mirrored at the board at a constant location. The result is a greatly improved exposure time for the photolithography proces~, and a similar improvement in process speed.
The number of lines available in the ~patial light modulator array could exceed the number of sequential exposure~ required to fully expose the photoreo.ist layer on the PCB or the reticle substrate. The option then exists to te~ninate the parallel flow of a particular line of data across the spatial light modulator array and reduce the total light energy level impinging on the PCB or reticle. By controlling the total number of exposure lineR actually utili~ed, the exposure process can be tailored to , j 2075~26 accomrnodate process equipment and photoresist chemistry variables.
TI~
Claims (21)
1. A system for patterning a printed circuit board coated with light sensitive material comprising:
a. a light source;
b. a spatial light modulator for reflecting light energy from said source in a pre-determined pattern;
c. an imaging lens located such that light rays corresponding to said pre-determined pattern passes through it; and d. a movable surface operable for repeatedly transporting said printed circuit board past the imaging lens in a mosaic pattern to allow said pre-determined pattern of light to expose said light sensitive material.
a. a light source;
b. a spatial light modulator for reflecting light energy from said source in a pre-determined pattern;
c. an imaging lens located such that light rays corresponding to said pre-determined pattern passes through it; and d. a movable surface operable for repeatedly transporting said printed circuit board past the imaging lens in a mosaic pattern to allow said pre-determined pattern of light to expose said light sensitive material.
2. The system as in Claim 1 wherein said light source is ultraviolet.
3. The system as in Claim 1 wherein said spatial light modulator comprises a deformable mirror device.
4. The system as in Claim 1 wherein said movable surface comprises a moving stage.
5. A system for patterning a reticle substrate for the manufacture of printed circuit boards comprising:
a. a light source;
b. a spatial light modulator for reflecting light energy from said source in a pre-determined pattern;
c. an imaging lens located such that light rays corresponding to said pre-determined pattern passes through it; and d. a movable surface operable for repeatedly transporting said reticle substrate past the imaging lens in a mosaic pattern to allow said pre-determined pattern of light to expose said reticle substrate.
a. a light source;
b. a spatial light modulator for reflecting light energy from said source in a pre-determined pattern;
c. an imaging lens located such that light rays corresponding to said pre-determined pattern passes through it; and d. a movable surface operable for repeatedly transporting said reticle substrate past the imaging lens in a mosaic pattern to allow said pre-determined pattern of light to expose said reticle substrate.
6. The system as in Claim 5 wherein said light source is ultraviolet.
7. The system as in Claim 5 wherein said spatial light modulator comprises a deformable mirror device.
8. The system as in Claim 5 wherein said movable surface comprises a moving stage.
9. A method for patterning a printed circuit board coated with a light sensitive material comprising:
a. generating light with a source;
b. modulating light energy from said source into a pre-determined pattern;
c. imaging said pre-determined pattern through a lens; and d. repeatedly transporting said printed circuit board past said imaging lens in a mosaic pattern allowing said predetermined pattern to expose said light sensitive material.
a. generating light with a source;
b. modulating light energy from said source into a pre-determined pattern;
c. imaging said pre-determined pattern through a lens; and d. repeatedly transporting said printed circuit board past said imaging lens in a mosaic pattern allowing said predetermined pattern to expose said light sensitive material.
10. The method of claim 9 wherein said light generated is ultraviolet.
11. The method of Claim 9 wherein said modulating step includes the use of a spatial light modulator.
12. The method of Claim 9 wherein said transporting step includes moving a plate that supports said board.
13. A method for patterning a reticle substrate used in the manufacture of printed circuit boards comprising:
a. generating light with a source;
b. modulating light energy from said source into a pre-determined pattern;
c. imaging said pre-determined pattern through a lens; and d. repeatedly transporting said reticle substrate past said imaging lens in a mosaic pattern allowing said predetermined pattern to expose said reticle substrate.
a. generating light with a source;
b. modulating light energy from said source into a pre-determined pattern;
c. imaging said pre-determined pattern through a lens; and d. repeatedly transporting said reticle substrate past said imaging lens in a mosaic pattern allowing said predetermined pattern to expose said reticle substrate.
14. The method of claim 9 wherein said light generated is ultraviolet.
15. The method of Claim 9 wherein said modulating step includes the use of a spatial light modulator.
16. The method of Claim 9 wherein said transporting step includes moving a plate that supports said reticle.
17. A method of processing data comprising:
a. loading a line of data into a spatial light modulator array, to reimage said array;
b. passing said line of data in parallel through said array;
c. moving an imaging member past said reimaged spatial light modulator array so light patterns reflected from said spatial light modulator array impinge upon said imaging member; and d. synchronizing said passing of said line of data with said moving of said imaging member to reflect said line of data onto a fixed area of said imaging member for an extended period of time.
a. loading a line of data into a spatial light modulator array, to reimage said array;
b. passing said line of data in parallel through said array;
c. moving an imaging member past said reimaged spatial light modulator array so light patterns reflected from said spatial light modulator array impinge upon said imaging member; and d. synchronizing said passing of said line of data with said moving of said imaging member to reflect said line of data onto a fixed area of said imaging member for an extended period of time.
18. The method of Claim 17 wherein said loading step is done serially.
19. The method of Claim 17 wherein said moving step comprises moving said imaging member underneath said spatial light modulator array.
20. The method of Claim 17 wherein said spatial light modulator array comprises an area array of deformable mirror devices.
21. The method of Claim 17 wherein the synchronized passing of a given line of data in parallel through said spatial light modulator array can be decreased from the total number of available lines, to adjust the total exposure process threshold to compensate for PCB process variables.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74213391A | 1991-08-08 | 1991-08-08 | |
US742,133 | 1991-08-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2075026A1 true CA2075026A1 (en) | 1993-02-09 |
Family
ID=24983622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002075026A Abandoned CA2075026A1 (en) | 1991-08-08 | 1992-07-30 | Method and apparatus for patterning an imaging member |
Country Status (5)
Country | Link |
---|---|
US (3) | US5330878A (en) |
EP (1) | EP0528285B1 (en) |
JP (1) | JP3254248B2 (en) |
CA (1) | CA2075026A1 (en) |
DE (1) | DE69220629T2 (en) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2892765B2 (en) * | 1990-04-27 | 1999-05-17 | 株式会社日立製作所 | Method for manufacturing element having pattern structure |
CA2075026A1 (en) * | 1991-08-08 | 1993-02-09 | William E. Nelson | Method and apparatus for patterning an imaging member |
US6219015B1 (en) | 1992-04-28 | 2001-04-17 | The Board Of Directors Of The Leland Stanford, Junior University | Method and apparatus for using an array of grating light valves to produce multicolor optical images |
US5684566A (en) * | 1995-05-24 | 1997-11-04 | Svg Lithography Systems, Inc. | Illumination system and method employing a deformable mirror and diffractive optical elements |
US5841579A (en) | 1995-06-07 | 1998-11-24 | Silicon Light Machines | Flat diffraction grating light valve |
JPH09114397A (en) * | 1995-10-19 | 1997-05-02 | Mitsubishi Electric Corp | Display device and display equipment |
US5834160A (en) * | 1996-01-16 | 1998-11-10 | Lucent Technologies Inc. | Method and apparatus for forming fine patterns on printed circuit board |
WO1998004950A1 (en) * | 1996-07-25 | 1998-02-05 | Anvik Corporation | Seamless, maskless lithography system using spatial light modulator |
US5982553A (en) | 1997-03-20 | 1999-11-09 | Silicon Light Machines | Display device incorporating one-dimensional grating light-valve array |
US6088102A (en) | 1997-10-31 | 2000-07-11 | Silicon Light Machines | Display apparatus including grating light-valve array and interferometric optical system |
SE9800665D0 (en) * | 1998-03-02 | 1998-03-02 | Micronic Laser Systems Ab | Improved method for projection printing using a micromirror SLM |
ES2213311T3 (en) * | 1998-04-29 | 2004-08-16 | Cst Gmbh | PROCEDURE FOR THE MANUFACTURE OF SERIGRAPHY MOLDS, AS WELL AS LIGHTING DEVICE FOR THE SAME. |
US6271808B1 (en) | 1998-06-05 | 2001-08-07 | Silicon Light Machines | Stereo head mounted display using a single display device |
US6130770A (en) | 1998-06-23 | 2000-10-10 | Silicon Light Machines | Electron gun activated grating light valve |
US6101036A (en) | 1998-06-23 | 2000-08-08 | Silicon Light Machines | Embossed diffraction grating alone and in combination with changeable image display |
US6215579B1 (en) | 1998-06-24 | 2001-04-10 | Silicon Light Machines | Method and apparatus for modulating an incident light beam for forming a two-dimensional image |
US6303986B1 (en) | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
DE19944760A1 (en) * | 1999-09-17 | 2001-03-22 | Basys Print Gmbh Systeme Fuer | Device and method for compensating for inhomogeneities in imaging systems |
EP2343128A1 (en) * | 1999-09-17 | 2011-07-13 | BioArray Solutions Ltd. | Substrate and chip for conducting bioassays |
SE522531C2 (en) * | 1999-11-24 | 2004-02-17 | Micronic Laser Systems Ab | Method and apparatus for labeling semiconductors |
TW508653B (en) | 2000-03-24 | 2002-11-01 | Asml Netherlands Bv | Lithographic projection apparatus and integrated circuit manufacturing method |
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JP2002072491A (en) * | 2000-09-01 | 2002-03-12 | Airex Inc | Printed circuit board manufacturing apparatus |
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US6624880B2 (en) | 2001-01-18 | 2003-09-23 | Micronic Laser Systems Ab | Method and apparatus for microlithography |
US6707591B2 (en) | 2001-04-10 | 2004-03-16 | Silicon Light Machines | Angled illumination for a single order light modulator based projection system |
US6753947B2 (en) * | 2001-05-10 | 2004-06-22 | Ultratech Stepper, Inc. | Lithography system and method for device manufacture |
US6782205B2 (en) | 2001-06-25 | 2004-08-24 | Silicon Light Machines | Method and apparatus for dynamic equalization in wavelength division multiplexing |
US6747781B2 (en) | 2001-06-25 | 2004-06-08 | Silicon Light Machines, Inc. | Method, apparatus, and diffuser for reducing laser speckle |
US7095484B1 (en) * | 2001-06-27 | 2006-08-22 | University Of South Florida | Method and apparatus for maskless photolithography |
US6829092B2 (en) | 2001-08-15 | 2004-12-07 | Silicon Light Machines, Inc. | Blazed grating light valve |
US6785001B2 (en) * | 2001-08-21 | 2004-08-31 | Silicon Light Machines, Inc. | Method and apparatus for measuring wavelength jitter of light signal |
JP4068838B2 (en) * | 2001-12-07 | 2008-03-26 | 株式会社日立製作所 | Manufacturing method of semiconductor device |
US6800238B1 (en) | 2002-01-15 | 2004-10-05 | Silicon Light Machines, Inc. | Method for domain patterning in low coercive field ferroelectrics |
US6665048B2 (en) | 2002-01-22 | 2003-12-16 | Creo Inc. | Method for imaging a continuously moving object |
JP3938714B2 (en) | 2002-05-16 | 2007-06-27 | 大日本スクリーン製造株式会社 | Exposure equipment |
US6767751B2 (en) | 2002-05-28 | 2004-07-27 | Silicon Light Machines, Inc. | Integrated driver process flow |
US6728023B1 (en) | 2002-05-28 | 2004-04-27 | Silicon Light Machines | Optical device arrays with optimized image resolution |
JP4201178B2 (en) | 2002-05-30 | 2008-12-24 | 大日本スクリーン製造株式会社 | Image recording device |
US6822797B1 (en) | 2002-05-31 | 2004-11-23 | Silicon Light Machines, Inc. | Light modulator structure for producing high-contrast operation using zero-order light |
US6829258B1 (en) | 2002-06-26 | 2004-12-07 | Silicon Light Machines, Inc. | Rapidly tunable external cavity laser |
US6813059B2 (en) | 2002-06-28 | 2004-11-02 | Silicon Light Machines, Inc. | Reduced formation of asperities in contact micro-structures |
US6714337B1 (en) | 2002-06-28 | 2004-03-30 | Silicon Light Machines | Method and device for modulating a light beam and having an improved gamma response |
US6801354B1 (en) | 2002-08-20 | 2004-10-05 | Silicon Light Machines, Inc. | 2-D diffraction grating for substantially eliminating polarization dependent losses |
US7057795B2 (en) * | 2002-08-20 | 2006-06-06 | Silicon Light Machines Corporation | Micro-structures with individually addressable ribbon pairs |
JP4597675B2 (en) * | 2002-08-24 | 2010-12-15 | マスクレス・リソグラフィー・インコーポレーテッド | Continuous direct write photolithography |
US6712480B1 (en) | 2002-09-27 | 2004-03-30 | Silicon Light Machines | Controlled curvature of stressed micro-structures |
US6829077B1 (en) | 2003-02-28 | 2004-12-07 | Silicon Light Machines, Inc. | Diffractive light modulator with dynamically rotatable diffraction plane |
US6806997B1 (en) | 2003-02-28 | 2004-10-19 | Silicon Light Machines, Inc. | Patterned diffractive light modulator ribbon for PDL reduction |
JP4390189B2 (en) | 2003-04-10 | 2009-12-24 | 大日本スクリーン製造株式会社 | Pattern drawing device |
JPWO2005081034A1 (en) * | 2004-02-25 | 2007-10-25 | 株式会社ニコン | Two-dimensional light control device, exposure apparatus, and exposure method |
JP2005311084A (en) * | 2004-04-21 | 2005-11-04 | Canon Inc | Aligner, device manufacturing method, pattern generation device, and maintenance method |
JP4601482B2 (en) * | 2004-07-29 | 2010-12-22 | 新光電気工業株式会社 | Drawing apparatus and drawing method |
JP2006128194A (en) * | 2004-10-26 | 2006-05-18 | Canon Inc | Exposing apparatus and device manufacturing method |
DE102004059973A1 (en) * | 2004-12-13 | 2006-06-22 | Imi Intelligent Medical Implants Ag | Device for controlling the electrical charge on stimulation electrodes |
JP2008535007A (en) * | 2005-04-02 | 2008-08-28 | パンチ グラフィックス プレプレス ジャーマニー ゲーエムベーハー | Printing plate exposure equipment |
JP5100636B2 (en) | 2005-05-02 | 2012-12-19 | ラドーフ ゲーエムベーハー | Lithographic method for maskless pattern transfer onto photoresponsive substrates |
JP4753625B2 (en) | 2005-05-31 | 2011-08-24 | 大日本スクリーン製造株式会社 | Pattern drawing apparatus and block number determination method |
JP2009109550A (en) | 2007-10-26 | 2009-05-21 | Adtec Engineeng Co Ltd | Direct writing exposure apparatus |
NL2007577A (en) | 2010-11-10 | 2012-05-14 | Asml Netherlands Bv | Optimization of source, mask and projection optics. |
JP6106970B2 (en) * | 2012-07-02 | 2017-04-05 | 株式会社ニコン | Spatial light modulator and exposure apparatus |
US10532556B2 (en) | 2013-12-16 | 2020-01-14 | General Electric Company | Control of solidification in laser powder bed fusion additive manufacturing using a diode laser fiber array |
US10328685B2 (en) | 2013-12-16 | 2019-06-25 | General Electric Company | Diode laser fiber array for powder bed fabrication or repair |
RU2606607C2 (en) * | 2015-05-27 | 2017-01-10 | 3М Инновейтив Пропертиз Компани | Polishing compositions, resistant to subzero temperatures |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2441472A1 (en) * | 1974-08-29 | 1976-03-11 | Siemens Ag | ARRANGEMENT FOR LIGHT-OPTICAL COMPUTER-CONTROLLED DRAWING OF MASKS FOR SEMICONDUCTOR COMPONENTS |
ZA8244B (en) * | 1981-01-16 | 1982-11-24 | Grace W R & Co | Method and apparatus for making printed circuit boards |
US4436806A (en) * | 1981-01-16 | 1984-03-13 | W. R. Grace & Co. | Method and apparatus for making printed circuit boards |
US4638309A (en) * | 1983-09-08 | 1987-01-20 | Texas Instruments Incorporated | Spatial light modulator drive system |
DE3583754D1 (en) * | 1984-03-16 | 1991-09-19 | Sharp Kk | METHOD FOR PRODUCING AN OPTICAL STORAGE ELEMENT. |
US4577932A (en) * | 1984-05-08 | 1986-03-25 | Creo Electronics Corporation | Multi-spot modulator using a laser diode |
US5151718A (en) * | 1990-12-31 | 1992-09-29 | Texas Instruments Incorporated | System and method for solid state illumination for dmd devices |
CA2075026A1 (en) * | 1991-08-08 | 1993-02-09 | William E. Nelson | Method and apparatus for patterning an imaging member |
US5530878A (en) * | 1994-11-17 | 1996-06-25 | Sun Microsystems, Inc. | Simplified power system with a single power converter providing low power consumption and a soft on/off feature |
-
1992
- 1992-07-30 CA CA002075026A patent/CA2075026A1/en not_active Abandoned
- 1992-08-07 EP EP92113461A patent/EP0528285B1/en not_active Expired - Lifetime
- 1992-08-07 JP JP21173392A patent/JP3254248B2/en not_active Expired - Fee Related
- 1992-08-07 DE DE69220629T patent/DE69220629T2/en not_active Expired - Fee Related
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1993
- 1993-04-14 US US08/047,254 patent/US5330878A/en not_active Expired - Lifetime
-
1994
- 1994-05-16 US US08/242,926 patent/US5482818A/en not_active Expired - Lifetime
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1995
- 1995-06-07 US US08/478,159 patent/US5672464A/en not_active Expired - Lifetime
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US5330878A (en) | 1994-07-19 |
EP0528285A1 (en) | 1993-02-24 |
DE69220629T2 (en) | 1997-12-18 |
EP0528285B1 (en) | 1997-07-02 |
JP3254248B2 (en) | 2002-02-04 |
US5482818A (en) | 1996-01-09 |
DE69220629D1 (en) | 1997-08-07 |
US5672464A (en) | 1997-09-30 |
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