CA2255441A1 - Package for semiconductor power device and method for assembling the same - Google Patents
Package for semiconductor power device and method for assembling the sameInfo
- Publication number
- CA2255441A1 CA2255441A1 CA002255441A CA2255441A CA2255441A1 CA 2255441 A1 CA2255441 A1 CA 2255441A1 CA 002255441 A CA002255441 A CA 002255441A CA 2255441 A CA2255441 A CA 2255441A CA 2255441 A1 CA2255441 A1 CA 2255441A1
- Authority
- CA
- Canada
- Prior art keywords
- bottom plate
- insulating substrate
- silicone gel
- notch
- semiconductor chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01083—Bismuth [Bi]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Abstract
A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate, surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container, wherein a solidified insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. Thus, reducing an electric field across the interface and making it difficult to cause a creeping discharge. A notch is formed in the bottom plate, and the notch is filled with a high heat conductive resin. The notch is located outwardly apart from a region where the semiconductor chips are mounted. Thus, a creeping breakdown is prevented without sacrificing a heat radiation effect of the bottom plate. Using a waterproof and flexible film to seal an inlet for filling the silicone gel into the case, a heat stress caused by an expansionand a shrinkage of the silicone gel in response to a variation of temperatures is reduced, and it prevents the silicone gel from being wet. A
thermoplastic insulating resin is employed instead of the silicone gel.
thermoplastic insulating resin is employed instead of the silicone gel.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33740397A JPH11177006A (en) | 1997-12-08 | 1997-12-08 | Semiconductor device |
JPP9-337403 | 1997-12-08 | ||
JPP10-246334 | 1998-08-31 | ||
JP24633498A JP2000077603A (en) | 1998-08-31 | 1998-08-31 | Semiconductor device and its manufacture |
JPP10-256606 | 1998-09-10 | ||
JP25660698A JP4098414B2 (en) | 1998-09-10 | 1998-09-10 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2255441A1 true CA2255441A1 (en) | 1999-06-08 |
CA2255441C CA2255441C (en) | 2003-08-05 |
Family
ID=27333456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002255441A Expired - Fee Related CA2255441C (en) | 1997-12-08 | 1998-12-07 | Package for semiconductor power device and method for assembling the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US6201696B1 (en) |
EP (1) | EP0921565A3 (en) |
KR (1) | KR19990062872A (en) |
CN (1) | CN1146988C (en) |
CA (1) | CA2255441C (en) |
TW (1) | TW408453B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112687630A (en) * | 2020-12-15 | 2021-04-20 | 株洲中车时代半导体有限公司 | Power device and manufacturing method thereof |
Families Citing this family (165)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19700963C2 (en) * | 1997-01-14 | 2000-12-21 | Telefunken Microelectron | Method for producing a power module with an active semiconductor component and a circuit arrangement having passive semiconductor components |
DE69923374T2 (en) * | 1998-05-28 | 2006-01-19 | Hitachi, Ltd. | Semiconductor device |
JP2001148451A (en) * | 1999-03-24 | 2001-05-29 | Mitsubishi Materials Corp | Power module board |
JP4234259B2 (en) * | 1999-05-14 | 2009-03-04 | 富士通テン株式会社 | Combination structure of electronic equipment |
JP2003502866A (en) * | 1999-06-17 | 2003-01-21 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | Electronic component having a soft bond and method for manufacturing such a component |
JP3747699B2 (en) * | 1999-08-06 | 2006-02-22 | 富士電機デバイステクノロジー株式会社 | Semiconductor device |
JP2001144403A (en) * | 1999-11-11 | 2001-05-25 | Yazaki Corp | Heat radiation mounting structure and assembling method for electric part |
US6864574B1 (en) * | 1999-11-29 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor package |
DE19959248A1 (en) * | 1999-12-08 | 2001-06-28 | Daimler Chrysler Ag | Insulation improvement for high-performance semiconductor modules |
JP3864029B2 (en) * | 2000-03-24 | 2006-12-27 | 松下電器産業株式会社 | Semiconductor package and semiconductor package manufacturing method |
US6407411B1 (en) | 2000-04-13 | 2002-06-18 | General Electric Company | Led lead frame assembly |
DE60030417D1 (en) * | 2000-05-08 | 2006-10-12 | St Microelectronics Srl | Electrical connection structure for electronic power devices and connection method |
DE60132397T2 (en) * | 2000-06-01 | 2009-01-22 | Matsushita Electric Industrial Co., Ltd., Kadoma-shi | Method for producing a thermally conductive substrate with lead frame and heat radiation plate |
WO2002013267A1 (en) * | 2000-08-09 | 2002-02-14 | Mitsubishi Materials Corporation | Power module and power module with heat sink |
US6912134B2 (en) * | 2000-09-12 | 2005-06-28 | International Rectifier Corporation | Fan control circuit and package |
DE10158185B4 (en) * | 2000-12-20 | 2005-08-11 | Semikron Elektronik Gmbh | Power semiconductor module with high insulation resistance |
JP2002203942A (en) * | 2000-12-28 | 2002-07-19 | Fuji Electric Co Ltd | Power semiconductor module |
WO2002059969A1 (en) * | 2001-01-23 | 2002-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US7027304B2 (en) * | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
US6943445B2 (en) * | 2001-03-30 | 2005-09-13 | Hitachi, Ltd. | Semiconductor device having bridge-connected wiring structure |
JPWO2002082542A1 (en) * | 2001-04-02 | 2004-07-29 | 三菱電機株式会社 | Power semiconductor devices |
US6583505B2 (en) * | 2001-05-04 | 2003-06-24 | Ixys Corporation | Electrically isolated power device package |
DE10130517C2 (en) | 2001-06-25 | 2003-07-24 | Eupec Gmbh & Co Kg | High-voltage module and method for its production |
US7003970B2 (en) * | 2001-07-09 | 2006-02-28 | Daikin Industries, Ltd. | Power module and air conditioner |
US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
US6781060B2 (en) * | 2002-07-26 | 2004-08-24 | X-Ray Optical Systems Incorporated | Electrical connector, a cable sleeve, and a method for fabricating an electrical connection |
EP1324386B1 (en) * | 2001-12-24 | 2011-06-15 | ABB Research Ltd. | Semiconductor module and method of manufacturing a semiconductor module |
US6885562B2 (en) * | 2001-12-28 | 2005-04-26 | Medtronic Physio-Control Manufacturing Corporation | Circuit package and method for making the same |
US6797889B1 (en) * | 2002-05-30 | 2004-09-28 | Johnson Controls Automotive Electronics | Assembly of power circuits and numerical data printed on a multilayer board |
US7057896B2 (en) * | 2002-08-21 | 2006-06-06 | Matsushita Electric Industrial Co., Ltd. | Power module and production method thereof |
TWI286832B (en) * | 2002-11-05 | 2007-09-11 | Advanced Semiconductor Eng | Thermal enhance semiconductor package |
JP2004179313A (en) * | 2002-11-26 | 2004-06-24 | Fujitsu Ten Ltd | Circuit wiring board |
EP1424728A1 (en) * | 2002-11-27 | 2004-06-02 | Abb Research Ltd. | Power semiconductor module |
EP1443554A1 (en) * | 2003-01-27 | 2004-08-04 | STMicroelectronics S.r.l. | Package for semiconductor devices |
EP1465250A1 (en) * | 2003-04-02 | 2004-10-06 | Abb Research Ltd. | Insulated power semiconductor module with reduced partial discharge and manufacturing method |
JP2005080370A (en) * | 2003-08-29 | 2005-03-24 | Auto Network Gijutsu Kenkyusho:Kk | Circuit configuration and manufacturing method of waterproofed circuit configuration |
US7646095B2 (en) * | 2003-09-30 | 2010-01-12 | Panasonic Corporation | Semiconductor device |
JP4048435B2 (en) * | 2003-10-23 | 2008-02-20 | ソニー株式会社 | Electronics |
US6982482B2 (en) * | 2004-02-24 | 2006-01-03 | Applied Pulsed Power, Inc. | Packaging of solid state devices |
FR2867608B1 (en) * | 2004-03-12 | 2006-05-26 | Metal Process | COOLER FOR ELECTRONIC POWER COMPONENT |
US7064422B2 (en) * | 2004-03-26 | 2006-06-20 | Intel Corporation | Electronic assembly with integrated IO and power contacts |
DE102004051039B4 (en) | 2004-10-20 | 2008-06-26 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with pressure contact device |
JP2006140192A (en) * | 2004-11-10 | 2006-06-01 | Matsushita Electric Ind Co Ltd | Electronic circuit apparatus |
KR100765604B1 (en) * | 2004-11-26 | 2007-10-09 | 산요덴키가부시키가이샤 | Circuit device and manufacturing method thereof |
US7696532B2 (en) | 2004-12-16 | 2010-04-13 | Abb Research Ltd | Power semiconductor module |
JP4207896B2 (en) * | 2005-01-19 | 2009-01-14 | 富士電機デバイステクノロジー株式会社 | Semiconductor device |
JP2006261385A (en) * | 2005-03-17 | 2006-09-28 | Toyota Motor Corp | Semiconductor apparatus |
US7547964B2 (en) * | 2005-04-25 | 2009-06-16 | International Rectifier Corporation | Device packages having a III-nitride based power semiconductor device |
WO2006116249A2 (en) * | 2005-04-25 | 2006-11-02 | International Rectifier Corporation | Device packages having a iii-nitride based power semiconductor device |
US8144478B1 (en) * | 2005-07-01 | 2012-03-27 | Globalfoundries Inc. | Circuit module and method |
JP4818654B2 (en) * | 2005-07-25 | 2011-11-16 | ソニーケミカル&インフォメーションデバイス株式会社 | Method for sealing light emitting device |
JP4867280B2 (en) * | 2005-10-18 | 2012-02-01 | 株式会社ジェイテクト | Coating agent application method |
JP4455488B2 (en) * | 2005-12-19 | 2010-04-21 | 三菱電機株式会社 | Semiconductor device |
JP2007235004A (en) * | 2006-03-03 | 2007-09-13 | Mitsubishi Electric Corp | Semiconductor device |
JP2007305702A (en) * | 2006-05-10 | 2007-11-22 | Toshiba Corp | Semiconductor device and its manufacturing method |
JP4967447B2 (en) * | 2006-05-17 | 2012-07-04 | 株式会社日立製作所 | Power semiconductor module |
JP2007329387A (en) * | 2006-06-09 | 2007-12-20 | Mitsubishi Electric Corp | Semiconductor device |
CA2666081C (en) * | 2006-10-06 | 2011-02-15 | Microsemi Corporation | High temperature, high voltage sic void-less electronic package |
DE102007009521B4 (en) * | 2007-02-27 | 2011-12-15 | Infineon Technologies Ag | Component and method for its production |
JP5252819B2 (en) * | 2007-03-26 | 2013-07-31 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
SI2149902T1 (en) * | 2007-05-18 | 2019-03-29 | Sansha Electric Manufacturing Company, Limited | Power semiconductor module and arc discharge device using the same |
JP5355867B2 (en) * | 2007-07-10 | 2013-11-27 | ローム株式会社 | Integrated circuit element |
US7768109B2 (en) * | 2007-08-24 | 2010-08-03 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
JP5272191B2 (en) * | 2007-08-31 | 2013-08-28 | 三菱電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
DE102007046969B3 (en) * | 2007-09-28 | 2009-04-02 | Siemens Ag | Electronic circuit of subcircuits and method for their manufacture and the corresponding converter or switch |
ES2705170T3 (en) * | 2007-11-13 | 2019-03-22 | Siemens Ag | Power semiconductor module |
JP4523632B2 (en) * | 2007-12-11 | 2010-08-11 | 三菱電機株式会社 | Semiconductor device |
US7763970B2 (en) * | 2008-02-27 | 2010-07-27 | Infineon Technologies Ag | Power module |
JP4640425B2 (en) * | 2008-03-04 | 2011-03-02 | 株式会社豊田自動織機 | Power converter |
CN101978490B (en) * | 2008-03-31 | 2012-10-17 | 株式会社村田制作所 | Electronic component module and method of manufacturing the electronic component module |
DE102008017454B4 (en) * | 2008-04-05 | 2010-02-04 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with hermetically sealed circuit arrangement and manufacturing method for this purpose |
TWI352567B (en) * | 2008-04-21 | 2011-11-11 | Wistron Corp | Waterproof casing |
FR2936097B1 (en) * | 2008-09-12 | 2010-10-29 | Alstom Transport Sa | METHOD FOR ENCAPSULATING A SEMICONDUCTOR ELECTRONIC COMPONENT |
DE102008048005B3 (en) * | 2008-09-19 | 2010-04-08 | Infineon Technologies Ag | Power semiconductor module arrangement and method for producing a power semiconductor module arrangement |
JP4941509B2 (en) * | 2008-10-20 | 2012-05-30 | 株式会社デンソー | Electronic control device |
JP5839769B2 (en) * | 2009-03-06 | 2016-01-06 | 三菱重工業株式会社 | Inverter module and inverter-integrated electric compressor |
DE102009002993B4 (en) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Power semiconductor module with spaced circuit carriers |
JP5018909B2 (en) * | 2009-06-30 | 2012-09-05 | 株式会社デンソー | Semiconductor device |
JP2011023458A (en) * | 2009-07-14 | 2011-02-03 | Toshiba Corp | Semiconductor device and method of manufacturing the same |
JP5345017B2 (en) * | 2009-08-27 | 2013-11-20 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
DE102009045063C5 (en) * | 2009-09-28 | 2017-06-01 | Infineon Technologies Ag | Power semiconductor module with molded-on heat sink, power semiconductor module system and method for producing a power semiconductor module |
EP2302676A1 (en) * | 2009-09-29 | 2011-03-30 | ABB Technology AG | High power semiconductor device |
US7939370B1 (en) * | 2009-10-29 | 2011-05-10 | Alpha And Omega Semiconductor Incorporated | Power semiconductor package |
US8520389B2 (en) | 2009-12-02 | 2013-08-27 | Hamilton Sundstrand Corporation | Power semiconductor module for wide temperature applications |
JP5212417B2 (en) * | 2010-04-12 | 2013-06-19 | 三菱電機株式会社 | Power semiconductor module |
US20120057313A1 (en) * | 2010-09-03 | 2012-03-08 | National Semiconductor Corporation | Package for system level electronic products |
JP5709299B2 (en) * | 2010-09-29 | 2015-04-30 | ローム株式会社 | Semiconductor power module and manufacturing method thereof |
CN102054826B (en) * | 2010-11-04 | 2013-01-09 | 嘉兴斯达微电子有限公司 | Novel baseplate-free power module |
FR2967845B1 (en) * | 2010-11-23 | 2013-08-02 | Valeo Equip Electr Moteur | ARCHITECTURE OF INTERCONNECTED ELECTRONIC POWER MODULES FOR A ROTATING ELECTRIC MACHINE AND ROTATING ELECTRIC MACHINE COMPRISING SUCH AN ARCHITECTURE |
JP5542646B2 (en) * | 2010-12-24 | 2014-07-09 | 日立オートモティブシステムズ株式会社 | Power module manufacturing method, power module design method |
JP5588895B2 (en) * | 2011-02-28 | 2014-09-10 | 日立オートモティブシステムズ株式会社 | Power semiconductor module, power semiconductor module manufacturing method, and power conversion device |
JP5626087B2 (en) * | 2011-04-13 | 2014-11-19 | 三菱電機株式会社 | Semiconductor device |
JPWO2012157583A1 (en) * | 2011-05-13 | 2014-07-31 | 富士電機株式会社 | Semiconductor device and manufacturing method thereof |
FR2975528B1 (en) * | 2011-05-17 | 2014-02-28 | Alstom Transport Sa | DEVICE FOR ELECTRICALLY INSULATING A CONDUCTIVE PLAN HAVING A FIRST ELECTRICAL POTENTIAL IN RELATION TO A SECOND POTENTIAL, COMPRISING MEANS FOR REDUCING THE ELECTROSTATIC FIELD VALUE AT A POINT OF THE PERIPHERAL EDGE OF THE CONDUCTIVE PLANE |
JP2012253125A (en) * | 2011-06-01 | 2012-12-20 | Sumitomo Electric Ind Ltd | Semiconductor device and wiring board |
US8787003B2 (en) * | 2011-10-12 | 2014-07-22 | Infineon Technologies Ag | Low inductance capacitor module and power system with low inductance capacitor module |
DE102011085629A1 (en) * | 2011-11-02 | 2013-05-02 | Robert Bosch Gmbh | Electronic module for operation in the gearbox |
KR101983420B1 (en) * | 2011-12-12 | 2019-05-29 | 미쓰비시 마테리알 가부시키가이샤 | Power module substrate, substrate for power module with heat sink, power module, paste for forming flux component penetration prevention layer, and bonding method for article to be bonded |
CN102427070A (en) * | 2011-12-14 | 2012-04-25 | 深圳市威怡电气有限公司 | Power module |
CN102522389A (en) * | 2011-12-31 | 2012-06-27 | 嘉兴斯达微电子有限公司 | Small-sized power semiconductor module |
WO2013105351A1 (en) * | 2012-01-10 | 2013-07-18 | 株式会社日立製作所 | Power module |
CN102593111B (en) * | 2012-02-23 | 2014-12-31 | 株洲南车时代电气股份有限公司 | IGBT (insulated gate bipolar transistor) module and manufacturing method of IGBT module |
DE102012206758B3 (en) * | 2012-04-25 | 2013-05-29 | Semikron Elektronik Gmbh & Co. Kg | Method for manufacturing substrate for power semiconductor component such as MOSFET of power semiconductor module, involves performing galvanic isolation of metal film on broad strip conductor |
EP2851951B1 (en) * | 2012-05-15 | 2019-11-13 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing semiconductor device and semiconductor device |
EP2709150A1 (en) * | 2012-09-18 | 2014-03-19 | ABB Technology AG | Humidity protection of semiconductor modules |
JP6368646B2 (en) | 2012-09-20 | 2018-08-01 | ローム株式会社 | Power module semiconductor device, inverter device, power module semiconductor device manufacturing method, and mold |
WO2014073311A1 (en) * | 2012-11-09 | 2014-05-15 | 富士電機株式会社 | Semiconductor device |
KR101443985B1 (en) * | 2012-12-14 | 2014-11-03 | 삼성전기주식회사 | Power module package |
KR101477359B1 (en) * | 2012-12-27 | 2014-12-29 | 삼성전기주식회사 | Power semiconductor module |
DE102013104739B4 (en) | 2013-03-14 | 2022-10-27 | Rogers Germany Gmbh | Metal-ceramic substrates and method for producing a metal-ceramic substrate |
JP2014179547A (en) * | 2013-03-15 | 2014-09-25 | Toshiba Corp | Semiconductor module and method of manufacturing the same |
DE102013102829B4 (en) * | 2013-03-20 | 2017-10-19 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and arrangement hereby |
CN103311133B (en) * | 2013-05-20 | 2015-11-04 | 临海市志鼎电子科技有限公司 | Reverse installation process before a kind of power semiconductor modular welding |
DE102013211405B4 (en) * | 2013-06-18 | 2020-06-04 | Infineon Technologies Ag | METHOD FOR PRODUCING A SEMICONDUCTOR MODULE |
CN103367263A (en) * | 2013-07-22 | 2013-10-23 | 沈首良 | Improved injection molding packaging structure and packaging method of high-power semiconductor modules |
JP5751293B2 (en) * | 2013-08-13 | 2015-07-22 | Tdk株式会社 | Printed circuit board and power supply device |
US9247676B2 (en) * | 2013-08-14 | 2016-01-26 | The Directv Group, Inc. | Electronic device cooling systems |
CN103594505A (en) * | 2013-11-21 | 2014-02-19 | 西安永电电气有限责任公司 | High-voltage IGBT module capable of weakening partial discharge and manufacturing method thereof |
CN103633035A (en) * | 2013-12-04 | 2014-03-12 | 西安永电电气有限责任公司 | IGBT (insulated gate bipolar transistor) modular structure |
KR102041645B1 (en) * | 2014-01-28 | 2019-11-07 | 삼성전기주식회사 | Power semiconductor module |
CN104867891A (en) * | 2014-02-26 | 2015-08-26 | 西安永电电气有限责任公司 | Double-layer conductive film electrical connecting structure for IGBT device |
JP2015223044A (en) * | 2014-05-23 | 2015-12-10 | 株式会社オートネットワーク技術研究所 | Circuit structure and electric connection box |
JP6312527B2 (en) * | 2014-05-23 | 2018-04-18 | 新日本無線株式会社 | Electronic component mounting structure with heat sink |
JP6227141B2 (en) * | 2014-07-04 | 2017-11-08 | 三菱電機株式会社 | Power semiconductor device |
CN104269361B (en) * | 2014-10-10 | 2017-04-19 | 禾邦电子(苏州)有限公司 | Method for packaging semiconductor chip |
DE102014115815B4 (en) | 2014-10-30 | 2022-11-17 | Infineon Technologies Ag | METHOD FOR MANUFACTURING A CIRCUIT CARRIER, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR OPERATING A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MODULE |
TWI539894B (en) | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | Power module |
WO2016120997A1 (en) | 2015-01-27 | 2016-08-04 | 三菱電機株式会社 | Semiconductor module |
KR20160093403A (en) * | 2015-01-29 | 2016-08-08 | 엘지이노텍 주식회사 | Structure for shielding electromagnetic waves |
CN107210289B (en) * | 2015-02-04 | 2019-05-07 | 三菱电机株式会社 | Semiconductor devices |
CN106313422A (en) * | 2015-06-30 | 2017-01-11 | 西安永电电气有限责任公司 | Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM |
EP3317708A2 (en) * | 2015-06-30 | 2018-05-09 | CommScope Connectivity Belgium BVBA | System for compensation of expansion/contraction of a cooling medium inside a sealed closure |
KR102424402B1 (en) * | 2015-08-13 | 2022-07-25 | 삼성전자주식회사 | Semiconductor packages and methods for fabricating the same |
JP6613806B2 (en) * | 2015-10-23 | 2019-12-04 | 富士電機株式会社 | Semiconductor device |
CN106910519B (en) * | 2015-12-31 | 2022-12-16 | 中山市江波龙电子有限公司 | Solid state disk storage module and solid state disk |
JP6584333B2 (en) * | 2016-01-28 | 2019-10-02 | 三菱電機株式会社 | Power module |
CN109075136B (en) * | 2016-04-28 | 2022-08-02 | 电化株式会社 | Ceramic circuit board and method for manufacturing the same |
CN105895609B (en) * | 2016-05-03 | 2019-06-04 | 扬州国扬电子有限公司 | A kind of power module of electrode packet insulating layer |
JP6546892B2 (en) * | 2016-09-26 | 2019-07-17 | 株式会社 日立パワーデバイス | Semiconductor device |
CN108933115B (en) * | 2017-05-22 | 2023-11-14 | 德阳帛汉电子有限公司 | Coil packaging module |
JP6870531B2 (en) * | 2017-08-21 | 2021-05-12 | 三菱電機株式会社 | Power module and power converter |
US20190103342A1 (en) | 2017-10-04 | 2019-04-04 | Infineon Technologies Ag | Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same |
CN109671633A (en) * | 2017-10-17 | 2019-04-23 | 株洲中车时代电气股份有限公司 | A kind of high pressure IGBT liner plate insulating method |
US10283447B1 (en) * | 2017-10-26 | 2019-05-07 | Infineon Technologies Ag | Power semiconductor module with partially coated power terminals and method of manufacturing thereof |
JP7163583B2 (en) * | 2018-01-30 | 2022-11-01 | 株式会社デンソー | semiconductor equipment |
DE102018104532B4 (en) * | 2018-02-28 | 2023-06-29 | Rogers Germany Gmbh | Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate |
US10304788B1 (en) * | 2018-04-11 | 2019-05-28 | Semiconductor Components Industries, Llc | Semiconductor power module to protect against short circuit event |
CN110572975B (en) * | 2018-06-05 | 2020-12-15 | 台达电子工业股份有限公司 | Power supply with function of positioning internal circuit substrate and manufacturing method thereof |
CN109273421A (en) * | 2018-09-17 | 2019-01-25 | 威海银创微电子技术有限公司 | IGBT module |
CN109524333B (en) * | 2018-12-27 | 2024-03-26 | 西安中车永电电气有限公司 | Release liquid injection tool for packaging high-voltage IGBT module |
US10968529B2 (en) * | 2019-05-03 | 2021-04-06 | General Electric Company | Insulation systems and methods of depositing insulation systems |
CN110676232B (en) * | 2019-08-30 | 2022-05-24 | 华为技术有限公司 | Semiconductor device packaging structure, manufacturing method thereof and electronic equipment |
TR202003626A2 (en) * | 2020-03-09 | 2021-09-21 | Kuvv Elektronik Anonim Sirketi | POWER CONVERSION CIRCUIT WITH COMPONENTS WITH MATCHED THERMAL EXPANSION COEFFICIENT |
CN111627870A (en) * | 2020-05-28 | 2020-09-04 | 通富微电子股份有限公司技术研发分公司 | Semiconductor packaging device |
CN111640675A (en) * | 2020-05-28 | 2020-09-08 | 通富微电子股份有限公司技术研发分公司 | System-level packaging method |
CN112071807B (en) * | 2020-08-11 | 2023-11-03 | 西安交通大学 | Method for enabling electric field distribution in high-voltage high-power IGBT packaging structure to be uniform |
CN111988936A (en) * | 2020-08-17 | 2020-11-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | Electronic module high overload resistance reinforcing structure and method |
DE112021002383T5 (en) | 2020-10-14 | 2023-01-26 | Rohm Co., Ltd. | SEMICONDUCTOR MODULE |
US20230307411A1 (en) | 2020-10-14 | 2023-09-28 | Rohm Co., Ltd. | Semiconductor module |
CN116034465A (en) * | 2020-10-14 | 2023-04-28 | 罗姆股份有限公司 | Semiconductor module |
CN112635336A (en) * | 2020-12-22 | 2021-04-09 | 武汉大学 | High efficiency underfill process |
JP2022165251A (en) * | 2021-04-19 | 2022-10-31 | 三菱電機株式会社 | Power semiconductor device, method of manufacturing power semiconductor device, and power conversion device |
CN113421863B (en) * | 2021-05-07 | 2023-05-05 | 华为数字能源技术有限公司 | Power semiconductor package device and power converter |
CN116153922A (en) * | 2023-02-15 | 2023-05-23 | 深圳吉华微特电子有限公司 | High-power intelligent IGBT module and processing technology thereof |
CN117139767B (en) * | 2023-10-27 | 2023-12-26 | 合肥先进封装陶瓷有限公司 | Ceramic package shell conveying device and assembly equipment thereof |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1000023A (en) * | 1963-02-06 | 1965-08-04 | Westinghouse Brake & Signal | Semi-conductor devices |
US3292050A (en) * | 1965-08-19 | 1966-12-13 | Gen Electric | Mounting of solid state electronic components |
US3839660A (en) * | 1973-02-05 | 1974-10-01 | Gen Motors Corp | Power semiconductor device package |
CH560999A5 (en) * | 1973-08-16 | 1975-04-15 | Bbc Brown Boveri & Cie | |
JPS5610969A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Semiconductor controlled rectifier |
JPS56158460A (en) * | 1980-05-12 | 1981-12-07 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
FR2500959A1 (en) * | 1981-02-27 | 1982-09-03 | Thomson Csf | Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood |
JPS57188850A (en) * | 1981-05-15 | 1982-11-19 | Matsushita Electric Ind Co Ltd | Sealing method for semiconductor element |
JPS57188851A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electric Ind Co Ltd | Method of sealing semiconductor element |
JPS5861637A (en) * | 1981-10-09 | 1983-04-12 | Hitachi Ltd | Insulated mold type semiconductor device |
JPS5952853A (en) * | 1982-09-20 | 1984-03-27 | Hitachi Ltd | Semiconductor device |
JPS60136347A (en) * | 1983-12-26 | 1985-07-19 | Hitachi Micro Comput Eng Ltd | Semiconductor device and manufacture thereof |
JPS618957A (en) * | 1984-06-25 | 1986-01-16 | Hitachi Ltd | Assembling method of electronic device |
JPS61225847A (en) * | 1985-03-30 | 1986-10-07 | Toshiba Corp | Semiconductor rectifier |
JPS62185346A (en) * | 1986-02-08 | 1987-08-13 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
US4814943A (en) * | 1986-06-04 | 1989-03-21 | Oki Electric Industry Co., Ltd. | Printed circuit devices using thermoplastic resin cover plate |
US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
DE8808767U1 (en) * | 1988-07-08 | 1989-11-02 | Akyuerek, Altan, Dipl.-Ing., 8560 Lauf, De | |
JP2712618B2 (en) * | 1989-09-08 | 1998-02-16 | 三菱電機株式会社 | Resin-sealed semiconductor device |
DE9114268U1 (en) * | 1991-11-15 | 1992-01-09 | Siemens Ag, 8000 Muenchen, De | |
US5386342A (en) * | 1992-01-30 | 1995-01-31 | Lsi Logic Corporation | Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device |
JP3153638B2 (en) * | 1992-06-26 | 2001-04-09 | 三菱電機株式会社 | Pressure contact type semiconductor device, method of manufacturing the same, and heat compensator |
KR100307465B1 (en) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | Power module |
JPH06268102A (en) * | 1993-01-13 | 1994-09-22 | Fuji Electric Co Ltd | Resin sealed semiconductor device |
JP2883787B2 (en) * | 1993-07-20 | 1999-04-19 | 富士電機株式会社 | Substrate for power semiconductor device |
JPH07147345A (en) * | 1993-11-26 | 1995-06-06 | Meidensha Corp | Package of power semiconductor element |
EP0661748A1 (en) | 1993-12-28 | 1995-07-05 | Hitachi, Ltd. | Semiconductor device |
DE69535775D1 (en) * | 1994-10-07 | 2008-08-07 | Hitachi Ltd | Semiconductor arrangement with a plurality of semiconductor elements |
JPH08125071A (en) * | 1994-10-25 | 1996-05-17 | Fuji Electric Co Ltd | Semiconductor device |
JP3269745B2 (en) * | 1995-01-17 | 2002-04-02 | 株式会社日立製作所 | Modular semiconductor device |
JP3357220B2 (en) * | 1995-07-07 | 2002-12-16 | 三菱電機株式会社 | Semiconductor device |
EP0789397B1 (en) * | 1996-02-07 | 2004-05-06 | Hitachi, Ltd. | Circuit board and semiconductor device using the circuit board |
JPH09275165A (en) * | 1996-02-07 | 1997-10-21 | Hitachi Ltd | Circuit board and semiconductor device using the same |
DE19649798A1 (en) * | 1996-12-02 | 1998-06-04 | Abb Research Ltd | Power semiconductor module |
US5940271A (en) * | 1997-05-02 | 1999-08-17 | Lsi Logic Corporation | Stiffener with integrated heat sink attachment |
-
1998
- 1998-12-07 CA CA002255441A patent/CA2255441C/en not_active Expired - Fee Related
- 1998-12-07 CN CNB981170714A patent/CN1146988C/en not_active Expired - Lifetime
- 1998-12-07 TW TW087120275A patent/TW408453B/en not_active IP Right Cessation
- 1998-12-08 EP EP98123044A patent/EP0921565A3/en not_active Withdrawn
- 1998-12-08 US US09/207,141 patent/US6201696B1/en not_active Expired - Lifetime
- 1998-12-08 KR KR1019980053568A patent/KR19990062872A/en active Search and Examination
-
2000
- 2000-04-04 US US09/542,987 patent/US6597063B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112687630A (en) * | 2020-12-15 | 2021-04-20 | 株洲中车时代半导体有限公司 | Power device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP0921565A2 (en) | 1999-06-09 |
US6201696B1 (en) | 2001-03-13 |
CN1219767A (en) | 1999-06-16 |
US6597063B1 (en) | 2003-07-22 |
CN1146988C (en) | 2004-04-21 |
EP0921565A3 (en) | 2005-07-27 |
KR19990062872A (en) | 1999-07-26 |
TW408453B (en) | 2000-10-11 |
CA2255441C (en) | 2003-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2255441A1 (en) | Package for semiconductor power device and method for assembling the same | |
US5379186A (en) | Encapsulated electronic component having a heat diffusing layer | |
US7449774B1 (en) | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same | |
US5057903A (en) | Thermal heat sink encapsulated integrated circuit | |
US5869883A (en) | Packaging of semiconductor circuit in pre-molded plastic package | |
US5254500A (en) | Method for making an integrally molded semiconductor device heat sink | |
EP0348361B1 (en) | Hollow plastic package for semiconductor devices | |
RU2477901C2 (en) | Mv and hv distributor gear contact unit and its fabrication method | |
US7709856B2 (en) | Semiconductor light emitting device excellent in heat radiation | |
US4117508A (en) | Pressurizable semiconductor pellet assembly | |
ITMI941840A1 (en) | MODULE OF HIGH POWER SEMICONDUCTOR DEVICES WITH LOW THERMAL RESISTANCE AND SIMPLIFIED MANUFACTURING METHOD | |
WO2006057342A1 (en) | Connector for solar cell module | |
CN109659284B (en) | Semiconductor device with a plurality of semiconductor chips | |
KR20120048504A (en) | Capacitor system and method for producing a capacitor system | |
JP2008199022A (en) | Power semiconductor module and its manufacturing method | |
JP4465906B2 (en) | Power semiconductor module | |
US4538168A (en) | High power semiconductor package | |
EP3649671B1 (en) | Power semiconductor module with a housing connected onto a mould compound and corresponding manufacturing method | |
EP0418891B1 (en) | Moulded plastic power semiconductor device | |
WO2017185803A1 (en) | Photovoltaic junction box with low junction temperature and chip assembly for photovoltaic junction box with low junction temperature | |
US20010045297A1 (en) | Molding of electrical devices with a thermally conductive and electrically insulative polymer composition | |
JPH08125071A (en) | Semiconductor device | |
US5517058A (en) | Semiconductor package and method with vertically extended electrode leads | |
JP2000244077A (en) | Resin-molded substrate and resin-molded substrate with built-in electronic part | |
JP2000150724A (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |