CA2190361A1 - Electrical devices comprising a ptc resistive element - Google Patents

Electrical devices comprising a ptc resistive element

Info

Publication number
CA2190361A1
CA2190361A1 CA002190361A CA2190361A CA2190361A1 CA 2190361 A1 CA2190361 A1 CA 2190361A1 CA 002190361 A CA002190361 A CA 002190361A CA 2190361 A CA2190361 A CA 2190361A CA 2190361 A1 CA2190361 A1 CA 2190361A1
Authority
CA
Canada
Prior art keywords
members
conductive
face
ptc
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002190361A
Other languages
French (fr)
Inventor
Michael Zhang
Shou-Mean Fang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22916634&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2190361(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of CA2190361A1 publication Critical patent/CA2190361A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material

Abstract

Laminar electrical devices, in particular circuit protection devices, contain two laminar electrodes (13, 15), with a PTC element (17) between them, and a cross-conductor (51) which passes through the thickness of the device and contacts one only of the two electrodes. This permits connection to both electrodes from the same side of the device. The device also includes layers of solder (64, 65, 66, 67) on the areas of the device through which connection is made, and separation and or masking members (81, 82, 85) which (a) reduce the danger of short circuits formed by solder flow during installation of the device and/or (b) provide a site for permanent marking of the device.

Description

2 1 9 0 3 6 1 PCr/US95/05567 .

Electrical Devices comprising a PTC resisitive element This invention relates to electrical devices.
S
Our International Application No. PCT/US94/10137, filed September 13, 1994 (Docket MP1490), discloses a variety of improved devices (and methods of making such devices) which comprise a laminar electrical element, preferably a PTC
resistive element composed of a conductive polymer, sandwiched between two laminar electrodes. These improved devices inclu~e a transverse conductive member (often referred to as a cross-conductor) which passes through the electrical element and is connected to one of the electrodes but not to the l5 other. Preferably the device comprises a first laminar electrode which i8 connected to the cross-conductor; a second laminar electrode which is not connected to the cross-conductor; and an additional laminar conductive member which is (i) connected to the cross-conductor, (ii) secured to the 20 same face of the electrical element as the second electrode, and (iii) spaced apart from the second electrode. The additional c~-nf~ t; ve member and the second electrode are preferably formed by removing a strip from a laminar n~ ; ve member, thug dividing the laminar conductive member 2s into two parts.
These improved devices are particularly useful for installation, e.g. onto a printed circuit board, by soldered connections to the second electrode and the additional 30 conductive member. For such installation, the additional conductive member and/or the second electrode are preferably provided with an outer layer of solder. As disclosed in that Application No. PCT/US94/10137, when the devices are made by dividing up an appropriately treated laminate comprising many 3s devices, the preferred methods of preparation result in the surface of the fir8t electrode also carrying an outer layer of the same solder. The layers of solder on the additional _ _ _ _ _ _ _ _ . . .. . _ _ _ _ . .

wo9S/31816 2 1 9 G3 o 1 F~ ~ '7 conductive member and on the first electrode can also serve to improve the current-carrying capacity of (or even to create~
the cross-conductor, by flowing into the aperture during the connection process.
We have now found that during installation of these devices ~ nt;l;n;r~ solder layers, particularly their installation on printed circuit boards, there is a danger that melting of the solder-~layerg will not only make ~he desired 0 connections, but will algo create short circuits between the e~ectrodes. These short circuits can be created by solder flowing across the gap between the additional r ~n~ t;ve member and the second electrode, and/or by solder flowing between the electrodes. We have also found that if the outer 5 surface of the first (upper) electrode is completely covered by a layer of solder which melts during installation of the device, this makes it impossible to provide the device with pF~rr~n~nt markingg which will identify the device after installation .
We have found, in accordance with the present invention, that the problems caused by solder flow during installation can be mitigated or so-lved by the use of masking and/or separating materials which are applied to the device to 25 provide permanent or temporary members which (a) ensure that solder layers to be used in the connection process are formed only in desired locations and/or (b) during installation of the device, prevent (or at least hinder) solder flow which results in short circuits between the electrodes, and/or (c) 30 provide a convenient, permanent location for identification marks on the device. A8 discussed in detail below, the masking or separating material is preferably applied to an assembly which is later separated lnto a plurality of individual devices.
In a f irst aspect, the present invention provides an electrical device which has a reduced tendency to suffer from WO 95/31816 2 19 0 3 6 ~ r~ cs~c7 short circuits caused by solder f low during installation and which comprises (1) a laminar PTC resistive element which has a first face ~.
s and second face;
(2) a first laminar electrode which has (i) an inner face which r~lllt;~ R the first face of the PTC element and ( i i ) an outer f ace;
(3) a second laminar electrode which has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face;
(4 ) an additional laminar conductive member which (a) has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face, and (b) is spaced apart from the second electrode;
the PTC element, the f irst electrode and the additional conductive member def ining an aperture which runs between the first electrode and the additional conductive member, through 2s the PTC element;
(5) a transverse conductive member which (a) is composed of metal, (b) lies within the aperture, and (c) is physically and electrically connected to the f irst electrode and the additional conductive member;

W0 95/31816 2 1 9 0 3 6 1 r~ '7 (6) a first layer of solder which is secured to~the outer face of the additional conductive member;
~7) a second layer~ of solder which ig secured to the outer S face of the secDnd electrode; and (8) a separation member which (a) is composed of a solid, non-conductive material, (b) lies between the first and second layers of solder and (c) remains solid at temperatures at which the layers of solder are molten.
The separation member prevents the f irst and second layers of soldcr f rom f lowing to create a short circuit between the electrodes when the layers of solder are heated to 20 temperatureg at which they are molten during installation of the device/ e.g. on a printed circuit board.
In a second aspect, the present invention provides an electrical device which ~1Vt:L~:~ -'' the problem that permanent 25 markings cannot be made on a device whose entire upper surface is covered by a layer of a solder which melt6 when the device is installed. The devices of the second aspect o~ the invention comprise (1) a laminar PTC resistive element which has a first face and second face;
(2) a first laminar electrode which has (i) an inner face which contacts the first face of the PTC element and (ii) an outer face;

WO 9~/31816 2 1 9 ~ 3 6 ~ . ~lIIJ ,'.'C~G7 (3) a 3econd laminar electrode which has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face;
(4) an additional laminar rf~nf~ t;ve member which (a) has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face, and 0 (b) is spaced apart from the second electrode;
the PTC element, the first electrode and the additional conductive member def ining an aperture which runs between the first electrode and the additional conductive member, through the PTC element;
(5) a transverse conductive member which (a) i8 composed of metal, (b) lies within the aperture, and (c) is physically and electrically connected to the f irst electrode and the additional conductive 2s member;
(6) a first layer of solder which is secured to the outer face of the additional conductive member;
(7) a second layer of solder which is secured to the outer face of the second electrode;
(8) a third layer of solder which is secured to the outer f ace of the f irst electrode around the transverse 3s conductive member; and (g) a masking member which Wo 9S/31816 2 1 9 0 3 ~ 1 F~~ 7 (a) is composed of a solid material, and (b) is secured to the outer face of the first electrode S adj acent to the third layer of solder .
In one emoodiment of the second aspect of the invention, the masking member can be one which remains in place after the device has been installed and which (a) extends so that the second and third layers of solder do not overlap (when viewing the device at right angles to its princip~l plane), and/or (b) carries ;rlPnt;f1cation marks.
The masking member can be composed of a non-conductive material or a conductive material, e . g . a solder having a melting point subst~nt;~l ly higher than the solder in the 20 first, second and third layers of solder.
In another embodiment of the second aspect of the invention, the masking member i8 stripped of f the f irst electrode before the device is installed. In th~ s case also, 2s the masking member can extend so that the second and third layers of solder do not overlap . Af ter the masking member has been stripped of ~ nt;f;cation marks can, if desired, be placed on the exposed 8urface of the first electrode, or on a metallic layer plated thereon.
The devices of the first aspect of the invention preferably include a third layer o~ solder which is secured to the outer face of the first electrode around the transverse conductive member. The third layer can extend over the whole 3s . of the outer face of the first electrode, but in order to reduce the danger of short circuits caused by molten solder dripping over the edge of the device, the third layer WO9~/31816 21 90361 r~ 7 .
preferably extends over part only of the first electrode, especially so that the third layer of solder does not overlap the second layer of solder (when viewing the device at right angles to its principal plane). In order to confine the third s layer of solder to preferred areas of the first electrode, the masking member preferably (a) is secured to the outer face of the first electrode before the third layer of solder is applied thereto and (b) remains solid at temperatures at which the first, second and third layers of solder are molten. The o masking member can be composed of an electrically insulating material, e.g. a crosslinked organic polymer, or a conductive material, e . g . a solder having a higher melting point than the first, second and third layers of solder. The masking member can also carry identification marks, e.g. screen-printed onto an organic polymer masking member or laser-marked onto a high-melting solder masking member.
The invention also includes processes in which devices according to the f irst or second aspect of the invention are 20 installed on a printed circuit board or other electrical substrate comprising spaced-apart electrical conductors. The conductors on the substrate preferably become connected to the additional conductive member and the second electrode respectively by soldered connections formed by ref lowing the 2s first and second layers of solder.
The invention also; n~ d~'R printed circuit boards and other electrical gubstrates comprising spaced-apart electrical conductors which are connected to a device according to the 30 first or second aspect of the invention, the conductors being connected to the additional conductive member and the second electrode respectively by soldered connections.
As indicated above, the devices of this invention are 3s preferably prepared by a process in which an assembly corresponding to a large number of devices iB prepared, by successive treatments of a laminate of a PTC resistive member .. . . . .. . , _ _ _ _ _ _ WO 95/31816 2 l 9 0 3 6 1 r~~ 5~G7 and upper and lower co~nductive members, thus simultaneously creating the various components of all the devices; and thereafter dividing the assembly into the individual devices.
Depending upon the facilities available at different s locations, the demands of manufacture, transportation and storage, and other factors, the assembly may be transported, sold or stored at different 6tages in its transformation into individual devices. Accordingly, these novel assemblies form part of the present invention. The treatment steps include 0 removal of strips of at least one of the conductive members 80 as to provide, in the final devices, the spaced-apart additional conductive member and second electrode. Such removal is preferably accomplished by removal of strips from both conductive members, in order to ensure that the assembly retains balanced physical properties.
A preferred assembly of the invention comprises (1) a laminar PTC resistive member which has a first face and second face;
(2) a plurality of upper laminar conductive members, said upper members ~being in the form of spaced-apart strips which are parallel to each other, adj acent pairs of 2s said upper members defining, with intermediate portions of the resistive element, a plurality of upper parallel channels, and each of said upper members having (i) an inner face which contacts the first face of the PTC
member and (ii) an outer face;
~
(3) a plurality of lower laminar conductive members, said lower members being in the form of spaced-apart strips which are parallel to each other and to the upper members, adjacent pairs of said lower members defining, 3s with int~ te portions of the resistive element, a plurality of lower parallel ~-h~nn~ , and each of said lower members having (i) an inner face which contacts WO 95/31816 2 1 9 0 3 6 ~ P~ '7 the first face of the PTC member and (ii) an outer face;
the PTC member and the laminar conductive members def ining a s plurality of spaced-apart apertures each of which runs between at least one of the upper rrn~ rt; ve members and at least one of the lower conductive members, through the PTC member;
(4 ) a plurality of spaced-apart transverse conductive 0 members each of which (a) is composed of metal, (b) lies within one of said apertures, and5 (c) is physically and electr;rAlly connected to at least one of the upper conductive members and at least one of the lower conductive members;
(5) a plurality of spaced-apart non-conductive separation members, the separation members being in the form of spaced-apart strips which are parallel to each other and to the upper and lower members, each of the separation members filling one of said upper or lower 2s parallel rhAnnrl ~ and F~rt~nrl;nr over part of the outer faces of the members defining the channel; and (6) a plurality of spaced-apart non-conductive masking members, the masking members being in the form of spaced-apart strips which (i) are parallel to each other and to the upper and lower members and (ii) alternate with, and are spaced apart from, the separation members, so that ad]acent separation and masking members, with intervening portions of the resistive element, define a plurality of contact areas each of which includes at least one of said apertures _ _ . . . .. .. . _ _ _ _ _ .

?
W0 95/31816 1 9 0 3 6 1 r~ .,J'C5~,C7 In this preferred asgembly, the cross-conductors are preferably formed by plating layers of metal onto the interior surfaces of the apertures. The plating on the apertures is _ preferably carried out on the assembly before removing strips s from the upper and lower conductive members in order to create the upper and lower channel8. This creates layers of plating on at least some, and preferably all, of the outer surfaces of the upper and lower member6 . Af ter the upper and lower ~h~lnn~l f; have been created, e.g. by etching strips from the (optionally plated) up~er and lower conductive members, the separation members are formed (e.g. by photopolymerization of selected areas of a photo-resist, followed by removal of non-polymerized material), and solder is then applied, e.g.
plated, onto the contact areas between the separation members.
The invention is described belo~ chiefly by reference to PTC circuit protection ~evices which comprise a laminar PTC
element composed of a PTC conductive polymer and two laminar electrodes secured directly to the PTC element, and to the 20 production of such devices. It is to be understood, however, that the description i8 also applicable, insofar as the context permits, to other electrical devices ~t~nt::lin;n~ PTC
conductive polymer f~l ~ t~, to electrical devices containing PTC ceramic elements, and to other electrical devices 2s comprising two laminar~ electrodes with a laminar electrical element between them.
A8 described and claimed below, and as illustrated in the acco~panying drawings, the present invention can rnake use of a 30 number of particular features. Where such a feature is disclosed in a particular context or as part of a particular combination, it can also be used in other contexts and in other combinations, including for example other combinations of two or more such features.
3s Materials which are suitable for use as separation members and masking members include polyesters and a wide WO 9~/31816 2 1 9 0 3 6 1 ~ 7 variety of other polymers, optionally mixed with other ingredients. Such materials are well known, as also are methods of using them to produce members of desired t~ kn.-c~
and shape, e.g. by photo-resist and photo-imaging techniques.
S
The PTC compositions used in the present invention are preferably conductive polymers which comprise a cry~talline polymer component and, dispersed in the polymer component, a particulate filler component which comprises a conductive o filler, e.g. carbon black or a metal. The composition can also contain one or more other components, e.g. a non-conductive filler, an antioxidant, crosslinking agent, coupling agent or elastomer. For use in circuit protection devices, the PTC
composition preferably has a resi6tivity at 23C of less than 50 ohm-cm, particularly less than 10 ohm-cm, especially less than 5 ohm-cm. Suitable conductive polymers for use- in this invention are disclosed for example in U. S . Patent Nos .
4,237,441, 4,304,987, 4,388,607, 4,514,620, 4,534,889, 4,545,926, 4,560,498, 4,591,700, 4,724,417, 4,774,024, 4, 935 ,156, and 5, 049, 850 .
The PTC resistive element is preferably a laminar element, and can be composed of one or more conductive polymer members, at least one of which is composed of a PTC material.
2s When there is more than one conductive polymer member, the current preferably flows sequentially through the different compositions, as for example when each composition is in the f orm of a layer which extends across the whole device . When there is more than one PTC composition, the PTC element will 30 usually be prepared by joining together, eg. laminating by means of heat and pressure, elements of the different compositions. For example, a PTC element can compri~e two laminar elements composed of a first PTC composition and, sandwiched between them, a laminar element composed of a 3s second PTC composition having a higher resistivity than the f irst .

Wo 95131816 2 ~ 9 0 3 6 1 ~ 7 ~qhen a PTC device is tripped, most of the voltage dropped over the device is normally dropped over a relatively small part of the device which is referred to as the hot line, hot plane or hot zone. In the devices of the invention, the PTC
s element can ha~e one or more features which help the hot line to form at a desired location, usually spaced apart from both electrodes. Suitable features of this kind for use in the present invention are~disclosed for example in l~.S. Patents Nos. 4,317,027, 4,352,083, 4,907,340 and 4,924,072.

Particularly useful devlces comprise two metal foil electrodes, and a PTC rr~n~ ;ve polymer element sandwiched between them, especially such devices which are used as circuit protection devices and have low resistance at 23C, generally less than 10 ohm, particularly less than 3 ohm, especially less than 0.5 ohm. Particularly suitable foil electrodes are mlcror~ugh metal foil electrodes, in~ ;n~ in particular electrodepo--sited nickel foils and nickel-plated electrodeposited copper foil electrodes, in particular as disclosed in U.S Patents Nos. 4,689,475 and 4,800,253. A
variety of laminar devices which can be modif ied in accordance with the present invention are disclosed in ~J. S . Patent Nos .
4,238,812, 4,255,798, 4,272,471, 4,315,237, 4,317,027, 4, 330, 703, 4, 426, 633, 4, 475, 138, 4, 724, 417, 4, 780, 598, 2s 4,845,838, 4,907,340, and 4,924,074. The electrodes can be modified so as to proauce desired thermal effects.
The electrodes are preferably secured directly to the PTC
resistive element.
AI-erture~ anfl ~'ross-(2~n~ tors The term "aperture" i~ used herein to denote an opening which 3s (a) has a closed cross section, e.g. a circle, an oval, or a generally rectangular shape, or WO 95/31816 2 19 ~ 3 6 1 r~ J~
.

(b) has an open reentrant cross section which (i) has a depth at least 0.15 times, preferably at least 0.5 times, particularly at lea8t l . 2 times, the maximum s width of the cross section, e.g. a quarter circle or a half circle or an open-ended slot, and/or (ii) has at least one part where the opposite edges of the cross section are parallel to each other.
o In assemblies of the invention which can be divided into a plurality of electrical devices, the aperture8 will normally be of clo8ed cross section, but if one or more of the lines of division passes through an aperture of closed cross section, then the apertures in the resulting device6 will then have --open cross sections.
The aperture can be a circular hole, and for many purposes this is satisfactory in both individual devices and assemblies of devices.
The aperture can be as small as is convenient for a cross-conductor having the necessary current - carrying capacity . For circuit protection devices, holes of diameter 0 . l to 5 mm, preferably 0.15 to 2s l.0 mm, e.g. 0.2 to 0.5 mm, are generally satisfactory.
Generally a single cross-conductor is all that is needed to make an electrical connection to the first electrode from the opposite side of the device. However, two or more cross-co~ductors can be used to make the same connection.
The aperture i8 preferably formed by drilling, or any other appropriate technique, and then plated with a single metal or a mixture of metals, in particular a solder, to provide the cross-conductors.
For additional details of the PTC compositions, laminar electrodes, apertures and crose-conductors, assemblies and _ ... .. . . , _ _ . _ _ _ , , _ _ , WO 95/31816 2 1 9 0 3 6 1 . Ci/.~ 7 processes which can be used in the present invention, and of the dimensions, resistance and installation of the devices of this invention, reference should be made to International Application No. PCT/US94/1013~, bearing in mirld any modif icatione that may be necegsary in order to make use of masking and/or separating materials in accordance with this invention .
The invention is illustrated in the accompanying o drawings, in which the size of the apertures and the thicknesses of the components have been exaggerated in the interests of clarity. Figures 1 to 5 are diagrammatic partial cross-sections through a laminated plaque as it is converted into an assembly which can be divided into a plurality of individual devices of the invention by shearing it along the broken lines and along lines at right angles thereto (not shown in the Figures). A diagrammatic partial plan view of the assembly of Figure 3 is shown in Figure 7 of International Application No. PCT/US94/10137.
Figure 1 shows an assembly containing a laminar PTC
element 7 composed of a PTC ~ n~ r~; ve polymer and having a first face to which metal foil 3 l8 attached and a second face to which metal foil 5 is attached. A plurality of round 2s apertures, arranged in a regular pattern, have been drilled through the assembly. Figure 2 shows the assembly of Figure 1 after electroplating it with a metal which forms cross-conductors 1 on the surfaces of the apertures and metal layers 2 on the outer faces of the foils 3 and 5. Figure 3 shows the assembly of Figure 2 after etching the plated foils 3 and 5 80 as to divide them into a plurality of upper members 30 and a plurality of lower members 50, with adjacent pairs of euch members 112f;n;n~, with intermediate portions of the PTC
element 7, a plurality of upper and lower parallel ~h~nnf~
3s Figure 4 shows the assembly of Figure 3 after the formation, by a photo-resiet procees, of (a) a plurality of parallel separation members 8 which fill the upper and lower f-h:~nn~

WO 95131816 15 ~ 'CS~C7 and extend over part of the outer faces of the adjacent members 30 or 50, and (b) a plurality of parallel masking members 9 placed so that adj acent separation and masking members defi~e, with the PTC element 7, a plurality of contact 5 areas. Figure 5 shows the asse~bly of Figure 4 after electroplating it with a solder 80 as to form layers of solder 61 and 62 on the contact areas and also layers of solder on the cross-conductors. It will be 8een that the contact areas are arranged 80 that when an individual device is prepared by o dividing up the asgembly, the solder layers overlap only in the vicinity of the crogs-conductor, 80 that if any solder flows from top to bottom of the device, while the device is being installed, it will not contact the layer of solder on the second electrode.

Figures 6-10 are diagrammatic cros8-sections through devices of the invention having a rectangular or square shape when viewed in plan. In each of Figures 6-10, the device includes a laminar PTC element 17 having a f irst f ace to which 20 first metal foil electrode 13 is attached and a second face to which second metal foil electrode 15 is attached. Also attached to the second face of the PTC element is an additional metal foil conductive member 49 which is not electrically connected to electrode 15. Cross-conductor 51 2s lies within an aperture def ined by f irst electrode 13, PTC
element 17 and additional member 49. The cross-conductor is a hollow tube formed by a plating process which also results in platings 52, 53 and 54 on the surfaces of the electrode 13, the electrode 15 and the additional member 49 respectively 30 which were exposed during the plating process. In addition, layers of solder 64, 65, 66 and 67 are present on (a) the first electrode 13 in the region of the cross-conductor 51, (b) the additional member 49, (c) the second electrode 15, and (d) the cross-conductor 51, respectively.
Figure 6 also shows a masking member 81 composed of a solder having a melting point substantially higher than the .. . _ _ . . . ... , . .. . , . . , ., . , ,, _ _ _ _ _ _ _ _ .

Wo 9S/31816 2 ~ 9 0 3 6 1 ~ ~G7 solder of layers 64, 65, 66 and 67 The masking member 81 is put in place before the layers 64, 65, 66 and 67 and thus masks the electrode ~ so that the solder layer 64 does not overlap the solder layer 66 The member 81 can also serve as s a site for r~ n~nt marking of the device. The member 81 can alternatively be composed of an electrically insulating material which does not f low when the device is installed .
Figure 7 is a product obtained f rom a device as shown in o Figure 6 by removing the masking member 81, thus exposing part of the plated first electrode 13 which can be used as a site for permanent marking of the device.
Figure 8 is similar to Figure 7 but also includes a separation member 85 which (a) is composed of an electrically insulating material 85, (b) fills the channel between second electrode 15 and additional member 49, and (c) extends over part of electrode 15 and member 49, 80 that the solder layers 65 and 66 are less extensive.
Figure 9 is the same as Figure 8 except that it also ~nntA;n~ masking member 82 which is composed of an electrically insulating material.
2s Figure ~o is similar to Figure 9 but is a symmetrical device which can be connected in the same way from either side of the device.
The invention is illustrated by the following Example .
A conductive polymer composition was prepared by pre 3s blending 48 . 696 by weight high density polyethylene (PetrotheneW L~3 832, available from USI) with 51.49~ by weight carbon black (Raven'M 430, available from Columbian Chemicals), WO95/31816 2 ~ 9036 ~ r~ll11~5~v~G7 .

mixing the blend in a BanburylM mixer, extruding the mixed compound into pellets, and extruding the pellets though a 3 . 8 cm ~1.5 inch) extruder to produce a sheet with a thickness of 0.25 mm (0.010 inch~. The extruded sheet was cut into 0.31 x 0 . 41 meter (12 x 16 inches) pieces and each piece was stacked between two sheets of 0 . 025 mm (0 . 001 inch) thick electrodeposited nickel foil (available from Fukuda). The layers were laminated under heat and pressure to form a plaque with a thickness of about 0.25 mm (0 . 010 inch) . Each plaque 0 was irradiated to 10 Mrad. Each plaque was used to prepare a large number of devices by the following process.
Holes of diameter 0.25 mm (0.01 inch) were drilled through the plaque in a regular pattern which provided one hole for each device. The holes were cleaned, and the plaque was then treated so that the exposed surfaces of the foils and of the holes were given an electroless copper plating and then an electrolytic copper plating about 0 . 076 mm (0 . 003 inch) thick.
After cleaning the plated plaque, photo resists were used to produce masks over the plated oils except along parallel strips corresponding to the gaps between the additional conductive members and the second electrodes in the devices.
The exposed strips were etched to remove the plated foils in 2s those areas, and the masks removed.
After cleaning the etched, plated plaque, a masking material was scree~-printed and tack-cured on one side of the plaque and then screen-printed and tack-cured on the other ~=
side of the plaque. The screen-printed masking material was in approximately the desired f inal pattern, ~ut somewhat oversize. The final pattern was produced by photo-curing precisely the desired parts of the masking material through a mask, followed by washing to remove the masking material which 3s had not been fully cured. On each side of the plaque, the fully cured material masked (a) the areas corresponding to the first electrode in each device, except for a strip cf~nt~;n1ng . . ~

WO95/31816 21 ~0361 F_l/us,'.~~ ~7 the cross-conductor, (b) the etched strips, (c) the areas corresponding to the second electrode, except f or a strip at the end remote from the cross-conductor, and (d) the areas corresponding to the additional nnntl1ln~;ve member except for a strip adjacent to the cross-conductor.
The masking material was then marked (e . g . with an electrical rating and/or a lot number) by screen-printing an ink, followed by curing the ink, in the areas corresponding to o the first electrode (which provides the top surface of the installed device).
The areas of the plaque not covered by masking material were then electrolytically plated with tin/lead (63/37) solder to a thickness of about 0.025 mm (O.OOl inch).
Finally, the plaque was sheared and diced to divide it up into individual devices.

Claims (10)

19
1. An electrical device which comprises (1) a laminar PTC resistive element which has a first face and second face;
(2) a first laminar electrode which has (i) an inner face which contacts the first face of the PTC element and (ii) an outer face;
(3) a second laminar electrode which has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face;
(4) an additional laminar conductive member which (a) has (i) an inner face which contacts the second face of the PTC element and (ii) an outer face, and (b) is spaced apart from the second electrode;
the PTC element, the first electrode and the additional conductive member defining an aperture which runs between the first electrode and the additional conductive member, through the PTC element;
(5) a transverse conductive member which (a) is composed of metal, (b) lies within the aperture, and (c) is physically and electrically connected to the first electrode and the additional conductive member;

(6) a first layer of solder which is secured to the outer face of the additional conductive member;
(7) a second layer of solder which is secured to the outer face of the second electrode; and (8) a separation member which (a) is composed of a solid, non-conductive material, (b) lies between the first and second layers of solder, and (c) remains solid at temperatures at which the layers of solder are molten.
2. A device according to Claim 1 which is rectangular in shape, wherein the aperture has a closed cross section, and wherein the separation member is in the form of a bar which crosses the full width of the device.
3. A device according to Claim 1 wherein the resistive element is composed of a conductive polymer exhibiting PTC
behavior and the laminar electrodes and the additional laminar conductive member are metal foils.
4. A device according to Claim 1 which comprises a third layer of solder which is secured to the outer face of the first electrode around the transverse conductive member.
5. A device according to Claim 4 which comprises a masking member which (a) is composed of a solid material, and (b) is secured to the outer face of the first electrode adjacent to the third layer of solder
6. A device according to Claim 5 wherein the masking member (a) remains solid at temperatures at which the first, second and third layers of solder are molten, and (b) carries identification marks.
7. A device according to Claim 4 wherein the third layer of solder does not overlap the second layer of solder.
8. A device according to Claim 1 wherein the transverse conductive member comprises a metal layer which is plated onto the aperture and wherein there are layers of the same metal plated onto the outer faces of the upper and lower member.
9. An assembly which comprises (1) a laminar PTC resistive member which has a first face and second face;
(2) a plurality of upper laminar conductive members, said upper members being in the form of spaced-apart strips which are parallel to each other, adjacent pairs of said upper members defining, with intermediate portions of the resistive element, a plurality of upper parallel channels, and each of said upper members having (i) an inner face which contacts the first face of the PTC
member and (ii) an outer face;
(3) a plurality of lower laminar conductive members, said lower members being in the form of spaced-apart strips which are parallel to each other and to the upper members, adjacent pairs of said lower members defining, with intermediate portions of the resistive element, a plurality of lower parallel channels, and each of said lower members having (i) an inner face which contacts the first face of the PTC member and (ii) an outer face;
the PTC member and the laminar conductive members defining a plurality of spaced-apart apertures each of which runs between at least one of the upper conductive members and at least one of the lower conductive members, through the PTC member;
(4) a plurality of spaced-apart transverse conductive members each of which (a) is composed of metal, (b) lies within one of said apertures, and (c) is physically and electrically connected to at least one of the upper conductive members and at least one of the lower conductive members;
(5) a plurality of spaced-apart non-conductive separation members, the separation members being in the form of spaced-apart strips which are parallel to each other and to the upper and lower members, each of the separation members filling one of said upper or lower parallel channels and extending over part of the outer faces of the members defining the channel; and (6) a plurality of spaced-apart non-conductive masking members, the masking members being in the form of spaced-apart strips which (i) are parallel to each other and to the upper and lower members and (ii) alternate with, and are spaced apart from, the separation members, so that adjacent separation and masking members, with intervening portions of the resistive element, define a plurality of contact areas each of which includes at least one of said apertures.
10. An assembly according to Claim 13 wherein the laminar PTC
resistive member is composed of a conductive polymer exhibiting PTC behavior, the laminar conductive members are metal foils, and each of the transverse conductive members comprises a metal layer which is plated onto the aperture, and wherein there are layers of the same metal plated onto the outer faces of the upper and lower conductive members.
CA002190361A 1994-05-16 1995-05-04 Electrical devices comprising a ptc resistive element Abandoned CA2190361A1 (en)

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US24291694A 1994-05-16 1994-05-16
US08/242,916 1994-05-16

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EP (2) EP0853323A3 (en)
JP (1) JPH10500255A (en)
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CA (1) CA2190361A1 (en)
DE (1) DE69504333T2 (en)
WO (1) WO1995031816A1 (en)

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CN1275778A (en) 2000-12-06
JPH10500255A (en) 1998-01-06
DE69504333T2 (en) 1999-05-12
EP0760157A1 (en) 1997-03-05
US6292088B1 (en) 2001-09-18
CN1171245C (en) 2004-10-13
CN1148441A (en) 1997-04-23
EP0760157B1 (en) 1998-08-26
DE69504333D1 (en) 1998-10-01
US5831510A (en) 1998-11-03
WO1995031816A1 (en) 1995-11-23
EP0853323A3 (en) 1998-09-02
EP0853323A2 (en) 1998-07-15
CN1054941C (en) 2000-07-26

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