CA2463981A1 - Light-emitting or light-receiving semiconductor module, and method for manufacturing the same - Google Patents

Light-emitting or light-receiving semiconductor module, and method for manufacturing the same Download PDF

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Publication number
CA2463981A1
CA2463981A1 CA002463981A CA2463981A CA2463981A1 CA 2463981 A1 CA2463981 A1 CA 2463981A1 CA 002463981 A CA002463981 A CA 002463981A CA 2463981 A CA2463981 A CA 2463981A CA 2463981 A1 CA2463981 A1 CA 2463981A1
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Prior art keywords
light
sheet
emitting
semiconductor
receiving
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CA002463981A
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French (fr)
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CA2463981C (en
Inventor
Josuke Nakata
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SPHELAR POWER Corp
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Individual
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Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/035281—Shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529—Shape of the potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/20—Optical components
    • H02S40/22—Light-reflecting or light-concentrating means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1017—Shape being a sphere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Abstract

A solar module 20 comprises first and second sheets 21 and 22, a plurality of rows (a plurality of groups) of spherical solar cells 11 incorporated in between these sheets 21 and 22 in a state in which the conduction direction is perpendicular to the surface of the sheets, a mechanism for the parallel connection of each group of spherical solar cells 11, a mechanism for the serial connection of each group of spherical solar cells 11 with the spherical solar cells 11 in adjacent groups, a positive electrode terminal 23, and a negative electrode terminal 24. A positive electrode is formed on the bottom and a negative electrode on top in the odd-numbered rows of spherical solar cells 11 from the left end, while a positive electrode is formed on top and a negative electrode on the bottom in the even-numbered rows of spherical solar cells 11.

Claims (22)

1. A light-emitting or light-receiving semiconductor module, comprising:
a pair of sheets including a first. sheet made of a translucent insulating material, a second sheet made of an insulating material and disposed parallel to the first sheet, and a plurality of granular semiconductor cells disposed in a plurality of rows and a plurality of columns in between these sheets, wherein each semiconductor cell comprises a p or n type semiconductor granule, a pn junction formed at the top layer of the semiconductor granule, and a pair of electrodes formed at either end of the semiconductor granule and connected to the ends of the pn junction, and has a light-emitting or light receiving function, each semiconductor cell is disposed in a state such that the conduction direction linking the pair of electrodes is perpendicular to the pair of sheets, a plurality of granular semiconductor cells arc' grouped into a plurality of groups each of which includes a plurality of semiconductor cells having a common conduction direction, and a parallel connection mechanism for the parallel connection of a plurality of semiconductor cells of each group. and a serial connection mechanism for the serial connection of the semiconductor cells of each group with the semiconductor cells of adjacent groups are provided to the opposing inner surfaces of the pair of sheets.
2. The light-emitting or light-receiving semiconductor module:

according to Claim 1, wherein each of said semiconductor cells has a light-receiving function involving opto-electric conversion.
3. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein each of said semiconductor cells has a light-emitting function involving electro-optical conversion.
4. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein said granular semiconductor cells are spherical semiconductor cells.
5. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein said granular semiconductor cells are cylindrical semiconductor cells.
6. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein said second sheet is composed of a translucent sheet.
7. The light-emitting or light-receiving semiconductor module according to Claim 2, wherein said first sheet is composed of a glass sheet, and numerous fine pyramid cuts or bumps are formed on the outer surface of the glass sheet.
8. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein said pair of sheets is composed of flexible sheets made of a synthetic resin.
9. The light-emitting or light-receiving semiconductor module according to Claim 1, wherein an insulating, transparent synthetic resin is packed into the space between tho plurality of semiconductor cells between said pair of sheets.
10. The light-omitting or light-receiving semiconductor module according to Claim 1, wherein said parallel connection mechanism comprises a first conductive film formed on the inner surface of each of the first and second sheets, and said serial connection mechanism comprises a second conductive film formed on the inner surface of each of the first and second sheets.
11. The light-emitting or light-receiving semiconductor module according to Claim 10, wherein the first and second conductive films on the inner surface of said first sheet are composed of a transparent metal oxide conductive film.
12. The light-emitting or light-receiving semiconductor module according to Claim 11, wherein the first and second conductive films on the inner surface of said second sheet are composed of a transparent metal oxide conductive film.
13. The light-emitting or light-receiving semiconductor module according to Claim 11, wherein the first and second conductive films on the inner surface of said second sheet are composed of metal conductive films that function as light reflecting films.
14. The light-emitting or light-receiving semiconductor module according to Claim 10, wherein the first and second conductive films on the inner surface of said first sheet are composed of printed wiring.
15. The light-emitting on light-receiving semiconductor module according to Claim 14, wherein the first and second conductive films on the inner surface of said second sheet are composed of printed wiring.
16. The light-emitting or light-receiving semiconductor module according to Claim 14, wherein the first and second conductive films on the inner surface of said second sheet are composed of metal conductive films that function as light reflecting films.
17. The light-emitting or light-receiving semiconductor module according to Claim 2, wherein said second sheet is constituted by a translucent sheet, and said module is structured so as to be capable of receiving external light incident from the front side and back side of said pair of sheets.
18. The light-emitting or light-receiving semiconductor module according to Claim 17, wherein a specific gap is provided between said semiconductor cells, and said module is structured so that part of the back side of said pair of sheets can be seen through the front side, or part of the front side can be seen through the back side.
19. The light-emitting or light-receiving semiconductor module according to Claim 3, wherein said second sheet is constituted by a translucent sheet, and said module is structured so that light can radiate from the front and back sides of said pair of sheets to the back side.
20. A method for manufacturing a light-emitting or light-receiving semiconductor module, comprising:
a first step of readying a first sheet made of a translucent insulating material and a second sheet made of an insulating material and capable of facing parallel to the first sheet, and a plurality of semiconductor cells having a light-emitting or light-receiving function and comprising a pair of electrodes:
a second step of forming respectively a plurality of conductive films on the inner surface of each of said first and second sheet;
a third step of bonding one of the electrodes of the plurality of semiconductor cells to one portion of each conductive film of said first sheet, and bonding the same electrode of the plurality of semiconductor cells as the one mentioned above to one portion of each conductive film of the second sheet;
and a fourth step of bring the first and second sheets closer together and across from each other, bonding the other electrode of the plurality of semiconductor cells affixed to each conductive film of the first sheet to the corresponding conductive film of the second sheet, and bonding the other electrode of the plurality of semiconductor cells affixed to each conductive film of the second sheet to the corresponding conductive film of the first sheet.
21. A method for manufacturing a light-emitting or light-receiving semiconductor module, comprising:
a first step of readying a first sheet made of a translucent insulating material and a second sheet made of an insulating material and capable of facing parallel to the first sheet, and a plurality of semiconductor cells having a light-emitting or light-receiving function and comprising a pair of electrodes;
a second step of forming respectively a plurality of conductive films on the inner surface of each of said first and second sheets:
a third step of bonding one of the electrodes of the plurality of semiconductor cells to each conductive film of said second sheet and a fourth step of bringing the first and second sheets closer together and across from each other and bonding the other electrode of the plurality of semiconductor cells, which is bonded on the second sheet side, to the corresponding conductive film of the first sheet.
22. The method for manufacturing a light-emitting or light-receiving semiconductor module according to Claim 21, wherein, in said fourth step, the groups of a plurality of semiconductor cells connected in parallel in the fourth step are serially connected to adjacent groups.
CA2463981A 2001-10-19 2001-10-19 Light-emitting or light-receiving semiconductor module, and method for manufacturing the same Expired - Fee Related CA2463981C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/009234 WO2003036731A1 (en) 2001-10-19 2001-10-19 Light emitting or light receiving semiconductor module and method for manufacturing the same

Publications (2)

Publication Number Publication Date
CA2463981A1 true CA2463981A1 (en) 2003-05-01
CA2463981C CA2463981C (en) 2011-11-29

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US (1) US7602035B2 (en)
EP (1) EP1445804A4 (en)
JP (1) JP3904559B2 (en)
KR (1) KR100619614B1 (en)
CN (1) CN1220277C (en)
AU (1) AU2001295987B2 (en)
CA (1) CA2463981C (en)
TW (1) TW512542B (en)
WO (1) WO2003036731A1 (en)

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