CA2460840A1 - Thin electronic label and method for making same - Google Patents

Thin electronic label and method for making same Download PDF

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Publication number
CA2460840A1
CA2460840A1 CA002460840A CA2460840A CA2460840A1 CA 2460840 A1 CA2460840 A1 CA 2460840A1 CA 002460840 A CA002460840 A CA 002460840A CA 2460840 A CA2460840 A CA 2460840A CA 2460840 A1 CA2460840 A1 CA 2460840A1
Authority
CA
Canada
Prior art keywords
substrate
conductive layer
electronic component
window
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002460840A
Other languages
French (fr)
Other versions
CA2460840C (en
Inventor
Francois Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagravision SARL
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2460840A1 publication Critical patent/CA2460840A1/en
Application granted granted Critical
Publication of CA2460840C publication Critical patent/CA2460840C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The aim of this invention is to provide a thin flexible card or electronic label, wherein are mounted electronic components to provide good electric connection between component contacts and card conductors. The aim of this invention is also to provide a manufacturing method for this type of card or electronic label.

The card or electronic label, according to the invention, is produced by assembling at least one thin, flexible substrate (7), a conductive layer (4) and an adhesive layer (1), and comprising at least one electronic component (11). Said card is characterized in that the substrate (7) includes at least one window (8) wherein is housed the electronic component (11), the adhesive layer (1) maintains the conductive layer (8) on the substrate, the conductive layer (4) extends partially into the window's surface (8) so as to form at least one electric contact (4') whereon the electronic component (11) is connected. The substrate (7) has a thickness preferably selected on the basis of the greatest height of the component to be mounted.

Claims (11)

1. ~Method for manufacturing cards or electronic labels carried out by assembling at least one thin, flexible substrate (7), a conductive layer (4) and an adhesive layer (1), and comprising at least one electronic component (11), said conductive layer (4) being made up of conductive tracks defining an antenna, characterized in that it includes the following steps:
- ~formation of at least one segment (6) in the conductive layer(4), - ~formation of at least one window (2) in the adhesive layer (1), - ~formation of at least one window (8) in the substrate (7), said window (8) being intended to receive the electronic component (11), - ~superimposition and lamination of the adhesive (1) and conductive layers (4) on the substrate (7) in order to make correspond the openings (6), (2), (8) made previously, - ~realization of an electric circuit made up of a plurality of tracks, and formation of at least one connection surface (4') for the electronic component (11) located in the window of the substrate (7), - ~positioning and connection (10) of the electronic component (11) in the window (8) formed for that purpose in the substrate (7).
2. ~Method according to claim 1, characterized in that the adhesive layer (1) is made up of an adhesive film.
3. ~Method according to claim 1, characterized in that the adhesive layer (1) is applied by silk-screening on the conductive layer with protected areas to form the windows.
4. ~Method according to claim 1, characterized in that the adhesive layer is applied by silk-screening onto the substrate, preferably with protected areas to form the windows.
5. ~Method according to claim 1, characterized in that the realization of the electric circuit is carried out by stamping, machining or chemical etching of the conductive layer (4).
6. ~Method according to claim 1, characterized in that the connection (10) of said electronic component (11) is carried out by means such as soldering, cold or hot conductive bonding on the conductive film, or thermo-compression.
7. ~Method according to claim 1, characterized in that the formation of the windows (2), (8) in the adhesive layer (1), the substrate (7) and the segment (6) in the conductive layer (4) is carried out by stamping.
8. ~Method according to one of the claims 1 to 7, characterized in that the conductive layer (4) is deposited so as to extend partially into the window's surface (8) by forming at least two electric contacts (4') on which the electronic component (11) is connected.
9. ~Method according to one of the claims 1 to 7, characterized in that the conductive layer (4) is deposited in such a way as to extend into the surface of the window (8) forming at least one electric contact (4') on which the electronic component (11) is connected, and another electric contact is formed by means of a bridge (12, 15) connecting a more distant connection area on the conductive layer (4).
10. ~Method according to one of the claims 1 to 9, characterized in that the thickness of the substrate (7) is at least equal to the height of the highest electronic component (11).
11. ~Method according to one of the claims 1 to 10, characterized in that a final step consists in assembling a film of insulating material on each face of the assembly, said film serving as protection and/or support allowing a marking to be made.
CA2460840A 2001-09-18 2002-09-17 Thin electronic label and method for making same Expired - Fee Related CA2460840C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1718/01 2001-09-18
CH17182001 2001-09-18
PCT/IB2002/003953 WO2003026010A1 (en) 2001-09-18 2002-09-17 Thin electronic label and method for making same

Publications (2)

Publication Number Publication Date
CA2460840A1 true CA2460840A1 (en) 2003-03-27
CA2460840C CA2460840C (en) 2011-12-20

Family

ID=4566019

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2460840A Expired - Fee Related CA2460840C (en) 2001-09-18 2002-09-17 Thin electronic label and method for making same

Country Status (12)

Country Link
US (1) US7150406B2 (en)
EP (1) EP1428258B1 (en)
JP (1) JP4257679B2 (en)
CN (1) CN100359682C (en)
AU (1) AU2002337402B2 (en)
BR (1) BRPI0212612B1 (en)
CA (1) CA2460840C (en)
ES (1) ES2649545T3 (en)
MX (1) MXPA04002588A (en)
RU (1) RU2300159C2 (en)
WO (1) WO2003026010A1 (en)
ZA (1) ZA200402147B (en)

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JP4109039B2 (en) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ Inlet for electronic tag and manufacturing method thereof
JP4066929B2 (en) * 2003-10-08 2008-03-26 株式会社日立製作所 Electronic device and manufacturing method thereof
EP1724712A1 (en) * 2005-05-11 2006-11-22 Stmicroelectronics Sa Micromodule, specifically for a smart card
FR2885718B1 (en) * 2005-05-11 2007-09-21 Gemplus Sa ADHESIVE FORMAT ADAPTER FOR MEMORY DEVICE AND METHOD OF MANUFACTURE
JP5395660B2 (en) * 2006-06-19 2014-01-22 ナグライデ・エス アー Method of manufacturing a card comprising at least one electronic module, assembly produced during the method, and intermediate product
CN101473338B (en) 2006-06-19 2012-06-06 纳格雷德股份有限公司 Method of fabricating cards each comprising an electronic module and intermediate products
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
ES2393884T3 (en) 2007-02-09 2012-12-28 Nagraid S.A. Procedure for manufacturing electronic cards comprising at least one printed motive
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
GB2453765A (en) * 2007-10-18 2009-04-22 Novalia Ltd Product packaging with printed circuit and means for preventing a short circuit
FI121592B (en) * 2008-03-26 2011-01-31 Tecnomar Oy Process for making PCB laminates, especially RFID antenna laminates and PCB laminates
CN101345330A (en) * 2008-08-25 2009-01-14 合隆科技(杭州)有限公司 Radio frequency antenna and preparation thereof
WO2013175261A1 (en) * 2012-05-21 2013-11-28 Linxens Holding Interconnection substrate and method of manufacturing the same
FR2992141B1 (en) * 2012-06-14 2015-03-20 Microconnections Sas METHOD FOR PRODUCING ELECTRONIC CIRCUIT WITH CONDUCTIVE LAYER PROTECTION
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
WO2015085086A1 (en) 2013-12-04 2015-06-11 Temptime Corporation Condition change labels
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
CN110077135B (en) * 2019-04-23 2020-07-17 捷卡（厦门）工业科技有限公司 Production process of label with window

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Also Published As

Publication number Publication date
MXPA04002588A (en) 2004-06-18
US20040256466A1 (en) 2004-12-23
WO2003026010A1 (en) 2003-03-27
RU2004107999A (en) 2005-05-10
AU2002337402B2 (en) 2007-08-16
RU2300159C2 (en) 2007-05-27
CA2460840C (en) 2011-12-20
ES2649545T3 (en) 2018-01-12
JP4257679B2 (en) 2009-04-22
US7150406B2 (en) 2006-12-19
EP1428258B1 (en) 2017-08-30
ZA200402147B (en) 2005-07-27
CN1555576A (en) 2004-12-15
JP2005503625A (en) 2005-02-03
BR0212612A (en) 2004-08-17
CN100359682C (en) 2008-01-02
BRPI0212612B1 (en) 2016-01-19
EP1428258A1 (en) 2004-06-16

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EEER Examination request
MKLA Lapsed

Effective date: 20190917