CA2327108A1 - Electromechanical switching device package with controlled impedance environment - Google Patents

Electromechanical switching device package with controlled impedance environment Download PDF

Info

Publication number
CA2327108A1
CA2327108A1 CA002327108A CA2327108A CA2327108A1 CA 2327108 A1 CA2327108 A1 CA 2327108A1 CA 002327108 A CA002327108 A CA 002327108A CA 2327108 A CA2327108 A CA 2327108A CA 2327108 A1 CA2327108 A1 CA 2327108A1
Authority
CA
Canada
Prior art keywords
ground
reed switch
signal
main body
opposing sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002327108A
Other languages
French (fr)
Other versions
CA2327108C (en
Inventor
Mark E. Martich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kearney National Inc
Original Assignee
Kearney-National, Inc.
Mark E. Martich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/266,978 external-priority patent/US6052045A/en
Application filed by Kearney-National, Inc., Mark E. Martich filed Critical Kearney-National, Inc.
Publication of CA2327108A1 publication Critical patent/CA2327108A1/en
Application granted granted Critical
Publication of CA2327108C publication Critical patent/CA2327108C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

A reed switch package (100) is disclosed that includes a reed switch (111) with at least one electrical signal path (106). A cylindrical ground shield (110) is provided about the reed switch (111). Ground terminals (108) are connected to opposing sides of the ground shield (110) so that the ground terminals (108) are on opposing sides of the signal terminal (106) and lie in the same plane. The reed switch (111) resides on a support substrate (222). An electrically conductive signal via (134) extends through the main body (212) and connects to the signal terminal (106). Ground vias (134) extend through the main body (212) and respectively connect to the ground terminals (108).
The ground vias (134) are on opposing sides of the signal via (134) and lie in the same plane as the signal via (114). The signal and ground vias (134) exit at the bottom of the main body (212) and are connected to a circuit via solder balls (224) to provide a compact surface mount package with a controlled impedance environment.
CA002327108A 1999-03-12 1999-10-06 Electromechanical switching device package with controlled impedance environment Expired - Fee Related CA2327108C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/266,978 1999-03-12
US09/266,978 US6052045A (en) 1999-03-12 1999-03-12 Electromechanical switching device package with controlled impedance environment
US09/391,710 US6025768A (en) 1999-03-12 1999-09-08 Electromechanical switching device package with controlled impedance environment
US09/391,710 1999-09-08
PCT/US1999/023129 WO2000055878A1 (en) 1999-03-12 1999-10-06 Electromechanical switching device package with controlled impedance environment

Publications (2)

Publication Number Publication Date
CA2327108A1 true CA2327108A1 (en) 2000-09-21
CA2327108C CA2327108C (en) 2007-04-10

Family

ID=26952147

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002327108A Expired - Fee Related CA2327108C (en) 1999-03-12 1999-10-06 Electromechanical switching device package with controlled impedance environment

Country Status (15)

Country Link
US (1) US6025768A (en)
EP (1) EP1037236B1 (en)
JP (1) JP3442012B2 (en)
KR (1) KR100396129B1 (en)
CN (1) CN1155037C (en)
AT (1) ATE239977T1 (en)
AU (1) AU6288199A (en)
CA (1) CA2327108C (en)
DE (1) DE69907624T2 (en)
DK (1) DK1037236T3 (en)
ES (1) ES2193643T3 (en)
HK (1) HK1037059A1 (en)
PT (1) PT1037236E (en)
TW (1) TW434618B (en)
WO (1) WO2000055878A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
EP1325505A4 (en) * 2000-09-18 2006-11-02 Meder Electronic A lead-less surface mount reed relay
JP3996758B2 (en) * 2001-03-13 2007-10-24 富士通コンポーネント株式会社 Operating condition constrained switch, external magnetic field generation unit, operating condition constrained switch device, and electronic device
GB2378042A (en) * 2001-07-24 2003-01-29 Ubinetics Ltd Fixing mechanical parts to PCBs
WO2003077269A2 (en) * 2002-03-08 2003-09-18 Kearney-National, Inc. Surface mount molded relay package and method of manufacturing same
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
CN101197337A (en) * 2006-12-05 2008-06-11 鸿富锦精密工业（深圳）有限公司 Fool-proof integrated circuit component
DE112009000842T5 (en) 2008-04-15 2011-05-19 Coto Technology, Inc. Improved Form C relay and device using the same
US7920038B1 (en) * 2008-05-20 2011-04-05 Keithley Instruments, Inc. Dual shielded relay
WO2015135130A1 (en) * 2014-03-11 2015-09-17 深圳市智优电池集成技术有限公司 Reed switch relay
DE202018101423U1 (en) * 2018-03-14 2019-06-17 Tridonic Gmbh & Co Kg Positioning and mounting aid for coils on printed circuit boards
WO2019194346A1 (en) * 2018-04-05 2019-10-10 엘지전자 주식회사 Pcb laminated structure and mobile terminal comprising same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (en) * 1969-10-06 1971-03-16 Grisby Barton Inc RELAY ASSEMBLY
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
US5438307A (en) * 1994-08-03 1995-08-01 Pen-Lin Liao Single-pole magnetic reed relay
US5684441A (en) * 1996-02-29 1997-11-04 Graeber; Roger R. Reverse power protection circuit and relay
EP0805471A1 (en) * 1996-04-30 1997-11-05 C.P. Clare Corporation Electromagnetic relay and method of manufacturing such relay
JPH11204010A (en) * 1998-01-08 1999-07-30 Fujitsu Takamisawa Component Ltd Reed relay and manufacture thereof

Also Published As

Publication number Publication date
CN1298545A (en) 2001-06-06
KR100396129B1 (en) 2003-08-27
AU6288199A (en) 2000-10-04
PT1037236E (en) 2003-08-29
US6025768A (en) 2000-02-15
CN1155037C (en) 2004-06-23
KR20010089117A (en) 2001-09-29
TW434618B (en) 2001-05-16
EP1037236A3 (en) 2001-01-17
JP2000268692A (en) 2000-09-29
JP3442012B2 (en) 2003-09-02
DE69907624T2 (en) 2004-03-25
EP1037236A2 (en) 2000-09-20
DK1037236T3 (en) 2003-08-25
WO2000055878A1 (en) 2000-09-21
ATE239977T1 (en) 2003-05-15
EP1037236B1 (en) 2003-05-07
HK1037059A1 (en) 2002-01-25
CA2327108C (en) 2007-04-10
ES2193643T3 (en) 2003-11-01
DE69907624D1 (en) 2003-06-12

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