CA2360759A1 - Diagnostic layer and methods for detecting structural integrity of composite and metallic materials - Google Patents

Diagnostic layer and methods for detecting structural integrity of composite and metallic materials Download PDF

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Publication number
CA2360759A1
CA2360759A1 CA002360759A CA2360759A CA2360759A1 CA 2360759 A1 CA2360759 A1 CA 2360759A1 CA 002360759 A CA002360759 A CA 002360759A CA 2360759 A CA2360759 A CA 2360759A CA 2360759 A1 CA2360759 A1 CA 2360759A1
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CA
Canada
Prior art keywords
sensors
substrate
diagnostic
actuator
output signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002360759A
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French (fr)
Other versions
CA2360759C (en
Inventor
Fu-Kuo Chang
Mark Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leland Stanford Junior University
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The Board Of Trusteed Of The Leland Stanford Junior University
Fu-Kuo Chang
Mark Lin
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Application filed by The Board Of Trusteed Of The Leland Stanford Junior University, Fu-Kuo Chang, Mark Lin filed Critical The Board Of Trusteed Of The Leland Stanford Junior University
Publication of CA2360759A1 publication Critical patent/CA2360759A1/en
Application granted granted Critical
Publication of CA2360759C publication Critical patent/CA2360759C/en
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0016—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings of aircraft wings or blades
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0033—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining damage, crack or wear
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0091—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by using electromagnetic excitation or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2475—Embedded probes, i.e. probes incorporated in objects to be inspected
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2481—Wireless probes, e.g. with transponders or radio links
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0251—Solidification, icing, curing composites, polymerisation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays

Abstract

A diagnostic layer having a network of actuators and sensors may be incorporated into or on the surface of composite, metallic, and laminated materials for monitoring the structural health of the material. The diagnostic layer is adapted for detecting and measuring changes in the condition of the material, e.g., the site and extent of damage in the material. In a preferred embodiment, piezoelectric devices are embedded in the diagnostic layer in a network, and serve as actuators and sensors. Signals emitted from the sensors in response to physical deformation, either by an impact or as a result of stress waves generated by the actuators, are diagnostic of the current condition of the diagnostic layer. The diagnostic layer is also adapted to monitor the curing process of a composite material and accurately determine when curing is complete. Methods for monitoring changes in conditions of a material are also disclosed.

Claims (26)

1. A diagnostic layer for detecting a structural condition of a material, said diagnostic layer comprising:
a) a thin dielectric substrate;
b) a plurality of sensors spatially distributed on said substrate, said sensors capable of generating electrical signals representative of a structural condition of said substrate;
c) a plurality of conductive elements in said substrate electrically connected to said sensors; and d) an output lead electrically connected to said conductive elements.
2. The diagnostic layer of claim 1 further comprising at least one actuator on said substrate, wherein said actuator is not necessarily distinct from said sensors, and wherein said conductive elements electrically connect said actuator to said output lead.
3. The diagnostic layer of claim 2 further comprising a plurality of actuators spatially distributed on said substrate, wherein said actuators are not necessarily distinct from said sensors.
4. The diagnostic layer of claim 1 wherein said sensors are piezoelectric sensors and generate said electrical signals in response to physical deformations of said piezoelectric sensors.
5. A diagnostic system for detecting a structural condition of a material, said diagnostic system comprising:
a) a diagnostic layer comprising:
i) a thin dielectric substrate;
ii) a plurality of sensors spatially distributed on said substrate, said sensors capable of generating electrical output signals representative of a structural condition of said substrate;

iii) a plurality of conductive elements in said substrate electrically connected to said sensors; and iv) an output lead electrically connected to said conductive elements;
b) a signal receiver unit electrically coupled to said output lead for receiving said output signals from said sensors; and c) an interface unit in electrical communication with said signal receiver unit, said interface unit comprising a processor unit for processing data from said signal receiver unit to detect said structural condition.
6. The diagnostic system of claim 5 wherein:
a) said diagnostic layer further comprises at least one actuator on said substrate, wherein said actuator is not necessarily distinct from said sensors, and wherein said conductive elements electrically connect said actuator to said output lead; and b) said diagnostic system further comprises a signal generating unit electrically connected to said output lead for providing an input signal to said actuator.
7. The diagnostic system of claim 6 wherein said signal generating unit is electrically connected to said interface unit, and wherein said interface unit further comprises a control unit for controlling said input signal to said actuator.
8. The diagnostic system of claim 6 further comprising a plurality of actuators spatially distributed on said substrate, wherein said actuators are not necessarily distinct from said sensors.
9. The diagnostic system of claim 5 wherein said sensors are piezoelectric sensors and generate said output signals in response to physical deformations of said piezoelectric sensors.
10. The diagnostic system of claim 5 wherein said signal receiver unit is electrically coupled to said output lead by wireless means.
11. The diagnostic system of claim 5 wherein said interface unit further comprises a memory unit for storing said data from said signal receiver unit.
12. The diagnostic system of claim 5 wherein said structural condition comprises a location and a size of structural damage in said diagnostic layer.
13. The diagnostic system of claim 5 wherein said structural condition comprises a location and a force of an impact to said diagnostic layer.
14. The diagnostic system of claim 5 wherein said structural condition comprises progression of curing.
15. A method of detecting a change in a structural condition of a material, said method comprising the steps of:
a) providing a material having a diagnostic layer comprising:
i) a thin dielectric substrate;
ii) at least one actuator on said substrate;
iii) a plurality of sensors spatially distributed on said substrate;
iv) a plurality of conductive elements in said substrate electrically connected to said sensors and said actuator; and v) an output lead electrically connected to said conductive elements;
b) transmitting a first input signal to said actuator through said output lead;
c) receiving a first set of output signals from said sensors in response to said first input signal;
d) at a later time, transmitting a second input signal to said actuator through said output lead;
e) receiving a second set of output signals from said sensors in response to said second input signal; and f) analyzing said first set of output signals and said second set of output signals to determine a difference between said first set of output signals and said second set of output signals, wherein said difference represents said change in said structural condition.
16. The method of claim 15 wherein step (f) comprises generating a first set of data from said first set of output signals and generating a second set of data from said second set of output signals, wherein set first set of data represents a first structural condition of said material and said second set of data represents a second structural condition of said material.
17. The method of claim 15 wherein said change in said structural condition comprises a location and a size of damage in said diagnostic layer.
18. The method of claim 15 wherein said change in said structural condition comprises progression of curing.
19. The method of claim 15, further comprising the steps of:
a) at a later time, transmitting an n th input signal to said actuator through said output lead;
b) receiving an n th set of output signals from said sensors in response to said n th input signal; and c) analyzing said n th set of output signals and a prior set of output signals to determine a difference between said n th set of output signals and said prior set of output signals, wherein said difference represents a further change in said structural condition; and d) repeating steps (a), (b), and (c) for a predetermined time.
20. The method of claim 15, further comprising the steps of, before step (a), providing said material, and bonding said diagnostic layer to an external surface of said material.
21. A method of detecting a physical deformation of a material having a diagnostic layer, said diagnostic layer comprising a plurality of sensors spatially distributed on a thin dielectric substrate and electrically connected to an output lead by a plurality of conductive elements, said method comprising the steps of:
a) receiving a signal from at least one of said sensors, wherein said signal represents a physical deformation of said sensor; and b) processing said signal to generate data representing said physical deformation of said material.
22. The method of claim 21 wherein said sensors are piezoelectric sensors.
23. The method of claim 21 wherein said physical deformation of said material comprises an impact on said material and said data comprise a force and a location of said impact.
24. A method of curing a composite material comprising the steps of:
a) providing an uncured composite material having a diagnostic layer;
b) subjecting said uncured composite material to an elevated temperature, wherein said elevated temperature initiates curing of said uncured composite material; and c) monitoring changes in a condition of said diagnostic layer until said condition is substantially constant.
25. The method of claim 24 wherein:
said diagnostic layer comprises:
i) a thin dielectric substrate;
ii) at least one actuator on said substrate;
iii) a plurality of sensors spatially distributed on said substrate;
iv) a plurality of conductive elements in said substrate electrically connected to said sensors and said actuator; and v) an output lead electrically connected to said conductive elements; and step (c) comprises:
i) transmitting an input signal to said actuator through said output lead;
ii) receiving a set of output signals from said sensors in response to said first input signal; and iii) repeating steps (i) and (ii) until said set of output signals is substantially constant.
26
CA002360759A 1999-11-23 2000-11-02 Diagnostic layer and methods for detecting structural integrity of composite and metallic materials Expired - Lifetime CA2360759C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/447,480 1999-11-23
US09/447,480 US6370964B1 (en) 1998-11-23 1999-11-23 Diagnostic layer and methods for detecting structural integrity of composite and metallic materials
PCT/US2000/041839 WO2001039253A2 (en) 1999-11-23 2000-11-02 Diagnostic layer and methods for detecting structural integrity of composite and metallic materials

Publications (2)

Publication Number Publication Date
CA2360759A1 true CA2360759A1 (en) 2001-05-31
CA2360759C CA2360759C (en) 2010-01-05

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CA002360759A Expired - Lifetime CA2360759C (en) 1999-11-23 2000-11-02 Diagnostic layer and methods for detecting structural integrity of composite and metallic materials

Country Status (6)

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US (1) US6370964B1 (en)
EP (1) EP1185839A4 (en)
JP (1) JP4823459B2 (en)
AU (1) AU3437801A (en)
CA (1) CA2360759C (en)
WO (1) WO2001039253A2 (en)

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