CA2205734A1 - Method of treating polyolefin - Google Patents
Method of treating polyolefinInfo
- Publication number
- CA2205734A1 CA2205734A1 CA002205734A CA2205734A CA2205734A1 CA 2205734 A1 CA2205734 A1 CA 2205734A1 CA 002205734 A CA002205734 A CA 002205734A CA 2205734 A CA2205734 A CA 2205734A CA 2205734 A1 CA2205734 A1 CA 2205734A1
- Authority
- CA
- Canada
- Prior art keywords
- polyolefin
- ligand
- bis
- dimethylsilylene
- ligands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920000098 polyolefin Polymers 0.000 title claims abstract description 192
- 238000000034 method Methods 0.000 title claims abstract description 47
- 239000003446 ligand Substances 0.000 claims abstract description 113
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 claims abstract description 33
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 150000003623 transition metal compounds Chemical class 0.000 claims abstract description 22
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001301 oxygen Substances 0.000 claims abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 5
- 150000002978 peroxides Chemical class 0.000 claims abstract description 5
- 239000008188 pellet Substances 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 29
- 239000011261 inert gas Substances 0.000 claims description 14
- 238000002425 crystallisation Methods 0.000 claims description 12
- 230000008025 crystallization Effects 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000011161 development Methods 0.000 abstract description 21
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000003292 diminished effect Effects 0.000 abstract 1
- -1 (substituted) cyclopentadienyl group Chemical group 0.000 description 113
- 239000000843 powder Substances 0.000 description 38
- 239000004698 Polyethylene Substances 0.000 description 24
- 239000007789 gas Substances 0.000 description 24
- 229920000573 polyethylene Polymers 0.000 description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 125000005843 halogen group Chemical group 0.000 description 5
- 125000005647 linker group Chemical group 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000001181 organosilyl group Chemical class [SiH3]* 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 3
- 150000008282 halocarbons Chemical group 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000003624 transition metals Chemical group 0.000 description 2
- 125000004955 1,4-cyclohexylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([H])C([H])([H])C1([H])[*:2] 0.000 description 1
- BFFQFGGITJXTFP-UHFFFAOYSA-N 3-methyldioxetane Chemical compound CC1COO1 BFFQFGGITJXTFP-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000518994 Conta Species 0.000 description 1
- 102000018361 Contactin Human genes 0.000 description 1
- 108060003955 Contactin Proteins 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002102 aryl alkyloxo group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical group C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000002097 pentamethylcyclopentadienyl group Chemical group 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000109 phenylethoxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- XMGMFRIEKMMMSU-UHFFFAOYSA-N phenylmethylbenzene Chemical group C=1C=CC=CC=1[C]C1=CC=CC=C1 XMGMFRIEKMMMSU-UHFFFAOYSA-N 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000037048 polymerization activity Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F6/00—Post-polymerisation treatments
- C08F6/02—Neutralisation of the polymerisation mass, e.g. killing the catalyst also removal of catalyst residues
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F6/00—Post-polymerisation treatments
- C08F6/06—Treatment of polymer solutions
- C08F6/08—Removal of catalyst residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/16—Auxiliary treatment of granules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F10/00—Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F6/00—Post-polymerisation treatments
- C08F6/26—Treatment of polymers prepared in bulk also solid polymers or polymer melts
- C08F6/28—Purification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/16—Auxiliary treatment of granules
- B29B2009/168—Removing undesirable residual components, e.g. solvents, unreacted monomers; Degassing
Abstract
A method of treating polyolefin comprises (i) a ligand-decomposition step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer, such as water, oxygen, alcohol, alkylene oxide or peroxide, to decompose the ligands contained in the polyolefin, and (ii) a ligand-removal step of heating the polyolefin contacted with the ligand decomposer to remove the decomposed ligands from the polyolefin.
According to this method, the residual ligands having cyclopentadienyl skeleton, which are contained in the polyolefin produced by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, are decomposed and removed from the polyolefin, whereby polyolefin diminished in odor development in the molding process can be obtained.
According to this method, the residual ligands having cyclopentadienyl skeleton, which are contained in the polyolefin produced by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, are decomposed and removed from the polyolefin, whereby polyolefin diminished in odor development in the molding process can be obtained.
Description
CA 02205734 1997-0~-20 TITLE
METHOD OF TREATING POLYOLEFIN
FIELD OF THE INVENTION
The present invention relates to a method of treating polyolefin, and more particularly to a method of removing residual ligands having cyclopentadienyl skeleton from polyolefin obtained by the use of a transition metal compound cont~;n;ng ligands having cyclopentadienyl skeleton.
BACKGROUND OF THE INVENTION
Processes for preparing polyolefins using transition metal compounds such as metallocene compounds have been recently paid much attention. The transition metal compounds are characterized in that when they are used as a catalyst component for olefin polymerization, they exhibit a high polymerization activity and the resulting polymer has a narrow molecular weight distribution.
Meanwhile, in polyolefins which are obtained by the use of such transition metal compounds as mentioned above, the transition metal compounds used as the catalyst component are contained. Ligands of the transition metal compounds are residual groups of cyclic compounds having conjugated double bond of cyclopentadienyl skeleton, so that they sometimes become sources of odor development when they are thermally processed, and besides the odor development may have bad influences on flavor, etc. in a field of foods where delicate smell or taste is considered as important. Therefore, the polyolefins obtained by the use of the transition metal compounds are sometimes restricted in their uses.
As a method of treating resins to inhibit odor development of the resins in the molding process, for example, a method of drying resin pellets over an inert gas to remove the ligands has been proposed in Japanese Patent Laid-Open Publication No. 157486/1975, or a method of 10 treating resin pellets with a hot water column to remove the ligands has been proposed in Japanese Patent Publication No. 18521/1982.
By the conventional technique, however, odor development cannot be sufficiently inhibited because of 15 insufficient removal of the ligands, or the removal of the ligands needs much time or large energy.
Under such circumstances as described above, the present inventors have earnestly studied, and as a result, they have found that the ligands, which are sources of odor 20 development, can be efficiently removed by the method comprising the steps of contacting polyolefin with a ligand decomposer such as water, alcohol or the like to decompose the residual ligands contained in the polyolefin and heating the polyolefin contacted with the ligand 25 decomposer. Based on the finding, the present invention has been accomplished.
OBJECT OF THE INVENTION
CA 0220~734 1997-0~-20 It is an object of the present invention to provide a method of treating polyolefin, by which residual ligands having cyclopentadienyl skeleton, which are contained in polyolefin obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, can be decomposed and removed from the polyolefin to thereby obtain polyolefin ~;m;n; shed in odor development in the molding process.
SUMMARY OF THE INVENTION
The method of treating polyolefin according to the present invention comprises:
(i) a step of contacing polyolefin, which is obtained by the use of a transition metal compound, with a ligand decomposer, and (11) a step of heating the polyolefin contacted with the ligand decomposer.
Particularly, the method of treating polyolefin according to the invention comprises:
(i) a ligand-decomposition step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer to decompose the ligands contained in the polyolefin, and (ii) a ligand-removal step of heating the polyolefin contacted with the ligand decomposer to remove the decomposed ligands from the polyolefin.
CA 0220~734 1997-0~-20 The ligand decomposer is at least one compound selected from the group consisting of water, oxygen, alcohol, alkylene oxide and peroxide.
The mean particle diameter of the polyolefin in the ligand-decomposition step is desirably in the range of 50 to 5,000 ~m. In the ligand-decomposition step, the polyolefin is contacted with, for example, a gaseous stream containing the ligand decomposer.
The heating temperature in the ligand-removal step is 0 not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, in the event that the polyolefin has a crystallinity of not less than 40 %; and the heating temperature in said step is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, in the event that the polyolefin has a crystallinity of less than 40 %.
Further, the heating temperature in the ligand-removal step is not lower than the crystallization temperature of the polyolefin and not higher than the melting point of the polyolefin, in the event that the polyolefin has a crystallinity of not less than 40 %; and the heating temperature in said step is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin (i.e., heating temperature 2 melting point -15 ~C) and not higher than the melting point of the CA 0220~734 1997-0~-20 polyolefin, in the event that the polyolefin has a crystallinity of less than 40 %.
The ligand-removal step is, for example, a step in which the polyolefin contacted with the ligand decomposer is heated at a temperature of not lower than the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, with applying a shear force to the polyolefin.
The ligand-removal step is, for example, a step 0 comprising:
(a) a step of melting, by heating, the polyolefin contacted with the ligand decomposer to prepare pellets of the polyolefin, and any one of (b-l) a step of contacting the pellets with hot water, (b-2) a step of contacting the pellets with water vapor and (b-3) a step of maintain;ng the pellets at a pressure of 0.001 to 0.098 MPa.
The method of treating polyolefin according to the invention includes a step of decomposing ligands having cyclopentadienyl skeleton contained in the polyolefin and a step of removing the decomposed ligands, and therefore polyolefin ~;m;n;shed in odor development in the molding process can be obtained.
BRIEF DESCRIPTION OF THE DRAWING
Fig. 1 is a conceptual view showing steps of one embodiment of the method of treating polyolefin according to the present invention.
CA 0220~734 1997-0~-20 Fig. 2 is a conceptual view showing steps of another embodiment of the method of treating polyolefin according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
The method of treating polyolefin according to the invention is described in detail hereinafter.
The method of treating polyolefin according to the invention comprises:
(i) a step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer, and (ii) a step of heating the polyolefin contacted with the ligand decomposer.
The polyolefin used in the invention is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton. Examples of the transition metal compounds cont~;n;ng ligands having cyclopentadienyl skeleton include a transition metal compound cont~;n;ng two ligands having cyclopentadienyl skeleton, which is represented by the following formula (I), and a transition metal compound cont~;n;ng bidentate ligand formed from two ligands having cyclopentadienyl skeleton bonded through a divalent bonding group, which is represented by the following formula (II).
CA 0220~734 1997-0~-20 M
Cp2 R2 (I) In the above formula, M is a transition metal atom of Group 4 of the periodic table, i.e., titanium, zirconium or hafnium; Cpl and Cp2 may be the same or different and are each a ligand having cyclopentadienyl skeleton, which is coordinated to the transition metal atom; and Rl and R2 may be the same or different and are each a hydrocarbon group of 1 to 20 carbon atoms, an alkoxy group, an aryloxy group, 0 a trialkylsilyl group, a halogen atom or a hydrogen atom.
Cpl R
Y M
\ / \
Cp2 R2 (II) In the above formula, M, Cpl, Cp2, Rl and R2 are the same as those in the formula (I); and Y is a divalent bonding group such as alkylene or silylene.
In the polyolefin obtained by the use of the transition metal compounds contA;n;ng ligands having cyclopentadienyl skeleton, some ligands having cyclopentadienyl skeleton remain.
Examples of the ligands (i.e., groups) having cyclopentadienyl skeleton include a (substituted) cyclopentadienyl group, a (substituted) indenyl group, a (substituted) fluorenyl group, and a group wherein two CA 0220~734 1997-0~-20 ligands selected from a ~substituted) cyclopentadienyl group, a (substituted) indenyl group, a (substituted) fluorenyl group are bonded through a divalent bonding group.
As the substituents of the ligands having cyclopentadienyl skeleton, there can be mentioned (halogenated) hydrocarbon groups of 1 to 20 carbon atoms, oxygen-cont~;n;ng groups, silicon-cont~in;ng groups and halogen atoms.
0 Examples of the hydrocarbon groups of 1 to 20 carbon atoms include alkyl groups, cycloalkyl groups, alkenyl groups, arylalkyl groups and aryl groups. More specifically, there can be mentioned alkyl groups, such as methyl, ethyl, propyl, butyl, hexyl, octyl, nonyl, dodecyl and eicosyl; cycloalkyl groups, such as cyclopentyl, cyclohexyl, norbornyl and adamantyl; alkenyl groups, such as vinyl, propenyl and cyclohexenyl; arylalkyl groups, such as benzyl, phenylethyl and phenylpropyl; and aryls groups, such as phenyl, tolyl, dimethylphenyl, trimethylphenyl, ethylphenyl, propylphenyl, biphenyl, naphthyl, methylnaphthyl, anthryl and phenanthryl.
Examples of the halogenated hydrocarbon groups of 1 to 20 carbon atoms include those wherein the above-exemplified hydrocarbon groups of 1 to 20 carbon atoms are substituted with halogens.
Examples of the oxygen-containing groups include hydroxyl group; alkoxy groups, such as methoxy, ethoxy, propoxy and butoxy; aryloxy groups, such as phenoxy, CA 0220~734 1997-0~-20 methylphenoxy, dimethylphenoxy and naphthoxy; and arylalkoxy groups, such as phenylmethoxy and phenylethoxy.
Examples of the silicon-cont~;n;ng groups include monohydrocarbon-substituted silyls, such as methylsilyl and phenylsilyl; dihydrocarbon-substituted silyls, such as dimethylsilyl and diphenylsilyl; trihydrocarbon-substituted silyls, such as trimethylsilyl, triethylsilyl, tripropylsilyl, tricyclohexylsilyl, triphenylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, tritolylsilyl and 0 trinaphthylsilyl; silyl ethers of the hydrocarbon-substituted silyls, such as trimethylsilyl ether; silicon-substituted alkyl groups, such as trimethylsilylmethyl; and silicon-substituted aryl groups, such as trimethylsilylphenyl.
Examples of the halogen atoms include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
Examples of the divalent bonding groups represented by Y, which serve to bond two ligands selected from the (substituted) cyclopentadienyl group, the (substituted) indenyl group and the (substituted) fluorenyl group, include a divalent hydrocarbon group of 1 to 20 carbon atoms, a divalent halogenated hydrocarbon group of 1 to 20 carbon atoms, a divalent silicon-cont~in;ng group, a divalent germanium-cont~;n;ng group, a divalent tin-cont~;n;ng group, -0-, -C0-, -S-, -SO-, -S02-, -Ge-, -Sn-, -NR-, -P(R)-, -P(O) (R)-, -B(R)- or -Al(R)- (each R may be the same or different and is a (halogenated) hydrocarbon CA 0220~734 1997-0~-20 group of 1 to 20 carbon atoms, a hydrogen atom or a halogen atom).
Examples of the divalent hydrocarbon groups of 1 to 20 carbon atoms include alkylene groups, such as methylene, S dimethylmethylene, 1,2-ethylene, dimethyl-1,2-ethylene, 1,3-trimethylene, 1,4-tetramethylene, 1,2-cyclohexylene and 1,4-cyclohexylene; and arylalkylene groups, such as diphenylmethylene and diphenyl-1,2-ethylene.
Examples of the divalent halogenated hydrocarbon 0 groups of 1 to 20 carbon atoms include those wherein the above-exemplified divalent hydrocarbon groups of 1 to 20 carbon atoms are halogenated, such as chloromethylene.
Examples of the divalent silicon-containing groups include silylene group; alkylsilylene, alkylarylsilylene and arylsilylene groups, such as methylsilylene, dimethylsilylene, diethylsilylene, di(n-propyl)silylene, di(i-propyl)silylene, di(cyclohexyl)silylene, methylphenylsilylene, diphenylsilylene, di(p-tolyl)silylene and di(p-chlorophenyl)silylene; and alkyldisilylene, alkylaryldisilylene and aryldisilylene groups, such as tetramethyl-1,2-disilylene and tetraphenyl-1,2-disilylene.
Examples of the divalent germanium-cont~;n;ng groups include those wherein silicon is replaced with germanium in the above-exemplified divalent silicon-containing groups.
Examples of the divalent tin-containing groups include those wherein silicon is replaced with tin in the above-exemplified divalent silicon-containing groups.
CA 0220~734 1997-0~-20 Examples of the ligands having cyclopentadienyl skeleton include:
cyclopentadienyl group;
substituted cyclopentadienyl groups, such as methylcyclopentadienyl, dimethylcyclopentadienyl, ethylcyclopentadienyl, methylethylcyclopentadienyl, propylcyclopentadienyl, methylpropylcyclopentadienyl, butylcyclopentadienyl, methylbutylcyclopentadienyl, trimethylcyclopentadienyl, tetramethylcyclopentadienyl, 0 pentamethylcyclopentadienyl, hexylcyclopentadienyl and trimethylsilylcyclopentadienyl;
indenyl group;
substituted indenyl groups, such as 2-methylindenyl,
METHOD OF TREATING POLYOLEFIN
FIELD OF THE INVENTION
The present invention relates to a method of treating polyolefin, and more particularly to a method of removing residual ligands having cyclopentadienyl skeleton from polyolefin obtained by the use of a transition metal compound cont~;n;ng ligands having cyclopentadienyl skeleton.
BACKGROUND OF THE INVENTION
Processes for preparing polyolefins using transition metal compounds such as metallocene compounds have been recently paid much attention. The transition metal compounds are characterized in that when they are used as a catalyst component for olefin polymerization, they exhibit a high polymerization activity and the resulting polymer has a narrow molecular weight distribution.
Meanwhile, in polyolefins which are obtained by the use of such transition metal compounds as mentioned above, the transition metal compounds used as the catalyst component are contained. Ligands of the transition metal compounds are residual groups of cyclic compounds having conjugated double bond of cyclopentadienyl skeleton, so that they sometimes become sources of odor development when they are thermally processed, and besides the odor development may have bad influences on flavor, etc. in a field of foods where delicate smell or taste is considered as important. Therefore, the polyolefins obtained by the use of the transition metal compounds are sometimes restricted in their uses.
As a method of treating resins to inhibit odor development of the resins in the molding process, for example, a method of drying resin pellets over an inert gas to remove the ligands has been proposed in Japanese Patent Laid-Open Publication No. 157486/1975, or a method of 10 treating resin pellets with a hot water column to remove the ligands has been proposed in Japanese Patent Publication No. 18521/1982.
By the conventional technique, however, odor development cannot be sufficiently inhibited because of 15 insufficient removal of the ligands, or the removal of the ligands needs much time or large energy.
Under such circumstances as described above, the present inventors have earnestly studied, and as a result, they have found that the ligands, which are sources of odor 20 development, can be efficiently removed by the method comprising the steps of contacting polyolefin with a ligand decomposer such as water, alcohol or the like to decompose the residual ligands contained in the polyolefin and heating the polyolefin contacted with the ligand 25 decomposer. Based on the finding, the present invention has been accomplished.
OBJECT OF THE INVENTION
CA 0220~734 1997-0~-20 It is an object of the present invention to provide a method of treating polyolefin, by which residual ligands having cyclopentadienyl skeleton, which are contained in polyolefin obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, can be decomposed and removed from the polyolefin to thereby obtain polyolefin ~;m;n; shed in odor development in the molding process.
SUMMARY OF THE INVENTION
The method of treating polyolefin according to the present invention comprises:
(i) a step of contacing polyolefin, which is obtained by the use of a transition metal compound, with a ligand decomposer, and (11) a step of heating the polyolefin contacted with the ligand decomposer.
Particularly, the method of treating polyolefin according to the invention comprises:
(i) a ligand-decomposition step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer to decompose the ligands contained in the polyolefin, and (ii) a ligand-removal step of heating the polyolefin contacted with the ligand decomposer to remove the decomposed ligands from the polyolefin.
CA 0220~734 1997-0~-20 The ligand decomposer is at least one compound selected from the group consisting of water, oxygen, alcohol, alkylene oxide and peroxide.
The mean particle diameter of the polyolefin in the ligand-decomposition step is desirably in the range of 50 to 5,000 ~m. In the ligand-decomposition step, the polyolefin is contacted with, for example, a gaseous stream containing the ligand decomposer.
The heating temperature in the ligand-removal step is 0 not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, in the event that the polyolefin has a crystallinity of not less than 40 %; and the heating temperature in said step is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, in the event that the polyolefin has a crystallinity of less than 40 %.
Further, the heating temperature in the ligand-removal step is not lower than the crystallization temperature of the polyolefin and not higher than the melting point of the polyolefin, in the event that the polyolefin has a crystallinity of not less than 40 %; and the heating temperature in said step is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin (i.e., heating temperature 2 melting point -15 ~C) and not higher than the melting point of the CA 0220~734 1997-0~-20 polyolefin, in the event that the polyolefin has a crystallinity of less than 40 %.
The ligand-removal step is, for example, a step in which the polyolefin contacted with the ligand decomposer is heated at a temperature of not lower than the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, with applying a shear force to the polyolefin.
The ligand-removal step is, for example, a step 0 comprising:
(a) a step of melting, by heating, the polyolefin contacted with the ligand decomposer to prepare pellets of the polyolefin, and any one of (b-l) a step of contacting the pellets with hot water, (b-2) a step of contacting the pellets with water vapor and (b-3) a step of maintain;ng the pellets at a pressure of 0.001 to 0.098 MPa.
The method of treating polyolefin according to the invention includes a step of decomposing ligands having cyclopentadienyl skeleton contained in the polyolefin and a step of removing the decomposed ligands, and therefore polyolefin ~;m;n;shed in odor development in the molding process can be obtained.
BRIEF DESCRIPTION OF THE DRAWING
Fig. 1 is a conceptual view showing steps of one embodiment of the method of treating polyolefin according to the present invention.
CA 0220~734 1997-0~-20 Fig. 2 is a conceptual view showing steps of another embodiment of the method of treating polyolefin according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
The method of treating polyolefin according to the invention is described in detail hereinafter.
The method of treating polyolefin according to the invention comprises:
(i) a step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer, and (ii) a step of heating the polyolefin contacted with the ligand decomposer.
The polyolefin used in the invention is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton. Examples of the transition metal compounds cont~;n;ng ligands having cyclopentadienyl skeleton include a transition metal compound cont~;n;ng two ligands having cyclopentadienyl skeleton, which is represented by the following formula (I), and a transition metal compound cont~;n;ng bidentate ligand formed from two ligands having cyclopentadienyl skeleton bonded through a divalent bonding group, which is represented by the following formula (II).
CA 0220~734 1997-0~-20 M
Cp2 R2 (I) In the above formula, M is a transition metal atom of Group 4 of the periodic table, i.e., titanium, zirconium or hafnium; Cpl and Cp2 may be the same or different and are each a ligand having cyclopentadienyl skeleton, which is coordinated to the transition metal atom; and Rl and R2 may be the same or different and are each a hydrocarbon group of 1 to 20 carbon atoms, an alkoxy group, an aryloxy group, 0 a trialkylsilyl group, a halogen atom or a hydrogen atom.
Cpl R
Y M
\ / \
Cp2 R2 (II) In the above formula, M, Cpl, Cp2, Rl and R2 are the same as those in the formula (I); and Y is a divalent bonding group such as alkylene or silylene.
In the polyolefin obtained by the use of the transition metal compounds contA;n;ng ligands having cyclopentadienyl skeleton, some ligands having cyclopentadienyl skeleton remain.
Examples of the ligands (i.e., groups) having cyclopentadienyl skeleton include a (substituted) cyclopentadienyl group, a (substituted) indenyl group, a (substituted) fluorenyl group, and a group wherein two CA 0220~734 1997-0~-20 ligands selected from a ~substituted) cyclopentadienyl group, a (substituted) indenyl group, a (substituted) fluorenyl group are bonded through a divalent bonding group.
As the substituents of the ligands having cyclopentadienyl skeleton, there can be mentioned (halogenated) hydrocarbon groups of 1 to 20 carbon atoms, oxygen-cont~;n;ng groups, silicon-cont~in;ng groups and halogen atoms.
0 Examples of the hydrocarbon groups of 1 to 20 carbon atoms include alkyl groups, cycloalkyl groups, alkenyl groups, arylalkyl groups and aryl groups. More specifically, there can be mentioned alkyl groups, such as methyl, ethyl, propyl, butyl, hexyl, octyl, nonyl, dodecyl and eicosyl; cycloalkyl groups, such as cyclopentyl, cyclohexyl, norbornyl and adamantyl; alkenyl groups, such as vinyl, propenyl and cyclohexenyl; arylalkyl groups, such as benzyl, phenylethyl and phenylpropyl; and aryls groups, such as phenyl, tolyl, dimethylphenyl, trimethylphenyl, ethylphenyl, propylphenyl, biphenyl, naphthyl, methylnaphthyl, anthryl and phenanthryl.
Examples of the halogenated hydrocarbon groups of 1 to 20 carbon atoms include those wherein the above-exemplified hydrocarbon groups of 1 to 20 carbon atoms are substituted with halogens.
Examples of the oxygen-containing groups include hydroxyl group; alkoxy groups, such as methoxy, ethoxy, propoxy and butoxy; aryloxy groups, such as phenoxy, CA 0220~734 1997-0~-20 methylphenoxy, dimethylphenoxy and naphthoxy; and arylalkoxy groups, such as phenylmethoxy and phenylethoxy.
Examples of the silicon-cont~;n;ng groups include monohydrocarbon-substituted silyls, such as methylsilyl and phenylsilyl; dihydrocarbon-substituted silyls, such as dimethylsilyl and diphenylsilyl; trihydrocarbon-substituted silyls, such as trimethylsilyl, triethylsilyl, tripropylsilyl, tricyclohexylsilyl, triphenylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, tritolylsilyl and 0 trinaphthylsilyl; silyl ethers of the hydrocarbon-substituted silyls, such as trimethylsilyl ether; silicon-substituted alkyl groups, such as trimethylsilylmethyl; and silicon-substituted aryl groups, such as trimethylsilylphenyl.
Examples of the halogen atoms include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
Examples of the divalent bonding groups represented by Y, which serve to bond two ligands selected from the (substituted) cyclopentadienyl group, the (substituted) indenyl group and the (substituted) fluorenyl group, include a divalent hydrocarbon group of 1 to 20 carbon atoms, a divalent halogenated hydrocarbon group of 1 to 20 carbon atoms, a divalent silicon-cont~in;ng group, a divalent germanium-cont~;n;ng group, a divalent tin-cont~;n;ng group, -0-, -C0-, -S-, -SO-, -S02-, -Ge-, -Sn-, -NR-, -P(R)-, -P(O) (R)-, -B(R)- or -Al(R)- (each R may be the same or different and is a (halogenated) hydrocarbon CA 0220~734 1997-0~-20 group of 1 to 20 carbon atoms, a hydrogen atom or a halogen atom).
Examples of the divalent hydrocarbon groups of 1 to 20 carbon atoms include alkylene groups, such as methylene, S dimethylmethylene, 1,2-ethylene, dimethyl-1,2-ethylene, 1,3-trimethylene, 1,4-tetramethylene, 1,2-cyclohexylene and 1,4-cyclohexylene; and arylalkylene groups, such as diphenylmethylene and diphenyl-1,2-ethylene.
Examples of the divalent halogenated hydrocarbon 0 groups of 1 to 20 carbon atoms include those wherein the above-exemplified divalent hydrocarbon groups of 1 to 20 carbon atoms are halogenated, such as chloromethylene.
Examples of the divalent silicon-containing groups include silylene group; alkylsilylene, alkylarylsilylene and arylsilylene groups, such as methylsilylene, dimethylsilylene, diethylsilylene, di(n-propyl)silylene, di(i-propyl)silylene, di(cyclohexyl)silylene, methylphenylsilylene, diphenylsilylene, di(p-tolyl)silylene and di(p-chlorophenyl)silylene; and alkyldisilylene, alkylaryldisilylene and aryldisilylene groups, such as tetramethyl-1,2-disilylene and tetraphenyl-1,2-disilylene.
Examples of the divalent germanium-cont~;n;ng groups include those wherein silicon is replaced with germanium in the above-exemplified divalent silicon-containing groups.
Examples of the divalent tin-containing groups include those wherein silicon is replaced with tin in the above-exemplified divalent silicon-containing groups.
CA 0220~734 1997-0~-20 Examples of the ligands having cyclopentadienyl skeleton include:
cyclopentadienyl group;
substituted cyclopentadienyl groups, such as methylcyclopentadienyl, dimethylcyclopentadienyl, ethylcyclopentadienyl, methylethylcyclopentadienyl, propylcyclopentadienyl, methylpropylcyclopentadienyl, butylcyclopentadienyl, methylbutylcyclopentadienyl, trimethylcyclopentadienyl, tetramethylcyclopentadienyl, 0 pentamethylcyclopentadienyl, hexylcyclopentadienyl and trimethylsilylcyclopentadienyl;
indenyl group;
substituted indenyl groups, such as 2-methylindenyl,
2-ethylindenyl, 2-methyl-4-phenylindenyl, 2-ethyl-4-phenylindenyl, 2,4,7-trimethylindenyl, 3-methylindenyl, 2,7-dimethyl-4-propylindenyl, 2,7-dimethyl-4-butylindenyl, 2,7-dimethyl-4-pentylindenyl, 2,7-dimethyl-4-hexylindenyl, 2,7-dimethyl-4-cyclohexylindenyl and 4,5,6,7-tetrahydroindenyl;
fluorenyl group; and substituted fluorenyl groups.
In the above examples, the di-substituted cyclopentadienyl rings include 1,2- and 1,3-position substituted cyclopentadienyl rings, and the tri-substituted cyclopentadienyl rings include 1,2,3- and 1,2,4-substituted cyclopentadienyl rings. The alkyl groups such as propyl and butyl include isomers such as n-, i-, sec- and tert-alkyl groups.
Listed below are examples of the groups wherein two ligands selected from the (substituted) cyclopentadienyl group, the (substituted) indenyl group and the (substituted) fluorenyl group are bonded through the divalent bonding group.
Methylene-bis[l-(2-methyl-4-phenylindenyl)], Methylene-bis[l-(2-ethyl-4-phenylindenyl)], Methylene-bis[l-(2-ethyl-4-naphthylindenyl)], Ethylene-bis(indenyl), Ethylene-bis(4,5,6,7-tetrahydroindenyl), Ethylene-bis[l-(2-methyl-4-phenylindenyl)], Ethylene-bis[l-(2-ethyl-4-phenylindenyl)], Ethylene-bis[l-(2-ethyl-4-naphthylindenyl)], Ethylene-bis[l-(2-propyl-4-naphthylindenyl)], Ethylene-bis[l-(2,4,7-trimethylindenyl)], Isopropylidene-(cyclopentadienyl)(fluorenyl), Isopropylidene-(cyclopentadienyl)(methylcyclopentadienyl), Isopropylidene-(methylcyclopentadienyl)(3-methylindenyl), Isopropylidene-(butylcyclopentadienyl)(3 methylindenyl), Isopropylidene-(butylcyclopentadienyl)(fluorenyl), Isopropylidene-bis[l-(2,4,7-trimethylindenyl)], Dimethylsilylene-bis(cyclopentadienyl), Dimethylsilylene-bis(methylcyclopentadienyl), Dimethylsilylene-bis(dimethylcyclopentadienyl), Dimethylsilylene-bis(trimethylcyclopentadienyl), CA 0220~734 1997-0~-20 Dimethylsilylene-bis(indenyl), Dimethylsilylene~bis(4,5,6,7-tetrahydroindenyl), Dimethylsilylene-bis(methylbutylcyclopentadienyl), Dimethylsilylene-(cyclopentadienyl)(fluorenyl), Dimethylsilylene-(butylcyclopentadienyl)(fluorenyl), Dimethylsilylene-(butylcyclopentadienyl)(indenyl), Diphenylsilylene-bis(indenyl), Dimethylsilylene-(methylcyclopentadienyl)(3-methylindenyl), 0 Dimethylsilylene-(butylcyclopentadienyl)(3-methylindenyl), Dimethylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-anthrylindenyl)], Dimethylsilylene-bis[1-(2-methyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(fluorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(pentafluorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(chlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(dichlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(bromophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(tolyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-methyl-4-(dimethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(ethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(propylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(benzylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-0 biphenylylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(trimethylsilylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-phenyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Dimethylsilylene-bis[1-(2-ethyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(2-methyl-1-naphthyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(methylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(dimethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(trimethylphenyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-ethyl-4-(chlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(dichlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(bromophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-biphenylylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(trimethylsilylphenyl)indenyl)], 0 Dimethylsilylene-bis[l-(2-propyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-(methylnaphthyl)indenyl)], Dimethylsilylene-bis[l-(2-propyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-(methylnaphthyl)indenyl)], Dimethylsilylene-bis[l-(2-butyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-pentyl-4-phenylindenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-pentyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-neopentyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-neopentyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-hexyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-hexyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-ethylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-butylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-pentylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-hexylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-cyclohexylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(methylcyclohexyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(phenylethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(phenyldichloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(chloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(trimethylsilylmethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(trimethylsiloxymethyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-methyl-4-propyl-7-ethylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-ethylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-0 pentylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-hexylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-cyclohexylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(methylcyclohexyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(trimethylsilyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(trimethylsiloxymethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(phenylethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(phenyldichloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(chloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4,6-dipropylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-propyl-7-methylindenyl)], Dimethylsilylene-bis[l-(2-phenyl-4-propyl-7-methylindenyl)], Dimethylsilylene-bis[l-(2-methylindenyl)], 0 Diethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Diethylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Diethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Methylphenylsilylene-bis(indenyl), Methylphenylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-naphthylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Methylphenylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Methylphenylsilylene-bis[l-(2,7-dimethyl-4-butylindenyl)], CA 0220~734 1997-0~-20 Methylphenylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Methylphenylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)~, Dipropylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dipropylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dipropylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], 0 Dibutylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dibutylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dibutylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dicyclohexylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dicyclohexylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dicyclohexylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-naphthylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-biphenylylindenyl)], Diphenylsilylene-bis[1-(2,7-dimethyl-4-butylindenyl)], CA 0220~734 1997-0~-20 Diphenylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2,7-dimethyl-4-ethylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-ethylindenyl)], 0 Ditolylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Ditolylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Ditolylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Di(chlorophenyl)silylene-bis[l-(2-methyl-4-phenylindenyl)], Di(chlorophenyl)silylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Di(chlorophenyl)silylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylgermylene-bis[l-(2-methyl-4-phenylindenyl)], Dimethylgermyl-bis[l-(2-ethyl-4-phenylindenyl)], Dimethylgermyl-bis[l-(2-ethyl-4-naphthylindenyl)], Dimethylgermyl-bis[l-(2-propyl-4-phenylindenyl)], and Dimethylstannylene-bis[l-(2-methyl-4-phenylindenyl)].
In the above examples, the di-substituted cyclopentadienyl rings include 1,2- and 1,3-position substituted cyclopentadienyl rings, and the tri-substituted cyclopentadienyl rings include 1,2,3- and 1,2,4-substituted CA 0220~734 1997-0~-20 cyclopentadienyl rings. The alkyl groups such as propyl and butyl include isomers such as n-, i-, sec- and tert-alkyl groups.
The polyolefins used in the present invention are obtained by the use of the transition metal compound containing the ligands having the aforementioned cyclopentadienyl skeleton, and the ligands having the cyclopentadienyl skeleton remain therein. In the present invention, the polyolefin is subjected to contact with a 0 ligand decomposer to decompose the ligands contained in the polyolefin (a ligand-decompostion step), and the polyolefin contacted with the ligand decomposer is subjected to heating to remove the decomposed ligands from the polyolefin.
Examples of the ligand decomposers employable in the ligand-decomposition step include water, oxygen, alcohols, alkylene oxides and peroxides. More specifically, there can be mentioned:
alcohols having 10 or less carbon atoms, e.g., monoalcohols, such as methanol, ethanol, propanol, isopropanol, butanol, pentanol, hexanol, heptanol, octanol, cyclopentanol and cyclohexanol, and dialcohols, such as ethylene glycol;
alkylene oxides, such as ethylene oxide, propylene oxide, trimethylene oxide, tetrahydrofuran and tetrahydropyran; and peroxides, such as propylene peroxide and butene peroxide.
CA 0220~734 1997-0~-20 Of these, preferable are water and alcohols having S
or less carbon atoms, and particularly preferable is water.
In order to contact the polyolefin with the ligand decomposer, the polyolefin is contacted with, for example, 5 a gaseous stream containing the ligand decomposer. In this event, a powder of the polyolefin is passed through a container with introducing a gas cont~;ning the ligand decomposer into the container.
The mean particle diameter of the polyolefin powder to be contacted with the ligand decomposer is in the range of usually 50 to 5,000 ~m, preferably 80 to 3,000 ~m, more preferably 100 to 2,000 ~m.
Examples of the gases to incorporate therein the ligand decomposer include inert gases such as a nitrogen gas and an argon gas.
In the gas, the ligand decomposer is contained usually in the form of vapor. The amount of the ligand decomposer contained in the ligand decomposer-cont~; n; ng gas is in the range of usually 0.1 to 40 % by weight, preferably 0.5 to 20 % by weight, particularly preferably 1 to 10 % by weight.
The superficial velocity of the ligand decomposer-containing gas in a column is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.5 to 5 cm/sec. The superficial velocity in a column is calculated from the temperature and the pressure of the ligand decomposer-containing gas at the gas exhaust vent of an apparatus used for contacting the polyolefin CA 0220S734 1997-0~-20 with the ligand decomposer and from the sectional area of the apparatus.
When the polyolefin has a crystallinity of not less than 40 %, the temperature in the contact of the polyolefin with the ligand decomposer is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C. When the polyolefin has a crystallinity of less than 40 %, the 0 temperature in the contact of the polyolefin with the ligand decomposer is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The crystallinity (Xc) of polyolefin is measured in the following manner. Polyolefin is preheated at 190 ~c for 7 minutes, and thereto is applied a pressure of 100 kg/cm2 for 2 minutes. Then, the polyolefin is cooled at 20 ~C under a pressure of 100 kg/cm2 to prepare a pressed sheet having a thickness of 5 mm. The pressed sheet is cut to give a specimen (sample) of about 5 mg, and the sample is introduced into an aluminum pan. The sample is heated from room temperature to 150 ~C at a heating rate of 10 ~C/min to measure endotherm of the sample using DSC-II of Perkin Elmer Co., whereby an endotherm curve of the sample is obtained. The endotherm curve of the sample is then converted to the quantity of heat of melting using an area CA 0220~734 1997-0~-20 of an endotherm curve of indium separately weighed. On the endotherm curve of the sample, the point at the position of 35 ~C and the point at which no endothermic peak comes to appear are connected with each other to give a base line.
The quantity of heat of melting (A (J/g)) obtained by the measurement is divided by the quantity of heat of melting of 100 % polyethylene crystals (260 (J/g)), to obtain a crystallinity (Xc = A/260).
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The contact time (residence time) is in the range of usually 1 minute to 3 hours, preferably 2 minutes to 2 hours, particularly preferably 5 minutes to 1 hour.
By virtue of the contact of the polyolefin with the ligand decomposer, the ligands can be decomposed, and therefore the legands having a high-boiling point can be converted to a low-boiling point compound. Further, some kinds of the ligands can be made odorless by the decomposition.
In the present invention, the polyolefin is contacted with the ligand decomposer as described above, and then the polyolefin is heated to remove the decomposed ligands from the polyolefin.
In order to remove the ligands by heating the polyolefin contacted with the ligand decomposer, the following methods are employable.
CA 0220~734 1997-0~-20 (1) The polyolefin is heated in a stream of an inert gas using a dryer such as a rotary dryer, a belt dryer, a flash dryer, a spray dryer or a paddle dryer.
(2) The polyolefin is melted by heating using a single-screw or twin-screw extruder.
If the method (2) is adopted, it is possible that the molten polyolefin is pelletized and the resulting pellets are subjected to any of the following steps (b-l) to (b-3).
(b-l) The pellets are contacted with hot water.
(b-2) The pellets are contacted with water vapor (steam).
(b-3) The pellets are heated under a pressure of 0.001 to 0.98 MPa.
In the method (1), when the polyolefin has a crystallinity of not less than 40 %, the temperature for heating the polyolefin is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than the crystallization temperature of the polyolefin and not hither than the melting point of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C
When the polyolefin has a crystallinity of less than 40 %, the temperature for heating the polyolefin is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than a temperature obtained by subtracting 15 ~C from the CA 0220~734 1997-0~-20 melting point of the polyolefin and not higher than the melting point of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The heating time (residence time) is in the range of usually 1 minute to 3 hours, preferably 2 minutes to 2 hours, particularly preferably 5 minutes to 1 hour.
0 Examples of the inert gases employable herein include a nitrogen gas, a helium gas and an argon gas.
The flow velocity of the gas in the dryer is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.1 to 5 cm/sec.
In the method (2), the temperature for heating the polyolefin is the same as that in the method (1).
In the present invention, if the polyolefin is heated at a temperature of not lower than the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, the heating is preferably carried out with applying a shear force to the polyolefin. In order to apply a shear force to the polyolefin, a paddle dryer, a single-screw extruder, a twin-screw extruder, etc. are employed.
When the method (2) is used in the invention, it is possible that the molten polyolefin is pelletized and the resulting pellets are subjected to any of the above steps (b-l) to (b-3).
CA 0220S734 1997-0~-20 Examples of the apparatuses employable for conducting the step (b-l) include a countercurrent extraction column, a tank equipped with a stirring device and a multi-stage horizontal extraction bath. Examples of the apparatuses employable for conducting the steps (b-2) and (b-3) include a silo and a hopper.
In the step (b-l), the temperature of hot water is in the range of usually 35 to 200 ~C, preferably 40 to 180 ~C, particularly preferably 45 to 150 ~C; and the contact time is in the range of 1 to 900 minutes, preferably 5 to 600 minutes, particularly preferably 10 to 360 minutes.
In the step (b-2), the polyolefin is contacted with a gas containing water vapor (steam) in the same manner as in the ligand-decomposition step described above. Examples of the gases to incorporate water vapor therein include the aforesaid inert gases and air.
When the polyolefin has a crystallinity of not less than 40 %, the temperature in the contact of the polyolefin with the water vapor-cont~in'ng gas is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than the crystallization temperature of the polyolefin and not higher than the melting point of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C.
When the polyolefin has a crystallinity of less than 40 %, the temperature in the contact of the polyolefin with the water vapor-containing gas is not lower than a CA 0220~734 1997-0~-20 temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and not higher than the melting point of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The amount of the water vapor contained in the water vapor-cont~in;ng gas is in the range of usually 0.1 to 40 %
by weight, preferably 0.5 to 20 % by weight, particularly preferably 1 to 10 % by weight.
The superficial velocity of the water vapor-containing gas in a column is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.5 to 5 cm/sec.
The contact time (residence time) is in the range of usually 0.5 to 30 hours, preferably 1 to 24 hours, particularly preferably 2 to 20 hours.
In the method (b-3), the pressure is in the range of 0.001 to 0.100 MPa, preferably 0.007 to 0.098 MPa, particularly preferably 0.01 to 0.07 MPa; and the temperature is in the range of 35 to 200 ~C, preferably 40 to 180 ~C, particularly preferably 45 to 150 ~C. The heating time is 0.5 to 30 hours, preferably 1 to 24 hours, particularly preferably 2 to 20 hours.
CA 0220~734 1997-0~-20 In each of the steps (b-l) to (b-3), the mean particle diameter of the polyolefin pellets is in the range of usually 1 to 30 mm, preferably 3 to 20 mm, more preferably 5 to 15 mm.
More specifically, the method of treating polyolefin according to the invention can be carried out through, for example, the steps shown in Fig. 1 or Fig. 2.
Fig. 1 is a conceptual view showing steps of one embodiment of the method of treating polyolefin according 0 to the invention, and Fig. 2 is a conceptual view showing steps of another embodiment of the method of treating polyolefin according to the present invention. Referring to these figures, the ligand-decomposition step is carried out in a silo designated by numeral 1, and the ligand- .
removal step is carried out in an extruder designated by numeral 2, a silo designated by numeral 4 or a dryer designated by numeral 7.
Hereinafter, the embodiment wherein water (steam) is used as the ligand-decomposer is explained.
Referring to Fig. 1, a powder of polyolefin is continuously fed to the silo 1 through a powder feed pipe 11. To the silo 1, an inert gas cont~;ning water vapor is also fed through a gas feed pipe 12 provided at the lower part of the silo 1. Thus, the polyolefin powder is contacted with the ligand decomposer to decompose ligands contained in the polyolefin. The inert gas containing water vapor, which has been fed to the silo 1, is exhausted out of the silo 1 from a gas exhaust pipe 14.
CA 0220~734 1997-0~-20 The polyolefin powder contacted with the water vapor is discharged out of the silo 1 from a powder discharge pipe 13 and then fed to an extruder 2. In the extruder 2, the polyolefin is melted by heating, and cooled with water to be pelletized, whereby a part of the decomposed ligands are removed from the polyolefin. The resulting polyolefin pellets are passed through a line 15 together with water and fed to a water separator 3. The polyolefin pellets are separated from water in the separator 3 and then fed to a 0 silo 4 through a pellet feed pipe 17. The water separated from the polyolefin pellets in the separator 3 is passed through a circulating line 16 and is used again as cooling water. In Fig. 1, numeral 5 designates a water tank, and numeral 6 designates a pump.
To the silo 4, an inert gas cont~in;ng water vapor is also fed through a gas feed pipe 18 provided at the lower part of the silo 4. Thus, the polyolefin pellets are contacted with water vapor to further remove the decomposed ligands from the polyolefin. The water vapor-cont~; n; ng inert gas, which has been fed to the silo 4, is exhausted out of the silo 4 from a gas exhaust pipe 20. The pellets of polyolefin from which the decomposed ligands have been removed are discharged from a pellet discharge pipe 19.
Referring to Fig. 2, a powder of polyolefin is contacted with an inert gas cont~;n;ng vapor of a ligand decomposer in a silo 2 to decompose ligands contained in the polyolefin, in the same manner as described in Fig. 1.
The polyolefin powder contacted with the water vapor is CA 0220~734 1997-0~-20 then discharged out of the silo 1 from a powder discharge pipe 13 and fed to a dryer 7. In Fig. 2, a belt dryer is shown as the dryer 7, but the dryer 7 is not limited to the belt dryer.
To the dryer 7, a heated inert gas is also fed through a gas feed pipe 21. Thus, the polyolefin powder is contacted with the inert gas and heated, whereby the decomposed ligands are removed from the polyolefin. The inert gas, which has been fed to the dryer 7, is exhausted 0 from a gas exhaust pipe 22.
The powder of polyolefin from which the decomposed ligands are removed is fed to a granulator 8 through a line 23, granulated therein and then discharged from a discharge pipe 24.
EFFECT OF THE INVENTION
According to the method of the present invention, residual ligands having cyclopentadienyl skeleton, which are contained in polyolefin produced by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, are decomposed and removed from the polyolefin, whereby polyolefin ~; m; n; shed in odor development in the molding process can be obtained.
EXAMPLE
The present invention will be further described with reference to the following examples, but it should be CA 0220~734 1997-0~-20 construed that the invention is in no way limited to those examples.
In the examples, measurement of the quantity of residual ligands and evaluation of odor development were made in the following manner.
OuantitY of residual ligands The residual ligands were extracted with toluene. The extract was identified and quantitatively determined in accordance with a calibration curve method using a gas chromatograph mass spectrometer.
Odor develoPment Polyolefin pellets of 400 g were introduced into a 1-liter wide-mouthed bottle. The bottle was closed with a lid and thoroughly shaken for 30 seconds. Then, the lid was taken off and the odor development was evaluated.
That is, odor development of the polyolefin was evaluated based on the following five criteria. When the polyolefin is graded as 5 or 4, it is considered to be no matter in the practical use.
5: No odor is developed.
4: Slight odor is developed.
fluorenyl group; and substituted fluorenyl groups.
In the above examples, the di-substituted cyclopentadienyl rings include 1,2- and 1,3-position substituted cyclopentadienyl rings, and the tri-substituted cyclopentadienyl rings include 1,2,3- and 1,2,4-substituted cyclopentadienyl rings. The alkyl groups such as propyl and butyl include isomers such as n-, i-, sec- and tert-alkyl groups.
Listed below are examples of the groups wherein two ligands selected from the (substituted) cyclopentadienyl group, the (substituted) indenyl group and the (substituted) fluorenyl group are bonded through the divalent bonding group.
Methylene-bis[l-(2-methyl-4-phenylindenyl)], Methylene-bis[l-(2-ethyl-4-phenylindenyl)], Methylene-bis[l-(2-ethyl-4-naphthylindenyl)], Ethylene-bis(indenyl), Ethylene-bis(4,5,6,7-tetrahydroindenyl), Ethylene-bis[l-(2-methyl-4-phenylindenyl)], Ethylene-bis[l-(2-ethyl-4-phenylindenyl)], Ethylene-bis[l-(2-ethyl-4-naphthylindenyl)], Ethylene-bis[l-(2-propyl-4-naphthylindenyl)], Ethylene-bis[l-(2,4,7-trimethylindenyl)], Isopropylidene-(cyclopentadienyl)(fluorenyl), Isopropylidene-(cyclopentadienyl)(methylcyclopentadienyl), Isopropylidene-(methylcyclopentadienyl)(3-methylindenyl), Isopropylidene-(butylcyclopentadienyl)(3 methylindenyl), Isopropylidene-(butylcyclopentadienyl)(fluorenyl), Isopropylidene-bis[l-(2,4,7-trimethylindenyl)], Dimethylsilylene-bis(cyclopentadienyl), Dimethylsilylene-bis(methylcyclopentadienyl), Dimethylsilylene-bis(dimethylcyclopentadienyl), Dimethylsilylene-bis(trimethylcyclopentadienyl), CA 0220~734 1997-0~-20 Dimethylsilylene-bis(indenyl), Dimethylsilylene~bis(4,5,6,7-tetrahydroindenyl), Dimethylsilylene-bis(methylbutylcyclopentadienyl), Dimethylsilylene-(cyclopentadienyl)(fluorenyl), Dimethylsilylene-(butylcyclopentadienyl)(fluorenyl), Dimethylsilylene-(butylcyclopentadienyl)(indenyl), Diphenylsilylene-bis(indenyl), Dimethylsilylene-(methylcyclopentadienyl)(3-methylindenyl), 0 Dimethylsilylene-(butylcyclopentadienyl)(3-methylindenyl), Dimethylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-anthrylindenyl)], Dimethylsilylene-bis[1-(2-methyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(fluorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(pentafluorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(chlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(dichlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(bromophenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(tolyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-methyl-4-(dimethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(ethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(propylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(benzylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-methyl-4-0 biphenylylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4-(trimethylsilylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-phenyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Dimethylsilylene-bis[1-(2-ethyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(2-methyl-1-naphthyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(methylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(dimethylphenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(trimethylphenyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-ethyl-4-(chlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(dichlorophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(bromophenyl)indenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-biphenylylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-(trimethylsilylphenyl)indenyl)], 0 Dimethylsilylene-bis[l-(2-propyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-(methylnaphthyl)indenyl)], Dimethylsilylene-bis[l-(2-propyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-propyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-(methylnaphthyl)indenyl)], Dimethylsilylene-bis[l-(2-butyl-4-acenaphthylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-anthrylindenyl)], Dimethylsilylene-bis[l-(2-butyl-4-phenanthrylindenyl)], Dimethylsilylene-bis[l-(2-pentyl-4-phenylindenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-pentyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-neopentyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-neopentyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2-hexyl-4-phenylindenyl)], Dimethylsilylene-bis[l-(2-hexyl-4-naphthylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-ethylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-butylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-pentylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-hexylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-cyclohexylindenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(methylcyclohexyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(phenylethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(phenyldichloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(chloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(trimethylsilylmethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-(trimethylsiloxymethyl)indenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2-methyl-4-propyl-7-ethylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-ethylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-0 pentylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-hexylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-cyclohexylindenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(methylcyclohexyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(trimethylsilyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(trimethylsiloxymethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(phenylethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(phenyldichloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-(chloromethyl)indenyl)], Dimethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], CA 0220~734 1997-0~-20 Dimethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylsilylene-bis[l-(2-methyl-4,6-dipropylindenyl)], Dimethylsilylene-bis[l-(2-ethyl-4-propyl-7-methylindenyl)], Dimethylsilylene-bis[l-(2-phenyl-4-propyl-7-methylindenyl)], Dimethylsilylene-bis[l-(2-methylindenyl)], 0 Diethylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Diethylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Diethylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Methylphenylsilylene-bis(indenyl), Methylphenylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-naphthylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Methylphenylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Methylphenylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Methylphenylsilylene-bis[l-(2,7-dimethyl-4-butylindenyl)], CA 0220~734 1997-0~-20 Methylphenylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Methylphenylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)~, Dipropylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dipropylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dipropylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], 0 Dibutylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dibutylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dibutylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dicyclohexylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Dicyclohexylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Dicyclohexylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-phenylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-naphthylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-anthrylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-phenanthrylindenyl)], Diphenylsilylene-bis[l-(2-ethyl-4-biphenylylindenyl)], Diphenylsilylene-bis[1-(2,7-dimethyl-4-butylindenyl)], CA 0220~734 1997-0~-20 Diphenylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2,7-dimethyl-4-ethylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-butylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Diphenylsilylene-bis[l-(2,3,7-trimethyl-4-ethylindenyl)], 0 Ditolylsilylene-bis[l-(2-methyl-4-phenylindenyl)], Ditolylsilylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Ditolylsilylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Di(chlorophenyl)silylene-bis[l-(2-methyl-4-phenylindenyl)], Di(chlorophenyl)silylene-bis[l-(2,7-dimethyl-4-propylindenyl)], Di(chlorophenyl)silylene-bis[l-(2,3,7-trimethyl-4-propylindenyl)], Dimethylgermylene-bis[l-(2-methyl-4-phenylindenyl)], Dimethylgermyl-bis[l-(2-ethyl-4-phenylindenyl)], Dimethylgermyl-bis[l-(2-ethyl-4-naphthylindenyl)], Dimethylgermyl-bis[l-(2-propyl-4-phenylindenyl)], and Dimethylstannylene-bis[l-(2-methyl-4-phenylindenyl)].
In the above examples, the di-substituted cyclopentadienyl rings include 1,2- and 1,3-position substituted cyclopentadienyl rings, and the tri-substituted cyclopentadienyl rings include 1,2,3- and 1,2,4-substituted CA 0220~734 1997-0~-20 cyclopentadienyl rings. The alkyl groups such as propyl and butyl include isomers such as n-, i-, sec- and tert-alkyl groups.
The polyolefins used in the present invention are obtained by the use of the transition metal compound containing the ligands having the aforementioned cyclopentadienyl skeleton, and the ligands having the cyclopentadienyl skeleton remain therein. In the present invention, the polyolefin is subjected to contact with a 0 ligand decomposer to decompose the ligands contained in the polyolefin (a ligand-decompostion step), and the polyolefin contacted with the ligand decomposer is subjected to heating to remove the decomposed ligands from the polyolefin.
Examples of the ligand decomposers employable in the ligand-decomposition step include water, oxygen, alcohols, alkylene oxides and peroxides. More specifically, there can be mentioned:
alcohols having 10 or less carbon atoms, e.g., monoalcohols, such as methanol, ethanol, propanol, isopropanol, butanol, pentanol, hexanol, heptanol, octanol, cyclopentanol and cyclohexanol, and dialcohols, such as ethylene glycol;
alkylene oxides, such as ethylene oxide, propylene oxide, trimethylene oxide, tetrahydrofuran and tetrahydropyran; and peroxides, such as propylene peroxide and butene peroxide.
CA 0220~734 1997-0~-20 Of these, preferable are water and alcohols having S
or less carbon atoms, and particularly preferable is water.
In order to contact the polyolefin with the ligand decomposer, the polyolefin is contacted with, for example, 5 a gaseous stream containing the ligand decomposer. In this event, a powder of the polyolefin is passed through a container with introducing a gas cont~;ning the ligand decomposer into the container.
The mean particle diameter of the polyolefin powder to be contacted with the ligand decomposer is in the range of usually 50 to 5,000 ~m, preferably 80 to 3,000 ~m, more preferably 100 to 2,000 ~m.
Examples of the gases to incorporate therein the ligand decomposer include inert gases such as a nitrogen gas and an argon gas.
In the gas, the ligand decomposer is contained usually in the form of vapor. The amount of the ligand decomposer contained in the ligand decomposer-cont~; n; ng gas is in the range of usually 0.1 to 40 % by weight, preferably 0.5 to 20 % by weight, particularly preferably 1 to 10 % by weight.
The superficial velocity of the ligand decomposer-containing gas in a column is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.5 to 5 cm/sec. The superficial velocity in a column is calculated from the temperature and the pressure of the ligand decomposer-containing gas at the gas exhaust vent of an apparatus used for contacting the polyolefin CA 0220S734 1997-0~-20 with the ligand decomposer and from the sectional area of the apparatus.
When the polyolefin has a crystallinity of not less than 40 %, the temperature in the contact of the polyolefin with the ligand decomposer is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C. When the polyolefin has a crystallinity of less than 40 %, the 0 temperature in the contact of the polyolefin with the ligand decomposer is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The crystallinity (Xc) of polyolefin is measured in the following manner. Polyolefin is preheated at 190 ~c for 7 minutes, and thereto is applied a pressure of 100 kg/cm2 for 2 minutes. Then, the polyolefin is cooled at 20 ~C under a pressure of 100 kg/cm2 to prepare a pressed sheet having a thickness of 5 mm. The pressed sheet is cut to give a specimen (sample) of about 5 mg, and the sample is introduced into an aluminum pan. The sample is heated from room temperature to 150 ~C at a heating rate of 10 ~C/min to measure endotherm of the sample using DSC-II of Perkin Elmer Co., whereby an endotherm curve of the sample is obtained. The endotherm curve of the sample is then converted to the quantity of heat of melting using an area CA 0220~734 1997-0~-20 of an endotherm curve of indium separately weighed. On the endotherm curve of the sample, the point at the position of 35 ~C and the point at which no endothermic peak comes to appear are connected with each other to give a base line.
The quantity of heat of melting (A (J/g)) obtained by the measurement is divided by the quantity of heat of melting of 100 % polyethylene crystals (260 (J/g)), to obtain a crystallinity (Xc = A/260).
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The contact time (residence time) is in the range of usually 1 minute to 3 hours, preferably 2 minutes to 2 hours, particularly preferably 5 minutes to 1 hour.
By virtue of the contact of the polyolefin with the ligand decomposer, the ligands can be decomposed, and therefore the legands having a high-boiling point can be converted to a low-boiling point compound. Further, some kinds of the ligands can be made odorless by the decomposition.
In the present invention, the polyolefin is contacted with the ligand decomposer as described above, and then the polyolefin is heated to remove the decomposed ligands from the polyolefin.
In order to remove the ligands by heating the polyolefin contacted with the ligand decomposer, the following methods are employable.
CA 0220~734 1997-0~-20 (1) The polyolefin is heated in a stream of an inert gas using a dryer such as a rotary dryer, a belt dryer, a flash dryer, a spray dryer or a paddle dryer.
(2) The polyolefin is melted by heating using a single-screw or twin-screw extruder.
If the method (2) is adopted, it is possible that the molten polyolefin is pelletized and the resulting pellets are subjected to any of the following steps (b-l) to (b-3).
(b-l) The pellets are contacted with hot water.
(b-2) The pellets are contacted with water vapor (steam).
(b-3) The pellets are heated under a pressure of 0.001 to 0.98 MPa.
In the method (1), when the polyolefin has a crystallinity of not less than 40 %, the temperature for heating the polyolefin is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than the crystallization temperature of the polyolefin and not hither than the melting point of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C
When the polyolefin has a crystallinity of less than 40 %, the temperature for heating the polyolefin is not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than a temperature obtained by subtracting 15 ~C from the CA 0220~734 1997-0~-20 melting point of the polyolefin and not higher than the melting point of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The heating time (residence time) is in the range of usually 1 minute to 3 hours, preferably 2 minutes to 2 hours, particularly preferably 5 minutes to 1 hour.
0 Examples of the inert gases employable herein include a nitrogen gas, a helium gas and an argon gas.
The flow velocity of the gas in the dryer is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.1 to 5 cm/sec.
In the method (2), the temperature for heating the polyolefin is the same as that in the method (1).
In the present invention, if the polyolefin is heated at a temperature of not lower than the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, the heating is preferably carried out with applying a shear force to the polyolefin. In order to apply a shear force to the polyolefin, a paddle dryer, a single-screw extruder, a twin-screw extruder, etc. are employed.
When the method (2) is used in the invention, it is possible that the molten polyolefin is pelletized and the resulting pellets are subjected to any of the above steps (b-l) to (b-3).
CA 0220S734 1997-0~-20 Examples of the apparatuses employable for conducting the step (b-l) include a countercurrent extraction column, a tank equipped with a stirring device and a multi-stage horizontal extraction bath. Examples of the apparatuses employable for conducting the steps (b-2) and (b-3) include a silo and a hopper.
In the step (b-l), the temperature of hot water is in the range of usually 35 to 200 ~C, preferably 40 to 180 ~C, particularly preferably 45 to 150 ~C; and the contact time is in the range of 1 to 900 minutes, preferably 5 to 600 minutes, particularly preferably 10 to 360 minutes.
In the step (b-2), the polyolefin is contacted with a gas containing water vapor (steam) in the same manner as in the ligand-decomposition step described above. Examples of the gases to incorporate water vapor therein include the aforesaid inert gases and air.
When the polyolefin has a crystallinity of not less than 40 %, the temperature in the contact of the polyolefin with the water vapor-cont~in'ng gas is not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than the crystallization temperature of the polyolefin and not higher than the melting point of the polyolefin, specifically 100 to 300 ~C, preferably 100 to 280 ~C.
When the polyolefin has a crystallinity of less than 40 %, the temperature in the contact of the polyolefin with the water vapor-containing gas is not lower than a CA 0220~734 1997-0~-20 temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, or not lower than a temperature obtained by subtracting 15 ~C from the melting point of the polyolefin and not higher than the melting point of the polyolefin, specifically 85 to 300 ~C, preferably 90 to 280 ~C.
The pressure is in the range of usually 0.0001 to 0.6 MPa, preferably 0.001 to 0.35 MPa, particularly preferably 0.01 to 0.25 MPa.
The amount of the water vapor contained in the water vapor-cont~in;ng gas is in the range of usually 0.1 to 40 %
by weight, preferably 0.5 to 20 % by weight, particularly preferably 1 to 10 % by weight.
The superficial velocity of the water vapor-containing gas in a column is in the range of usually 0.01 to 20 cm/sec, preferably 0.1 to 10 cm/sec, particularly preferably 0.5 to 5 cm/sec.
The contact time (residence time) is in the range of usually 0.5 to 30 hours, preferably 1 to 24 hours, particularly preferably 2 to 20 hours.
In the method (b-3), the pressure is in the range of 0.001 to 0.100 MPa, preferably 0.007 to 0.098 MPa, particularly preferably 0.01 to 0.07 MPa; and the temperature is in the range of 35 to 200 ~C, preferably 40 to 180 ~C, particularly preferably 45 to 150 ~C. The heating time is 0.5 to 30 hours, preferably 1 to 24 hours, particularly preferably 2 to 20 hours.
CA 0220~734 1997-0~-20 In each of the steps (b-l) to (b-3), the mean particle diameter of the polyolefin pellets is in the range of usually 1 to 30 mm, preferably 3 to 20 mm, more preferably 5 to 15 mm.
More specifically, the method of treating polyolefin according to the invention can be carried out through, for example, the steps shown in Fig. 1 or Fig. 2.
Fig. 1 is a conceptual view showing steps of one embodiment of the method of treating polyolefin according 0 to the invention, and Fig. 2 is a conceptual view showing steps of another embodiment of the method of treating polyolefin according to the present invention. Referring to these figures, the ligand-decomposition step is carried out in a silo designated by numeral 1, and the ligand- .
removal step is carried out in an extruder designated by numeral 2, a silo designated by numeral 4 or a dryer designated by numeral 7.
Hereinafter, the embodiment wherein water (steam) is used as the ligand-decomposer is explained.
Referring to Fig. 1, a powder of polyolefin is continuously fed to the silo 1 through a powder feed pipe 11. To the silo 1, an inert gas cont~;ning water vapor is also fed through a gas feed pipe 12 provided at the lower part of the silo 1. Thus, the polyolefin powder is contacted with the ligand decomposer to decompose ligands contained in the polyolefin. The inert gas containing water vapor, which has been fed to the silo 1, is exhausted out of the silo 1 from a gas exhaust pipe 14.
CA 0220~734 1997-0~-20 The polyolefin powder contacted with the water vapor is discharged out of the silo 1 from a powder discharge pipe 13 and then fed to an extruder 2. In the extruder 2, the polyolefin is melted by heating, and cooled with water to be pelletized, whereby a part of the decomposed ligands are removed from the polyolefin. The resulting polyolefin pellets are passed through a line 15 together with water and fed to a water separator 3. The polyolefin pellets are separated from water in the separator 3 and then fed to a 0 silo 4 through a pellet feed pipe 17. The water separated from the polyolefin pellets in the separator 3 is passed through a circulating line 16 and is used again as cooling water. In Fig. 1, numeral 5 designates a water tank, and numeral 6 designates a pump.
To the silo 4, an inert gas cont~in;ng water vapor is also fed through a gas feed pipe 18 provided at the lower part of the silo 4. Thus, the polyolefin pellets are contacted with water vapor to further remove the decomposed ligands from the polyolefin. The water vapor-cont~; n; ng inert gas, which has been fed to the silo 4, is exhausted out of the silo 4 from a gas exhaust pipe 20. The pellets of polyolefin from which the decomposed ligands have been removed are discharged from a pellet discharge pipe 19.
Referring to Fig. 2, a powder of polyolefin is contacted with an inert gas cont~;n;ng vapor of a ligand decomposer in a silo 2 to decompose ligands contained in the polyolefin, in the same manner as described in Fig. 1.
The polyolefin powder contacted with the water vapor is CA 0220~734 1997-0~-20 then discharged out of the silo 1 from a powder discharge pipe 13 and fed to a dryer 7. In Fig. 2, a belt dryer is shown as the dryer 7, but the dryer 7 is not limited to the belt dryer.
To the dryer 7, a heated inert gas is also fed through a gas feed pipe 21. Thus, the polyolefin powder is contacted with the inert gas and heated, whereby the decomposed ligands are removed from the polyolefin. The inert gas, which has been fed to the dryer 7, is exhausted 0 from a gas exhaust pipe 22.
The powder of polyolefin from which the decomposed ligands are removed is fed to a granulator 8 through a line 23, granulated therein and then discharged from a discharge pipe 24.
EFFECT OF THE INVENTION
According to the method of the present invention, residual ligands having cyclopentadienyl skeleton, which are contained in polyolefin produced by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, are decomposed and removed from the polyolefin, whereby polyolefin ~; m; n; shed in odor development in the molding process can be obtained.
EXAMPLE
The present invention will be further described with reference to the following examples, but it should be CA 0220~734 1997-0~-20 construed that the invention is in no way limited to those examples.
In the examples, measurement of the quantity of residual ligands and evaluation of odor development were made in the following manner.
OuantitY of residual ligands The residual ligands were extracted with toluene. The extract was identified and quantitatively determined in accordance with a calibration curve method using a gas chromatograph mass spectrometer.
Odor develoPment Polyolefin pellets of 400 g were introduced into a 1-liter wide-mouthed bottle. The bottle was closed with a lid and thoroughly shaken for 30 seconds. Then, the lid was taken off and the odor development was evaluated.
That is, odor development of the polyolefin was evaluated based on the following five criteria. When the polyolefin is graded as 5 or 4, it is considered to be no matter in the practical use.
5: No odor is developed.
4: Slight odor is developed.
3: A little odor is developed.
4: Considerable odor is developed.
5: Serious odor is developed.
ExamPle Polyethylene obtained by the use of a metallocene compound having l-methyl-3-butylcyclopentadienyl as ligand CA 0220S734 1997-0~-20 and having a crystallinity of 50 %, a crystallization temperature of 101 ~C, a melting point of 117 ~C, MI of 4.0 g/10 min, a density of 0.920 g/cm3, a particle diameter of 1,100 ~m and a bulk density of 0.420 g/cm3 was treated in the following manner through the steps shown in Fig. 1.
Before the treatment, the quantity of the residual ligands in the polyethylene was 500 ppb and the grade of the odor development was 1.
Liqand-decom~oser contactin~ ste~ & Liqand-decom~osition ste~
A water vapor-containing nitrogen gas was introduced into a silo, and the silo was set at a temperature of 80 ~C
under a pressure of 0.05 kg/cm2-G. Then, a powder of the polyolefin (polyethylene) was passed through the silo for a residence time of 3 minutes.
The weight ratio of water to the polyethylene powder (PE), water/PE, was 0.002, and the ratio of the nitrogen gas (N2) to the polyethylene powder (PE), N2(N-m3)/PE, was 0.004.
First li~and-removal step The polyethylene powder subjected to the ligand-decomposition step was then pelletized using a twin-screw extruder at an outlet temperature of 180 ~C.
Second liqand-removal step A water vapor-containing air was introduced into a silo, and thé silo was set at a temperature of 90 ~C under a pressure of 1.7 kg/cm2-G. Then, the pellets of the CA 0220~734 1997-0~-20 polyolefin (polyethylene) were passed through the silo for a residence time of 12 hours.
The weight ratio of water vapor (water) to the polyethylene pellets (PE), water/PE, was 0.018, and the ratio of air to the polyethylene pellets (PE), air(N-m3)/PE(kg), was 0.016.
The polyethylene treated as above was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Example 2 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the second ligand-removal step was not effected. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Com~arative Exam~le 1 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the ligand-decomposition step was not effected. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Exam~les 3 - 7 CA 0220~734 1997-0~-20 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the polyethylene of Example 1 was replaced with that shown in Table 1. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development.
The results are set forth in Table 1.
Example 8 The same polyethylene as used in Example 1 was treated 0 in the following manner through the steps shown in Fig. 2.
Liqand-decomPosition step A nitrogen gas containing methanol vapor was introduced into a silo, and the silo was set at a temperature of 80 ~C under a pressure of 0.05 kg/cm2-G.
Then, a powder of the polyolefin (polyethylene) was passed through the silo for a residence time of 3 minutes.
The weight ratio of methanol to the polyethylene powder (PE), methanol/PE, was 0.0002, and the ratio of the nitrogen gas (N2) to the polyethylene powder (PE), N2(N-m3)/PE(kg), was 0.004.
The above-described ligand-decomposition step was the same as the ligand-decomposition step of Example 1, except that the methanol vapor-cont~;n;ng nitrogen gas was used in place of the water vapor-cont~;n;ng nitrogen gas.
Liqand-removal ste~
Through a belt dryer set at a temperature of 120 ~C, the polyethylene powder was passed for a residence time of 1 minute.
CA 0220~734 l997-05-20 he polyethylene treated as above was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Table 1 Ex. 1 Ex. 2 Comp. Ex. 3 Ex. 4 Ex.l ProcessFig. 1 Fig. 1 Fig. 1 Fig. 1 Fig. 1 LigandBu~Me Bu~Me Bu~Me Bu~Bu Me~,,Me Polyolefin Powder crystallinity (%) 50 50 50 55 53 Crystallization 101 101 101 101 101 temperature (~C) Melting point (~C) 117 117 117 115 120 MI (g/10 min) 4.0 4.0 4.0 4.0 4.0 Density(g/cm3) 0.920 0.9200.920 0.921 0.921 Particle diameter (~m)11001100 1100 1000 900 Bulk density (g/cm3)0.4200.420 0.420 0.435 0.440 Decomposition step Decomposer water water water water Residence time (min) 3 3 3 3 Pressure (kg/cm2-G) 0.05 0.05 0.05 0.05 Temperature (~C) 80 80 80 80 Decomposer/Powder (wt/wt) 0.002 0.002 0.002 0.002 N2/Powder(N-m3/kg) 0-004 0.004 0.004 0.004 Removal step Heat treatment 180 180 180 180 180 temperature (~C) Residence time (hr) 12 12 12 12 Temperature of steam (~C) 90 90 90 90 Steam/pellet (wt/wt) 0.018 0.018 0.018 0.018 Air/pellet (N-m3/wt) 0.016 0 016 0.016 0.016 Result not more not more not more not more Quantity of residual than 1 than 1 10 ppb than 1 than 1 ligand ppb ppb ppb ppb Odor development 5 4 1 5 5 CA 0220~734 l997-0~-20 Table 1 (continued) Ex. 5 Ex. 6 Ex. 7 Ex. 8 Process Fig. 1 Fig. 1 Fig. 1 Fig. 2 Ligand ~ u ~ Bu~Me Bu~Ne ~, Polyolefin Powder crystallinity (%) 55 55 35 50 Crystallization 101 101 100 101 temperature(~C) Melting point(~C) 120 121 114 117 MI (g/10 min) 3.5 3.6 3.9 4.0 Density(g/cm3) 0.922 0.922 0.9040.920 Particle diameter (~m) 900 900 1200 1100 Bulk density(g/cm3)0.445 0.410 0.3800.420 Decomposition step methyl Decomposer water water wateralcohol Residence time (min) 3 3 3 3 Pressure (kg/cm2-G)0.05 0.05 0.05 0.05 Temperature(~C) 80 80 70 80 Decomposer/Powder (wt/wt)0.0020.0020.002 0.0002 N2/Powder(N-m3/kg) 0.004 0.004 0.0040.004 Removal step hot-air Heat treatment 180 180 180 drying temperature(~C) condition Residence time (hr) 12 12 18 1 min Temperature of steam (~C) 90 90 70 Steam/pellet (wt/wt) 0.018 0.0180.018 temperature Air/pellet (N-m3/wt) 0.016 0.0160.016 120~C
Result not more not more not more not more Quantity of residual than 1 than 1 than 1 than 1 ppb ligand ppb ppb ppb Odor development 5 4 4 4
ExamPle Polyethylene obtained by the use of a metallocene compound having l-methyl-3-butylcyclopentadienyl as ligand CA 0220S734 1997-0~-20 and having a crystallinity of 50 %, a crystallization temperature of 101 ~C, a melting point of 117 ~C, MI of 4.0 g/10 min, a density of 0.920 g/cm3, a particle diameter of 1,100 ~m and a bulk density of 0.420 g/cm3 was treated in the following manner through the steps shown in Fig. 1.
Before the treatment, the quantity of the residual ligands in the polyethylene was 500 ppb and the grade of the odor development was 1.
Liqand-decom~oser contactin~ ste~ & Liqand-decom~osition ste~
A water vapor-containing nitrogen gas was introduced into a silo, and the silo was set at a temperature of 80 ~C
under a pressure of 0.05 kg/cm2-G. Then, a powder of the polyolefin (polyethylene) was passed through the silo for a residence time of 3 minutes.
The weight ratio of water to the polyethylene powder (PE), water/PE, was 0.002, and the ratio of the nitrogen gas (N2) to the polyethylene powder (PE), N2(N-m3)/PE, was 0.004.
First li~and-removal step The polyethylene powder subjected to the ligand-decomposition step was then pelletized using a twin-screw extruder at an outlet temperature of 180 ~C.
Second liqand-removal step A water vapor-containing air was introduced into a silo, and thé silo was set at a temperature of 90 ~C under a pressure of 1.7 kg/cm2-G. Then, the pellets of the CA 0220~734 1997-0~-20 polyolefin (polyethylene) were passed through the silo for a residence time of 12 hours.
The weight ratio of water vapor (water) to the polyethylene pellets (PE), water/PE, was 0.018, and the ratio of air to the polyethylene pellets (PE), air(N-m3)/PE(kg), was 0.016.
The polyethylene treated as above was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Example 2 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the second ligand-removal step was not effected. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Com~arative Exam~le 1 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the ligand-decomposition step was not effected. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Exam~les 3 - 7 CA 0220~734 1997-0~-20 Treatment of polyethylene was carried out in the same manner as in Example 1, except that the polyethylene of Example 1 was replaced with that shown in Table 1. The thus treated polyethylene was measured on the quantity of residual ligands and evaluated on the odor development.
The results are set forth in Table 1.
Example 8 The same polyethylene as used in Example 1 was treated 0 in the following manner through the steps shown in Fig. 2.
Liqand-decomPosition step A nitrogen gas containing methanol vapor was introduced into a silo, and the silo was set at a temperature of 80 ~C under a pressure of 0.05 kg/cm2-G.
Then, a powder of the polyolefin (polyethylene) was passed through the silo for a residence time of 3 minutes.
The weight ratio of methanol to the polyethylene powder (PE), methanol/PE, was 0.0002, and the ratio of the nitrogen gas (N2) to the polyethylene powder (PE), N2(N-m3)/PE(kg), was 0.004.
The above-described ligand-decomposition step was the same as the ligand-decomposition step of Example 1, except that the methanol vapor-cont~;n;ng nitrogen gas was used in place of the water vapor-cont~;n;ng nitrogen gas.
Liqand-removal ste~
Through a belt dryer set at a temperature of 120 ~C, the polyethylene powder was passed for a residence time of 1 minute.
CA 0220~734 l997-05-20 he polyethylene treated as above was measured on the quantity of residual ligands and evaluated on the odor development. The results are set forth in Table 1.
Table 1 Ex. 1 Ex. 2 Comp. Ex. 3 Ex. 4 Ex.l ProcessFig. 1 Fig. 1 Fig. 1 Fig. 1 Fig. 1 LigandBu~Me Bu~Me Bu~Me Bu~Bu Me~,,Me Polyolefin Powder crystallinity (%) 50 50 50 55 53 Crystallization 101 101 101 101 101 temperature (~C) Melting point (~C) 117 117 117 115 120 MI (g/10 min) 4.0 4.0 4.0 4.0 4.0 Density(g/cm3) 0.920 0.9200.920 0.921 0.921 Particle diameter (~m)11001100 1100 1000 900 Bulk density (g/cm3)0.4200.420 0.420 0.435 0.440 Decomposition step Decomposer water water water water Residence time (min) 3 3 3 3 Pressure (kg/cm2-G) 0.05 0.05 0.05 0.05 Temperature (~C) 80 80 80 80 Decomposer/Powder (wt/wt) 0.002 0.002 0.002 0.002 N2/Powder(N-m3/kg) 0-004 0.004 0.004 0.004 Removal step Heat treatment 180 180 180 180 180 temperature (~C) Residence time (hr) 12 12 12 12 Temperature of steam (~C) 90 90 90 90 Steam/pellet (wt/wt) 0.018 0.018 0.018 0.018 Air/pellet (N-m3/wt) 0.016 0 016 0.016 0.016 Result not more not more not more not more Quantity of residual than 1 than 1 10 ppb than 1 than 1 ligand ppb ppb ppb ppb Odor development 5 4 1 5 5 CA 0220~734 l997-0~-20 Table 1 (continued) Ex. 5 Ex. 6 Ex. 7 Ex. 8 Process Fig. 1 Fig. 1 Fig. 1 Fig. 2 Ligand ~ u ~ Bu~Me Bu~Ne ~, Polyolefin Powder crystallinity (%) 55 55 35 50 Crystallization 101 101 100 101 temperature(~C) Melting point(~C) 120 121 114 117 MI (g/10 min) 3.5 3.6 3.9 4.0 Density(g/cm3) 0.922 0.922 0.9040.920 Particle diameter (~m) 900 900 1200 1100 Bulk density(g/cm3)0.445 0.410 0.3800.420 Decomposition step methyl Decomposer water water wateralcohol Residence time (min) 3 3 3 3 Pressure (kg/cm2-G)0.05 0.05 0.05 0.05 Temperature(~C) 80 80 70 80 Decomposer/Powder (wt/wt)0.0020.0020.002 0.0002 N2/Powder(N-m3/kg) 0.004 0.004 0.0040.004 Removal step hot-air Heat treatment 180 180 180 drying temperature(~C) condition Residence time (hr) 12 12 18 1 min Temperature of steam (~C) 90 90 70 Steam/pellet (wt/wt) 0.018 0.0180.018 temperature Air/pellet (N-m3/wt) 0.016 0.0160.016 120~C
Result not more not more not more not more Quantity of residual than 1 than 1 than 1 than 1 ppb ligand ppb ppb ppb Odor development 5 4 4 4
Claims (10)
- What is claimed is:
A method of treating polyolefin, comprising (i) a step of contacting polyolefin, which is obtained by the use of a transition metal compound, with a ligand decomposer, and (ii) a step of heating the polyolefin contacted with the ligand decomposer. - 2. A method of treating polyolefin, comprising:
(i) a ligand-decomposition step of contacting polyolefin, which is obtained by the use of a transition metal compound containing ligands having cyclopentadienyl skeleton, with a ligand decomposer to decompose the ligands contained in the polyolefin, and (ii) a ligand-removal step of heating the polyolefin contacted with the ligand decomposer to remove the decomposed ligands from the polyolefin. - 3. The method of treating polyolefin as claimed in claim 2, wherein the ligand decomposer is at least one compound selected from the group consisting of water, oxygen, alcohol, alkylene oxide and peroxide.
- 4. The method of treating polyolefin as claimed in claim 2 or claim 3, wherein the mean particle diameter of the polyolefin in the ligand-decomposition step is in the range of 50 to 5,000 µm.
- 5. The method of treating polyolefin as claimed in any one of claims 2 to 4, wherein the ligand-decomposition step is a step in which the polyolefin is contacted with a gaseous stream containing the ligand decomposer.
- 6. The method of treating polyolefin as claimed in any one of claims 2 to 5, wherein the heating temperature in the ligand-removal step is:
not lower than the crystallization temperature of the polyolefin and lower than the decomposition temperature of the polyolefin in the event that the polyolefin has a crystallinity of not less than 40 %, and not lower than a temperature obtained by subtracting 15 °C from the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin in the event that the polyolefin has a crystallinity of less than 40 %. - 7. The method of treating polyolefin as claimed in any one of claims 2 to 5, wherein the heating temperature in the ligand-removal step is:
not lower than the crystallization temperature of the polyolefin and not higher than the melting point of the polyolefin in the event that the polyolefin has a crystallinity of not less than 40 %, and not lower than a temperature obtained by subtracting 15 °C from the melting point of the polyolefin and not higher than the melting point of the polyolefin in the event that the polyolefin has a crystallinity of less than 40 %. - 8. The method of treating polyolefin as claimed in any one of claims 2 to 5, wherein the ligand-removal step is a step in which the polyolefin contacted with the ligand decomposer is heated at a temperature of not lower than the melting point of the polyolefin and lower than the decomposition temperature of the polyolefin, with applying a shear force to the polyolefin.
- 9. The method of treating polyolefin as claimed in any one of claims 2 to 7, wherein the ligand-removal step is a step comprising:
(a) a step of melting, by heating, the polyolefin contacted with the ligand decomposer to prepare pellets of the polyolefin, and any one of (b-1) a step of contacting the pellets with hot water, (b-2) a step of contacting the pellets with water vapor and (b-3) a step of maintaining the pellets at a pressure of 0.001 to 0.098 MPa. - 10. The method of treating polyolefin as claimed in any one of claims 2 to 7, wherein the ligand-removal step is a step in which the polyolefin contacted with the ligand decomposer is heated in a stream of an inert gas.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP126008/1996 | 1996-05-21 | ||
JP12600896 | 1996-05-21 |
Publications (1)
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CA2205734A1 true CA2205734A1 (en) | 1997-11-21 |
Family
ID=14924452
Family Applications (1)
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CA002205734A Abandoned CA2205734A1 (en) | 1996-05-21 | 1997-05-20 | Method of treating polyolefin |
Country Status (8)
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US (1) | US5990272A (en) |
EP (1) | EP0808850B2 (en) |
KR (1) | KR100229003B1 (en) |
CN (1) | CN1065541C (en) |
CA (1) | CA2205734A1 (en) |
DE (1) | DE69706758T3 (en) |
SG (1) | SG64990A1 (en) |
TW (1) | TW404956B (en) |
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US6794461B2 (en) | 2000-08-25 | 2004-09-21 | Kaneka Corporation | Method for purification of vinyl polymers |
US7276574B2 (en) | 2001-10-17 | 2007-10-02 | Kaneka Corporation | Process for producing vinyl polymer |
SG106681A1 (en) | 2002-03-29 | 2004-10-29 | Mitsui Chemicals Inc | Olefinic polymer and process for producing the same |
JP2009545644A (en) | 2006-08-03 | 2009-12-24 | バーゼル・ポリオレフィン・ゲーエムベーハー | Polyolefin finishing method |
EP2072203B2 (en) † | 2007-12-18 | 2020-11-18 | Borealis Technology Oy | Removing volatile compounds from polymer pellets |
RU2526392C2 (en) | 2008-12-30 | 2014-08-20 | Базелль Полиолефин Италия С.Р.Л. | Polyolefin steam treatment |
KR101722792B1 (en) * | 2009-04-17 | 2017-04-03 | 익셀러레이트 에너지 리미티드 파트너쉽 | Dockside shiptoship transfer of lng |
US9919774B2 (en) | 2010-05-20 | 2018-03-20 | Excelerate Energy Limited Partnership | Systems and methods for treatment of LNG cargo tanks |
CN113233949B (en) * | 2021-05-19 | 2022-08-02 | 万华化学集团股份有限公司 | Jiale musk tower kettle waste liquid treatment method |
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CA1012692A (en) * | 1973-01-19 | 1977-06-21 | Du Pont Of Canada Limited | Removal of volatile impurities from polymers |
JPS5231269B2 (en) * | 1974-06-13 | 1977-08-13 | ||
DE2814572A1 (en) * | 1978-04-05 | 1979-10-18 | Basf Ag | PROCESS FOR REMOVING INTENSIVE ODOR COMPONENTS FROM FINE PARTICLE OLEFINE POLYMERIZES |
US5340786A (en) * | 1988-02-12 | 1994-08-23 | Mitsui Petrochemical Industries, Ltd. | Olefin polymerization catalyst and process for the polymerization of olefins |
US5128127A (en) * | 1989-02-08 | 1992-07-07 | Stolle Research & Development Corp. | Increased protein production in animals |
JP3048591B2 (en) * | 1989-04-11 | 2000-06-05 | 三井化学株式会社 | Method for producing syndiotactic polyolefin |
TW254950B (en) * | 1992-03-02 | 1995-08-21 | Shell Internat Res Schappej Bv | |
IL107927A0 (en) * | 1992-12-17 | 1994-04-12 | Exxon Chemical Patents Inc | Oil soluble ethylene/1-butene copolymers and lubricating oils containing the same |
EP0812854B2 (en) † | 1993-06-07 | 2011-04-20 | Mitsui Chemicals, Inc. | Novel transition metal compound, olefin polymerization catalyst comprising said compound, process for olefin polymerization using said catalyst and propylene homo- and copolymer |
US5804678A (en) † | 1993-07-13 | 1998-09-08 | Mitsui Petrochemical Industries, Ltd. | Process for gas phase polymerization of olefin |
JPH0952918A (en) * | 1995-08-09 | 1997-02-25 | Tosoh Corp | Production of ethylene/alpha-olefin copolymer with slight smell |
-
1997
- 1997-05-17 TW TW086106619A patent/TW404956B/en not_active IP Right Cessation
- 1997-05-20 CA CA002205734A patent/CA2205734A1/en not_active Abandoned
- 1997-05-20 DE DE69706758T patent/DE69706758T3/en not_active Expired - Lifetime
- 1997-05-20 EP EP97108128A patent/EP0808850B2/en not_active Expired - Lifetime
- 1997-05-20 SG SG9701608A patent/SG64990A1/en unknown
- 1997-05-21 CN CN97111433A patent/CN1065541C/en not_active Expired - Lifetime
- 1997-05-21 KR KR1019970019679A patent/KR100229003B1/en not_active IP Right Cessation
- 1997-05-21 US US08/861,069 patent/US5990272A/en not_active Expired - Lifetime
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CN1065541C (en) | 2001-05-09 |
DE69706758T2 (en) | 2002-07-04 |
TW404956B (en) | 2000-09-11 |
US5990272A (en) | 1999-11-23 |
EP0808850B2 (en) | 2010-01-13 |
DE69706758T3 (en) | 2010-08-12 |
DE69706758D1 (en) | 2001-10-25 |
CN1170729A (en) | 1998-01-21 |
SG64990A1 (en) | 2001-03-20 |
EP0808850B1 (en) | 2001-09-19 |
KR970074796A (en) | 1997-12-10 |
KR100229003B1 (en) | 1999-11-01 |
EP0808850A1 (en) | 1997-11-26 |
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