CA2176785A1 - Terminal socket assembly - Google Patents
Terminal socket assemblyInfo
- Publication number
- CA2176785A1 CA2176785A1 CA002176785A CA2176785A CA2176785A1 CA 2176785 A1 CA2176785 A1 CA 2176785A1 CA 002176785 A CA002176785 A CA 002176785A CA 2176785 A CA2176785 A CA 2176785A CA 2176785 A1 CA2176785 A1 CA 2176785A1
- Authority
- CA
- Canada
- Prior art keywords
- terminal socket
- terminal
- barrel portion
- circuit board
- socket assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
Abstract
A terminal socket assembly is adapted for mounting on a printed circuit board and includes a conductive terminal socket having a barrel portion insertable axially into a hole in the printed circuit board, with radially outwardly projecting wing portions for soldering to solder pads on the circuit board. A terminal-receiving dielectric housing mounts the terminal socket therewithin. The housing has walls which extend circumferentially about portions of the barrel portion of the terminal socket to prevent solder from wicking along exposed areas of the terminal and interfering with mating.
The anti-solder wicking design allows a connector or component to be surface mounted directly on the surface of a circuit board to maximize the density of the entire assembly and the device in which it is used.
The anti-solder wicking design allows a connector or component to be surface mounted directly on the surface of a circuit board to maximize the density of the entire assembly and the device in which it is used.
Description
217678~
spErT~Ir~IoN
Tr~RMTNAT. SorRTi~T A.~.cr'MRr,Y
Field of th.~ InVenl i-~n This invention generally relate6 to the art of electrical connectors and, particularly, to a ~nrminAl 60cket assembly which prevent6 molten solder material from wicking or creeping along the terminal socket during processing of the socket assembly to an underlying printed circuit board.
Ba.ik4L..~ of ~hP Tnvention In hand held and portable electronic devices 6uch as cnll~ r phones, pagers, and two-way radios, the trend i8 toward smaller and more compact designs to minimize the size and weight of the device and to allow for increased density of the electronic circuitry mounted on the printed circuit boards within the devices. Therefore, it i6 important to maximize the density of such devices by utilizing "true surface mount" ~_ -~ents, i.e. mounting components and connectors on both surfaces of the circuit boards, and by minimizing the distance between the printed circuit board and the connector mounted thereon. However, if ~ ts or connectors, and in particular the component or connector terminal6, are placed too close to the surface of the printed circuit board, during processing of the board the reflow soldering may cause "solder-wicking" of the molten solder or spreading of the ref lowed solder into exposed surfaces of the connector terminals.
The "creeping" or wicking of the solder within the ~nrm~ n~l can interfere with the electrlcal connection between the connector tnrm~nAl~ and mating c~ ~)n~nt leads by increasing the insertion force of a mating pin or blocking insertion altogether, by causing solder bridging and/or short circuits within the terminal, or by causing 1068 of functionality of re8ilient beam6 of the terminal by ~176785 reducing or eliminating contact normal forces altogether.
Therefore, to minimize the risk of solder-wicking in these electronic devices, the designs typically call for spacing the connector or, ~llell~ away from the surface of the circuit board to create a gap which mLnimizes the exposed surfaces of a terminal along which the molten solder can flow. However, this approach i8 not nprpccArily consistent with the trend toward high density and compact miniaturized devices, since the gap between the circuit board and the connector take6 up valuable space. Eliminating the gap by mounting the connector6 and/or the c~ ul~ellLs l'flush" with or directly on the surface of the circuit board would allow the designs to achieve higher density.
The present invention is directed to solving the above problems by providing a surface mount tPrmin~l socket assembly which prevents solder-wicking and therefore allows the assembly to be mounted directly to the surface of the circuit board to minimize the overall profile of the assembly . The assembly can theref ore be f lush-mounted to the surface of a printed circuit board without the danger of problems caused by solder-wicking.
rv o~ the ~nvent~ion An object, therefore, of the invention is to provide a new and i ~Gved surface mount termlnal socket assembly of the character described.
In the exemplary embodiment of the invention, the socket assembly is adapted for mounting on a printed circuit board. The printed circuit board includes holes with corresponding solder pads on a surface of the circuit board ad; acent the holes . The socket assembly includes a conductive termi~Al socket having a barrel portion insertable axially into a cc,LL~ ding one of the holes in the printed circuit board, and radially outwardly projecting wing portions engageable with and solderable to the solder pads on the surface of the printed circuit board. A tprminAl-receiving dielectric housing has a ~ 17~785 receptacle portion adapted for mounting the tPrm~nAl socket therein and wall portions extending circumferentially around about at least part of the barrel portion of the t-~rm;nAl socket to prevent solder material from wicking or flowing along thc outside of the t~rminAl and into the internal mating portion of the terminal where it may interfere with the electrlcal and/or mechanical functlon of the terminal socket.
The wing portion of the terminal socket is axially spaced from a distal end of the socket and extends circumferentially around a portion of the barrel portion, and the wall portions of the housing extend circumferentially around substantially the ~ ininq portion of the barrel portion of the terminal socket. As disclosed herein, the t~rm~nAl socket includes a pair of the wing portions projecting radially outwardly from diametrically opposite sides of the barrel portion. The wall portions of the housing comprise a pair of walls positioned about diametrically opposite sides of the barrel portion between the wing portions. Therefore, the pair of wing portions combine to extend circumferentially around a portion of the barrel portion of the terminal socket, and the walls of the housing extend circumferentially around substantially the ~ ~ in;ng portion of the barrel portion of the t~rm;nAl socket.
The barrel portion of the t~rminAl socket has a generally cylindrical configuration, and the housing walls are generally semi-cylindrical. The walls are sized and conf igured relative to the barrel portion to establish a 3 o press-f it relationship thercbetween to prevent solder f rom f lowing along exposed areas of the terminal . The terminal socket is stamped and formed of metal material and defines a seam extending longi~ nA 1 1 y along the barrel portion thereof. One of the housing walls surrounds the seam to prevent solder-wicking thercalong.
Lastly, the terminal socket includes a compliant mating portion loc~ted within the receptacle portion of the ~ 217~785 housing for reEliliently engaging a mating terminal pin.
The compliant portion comprises a plurality of axially extending, inwardly bowed, circumferentially spaced resilient fingers.
Other ob~ects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying draw-Lng5 -21~678~
Brief Degcri~tion gf th~ Drawings The feature3 of this invention which are believed to be novel are 6et forth with particularity in the append-ed claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the nying drawing6, in which like reference numerals identify like elements in the figures and in which:
FIGURE 1 is an exploded pefD~e~;Live view of a t~rmln~l socket assembly according to the invention;
FIGURE 2 is a perspective view of the 60cket assembly in assembled condition;
FIGURE 3 is a perspective view of the socket assembly, inverted relative to the position of Figures 1 and 2, about to be positioned on a printed circuit board having a hole therein;
FIGURE 4 is a fragmented plan view of the assembly of Figure 2;
FIGURE 5 i5 a fragmented vertical section taken generally along line 5-5 of Figure 4; and FIGURE 6 is a view similar to that of Figure 5, showing the socket assembly soldered to the printed circuit board .
217678~
D~t~;led l)escri.,tion of the Preferred F~nhAriir According to the invention, the terminAl socket assembly, generally designated 10, is shown in Figures 1, 2, 4 and 5 isolated from a printed circuit board. The assembly is shown in conjunction with a printed circuit board 12 in Figures 3 and 6. I'he printed circuit board has a hole 14 therethrough, with a corresponding circuit pad 16 adjacent the hole on one surface of the board. The circuit pad is elongated as best seen in Figure 3 to form enlarged areas 16a on diametrically opposite sides of hole 14, the areas being covered with a meltable or ref lowable solder material as shown. The design contemplates that the solder be placed on the surface of the circuit board, to avoid costly through-hole plating processes and to allow c~ ~ AntS to be located on both surfaces of the circuit board to maximize the density thereof.
Generally in the preferred ~mhorlir-~t~ terminal socket assembly 10 is a two-piece assembly including a one-piece conductive terminal socket, generally designated 20, and a one-piece terminal housing, generally designated 22, for mounting tArmin~l socket 20. The terminal socket is stamped and formed of conductive sheet metal material. The housing is unitarily molded of dielectric material such as plastic or the like.
As shown in Figure 1, terminal socket 20 of assembly 10 includes a barrel portion 24 which defines one end o~ the socket for insertion into hole 14 in printed circuit board 12, as described in greater detail hereinafter. A pair of wing portions 26 project radially outwardly from opposite sides of barrel portion 24, and spaced inwardly of a distal end 28 of the socket. The terminal socket includes a compliant mating portion extending between barrel portion 24 and a second barrel portion 30 at the opposite end o~ the socket. The compliant mating portion is defined by a plurality of longit~ in~lly extending, inwardly bowed and circumferentially spaced resilient mating fingers 32 which -. ~176785 are effective to grip a mating male tPrminAl pin or r ~ellL lead (de3cribed hereinafter). Lastly, with terminal socket 20 being stamped and formed of sheet metal material, a seam 34 extends longitudinally through the socket, including through barrel portions 24 and 30 and through a pair of adjacent resilient fingers 32.
~Eousing 22 of t~rmin~l socket assembly 10 includes a rectangular block-shaped base 36 having a t~rm;nAl-receiving passage or receptacle 38 extending therethrough for mounting terminal socket 20 therewithin.
A rib 40 projects from a planar surface 36 of the ba3e and includes radially outwardly configured rib portions 40a on l Lically opposite gides of receptacle 38 for surrounding wing portions 26 of terminal socket 20, as seen in Figure 2. A pair of generally semi-cylindrical walls 44 are disposed about diametrically opposite sides of barrel portion 24 when the terminal socket is inserted into receptacle potion 38 of the housing in the direction of arrow "A" (Fig. 2). Lastly, a cylindrical boss portion 46 of housing 22 projects from an opposite planar surface 48 of base 36 to ~uLluln-d opposite barrel portion 30 of terminal socket 20, as seen best in Figures 5 and 6.
Referring now to Figures 2 and 3, when terminal socket 20 is mounted within housing 22, areas 24a on opposite diametric sides of barrel portion 24 and wing portion 26 of the t~rm;nAl socket are exposed for soldering to circuit board 18. The rr--~;n;ng portions of the outside of barrel portion 24 are substantially ~uLl~u~ded by walls 44 of the housing. Preferably, the walls are sized and configured relative to barrel portion 24 to establish a press-f it therebetween to ensure that molten 301der material cannot ~low or enter between the outside of barrel portion 24 and the insides of walls 44. In essence, wing portion 26 and areas 24a of barrel 24 extend circumferentially around a portion of the outside of barrel portion 24 of the t~rm;n~l socket and allow for the flow of molten solder material thereover to effect a 301der 2~ ~67~5 95-269 CA
connection to the surface of the printed circuit board, but the I. inin~ circumferential areas of the barrel portion, including seam 34, is substantially ~ULL~UIlded by walls 44 of the housing to prevent the flow of molter solder to other areas.
Figure 3 shows terminal socket asaembly 10 inverted in relation to the orientation of Figures 1, 2 and 4-6. This is the orientation that the asGembly would assume during processlng of printed circuit board 12, for example, in a reflow soldering proce6s. The assembly is adapted to be positioned on the printed circuit board in the direction of arrow "B" such that wing portions 26 of terminal socket 20 overlie solder pad areas 16a of circuit pad 16 on the printed circuit board. Barrel portion 24, along with walls 44 of housing 22, pro~ect into hole 14 in the printed circuit board.
Referring to Figure 6 in conjunction with Figure 3, solder material 50 i8 shown between wing portions 26 of terminal socket 20 and the surface 18 of printed circuit board 12. Although not visible in this depiction, the material would cover solder paste areas 16a of surface 18 of the board. Walls 44 prevent the solder from wicking circumferentially about the barrel portion and further up into the t~rm~n~l socket via seam 34.
Iherefore, the molten solder is confined by the socket assembly of the invention to the exposed areas 24a of the barrel portion (Figures 2 and 3), and to the radially outwardly projecting wing portions 26. The solder material can neither wick circumferentially about the barrel portion or axially into the interior of the t~rm;nAl socket, due to the housing walls 44 and the terminal wing portions 26.
Lastly, Figures 5 and 6 show in phantom a mating terminal pin or component lead 52 which is inserted into t~rm~nAl socket 20. ~he terminal pin is insertable in the direction of arrow "C" through barrel portion 24 and into engagement with resilient fingers 32 within the receptacle 2~7~785 portion 38 of housing 22. Due to the design described above, solder wicking does not occur through the tc~nmin~l socket and therefore no interference with the mating terminal pin can occur.
It will be understood that the invention may be embodi~d in other specific forms without departlng from the spirit or central characteristics thereof. ~he present examples and embodiments, therefore, are to be considered in all respects as lllustrative and not restrictive, and the invention is not to be limited to the details given herein .
spErT~Ir~IoN
Tr~RMTNAT. SorRTi~T A.~.cr'MRr,Y
Field of th.~ InVenl i-~n This invention generally relate6 to the art of electrical connectors and, particularly, to a ~nrminAl 60cket assembly which prevent6 molten solder material from wicking or creeping along the terminal socket during processing of the socket assembly to an underlying printed circuit board.
Ba.ik4L..~ of ~hP Tnvention In hand held and portable electronic devices 6uch as cnll~ r phones, pagers, and two-way radios, the trend i8 toward smaller and more compact designs to minimize the size and weight of the device and to allow for increased density of the electronic circuitry mounted on the printed circuit boards within the devices. Therefore, it i6 important to maximize the density of such devices by utilizing "true surface mount" ~_ -~ents, i.e. mounting components and connectors on both surfaces of the circuit boards, and by minimizing the distance between the printed circuit board and the connector mounted thereon. However, if ~ ts or connectors, and in particular the component or connector terminal6, are placed too close to the surface of the printed circuit board, during processing of the board the reflow soldering may cause "solder-wicking" of the molten solder or spreading of the ref lowed solder into exposed surfaces of the connector terminals.
The "creeping" or wicking of the solder within the ~nrm~ n~l can interfere with the electrlcal connection between the connector tnrm~nAl~ and mating c~ ~)n~nt leads by increasing the insertion force of a mating pin or blocking insertion altogether, by causing solder bridging and/or short circuits within the terminal, or by causing 1068 of functionality of re8ilient beam6 of the terminal by ~176785 reducing or eliminating contact normal forces altogether.
Therefore, to minimize the risk of solder-wicking in these electronic devices, the designs typically call for spacing the connector or, ~llell~ away from the surface of the circuit board to create a gap which mLnimizes the exposed surfaces of a terminal along which the molten solder can flow. However, this approach i8 not nprpccArily consistent with the trend toward high density and compact miniaturized devices, since the gap between the circuit board and the connector take6 up valuable space. Eliminating the gap by mounting the connector6 and/or the c~ ul~ellLs l'flush" with or directly on the surface of the circuit board would allow the designs to achieve higher density.
The present invention is directed to solving the above problems by providing a surface mount tPrmin~l socket assembly which prevents solder-wicking and therefore allows the assembly to be mounted directly to the surface of the circuit board to minimize the overall profile of the assembly . The assembly can theref ore be f lush-mounted to the surface of a printed circuit board without the danger of problems caused by solder-wicking.
rv o~ the ~nvent~ion An object, therefore, of the invention is to provide a new and i ~Gved surface mount termlnal socket assembly of the character described.
In the exemplary embodiment of the invention, the socket assembly is adapted for mounting on a printed circuit board. The printed circuit board includes holes with corresponding solder pads on a surface of the circuit board ad; acent the holes . The socket assembly includes a conductive termi~Al socket having a barrel portion insertable axially into a cc,LL~ ding one of the holes in the printed circuit board, and radially outwardly projecting wing portions engageable with and solderable to the solder pads on the surface of the printed circuit board. A tprminAl-receiving dielectric housing has a ~ 17~785 receptacle portion adapted for mounting the tPrm~nAl socket therein and wall portions extending circumferentially around about at least part of the barrel portion of the t-~rm;nAl socket to prevent solder material from wicking or flowing along thc outside of the t~rminAl and into the internal mating portion of the terminal where it may interfere with the electrlcal and/or mechanical functlon of the terminal socket.
The wing portion of the terminal socket is axially spaced from a distal end of the socket and extends circumferentially around a portion of the barrel portion, and the wall portions of the housing extend circumferentially around substantially the ~ ininq portion of the barrel portion of the terminal socket. As disclosed herein, the t~rm~nAl socket includes a pair of the wing portions projecting radially outwardly from diametrically opposite sides of the barrel portion. The wall portions of the housing comprise a pair of walls positioned about diametrically opposite sides of the barrel portion between the wing portions. Therefore, the pair of wing portions combine to extend circumferentially around a portion of the barrel portion of the terminal socket, and the walls of the housing extend circumferentially around substantially the ~ ~ in;ng portion of the barrel portion of the t~rm;nAl socket.
The barrel portion of the t~rminAl socket has a generally cylindrical configuration, and the housing walls are generally semi-cylindrical. The walls are sized and conf igured relative to the barrel portion to establish a 3 o press-f it relationship thercbetween to prevent solder f rom f lowing along exposed areas of the terminal . The terminal socket is stamped and formed of metal material and defines a seam extending longi~ nA 1 1 y along the barrel portion thereof. One of the housing walls surrounds the seam to prevent solder-wicking thercalong.
Lastly, the terminal socket includes a compliant mating portion loc~ted within the receptacle portion of the ~ 217~785 housing for reEliliently engaging a mating terminal pin.
The compliant portion comprises a plurality of axially extending, inwardly bowed, circumferentially spaced resilient fingers.
Other ob~ects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying draw-Lng5 -21~678~
Brief Degcri~tion gf th~ Drawings The feature3 of this invention which are believed to be novel are 6et forth with particularity in the append-ed claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the nying drawing6, in which like reference numerals identify like elements in the figures and in which:
FIGURE 1 is an exploded pefD~e~;Live view of a t~rmln~l socket assembly according to the invention;
FIGURE 2 is a perspective view of the 60cket assembly in assembled condition;
FIGURE 3 is a perspective view of the socket assembly, inverted relative to the position of Figures 1 and 2, about to be positioned on a printed circuit board having a hole therein;
FIGURE 4 is a fragmented plan view of the assembly of Figure 2;
FIGURE 5 i5 a fragmented vertical section taken generally along line 5-5 of Figure 4; and FIGURE 6 is a view similar to that of Figure 5, showing the socket assembly soldered to the printed circuit board .
217678~
D~t~;led l)escri.,tion of the Preferred F~nhAriir According to the invention, the terminAl socket assembly, generally designated 10, is shown in Figures 1, 2, 4 and 5 isolated from a printed circuit board. The assembly is shown in conjunction with a printed circuit board 12 in Figures 3 and 6. I'he printed circuit board has a hole 14 therethrough, with a corresponding circuit pad 16 adjacent the hole on one surface of the board. The circuit pad is elongated as best seen in Figure 3 to form enlarged areas 16a on diametrically opposite sides of hole 14, the areas being covered with a meltable or ref lowable solder material as shown. The design contemplates that the solder be placed on the surface of the circuit board, to avoid costly through-hole plating processes and to allow c~ ~ AntS to be located on both surfaces of the circuit board to maximize the density thereof.
Generally in the preferred ~mhorlir-~t~ terminal socket assembly 10 is a two-piece assembly including a one-piece conductive terminal socket, generally designated 20, and a one-piece terminal housing, generally designated 22, for mounting tArmin~l socket 20. The terminal socket is stamped and formed of conductive sheet metal material. The housing is unitarily molded of dielectric material such as plastic or the like.
As shown in Figure 1, terminal socket 20 of assembly 10 includes a barrel portion 24 which defines one end o~ the socket for insertion into hole 14 in printed circuit board 12, as described in greater detail hereinafter. A pair of wing portions 26 project radially outwardly from opposite sides of barrel portion 24, and spaced inwardly of a distal end 28 of the socket. The terminal socket includes a compliant mating portion extending between barrel portion 24 and a second barrel portion 30 at the opposite end o~ the socket. The compliant mating portion is defined by a plurality of longit~ in~lly extending, inwardly bowed and circumferentially spaced resilient mating fingers 32 which -. ~176785 are effective to grip a mating male tPrminAl pin or r ~ellL lead (de3cribed hereinafter). Lastly, with terminal socket 20 being stamped and formed of sheet metal material, a seam 34 extends longitudinally through the socket, including through barrel portions 24 and 30 and through a pair of adjacent resilient fingers 32.
~Eousing 22 of t~rmin~l socket assembly 10 includes a rectangular block-shaped base 36 having a t~rm;nAl-receiving passage or receptacle 38 extending therethrough for mounting terminal socket 20 therewithin.
A rib 40 projects from a planar surface 36 of the ba3e and includes radially outwardly configured rib portions 40a on l Lically opposite gides of receptacle 38 for surrounding wing portions 26 of terminal socket 20, as seen in Figure 2. A pair of generally semi-cylindrical walls 44 are disposed about diametrically opposite sides of barrel portion 24 when the terminal socket is inserted into receptacle potion 38 of the housing in the direction of arrow "A" (Fig. 2). Lastly, a cylindrical boss portion 46 of housing 22 projects from an opposite planar surface 48 of base 36 to ~uLluln-d opposite barrel portion 30 of terminal socket 20, as seen best in Figures 5 and 6.
Referring now to Figures 2 and 3, when terminal socket 20 is mounted within housing 22, areas 24a on opposite diametric sides of barrel portion 24 and wing portion 26 of the t~rm;nAl socket are exposed for soldering to circuit board 18. The rr--~;n;ng portions of the outside of barrel portion 24 are substantially ~uLl~u~ded by walls 44 of the housing. Preferably, the walls are sized and configured relative to barrel portion 24 to establish a press-f it therebetween to ensure that molten 301der material cannot ~low or enter between the outside of barrel portion 24 and the insides of walls 44. In essence, wing portion 26 and areas 24a of barrel 24 extend circumferentially around a portion of the outside of barrel portion 24 of the t~rm;n~l socket and allow for the flow of molten solder material thereover to effect a 301der 2~ ~67~5 95-269 CA
connection to the surface of the printed circuit board, but the I. inin~ circumferential areas of the barrel portion, including seam 34, is substantially ~ULL~UIlded by walls 44 of the housing to prevent the flow of molter solder to other areas.
Figure 3 shows terminal socket asaembly 10 inverted in relation to the orientation of Figures 1, 2 and 4-6. This is the orientation that the asGembly would assume during processlng of printed circuit board 12, for example, in a reflow soldering proce6s. The assembly is adapted to be positioned on the printed circuit board in the direction of arrow "B" such that wing portions 26 of terminal socket 20 overlie solder pad areas 16a of circuit pad 16 on the printed circuit board. Barrel portion 24, along with walls 44 of housing 22, pro~ect into hole 14 in the printed circuit board.
Referring to Figure 6 in conjunction with Figure 3, solder material 50 i8 shown between wing portions 26 of terminal socket 20 and the surface 18 of printed circuit board 12. Although not visible in this depiction, the material would cover solder paste areas 16a of surface 18 of the board. Walls 44 prevent the solder from wicking circumferentially about the barrel portion and further up into the t~rm~n~l socket via seam 34.
Iherefore, the molten solder is confined by the socket assembly of the invention to the exposed areas 24a of the barrel portion (Figures 2 and 3), and to the radially outwardly projecting wing portions 26. The solder material can neither wick circumferentially about the barrel portion or axially into the interior of the t~rm;nAl socket, due to the housing walls 44 and the terminal wing portions 26.
Lastly, Figures 5 and 6 show in phantom a mating terminal pin or component lead 52 which is inserted into t~rm~nAl socket 20. ~he terminal pin is insertable in the direction of arrow "C" through barrel portion 24 and into engagement with resilient fingers 32 within the receptacle 2~7~785 portion 38 of housing 22. Due to the design described above, solder wicking does not occur through the tc~nmin~l socket and therefore no interference with the mating terminal pin can occur.
It will be understood that the invention may be embodi~d in other specific forms without departlng from the spirit or central characteristics thereof. ~he present examples and embodiments, therefore, are to be considered in all respects as lllustrative and not restrictive, and the invention is not to be limited to the details given herein .
Claims (11)
1. A terminal socket assembly for mounting on a printed circuit board, the circuit board having a hole and a solder pad adjacent the hole, the terminal socket assembly characterized by:
a conductive terminal socket having a barrel portion insertable axially into the hole in the printed circuit board with a radially outwardly projecting wing portion engageable with the solder pad and adapted for soldering thereto; and a terminal-receiving dielectric housing for holding the terminal socket and including a wall portion about at least part of the barrel portion of the terminal socket to prevent solder material from wicking into the terminal socket.
a conductive terminal socket having a barrel portion insertable axially into the hole in the printed circuit board with a radially outwardly projecting wing portion engageable with the solder pad and adapted for soldering thereto; and a terminal-receiving dielectric housing for holding the terminal socket and including a wall portion about at least part of the barrel portion of the terminal socket to prevent solder material from wicking into the terminal socket.
2. The terminal socket assembly of claim 1 wherein said wing portion is spaced axially from a distal end of the terminal socket.
3. The terminal socket assembly of claim 2 wherein said wing portion of the terminal socket extends circumferentially around a portion of the barrel portion of the terminal socket, and said wall portion extends circumferentially around substantially the remaining portion of the barrel portion.
4. The terminal socket assembly of claim 1, including a pair of said wing portions projecting radially outwardly from diametrically opposite sides of the barrel portion of the terminal socket, and said wall portion of said dielectric housing comprises a pair of walls about diametrically opposite sides of the barrel portion of the terminal socket between the wing portions.
5. The terminal socket assembly of claim 4 wherein said pair of wing portions extend circumferentially around a portion of the barrel portion of the terminal socket, and said pair of housing walls extends circumferentially around substantially the remaining portion of the barrel portion.
6. The terminal socket assembly of claim 1 wherein said barrel portion of said terminal socket is generally cylindrical in shape, and said wall portion of said dielectric housing is generally semi-cylindrical in shape.
7. The terminal socket assembly of claim 6 wherein said wall portion of said dielectric housing is sized and configured relative to said barrel portion of said terminal socket to establish a press-fit relationship therebetween.
8. The terminal socket assembly of claim 1 wherein said terminal socket is further characterized by a compliant mating portion positioned within the housing for resiliently engaging a mating terminal pin.
9. The terminal socket assembly of claim 8 wherein said compliant mating portion comprises a plurality of axially extending, inwardly bowed, circumferentially spaced, resilient fingers.
10. The terminal socket assembly of claim 1 wherein said terminal socket is stamped and formed of metal material defining a seam extending longitudinally along said barrel portion, wherein said wall portion of said dielectric housing substantially surrounds the seam to prevent solder-wicking therealong.
11
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/500,659 US5653601A (en) | 1995-07-11 | 1995-07-11 | Terminal socket assembly |
| US08/500,659 | 1995-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2176785A1 true CA2176785A1 (en) | 1997-01-12 |
Family
ID=23990385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002176785A Abandoned CA2176785A1 (en) | 1995-07-11 | 1996-05-16 | Terminal socket assembly |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5653601A (en) |
| EP (1) | EP0753904A1 (en) |
| JP (1) | JP3082070B2 (en) |
| KR (1) | KR100208636B1 (en) |
| CN (1) | CN1145539A (en) |
| CA (1) | CA2176785A1 (en) |
| MY (1) | MY132182A (en) |
| TW (1) | TW291614B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822990A1 (en) * | 1998-05-22 | 1999-11-25 | Amphenol Tuchel Elect | Two part molded socket-type electrical connector |
| TW395603U (en) * | 1998-11-10 | 2000-06-21 | Advanced Connectek Inc | Electrical connector |
| US6079990A (en) * | 1999-02-02 | 2000-06-27 | Molex Incorporated | Terminal-receiving socket for mounting on a circuit board |
| US6725536B1 (en) * | 1999-03-10 | 2004-04-27 | Micron Technology, Inc. | Methods for the fabrication of electrical connectors |
| JP4313919B2 (en) * | 2000-01-21 | 2009-08-12 | モレックス インコーポレイテド | Board mounting connector and connector terminal |
| US6220877B1 (en) * | 2000-05-05 | 2001-04-24 | Alcoa Fujikura Limited | Monolithic terminal interface |
| US6338632B1 (en) * | 2000-07-05 | 2002-01-15 | Hon Hai Precision Ind. Co., Ltd. | Compliant, press fit electrical contact having improved retention |
| US6540590B1 (en) | 2000-08-31 | 2003-04-01 | Multi-Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a rotating retaining ring |
| US6565367B2 (en) | 2001-01-17 | 2003-05-20 | International Business Machines Corporation | Zero insertion force compliant pin contact and assembly |
| US6717425B2 (en) * | 2001-10-17 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | High-density PCB test jack |
| US7021963B2 (en) * | 2002-08-15 | 2006-04-04 | 3M Innovative Properties Company | Electrical contact |
| US6671174B1 (en) * | 2002-08-26 | 2003-12-30 | Illinois Tool Works Inc. | 5-pin surface mount contacts and block assembly |
| US20060110955A1 (en) * | 2004-11-22 | 2006-05-25 | Trw Automotive U.S. Llc | Electrical apparauts |
| AT502552B1 (en) * | 2005-10-11 | 2007-07-15 | Fronius Int Gmbh | ASSEMBLY METHOD, COUPLING DEVICE AND COUPLING ELEMENT FOR A HIGH-PERFORMANCE CONTACT, AND BATTERY CHARGER WITH A CLUTCH DEVICE |
| US7320627B2 (en) * | 2006-04-03 | 2008-01-22 | Honeywell International Inc. | Deformable electrical connector |
| JP5541991B2 (en) * | 2010-07-20 | 2014-07-09 | タイコエレクトロニクスジャパン合同会社 | Surface mount contact and connector using the same |
| US8137144B1 (en) * | 2011-02-11 | 2012-03-20 | E-Full Enterprise Co., Ltd. | Pin connector |
| JP5319817B1 (en) * | 2012-04-06 | 2013-10-16 | ファナック株式会社 | Motor structure with soldered terminals soldered to connectors or terminal blocks |
| CN203039130U (en) * | 2012-12-06 | 2013-07-03 | 上海莫仕连接器有限公司 | Electrical connector |
| US20140238726A1 (en) * | 2013-02-28 | 2014-08-28 | Cooper Technologies Company | External moisture barrier package for circuit board electrical component |
| DE102015111543A1 (en) * | 2015-07-16 | 2017-01-19 | Phoenix Contact Gmbh & Co. Kg | Base strip for connecting to at least one connector part |
| CN106332449B (en) * | 2016-08-31 | 2019-03-05 | 安徽赛福电子有限公司 | A kind of electronic component pin |
| CN106363312B (en) * | 2016-11-23 | 2019-03-08 | 京信通信技术(广州)有限公司 | Weld matrix |
| CN206850065U (en) | 2017-01-20 | 2018-01-05 | 得意精密电子(苏州)有限公司 | Tubular terminal |
| DE102017206217A1 (en) * | 2017-04-11 | 2018-10-11 | Robert Bosch Gmbh | Electrical contact arrangement |
| WO2020031760A1 (en) * | 2018-08-10 | 2020-02-13 | 株式会社村田製作所 | Surface-mount connector and surface-mount connector set |
| DE102019131791B8 (en) * | 2019-11-25 | 2022-12-15 | Hanon Systems | Arrangements for connecting electrical connections for a device for driving a compressor and methods for assembling the arrangements and device for driving a compressor and use of the device |
| EP4133574A1 (en) | 2020-04-07 | 2023-02-15 | Milwaukee Electric Tool Corporation | Impact tool and electric motor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3158425A (en) * | 1961-05-25 | 1964-11-24 | Amp Inc | Pin socket for printed circuit board |
| US3222632A (en) * | 1964-06-08 | 1965-12-07 | Amp Inc | Pin and socket connector assembly adapted for solder connection |
| US3218606A (en) * | 1964-01-20 | 1965-11-16 | Lockheed Aircraft Corp | Socket assembly for printed circuits |
| GB1288757A (en) * | 1968-09-24 | 1972-09-13 | ||
| US3673551A (en) * | 1969-11-28 | 1972-06-27 | Molex Products Co | Integrated circuit terminal and method |
| US4171856A (en) * | 1978-04-24 | 1979-10-23 | Amp Incorporated | Substrate recessed receptacle |
| DE3469476D1 (en) * | 1983-12-03 | 1988-03-31 | Mentor Paul Mozar | Front board fitting unit for a circuit board |
| US4620757A (en) * | 1984-12-26 | 1986-11-04 | Brintec Systems Corporation | Connector socket |
| FR2579834B1 (en) * | 1985-03-27 | 1987-06-26 | Allied Corp | TULIP TYPE CONTACT FOR INTEGRATED CIRCUIT SUPPORT |
| US4727648A (en) * | 1985-04-22 | 1988-03-01 | Savage John Jun | Circuit component mount and assembly |
| US4695106A (en) * | 1985-05-13 | 1987-09-22 | Amp Incorporated | Surface mount, miniature connector |
| IT1208262B (en) * | 1987-03-25 | 1989-06-12 | Connei Spa | BUSHING FOR BUSHING AND PIN PLUG CONTACT DEVICES |
| JPS6435879A (en) * | 1987-07-31 | 1989-02-06 | Texas Instruments Japan | Socket |
| US4981450A (en) * | 1989-01-06 | 1991-01-01 | Texas Instruments Incorporated | Connector apparatus |
| US5178564A (en) * | 1990-11-19 | 1993-01-12 | Molex Incorporated | Electrical connector with solder mask |
-
1995
- 1995-07-11 US US08/500,659 patent/US5653601A/en not_active Expired - Fee Related
-
1996
- 1996-05-16 CA CA002176785A patent/CA2176785A1/en not_active Abandoned
- 1996-05-31 TW TW085106530A patent/TW291614B/zh active
- 1996-06-28 JP JP08188402A patent/JP3082070B2/en not_active Expired - Fee Related
- 1996-07-02 EP EP96110648A patent/EP0753904A1/en not_active Ceased
- 1996-07-10 KR KR1019960027741A patent/KR100208636B1/en not_active IP Right Cessation
- 1996-07-10 MY MYPI96002845A patent/MY132182A/en unknown
- 1996-07-10 CN CN96110801A patent/CN1145539A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0935785A (en) | 1997-02-07 |
| US5653601A (en) | 1997-08-05 |
| CN1145539A (en) | 1997-03-19 |
| KR100208636B1 (en) | 1999-07-15 |
| KR970008733A (en) | 1997-02-24 |
| EP0753904A1 (en) | 1997-01-15 |
| JP3082070B2 (en) | 2000-08-28 |
| TW291614B (en) | 1996-11-21 |
| MY132182A (en) | 2007-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20000516 |