CA2147752A1 - Low Profile Fan Body with Heat Transfer Characteristics - Google Patents

Low Profile Fan Body with Heat Transfer Characteristics

Info

Publication number
CA2147752A1
CA2147752A1 CA2147752A CA2147752A CA2147752A1 CA 2147752 A1 CA2147752 A1 CA 2147752A1 CA 2147752 A CA2147752 A CA 2147752A CA 2147752 A CA2147752 A CA 2147752A CA 2147752 A1 CA2147752 A1 CA 2147752A1
Authority
CA
Canada
Prior art keywords
heat transfer
low profile
transfer characteristics
fan body
profile fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2147752A
Other languages
French (fr)
Other versions
CA2147752C (en
Inventor
Daniel L. Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2147752A1 publication Critical patent/CA2147752A1/en
Application granted granted Critical
Publication of CA2147752C publication Critical patent/CA2147752C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/522—Casings; Connections of working fluid for axial pumps especially adapted for elastic fluid pumps
    • F04D29/526—Details of the casing section radially opposing blade tips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A low profile, heat transfer, electronic component cooling fan is disclosed. The heat transfer body (20) includes a pressure differential surface (34) formed around the outer perimeter of the fan blades (30) within a first segment of the axial blade depth region. An interface surface (38) for connection to the electronic component is positioned opposite of the fan frame (25). Some heat transfer devices (45) are disposed between the frame (25) and the interface surface (38), such that the heat transfer devices (45) are positioned within a second segment of the axial blade depth region.
CA002147752A 1992-10-23 1993-09-29 Low profile fan body with heat transfer characteristics Expired - Lifetime CA2147752C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/965,654 US5288203A (en) 1992-10-23 1992-10-23 Low profile fan body with heat transfer characteristics
US07/965,654 1992-10-23

Publications (2)

Publication Number Publication Date
CA2147752A1 true CA2147752A1 (en) 1994-05-11
CA2147752C CA2147752C (en) 1998-12-08

Family

ID=25510285

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002147752A Expired - Lifetime CA2147752C (en) 1992-10-23 1993-09-29 Low profile fan body with heat transfer characteristics

Country Status (7)

Country Link
US (1) US5288203A (en)
EP (1) EP0746688B1 (en)
JP (1) JP3400801B2 (en)
AT (1) ATE196346T1 (en)
CA (1) CA2147752C (en)
DE (1) DE69329431T2 (en)
WO (1) WO1994010451A1 (en)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069819B2 (en) * 1992-05-28 2000-07-24 富士通株式会社 Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink
US5484262A (en) * 1992-10-23 1996-01-16 Nidec Corporation Low profile fan body with heat transfer characteristics
JP2901867B2 (en) 1993-03-19 1999-06-07 富士通株式会社 Heat sink and heat sink mounting structure
US5484013A (en) * 1993-05-27 1996-01-16 Nippon Densan Corporation Heat sink fan
JP2765801B2 (en) * 1993-08-20 1998-06-18 山洋電気株式会社 Electronic component cooling device
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5407324A (en) * 1993-12-30 1995-04-18 Compaq Computer Corporation Side-vented axial fan and associated fabrication methods
US5452181A (en) * 1994-02-07 1995-09-19 Nidec Corporation Detachable apparatus for cooling integrated circuits
US5437327A (en) * 1994-04-18 1995-08-01 Chiou; Ming Der CPU heat dissipating fan device
US5409352A (en) * 1994-04-18 1995-04-25 Lin; Mike CPU heat dissipating device
US5430610A (en) * 1994-06-15 1995-07-04 Hung; Chin-Ping Separable positioning device for the heat sink on computer chips
JP2918810B2 (en) * 1994-07-12 1999-07-12 山洋電気株式会社 Electronic component cooling device
US5506752A (en) * 1994-07-25 1996-04-09 Kong; Edmund Y. Apparatus for cooling an integrated circuit chip
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
US5460571A (en) * 1994-10-31 1995-10-24 Kato; Junichi Electro-magnetically shielded ventilation system
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus
US5502619A (en) * 1994-12-12 1996-03-26 Tennmax Trading Corp. Heat sink assembly for computer chips
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
US5519575A (en) * 1995-02-14 1996-05-21 Chiou; Ming D. CPU cooling fan mounting structure
GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit
US5810554A (en) * 1995-05-31 1998-09-22 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
JP3058818B2 (en) * 1995-10-05 2000-07-04 山洋電気株式会社 Heat sink for cooling electronic components
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5896917A (en) * 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
JP3188397B2 (en) * 1996-07-04 2001-07-16 松下電器産業株式会社 Blower
US6047765A (en) * 1996-08-20 2000-04-11 Zhan; Xiao Cross flow cooling device for semiconductor components
DE29615089U1 (en) * 1996-08-29 1996-10-17 Lee Richard Brushless DC fan
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP4290232B2 (en) * 1997-02-24 2009-07-01 富士通株式会社 Heat sink and information processing device using it
US5727624A (en) * 1997-03-18 1998-03-17 Liken Lin CPU heat dissipating device with airguiding units
US6132171A (en) * 1997-06-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Blower and method for molding housing thereof
TW464733B (en) * 1997-06-27 2001-11-21 Mitsubishi Electric Corp Blower, casing of blower, motor, vibration control mounting device
USD408514S (en) * 1997-10-07 1999-04-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
US6211566B1 (en) 1998-03-24 2001-04-03 Sun Microsystems, Inc. Method and apparatus to improve the thermal interface between a heat sink and a semiconductor
US6050326A (en) * 1998-05-12 2000-04-18 International Business Machines Corporation Method and apparatus for cooling an electronic device
JP3188417B2 (en) 1998-05-14 2001-07-16 松下電器産業株式会社 Blower
JP2000012751A (en) * 1998-06-24 2000-01-14 Nippon Densan Corp Cooling fan device
US6206641B1 (en) * 1998-06-29 2001-03-27 Samsung Electro-Mechanics Co., Ltd. Micro fan
US7584780B1 (en) 1998-12-09 2009-09-08 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6186739B1 (en) * 1999-09-09 2001-02-13 Hsieh Hsin-Mao Support for a cooling fan
TW562087U (en) * 2000-06-16 2003-11-11 Delta Electronics Inc Frame structure for fan
JP3503822B2 (en) * 2001-01-16 2004-03-08 ミネベア株式会社 Axial fan motor and cooling device
US6505680B1 (en) 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US6702001B2 (en) * 2001-08-21 2004-03-09 Agilent Technologies, Inc. Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly
TW592343U (en) * 2002-04-30 2004-06-11 Delta Electronics Inc Improved cooling fan
US6955215B2 (en) * 2004-03-09 2005-10-18 King Fahd University Of Petroleum And Minerals Hybrid cooling system and method for cooling electronic devices
US6844641B1 (en) * 2004-03-15 2005-01-18 Sunonwealth Electric Machine Industry Co., Ltd. Casing for heat-dissipating fan
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US7198464B2 (en) * 2004-10-08 2007-04-03 Asia Vital Component Co., Ltd. Frame device of a fan
US7296619B2 (en) * 2004-10-21 2007-11-20 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with heat spreader
US7028757B1 (en) 2004-10-21 2006-04-18 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device with liquid chamber
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
US20070231142A1 (en) * 2006-03-31 2007-10-04 Wen-Hao Liu Fan frame structure
US20070242430A1 (en) * 2006-04-15 2007-10-18 Wen-Hao Liu Fan frame device
JP2008267176A (en) * 2007-04-17 2008-11-06 Sony Corp Axial flow fan device, housing, and electronic equipment
US8740562B2 (en) * 2007-10-30 2014-06-03 Nidec Corporation Axial fan and method of manufacturing the same
JP5668352B2 (en) * 2010-07-30 2015-02-12 日本電産株式会社 Axial fan and slide mold
JP5636792B2 (en) * 2010-07-30 2014-12-10 日本電産株式会社 Axial fan and electronic device equipped with the same
US9039362B2 (en) * 2011-03-14 2015-05-26 Minebea Co., Ltd. Impeller and centrifugal fan using the same
KR101326515B1 (en) * 2011-12-12 2013-11-08 기아자동차주식회사 Heat radiation structure of Canned motor type pump
US8944148B2 (en) * 2012-07-23 2015-02-03 King Fahd University Of Petroleum And Minerals Add-on heat sink
TW201426263A (en) * 2012-12-26 2014-07-01 Hon Hai Prec Ind Co Ltd Thermal grease cover
GB2545414B (en) * 2015-12-11 2019-03-13 Dyson Technology Ltd A handheld product having a motor
JP6928434B2 (en) * 2016-09-30 2021-09-01 ミネベアミツミ株式会社 Axial fan device
KR102067271B1 (en) * 2018-07-23 2020-01-16 엘지전자 주식회사 Cooking appliance
US11859915B1 (en) * 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2120197A5 (en) * 1970-08-04 1972-08-18 Lannionnais Electronique
LU68101A1 (en) * 1973-07-26 1973-11-22
CH612736A5 (en) * 1976-04-27 1979-08-15 Papst Motoren Kg
DE2743708A1 (en) * 1977-09-28 1979-04-05 Siemens Ag Heat sink for hermetically sealed equipment - has modular heat exchanger and fan as part of housing wall
JPS6047453B2 (en) * 1978-01-13 1985-10-22 トヨタ自動車株式会社 Internal combustion engine cooling system
US4233644A (en) * 1979-06-28 1980-11-11 International Business Machines Corporation Dual-pull air cooling for a computer frame
US4611238A (en) * 1982-05-05 1986-09-09 Burroughs Corporation Integrated circuit package incorporating low-stress omnidirectional heat sink
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
US4662830A (en) * 1985-09-06 1987-05-05 Magnetic Peripherals Inc. Quiet centrifugal fan
US4784928A (en) * 1986-09-02 1988-11-15 Eastman Kodak Company Reusable electrophotographic element
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US4715430A (en) * 1986-10-27 1987-12-29 International Business Machines Corporation Environmentally secure and thermally efficient heat sink assembly
US4733293A (en) * 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US4885488A (en) * 1988-05-23 1989-12-05 Texas Instruments Incorporated Miniaturized fan for printed circuit boards
JPH0286900A (en) * 1988-06-25 1990-03-27 Nippon Spindle Mfg Co Ltd Method and device for filtering waste cutting fluid
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US5191230A (en) * 1989-01-30 1993-03-02 Heung Lap Yan Circuit module fan assembly
JPH03229492A (en) * 1990-02-05 1991-10-11 Seiko Electronic Components Ltd Centrifugal blower

Also Published As

Publication number Publication date
CA2147752C (en) 1998-12-08
WO1994010451A1 (en) 1994-05-11
DE69329431D1 (en) 2000-10-19
DE69329431T2 (en) 2001-02-22
JP3400801B2 (en) 2003-04-28
EP0746688A1 (en) 1996-12-11
JPH08502804A (en) 1996-03-26
ATE196346T1 (en) 2000-09-15
US5288203A (en) 1994-02-22
EP0746688B1 (en) 2000-09-13
EP0746688A4 (en) 1998-05-13

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Legal Events

Date Code Title Description
EEER Examination request