CA2128534A1 - Alignment of integrated optical components - Google Patents

Alignment of integrated optical components

Info

Publication number
CA2128534A1
CA2128534A1 CA002128534A CA2128534A CA2128534A1 CA 2128534 A1 CA2128534 A1 CA 2128534A1 CA 002128534 A CA002128534 A CA 002128534A CA 2128534 A CA2128534 A CA 2128534A CA 2128534 A1 CA2128534 A1 CA 2128534A1
Authority
CA
Canada
Prior art keywords
motherboard
laser
alignment
optical components
integrated optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002128534A
Other languages
French (fr)
Other versions
CA2128534C (en
Inventor
Anthony David Welbourn
Kenneth Cooper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
Anthony David Welbourn
Kenneth Cooper
British Telecommunications Public Limited Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anthony David Welbourn, Kenneth Cooper, British Telecommunications Public Limited Company filed Critical Anthony David Welbourn
Publication of CA2128534A1 publication Critical patent/CA2128534A1/en
Application granted granted Critical
Publication of CA2128534C publication Critical patent/CA2128534C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/975—Substrate or mask aligning feature

Abstract

A method for connecting two components (10, 11) with functional parts (12, 19) thereof in a predetermined alignment such as a semiconductor laser (11) and motherboard (10), comprising forming the laser (11) by processing in which the radiation outlet (19) and alignment means (21) are provided in a predetermined position with respect to each other, similarly forming on the motherboard (10), a waveguide (12) and alignment means (16, 14), mounting the laser (11) on the motherboard (10) in a generally aligned position, providing solder (26) between metal pads (18, 22) on the laser (11) and motherboard (10), and utilizing the sur-face tension of the molten metal (26) extending between the pads (18, 22) to move the laser (11) into an accurately aligned posi-tion on the motherboard (10).
CA002128534A 1992-01-28 1993-01-20 Alignment of integrated optical components Expired - Fee Related CA2128534C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP92300714.0 1992-01-28
EP92300714 1992-01-28
PCT/GB1993/000121 WO1993015424A1 (en) 1992-01-28 1993-01-20 Alignment of integrated optical components

Publications (2)

Publication Number Publication Date
CA2128534A1 true CA2128534A1 (en) 1993-08-05
CA2128534C CA2128534C (en) 2003-01-07

Family

ID=8211251

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002128534A Expired - Fee Related CA2128534C (en) 1992-01-28 1993-01-20 Alignment of integrated optical components

Country Status (8)

Country Link
US (1) US5656507A (en)
EP (1) EP0624257B1 (en)
JP (1) JPH07503328A (en)
KR (1) KR950700554A (en)
AU (1) AU670922B2 (en)
CA (1) CA2128534C (en)
DE (1) DE69331876T2 (en)
WO (1) WO1993015424A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0647091A1 (en) * 1993-10-05 1995-04-05 AT&T Corp. Passive alignment of components with micromachined tool
US5377900A (en) * 1993-12-29 1995-01-03 At&T Corp. Method of precisely positioning and mating two workpieces
DE59509887D1 (en) * 1994-09-26 2002-01-10 Infineon Technologies Ag COUPLING ARRANGEMENT FOR OPTICALLY COUPLING AN OEIC COMPONENT AND OPTICAL FIBERS
JP2655112B2 (en) * 1994-12-22 1997-09-17 日本電気株式会社 Optical module mounting method and structure
JP3658426B2 (en) * 1995-01-23 2005-06-08 株式会社日立製作所 Optical semiconductor device
SE512121C2 (en) * 1995-12-19 2000-01-31 Ericsson Telefon Ab L M A method of passively aligning a waveguide on a substrate
US6031856A (en) * 1997-10-30 2000-02-29 Motorola, Inc. Method, article of manufacture, and optical package for eliminating tilt angle between a header and an optical emitter mounted thereon
SE513858C2 (en) 1998-03-06 2000-11-13 Ericsson Telefon Ab L M Multilayer structure and method of manufacturing multilayer modules
US6832013B1 (en) 1999-07-16 2004-12-14 Hymite A/S Hybrid integration of active and passive optical components on an Si-board
EP1122567A1 (en) * 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
JP3656543B2 (en) * 2000-10-25 2005-06-08 松下電器産業株式会社 Electronic component mounting method
US6754427B2 (en) * 2001-02-08 2004-06-22 Shipley Company, L.L.C. Method and device passively locating a fiber stub in a groove
DE10146865B4 (en) * 2001-09-22 2005-04-21 Mergeoptics Gmbh Arrangement of a system for data transmission
US6876085B1 (en) * 2001-09-24 2005-04-05 Nortel Networks Limited Signal layer interconnect using tapered traces
US6818464B2 (en) * 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
US7039273B2 (en) * 2003-08-12 2006-05-02 Tyler Sims Solder seals within a switching system
US7681306B2 (en) * 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
GB0813784D0 (en) 2008-07-28 2008-09-03 Ct Integrated Photonics Ltd Optical intergration system
US9882073B2 (en) * 2013-10-09 2018-01-30 Skorpios Technologies, Inc. Structures for bonding a direct-bandgap chip to a silicon photonic device
US11181688B2 (en) 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
US10750807B1 (en) 2011-12-28 2020-08-25 Strap Appeal Garment system for interchangeable covers for garment straps
US10188153B1 (en) 2011-12-28 2019-01-29 Strap Appeal Garment system for interchangeable covers for garment straps
JP6379489B2 (en) * 2014-01-06 2018-08-29 富士通株式会社 Optical connector housing mounting method, optical connector housing, and optical module using the same
US10852492B1 (en) * 2014-10-29 2020-12-01 Acacia Communications, Inc. Techniques to combine two integrated photonic substrates
CA3014585C (en) 2016-02-19 2024-03-19 Macom Technology Solutions Holdings, Inc. Techniques for laser alignment in photonic integrated circuits
US10189706B2 (en) * 2016-11-08 2019-01-29 Dunan Microstaq, Inc. Method for self-aligning solder-attached MEMS die to a mounting surface
JP6977267B2 (en) 2017-02-02 2021-12-08 富士通オプティカルコンポーネンツ株式会社 Optical device and manufacturing method of optical device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE463297C (en) * 1928-07-26 Guenther Von Heyman Switching device for gear change transmissions of motor vehicles
GB1553065A (en) * 1978-01-28 1979-09-19 Int Computers Ltd Circuit structures including integrated circuits
JPS59155162A (en) * 1983-02-23 1984-09-04 Fujitsu Ltd Manufacture of semiconductor device
US4565314A (en) * 1983-09-09 1986-01-21 At&T Bell Laboratories Registration and assembly of integrated circuit packages
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US5009476A (en) * 1984-01-16 1991-04-23 Texas Instruments Incorporated Semiconductor layer with optical communication between chips disposed therein
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
ATE48480T1 (en) * 1985-10-16 1989-12-15 British Telecomm MOVABLE HOUSING FOR ONE ELEMENT.
US4878611A (en) * 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
GB2208943B (en) * 1987-08-19 1991-07-31 Plessey Co Plc Alignment of fibre arrays
GB2215087B (en) * 1988-02-03 1992-04-01 Plessey Co Plc A method of processing substrates for mounting optical elements and components
US4810557A (en) * 1988-03-03 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making an article comprising a tandem groove, and article produced by the method
US4904036A (en) * 1988-03-03 1990-02-27 American Telephone And Telegraph Company, At&T Bell Laboratories Subassemblies for optoelectronic hybrid integrated circuits
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly
AU645283B2 (en) * 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
AU637874B2 (en) * 1990-01-23 1993-06-10 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5023881A (en) * 1990-06-19 1991-06-11 At&T Bell Laboratories Photonics module and alignment method
CA2077161A1 (en) * 1991-09-13 1993-03-14 Thomas W. Fitzgerald Method of establishing soldered connections

Also Published As

Publication number Publication date
US5656507A (en) 1997-08-12
DE69331876D1 (en) 2002-06-06
KR950700554A (en) 1995-01-16
CA2128534C (en) 2003-01-07
EP0624257A1 (en) 1994-11-17
AU670922B2 (en) 1996-08-08
JPH07503328A (en) 1995-04-06
EP0624257B1 (en) 2002-05-02
WO1993015424A1 (en) 1993-08-05
DE69331876T2 (en) 2002-11-28
AU3360893A (en) 1993-09-01

Similar Documents

Publication Publication Date Title
CA2128534A1 (en) Alignment of integrated optical components
AU2017232626B2 (en) Optical alignment of an optical subassembly to an optoelectronic device
US5257336A (en) Optical subassembly with passive optical alignment
CA2287275A1 (en) Optical devices and methods of fabrication thereof
KR970001928B1 (en) Process for flip-chip connection of a semiconductor chip
CA2358529A1 (en) Method for constructing an optoelectronic assembly
WO2002077608A3 (en) Optical method and apparatus for determining status of agricultural products
EP1022822A4 (en) Optical module and method of manufacture thereof
WO2003005509A1 (en) Semiconductor laser module, light amplifier and method of producing semiconductor laser module
US6151173A (en) Assembly of optical components optically aligned and method for making this assembly
WO2001004664A3 (en) Integrated optics beam deflectors
DE19830360A1 (en) Opto-electronic module
CA2383949A1 (en) An optoelectronic assembly and method for fabricating the same
WO2003023460A3 (en) Glass bonded fiber array and method for the fabrication thereof
FR2694131B1 (en) PROCESS AND INSTALLATION FOR THE MANUFACTURE OF A COMPONENT, IN PARTICULAR AN OPTICAL COMPONENT, AND OPTICAL COMPONENT THUS OBTAINED
EP0718653B1 (en) Selfaligned optical element and optical wave-guide by means of solder bumps on rectangular pads
WO2002067031A3 (en) Method and system for automated dynamic fiber optic alignment and assembly
US6752888B2 (en) Mounting and curing chips on a substrate so as to minimize gap
CA2322298A1 (en) A method of fabricating mirrors in polymer waveguides
US6632028B1 (en) Apparatus and method for aligning an optical fiber with an optical device
WO2003010574A3 (en) Packaged optical micro-mechanical device
EP1241504A3 (en) Ferrule assembly, method of making the same, and optical module
JPH07234331A (en) Method for determining mutual position between facing workpiece to be machined
JPS5654081A (en) Photo-coupling device
WO2002073278A3 (en) Manufacturing method using solder self-alignment with optical component deformation fine alignment

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed