CA2327108A1 - Electromechanical switching device package with controlled impedance environment - Google Patents
Electromechanical switching device package with controlled impedance environment Download PDFInfo
- Publication number
- CA2327108A1 CA2327108A1 CA002327108A CA2327108A CA2327108A1 CA 2327108 A1 CA2327108 A1 CA 2327108A1 CA 002327108 A CA002327108 A CA 002327108A CA 2327108 A CA2327108 A CA 2327108A CA 2327108 A1 CA2327108 A1 CA 2327108A1
- Authority
- CA
- Canada
- Prior art keywords
- ground
- reed switch
- signal
- main body
- opposing sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/64—Protective enclosures, baffle plates, or screens for contacts
- H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H51/00—Electromagnetic relays
- H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
- H01H51/281—Mounting of the relay; Encapsulating; Details of connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
- H01H2001/5888—Terminals of surface mounted devices [SMD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Abstract
A reed switch package (100) is disclosed that includes a reed switch (111) with at least one electrical signal path (106). A cylindrical ground shield (110) is provided about the reed switch (111). Ground terminals (108) are connected to opposing sides of the ground shield (110) so that the ground terminals (108) are on opposing sides of the signal terminal (106) and lie in the same plane. The reed switch (111) resides on a support substrate (222). An electrically conductive signal via (134) extends through the main body (212) and connects to the signal terminal (106). Ground vias (134) extend through the main body (212) and respectively connect to the ground terminals (108).
The ground vias (134) are on opposing sides of the signal via (134) and lie in the same plane as the signal via (114). The signal and ground vias (134) exit at the bottom of the main body (212) and are connected to a circuit via solder balls (224) to provide a compact surface mount package with a controlled impedance environment.
The ground vias (134) are on opposing sides of the signal via (134) and lie in the same plane as the signal via (114). The signal and ground vias (134) exit at the bottom of the main body (212) and are connected to a circuit via solder balls (224) to provide a compact surface mount package with a controlled impedance environment.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/266,978 | 1999-03-12 | ||
US09/266,978 US6052045A (en) | 1999-03-12 | 1999-03-12 | Electromechanical switching device package with controlled impedance environment |
US09/391,710 | 1999-09-08 | ||
US09/391,710 US6025768A (en) | 1999-03-12 | 1999-09-08 | Electromechanical switching device package with controlled impedance environment |
PCT/US1999/023129 WO2000055878A1 (en) | 1999-03-12 | 1999-10-06 | Electromechanical switching device package with controlled impedance environment |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2327108A1 true CA2327108A1 (en) | 2000-09-21 |
CA2327108C CA2327108C (en) | 2007-04-10 |
Family
ID=26952147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002327108A Expired - Fee Related CA2327108C (en) | 1999-03-12 | 1999-10-06 | Electromechanical switching device package with controlled impedance environment |
Country Status (15)
Country | Link |
---|---|
US (1) | US6025768A (en) |
EP (1) | EP1037236B1 (en) |
JP (1) | JP3442012B2 (en) |
KR (1) | KR100396129B1 (en) |
CN (1) | CN1155037C (en) |
AT (1) | ATE239977T1 (en) |
AU (1) | AU6288199A (en) |
CA (1) | CA2327108C (en) |
DE (1) | DE69907624T2 (en) |
DK (1) | DK1037236T3 (en) |
ES (1) | ES2193643T3 (en) |
HK (1) | HK1037059A1 (en) |
PT (1) | PT1037236E (en) |
TW (1) | TW434618B (en) |
WO (1) | WO2000055878A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE38381E1 (en) | 2000-07-21 | 2004-01-13 | Kearney-National Inc. | Inverted board mounted electromechanical device |
WO2002023566A2 (en) * | 2000-09-18 | 2002-03-21 | Meder Electronic | A lead-less surface mount reed relay |
JP3996758B2 (en) * | 2001-03-13 | 2007-10-24 | 富士通コンポーネント株式会社 | Operating condition constrained switch, external magnetic field generation unit, operating condition constrained switch device, and electronic device |
GB2378042A (en) * | 2001-07-24 | 2003-01-29 | Ubinetics Ltd | Fixing mechanical parts to PCBs |
ATE373869T1 (en) * | 2002-03-08 | 2007-10-15 | Kearney National Inc | SURFACE MOUNT RELAY MOLD HOUSING AND METHOD FOR MAKING SAME |
US7361844B2 (en) * | 2002-11-25 | 2008-04-22 | Vlt, Inc. | Power converter package and thermal management |
CN101197337A (en) * | 2006-12-05 | 2008-06-11 | 鸿富锦精密工业(深圳)有限公司 | Fool-proof integrated circuit component |
WO2009137239A2 (en) * | 2008-04-15 | 2009-11-12 | Coto Technology, Inc. | Improved form c relay and package using same |
US7920038B1 (en) * | 2008-05-20 | 2011-04-05 | Keithley Instruments, Inc. | Dual shielded relay |
KR101972592B1 (en) * | 2014-03-11 | 2019-04-25 | 선전 지유 배터리 인테그레이션 테크놀로지 컴퍼니 리미티드 | Reed switch relay |
DE202018101423U1 (en) * | 2018-03-14 | 2019-06-17 | Tridonic Gmbh & Co Kg | Positioning and mounting aid for coils on printed circuit boards |
WO2019194346A1 (en) * | 2018-04-05 | 2019-10-10 | 엘지전자 주식회사 | Pcb laminated structure and mobile terminal comprising same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE757101A (en) * | 1969-10-06 | 1971-03-16 | Grisby Barton Inc | RELAY ASSEMBLY |
US3939381A (en) * | 1974-03-22 | 1976-02-17 | Mcm Industries, Inc. | Universal burn-in fixture |
US5438307A (en) * | 1994-08-03 | 1995-08-01 | Pen-Lin Liao | Single-pole magnetic reed relay |
US5684441A (en) * | 1996-02-29 | 1997-11-04 | Graeber; Roger R. | Reverse power protection circuit and relay |
EP0805471A1 (en) * | 1996-04-30 | 1997-11-05 | C.P. Clare Corporation | Electromagnetic relay and method of manufacturing such relay |
JPH11204010A (en) * | 1998-01-08 | 1999-07-30 | Fujitsu Takamisawa Component Ltd | Reed relay and manufacture thereof |
-
1999
- 1999-09-08 US US09/391,710 patent/US6025768A/en not_active Expired - Lifetime
- 1999-10-06 DK DK99119173T patent/DK1037236T3/en active
- 1999-10-06 CA CA002327108A patent/CA2327108C/en not_active Expired - Fee Related
- 1999-10-06 PT PT99119173T patent/PT1037236E/en unknown
- 1999-10-06 AU AU62881/99A patent/AU6288199A/en not_active Abandoned
- 1999-10-06 KR KR10-2000-7010891A patent/KR100396129B1/en not_active IP Right Cessation
- 1999-10-06 DE DE69907624T patent/DE69907624T2/en not_active Expired - Lifetime
- 1999-10-06 AT AT99119173T patent/ATE239977T1/en not_active IP Right Cessation
- 1999-10-06 EP EP99119173A patent/EP1037236B1/en not_active Expired - Lifetime
- 1999-10-06 WO PCT/US1999/023129 patent/WO2000055878A1/en active Application Filing
- 1999-10-06 CN CNB998053066A patent/CN1155037C/en not_active Expired - Fee Related
- 1999-10-06 ES ES99119173T patent/ES2193643T3/en not_active Expired - Lifetime
- 1999-10-08 JP JP28783199A patent/JP3442012B2/en not_active Expired - Fee Related
- 1999-12-02 TW TW088121074A patent/TW434618B/en not_active IP Right Cessation
-
2001
- 2001-09-24 HK HK01106718A patent/HK1037059A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ES2193643T3 (en) | 2003-11-01 |
DE69907624D1 (en) | 2003-06-12 |
JP2000268692A (en) | 2000-09-29 |
US6025768A (en) | 2000-02-15 |
CN1298545A (en) | 2001-06-06 |
CN1155037C (en) | 2004-06-23 |
EP1037236B1 (en) | 2003-05-07 |
HK1037059A1 (en) | 2002-01-25 |
DE69907624T2 (en) | 2004-03-25 |
KR100396129B1 (en) | 2003-08-27 |
ATE239977T1 (en) | 2003-05-15 |
WO2000055878A1 (en) | 2000-09-21 |
AU6288199A (en) | 2000-10-04 |
EP1037236A3 (en) | 2001-01-17 |
TW434618B (en) | 2001-05-16 |
EP1037236A2 (en) | 2000-09-20 |
PT1037236E (en) | 2003-08-29 |
KR20010089117A (en) | 2001-09-29 |
JP3442012B2 (en) | 2003-09-02 |
CA2327108C (en) | 2007-04-10 |
DK1037236T3 (en) | 2003-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |