CA2519632A1 - Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light - Google Patents
Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light Download PDFInfo
- Publication number
- CA2519632A1 CA2519632A1 CA002519632A CA2519632A CA2519632A1 CA 2519632 A1 CA2519632 A1 CA 2519632A1 CA 002519632 A CA002519632 A CA 002519632A CA 2519632 A CA2519632 A CA 2519632A CA 2519632 A1 CA2519632 A1 CA 2519632A1
- Authority
- CA
- Canada
- Prior art keywords
- light
- detection system
- interaction region
- embedded material
- spectrometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003993 interaction Effects 0.000 title claims abstract 29
- 238000000034 method Methods 0.000 title claims 5
- 238000001514 detection method Methods 0.000 claims abstract 36
- 239000000463 material Substances 0.000 claims abstract 19
- 238000001228 spectrum Methods 0.000 claims abstract 12
- 239000013307 optical fiber Substances 0.000 claims abstract 10
- 230000003287 optical effect Effects 0.000 claims abstract 6
- 238000004458 analytical method Methods 0.000 claims abstract 3
- 238000002834 transmittance Methods 0.000 claims abstract 2
- 230000003595 spectral effect Effects 0.000 claims 4
- 230000007935 neutral effect Effects 0.000 claims 2
- 238000004611 spectroscopical analysis Methods 0.000 claims 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0218—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0291—Housings; Spectrometer accessories; Spatial arrangement of elements, e.g. folded path arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
Abstract
A detection system (600) is used during irradiation of an interaction region of a structure including embedded material with laser light. The detection system (600) includes a collimating lens (610) positioned to receive light emitted from the interaction region. The detection system (600) further includes an optical fiber (620) optically coupled to the collimating lens (610) and a spectrometer (630) optically coupled to the optical fiber (620).
The spectrometer (630) is adapted for analysis of the light for indications of the embedded material within the interaction region. The spectrometer (630) includes an input slit (631) adapted to receive light from the optical fiber (620). The input slit (631) has a width selected to provide sufficient light transmittance and sufficient resolution. The spectrometer (630) further includes an optical grating (632) adapted to receive light from the input slit (631) and to separate the light into a spectrum of wavelengths. The spectrometer (630) further includes a collection lens (633) adapted to receive a selected range of wavelengths of the separated light from the optical grating (632). The spectrometer (630) further includes a light sensor (634) adapted to receive the selected range of wavelengths and to generate a signal corresponding to an intensity of the received light.
The spectrometer (630) is adapted for analysis of the light for indications of the embedded material within the interaction region. The spectrometer (630) includes an input slit (631) adapted to receive light from the optical fiber (620). The input slit (631) has a width selected to provide sufficient light transmittance and sufficient resolution. The spectrometer (630) further includes an optical grating (632) adapted to receive light from the input slit (631) and to separate the light into a spectrum of wavelengths. The spectrometer (630) further includes a collection lens (633) adapted to receive a selected range of wavelengths of the separated light from the optical grating (632). The spectrometer (630) further includes a light sensor (634) adapted to receive the selected range of wavelengths and to generate a signal corresponding to an intensity of the received light.
Claims (28)
1. A detection system for use during irradiation of an interaction region of a structure with laser light, the structure comprising embedded material, the detection system comprising:
a collimating lens positioned to receive light emitted from the interaction region;
an optical fiber optically coupled to the collimating lens to receive light from the collimating lens; and a spectrometer optically coupled to the optical fiber to receive light from the optical fiber, the spectrometer adapted for analysis of the light for indications of the embedded material within the interaction region, the spectrometer comprising:
an input slit adapted to receive light from the optical fiber, the input slit having a width selected to provide sufficient light transmittance and sufficient resolution;
an optical grating adapted to receive light from the input slit and to separate the light into a spectrum of wavelengths;
a collection lens adapted to receive a selected range of wavelengths of the separated light from the optical grating; and a light sensor adapted to receive the selected range of wavelengths and to generate a signal corresponding to an intensity of the received light.
a collimating lens positioned to receive light emitted from the interaction region;
an optical fiber optically coupled to the collimating lens to receive light from the collimating lens; and a spectrometer optically coupled to the optical fiber to receive light from the optical fiber, the spectrometer adapted for analysis of the light for indications of the embedded material within the interaction region, the spectrometer comprising:
an input slit adapted to receive light from the optical fiber, the input slit having a width selected to provide sufficient light transmittance and sufficient resolution;
an optical grating adapted to receive light from the input slit and to separate the light into a spectrum of wavelengths;
a collection lens adapted to receive a selected range of wavelengths of the separated light from the optical grating; and a light sensor adapted to receive the selected range of wavelengths and to generate a signal corresponding to an intensity of the received light.
2. The detection system of Claim 1, wherein the structure comprises concrete and the embedded material comprises rebar.
3. The detection system of Claim 1, wherein the width of the input slit is in a range between approximately 5 microns and approximately 200 microns.
4. The detection system of Claim 1, wherein the height of the input slit is approximately 1 millimeter.
5. The detection system of Claim 1, wherein the light sensor comprises a coupled-capacitance discharge camera system.
6. The detection system of Claim 1, further comprising at least one neutral density filter adapted to reduce the light received by the spectrometer.
7. The detection system of Claim 1, wherein the focusing lens is coaxial with the laser light impinging on the interaction region.
8. The detection system of Claim 1, wherein the focusing lens is off-axis with the laser light impinging on the interaction region.
9. The detection system of Claim 1, wherein the structure comprises concrete and the embedded material comprises rebar, and the detection system is adapted to analyze light in a spectral region having an upper cutoff wavelength of approximately 582 nanometers and a lower cutoff wavelength of approximately 600 nanometers.
10. The detection system of Claim 9, wherein the detection system is further adapted to analyze the spectral region by calculating a spectral ratio.
11. The detection system of Claim 10, wherein the spectral ratio being greater than or equal to one corresponds to rebar within the interaction region.
12. The detection system of Claim 1, wherein the detection system further comprises a computer system adapted to analyze spectroscopic data.
13. The detection system of Claim 12, wherein the computer system comprises a microprocessor, a memory subsystem, and a display.
14. The detection system of Claim 13, wherein the microprocessor and the memory subsystem are mounted in an enclosure.
15. A detection system for use during irradiation of an interaction region of a structure with laser light, the structure comprising embedded material, the detection system comprising:
means for collecting light emitted from the interaction region;
means for separating the collected light into a spectrum of wavelengths; and means for analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
means for collecting light emitted from the interaction region;
means for separating the collected light into a spectrum of wavelengths; and means for analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
16. A method of detecting embedded material within a laser-irradiated interaction region of a structure comprising the embedded material, the method comprising:
collecting light from the interaction region;
separating the collected light into a spectrum of wavelengths; and analyzing at least a portion of the spectrum for indications of the embedded material within the interaction region.
collecting light from the interaction region;
separating the collected light into a spectrum of wavelengths; and analyzing at least a portion of the spectrum for indications of the embedded material within the interaction region.
17. ~A detection system for use during irradiation of an interaction region of a structure with laser light, the structure comprising embedded material, the detection system comprising:
a focusing lens positioned to receive light emitted from the interaction region;
an optical fiber optically coupled to the focusing lens to receive light from the focusing lens; and a spectrometer optically coupled to the optical fiber to receive light from the optical fiber, the spectrometer adapted for analysis of the light for indications of the embedded material within the interaction region.
a focusing lens positioned to receive light emitted from the interaction region;
an optical fiber optically coupled to the focusing lens to receive light from the focusing lens; and a spectrometer optically coupled to the optical fiber to receive light from the optical fiber, the spectrometer adapted for analysis of the light for indications of the embedded material within the interaction region.
18. ~The detection system of Claim 17, wherein the structure comprises concrete and the embedded material comprises rebar.
19. ~The detection system of Claim 17, wherein the spectrometer comprises:
an optical grating adapted to separate the light into a spectrum of wavelengths; and a light sensor optically coupled to the optical grating, the light sensor adapted to receive light in at least a portion of the spectrum and to generate a signal corresponding to an intensity of the received light.
an optical grating adapted to separate the light into a spectrum of wavelengths; and a light sensor optically coupled to the optical grating, the light sensor adapted to receive light in at least a portion of the spectrum and to generate a signal corresponding to an intensity of the received light.
20. ~The detection system of Claim 19, wherein the light sensor comprises a coupled-capacitance discharge camera system.
21. ~The detection system of Claim 17, further comprising at least one neutral density filter adapted to reduce the light received by the spectrometer.
22. ~The detection system of Claim 17, wherein the focusing lens is coaxial with the laser light impinging on the interaction region.
23. ~The detection system of Claim 17, wherein the focusing lens is off-axis with the laser light impinging on the interaction region.
24. ~The detection system of Claim 17, wherein the structure comprises concrete and the embedded material comprises rebar, and the spectrometer is adapted to analyze light having wavelengths of approximately 592 nanometers for indications of rebar within the interaction region.
25. ~The detection system of Claim 24, wherein the spectrometer is further adapted to analyze light having wavelengths of approximately 588.5 nanometers and approximately 593 nanometers by calculating a ratio of twice the intensity of light at 592 nanometers divided by the sum of the intensities at 588.5 nanometers and at nanometers.
26. The detection system of Claim 25, wherein the ratio being greater than or equal to one corresponds to rebar within the interaction region.
27. A detection system for use during irradiation of an interaction region of a structure with laser light, the structure comprising embedded material, the detection system comprising:
means for focusing light emitted from the interaction region;
means for separating the focussed light into a spectrum of wavelengths; and means for analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
means for focusing light emitted from the interaction region;
means for separating the focussed light into a spectrum of wavelengths; and means for analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
28. A method of detecting rebar within a laser-irradiated interaction region of a structure comprising embedded material, the method comprising:
focussing light from the interaction region;
separating the light into a spectrum of wavelengths; and analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
focussing light from the interaction region;
separating the light into a spectrum of wavelengths; and analyzing at least a portion of the spectrum for indications of embedded material within the interaction region.
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45604303P | 2003-03-18 | 2003-03-18 | |
US60/456,043 | 2003-03-18 | ||
US47105703P | 2003-05-16 | 2003-05-16 | |
US60/471,057 | 2003-05-16 | ||
US49646003P | 2003-08-20 | 2003-08-20 | |
US60/496,460 | 2003-08-20 | ||
US10/691,444 | 2003-10-22 | ||
US10/691,444 US7286223B2 (en) | 2003-03-18 | 2003-10-22 | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
PCT/US2004/008219 WO2004083794A2 (en) | 2003-03-18 | 2004-03-18 | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2519632A1 true CA2519632A1 (en) | 2004-09-30 |
CA2519632C CA2519632C (en) | 2012-07-10 |
Family
ID=32996385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2519632A Expired - Fee Related CA2519632C (en) | 2003-03-18 | 2004-03-18 | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
Country Status (7)
Country | Link |
---|---|
US (7) | US7286223B2 (en) |
EP (1) | EP1610921A2 (en) |
JP (1) | JP4454625B2 (en) |
KR (1) | KR101081537B1 (en) |
AU (1) | AU2004221407B2 (en) |
CA (1) | CA2519632C (en) |
WO (1) | WO2004083794A2 (en) |
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2004
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- 2004-03-18 JP JP2006507295A patent/JP4454625B2/en not_active Expired - Fee Related
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- 2004-03-18 WO PCT/US2004/008219 patent/WO2004083794A2/en active Application Filing
- 2004-03-18 CA CA2519632A patent/CA2519632C/en not_active Expired - Fee Related
-
2005
- 2005-09-20 KR KR1020057017638A patent/KR101081537B1/en not_active IP Right Cessation
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2007
- 2007-09-25 US US11/861,193 patent/US7880877B2/en not_active Expired - Fee Related
- 2007-09-25 US US11/861,184 patent/US7492453B2/en not_active Expired - Fee Related
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- 2009-01-12 US US12/352,123 patent/US7864315B2/en not_active Expired - Fee Related
-
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- 2010-11-30 US US12/957,197 patent/US8228501B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
US20110102789A1 (en) | 2011-05-05 |
US20040182999A1 (en) | 2004-09-23 |
US7864315B2 (en) | 2011-01-04 |
WO2004083794A2 (en) | 2004-09-30 |
US8094303B2 (en) | 2012-01-10 |
CA2519632C (en) | 2012-07-10 |
EP1610921A2 (en) | 2006-01-04 |
US20110266262A1 (en) | 2011-11-03 |
US7880877B2 (en) | 2011-02-01 |
US20080067331A1 (en) | 2008-03-20 |
US7289206B2 (en) | 2007-10-30 |
KR101081537B1 (en) | 2011-11-08 |
AU2004221407B2 (en) | 2009-06-11 |
US20090284739A1 (en) | 2009-11-19 |
US20040182998A1 (en) | 2004-09-23 |
JP4454625B2 (en) | 2010-04-21 |
US7286223B2 (en) | 2007-10-23 |
AU2004221407A1 (en) | 2004-09-30 |
KR20060015481A (en) | 2006-02-17 |
US8228501B2 (en) | 2012-07-24 |
WO2004083794A3 (en) | 2005-03-03 |
US20090021731A1 (en) | 2009-01-22 |
US7492453B2 (en) | 2009-02-17 |
JP2006526145A (en) | 2006-11-16 |
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