CA2247556C - Method and apparatus for bonding an active tag to a patch and a tire - Google Patents
Method and apparatus for bonding an active tag to a patch and a tire Download PDFInfo
- Publication number
- CA2247556C CA2247556C CA002247556A CA2247556A CA2247556C CA 2247556 C CA2247556 C CA 2247556C CA 002247556 A CA002247556 A CA 002247556A CA 2247556 A CA2247556 A CA 2247556A CA 2247556 C CA2247556 C CA 2247556C
- Authority
- CA
- Canada
- Prior art keywords
- patch
- tire
- rubber
- assembly
- monitoring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/0061—Accessories, details or auxiliary operations not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0491—Constructional details of means for attaching the control device
- B60C23/0493—Constructional details of means for attaching the control device for attachment on the tyre
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/06—Pneumatic tyres or parts thereof (e.g. produced by casting, moulding, compression moulding, injection moulding, centrifugal casting)
- B29D30/0601—Vulcanising tyres; Vulcanising presses for tyres
- B29D30/0662—Accessories, details or auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C19/00—Tyre parts or constructions not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L7/00—Compositions of natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/07764—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier attachable to a tire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/80—Identifying, e.g. coding, dating, marking, numbering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/0061—Accessories, details or auxiliary operations not otherwise provided for
- B29D2030/0072—Attaching fasteners to tyres, e.g. patches, in order to connect devices to tyres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/0061—Accessories, details or auxiliary operations not otherwise provided for
- B29D2030/0077—Directly attaching monitoring devices to tyres before or after vulcanization, e.g. microchips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/0061—Accessories, details or auxiliary operations not otherwise provided for
- B29D2030/0083—Attaching monitoring devices to tyres before or after vulcanization by inserting them inside tyre cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/06—Pneumatic tyres or parts thereof (e.g. produced by casting, moulding, compression moulding, injection moulding, centrifugal casting)
- B29D30/0681—Parts of pneumatic tyres; accessories, auxiliary operations
- B29D2030/0682—Inner liners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D30/00—Producing pneumatic or solid tyres or parts thereof
- B29D30/06—Pneumatic tyres or parts thereof (e.g. produced by casting, moulding, compression moulding, injection moulding, centrifugal casting)
- B29D30/72—Side-walls
- B29D2030/728—Decorating or marking the sidewalls after tyre vulcanization
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T152/00—Resilient tires and wheels
- Y10T152/10—Tires, resilient
- Y10T152/10495—Pneumatic tire or inner tube
- Y10T152/10819—Characterized by the structure of the bead portion of the tire
Abstract
A method and apparatus for bonding an active tag to a patch and assembling the patch to a tire is set forth. A patch assembly and a method for securing an electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising an rigid tag assembly encapsulating the electronic monitoring device, bonded to a vulcanized rubber patch which is secured to the inner cavity of a tire utilizing a layer of dual cure bonding rubber.
Description
METHOD AND APPARATUS FOR BONDING
AN ACTIVE TAG TO A PATCH AND A TIRE
FIELD OF THE INVENTION
s This invention pertains to an apparatus and a method of bonding an active tag to a patch and to a tire. More particularly, this invention sets forth a method and apparatus for encapsulating an electronic device in a rigid material, mounting the device on a vulcanized rubber patch and bonding the rubber patch to a vulcanized tire.
io BACKGROUND OF THE INVENTION
It is desirable to monitor engineering coriditions of tires, such as wear, internal pressure and internal temperature in order to reduce tire costs and maximize vehicle efficiency. Of course, it is advantageous to perform such is monitoring in large truck tires, which are expensive.
Prior art methods of monitoring large truck tires have included passive integrated circuits embedded in the body of the tire, or self-powered circuits which are positioned external to the tire. The passive integrated circuits rely on inductive magnetic coupling or capacitative coupling to energize the 2o circuit, thus providing power to the circuit from a source remote from the tire.
Self-powered circuits positioned external to the tire are exposed to damage from the environment such as weather, road hazards and even vandalism.
Recent engineering advances have permitted the installation of monitoring devices having active integrated circuits within tires. One such 2s device is described in U.S. Patent No. 5,562,787 to Koch et al. entitled "Method of Monitoring Conditions of Vehicle Tires", incorporated herein by reference, and assigned to the assignee of the present invention. These devices include an active circuit powered by a dedicated long life, miniature battery and at least one sensor for detecting, optionally storing and 3o transmitting real time engineering conditions within the tire. Such devices are capable of being programmed to remain in an active, but dormant condition, but will switch automatically to an "awakened' condition in response to an external signal or a condition which exceeds preset limits.
One of the problems faced with such active devices is that they are delicate electronic devices that must operate in the harsh environment of a s tire. Thus it is important to secure these devices in the tires to minimize the effect of the harsh tire environment on them, while still permitting them to be exposed to this environment to allow accurate monitoring of the engineering conditions for the life of the tire. These active devices have previously been mounted in tires by first encapsulating the device or power-containing circuit io in a material which forms a rigid or semi-rigid encasement about the device, thereby inhibiting straining of the device as a result of applied stresses.
Such materials have included non-foam compounds such as urethanes, epoxies, polyester-styrene resins, hard rubber compositions, and the like.
The encapsulated device is then placed into a green rubber material which is forms a housing or is placed in a green rubber pocket or pouch that becomes part of the tire. The encapsulated device is then permanently set within the rubber material during a subsequent vulcanizing operation. The green rubber material containing the encapsulated device may be assembled to the green tire and then vulcanized with the tire. Alternatively, the green patch 2o containing the encapsulated device may be separately vulcanized and then affixed to a cured tire with a suitable adhesive. In either event, the delicate electronic components of the active tag are exposed to high vulcanizing temperatures which may adversely affect their performance or shorten their life. Additionally, certain components of the device, such as the pressure 2s sensor or a thermistor must remain open to the pressurized tire cavity. The flow of rubber occurring during the vulcanization process can effect the openings to the tire cavity. As set forth in U.S. Patent No. 5,562,787, the opening to the tire cavity can remain open during the curing operations by placement of a dowel into the opening.
3o While the methods and apparatus of U.S. Patent No. 5,562,787 provide an acceptable method of assembling an active chip into a tire cavity, an improved method and apparatus which increases the life of the active chip in the tire is desirable.
AN ACTIVE TAG TO A PATCH AND A TIRE
FIELD OF THE INVENTION
s This invention pertains to an apparatus and a method of bonding an active tag to a patch and to a tire. More particularly, this invention sets forth a method and apparatus for encapsulating an electronic device in a rigid material, mounting the device on a vulcanized rubber patch and bonding the rubber patch to a vulcanized tire.
io BACKGROUND OF THE INVENTION
It is desirable to monitor engineering coriditions of tires, such as wear, internal pressure and internal temperature in order to reduce tire costs and maximize vehicle efficiency. Of course, it is advantageous to perform such is monitoring in large truck tires, which are expensive.
Prior art methods of monitoring large truck tires have included passive integrated circuits embedded in the body of the tire, or self-powered circuits which are positioned external to the tire. The passive integrated circuits rely on inductive magnetic coupling or capacitative coupling to energize the 2o circuit, thus providing power to the circuit from a source remote from the tire.
Self-powered circuits positioned external to the tire are exposed to damage from the environment such as weather, road hazards and even vandalism.
Recent engineering advances have permitted the installation of monitoring devices having active integrated circuits within tires. One such 2s device is described in U.S. Patent No. 5,562,787 to Koch et al. entitled "Method of Monitoring Conditions of Vehicle Tires", incorporated herein by reference, and assigned to the assignee of the present invention. These devices include an active circuit powered by a dedicated long life, miniature battery and at least one sensor for detecting, optionally storing and 3o transmitting real time engineering conditions within the tire. Such devices are capable of being programmed to remain in an active, but dormant condition, but will switch automatically to an "awakened' condition in response to an external signal or a condition which exceeds preset limits.
One of the problems faced with such active devices is that they are delicate electronic devices that must operate in the harsh environment of a s tire. Thus it is important to secure these devices in the tires to minimize the effect of the harsh tire environment on them, while still permitting them to be exposed to this environment to allow accurate monitoring of the engineering conditions for the life of the tire. These active devices have previously been mounted in tires by first encapsulating the device or power-containing circuit io in a material which forms a rigid or semi-rigid encasement about the device, thereby inhibiting straining of the device as a result of applied stresses.
Such materials have included non-foam compounds such as urethanes, epoxies, polyester-styrene resins, hard rubber compositions, and the like.
The encapsulated device is then placed into a green rubber material which is forms a housing or is placed in a green rubber pocket or pouch that becomes part of the tire. The encapsulated device is then permanently set within the rubber material during a subsequent vulcanizing operation. The green rubber material containing the encapsulated device may be assembled to the green tire and then vulcanized with the tire. Alternatively, the green patch 2o containing the encapsulated device may be separately vulcanized and then affixed to a cured tire with a suitable adhesive. In either event, the delicate electronic components of the active tag are exposed to high vulcanizing temperatures which may adversely affect their performance or shorten their life. Additionally, certain components of the device, such as the pressure 2s sensor or a thermistor must remain open to the pressurized tire cavity. The flow of rubber occurring during the vulcanization process can effect the openings to the tire cavity. As set forth in U.S. Patent No. 5,562,787, the opening to the tire cavity can remain open during the curing operations by placement of a dowel into the opening.
3o While the methods and apparatus of U.S. Patent No. 5,562,787 provide an acceptable method of assembling an active chip into a tire cavity, an improved method and apparatus which increases the life of the active chip in the tire is desirable.
SUMMARY OF THE INVENTION
In accordance with the present invention, an improved method and s apparatus for assembling an active electronic monitoring device into a tire cavity is disclosed.
The improved method and apparatus increases the life of the electronic monitoring device by minimizing the stress, strain, cyclic fatigue, impact and vibration to which the electronic monitoring device is subjected io when properly assembled into a tire. While the location of the device is an important factor in determining the life of an electronic monitoring device located within a tire, so too is the manner in which the device is installed into the tire. A method for securing within a tire an electronic monitoring device for monitoring at least one engineering condition of a tire comprises the steps is of encapsulating an electronic monitoring device by placing the electronic monitoring device into a mold having a preselected configuration, the preselected configuration including at least one face having an alternating raised and recessed pattern to increase the surface area of the face. The mold is filled with an epoxy potting material so that the electronic monitoring 2o device is encased by the epoxy. The epoxy potting material is cured to form a rigid tag assembly having a preselected configuration. However, certain electronic components comprising the electronic monitoring device, such as pressure sensors, are assembled in such a manner as to remain free from internal contamination while remaining open to the tire atmosphere as 2s necessary. A rubber tire patch having a preselected configuration is formed.
The rubber patch includes a first side for interfacing with the face of the encapsulated rigid tag assembly. This first side has increased surface area, which allows for a better bond with the encapsulated tag. The first side also includes a recessed cavity surrounded by a ridge of material of sufficient 3o height to capture the encapsulated rigid tag assembly This ridge helps to improve the bond between the rubber patch and the encapsulated rigid tag.
The patch includes a second opposite side, the second side approximating the contour of the inner liner of the tire. The patch is tapered from the first side toward the second side, with the second side flaring out into a relatively thin configuration, but having a radius approaching the radius of the tire inner liner. The rubber patch is vulcanized at a preselected temperature and for a time sufficient its vulcanization. After vulcanization, a thin layer of dual cure s bonding rubber is applied to the second side of the vulcanized rubber patch.
This thin layer of dual cure bonding rubber will permit the assembly of the patch assembly to the inner liner of the tire. A fluid epoxy adhesive is applied to an interface between the encapsulated tag assembly and the rubber patch. The encapsulated tag assembly is assembled into the to recessed cavity on the first side of the rubber patch so that the fluid epoxy adhesive is evenly distributed across the interface and flows from the interface between the encapsulated tag assembly and the rubber patch. Of course, the increased surface area of the tag assembly allows for better bonding between the rubber patch and the encapsulated tag. The assembly is or the encapsulated tag and the rubber patch is allowed to cure to form a patch assembly. The patch assembly is then assembled to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire. This curing process permanently bonds the patch assembly to the inner liner and is diffusion-controlled.
2o Because it is diffusion controlled, the curing must be done for a sufficient amount of time and at a sufficient temperature to allow a strong permanent bond to form. To assure that solid contact is maintained at the interface between the inner liner of the tire and the dual cure bonding layer of the patch assembly, a clamping mechanism is applied to secure the patch 2s assembly to the inner liner during the curing process. The clamping mechanism is applied with sufficient pressure across the interface of the patch assembly and the inner liner to assure intimate contact during curing.
In accordance with the present invention, an improved method and s apparatus for assembling an active electronic monitoring device into a tire cavity is disclosed.
The improved method and apparatus increases the life of the electronic monitoring device by minimizing the stress, strain, cyclic fatigue, impact and vibration to which the electronic monitoring device is subjected io when properly assembled into a tire. While the location of the device is an important factor in determining the life of an electronic monitoring device located within a tire, so too is the manner in which the device is installed into the tire. A method for securing within a tire an electronic monitoring device for monitoring at least one engineering condition of a tire comprises the steps is of encapsulating an electronic monitoring device by placing the electronic monitoring device into a mold having a preselected configuration, the preselected configuration including at least one face having an alternating raised and recessed pattern to increase the surface area of the face. The mold is filled with an epoxy potting material so that the electronic monitoring 2o device is encased by the epoxy. The epoxy potting material is cured to form a rigid tag assembly having a preselected configuration. However, certain electronic components comprising the electronic monitoring device, such as pressure sensors, are assembled in such a manner as to remain free from internal contamination while remaining open to the tire atmosphere as 2s necessary. A rubber tire patch having a preselected configuration is formed.
The rubber patch includes a first side for interfacing with the face of the encapsulated rigid tag assembly. This first side has increased surface area, which allows for a better bond with the encapsulated tag. The first side also includes a recessed cavity surrounded by a ridge of material of sufficient 3o height to capture the encapsulated rigid tag assembly This ridge helps to improve the bond between the rubber patch and the encapsulated rigid tag.
The patch includes a second opposite side, the second side approximating the contour of the inner liner of the tire. The patch is tapered from the first side toward the second side, with the second side flaring out into a relatively thin configuration, but having a radius approaching the radius of the tire inner liner. The rubber patch is vulcanized at a preselected temperature and for a time sufficient its vulcanization. After vulcanization, a thin layer of dual cure s bonding rubber is applied to the second side of the vulcanized rubber patch.
This thin layer of dual cure bonding rubber will permit the assembly of the patch assembly to the inner liner of the tire. A fluid epoxy adhesive is applied to an interface between the encapsulated tag assembly and the rubber patch. The encapsulated tag assembly is assembled into the to recessed cavity on the first side of the rubber patch so that the fluid epoxy adhesive is evenly distributed across the interface and flows from the interface between the encapsulated tag assembly and the rubber patch. Of course, the increased surface area of the tag assembly allows for better bonding between the rubber patch and the encapsulated tag. The assembly is or the encapsulated tag and the rubber patch is allowed to cure to form a patch assembly. The patch assembly is then assembled to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire. This curing process permanently bonds the patch assembly to the inner liner and is diffusion-controlled.
2o Because it is diffusion controlled, the curing must be done for a sufficient amount of time and at a sufficient temperature to allow a strong permanent bond to form. To assure that solid contact is maintained at the interface between the inner liner of the tire and the dual cure bonding layer of the patch assembly, a clamping mechanism is applied to secure the patch 2s assembly to the inner liner during the curing process. The clamping mechanism is applied with sufficient pressure across the interface of the patch assembly and the inner liner to assure intimate contact during curing.
In accordance with one aspect of the present invention, there is provided a method for forming a patch assembly for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising the steps of encapsulating an electronic monitoring device by placing the electronic monitoring device into a mold having a preselected configuration, the preselected configuration including at least one face having an alternating raised and recessed pattern to increase the surface area of the face, filling the mold with an epoxy potting material, and curing the epoxy potting material to form a rigid tag assembly having the preselected configuration in such a manner so as allow the electronic components to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
manufacturing a rubber patch having a preselected configuration, the rubber patch having edges, a first side for interfacing with the face of the encapsulated rigid tag assembly, the first side having increased surface area, the first side of the rubber patch including a recessed cavity surrounded by a ridge of material of sufficient height to capture the encapsulated rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
vulcanizing the rubber patch at a preselected temperature and for a time sufficient for vulcanization; applying a layer of dual cure bonding rubber to the second side of the vulcanized rubber patch; applying a fluid epoxy adhesive to an interface between the encapsulated tag assembly and the rubber patch; assembling the encapsulated tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from the interface between the encapsulated tag assembly and the rubber patch; and curing the assembly to form a patch assembly.
In accordance with another aspect of the present invention, there is also provided a method for securing within a tire an electronic monitoring device for monitoring at least one engineering condition of a tire, in such a manner and in such a location so as to minimize stress, strain, cyclic fatigue, impact and vibration, comprising the steps of:
providing a rigid tag assembly having an encapsulated monitoring device that allows the electronic components of the monitoring device to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
providing a rubber patch having edges, a first side for interfacing with at least one surface of the rigid tag, the first side including a recessed cavity surrounded by a ridge of material of sufficient -4a-height to capture the rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges; applying a layer of dual cure bonding rubber to the second side of the rubber patch; applying a fluid epoxy adhesive to an interface between the tag assembly and the rubber patch; assembling the tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from an interface between the surface of the encapsulated tag assembly and the rubber patch;
curing the tag assembly to form a patch assembly; assembling the patch assembly to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire; then, stitching the patch assembly to the inner liner of the vulcanized tire; and curing the patch/tire assembly at a temperature and for a time sufficient to form a strong bond.
In accordance with yet another aspect of the present invention, there is also provided a tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising: a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated rigid monitoring device and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height capable of surrounding a portion of the outer periphery of the encapsulated rigid monitoring device; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
In accordance with yet another aspect of the present invention, there is also provided a patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising: a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery; a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of -4b-sufficient height surrounding a portion of the outer periphery of the rigid tag assembly; an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
In accordance with yet another aspect of the present invention, there is also provided a tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising: a vulcanized tire having an inner liner; a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery; a vulcanized rubber patch of preselected configuration having edges, a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly; an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently cured to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
In accordance with yet another aspect of the present invention, there is also provided a tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising: a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving a cylindrical encapsulated monitoring device; a rubber patch of preselected configuration having a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side for interfacing with a face of an encapsulated rigid monitoring device and the second opposite side approximating the contour of an inner liner of a tire; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being -4c-permanently assembled to the second side of the rubber patch, while the second surface is uncured.
In accordance with yet another aspect of the present invention, there is also provided a patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising: a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer cylindrical periphery; a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly; a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire; an adhesive layer securing at least the outer cylindrical periphery of the rigid tag assembly within the recessed cavity of the cylindrical rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch, while the second surface is uncured.
In accordance with yet another aspect of the present invention, there is also provided a tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising: a vulcanized tire having an inner liner; a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the cylindrical rigid tag assembly having a cylindrical outer periphery wall, an upper surface and a lower surface; a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly; a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire; an adhesive layer securing at least the cylindrical outer periphery wall of the rigid tag -4d-assembly to the cylindrical wall of the rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently bonded to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
In accordance with yet another aspect of the present invention, there is also provided in combination: a pneumatic tire having an innerliner; an electronic monitoring device for monitoring at least one engineering condition of the tire; an attachment patch mounted to the innerliner of the tire; the attachment patch including a first side and a second side; the second side of the attachment patch being connected to the innerliner; the first side of the patch including a recessed cavity; the electronic monitoring device disposed at least partially in the recessed cavity; and the patch including a ridge surrounding the recessed cavity.
In accordance with yet another aspect of the present invention, there is also provided a method for mounting an electronic monitoring device to a tire having an innerliner and a chamber, the method comprising the steps of providing an electronic monitoring device that is adapted to monitor at least one engineering condition of a tire;
the electronic monitoring device having an upper surface adapted to face the chamber of the tire; providing an attachment patch; mounting at least part of the electronic monitoring device to the attachment patch; the attachment patch being free of members that cover the upper surface of the electronic monitoring device such that the upper surface of the electronic monitoring device is exposed to the chamber of the tire when the attachment patch is mounted to the tire; and mounting the attachment patch to the tire.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a perspective view of the tire patch of the present invention.
-4e-Fig. 2 is a cross-sectional view of the rigid tag assembly, showing the encapsulated electronic monitoring device.
s Fig. 3 is a cross-sectional view of the mold used to encapsulate the electronic monitoring device, producing the rigid tag assembly.
Fig. 4 is a perspective view of the patch assembly of the present invention.
io Fig. 5 is a cross-sectional view of the patch assembled to the inner liner of a tire.
Fig. 6 is a perspective view of an alternative configuration of the tire is patch of the present invention.
Fig. 7 is a cross-sectional view of the rigid tag assembly of Fig. 6, showing the encapsulated electronic monitoring device.
zo Fig. 8 is a perspective view of the patch assembly of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
2s Embodiments of the present invention will be described below with reference to the drawings.
Fig, 1 shows a tire patch 10 of the present invention. The tire patch is of a preselected configuration, which as shown, is rectangular in shape. The patch may be of any other convenient configuration, but is shown as 3o rectangular, and therefore has four edges 11. The tire patch 10 has a first side 12 for interfacing with a face of an encapsulated tag assembly 30, shown in Fig. 2. The patch has a second opposite side 14 approximating the contour of an inner liner of a tire. The contour of the second side 14 preferably is radiused to have about the same radius as the tire to which it is assembled, the radius being larger for larger tires. For very large tires, such as for off-the-road tires, the radius may be eliminated altogether, so that there is no contour and the opposite side is flat, having no contour.
s The rubber patch is vulcanized at a preselected temperature and for a time sufficient to vulcanize the patch. The patch may be rubber selected from the group consisting of Ethylene Propylene Diene Monomer (EPDM) rubber, butyl rubber, natural rubber, neoprene and mixtures thereof. One preferred embodiment is a mixture of chlorobutyl rubber and natural rubber.
io Another preferred embodiment is a mixture of Styrene-Butadiene rubber (SBR) and natural rubber. Typically, patches made of these rubber compositions may be cured by heating to a temperature of about 150°C
and holding at this temperature for about 30 minutes. The time and temperature may be modified as necessary to achieve sufficient curing of the patch for Is further assembly.
The first side 12 includes a recessed cavity 16 which is surrounded by a raised ridge 18 of rubbery polymer material. The recessed cavity optionally may have a roughened bottom surface to increase its surface area.
The ridge 18 preferably is of the same material as the remainder of the patch.
2o The ridge of material should be of sufficient height to capture the encapsulated rigid tag 30. In a preferred embodiment, the ridge is about one eighth (1/8") inch. The patch is gradually tapered from the ridge 18 of material of the first side of the patch 12, outwardly toward the edges of the patch.
2s Affixed to the second side 14 of the vulcanized tire patch is a dual cure bonding layer 20, which has a first side (not shown) and a second side 22.
This dual cure bonding layer may be assembled to the patch at any time following vulcanization of the patch and prior to assembly of the patch assembly to the tire innerliner. The dual cure bonding layer is permanently 3o assembled to the patch. A non-curing cement (not shown) is applied to side 14 of the patch in order to hold the dual cure bonding layer 20 onto the patch.
The non-curing cement and the dual cure bonding layer are products of Patch Rubber Company. The important feature of the dual cure bonding layer is that it can be chemically activated and cured, without the need for heating to an elevated temperature. The process is diffusion controlled, however, and some minimal heating will speed the curing process. The dual s cure bonding layer may be any material which can be activated and cured to the vulcanized rubber of the tire inner liner and the vulcanized patch.
Preferably, however, the dual cure bonding rubber is natural rubber. The dual cure bonding rubber, after application of the activating cement, may cure at room temperature over a period of seventy two (72) hours. However, if Io more rapid curing is desired. this may be accomplished by heating to 45°C for at least twenty four hours.
Fig. 2 shows a cross-sectional view of the rigid tag assembly 30, showing the encapsulated electronic monitoring device 32. Monitoring device may be a circuit board 34 which includes electronic memory as well as a is variety of sensors for monitoring engineering conditions such as, for example, pressure, temperature and distance traveled. The monitoring device is discussed in detail in U.S. Patent No. 5,562,787, incorporated herein by reference. Mounted to the board is a power source 36, such a battery, which permits the active monitoring of the engineering conditions, which may be 2o stored in the electronic memory for later use. The power source provides a bulge 38 to the rigid tag assembly, although this feature is expected to become less prominent or even completely eliminated as advances in battery technology produce smaller yet more powerful batteries. The rigid tag assembly may also house an antenna, or may provide for assembly of an 2s antenna which protrudes from the tag assembly so that the circuitry on the board can be activated for transmittal at will.
The circuit board including sensors, battery and optional antenna, hereinafter referred to as the electronic monitoring device, are encapsulated in a potting material 40 which solidifies into a rigid material. Referring to Fig.
30 3, the electronic monitoring device is placed within a mold 40 having a first half 52 and a second half 54. At least one of the mold halves has a face with increased surface area, shown as surface 56 in the second half 54 of mold 40. The mold is then filled with the potting material 40 in fluid form, which fills the mold and flows around the electronic monitoring device and allowed to cure, resulting in a rigid tag assembly. Any potting material having a Young's Modulus of at least 30,000 psi and which is capable of being molded s around the electronic monitoring device without damaging any of the components of the device. Preferably, the potting material has a Young's Modulus of at least about 100,000 psi. Two preferred potting materials include epoxy and urethane. If desired, the curing of the potting material around the electronic device may be accelerated by preheating the mold to io an elevated temperature which is above ambient, but below the temperature at which damage to the electronic monitoring device will occur. A preferred temperature is about 80°C. After the epoxy has been cured, the mold halves 52, 54 are separated, yielding a rigid, encapsulated tag assembly 30. Tag assembly 30 has a bottom surface 42 having increased surface finish which is is simply the impression of surface 56 from mold half 54.
Rigid tag assembly 30 is assembled into the recessed cavity 16 on the first side 12 of tire patch 10 either after vulcanization of the patch or after assembly of the dual bond curing layer 20 to the patch. In order to permanently adhere tag assembly 30 to patch 10, a fluid adhesive is applied 2o to the interface between tag assembly 30 and recess 16. This adhesive, preferably an epoxy adhesive, may be applied conveniently to surface 42 of tag assembly or to the base of recess 16. As tag assembly 30 is pressed into recessed cavity 16, the epoxy adhesive flows evenly along the interface between surface 42 and the base of recess 16. The increased surface area 2s between the base of recessed cavity 16 and surface 52 provides for additional bonding area and a stronger bond. Because the ridges around the recess are closely dimensioned to correspond to the dimensions of tag assembly 30, excess epoxy will flow between tag assembly 30 and ridge 18, and some epoxy may even flow out from this region. Of course, the flow of 3o epoxy in this region will add to the strength of the assembly as the epoxy cures. While the epoxy can be allowed to cure at room temperature, the curing process can be accelerated by heating the assembly at an elevated _8_ temperature, for example a temperature of from about 75-90°C for at least about 30 minutes. If the dual cure bonding layer has not already been assembled to the second side 14 of tire patch 10, it may be added at this time to form patch assembly 60.
s Referring now to Fig. 5, Patch assembly 60 was then assembled to the inner liner 75 of tire 70. Activating cement was first applied to second side of dual cure bonding layer 20. The patch assembly was then stitched to the inner liner of the vulcanized tire and the patch assemblyltire assembly was allowed to cure for a sufficient time and temperature to form a strong bond Io between the tire and the patch assembly. The times and temperatures utilized for this curing may be basically the same times and temperatures as previously discussed. To ensure a strong bond, the patch assembly optionally may be clamped to the tire inner liner 75, until the curing cycle is completed.
is Fig. 6 shows an alternative configuration of a tire patch 110 of the present invention. The tire patch 110 is of a preselected configuration, which as shown, is round in shape. The tire patch 110 has a first side 112 for interfacing with a face of an encapsulated tag assembly 130, shown in cross-section in Fig. 7. First side 112 includes a recessed cavity 116 , which in this 2o alternative configuration is formed by a cylindrical rigid insert 117 molded into the rubber patch. Preferably cylindrical insert 117 is a rigid plastic material, such as nylon, epoxy or a rigid composite material such as glass-filled polyimide or glass-filled epoxy, but also may be a metal, as long as the metal does not interfere with the electronic functions and operation of tag assembly 2s 130. Cylindrical rigid insert 117 is surrounded by a ridge 118 of rubbery material. The ridge preferably is of the same material as the remainder of the patch and should be of sufficient height to permanently hold cylindrical insert 117 in place following curing. In a preferred embodiment shown in Figs. 6 and 7, the ridge 118 is the same height as cylindrical insert 117. The patch is 3o gradually tapered from the ridge 118 of material of the first side of the patch outwardly toward the edges of the patch. Recessed cavity 116 may have a roughened bottom surface to increase its surface area, as previously _9_ described, or alternatively may be smooth and made from the same material as the cylindrical insert. The patch has a second opposite side 114 which may approximate the contour of an inner liner of a tire. The contour of the second side 114 preferably is radiused to have about the same radius as the s tire to which it is assembled, the radius being larger for larger tires. For very large tires, such as for off-the-road tires, the radius may be eliminated altogether, so that there is no contour and the opposite side 114 is flat, having no contour. Tire patch 110 including cylindrical rigid insert 117 is cured prior to insertion of rigid tag assembly 130 to form a round patch io assembly.
Rigid tag assembly 130, which includes the encapsulated electronic monitoring device and has the same components as previously described, is essentially identical to rigid tag assembly 30 except for its profile, being round or circular instead of rectangular. Round rigid tag assembly 130 is is permanently bonded to the round patch assembly by inserting rigid tag assembly 130 into cylindrical insert 117, as shown in Fig. 8, after applying an epoxy adhesive such as a Fusor system manufactured by Lord Corp. of Erie PA. to the interface between the rigid tag assembly 130 and the cylindrical insert 117. Of course, the epoxy adhesive also may conveniently be applied 2o to the interface between the bottom of cavity 116, whether it is a roughened surface or made of the same or similar material as cylindrical insert 117. As the rigid tag assembly 130 is inserted into cylindrical insert 117, excess epoxy flows out from the interface, which must be removed before it cures.
Cylindrical insert 117 only must be of sufficient height so that after curing of zs the epoxy, there is sufficient bonding strength between the insert 117 and tag assembly 130 to assure no separation. Although the rigid tag assembly 130 may be of the same height as cylindrical insert 117, as shown in the preferred embodiment, it also may be lower or higher than cylindrical insert 117 upon assembly. If tag assembly 130 is higher than the cylindrical insert 117, then 3o insert 117 has a lower profile than the rigid tag assembly 130 so that the outer periphery of the rigid tag assembly 130 extends above the outer periphery of the cylindrical insert 117, thereby reducing the overall amount of material required for tire patch 110.
Patch assembly 160 formed by assembling rigid tag assembly 130 into tire patch 110 is bonded to a tire using the same materials and methods described above for Patch assembly 60.
Patch assemblies manufactured and assembled to a tire inner liner in s the manner described above have run through tests equivalent to 100,000 miles, and have remained fully bonded to the tire.
While in accordance with the patent statutes, the best mode and preferred embodiment has been set forth above, the scope of the invention is not limited thereto, but rather by the scope of the attached claims.
manufacturing a rubber patch having a preselected configuration, the rubber patch having edges, a first side for interfacing with the face of the encapsulated rigid tag assembly, the first side having increased surface area, the first side of the rubber patch including a recessed cavity surrounded by a ridge of material of sufficient height to capture the encapsulated rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
vulcanizing the rubber patch at a preselected temperature and for a time sufficient for vulcanization; applying a layer of dual cure bonding rubber to the second side of the vulcanized rubber patch; applying a fluid epoxy adhesive to an interface between the encapsulated tag assembly and the rubber patch; assembling the encapsulated tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from the interface between the encapsulated tag assembly and the rubber patch; and curing the assembly to form a patch assembly.
In accordance with another aspect of the present invention, there is also provided a method for securing within a tire an electronic monitoring device for monitoring at least one engineering condition of a tire, in such a manner and in such a location so as to minimize stress, strain, cyclic fatigue, impact and vibration, comprising the steps of:
providing a rigid tag assembly having an encapsulated monitoring device that allows the electronic components of the monitoring device to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
providing a rubber patch having edges, a first side for interfacing with at least one surface of the rigid tag, the first side including a recessed cavity surrounded by a ridge of material of sufficient -4a-height to capture the rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges; applying a layer of dual cure bonding rubber to the second side of the rubber patch; applying a fluid epoxy adhesive to an interface between the tag assembly and the rubber patch; assembling the tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from an interface between the surface of the encapsulated tag assembly and the rubber patch;
curing the tag assembly to form a patch assembly; assembling the patch assembly to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire; then, stitching the patch assembly to the inner liner of the vulcanized tire; and curing the patch/tire assembly at a temperature and for a time sufficient to form a strong bond.
In accordance with yet another aspect of the present invention, there is also provided a tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising: a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated rigid monitoring device and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height capable of surrounding a portion of the outer periphery of the encapsulated rigid monitoring device; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
In accordance with yet another aspect of the present invention, there is also provided a patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising: a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery; a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of -4b-sufficient height surrounding a portion of the outer periphery of the rigid tag assembly; an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
In accordance with yet another aspect of the present invention, there is also provided a tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising: a vulcanized tire having an inner liner; a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery; a vulcanized rubber patch of preselected configuration having edges, a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly; an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently cured to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
In accordance with yet another aspect of the present invention, there is also provided a tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising: a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving a cylindrical encapsulated monitoring device; a rubber patch of preselected configuration having a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side for interfacing with a face of an encapsulated rigid monitoring device and the second opposite side approximating the contour of an inner liner of a tire; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being -4c-permanently assembled to the second side of the rubber patch, while the second surface is uncured.
In accordance with yet another aspect of the present invention, there is also provided a patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising: a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer cylindrical periphery; a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly; a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire; an adhesive layer securing at least the outer cylindrical periphery of the rigid tag assembly within the recessed cavity of the cylindrical rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch, while the second surface is uncured.
In accordance with yet another aspect of the present invention, there is also provided a tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising: a vulcanized tire having an inner liner; a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the cylindrical rigid tag assembly having a cylindrical outer periphery wall, an upper surface and a lower surface; a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly; a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire; an adhesive layer securing at least the cylindrical outer periphery wall of the rigid tag -4d-assembly to the cylindrical wall of the rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently bonded to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
In accordance with yet another aspect of the present invention, there is also provided in combination: a pneumatic tire having an innerliner; an electronic monitoring device for monitoring at least one engineering condition of the tire; an attachment patch mounted to the innerliner of the tire; the attachment patch including a first side and a second side; the second side of the attachment patch being connected to the innerliner; the first side of the patch including a recessed cavity; the electronic monitoring device disposed at least partially in the recessed cavity; and the patch including a ridge surrounding the recessed cavity.
In accordance with yet another aspect of the present invention, there is also provided a method for mounting an electronic monitoring device to a tire having an innerliner and a chamber, the method comprising the steps of providing an electronic monitoring device that is adapted to monitor at least one engineering condition of a tire;
the electronic monitoring device having an upper surface adapted to face the chamber of the tire; providing an attachment patch; mounting at least part of the electronic monitoring device to the attachment patch; the attachment patch being free of members that cover the upper surface of the electronic monitoring device such that the upper surface of the electronic monitoring device is exposed to the chamber of the tire when the attachment patch is mounted to the tire; and mounting the attachment patch to the tire.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a perspective view of the tire patch of the present invention.
-4e-Fig. 2 is a cross-sectional view of the rigid tag assembly, showing the encapsulated electronic monitoring device.
s Fig. 3 is a cross-sectional view of the mold used to encapsulate the electronic monitoring device, producing the rigid tag assembly.
Fig. 4 is a perspective view of the patch assembly of the present invention.
io Fig. 5 is a cross-sectional view of the patch assembled to the inner liner of a tire.
Fig. 6 is a perspective view of an alternative configuration of the tire is patch of the present invention.
Fig. 7 is a cross-sectional view of the rigid tag assembly of Fig. 6, showing the encapsulated electronic monitoring device.
zo Fig. 8 is a perspective view of the patch assembly of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
2s Embodiments of the present invention will be described below with reference to the drawings.
Fig, 1 shows a tire patch 10 of the present invention. The tire patch is of a preselected configuration, which as shown, is rectangular in shape. The patch may be of any other convenient configuration, but is shown as 3o rectangular, and therefore has four edges 11. The tire patch 10 has a first side 12 for interfacing with a face of an encapsulated tag assembly 30, shown in Fig. 2. The patch has a second opposite side 14 approximating the contour of an inner liner of a tire. The contour of the second side 14 preferably is radiused to have about the same radius as the tire to which it is assembled, the radius being larger for larger tires. For very large tires, such as for off-the-road tires, the radius may be eliminated altogether, so that there is no contour and the opposite side is flat, having no contour.
s The rubber patch is vulcanized at a preselected temperature and for a time sufficient to vulcanize the patch. The patch may be rubber selected from the group consisting of Ethylene Propylene Diene Monomer (EPDM) rubber, butyl rubber, natural rubber, neoprene and mixtures thereof. One preferred embodiment is a mixture of chlorobutyl rubber and natural rubber.
io Another preferred embodiment is a mixture of Styrene-Butadiene rubber (SBR) and natural rubber. Typically, patches made of these rubber compositions may be cured by heating to a temperature of about 150°C
and holding at this temperature for about 30 minutes. The time and temperature may be modified as necessary to achieve sufficient curing of the patch for Is further assembly.
The first side 12 includes a recessed cavity 16 which is surrounded by a raised ridge 18 of rubbery polymer material. The recessed cavity optionally may have a roughened bottom surface to increase its surface area.
The ridge 18 preferably is of the same material as the remainder of the patch.
2o The ridge of material should be of sufficient height to capture the encapsulated rigid tag 30. In a preferred embodiment, the ridge is about one eighth (1/8") inch. The patch is gradually tapered from the ridge 18 of material of the first side of the patch 12, outwardly toward the edges of the patch.
2s Affixed to the second side 14 of the vulcanized tire patch is a dual cure bonding layer 20, which has a first side (not shown) and a second side 22.
This dual cure bonding layer may be assembled to the patch at any time following vulcanization of the patch and prior to assembly of the patch assembly to the tire innerliner. The dual cure bonding layer is permanently 3o assembled to the patch. A non-curing cement (not shown) is applied to side 14 of the patch in order to hold the dual cure bonding layer 20 onto the patch.
The non-curing cement and the dual cure bonding layer are products of Patch Rubber Company. The important feature of the dual cure bonding layer is that it can be chemically activated and cured, without the need for heating to an elevated temperature. The process is diffusion controlled, however, and some minimal heating will speed the curing process. The dual s cure bonding layer may be any material which can be activated and cured to the vulcanized rubber of the tire inner liner and the vulcanized patch.
Preferably, however, the dual cure bonding rubber is natural rubber. The dual cure bonding rubber, after application of the activating cement, may cure at room temperature over a period of seventy two (72) hours. However, if Io more rapid curing is desired. this may be accomplished by heating to 45°C for at least twenty four hours.
Fig. 2 shows a cross-sectional view of the rigid tag assembly 30, showing the encapsulated electronic monitoring device 32. Monitoring device may be a circuit board 34 which includes electronic memory as well as a is variety of sensors for monitoring engineering conditions such as, for example, pressure, temperature and distance traveled. The monitoring device is discussed in detail in U.S. Patent No. 5,562,787, incorporated herein by reference. Mounted to the board is a power source 36, such a battery, which permits the active monitoring of the engineering conditions, which may be 2o stored in the electronic memory for later use. The power source provides a bulge 38 to the rigid tag assembly, although this feature is expected to become less prominent or even completely eliminated as advances in battery technology produce smaller yet more powerful batteries. The rigid tag assembly may also house an antenna, or may provide for assembly of an 2s antenna which protrudes from the tag assembly so that the circuitry on the board can be activated for transmittal at will.
The circuit board including sensors, battery and optional antenna, hereinafter referred to as the electronic monitoring device, are encapsulated in a potting material 40 which solidifies into a rigid material. Referring to Fig.
30 3, the electronic monitoring device is placed within a mold 40 having a first half 52 and a second half 54. At least one of the mold halves has a face with increased surface area, shown as surface 56 in the second half 54 of mold 40. The mold is then filled with the potting material 40 in fluid form, which fills the mold and flows around the electronic monitoring device and allowed to cure, resulting in a rigid tag assembly. Any potting material having a Young's Modulus of at least 30,000 psi and which is capable of being molded s around the electronic monitoring device without damaging any of the components of the device. Preferably, the potting material has a Young's Modulus of at least about 100,000 psi. Two preferred potting materials include epoxy and urethane. If desired, the curing of the potting material around the electronic device may be accelerated by preheating the mold to io an elevated temperature which is above ambient, but below the temperature at which damage to the electronic monitoring device will occur. A preferred temperature is about 80°C. After the epoxy has been cured, the mold halves 52, 54 are separated, yielding a rigid, encapsulated tag assembly 30. Tag assembly 30 has a bottom surface 42 having increased surface finish which is is simply the impression of surface 56 from mold half 54.
Rigid tag assembly 30 is assembled into the recessed cavity 16 on the first side 12 of tire patch 10 either after vulcanization of the patch or after assembly of the dual bond curing layer 20 to the patch. In order to permanently adhere tag assembly 30 to patch 10, a fluid adhesive is applied 2o to the interface between tag assembly 30 and recess 16. This adhesive, preferably an epoxy adhesive, may be applied conveniently to surface 42 of tag assembly or to the base of recess 16. As tag assembly 30 is pressed into recessed cavity 16, the epoxy adhesive flows evenly along the interface between surface 42 and the base of recess 16. The increased surface area 2s between the base of recessed cavity 16 and surface 52 provides for additional bonding area and a stronger bond. Because the ridges around the recess are closely dimensioned to correspond to the dimensions of tag assembly 30, excess epoxy will flow between tag assembly 30 and ridge 18, and some epoxy may even flow out from this region. Of course, the flow of 3o epoxy in this region will add to the strength of the assembly as the epoxy cures. While the epoxy can be allowed to cure at room temperature, the curing process can be accelerated by heating the assembly at an elevated _8_ temperature, for example a temperature of from about 75-90°C for at least about 30 minutes. If the dual cure bonding layer has not already been assembled to the second side 14 of tire patch 10, it may be added at this time to form patch assembly 60.
s Referring now to Fig. 5, Patch assembly 60 was then assembled to the inner liner 75 of tire 70. Activating cement was first applied to second side of dual cure bonding layer 20. The patch assembly was then stitched to the inner liner of the vulcanized tire and the patch assemblyltire assembly was allowed to cure for a sufficient time and temperature to form a strong bond Io between the tire and the patch assembly. The times and temperatures utilized for this curing may be basically the same times and temperatures as previously discussed. To ensure a strong bond, the patch assembly optionally may be clamped to the tire inner liner 75, until the curing cycle is completed.
is Fig. 6 shows an alternative configuration of a tire patch 110 of the present invention. The tire patch 110 is of a preselected configuration, which as shown, is round in shape. The tire patch 110 has a first side 112 for interfacing with a face of an encapsulated tag assembly 130, shown in cross-section in Fig. 7. First side 112 includes a recessed cavity 116 , which in this 2o alternative configuration is formed by a cylindrical rigid insert 117 molded into the rubber patch. Preferably cylindrical insert 117 is a rigid plastic material, such as nylon, epoxy or a rigid composite material such as glass-filled polyimide or glass-filled epoxy, but also may be a metal, as long as the metal does not interfere with the electronic functions and operation of tag assembly 2s 130. Cylindrical rigid insert 117 is surrounded by a ridge 118 of rubbery material. The ridge preferably is of the same material as the remainder of the patch and should be of sufficient height to permanently hold cylindrical insert 117 in place following curing. In a preferred embodiment shown in Figs. 6 and 7, the ridge 118 is the same height as cylindrical insert 117. The patch is 3o gradually tapered from the ridge 118 of material of the first side of the patch outwardly toward the edges of the patch. Recessed cavity 116 may have a roughened bottom surface to increase its surface area, as previously _9_ described, or alternatively may be smooth and made from the same material as the cylindrical insert. The patch has a second opposite side 114 which may approximate the contour of an inner liner of a tire. The contour of the second side 114 preferably is radiused to have about the same radius as the s tire to which it is assembled, the radius being larger for larger tires. For very large tires, such as for off-the-road tires, the radius may be eliminated altogether, so that there is no contour and the opposite side 114 is flat, having no contour. Tire patch 110 including cylindrical rigid insert 117 is cured prior to insertion of rigid tag assembly 130 to form a round patch io assembly.
Rigid tag assembly 130, which includes the encapsulated electronic monitoring device and has the same components as previously described, is essentially identical to rigid tag assembly 30 except for its profile, being round or circular instead of rectangular. Round rigid tag assembly 130 is is permanently bonded to the round patch assembly by inserting rigid tag assembly 130 into cylindrical insert 117, as shown in Fig. 8, after applying an epoxy adhesive such as a Fusor system manufactured by Lord Corp. of Erie PA. to the interface between the rigid tag assembly 130 and the cylindrical insert 117. Of course, the epoxy adhesive also may conveniently be applied 2o to the interface between the bottom of cavity 116, whether it is a roughened surface or made of the same or similar material as cylindrical insert 117. As the rigid tag assembly 130 is inserted into cylindrical insert 117, excess epoxy flows out from the interface, which must be removed before it cures.
Cylindrical insert 117 only must be of sufficient height so that after curing of zs the epoxy, there is sufficient bonding strength between the insert 117 and tag assembly 130 to assure no separation. Although the rigid tag assembly 130 may be of the same height as cylindrical insert 117, as shown in the preferred embodiment, it also may be lower or higher than cylindrical insert 117 upon assembly. If tag assembly 130 is higher than the cylindrical insert 117, then 3o insert 117 has a lower profile than the rigid tag assembly 130 so that the outer periphery of the rigid tag assembly 130 extends above the outer periphery of the cylindrical insert 117, thereby reducing the overall amount of material required for tire patch 110.
Patch assembly 160 formed by assembling rigid tag assembly 130 into tire patch 110 is bonded to a tire using the same materials and methods described above for Patch assembly 60.
Patch assemblies manufactured and assembled to a tire inner liner in s the manner described above have run through tests equivalent to 100,000 miles, and have remained fully bonded to the tire.
While in accordance with the patent statutes, the best mode and preferred embodiment has been set forth above, the scope of the invention is not limited thereto, but rather by the scope of the attached claims.
Claims (48)
1. A method for forming a patch assembly for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising the steps of:
encapsulating an electronic monitoring device by placing the electronic monitoring device into a mold having a preselected configuration, the preselected configuration including at least one face having an alternating raised and recessed pattern to increase the surface area of the face, filling the mold with an epoxy potting material, and curing the epoxy potting material to form a rigid tag assembly having the preselected configuration in such a manner so as allow the electronic components to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
manufacturing a rubber patch having a preselected configuration, the rubber patch having edges, a first side for interfacing with the face of the encapsulated rigid tag assembly, the first side having increased surface area, the first side of the rubber patch including a recessed cavity surrounded by a ridge of material of sufficient height to capture the encapsulated rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
vulcanizing the rubber patch at a preselected temperature and for a time sufficient for vulcanization;
applying a layer of dual cure bonding rubber to the second side of the vulcanized rubber patch;
applying a fluid epoxy adhesive to an interface between the encapsulated tag assembly and the rubber patch;
assembling the encapsulated tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from the interface between the encapsulated tag assembly and the rubber patch; and curing the assembly to form a patch assembly.
encapsulating an electronic monitoring device by placing the electronic monitoring device into a mold having a preselected configuration, the preselected configuration including at least one face having an alternating raised and recessed pattern to increase the surface area of the face, filling the mold with an epoxy potting material, and curing the epoxy potting material to form a rigid tag assembly having the preselected configuration in such a manner so as allow the electronic components to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
manufacturing a rubber patch having a preselected configuration, the rubber patch having edges, a first side for interfacing with the face of the encapsulated rigid tag assembly, the first side having increased surface area, the first side of the rubber patch including a recessed cavity surrounded by a ridge of material of sufficient height to capture the encapsulated rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
vulcanizing the rubber patch at a preselected temperature and for a time sufficient for vulcanization;
applying a layer of dual cure bonding rubber to the second side of the vulcanized rubber patch;
applying a fluid epoxy adhesive to an interface between the encapsulated tag assembly and the rubber patch;
assembling the encapsulated tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from the interface between the encapsulated tag assembly and the rubber patch; and curing the assembly to form a patch assembly.
2. The method of claim 1 for forming a patch assembly, wherein the step of manufacturing a rubber patch having a first side including a recessed cavity surrounded by a ridge further includes a ridge having a height of at least one-eighth of an inch of rubber material.
3. The method of claim 1 for forming a patch assembly wherein the step of vulcanizing the rubber patch includes heating the rubber patch at a temperature of about 150°C for about 30 minutes.
4. The method of claim 1 for forming a patch assembly wherein the step of encapsulating the electronic monitoring device further includes preheating the mold to a preselected temperature prior to filling the mold.
5. The method of claim 4 for forming a patch assembly wherein the mold is preheated to about 80°C.
6. The method of claim 1 for forming a patch assembly wherein the step of manufacturing a rubber patch includes manufacturing a rubber patch comprised of a mixture of chlorobutyl rubber and natural rubber.
7. The method of claim 1 for forming a patch assembly, wherein the step of manufacturing a rubber patch includes manufacturing a rubber patch comprised of a mixture of SBR and natural rubber.
8. The method of claim 1 for forming a patch assembly, wherein the step of manufacturing a rubber patch includes manufacturing a rubber patch selected from the group consisting of EPDM rubber, butyl rubber, natural rubber, neoprene and mixtures thereof.
9. The method of claim 1 for forming a patch assembly, wherein the step of curing the assembly includes curing the assembly at a temperature of from about 75-90°C for at least 30 minutes.
10. The method of claim 1 for forming a patch assembly, wherein the step of applying a layer of dual cure bonding rubber includes applying a layer of natural rubber.
11. A method for securing within a tire an electronic monitoring device for monitoring at least one engineering condition of a tire, in such a manner and in such a location so as to minimize stress, strain, cyclic fatigue, impact and vibration, comprising the steps of:
providing a rigid tag assembly having an encapsulated monitoring device that allows the electronic components of the monitoring device to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
providing a rubber patch having edges, a first side for interfacing with at least one surface of the rigid tag, the first side including a recessed cavity surrounded by a ridge of material of sufficient height to capture the rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
applying a layer of dual cure bonding rubber to the second side of the rubber patch;
applying a fluid epoxy adhesive to an interface between the tag assembly and the rubber patch;
assembling the tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from an interface between the surface of the encapsulated tag assembly and the rubber patch;
curing the tag assembly to form a patch assembly;
assembling the patch assembly to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire;
then, stitching the patch assembly to the inner liner of the vulcanized tire; and curing the patch/tire assembly at a temperature and for a time sufficient to form a strong bond.
providing a rigid tag assembly having an encapsulated monitoring device that allows the electronic components of the monitoring device to remain free from internal tire contamination but to remain open to the tire atmosphere as necessary;
providing a rubber patch having edges, a first side for interfacing with at least one surface of the rigid tag, the first side including a recessed cavity surrounded by a ridge of material of sufficient height to capture the rigid tag assembly, and a second opposite side, the second side approximating the contour of the inner liner of the tire, the patch being tapered from the ridge toward the edges;
applying a layer of dual cure bonding rubber to the second side of the rubber patch;
applying a fluid epoxy adhesive to an interface between the tag assembly and the rubber patch;
assembling the tag assembly into the recessed cavity on the first side of the rubber patch so that fluid epoxy adhesive flows from an interface between the surface of the encapsulated tag assembly and the rubber patch;
curing the tag assembly to form a patch assembly;
assembling the patch assembly to the inner liner of a vulcanized tire by applying an activating cement between the dual cure bonding layer and the inner liner of the tire;
then, stitching the patch assembly to the inner liner of the vulcanized tire; and curing the patch/tire assembly at a temperature and for a time sufficient to form a strong bond.
12. A method for securing within a tire an electronic monitoring device of claim 11, further including, prior to the step of curing, the step of applying a clamping device to apply sufficient pressure to the patch assembly and the inner liner to assure intimate contact at the interface during curing.
13. A method for securing within a tire an electronic monitoring device of claim 11, wherein the step of curing includes curing at a temperature of about 45°C for at least 24 hours.
14. A method for securing within a tire an electronic monitoring device of claim 11, wherein the step of curing the patch/tire assembly includes curing at ambient temperature for at least 72 hours.
15. A tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising:
a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated rigid monitoring device and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height capable of surrounding a portion of the outer periphery of the encapsulated rigid monitoring device;
and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated rigid monitoring device and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height capable of surrounding a portion of the outer periphery of the encapsulated rigid monitoring device;
and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
16. The tire patch of claim 15, wherein the patch is comprised of rubber selected from the group consisting of EPDM, butyl rubber, natural rubber neoprene and mixtures thereof.
17. The tire patch of claim 15, wherein the patch is comprised of a mixture of chlorobutyl rubber and natural rubber.
18. The tire patch of claim 15, wherein the patch is comprised of a mixture of SBR
and natural rubber.
and natural rubber.
19. A patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising:
a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery;
a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly;
an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery;
a vulcanized rubber patch of preselected configuration having a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly;
an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of uncured dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch.
20. The patch assembly of claim 19 wherein the potting material has a Young's Modulus of at least 30,000 psi and is capable of being molded around the electronic monitoring device without damaging any components of the electronic monitoring device.
21. The patch assembly of claim 20 wherein the potting material has a Young's Modulus of about 100,000 psi.
22. The patch assembly of claim 20 wherein the potting material selected from the group consisting of epoxy and urethane.
23. A tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising:
a vulcanized tire having an inner liner;
a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery;
a vulcanized rubber patch of preselected configuration having edges, a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly;
an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently cured to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
a vulcanized tire having an inner liner;
a rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer periphery;
a vulcanized rubber patch of preselected configuration having edges, a first side for interfacing with a face of an encapsulated tag assembly and a second opposite side approximating the contour of an inner liner of a tire, the first side including a recessed cavity surrounded by a raised ridge of material of sufficient height surrounding a portion of the outer periphery of the rigid tag assembly;
an adhesive layer securing at least the lower surface of the rigid tag assembly within the recessed cavity of the vulcanized rubber patch; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently cured to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
24. The tire of claim 23 wherein the dual cure bonding rubber includes rubbers capable of bonding the vulcanized rubber of the rubber patch to the vulcanized rubber of the inner liner of the tire.
25. The tire of claim 24 wherein the dual cure bonding rubber is natural rubber.
26. A tire patch for securing an electronic monitoring device for monitoring at least one engineering condition within a tire, comprising:
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving a cylindrical encapsulated monitoring device;
a rubber patch of preselected configuration having a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side for interfacing with a face of an encapsulated rigid monitoring device and the second opposite side approximating the contour of an inner liner of a tire; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the rubber patch, while the second surface is uncured.
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving a cylindrical encapsulated monitoring device;
a rubber patch of preselected configuration having a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side for interfacing with a face of an encapsulated rigid monitoring device and the second opposite side approximating the contour of an inner liner of a tire; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the rubber patch, while the second surface is uncured.
27. The tire patch of claim 26 wherein the insert consists of a rigid material selected from the group consisting of plastic, composite material and metal.
28. The tire patch of claim 27 wherein the insert consists of a rigid composite material selected from the group consisting of glass-filled polyimide and glass-filled epoxy.
29. The tire patch of claim 27 wherein the insert consists of a rigid composite material selected from the group consisting of epoxy and nylon.
30. A patch assembly for securing an active electronic monitoring device having electronic and mechanical components for monitoring at least one engineering condition within a tire, comprising:
a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer cylindrical periphery;
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly;
a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire;
an adhesive layer securing at least the outer cylindrical periphery of the rigid tag assembly within the recessed cavity of the cylindrical rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch, while the second surface is uncured.
a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the rigid tag assembly having an upper surface, a lower surface and an outer cylindrical periphery;
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly;
a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire;
an adhesive layer securing at least the outer cylindrical periphery of the rigid tag assembly within the recessed cavity of the cylindrical rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently assembled to the second side of the vulcanized rubber patch, while the second surface is uncured.
31. The patch assembly of claim 30 wherein the height of the raised ridge of material is about the same height as the cylindrical insert.
32. The patch assembly of claim 30 wherein the height of the raised ridge of material is less that the height of the cylindrical insert.
33. The patch assembly of claim 30 wherein the insert consists of a rigid material selected from the group consisting of plastic, composite material and metal.
34. A tire having an active electronic monitoring device for monitoring at least one engineering condition mounted within the tire, comprising:
a vulcanized tire having an inner liner;
a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the cylindrical rigid tag assembly having a cylindrical outer periphery wall, an upper surface and a lower surface;
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly;
a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire;
an adhesive layer securing at least the cylindrical outer periphery wall of the rigid tag assembly to the cylindrical wall of the rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently bonded to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
a vulcanized tire having an inner liner;
a cylindrical rigid tag assembly including a rigid potting material encapsulating an active electronic monitoring device, the cylindrical rigid tag assembly having a cylindrical outer periphery wall, an upper surface and a lower surface;
a rigid insert having a cylindrical wall, the interior of the cylindrical wall forming a recessed cavity for receiving the cylindrical rigid tag assembly;
a vulcanized rubber patch of preselected configuration having edges, a first side and a second opposite side, the first side including a cylindrical raised ridge of material surrounding the cylindrical wall of the rigid insert, the raised ridge being of sufficient height to secure the insert in a fixed position, and the second opposite side approximating the contour of an inner liner of a tire;
an adhesive layer securing at least the cylindrical outer periphery wall of the rigid tag assembly to the cylindrical wall of the rigid insert; and a layer of dual cure bonding rubber having a first surface and a second surface, the first surface being permanently bonded to the second side of the vulcanized rubber patch and the second surface being permanently cured to the inner liner of the tire.
35. In combination: a pneumatic tire having an innerliner; an electronic monitoring device for monitoring at least one engineering condition of the tire; an attachment patch mounted to the innerliner of the tire; the attachment patch including a first side and a second side; the second side of the attachment patch being connected to the innerliner; the first side of the patch including a recessed cavity; the electronic monitoring device disposed at least partially in the recessed cavity; and the patch including a ridge surrounding the recessed cavity.
36. The combination of claim 35, wherein the attachment patch has an outer edge; the attachment patch being tapered from the ridge to the outer edge.
37. The combination of claim 35, wherein the ridge is integral to the attachment patch; the attachment patch and the ridge being fabricated from rubber.
38. The combination of claim 35, wherein the monitoring device is connected to the attachment patch with an adhesive.
39. The combination of claim 35, wherein the attachment patch is comprised of rubber selected from the group consisting of EPDM, butyl rubber, natural rubber, neoprene, and mixtures thereof.
40. The combination of claim 35, wherein the attachment patch is comprised of chlorobutyl rubber and natural rubber.
41. The combination of claim 35, wherein the attachment patch is comprised of a mixture of SBR and natural rubber.
42. The combination of claim 35, further comprising a rigid insert connected to the attachment patch; the monitoring device disposed inside the insert.
43. The combination of claim 35, wherein the attachment patch includes a layer of uncured rubber that has been cured to connect the attachment patch to the innerliner.
44. The combination of claim 43, wherein the layer of uncured rubber is dual cure rubber.
45. The combination of claim 35, wherein the monitoring device is encapsulated with a rigid potting material.
46. The combination of claim 45, wherein one side of the encapsulated monitoring device has an alternating raised and recessed pattern.
47. A method for mounting an electronic monitoring device to a tire having an innerliner and a chamber, the method comprising the steps of:
providing an electronic monitoring device that is adapted to monitor at least one engineering condition of a tire; the electronic monitoring device having an upper surface adapted to face the chamber of the tire;
providing an attachment patch;
mounting at least part of the electronic monitoring device to the attachment patch;
the attachment patch being free of members that cover the upper surface of the electronic monitoring device such that the upper surface of the electronic monitoring device is exposed to the chamber of the tire when the attachment patch is mounted to the tire; and mounting the attachment patch to the tire.
providing an electronic monitoring device that is adapted to monitor at least one engineering condition of a tire; the electronic monitoring device having an upper surface adapted to face the chamber of the tire;
providing an attachment patch;
mounting at least part of the electronic monitoring device to the attachment patch;
the attachment patch being free of members that cover the upper surface of the electronic monitoring device such that the upper surface of the electronic monitoring device is exposed to the chamber of the tire when the attachment patch is mounted to the tire; and mounting the attachment patch to the tire.
48. The method of claim 47, further comprising the step of applying an adhesive between the electronic monitoring device and the attachment patch to adhesively connect the electronic monitoring device to the attachment patch.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/932,091 US5971046A (en) | 1997-09-17 | 1997-09-17 | Method and apparatus for bonding an active tag to a patch and a tire |
| US08/932,091 | 1997-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2247556A1 CA2247556A1 (en) | 1999-03-17 |
| CA2247556C true CA2247556C (en) | 2007-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002247556A Expired - Lifetime CA2247556C (en) | 1997-09-17 | 1998-09-16 | Method and apparatus for bonding an active tag to a patch and a tire |
Country Status (11)
| Country | Link |
|---|---|
| US (3) | US5971046A (en) |
| EP (1) | EP0906839B1 (en) |
| JP (1) | JP4049457B2 (en) |
| KR (1) | KR19990029976A (en) |
| AR (1) | AR013501A1 (en) |
| AU (1) | AU745710B2 (en) |
| BR (1) | BR9803469A (en) |
| CA (1) | CA2247556C (en) |
| DE (1) | DE69831117T2 (en) |
| ES (1) | ES2246061T3 (en) |
| ZA (1) | ZA987926B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5971046A (en) * | 1997-09-17 | 1999-10-26 | Bridgestone/Firestone, Inc. | Method and apparatus for bonding an active tag to a patch and a tire |
| US7009506B2 (en) * | 1998-02-10 | 2006-03-07 | Bridgestone Firestone North American Tire, Llc | Electronic monitoring device and patch assembly |
| US6030478A (en) | 1998-02-10 | 2000-02-29 | Bridgestone/Firestone, Inc. | Method and apparatus for removably inserting an electric tire tag into a tire |
| US6217683B1 (en) * | 1998-02-12 | 2001-04-17 | Michelin Recherche Et Technique S.A. | Monitored vehicle tire and monitor retainer assembly |
| BR9912848A (en) | 1998-08-03 | 2001-05-08 | Goodyear Tire & Rubber | Assembly of transponders in tires |
| US6868717B2 (en) * | 1998-10-16 | 2005-03-22 | Bridgestone/Firestone North America Tire, Llc | Method and device to encapsulate tire tag |
| US6722191B2 (en) * | 1998-11-13 | 2004-04-20 | Bridgestone/Firestone North American Tire, Llc | Non-attached monitoring assembly for pneumatic tire |
| US6309494B1 (en) * | 1998-12-04 | 2001-10-30 | Bridgestone/Firestone Research, Inc. | Method of attaching sensitive electronic equipment to the inner surface of a tire |
| US6312539B1 (en) * | 1999-03-19 | 2001-11-06 | Bridgestone/Firestone Research, Inc. | Method of using tire tag protector |
| US6388567B1 (en) * | 1999-04-29 | 2002-05-14 | Bridgestone/Firestone North American Tire, Llc | Combination monitoring device and patch for a pneumatic tire and method of installing the same |
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-
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- 1997-09-17 US US08/932,091 patent/US5971046A/en not_active Expired - Lifetime
-
1998
- 1998-08-31 ZA ZA987926A patent/ZA987926B/en unknown
- 1998-09-01 AU AU83040/98A patent/AU745710B2/en not_active Expired
- 1998-09-04 EP EP98116761A patent/EP0906839B1/en not_active Expired - Lifetime
- 1998-09-04 ES ES98116761T patent/ES2246061T3/en not_active Expired - Lifetime
- 1998-09-04 DE DE69831117T patent/DE69831117T2/en not_active Expired - Lifetime
- 1998-09-14 JP JP27638298A patent/JP4049457B2/en not_active Expired - Lifetime
- 1998-09-16 AR ARP980104613A patent/AR013501A1/en active IP Right Grant
- 1998-09-16 BR BR9803469-3A patent/BR9803469A/en active IP Right Grant
- 1998-09-16 CA CA002247556A patent/CA2247556C/en not_active Expired - Lifetime
- 1998-09-17 KR KR1019980038920A patent/KR19990029976A/en not_active Application Discontinuation
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1999
- 1999-09-15 US US09/396,533 patent/US6444069B1/en not_active Expired - Lifetime
- 1999-11-17 US US09/441,564 patent/US6443198B1/en not_active Expired - Lifetime
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| DE69831117D1 (en) | 2005-09-15 |
| BR9803469A (en) | 1999-10-26 |
| US6443198B1 (en) | 2002-09-03 |
| AR013501A1 (en) | 2000-12-27 |
| EP0906839A2 (en) | 1999-04-07 |
| ZA987926B (en) | 1999-03-01 |
| US5971046A (en) | 1999-10-26 |
| US6444069B1 (en) | 2002-09-03 |
| EP0906839B1 (en) | 2005-08-10 |
| KR19990029976A (en) | 1999-04-26 |
| AU8304098A (en) | 1999-04-01 |
| ES2246061T3 (en) | 2006-02-01 |
| EP0906839A3 (en) | 2004-01-02 |
| CA2247556A1 (en) | 1999-03-17 |
| AU745710B2 (en) | 2002-03-28 |
| JPH11165514A (en) | 1999-06-22 |
| JP4049457B2 (en) | 2008-02-20 |
| DE69831117T2 (en) | 2006-04-13 |
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