CA2159242A1 - Process for Manufacturing Semiconductor Device and Semiconductor Wafer - Google Patents

Process for Manufacturing Semiconductor Device and Semiconductor Wafer

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Publication number
CA2159242A1
CA2159242A1 CA2159242A CA2159242A CA2159242A1 CA 2159242 A1 CA2159242 A1 CA 2159242A1 CA 2159242 A CA2159242 A CA 2159242A CA 2159242 A CA2159242 A CA 2159242A CA 2159242 A1 CA2159242 A1 CA 2159242A1
Authority
CA
Canada
Prior art keywords
chip
wafer
semiconductor device
electrodes
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2159242A
Other languages
French (fr)
Other versions
CA2159242C (en
Inventor
Keiichiro Kata
Shinichi Chikaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17018517&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2159242(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by NEC Corp filed Critical NEC Corp
Priority to CA002254329A priority Critical patent/CA2254329A1/en
Publication of CA2159242A1 publication Critical patent/CA2159242A1/en
Application granted granted Critical
Publication of CA2159242C publication Critical patent/CA2159242C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract

A process for manufacturing a semiconductor device.
Chip sections are defined on a wafer by scribe lines, with each chip section having chip electrodes formed thereon. The wafer is covered with a passivating film except for an area on the chip electrodes. Aluminum interconnection layers are provided such that each layer is connected to the chip electrode at one end thereof, and the other end of the layer is extended towards the central portion of the chip section. A
cover coating film is applied on the passivating film and the layers. A number of apertures are formed in the coating film passing therethrough, and bump electrodes are formed at the position corresponding to the apertures. The chip sections are then separated from each other along the scribe lines into semiconductor devices.
CA002159242A 1994-09-30 1995-09-27 Process for manufacturing semiconductor device and semiconductor wafer Expired - Fee Related CA2159242C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002254329A CA2254329A1 (en) 1994-09-30 1995-09-27 Process for manufacturing semiconductor device and semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6237653A JP2792532B2 (en) 1994-09-30 1994-09-30 Semiconductor device manufacturing method and semiconductor wafer
JP237653/1994 1994-09-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CA002254329A Division CA2254329A1 (en) 1994-09-30 1995-09-27 Process for manufacturing semiconductor device and semiconductor wafer

Publications (2)

Publication Number Publication Date
CA2159242A1 true CA2159242A1 (en) 1996-03-31
CA2159242C CA2159242C (en) 1999-12-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA002159242A Expired - Fee Related CA2159242C (en) 1994-09-30 1995-09-27 Process for manufacturing semiconductor device and semiconductor wafer

Country Status (6)

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US (2) US5844304A (en)
EP (1) EP0704895B1 (en)
JP (1) JP2792532B2 (en)
KR (1) KR100241573B1 (en)
CA (1) CA2159242C (en)
DE (1) DE69526895T2 (en)

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US5844304A (en) 1998-12-01
KR100241573B1 (en) 2000-02-01
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JP2792532B2 (en) 1998-09-03
CA2159242C (en) 1999-12-07
JPH08102466A (en) 1996-04-16
EP0704895A2 (en) 1996-04-03

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