CA2277181A1 - Card mounted with circuit chip and circuit chip module - Google Patents
Card mounted with circuit chip and circuit chip module Download PDFInfo
- Publication number
- CA2277181A1 CA2277181A1 CA002277181A CA2277181A CA2277181A1 CA 2277181 A1 CA2277181 A1 CA 2277181A1 CA 002277181 A CA002277181 A CA 002277181A CA 2277181 A CA2277181 A CA 2277181A CA 2277181 A1 CA2277181 A1 CA 2277181A1
- Authority
- CA
- Canada
- Prior art keywords
- circuit chip
- card
- reinforcing body
- chip mounted
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
In an IC card (30), a highly rigid ceramic frame (38) is buried in a layer formed of a core member (34), and an IC chip (42) is held in an internal space (38a) of the frame (38) through an elastic material (40). Therefore, the IC
chip (42) held in the internal space (38a) of the frame (38) is not deformed largely even when strong bending forces, torsional forces, pressing forces, etc., are applied to the IC card (30), nor no shock is transmitted directly to the chip (42) even when shocks are given to the card (30). A coil (44) which is formed by printing, etc., is provided on an upper end face (38b) of the frame (38). The coil (44) is connected to the chip (42) through a wire (46).
Since the chip (42), frame (38), and coil (44) are integrally formed in advance, the workability is improved at the time of manufacturing the card (30). Therefore, a highly reliable and inexpensive card mounted with circuit chip, etc., can be provided.
chip (42) held in the internal space (38a) of the frame (38) is not deformed largely even when strong bending forces, torsional forces, pressing forces, etc., are applied to the IC card (30), nor no shock is transmitted directly to the chip (42) even when shocks are given to the card (30). A coil (44) which is formed by printing, etc., is provided on an upper end face (38b) of the frame (38). The coil (44) is connected to the chip (42) through a wire (46).
Since the chip (42), frame (38), and coil (44) are integrally formed in advance, the workability is improved at the time of manufacturing the card (30). Therefore, a highly reliable and inexpensive card mounted with circuit chip, etc., can be provided.
Description
SPECIFICATION
Card Mounted with Circuit Chip and Circuit Chip Module Technical Field The present invention relates to a card mounted with a circuit chip, and a circuit chip module. Particularly, the present invention relates to a circuit chip mounted card and a circuit chip module realizing improvement of reliability and reduction in fabrication cost.
Background Art A non-contact type IC card is used in automatic examination for lifts in skiing grounds and railroads, automatic sorting of parcels, and the like.
An example of a conventional non-contact IC card is shown in Fig. 7. An IC card 2 shown in Fig. 7 is a one-coil type IC card, including a coil 4 used as an antenna, capacitors C1 and C2, and an IC chip 8.
Capacitors C1 and C2 and IC chip 8 are mounted on a film-like synthetic resin substrate. The substrate mounted with capacitors C1 and C2 and IC chip 8 is :referred to as a tab (tape automated bonding) 10.
Fig. 8A is a sectional view of IC card 2. A core member 12 of synthetic resin is sandwiched by a pair of surface layer members 14 and 16.
Tab 10 mounted with capacitors C1, C2 and IC chip 8 is fixed to surface layer member 14 exposed within a cavity 18 provided in core membex 12.
The junction between tab 10 and IC chip 8 is covered with an encapsulant 9 formed of epoxy resin and the like.
Coi14 is located between surface layer member 14 and core member 12. Coil 4 and tab 10 are connected by a wire 20.
Fig. 8B shows a circuit diagram of IC card 2. IC card 2 receives an electromagnetic wave sent from a reader/writer (write/read device) not shown) by a resonant circuit 22 formed by coil 4 and capacitor C1 as the power source. It is to be noted that capacitor C2 is the capacitor for smoothing power.
The transmitted information overlapped with the electromagnetic wave is decoded by a control unit (not shown) provided in IC chip 8) and then sent back. This response is effected by altering the impedance of resonant circuit 22. The reader/writer identifies the contents of the response by detecting change in impedance (impedance reflectance) of its own resonant circuit (not shown) corresponding to the impedance change of resonant circuit 22 of IC card 2.
By using IC card 2, information can be transmitted/received without power provided in the card and in a non-contact manner.
The above-described conventional IC card has problems set forth in the following. IC card 2 is often carried in a wallet or pocket of trousers, easily susceptible to a relatively great bending force, torsional force, or pressing force. The thickness t of IC card 2 shown in Fig. 8A corresponds to the standard dimension, and is not so thick. Therefore, the rigidity with respect to bending, twisting, and compression is not so great. This means that the strain is extremely great when IC card 2 is subjected to a great bending force and the like. Accordingly, IC chip 8 will be greatly deformed.
This deformation causes a crack in IC chip 8 to degrade the function as an IC card.
When an impact is exerted on IC card 2, that impact will be conveyed to IC chip 8 to damage the same. Thus, there was a problem that the conventional IC card was di~cult to handle and lacks reliability.
Furthermore, assembling is labor-consuming to increase the fabrication cost since coil 4 and tab 10 must be connected by wire 20.
Disclosure of the Invention An object of the present invention is to provide a circuit chip mounted card and the like of high reliability and low fabrication cost by solving the above conventional problems.
According to an aspect of the present invention, a circuit chip mounted card of the present invention achieving the above object includes a reinforcing body that improves the rigidity of the card in the proximity of a circuit chip. The card is characterized in that an antenna that communicates utilizing an electromagnetic wave is provided at the reinforcing body.
According to the present invention having such a structure, a strong
Card Mounted with Circuit Chip and Circuit Chip Module Technical Field The present invention relates to a card mounted with a circuit chip, and a circuit chip module. Particularly, the present invention relates to a circuit chip mounted card and a circuit chip module realizing improvement of reliability and reduction in fabrication cost.
Background Art A non-contact type IC card is used in automatic examination for lifts in skiing grounds and railroads, automatic sorting of parcels, and the like.
An example of a conventional non-contact IC card is shown in Fig. 7. An IC card 2 shown in Fig. 7 is a one-coil type IC card, including a coil 4 used as an antenna, capacitors C1 and C2, and an IC chip 8.
Capacitors C1 and C2 and IC chip 8 are mounted on a film-like synthetic resin substrate. The substrate mounted with capacitors C1 and C2 and IC chip 8 is :referred to as a tab (tape automated bonding) 10.
Fig. 8A is a sectional view of IC card 2. A core member 12 of synthetic resin is sandwiched by a pair of surface layer members 14 and 16.
Tab 10 mounted with capacitors C1, C2 and IC chip 8 is fixed to surface layer member 14 exposed within a cavity 18 provided in core membex 12.
The junction between tab 10 and IC chip 8 is covered with an encapsulant 9 formed of epoxy resin and the like.
Coi14 is located between surface layer member 14 and core member 12. Coil 4 and tab 10 are connected by a wire 20.
Fig. 8B shows a circuit diagram of IC card 2. IC card 2 receives an electromagnetic wave sent from a reader/writer (write/read device) not shown) by a resonant circuit 22 formed by coil 4 and capacitor C1 as the power source. It is to be noted that capacitor C2 is the capacitor for smoothing power.
The transmitted information overlapped with the electromagnetic wave is decoded by a control unit (not shown) provided in IC chip 8) and then sent back. This response is effected by altering the impedance of resonant circuit 22. The reader/writer identifies the contents of the response by detecting change in impedance (impedance reflectance) of its own resonant circuit (not shown) corresponding to the impedance change of resonant circuit 22 of IC card 2.
By using IC card 2, information can be transmitted/received without power provided in the card and in a non-contact manner.
The above-described conventional IC card has problems set forth in the following. IC card 2 is often carried in a wallet or pocket of trousers, easily susceptible to a relatively great bending force, torsional force, or pressing force. The thickness t of IC card 2 shown in Fig. 8A corresponds to the standard dimension, and is not so thick. Therefore, the rigidity with respect to bending, twisting, and compression is not so great. This means that the strain is extremely great when IC card 2 is subjected to a great bending force and the like. Accordingly, IC chip 8 will be greatly deformed.
This deformation causes a crack in IC chip 8 to degrade the function as an IC card.
When an impact is exerted on IC card 2, that impact will be conveyed to IC chip 8 to damage the same. Thus, there was a problem that the conventional IC card was di~cult to handle and lacks reliability.
Furthermore, assembling is labor-consuming to increase the fabrication cost since coil 4 and tab 10 must be connected by wire 20.
Disclosure of the Invention An object of the present invention is to provide a circuit chip mounted card and the like of high reliability and low fabrication cost by solving the above conventional problems.
According to an aspect of the present invention, a circuit chip mounted card of the present invention achieving the above object includes a reinforcing body that improves the rigidity of the card in the proximity of a circuit chip. The card is characterized in that an antenna that communicates utilizing an electromagnetic wave is provided at the reinforcing body.
According to the present invention having such a structure, a strong
-2-bending, torsional, or pressing force) when exerted, will not cause the card to be greatly deformed in the proximity of the circuit chip. Therefore) the circuit chip per se will not be greatly deformed. When a bending force, twisting force) pressing force or the like is exerted, the occurrence of the circuit chip being damaged to degrade the function can be relatively prevented. In other words, reliability of the circuit chip mounted card can be improved.
The provision of an antenna that communicates using an electromagnetic wave at the reinforcing body allows the circuit chip, the antenna and the like to be connected to facilitate integration. Therefore, the fabrication cost can be reduced due to improvement of the workability duizng fabucation.
In a preferable embodiment, a circuit chip mounted card of the present invention having the above structure includes a frame arranged so that the reinforcing body surrounds the circuit chip in the direction of the plane perpendicular to the direction of the card thickness.
According to such a structure, the rigidity of the card in the proximity of the circuit chip can be improved effectively while maintaining the space to store the circuit chip.
Further preferably, the reinforcing body includes a tabular body coupled to at least one side of the cavity surrounded by the frame body in the thickness direction. The circuit chip is arranged in a cavity of substantially a recess formed of the tabular body and the frame body.
According to this structure) the rigidity of the card in the proximity of circuit chip can further be improved. The desired rigidity can be ensured even when the dimension of the reinforcing body in the plane direction is relatively increased. When an antenna is provided at the reinforcing body, for example, a larger antenna can be provided.
In the circuit chip mounted card of such a structure, the circuit chip is further preferably supported within the card by a buffer member that alleviates the impact.
According to <~ circuit chip mounted card of such a structure, any impact, when exerted, will be alleviated in transmission. Therefore,
The provision of an antenna that communicates using an electromagnetic wave at the reinforcing body allows the circuit chip, the antenna and the like to be connected to facilitate integration. Therefore, the fabrication cost can be reduced due to improvement of the workability duizng fabucation.
In a preferable embodiment, a circuit chip mounted card of the present invention having the above structure includes a frame arranged so that the reinforcing body surrounds the circuit chip in the direction of the plane perpendicular to the direction of the card thickness.
According to such a structure, the rigidity of the card in the proximity of the circuit chip can be improved effectively while maintaining the space to store the circuit chip.
Further preferably, the reinforcing body includes a tabular body coupled to at least one side of the cavity surrounded by the frame body in the thickness direction. The circuit chip is arranged in a cavity of substantially a recess formed of the tabular body and the frame body.
According to this structure) the rigidity of the card in the proximity of circuit chip can further be improved. The desired rigidity can be ensured even when the dimension of the reinforcing body in the plane direction is relatively increased. When an antenna is provided at the reinforcing body, for example, a larger antenna can be provided.
In the circuit chip mounted card of such a structure, the circuit chip is further preferably supported within the card by a buffer member that alleviates the impact.
According to <~ circuit chip mounted card of such a structure, any impact, when exerted, will be alleviated in transmission. Therefore,
-3-damage of the circuit chip caused by an impact can be relatively prevented.
According to another preferable embodiment of the inventive circuit chip mounted card :having the above structure, an antenna for communication utilizing an electromagnetic wave is provided at the buffer member.
By such a structure) the circuit chip, antenna, and the like can be connected integrally. Therefore, the fabrication cost can be reduced by improving the workability in the fabrication process.
Since the position of the wire connecting the circuit chip and the antenna can be accommodated within the range of the reinforcing body of high izgidity, cut off or disconnection of the wire caused by the card being bent is less likely to occur. Therefore, the reliability of a non-contact type circuit chip mounted card with an antenna can be improved.
Preferably, the antenna in the circuit chip mounted card is formed of a looped metal wire fixed to the reinforcing body or buffer member.
By such a structure, the antenna can be formed more easily by printing or etching. As a result, the fabrication cost can further be reduced.
According to another preferable embodiment of the circuit chip mounted card of the present invention having the above structure, the reinforcing body is formed of ceramic.
According to the circuit chip mounted card of such a structure) the rigidity of the reinfarcing body can further be improved. Therefore, the rigidity of the card in the proximity of the circuit chip can be further improved.
An insulator does not have to be used in providing the antenna at the reinforcing body since ceramic is highly insulative. Therefore, an antenna can be directly provided at the reinforcing body by punting and the like to allow reduction in the fabrication cost.
According to another aspect, a circuit chip mounted card of the present invention includes a first substrate, a reinforcing body arranged on the first substrate and having a through hole in the thickness direction of the card, a second substrate arranged on the reinforcing body) a buffer
According to another preferable embodiment of the inventive circuit chip mounted card :having the above structure, an antenna for communication utilizing an electromagnetic wave is provided at the buffer member.
By such a structure) the circuit chip, antenna, and the like can be connected integrally. Therefore, the fabrication cost can be reduced by improving the workability in the fabrication process.
Since the position of the wire connecting the circuit chip and the antenna can be accommodated within the range of the reinforcing body of high izgidity, cut off or disconnection of the wire caused by the card being bent is less likely to occur. Therefore, the reliability of a non-contact type circuit chip mounted card with an antenna can be improved.
Preferably, the antenna in the circuit chip mounted card is formed of a looped metal wire fixed to the reinforcing body or buffer member.
By such a structure, the antenna can be formed more easily by printing or etching. As a result, the fabrication cost can further be reduced.
According to another preferable embodiment of the circuit chip mounted card of the present invention having the above structure, the reinforcing body is formed of ceramic.
According to the circuit chip mounted card of such a structure) the rigidity of the reinfarcing body can further be improved. Therefore, the rigidity of the card in the proximity of the circuit chip can be further improved.
An insulator does not have to be used in providing the antenna at the reinforcing body since ceramic is highly insulative. Therefore, an antenna can be directly provided at the reinforcing body by punting and the like to allow reduction in the fabrication cost.
According to another aspect, a circuit chip mounted card of the present invention includes a first substrate, a reinforcing body arranged on the first substrate and having a through hole in the thickness direction of the card, a second substrate arranged on the reinforcing body) a buffer
-4-member arranged on the first substrate in the through hole, a circuit chip arranged on the buffer member in the through hole, and a core member external to the reinforcing body) and arranged between the first and second substrates.
According to the present invention of such a structure, the card will not be greatly deformed in the proximity of the circuit chip even when a strong bending, torsional, or pressing force, and the like is exerted on the car d. Therefore, the circuit chip itself will not be greatly deformed. Thus, the occurrence of the circuit chip being damaged to degrade the function can be relatively prevented even when a bending, torsional, or pressing force and the like is exerted. In other words, the reliability of the circuit chip mounted card c;an be improved.
Even when an impact is exerted on the card, transmission of that impact to the circuit; chip can be alleviated by the function of the buffer member. Therefore, damage of the circuit chip caused by an impact can be relatively prevented.
According to an aspect of the present invention, a circuit chip module of the present invention configures a card mounted with a circuit chip.
The circuit chip mounted in the card and a reinforcing body to improve the ugidity of the card where the circuit chip is mounted are integrally coupled.
The reinforcing body includes a frame arranged so as to surround the circuit chip in a plane direction perpendicular to the direction of thickness of the card, and a tabular member covering at least one side of the cavity surrounded by the frame in the thickness direction. The circuit chip is arranged in a substantially recess cavity formed by the tabular member and the frame.
According to the circuit chip module of the present invention having such a structure, the card will not be greatly deformed in the proximity of circuit chip even when a strong bending force, twisting force, compression and the like is exeWed on the chip. Therefore, the circuit chip itself will not be greatly deformed. The occurrence of the circuit chip being damaged to degrade the function can be relatively prevented even when a bending, torsional, or pressing force and the like is exerted. In other words, the
According to the present invention of such a structure, the card will not be greatly deformed in the proximity of the circuit chip even when a strong bending, torsional, or pressing force, and the like is exerted on the car d. Therefore, the circuit chip itself will not be greatly deformed. Thus, the occurrence of the circuit chip being damaged to degrade the function can be relatively prevented even when a bending, torsional, or pressing force and the like is exerted. In other words, the reliability of the circuit chip mounted card c;an be improved.
Even when an impact is exerted on the card, transmission of that impact to the circuit; chip can be alleviated by the function of the buffer member. Therefore, damage of the circuit chip caused by an impact can be relatively prevented.
According to an aspect of the present invention, a circuit chip module of the present invention configures a card mounted with a circuit chip.
The circuit chip mounted in the card and a reinforcing body to improve the ugidity of the card where the circuit chip is mounted are integrally coupled.
The reinforcing body includes a frame arranged so as to surround the circuit chip in a plane direction perpendicular to the direction of thickness of the card, and a tabular member covering at least one side of the cavity surrounded by the frame in the thickness direction. The circuit chip is arranged in a substantially recess cavity formed by the tabular member and the frame.
According to the circuit chip module of the present invention having such a structure, the card will not be greatly deformed in the proximity of circuit chip even when a strong bending force, twisting force, compression and the like is exeWed on the chip. Therefore, the circuit chip itself will not be greatly deformed. The occurrence of the circuit chip being damaged to degrade the function can be relatively prevented even when a bending, torsional, or pressing force and the like is exerted. In other words, the
-5-reliability of the circuit chip mounted card can be improved.
According to another aspect, a circuit chip module of the present invention configures a card mounted with a circuit chip. The circuit chip mounted in the card and a reinforcing body to improve the rigidity of the card where the circiut chip is mounted are integrally coupled. The circuit chip is supported in a resting manner within the card via a buffer member that alleviates an impact.
According to a fuWher aspect, a circuit chip module of the present invention configures a card mounted with a non-contact type circuit chip that communicates in an electrically non-contact manner. The circuit chip mounted in the card and a reinforcing body to improve the izgidity of the card where the circuit chip is incorporated are integrally coupled. An antenna that communicates utilizing an electromagnetic wave is provided at the reinforcing body.
According to still another aspect of the present invention, a circuit chip module of the present invention configures a card mounted with a non-contact type circuit chip that communicates in an electrically non-contact manner. The circuit chip mounted in the card and the reinforcing body to improve the rigidity of a card where the circuit chip is incorporated are integrally coupled. An antenna that communicates utilizing an electromagnetic wave is provided at the buffer member.
Bizef Descuption of the Drawings Fig. 1 shows the appearance of a non-contact type IC card 30 according to an embodiment of the present invention.
Fig. 2 is a seci;ional view taken along sectional plane II-II of Fig. 1.
Fig. 3 is a plan view of IC card 3 viewed from the direction of Vl of Fig. 2 with a surface layer member 3G removed.
Fig. 4 is sectional view showing a sectional structure of a non-contact type IC card 50 according to another embodiment of the present invention.
Fig. 5 is a sectional view showing a sectional structure of a non-contact type IC card 170 according to a further embodiment of the present invention.
Fig. 6 shows the appearance of a non-contact type IC card 60 according to still anather embodiment of the present invention.
Fig. 7 shows an example of a conventional non-contact type IC card.
Fig. 8A is a sectional view taken along line VIVA-VIIIA of Fig. 7) and Fig. 8B is a circuit diagram of IC card 2.
Best Modes for Carrying Out the Invention Fig. 1 shows an appearance of a non-contact type IC card 30 as a circuit chip mounted card according to an embodiment of the present invention. IC card 30 is a one-coil type IC card used in the automatic examination for a ski lift at skiing grounds and railways, automatic sorter of parcels) and the like.
Fig. 2 is a sectional view taken along line II-II of Fig. 1. IC card 30 has a structure of sequential layers of a surface layer member 32 which is the first substrate) a core member 34, and surface layer member 36 which is the second substrate. Synthetic resin such as vinyl chloride, PET
(polyethylene terephthalate) and the like are used for surface layer members 32 and 36. Core member 34 is formed of synthetic resin.
A ceramic frame 38 is embedded in the layer formed of core member 34. Cer amic frame 38 is formed of ceramic in a cylindrical configuration.
Cer amic frame 38 carresponds to the frame of a reinforcing body. In the present embodiment:, the reinforcing body is formed only of the frame.
~'he interior 38a of ceramic frame 38 forms a cavity. An elastic member 40 which is a buffer member is layered in contact with surface layer member 32 at the bottom end of interior 38a of ceramic frame 38.
Adhesive silicon rubber is used for elastic member 40. An IC chip 42 which is the circuit chip is supported on elastic member 40. In the present embodiment, a capacitor for a resonant circuit and a capacitor for smoothing the power source are incorporated in IC card 42.
By embedding ceramic frame 38 in the layer of core member 34, the bending rigidity) torsion rigidity) and compression rigidity of IC card 30 in the proximity of ceramic frame 38 can be improved significantly.
Even if a strong bending, torsional) or pressing force is exerted on the IC card, IC chip 42 located at interior 38a of ceramic frame 38 will not
According to another aspect, a circuit chip module of the present invention configures a card mounted with a circuit chip. The circuit chip mounted in the card and a reinforcing body to improve the rigidity of the card where the circiut chip is mounted are integrally coupled. The circuit chip is supported in a resting manner within the card via a buffer member that alleviates an impact.
According to a fuWher aspect, a circuit chip module of the present invention configures a card mounted with a non-contact type circuit chip that communicates in an electrically non-contact manner. The circuit chip mounted in the card and a reinforcing body to improve the izgidity of the card where the circuit chip is incorporated are integrally coupled. An antenna that communicates utilizing an electromagnetic wave is provided at the reinforcing body.
According to still another aspect of the present invention, a circuit chip module of the present invention configures a card mounted with a non-contact type circuit chip that communicates in an electrically non-contact manner. The circuit chip mounted in the card and the reinforcing body to improve the rigidity of a card where the circuit chip is incorporated are integrally coupled. An antenna that communicates utilizing an electromagnetic wave is provided at the buffer member.
Bizef Descuption of the Drawings Fig. 1 shows the appearance of a non-contact type IC card 30 according to an embodiment of the present invention.
Fig. 2 is a seci;ional view taken along sectional plane II-II of Fig. 1.
Fig. 3 is a plan view of IC card 3 viewed from the direction of Vl of Fig. 2 with a surface layer member 3G removed.
Fig. 4 is sectional view showing a sectional structure of a non-contact type IC card 50 according to another embodiment of the present invention.
Fig. 5 is a sectional view showing a sectional structure of a non-contact type IC card 170 according to a further embodiment of the present invention.
Fig. 6 shows the appearance of a non-contact type IC card 60 according to still anather embodiment of the present invention.
Fig. 7 shows an example of a conventional non-contact type IC card.
Fig. 8A is a sectional view taken along line VIVA-VIIIA of Fig. 7) and Fig. 8B is a circuit diagram of IC card 2.
Best Modes for Carrying Out the Invention Fig. 1 shows an appearance of a non-contact type IC card 30 as a circuit chip mounted card according to an embodiment of the present invention. IC card 30 is a one-coil type IC card used in the automatic examination for a ski lift at skiing grounds and railways, automatic sorter of parcels) and the like.
Fig. 2 is a sectional view taken along line II-II of Fig. 1. IC card 30 has a structure of sequential layers of a surface layer member 32 which is the first substrate) a core member 34, and surface layer member 36 which is the second substrate. Synthetic resin such as vinyl chloride, PET
(polyethylene terephthalate) and the like are used for surface layer members 32 and 36. Core member 34 is formed of synthetic resin.
A ceramic frame 38 is embedded in the layer formed of core member 34. Cer amic frame 38 is formed of ceramic in a cylindrical configuration.
Cer amic frame 38 carresponds to the frame of a reinforcing body. In the present embodiment:, the reinforcing body is formed only of the frame.
~'he interior 38a of ceramic frame 38 forms a cavity. An elastic member 40 which is a buffer member is layered in contact with surface layer member 32 at the bottom end of interior 38a of ceramic frame 38.
Adhesive silicon rubber is used for elastic member 40. An IC chip 42 which is the circuit chip is supported on elastic member 40. In the present embodiment, a capacitor for a resonant circuit and a capacitor for smoothing the power source are incorporated in IC card 42.
By embedding ceramic frame 38 in the layer of core member 34, the bending rigidity) torsion rigidity) and compression rigidity of IC card 30 in the proximity of ceramic frame 38 can be improved significantly.
Even if a strong bending, torsional) or pressing force is exerted on the IC card, IC chip 42 located at interior 38a of ceramic frame 38 will not
-6-be greatly deformed. Therefore, damage of IC chip 42 will seldom occur even when a bending) torsional, or pressing force and the like is exerted.
In other words, the reliability of IC card 30 can be improved.
By fixing IC chip 42 via elastic member 40, any impact on IC card 30, when exerted) will not be directly transmitted to IC chip 42. Therefore, the damage of IC chip 42 caused by an impact can be alleviated.
In the present; embodiment, the thickness of both surface layer members 32 and 36 :is O.lmm) and the entire thickness of IC card 30 is 0.768mm. IC chip 42 is a square having the sides of 3mm in length and 0.25mm in thickness. Elastic member 40 has a thickness of 0.118mm.
The height of ceramic frame 38 is 568mm including a coil 44 that will be described afterwards) adjacent to an upper end face 38b. - The inner diameter of ceramic frame 38 is set so that the clearance from the incorpor ated IC chip 42 is approximately 0.2-0.3mm. The outer diameter of ceramic frame 38 :is approximately 23mm. It is to be noted that the present invention is not limited to these dimensions and materials.
Coil 44 forming an antenna is provided at the upper end of ceramic frame 38. Fig. 3 shows IC card 30 viewed from the direction of Vl of Fig. 2 with suuace layer member 36 removed. Coil 44 is formed of a looped metal wire provided by printing or etching on upper end face 38b of cylindrical ceramic frame 38. The terminal of coil 44 is connected to IC
chip 42 by a wire 46..
The provision of coil 44 at upper end face 38b of ceramic frame 38 allows the preparation in advance of a unitary element of the connection of IC chip 42) ceramic flame 38 and coil 44. Therefore, the fabizcation cost can be reduced by virtue of improvement in the workability of fabrication.
Since wire 46 connecting IC chip 42 and coil 44 is located within the range of highly rigid ceramic frame 38, cut off or disconnection of wire 4G
caused by IC card 30 being bent is less likely to occur. Therefore, the reliability of non-contact type IC card 30 including coil 44 can be improved.
By forming th.e reinforcing body with ceramic, high rigidity can be obtained. It is not necessary to use an insulator in providing coil 44 at ceramic flame 38 by virtue of the high insulation of the ceramic. Coil 44 ?_ can be directly provided at ceramic frame 38 by printing and the like to reduce the fabrication cost.
The operation of IC card 30 is similar to that of conventional IC card 2. More specifically, an electromagnetic wave sent from a reader/writer (write/read device, not shown) is received by a resonant circuit (not shown) formed of coil 44 and a capacitor (not shown) incorporated in IC chip 42.
The received electromagnetic wave corresponds to the power source. A
capacitor (not shown) for smoothing the power is incorporated in IC chip 42.
The obtained information overlapped with the electromagnetic wave is decoded by a control unit (not shown) provided in IC chip 42. The decoded information is sent back. This response is effected by altering the impedance of the resonant circuit. The readerlwriter can identify the contents of the response by detecting the impedance change of its own r esonant circuit (not shown) in actor dance with the impedance change of the resonant circuit of IC card 3.
Thus, information can be transmitted/received with the card absent of a power source, and in a non-contact manner.
Although the above embodiment is configured so that IC chip 42 is fixed to surface layer member 32 via elastic member 40 as shown in Fig. 2, IC chip 42 can be directly fixed to surface layer member 32 without elastic member 40.
Fig, 4 shows a sectional view of a non-contact IC card 50 as a circuit chip mounted card according to another embodiment of the present invention. The appearance of the structure of IC car d 50 is similar to that of IC card 30 (refer to Fig. 1). The view from Vl of Fig. 4 is substantially similar to that for IC card 32 (refer to Fig. 3).
It is to be noted that the configuration of ceramic frame 52 in IC card 50 as shown in Fig. 4 differs from that of ceramic frame 38 of IC card 32 (refer to Fig. 2). More specifically, ceramic frame 52 differs from ceramic fi ame 38 formed only of a cylindrical frame body in that it includes a cylindrical section 52a which is a frame body, and a bottom section 52b which is tabular provided integrally continuous to the lower end of cylindrical section 52a.
_g_ As shown in Fig. 4) IC chip 42 is configured to be directly fixed to bottom section 52b of recess cavity 52c formed by cylindrical section 52a and bottom section 52b of ceramic frame 52.
By providing a bottom section 52b integrally continuous to the lower end of cylindrical section 52a, the rigidity of ceramic frame 52 can be further improved. Therefore, the desired rigidity can be ensured even when the dimension of ceramic frame 52 in the plane direction (the X
direction and Y direction in Fig. 1) is relatively increased. Therefore, the diameter of coil 44 can be set greater.
As shown in Fig. 4, IC chip module 54 which is the circuit chip module is formed of ceramic frame 52) IC chip 42 fixed to ceramic frame 52, coil 44 formed by being panted or etched at ceramic frame 52, and wire 46 connecting coil 44 and IC chip 42. By providing such a module, the workability in the fabrication process can be improved to allow reduction in the fabrication cost.
Although the present embodiment is configured so as to directly fix IC chip 42 at bottom. section 52b of ceramic frame 52, an elastic member 40 as shown in Fig. 2 can be provided between IC chip 42 and bottom section 52b of ceramic frame 52. Accordingly, the impact exerted on the card can be alleviated.
Each of the above embodiments is configured so as to form coil 44 at the upper end face of ceramic frame 38 or 52. However) the coil can be provided at the lower end, side plane) or both ends of ceramic frame 38 or 52. Furthermore, ceramic frame 38 or 52 can be divided into two or more pieces in the thickness direction so as to sandwich the coil between the divided ceramic frames.
Although coil 44 is directly formed at ceramic frame 38 or 52 by printing or etching, a coil can be formed by etching and the like at a synthetic resin film and connect that film formed with a coil to ceramic frame 38 or 52. Furthermore) the coil can be wound around ceramic frame 38 or 52.
Fig. 5 shows a sectional structure of a non-contact type IC card 170 which is a circuit chip mounted card according to another embodiment of the present invention. The appearance of IC card 170 is similar to that of IC card 30.
As shown in Fig. 5, the configuration of ceramic frame 172 corresponding to a fr. ame body in IC card 170 differs from ceramic frame 38 (refer to Fig. 2) in IC, card 30. More specifically) ceramic frame 172 has the outer side formed of a unit cylinder, likewise ceramic frame 38, and the inner side formed in a stepped cylindrical shape.
As shown in F'ig. 5, a stepped portion 172a of ceramic dame 172 has a coil 44 formed functioning as an antenna. A support film 174 forming a buffer member is arranged on coil 44. Support film 1?4 is a synthetic resin film formed as a hollow cylinder with a panted wiring (not shown) applied. The printed wiring of support film 174 and a terminal 44a provided at the end of coil 44 are coupled by soldeizng or bumping technology (terminal junction technique) and the like. Therefore, support film 174 is supported in a resting manner on step portion 172a of ceramic frame.172 via coil 44 within inner cavity 172b of ceramic frame 172.
An IC chip 42 is provided substantially at the center of support film 174. The printed wiring of support frame 174 and terminal 42a of IC chip 42 are coupled by soldering or bumping techniques. Therefore, IC chip 42 is supported by support film 174 in a suspending manner within internal cavity 172b of ceramic frame 172.
Terminal 44a of coil 44 and terminal 42a of IC chip 42 are electrically connected through the aforementioned printed wiring provided at support film 174.
By such a structure, an impact exerted on the card can be reliably alleviated. No wire is required in electrically connecting coil 44 and IC
chip 42. Therefore, the event of disconnection or cut off of the wir a will not occur. As shown in. Fig. 5) ceramic frame 172, coil 44) suppoW film 174 and IC chip 42 form IC chip module 176 as a circuit chip module. By such a modular form, the workability in fabrication is improved to reduce the fabizcation cost.
The present embodiment is configured so as to connect the printed wiring of support film 174 with terminal 42a of IC chip 42 by means of soldering or bumping techniques. However, support film 174 and IC chip 42 can be coupled via an isotropic conductor (not shown). An anisotropic conductor is a conductor having conductivity in only one direction, and is adhesive. Anisolum (Hitachi Chemical Company Limited) that is a thermosetting adhesive can be used as the anisotropic conductor.
The usage of such an anisotropic conductor allows the printed wiring of support film 174 to be electrically connected to terminal 42a of IC chip 42.
Since the anisotropic conductor is applied so as to fill up the gap between support film 174 and IC chip 42, the bonding strength between support film 174 and IC chip 42 can be increased significantly. By the formation of entirely covering top surface 42b of IC chip 42 by the anisotropic conductor, introduction of moisture into IC chip 42 can be prevented. Therefore, corrosion of the aluminum wiring (not shown) in IC chip 42 can be prevented.
According to the present embodiment, printed wiring is provided at support film 174 and. electrical connection established between coil 44 and IC chip 42 via the printed wiring. However, coil 44 and IC chip 42 can be electrically connected via a wire as in the embodiment shown in Figs. 2 and 4. Although a synthetic resin film of a hollow cylindrical shape is used as the buffer member, the shape and the material of the buffer member are not limited to the aforementioned.
Coil 44 is provided at a stepped section 172a of ceramic frame 172 in the present embodiment. However, coil 44 can be provided at the top surface, bottom surface) side surface, end surface and the like of ceramic frame 172. Also, ceramic frame 172 can be divided into two or more pieces in the direction of the thickness, and insert the coil between the divided ceramic frames.
Coil 44 is formed at ceramic frame 172 by printing or etching.
However, the coil can be directly formed by a printed wising and the like at support film 174. Also) the coil can be round around ceramic frame 172.
Furthermore, coil 64 can be provided external to ceramic flame 62 as in an IC card 60 of Fig. 6. Such a structure allows coil 64 to be increased in size without increasing the dimension of ceramic frame 62. Therefore, information can be transmitted/received even when the distance from the reader/writer is great.
A through cylindrical or a cylinder with a bottom is used as the reinforcing body in each of the above embodiments. However, the outside or inside configuration of the cylinder is not limited to the cylinclizcal shape.
For example, a rectangular tubular form can be used as the reinforcing body. Also, the reinforcing body is not limited to a cylinclizcal form, and a tabular form, for example, can be used. Furthermore) a plugality of reinforcing bodies can be provided. For example) a reinforcing body can be provided above and below so as to sandwich the circuit chip.
The reinforcing body is formed of ceramic in each of the above embodiments. However, a material other than ceramic can be used as long as it is rigid. For example, a metal material such as stainless steel or hard synthetic resin and the like can be used.
The capacitor for a resonant circuit and the capacitor for power smoothing are incorporated in IC chip 42 in each of the above embodiments.
However, these capacitors do not have to be incorporated in IC chip 42. In such a case, IC chip 42 and the capacitor are mounted on a tab) which is installed within ceramic frame 38 or 52) as shown in Fig. 8A. In the embodiment of Fig. !i, the capacitor can be mounted at support film 174.
Each of the above-described embodiments is exemplified with the present invention applied to a one-coil type non-contact IC car d. However) the present application is also applicable to the so-called multi-coil type non-contact IC card. Furthermore) the present invention is applicable to a contact type IC card besides the non-contact type IC card. Furthermore) the present invention is applicable to the entire module incorporating the circuit chip and the entire card in addition to an IC card. Here) a card implies a substantially tabular member, such as a credit card, a commutation ticket, a common ticket of the railway, and the like.
In other words, the reliability of IC card 30 can be improved.
By fixing IC chip 42 via elastic member 40, any impact on IC card 30, when exerted) will not be directly transmitted to IC chip 42. Therefore, the damage of IC chip 42 caused by an impact can be alleviated.
In the present; embodiment, the thickness of both surface layer members 32 and 36 :is O.lmm) and the entire thickness of IC card 30 is 0.768mm. IC chip 42 is a square having the sides of 3mm in length and 0.25mm in thickness. Elastic member 40 has a thickness of 0.118mm.
The height of ceramic frame 38 is 568mm including a coil 44 that will be described afterwards) adjacent to an upper end face 38b. - The inner diameter of ceramic frame 38 is set so that the clearance from the incorpor ated IC chip 42 is approximately 0.2-0.3mm. The outer diameter of ceramic frame 38 :is approximately 23mm. It is to be noted that the present invention is not limited to these dimensions and materials.
Coil 44 forming an antenna is provided at the upper end of ceramic frame 38. Fig. 3 shows IC card 30 viewed from the direction of Vl of Fig. 2 with suuace layer member 36 removed. Coil 44 is formed of a looped metal wire provided by printing or etching on upper end face 38b of cylindrical ceramic frame 38. The terminal of coil 44 is connected to IC
chip 42 by a wire 46..
The provision of coil 44 at upper end face 38b of ceramic frame 38 allows the preparation in advance of a unitary element of the connection of IC chip 42) ceramic flame 38 and coil 44. Therefore, the fabizcation cost can be reduced by virtue of improvement in the workability of fabrication.
Since wire 46 connecting IC chip 42 and coil 44 is located within the range of highly rigid ceramic frame 38, cut off or disconnection of wire 4G
caused by IC card 30 being bent is less likely to occur. Therefore, the reliability of non-contact type IC card 30 including coil 44 can be improved.
By forming th.e reinforcing body with ceramic, high rigidity can be obtained. It is not necessary to use an insulator in providing coil 44 at ceramic flame 38 by virtue of the high insulation of the ceramic. Coil 44 ?_ can be directly provided at ceramic frame 38 by printing and the like to reduce the fabrication cost.
The operation of IC card 30 is similar to that of conventional IC card 2. More specifically, an electromagnetic wave sent from a reader/writer (write/read device, not shown) is received by a resonant circuit (not shown) formed of coil 44 and a capacitor (not shown) incorporated in IC chip 42.
The received electromagnetic wave corresponds to the power source. A
capacitor (not shown) for smoothing the power is incorporated in IC chip 42.
The obtained information overlapped with the electromagnetic wave is decoded by a control unit (not shown) provided in IC chip 42. The decoded information is sent back. This response is effected by altering the impedance of the resonant circuit. The readerlwriter can identify the contents of the response by detecting the impedance change of its own r esonant circuit (not shown) in actor dance with the impedance change of the resonant circuit of IC card 3.
Thus, information can be transmitted/received with the card absent of a power source, and in a non-contact manner.
Although the above embodiment is configured so that IC chip 42 is fixed to surface layer member 32 via elastic member 40 as shown in Fig. 2, IC chip 42 can be directly fixed to surface layer member 32 without elastic member 40.
Fig, 4 shows a sectional view of a non-contact IC card 50 as a circuit chip mounted card according to another embodiment of the present invention. The appearance of the structure of IC car d 50 is similar to that of IC card 30 (refer to Fig. 1). The view from Vl of Fig. 4 is substantially similar to that for IC card 32 (refer to Fig. 3).
It is to be noted that the configuration of ceramic frame 52 in IC card 50 as shown in Fig. 4 differs from that of ceramic frame 38 of IC card 32 (refer to Fig. 2). More specifically, ceramic frame 52 differs from ceramic fi ame 38 formed only of a cylindrical frame body in that it includes a cylindrical section 52a which is a frame body, and a bottom section 52b which is tabular provided integrally continuous to the lower end of cylindrical section 52a.
_g_ As shown in Fig. 4) IC chip 42 is configured to be directly fixed to bottom section 52b of recess cavity 52c formed by cylindrical section 52a and bottom section 52b of ceramic frame 52.
By providing a bottom section 52b integrally continuous to the lower end of cylindrical section 52a, the rigidity of ceramic frame 52 can be further improved. Therefore, the desired rigidity can be ensured even when the dimension of ceramic frame 52 in the plane direction (the X
direction and Y direction in Fig. 1) is relatively increased. Therefore, the diameter of coil 44 can be set greater.
As shown in Fig. 4, IC chip module 54 which is the circuit chip module is formed of ceramic frame 52) IC chip 42 fixed to ceramic frame 52, coil 44 formed by being panted or etched at ceramic frame 52, and wire 46 connecting coil 44 and IC chip 42. By providing such a module, the workability in the fabrication process can be improved to allow reduction in the fabrication cost.
Although the present embodiment is configured so as to directly fix IC chip 42 at bottom. section 52b of ceramic frame 52, an elastic member 40 as shown in Fig. 2 can be provided between IC chip 42 and bottom section 52b of ceramic frame 52. Accordingly, the impact exerted on the card can be alleviated.
Each of the above embodiments is configured so as to form coil 44 at the upper end face of ceramic frame 38 or 52. However) the coil can be provided at the lower end, side plane) or both ends of ceramic frame 38 or 52. Furthermore, ceramic frame 38 or 52 can be divided into two or more pieces in the thickness direction so as to sandwich the coil between the divided ceramic frames.
Although coil 44 is directly formed at ceramic frame 38 or 52 by printing or etching, a coil can be formed by etching and the like at a synthetic resin film and connect that film formed with a coil to ceramic frame 38 or 52. Furthermore) the coil can be wound around ceramic frame 38 or 52.
Fig. 5 shows a sectional structure of a non-contact type IC card 170 which is a circuit chip mounted card according to another embodiment of the present invention. The appearance of IC card 170 is similar to that of IC card 30.
As shown in Fig. 5, the configuration of ceramic frame 172 corresponding to a fr. ame body in IC card 170 differs from ceramic frame 38 (refer to Fig. 2) in IC, card 30. More specifically) ceramic frame 172 has the outer side formed of a unit cylinder, likewise ceramic frame 38, and the inner side formed in a stepped cylindrical shape.
As shown in F'ig. 5, a stepped portion 172a of ceramic dame 172 has a coil 44 formed functioning as an antenna. A support film 174 forming a buffer member is arranged on coil 44. Support film 1?4 is a synthetic resin film formed as a hollow cylinder with a panted wiring (not shown) applied. The printed wiring of support film 174 and a terminal 44a provided at the end of coil 44 are coupled by soldeizng or bumping technology (terminal junction technique) and the like. Therefore, support film 174 is supported in a resting manner on step portion 172a of ceramic frame.172 via coil 44 within inner cavity 172b of ceramic frame 172.
An IC chip 42 is provided substantially at the center of support film 174. The printed wiring of support frame 174 and terminal 42a of IC chip 42 are coupled by soldering or bumping techniques. Therefore, IC chip 42 is supported by support film 174 in a suspending manner within internal cavity 172b of ceramic frame 172.
Terminal 44a of coil 44 and terminal 42a of IC chip 42 are electrically connected through the aforementioned printed wiring provided at support film 174.
By such a structure, an impact exerted on the card can be reliably alleviated. No wire is required in electrically connecting coil 44 and IC
chip 42. Therefore, the event of disconnection or cut off of the wir a will not occur. As shown in. Fig. 5) ceramic frame 172, coil 44) suppoW film 174 and IC chip 42 form IC chip module 176 as a circuit chip module. By such a modular form, the workability in fabrication is improved to reduce the fabizcation cost.
The present embodiment is configured so as to connect the printed wiring of support film 174 with terminal 42a of IC chip 42 by means of soldering or bumping techniques. However, support film 174 and IC chip 42 can be coupled via an isotropic conductor (not shown). An anisotropic conductor is a conductor having conductivity in only one direction, and is adhesive. Anisolum (Hitachi Chemical Company Limited) that is a thermosetting adhesive can be used as the anisotropic conductor.
The usage of such an anisotropic conductor allows the printed wiring of support film 174 to be electrically connected to terminal 42a of IC chip 42.
Since the anisotropic conductor is applied so as to fill up the gap between support film 174 and IC chip 42, the bonding strength between support film 174 and IC chip 42 can be increased significantly. By the formation of entirely covering top surface 42b of IC chip 42 by the anisotropic conductor, introduction of moisture into IC chip 42 can be prevented. Therefore, corrosion of the aluminum wiring (not shown) in IC chip 42 can be prevented.
According to the present embodiment, printed wiring is provided at support film 174 and. electrical connection established between coil 44 and IC chip 42 via the printed wiring. However, coil 44 and IC chip 42 can be electrically connected via a wire as in the embodiment shown in Figs. 2 and 4. Although a synthetic resin film of a hollow cylindrical shape is used as the buffer member, the shape and the material of the buffer member are not limited to the aforementioned.
Coil 44 is provided at a stepped section 172a of ceramic frame 172 in the present embodiment. However, coil 44 can be provided at the top surface, bottom surface) side surface, end surface and the like of ceramic frame 172. Also, ceramic frame 172 can be divided into two or more pieces in the direction of the thickness, and insert the coil between the divided ceramic frames.
Coil 44 is formed at ceramic frame 172 by printing or etching.
However, the coil can be directly formed by a printed wising and the like at support film 174. Also) the coil can be round around ceramic frame 172.
Furthermore, coil 64 can be provided external to ceramic flame 62 as in an IC card 60 of Fig. 6. Such a structure allows coil 64 to be increased in size without increasing the dimension of ceramic frame 62. Therefore, information can be transmitted/received even when the distance from the reader/writer is great.
A through cylindrical or a cylinder with a bottom is used as the reinforcing body in each of the above embodiments. However, the outside or inside configuration of the cylinder is not limited to the cylinclizcal shape.
For example, a rectangular tubular form can be used as the reinforcing body. Also, the reinforcing body is not limited to a cylinclizcal form, and a tabular form, for example, can be used. Furthermore) a plugality of reinforcing bodies can be provided. For example) a reinforcing body can be provided above and below so as to sandwich the circuit chip.
The reinforcing body is formed of ceramic in each of the above embodiments. However, a material other than ceramic can be used as long as it is rigid. For example, a metal material such as stainless steel or hard synthetic resin and the like can be used.
The capacitor for a resonant circuit and the capacitor for power smoothing are incorporated in IC chip 42 in each of the above embodiments.
However, these capacitors do not have to be incorporated in IC chip 42. In such a case, IC chip 42 and the capacitor are mounted on a tab) which is installed within ceramic frame 38 or 52) as shown in Fig. 8A. In the embodiment of Fig. !i, the capacitor can be mounted at support film 174.
Each of the above-described embodiments is exemplified with the present invention applied to a one-coil type non-contact IC car d. However) the present application is also applicable to the so-called multi-coil type non-contact IC card. Furthermore) the present invention is applicable to a contact type IC card besides the non-contact type IC card. Furthermore) the present invention is applicable to the entire module incorporating the circuit chip and the entire card in addition to an IC card. Here) a card implies a substantially tabular member, such as a credit card, a commutation ticket, a common ticket of the railway, and the like.
Claims (24)
1. A circuit chip mounted card, mounted with a circuit chip, characterized by comprising a reinforcing body improving card rigidity in proximity to a circuit chip, and an antenna that communicates using an electromagnetic wave, provided at said reinforcing body.
2. The circuit chip mounted card according to claim 1, characterized in that said reinforcing body comprises a frame arranged so as to surround the circuit chip in a plane direction perpendicular to a thickness direction of the card.
3. The circuit chip mounted card according to claim 2, characterized in that said reinforcing body composes a tabular member covering at least one side of a cavity surrounded by said frame in the thickness direction, and said circuit chip is arranged in a substantially recessed cavity formed by said tabular member and frame.
4. The circuit chip mounted card according to claim 2, characterized in that said circuit chip is supported in the card via a buffer member alleviating an impact.
5. The circuit chip mounted card according to claim 4, characterized in that said circuit chip is supported in a resting manner in the card via said buffer member.
6. The circuit chip mounted card according to claim 1, characterized in that said card is a contact type circuit chip mounted card that communicates electrically in contact.
7. The circuit chip mounted card according to claim 1, characterized in that said card is a non-contact type circuit chip mounted card that communicates in an electrically non-contact manner.
8. (deleted)
9. A circuit chip module according to claim 4, mounted in a non-contact type circuit chip mounted card that communicates in an electrically non-contact manner, characterized in that an antenna that communicates using an electromagnetic wave is provided at said buffer member.
10. (amended) The circuit chip mounted card according to claim 9, characterized in that said antenna is a looped metal wire fixed at said reinforcing body or said buffer member.
11. A circuit chip mounted card, mounted with a circuit chip, characterized by comprising:
a first substrate, a reinforcing body arranged on said first substrate, and having a through hole in a thickness direction of the card, a second substrate arranged on said reinforcing body, a buffer member arranged on said first substrate in said through hole, a circuit chip arranged on said buffer member in said through hole, and a core member external to said reinforcing member, and arranged between said first substrate and said second substrate.
a first substrate, a reinforcing body arranged on said first substrate, and having a through hole in a thickness direction of the card, a second substrate arranged on said reinforcing body, a buffer member arranged on said first substrate in said through hole, a circuit chip arranged on said buffer member in said through hole, and a core member external to said reinforcing member, and arranged between said first substrate and said second substrate.
12. A circuit chip mounted card, mounted with a circuit chip, characterized by comprising:
a first substrate, a reinforcing body arranged on said first substrate, and including a recess open upwards in a thickness direction of the card, a second substrate arranged on said reinforcing body, a circuit chip arranged on a bottom face of said recess within said recess, and a core member arranged external to said reinforcing body, and between said first and second substrates.
a first substrate, a reinforcing body arranged on said first substrate, and including a recess open upwards in a thickness direction of the card, a second substrate arranged on said reinforcing body, a circuit chip arranged on a bottom face of said recess within said recess, and a core member arranged external to said reinforcing body, and between said first and second substrates.
13. A circuit chip mounted card, mounted with a circuit chip, characterized by comprising:
a first substrate, a reinforcing body arranged on said first substrate, and having a through hole at an upper portion of the card in a thickness direction, a second substrate arranged on said reinforcing body, a buffer member supported by said reinforcing body at a resting state within said through hole, a circuit chip supported by a buffer member at a resting state within said through hole, and a core member arranged external to said reinforcing body, and between said first and second substrates.
a first substrate, a reinforcing body arranged on said first substrate, and having a through hole at an upper portion of the card in a thickness direction, a second substrate arranged on said reinforcing body, a buffer member supported by said reinforcing body at a resting state within said through hole, a circuit chip supported by a buffer member at a resting state within said through hole, and a core member arranged external to said reinforcing body, and between said first and second substrates.
14. The circuit chip mounted card according to any of claims 11-13, characterized by comprising an antenna formed of a looped metal wire fixed to said reinforcing body, and electrically connected to said circuit chip.
15. The circuit chip mounted card according to claim 11 or 13, characterized by comprising an antenna formed of a looped metal wire fixed to said buffer member, and electrically connected to said circuit chip.
16. The circuit chip mounted card according to claim 1, characterized in that said reinforcing body is formed of ceramic.
17. (deleted)
18. (deleted)
19. A circuit chip module configuring a circuit chip mounted card, characterized in that the circuit chip mounted in the card and a reinforcing body to improve card rigidity where said circuit chip is incorporated are integrally coupled, said reinforcing body including a flame arranged so as to surround the circuit chip in a plane direction perpendicular to a thickness direction of the card, and a tabular member covering at least one side of a cavity surrounded by said frame in the thickness direction, said circuit chip arranged in a substantially recessed cavity formed by said tabular member and frame.
20. (deleted)
21. (amended) A circuit chip module configuring a circuit chip mounted card, characterized in that the circuit chip mounted in the card and a reinforcing body to improve card rigidity where said circuit chip is incorporated are integrally coupled, said circuit chip being supported in a resting state in the card via a buffer member alleviating an impact.
22. (amended) A circuit chip module configuring a non-contact type circuit chip mounted card that communicates in an electrically non-contact manner, characterized in that the circuit chip mounted in the card and a reinforcing body to improve card rigidity where said circuit chip is incorporated are integrally coupled, and an antenna that communicates using an electromagnetic wave is provided at said reinforcing member.
23. (amended) A circuit chip module configuring a non-contact type circuit chip mounted card that communicates in an electrically non-contact manner, characterized in that the circuit chip mounted in the card and a reinforcing body to improve card rigidity where said circuit chip is incorporated are integrally coupled, and an antenna that communicates using an electromagnetic wave is provided at said buffer member.
24. The circuit chip module according to claim 22 or 23, characterized in that said antenna is a looped metal wire fixed to said reinforcing body or said buffer member.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35135996A JP4108779B2 (en) | 1996-12-27 | 1996-12-27 | Circuit chip mounted card and circuit chip module |
JP8-351359 | 1996-12-27 | ||
PCT/JP1997/004771 WO1998029262A1 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2277181A1 true CA2277181A1 (en) | 1998-07-09 |
Family
ID=18416769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002277181A Abandoned CA2277181A1 (en) | 1996-12-27 | 1997-12-22 | Card mounted with circuit chip and circuit chip module |
Country Status (8)
Country | Link |
---|---|
US (1) | US6478228B1 (en) |
EP (2) | EP1013472B1 (en) |
JP (1) | JP4108779B2 (en) |
CN (1) | CN1086346C (en) |
AU (1) | AU742524B2 (en) |
CA (1) | CA2277181A1 (en) |
DE (2) | DE69738891D1 (en) |
WO (1) | WO1998029262A1 (en) |
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US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
CA2470600C (en) | 2001-12-24 | 2009-12-22 | Digimarc Id Systems, Llc | Systems, compositions, and methods for full color laser engraving of id documents |
CA2471457C (en) | 2001-12-24 | 2011-08-02 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
WO2003088144A2 (en) | 2002-04-09 | 2003-10-23 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
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KR100467634B1 (en) * | 2002-07-16 | 2005-01-24 | 삼성에스디에스 주식회사 | Smart card and manufacturing method of the same |
DE10232569A1 (en) * | 2002-07-18 | 2004-02-05 | Agfa-Gevaert Ag | identity card |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
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DE102004008841A1 (en) * | 2003-03-12 | 2004-09-23 | Bundesdruckerei Gmbh | Security insert, to prevent forgery or tampering, at a book document e.g. a passport, has an integrated data carrier with a microchip which can be scanned without contact |
DE602004030434D1 (en) | 2003-04-16 | 2011-01-20 | L 1 Secure Credentialing Inc | THREE-DIMENSIONAL DATA STORAGE |
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US7838976B2 (en) * | 2006-07-28 | 2010-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a semiconductor chip enclosed by a body structure and a base |
KR101478810B1 (en) | 2006-07-28 | 2015-01-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Power storage device |
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-
1996
- 1996-12-27 JP JP35135996A patent/JP4108779B2/en not_active Expired - Fee Related
-
1997
- 1997-12-22 WO PCT/JP1997/004771 patent/WO1998029262A1/en active IP Right Grant
- 1997-12-22 AU AU78894/98A patent/AU742524B2/en not_active Ceased
- 1997-12-22 CN CN97181047A patent/CN1086346C/en not_active Expired - Fee Related
- 1997-12-22 EP EP97949217A patent/EP1013472B1/en not_active Expired - Lifetime
- 1997-12-22 DE DE69738891T patent/DE69738891D1/en not_active Expired - Lifetime
- 1997-12-22 DE DE69732719T patent/DE69732719T2/en not_active Expired - Fee Related
- 1997-12-22 EP EP04028035A patent/EP1514698B1/en not_active Expired - Lifetime
- 1997-12-22 US US09/331,190 patent/US6478228B1/en not_active Expired - Fee Related
- 1997-12-22 CA CA002277181A patent/CA2277181A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1241969A (en) | 2000-01-19 |
DE69738891D1 (en) | 2008-09-18 |
CN1086346C (en) | 2002-06-19 |
AU742524B2 (en) | 2002-01-03 |
EP1013472B1 (en) | 2005-03-09 |
EP1514698B1 (en) | 2008-08-06 |
JP4108779B2 (en) | 2008-06-25 |
US6478228B1 (en) | 2002-11-12 |
EP1013472A1 (en) | 2000-06-28 |
JPH10193847A (en) | 1998-07-28 |
AU7889498A (en) | 1998-07-31 |
DE69732719T2 (en) | 2006-04-13 |
EP1514698A2 (en) | 2005-03-16 |
DE69732719D1 (en) | 2005-04-14 |
EP1514698A3 (en) | 2005-03-30 |
WO1998029262A1 (en) | 1998-07-09 |
EP1013472A4 (en) | 2000-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Discontinued |