CA2245549A1 - Assembly and method for testing integrated circuit devices - Google Patents

Assembly and method for testing integrated circuit devices

Info

Publication number
CA2245549A1
CA2245549A1 CA002245549A CA2245549A CA2245549A1 CA 2245549 A1 CA2245549 A1 CA 2245549A1 CA 002245549 A CA002245549 A CA 002245549A CA 2245549 A CA2245549 A CA 2245549A CA 2245549 A1 CA2245549 A1 CA 2245549A1
Authority
CA
Canada
Prior art keywords
testing
integrated circuit
assembly
circuit device
circuit devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002245549A
Other languages
French (fr)
Other versions
CA2245549C (en
Inventor
Tord L. Haulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2245549A1 publication Critical patent/CA2245549A1/en
Application granted granted Critical
Publication of CA2245549C publication Critical patent/CA2245549C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/24—Accessing extra cells, e.g. dummy cells or redundant cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration

Abstract

A testing assembly (10), and an associated method, for testing an integrated circuit device (12). The testing assembly (10) is capable of testing an integrated circuit device (12) having a large number of input and output terminals formed of either single-ended terminals (16) or differential terminals (20, 22). Static testing, both functional and parametric, can be performed upon the integrated circuit device (12). Additionally, dynamic testing of the integrated circuit device (12), even integrated circuit devices operable at high frequencies, is possible through operation of the testing assembly (10). Test signals are applied by way of signal rails (54, 56, 58) to the device (12) undergoing testing. A test signal response indicator (78) is coupled to observe responses to the test signals.
CA002245549A 1996-02-06 1997-01-17 Assembly and method for testing integrated circuit devices Expired - Lifetime CA2245549C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59597996A 1996-02-06 1996-02-06
US08/595,979 1996-02-06
PCT/SE1997/000068 WO1997029384A1 (en) 1996-02-06 1997-01-17 Assembly and method for testing integrated circuit devices

Publications (2)

Publication Number Publication Date
CA2245549A1 true CA2245549A1 (en) 1997-08-14
CA2245549C CA2245549C (en) 2003-04-08

Family

ID=24385505

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002245549A Expired - Lifetime CA2245549C (en) 1996-02-06 1997-01-17 Assembly and method for testing integrated circuit devices

Country Status (11)

Country Link
US (1) US5996102A (en)
EP (1) EP0882239B1 (en)
JP (1) JP2000504830A (en)
KR (1) KR19990082339A (en)
CN (1) CN1084878C (en)
AT (1) ATE433121T1 (en)
AU (1) AU1678697A (en)
CA (1) CA2245549C (en)
DE (1) DE69739438D1 (en)
HK (1) HK1019930A1 (en)
WO (1) WO1997029384A1 (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6392448B1 (en) 2000-02-03 2002-05-21 Teradyne, Inc. Common-mode detection circuit with cross-coupled compensation
US6300804B1 (en) 2000-02-09 2001-10-09 Teradyne, Inc. Differential comparator with dispersion reduction circuitry
US6647513B1 (en) * 2000-05-25 2003-11-11 International Business Machines Corporation Coverage-based test generation for microprocessor verification
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE10143173A1 (en) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafer probe has contact finger array with impedance matching network suitable for wide band
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US7089463B1 (en) * 2002-02-20 2006-08-08 Cisco Technology Inc. Test buffer design and interface mechanism for differential receiver AC/DC boundary scan test
US6990618B1 (en) * 2002-12-03 2006-01-24 Cypress Semiconductor Corporation Boundary scan register for differential chip core
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US6933853B2 (en) * 2003-06-12 2005-08-23 Hewlett-Packard Development Company, L.P. Apparatus and method for detecting and communicating interconnect failures
US20050024220A1 (en) * 2003-06-12 2005-02-03 Shidla Dale John Built-in circuitry and method to test connectivity to integrated circuit
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
KR20060126700A (en) 2003-12-24 2006-12-08 캐스케이드 마이크로테크 인코포레이티드 Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7307433B2 (en) * 2004-04-21 2007-12-11 Formfactor, Inc. Intelligent probe card architecture
KR20070058522A (en) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 Double sided probing structures
US7818640B1 (en) 2004-10-22 2010-10-19 Cypress Semiconductor Corporation Test system having a master/slave JTAG controller
US7305601B2 (en) * 2004-11-17 2007-12-04 Lsi Corporation Method and test apparatus for testing integrated circuits using both valid and invalid test data
DE102004059506B3 (en) * 2004-12-10 2006-08-17 X-Fab Semiconductor Foundries Ag Arrangement for testing embedded circuits using a separate supply voltage
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
US7555670B2 (en) * 2005-10-26 2009-06-30 Intel Corporation Clocking architecture using a bidirectional clock port
US8045353B2 (en) * 2005-12-30 2011-10-25 Stmicroelectronics Pvt. Ltd. Integrated circuit capable of operating at different supply voltages
US7609077B2 (en) * 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7382149B2 (en) * 2006-07-24 2008-06-03 International Business Machines Corporation System for acquiring device parameters
JP2008250725A (en) * 2007-03-30 2008-10-16 Nec Electronics Corp Interface circuit
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP4874210B2 (en) 2007-10-16 2012-02-15 株式会社アドバンテスト Test equipment
US8112043B2 (en) * 2008-04-11 2012-02-07 Infineon Technologies Ag Radio frequency communication devices and methods
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8230281B2 (en) * 2009-04-13 2012-07-24 Altera Corporation Techniques for boundary scan testing using transmitters and receivers
US10776233B2 (en) 2011-10-28 2020-09-15 Teradyne, Inc. Programmable test instrument
US9759772B2 (en) 2011-10-28 2017-09-12 Teradyne, Inc. Programmable test instrument
JP2013250250A (en) * 2012-06-04 2013-12-12 Advantest Corp Tester hardware and test system using the same
US9606183B2 (en) * 2012-10-20 2017-03-28 Advantest Corporation Pseudo tester-per-site functionality on natively tester-per-pin automatic test equipment for semiconductor test
CN103852709A (en) * 2012-11-28 2014-06-11 英业达科技有限公司 Test system and method of circuit board function and electronic component on circuit board
US8839063B2 (en) * 2013-01-24 2014-09-16 Texas Instruments Incorporated Circuits and methods for dynamic allocation of scan test resources
JP2014235127A (en) * 2013-06-04 2014-12-15 株式会社アドバンテスト Test system, control program, and configuration data write method
US10073806B2 (en) * 2015-05-13 2018-09-11 Qualcomm Incorporated Apparatus and methods for providing a reconfigurable bidirectional front-end interface
CN109061280A (en) * 2018-07-24 2018-12-21 北方电子研究院安徽有限公司 It is a kind of for testing the Auto-Test System of electric current, voltage
FR3093186B1 (en) * 2019-02-22 2021-11-26 St Microelectronics Rousset Method and device for detecting on a card any faults in a system fixed to said card
US11456729B1 (en) 2021-03-26 2022-09-27 Analog Devices, Inc. Deskew cell for delay and pulse width adjustment

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761695A (en) * 1972-10-16 1973-09-25 Ibm Method of level sensitive testing a functional logic system
US3833853A (en) * 1973-04-13 1974-09-03 Honeywell Inf Systems Method and apparatus for testing printed wiring boards having integrated circuits
US4236246A (en) * 1978-11-03 1980-11-25 Genrad, Inc. Method of and apparatus for testing electronic circuit assemblies and the like
US4348759A (en) * 1979-12-17 1982-09-07 International Business Machines Corporation Automatic testing of complex semiconductor components with test equipment having less channels than those required by the component under test
US4639664A (en) * 1984-05-31 1987-01-27 Texas Instruments Incorporated Apparatus for testing a plurality of integrated circuits in parallel
US4683569A (en) * 1985-10-21 1987-07-28 The Singer Company Diagnostic circuit utilizing bidirectional test data comparisons
US4660197A (en) * 1985-11-01 1987-04-21 Teradyne, Inc. Circuitry for synchronizing a multiple channel circuit tester
US4970454A (en) * 1986-12-09 1990-11-13 Texas Instruments Incorporated Packaged semiconductor device with test circuits for determining fabrication parameters
US4862067A (en) * 1987-06-24 1989-08-29 Schlumberger Technologies, Inc. Method and apparatus for in-circuit testing of electronic devices
EP0296884A3 (en) * 1987-06-24 1991-01-16 Schlumberger Technologies, Inc. Method for in-circuit testing of electronic devices
US4912709A (en) * 1987-10-23 1990-03-27 Control Data Corporation Flexible VLSI on-chip maintenance and test system with unit I/O cell design
US5084874A (en) * 1988-09-07 1992-01-28 Texas Instruments Incorporated Enhanced test circuit
US5168219A (en) * 1988-10-31 1992-12-01 Fujitsu Limited Integrated circuit device having signal discrimination circuit and method of testing the same
US4875003A (en) * 1989-02-21 1989-10-17 Silicon Connections Corporation Non-contact I/O signal pad scan testing of VLSI circuits
US4989209A (en) * 1989-03-24 1991-01-29 Motorola, Inc. Method and apparatus for testing high pin count integrated circuits
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
US5260947A (en) * 1990-12-04 1993-11-09 Hewlett-Packard Company Boundary-scan test method and apparatus for diagnosing faults in a device under test
US5155733A (en) * 1990-12-26 1992-10-13 Ag Communication Systems Corporation Arrangement for testing digital circuit devices having bidirectional outputs
JP2535670B2 (en) * 1991-01-28 1996-09-18 株式会社東芝 Boundary scan cancel for bidirectional input / output terminals
US5260948A (en) * 1991-03-13 1993-11-09 Ncr Corporation Bidirectional boundary-scan circuit
US5323107A (en) * 1991-04-15 1994-06-21 Hitachi America, Ltd. Active probe card
US5196788A (en) * 1991-07-03 1993-03-23 The United States Of America As Represented By The Secretary Of The Navy Self-contained functional test apparatus for modular circuit cards
US5202625A (en) * 1991-07-03 1993-04-13 Hughes Aircraft Company Method of testing interconnections in digital systems by the use of bidirectional drivers
TW253097B (en) * 1992-03-02 1995-08-01 At & T Corp
US5457400A (en) * 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
US5268639A (en) * 1992-06-05 1993-12-07 Rambus, Inc. Testing timing parameters of high speed integrated circuit devices
US5450415A (en) * 1992-11-25 1995-09-12 Matsushita Electric Industrial Co., Ltd. Boundary scan cell circuit and boundary scan test circuit
US5450418A (en) * 1992-12-23 1995-09-12 Advanced Micro Devices, Inc. Pseudo master slave capture mechanism for scan elements
US5428624A (en) * 1993-10-12 1995-06-27 Storage Technology Corporation Fault injection using boundary scan
US5513186A (en) * 1993-12-07 1996-04-30 Sun Microsystems, Inc. Method and apparatus for interconnect testing without speed degradation

Also Published As

Publication number Publication date
EP0882239B1 (en) 2009-06-03
HK1019930A1 (en) 2000-03-03
EP0882239A1 (en) 1998-12-09
CN1217062A (en) 1999-05-19
CN1084878C (en) 2002-05-15
DE69739438D1 (en) 2009-07-16
KR19990082339A (en) 1999-11-25
CA2245549C (en) 2003-04-08
WO1997029384A1 (en) 1997-08-14
AU1678697A (en) 1997-08-28
JP2000504830A (en) 2000-04-18
ATE433121T1 (en) 2009-06-15
US5996102A (en) 1999-11-30

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Effective date: 20170117