US6674562B1
(en)
*
|
1994-05-05 |
2004-01-06 |
Iridigm Display Corporation |
Interferometric modulation of radiation
|
US6786420B1
(en)
|
1997-07-15 |
2004-09-07 |
Silverbrook Research Pty. Ltd. |
Data distribution mechanism in the form of ink dots on cards
|
US6803989B2
(en)
*
|
1997-07-15 |
2004-10-12 |
Silverbrook Research Pty Ltd |
Image printing apparatus including a microcontroller
|
US6618117B2
(en)
|
1997-07-12 |
2003-09-09 |
Silverbrook Research Pty Ltd |
Image sensing apparatus including a microcontroller
|
US7705891B2
(en)
|
1997-07-15 |
2010-04-27 |
Silverbrook Research Pty Ltd |
Correction of distortions in digital images
|
US7551201B2
(en)
|
1997-07-15 |
2009-06-23 |
Silverbrook Research Pty Ltd |
Image capture and processing device for a print on demand digital camera system
|
US7110024B1
(en)
*
|
1997-07-15 |
2006-09-19 |
Silverbrook Research Pty Ltd |
Digital camera system having motion deblurring means
|
US7714889B2
(en)
*
|
1997-07-15 |
2010-05-11 |
Silverbrook Research Pty Ltd |
Digital camera using exposure information for image processing
|
AUPO850597A0
(en)
|
1997-08-11 |
1997-09-04 |
Silverbrook Research Pty Ltd |
Image processing method and apparatus (art01a)
|
US6624848B1
(en)
|
1997-07-15 |
2003-09-23 |
Silverbrook Research Pty Ltd |
Cascading image modification using multiple digital cameras incorporating image processing
|
US6879341B1
(en)
|
1997-07-15 |
2005-04-12 |
Silverbrook Research Pty Ltd |
Digital camera system containing a VLIW vector processor
|
US6985207B2
(en)
|
1997-07-15 |
2006-01-10 |
Silverbrook Research Pty Ltd |
Photographic prints having magnetically recordable media
|
AUPO802797A0
(en)
|
1997-07-15 |
1997-08-07 |
Silverbrook Research Pty Ltd |
Image processing method and apparatus (ART54)
|
US6690419B1
(en)
|
1997-07-15 |
2004-02-10 |
Silverbrook Research Pty Ltd |
Utilising eye detection methods for image processing in a digital image camera
|
DE69726718T2
(en)
*
|
1997-07-31 |
2004-10-07 |
St Microelectronics Srl |
Method of manufacturing highly sensitive integrated acceleration and gyroscopic sensors and sensors manufactured in this way
|
GB9722766D0
(en)
|
1997-10-28 |
1997-12-24 |
British Telecomm |
Portable computers
|
US8928967B2
(en)
|
1998-04-08 |
2015-01-06 |
Qualcomm Mems Technologies, Inc. |
Method and device for modulating light
|
WO1999052006A2
(en)
*
|
1998-04-08 |
1999-10-14 |
Etalon, Inc. |
Interferometric modulation of radiation
|
US6291875B1
(en)
*
|
1998-06-24 |
2001-09-18 |
Analog Devices Imi, Inc. |
Microfabricated structures with electrical isolation and interconnections
|
AUPP702098A0
(en)
|
1998-11-09 |
1998-12-03 |
Silverbrook Research Pty Ltd |
Image creation method and apparatus (ART73)
|
AUPQ056099A0
(en)
|
1999-05-25 |
1999-06-17 |
Silverbrook Research Pty Ltd |
A method and apparatus (pprint01)
|
US6798312B1
(en)
|
1999-09-21 |
2004-09-28 |
Rockwell Automation Technologies, Inc. |
Microelectromechanical system (MEMS) analog electrical isolator
|
US6803755B2
(en)
|
1999-09-21 |
2004-10-12 |
Rockwell Automation Technologies, Inc. |
Microelectromechanical system (MEMS) with improved beam suspension
|
WO2003007049A1
(en)
*
|
1999-10-05 |
2003-01-23 |
Iridigm Display Corporation |
Photonic mems and structures
|
US6753638B2
(en)
*
|
2000-02-03 |
2004-06-22 |
Calient Networks, Inc. |
Electrostatic actuator for micromechanical systems
|
JP2001227954A
(en)
*
|
2000-02-15 |
2001-08-24 |
Toyota Motor Corp |
Physical quantity detecting device
|
US6440766B1
(en)
*
|
2000-02-16 |
2002-08-27 |
Analog Devices Imi, Inc. |
Microfabrication using germanium-based release masks
|
DE10029012C2
(en)
*
|
2000-06-13 |
2002-06-06 |
Amtec Gmbh |
Microstructure and process for its manufacture
|
US20020118850A1
(en)
*
|
2000-08-02 |
2002-08-29 |
Yeh Jer-Liang (Andrew) |
Micromachine directional microphone and associated method
|
US6545796B1
(en)
*
|
2000-09-13 |
2003-04-08 |
Agere Systems Inc. |
Article comprising a freestanding micro-tube and method therefor
|
DE10047189C1
(en)
*
|
2000-09-23 |
2002-02-21 |
Bosch Gmbh Robert |
Seat occupant classification method for automobile passenger seat uses evaluation of seating profile provided by pressure sensor matrix
|
US6520013B1
(en)
*
|
2000-10-02 |
2003-02-18 |
Apple Computer, Inc. |
Method and apparatus for detecting free fall
|
US7688306B2
(en)
|
2000-10-02 |
2010-03-30 |
Apple Inc. |
Methods and apparatuses for operating a portable device based on an accelerometer
|
US7280014B2
(en)
*
|
2001-03-13 |
2007-10-09 |
Rochester Institute Of Technology |
Micro-electro-mechanical switch and a method of using and making thereof
|
US6889128B2
(en)
*
|
2001-04-20 |
2005-05-03 |
Trw Inc. |
System and method for controlling vehicle suspension components and vehicle occupant protection devices
|
US6815243B2
(en)
|
2001-04-26 |
2004-11-09 |
Rockwell Automation Technologies, Inc. |
Method of fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate
|
US6794271B2
(en)
|
2001-09-28 |
2004-09-21 |
Rockwell Automation Technologies, Inc. |
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
|
US6756310B2
(en)
*
|
2001-09-26 |
2004-06-29 |
Rockwell Automation Technologies, Inc. |
Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques
|
US6761829B2
(en)
*
|
2001-04-26 |
2004-07-13 |
Rockwell Automation Technologies, Inc. |
Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
|
US6768628B2
(en)
|
2001-04-26 |
2004-07-27 |
Rockwell Automation Technologies, Inc. |
Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
|
AU2002303933A1
(en)
*
|
2001-05-31 |
2002-12-09 |
Rochester Institute Of Technology |
Fluidic valves, agitators, and pumps and methods thereof
|
DE10196506B3
(en)
*
|
2001-06-13 |
2014-09-04 |
Mitsubishi Denki K.K. |
Manufacturing method for a thin-film structural body
|
DE10130379A1
(en)
*
|
2001-06-23 |
2003-01-02 |
Bosch Gmbh Robert |
Micromechanical mass flow sensor and method for its production
|
US6664786B2
(en)
|
2001-07-30 |
2003-12-16 |
Rockwell Automation Technologies, Inc. |
Magnetic field sensor using microelectromechanical system
|
US6817255B2
(en)
*
|
2001-09-12 |
2004-11-16 |
The Board Of Trustees Of The University Of Illinois |
Apparatus and method for testing of microscale to nanoscale thin films
|
US6933933B2
(en)
|
2001-10-02 |
2005-08-23 |
Harris Corporation |
Pen cartridge that transmits acceleration signal for recreating handwritten signatures and communications
|
DE10148858A1
(en)
*
|
2001-10-04 |
2003-04-10 |
Bosch Gmbh Robert |
Micro-mechanical sensor, e.g. for measurement of acceleration, has a seismic mass with measurement and self-test drive electrodes arranged perpendicularly to each other so that the effects of edge loss on self-testing are reduced
|
US6690178B2
(en)
|
2001-10-26 |
2004-02-10 |
Rockwell Automation Technologies, Inc. |
On-board microelectromechanical system (MEMS) sensing device for power semiconductors
|
WO2003038448A1
(en)
|
2001-10-26 |
2003-05-08 |
Potter Michael D |
An accelerometer and methods thereof
|
US7211923B2
(en)
*
|
2001-10-26 |
2007-05-01 |
Nth Tech Corporation |
Rotational motion based, electrostatic power source and methods thereof
|
US7378775B2
(en)
*
|
2001-10-26 |
2008-05-27 |
Nth Tech Corporation |
Motion based, electrostatic power source and methods thereof
|
US6568268B1
(en)
|
2001-10-31 |
2003-05-27 |
Western Digital Technologies, Inc. |
Multi-axis accelerometer comprising a mass suspended by springs above an optical sensor
|
US6794119B2
(en)
*
|
2002-02-12 |
2004-09-21 |
Iridigm Display Corporation |
Method for fabricating a structure for a microelectromechanical systems (MEMS) device
|
JP2003240798A
(en)
*
|
2002-02-19 |
2003-08-27 |
Denso Corp |
Capacitive physical quantity sensor
|
AU2003216338A1
(en)
*
|
2002-02-21 |
2003-09-09 |
Dana Corporation |
Vehicle dynamics control system
|
WO2003087459A1
(en)
*
|
2002-04-10 |
2003-10-23 |
Fisher & Paykel Appliances Limited |
A laundry appliance
|
US7539568B2
(en)
*
|
2002-06-03 |
2009-05-26 |
Continental Automotive Systems Us, Inc |
Crash pulse energy algorithm for an inflatable restraint system
|
DE10231729B4
(en)
*
|
2002-07-13 |
2011-08-11 |
Robert Bosch GmbH, 70469 |
Component with a surface micromechanical structure
|
US7004030B2
(en)
*
|
2002-09-27 |
2006-02-28 |
Oki Electric Industry Co., Ltd. |
Acceleration sensor
|
KR100770981B1
(en)
*
|
2002-10-30 |
2007-10-30 |
삼성전자주식회사 |
Stand of Display
|
FR2847515B1
(en)
*
|
2002-11-27 |
2006-07-14 |
Roulements Soc Nouvelle |
SUSPENSION OF INSTRUMENTED SUSPENSION IN DEFORMATION TO MEASURE EFFORTS
|
US6841992B2
(en)
*
|
2003-02-18 |
2005-01-11 |
Honeywell International, Inc. |
MEMS enhanced capacitive pick-off and electrostatic rebalance electrode placement
|
US7514283B2
(en)
|
2003-03-20 |
2009-04-07 |
Robert Bosch Gmbh |
Method of fabricating electromechanical device having a controlled atmosphere
|
US6975193B2
(en)
*
|
2003-03-25 |
2005-12-13 |
Rockwell Automation Technologies, Inc. |
Microelectromechanical isolating circuit
|
US8912174B2
(en)
*
|
2003-04-16 |
2014-12-16 |
Mylan Pharmaceuticals Inc. |
Formulations and methods for treating rhinosinusitis
|
US6987432B2
(en)
*
|
2003-04-16 |
2006-01-17 |
Robert Bosch Gmbh |
Temperature compensation for silicon MEMS resonator
|
TWI234819B
(en)
*
|
2003-05-06 |
2005-06-21 |
Walsin Lihwa Corp |
Selective etch method for side wall protection and structure formed using the method
|
US6979872B2
(en)
*
|
2003-05-13 |
2005-12-27 |
Rockwell Scientific Licensing, Llc |
Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modules
|
US6936491B2
(en)
|
2003-06-04 |
2005-08-30 |
Robert Bosch Gmbh |
Method of fabricating microelectromechanical systems and devices having trench isolated contacts
|
US7075160B2
(en)
*
|
2003-06-04 |
2006-07-11 |
Robert Bosch Gmbh |
Microelectromechanical systems and devices having thin film encapsulated mechanical structures
|
JP2005029142A
(en)
*
|
2003-06-17 |
2005-02-03 |
Yokohama Rubber Co Ltd:The |
Antilock brake system and its sensor unit
|
US6952041B2
(en)
*
|
2003-07-25 |
2005-10-04 |
Robert Bosch Gmbh |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
|
US7148436B1
(en)
|
2003-08-14 |
2006-12-12 |
Sandia Corporation |
Microelectromechanical acceleration-sensing apparatus
|
US7051656B1
(en)
|
2003-08-14 |
2006-05-30 |
Sandia Corporation |
Microelectromechanical safing and arming apparatus
|
US7217582B2
(en)
*
|
2003-08-29 |
2007-05-15 |
Rochester Institute Of Technology |
Method for non-damaging charge injection and a system thereof
|
US7287328B2
(en)
*
|
2003-08-29 |
2007-10-30 |
Rochester Institute Of Technology |
Methods for distributed electrode injection
|
US7055640B2
(en)
*
|
2003-09-10 |
2006-06-06 |
Ford Global Technologies, Llc |
Fuel cut-off control system for a vehicle
|
JP2005098740A
(en)
*
|
2003-09-22 |
2005-04-14 |
Denso Corp |
Capacitance-type semiconductor dynamic quantity sensor
|
EP1678013B1
(en)
*
|
2003-10-09 |
2008-02-27 |
Conti Temic microelectronic GmbH |
Device for activating a security system in a vehicle
|
US20050132803A1
(en)
*
|
2003-12-23 |
2005-06-23 |
Baldwin David J. |
Low cost integrated MEMS hybrid
|
US8581308B2
(en)
*
|
2004-02-19 |
2013-11-12 |
Rochester Institute Of Technology |
High temperature embedded charge devices and methods thereof
|
US7068125B2
(en)
*
|
2004-03-04 |
2006-06-27 |
Robert Bosch Gmbh |
Temperature controlled MEMS resonator and method for controlling resonator frequency
|
US7287429B2
(en)
*
|
2004-03-25 |
2007-10-30 |
Denso Corporation |
Capacitive acceleration sensor system
|
US7102467B2
(en)
*
|
2004-04-28 |
2006-09-05 |
Robert Bosch Gmbh |
Method for adjusting the frequency of a MEMS resonator
|
JP2008502911A
(en)
*
|
2004-06-12 |
2008-01-31 |
アクバイオ・リミテッド |
Analytical instrument with an array of sensors and calibration elements
|
US20060065622A1
(en)
*
|
2004-09-27 |
2006-03-30 |
Floyd Philip D |
Method and system for xenon fluoride etching with enhanced efficiency
|
US20060066932A1
(en)
*
|
2004-09-27 |
2006-03-30 |
Clarence Chui |
Method of selective etching using etch stop layer
|
US7417783B2
(en)
*
|
2004-09-27 |
2008-08-26 |
Idc, Llc |
Mirror and mirror layer for optical modulator and method
|
US7369296B2
(en)
*
|
2004-09-27 |
2008-05-06 |
Idc, Llc |
Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
|
US7616013B2
(en)
*
|
2004-11-11 |
2009-11-10 |
Brigham Young University |
Micromechanical positional state sensing apparatus method and system
|
US7204162B2
(en)
*
|
2004-11-23 |
2007-04-17 |
Delphi Technologies, Inc. |
Capacitive strain gauge
|
DE102004058103B4
(en)
*
|
2004-12-01 |
2011-03-17 |
Technische Universität Chemnitz |
Device for adjusting the gap
|
US7140250B2
(en)
*
|
2005-02-18 |
2006-11-28 |
Honeywell International Inc. |
MEMS teeter-totter accelerometer having reduced non-linearty
|
JP4710700B2
(en)
*
|
2005-05-09 |
2011-06-29 |
株式会社デンソー |
Semiconductor device and manufacturing method thereof
|
US7337671B2
(en)
*
|
2005-06-03 |
2008-03-04 |
Georgia Tech Research Corp. |
Capacitive microaccelerometers and fabrication methods
|
CN100430740C
(en)
*
|
2005-06-09 |
2008-11-05 |
中国科学院电子学研究所 |
Interlacing vibration type electric-field sensor
|
DE102005028214A1
(en)
*
|
2005-06-17 |
2006-12-21 |
Siemens Ag |
Vibration Measurement System
|
EP2495212A3
(en)
|
2005-07-22 |
2012-10-31 |
QUALCOMM MEMS Technologies, Inc. |
Mems devices having support structures and methods of fabricating the same
|
EP1910218A1
(en)
|
2005-07-22 |
2008-04-16 |
Qualcomm Mems Technologies, Inc. |
Mems devices having support structures and methods of fabricating the same
|
JP4633574B2
(en)
*
|
2005-08-08 |
2011-02-16 |
三菱電機株式会社 |
Thin film structure and manufacturing method thereof
|
DE102005042085A1
(en)
*
|
2005-09-05 |
2007-03-15 |
Siemens Ag |
Vibration Measurement System
|
US20070074731A1
(en)
*
|
2005-10-05 |
2007-04-05 |
Nth Tech Corporation |
Bio-implantable energy harvester systems and methods thereof
|
US20070096974A1
(en)
*
|
2005-10-14 |
2007-05-03 |
Siemens Vdo Automotive Corporation |
Blending of sensors to produce alternate sensor characteristics
|
DE102005050351A1
(en)
*
|
2005-10-20 |
2007-04-26 |
Siemens Ag |
Vibration Measurement System
|
US7630114B2
(en)
*
|
2005-10-28 |
2009-12-08 |
Idc, Llc |
Diffusion barrier layer for MEMS devices
|
US7916980B2
(en)
|
2006-01-13 |
2011-03-29 |
Qualcomm Mems Technologies, Inc. |
Interconnect structure for MEMS device
|
US7382515B2
(en)
*
|
2006-01-18 |
2008-06-03 |
Qualcomm Mems Technologies, Inc. |
Silicon-rich silicon nitrides as etch stops in MEMS manufacture
|
US20070170528A1
(en)
|
2006-01-20 |
2007-07-26 |
Aaron Partridge |
Wafer encapsulated microelectromechanical structure and method of manufacturing same
|
US7617729B2
(en)
*
|
2006-02-21 |
2009-11-17 |
Physical Logic Ag |
Accelerometer
|
US7711239B2
(en)
|
2006-04-19 |
2010-05-04 |
Qualcomm Mems Technologies, Inc. |
Microelectromechanical device and method utilizing nanoparticles
|
US7623287B2
(en)
*
|
2006-04-19 |
2009-11-24 |
Qualcomm Mems Technologies, Inc. |
Non-planar surface structures and process for microelectromechanical systems
|
US7578189B1
(en)
|
2006-05-10 |
2009-08-25 |
Qualtre, Inc. |
Three-axis accelerometers
|
US8186232B2
(en)
*
|
2006-05-30 |
2012-05-29 |
The Timken Company |
Displacement sensor
|
US7405863B2
(en)
*
|
2006-06-01 |
2008-07-29 |
Qualcomm Mems Technologies, Inc. |
Patterning of mechanical layer in MEMS to reduce stresses at supports
|
US7628072B2
(en)
*
|
2006-07-19 |
2009-12-08 |
Freescale Semiconductor, Inc. |
MEMS device and method of reducing stiction in a MEMS device
|
DE102006033636B4
(en)
|
2006-07-20 |
2022-08-11 |
Robert Bosch Gmbh |
accelerometer
|
US7545552B2
(en)
*
|
2006-10-19 |
2009-06-09 |
Qualcomm Mems Technologies, Inc. |
Sacrificial spacer process and resultant structure for MEMS support structure
|
KR100899812B1
(en)
*
|
2006-12-05 |
2009-05-27 |
한국전자통신연구원 |
Capacitive accelerometer
|
US7706042B2
(en)
|
2006-12-20 |
2010-04-27 |
Qualcomm Mems Technologies, Inc. |
MEMS device and interconnects for same
|
US7535621B2
(en)
|
2006-12-27 |
2009-05-19 |
Qualcomm Mems Technologies, Inc. |
Aluminum fluoride films for microelectromechanical system applications
|
KR20090125087A
(en)
*
|
2007-02-20 |
2009-12-03 |
퀄컴 엠이엠스 테크놀로지스, 인크. |
Equipment and methods for etching of mems
|
US7810373B2
(en)
*
|
2007-02-22 |
2010-10-12 |
Seagate Technology Llc |
MEMS shock sensors
|
US7719752B2
(en)
|
2007-05-11 |
2010-05-18 |
Qualcomm Mems Technologies, Inc. |
MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
|
US7625825B2
(en)
*
|
2007-06-14 |
2009-12-01 |
Qualcomm Mems Technologies, Inc. |
Method of patterning mechanical layer for MEMS structures
|
US7569488B2
(en)
*
|
2007-06-22 |
2009-08-04 |
Qualcomm Mems Technologies, Inc. |
Methods of making a MEMS device by monitoring a process parameter
|
US8068268B2
(en)
*
|
2007-07-03 |
2011-11-29 |
Qualcomm Mems Technologies, Inc. |
MEMS devices having improved uniformity and methods for making them
|
WO2009015231A1
(en)
|
2007-07-25 |
2009-01-29 |
Qualcomm Mems Technologies, Inc. |
Mems display devices and methods of fabricating the same
|
US7752916B2
(en)
*
|
2007-08-31 |
2010-07-13 |
The Board Of Trustees Of The University Of Illinois |
Apparatus and method for material testing of microscale and nanoscale samples
|
US7814794B2
(en)
|
2007-09-07 |
2010-10-19 |
Pixart Imaging Inc. |
Micromachined sensors
|
DE102007057044B4
(en)
|
2007-09-10 |
2021-08-05 |
Continental Teves Ag & Co. Ohg |
Micromechanical spring
|
US7704849B2
(en)
*
|
2007-12-03 |
2010-04-27 |
Micron Technology, Inc. |
Methods of forming trench isolation in silicon of a semiconductor substrate by plasma
|
US7863079B2
(en)
|
2008-02-05 |
2011-01-04 |
Qualcomm Mems Technologies, Inc. |
Methods of reducing CD loss in a microelectromechanical device
|
US8023191B2
(en)
*
|
2008-05-07 |
2011-09-20 |
Qualcomm Mems Technologies, Inc. |
Printable static interferometric images
|
US8076893B2
(en)
*
|
2008-09-04 |
2011-12-13 |
The Board Of Trustees Of The University Of Illinois |
Displacement actuation and sensing for an electrostatic drive
|
WO2010029516A1
(en)
*
|
2008-09-15 |
2010-03-18 |
Nxp B.V. |
A capacitive sensor device and a method of sensing accelerations
|
EP2790004B1
(en)
*
|
2008-10-07 |
2019-04-17 |
Bruker Nano, Inc. |
Micro/nano-mechanical test system employing tensile test holder with push-to-pull transformer
|
US8499629B2
(en)
*
|
2008-10-10 |
2013-08-06 |
Honeywell International Inc. |
Mounting system for torsional suspension of a MEMS device
|
US7943525B2
(en)
*
|
2008-12-19 |
2011-05-17 |
Freescale Semiconductor, Inc. |
Method of producing microelectromechanical device with isolated microstructures
|
US8392340B2
(en)
*
|
2009-03-13 |
2013-03-05 |
Apple Inc. |
Method and apparatus for detecting conditions of a peripheral device including motion, and determining/predicting temperature(S) wherein at least one temperature is weighted based on detected conditions
|
JP5678442B2
(en)
*
|
2009-03-26 |
2015-03-04 |
セイコーエプソン株式会社 |
Physical quantity sensor and electronic equipment
|
JP2010249805A
(en)
*
|
2009-03-26 |
2010-11-04 |
Seiko Epson Corp |
Mems sensor, mems sensor manufacturing method, and electronic device
|
WO2010127453A1
(en)
|
2009-05-06 |
2010-11-11 |
Simoes Paulo G |
Stackable and collapsible trolley cart system
|
JP2011075543A
(en)
*
|
2009-09-07 |
2011-04-14 |
Seiko Epson Corp |
Physical quantity sensor, method for manufacturing the same, and electronic apparatus
|
US20110174074A1
(en)
*
|
2010-01-15 |
2011-07-21 |
Freescale Semiconductor, Inc. |
Framed transducer device
|
US8505380B2
(en)
*
|
2010-02-19 |
2013-08-13 |
Honeywell International Inc. |
Out-of plane comb-drive accelerometer
|
RU2457494C2
(en)
*
|
2010-04-26 |
2012-07-27 |
Государственное образовательное учреждение высшего профессионального образования "Тульский государственный университет" (ТулГУ) |
Axial accelerometer
|
US9021880B2
(en)
|
2010-04-30 |
2015-05-05 |
Qualcomm Mems Technologies, Inc. |
Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer
|
JP5527019B2
(en)
*
|
2010-05-28 |
2014-06-18 |
セイコーエプソン株式会社 |
Physical quantity sensor and electronic equipment
|
US8351053B2
(en)
|
2010-06-25 |
2013-01-08 |
The Board Of Trustees Of The University Of Illinois |
Apparatus and method for in situ testing of microscale and nanoscale samples
|
WO2012002514A1
(en)
|
2010-07-01 |
2012-01-05 |
ローム株式会社 |
Semiconductor device and method for manufacturing same
|
US20120146452A1
(en)
*
|
2010-12-10 |
2012-06-14 |
Miradia, Inc. |
Microelectromechanical system device and semi-manufacture and manufacturing method thereof
|
US9525925B2
(en)
|
2011-02-25 |
2016-12-20 |
Infineon Technologies Ag |
Sensor with movable part and biasing
|
CN102156203B
(en)
|
2011-03-15 |
2013-07-24 |
迈尔森电子(天津)有限公司 |
MEMS (micro-electromechanical system) inertial sensor and forming method of MEMS inertial sensor
|
JP5790920B2
(en)
|
2011-04-20 |
2015-10-07 |
セイコーエプソン株式会社 |
FUNCTIONAL ELEMENT, SENSOR ELEMENT, ELECTRONIC DEVICE, AND FUNCTIONAL ELEMENT MANUFACTURING METHOD
|
US8659816B2
(en)
|
2011-04-25 |
2014-02-25 |
Qualcomm Mems Technologies, Inc. |
Mechanical layer and methods of making the same
|
WO2012153335A1
(en)
*
|
2011-05-09 |
2012-11-15 |
Ramot At Tel-Aviv University Ltd. |
Bistable force and/or acceleration sensor
|
JP5790297B2
(en)
|
2011-08-17 |
2015-10-07 |
セイコーエプソン株式会社 |
Physical quantity sensor and electronic equipment
|
JP5999302B2
(en)
|
2012-02-09 |
2016-09-28 |
セイコーエプソン株式会社 |
Electronic device, manufacturing method thereof, and electronic apparatus
|
JP5983912B2
(en)
|
2012-02-09 |
2016-09-06 |
セイコーエプソン株式会社 |
Electronic device, manufacturing method thereof, and electronic apparatus
|
JP6056177B2
(en)
|
2012-04-11 |
2017-01-11 |
セイコーエプソン株式会社 |
Gyro sensor, electronic equipment
|
JP2014021037A
(en)
|
2012-07-23 |
2014-02-03 |
Seiko Epson Corp |
Mems device, electronic module, electronic apparatus, and moving body
|
US9711392B2
(en)
*
|
2012-07-25 |
2017-07-18 |
Infineon Technologies Ag |
Field emission devices and methods of making thereof
|
TWI548861B
(en)
*
|
2012-08-07 |
2016-09-11 |
國立清華大學 |
Inertial sensing device
|
CN102879608B
(en)
*
|
2012-10-26 |
2014-12-24 |
中国科学院上海微系统与信息技术研究所 |
Capacitive acceleration transducer for bending elastic beam and manufacturing method
|
US9235937B1
(en)
|
2013-06-05 |
2016-01-12 |
Analog Devices, Inc. |
Mounting method for satellite crash sensors
|
JP6206651B2
(en)
|
2013-07-17 |
2017-10-04 |
セイコーエプソン株式会社 |
Functional element, electronic device, and moving object
|
US9695515B2
(en)
*
|
2013-08-30 |
2017-07-04 |
Hewlett-Packard Development Company, L.P. |
Substrate etch
|
JP2016042074A
(en)
|
2014-08-13 |
2016-03-31 |
セイコーエプソン株式会社 |
Physical quantity sensor, electronic apparatus and moving body
|
CA3006938C
(en)
|
2014-12-10 |
2023-08-15 |
Paul D. Okulov |
Micro electro-mechanical strain displacement sensor and usage monitoring system
|
FR3030739B1
(en)
|
2014-12-18 |
2019-05-03 |
Commissariat A L'energie Atomique Et Aux Energies Alternatives |
DYNAMIC PRESSURE SENSOR WITH IMPROVED OPERATION
|
RU2597950C1
(en)
*
|
2015-06-22 |
2016-09-20 |
федеральное государственное автономное образовательное учреждение высшего образования "Южный федеральный университет" (Южный федеральный университет) |
Integral micro mechanical gyroscope accelerometer
|
US10877063B2
(en)
*
|
2015-12-10 |
2020-12-29 |
Invensense, Inc. |
MEMS sensor with compensation of residual voltage
|
DE102016215829A1
(en)
*
|
2016-08-23 |
2018-03-01 |
Robert Bosch Gmbh |
Micromechanical component
|
US10826208B1
(en)
*
|
2017-01-30 |
2020-11-03 |
Superior Sensor Technology |
Sensor with integrated electrical contacts
|
US10086809B1
(en)
*
|
2017-05-02 |
2018-10-02 |
Delphi Technologies, Inc. |
Automatic braking system
|
RU2660412C1
(en)
*
|
2017-08-23 |
2018-07-06 |
федеральное государственное автономное образовательное учреждение высшего образования "Южный федеральный университет" (Южный федеральный университет) |
Integrated micro-mechanical tunnel accelerometer
|
US10712360B2
(en)
|
2017-09-27 |
2020-07-14 |
Azoteq (Pty) Ltd |
Differential charge transfer based accelerometer
|
RU192953U1
(en)
*
|
2018-12-20 |
2019-10-08 |
федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) |
MEMS ACCELEROMETER
|
US11592533B2
(en)
|
2020-06-18 |
2023-02-28 |
Beijing Voyager Technology Co., Ltd. |
MEMS mirror structure with backside skeleton
|
US20220041429A1
(en)
*
|
2020-08-07 |
2022-02-10 |
Stmicroelectronics S.R.L. |
Microelectromechanical sensor device with improved stability to stress
|
US20220252636A1
(en)
*
|
2021-02-05 |
2022-08-11 |
Kionix, Inc. |
Accelerometer apparatuses and systems
|
RU2758814C1
(en)
*
|
2021-04-30 |
2021-11-02 |
Федеральное государственное бюджетное образовательное учреждение высшего образования «Московский авиационный институт (национальный исследовательский университет)» |
Micro-opto-electromechanical compensation converter of linear accelerations with circuits of coarse-precise stabilization of the sensitive element
|