CA2567104A1 - Crosstalk compensation with balancing capacitance system and method - Google Patents

Crosstalk compensation with balancing capacitance system and method Download PDF

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Publication number
CA2567104A1
CA2567104A1 CA002567104A CA2567104A CA2567104A1 CA 2567104 A1 CA2567104 A1 CA 2567104A1 CA 002567104 A CA002567104 A CA 002567104A CA 2567104 A CA2567104 A CA 2567104A CA 2567104 A1 CA2567104 A1 CA 2567104A1
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CA
Canada
Prior art keywords
idc
capacitance
tip
ring
connector
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Granted
Application number
CA002567104A
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French (fr)
Other versions
CA2567104C (en
Inventor
Jeffrey P. Seefried
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Leviton Manufacturing Co Inc
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Leviton Manufacturing Co., Inc.
Jeffrey P. Seefried
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Publication of CA2567104A1 publication Critical patent/CA2567104A1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
    • H01R4/2425—Flat plates, e.g. multi-layered flat plates
    • H01R4/2429—Flat plates, e.g. multi-layered flat plates mounted in an insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Abstract

A insulation displacement connector (IDC) patch panel includes a circuit (PC) board with interdigitated capacitance for balancing out inherent capacitance found within IDCs of the panel and conventional plug connectors coupled to the panel. Unwanted cross-talk signals are reduced as a consequence.

Claims (24)

1. A system for at least one plug connector, the plug connector having a plurality of plug connector elements being grouped into pairs, each pair of the plurality of plug connector elements having a tip plug connector element and a ring plug connector element configured to be coupled to a different wire pair, the plug connector having a first capacitance between a tip plug connector element of a first pair of the plurality of plug connector elements and a ring plug connector element of a second pair of the plurality of plug connector elements, the plug connector having a second capacitance between a ring plug connector element of the first pair of the plurality of plug connector elements and a tip plug connector element of the second pair of the plurality of plug connector elements, the first capacitance being greater than the second capacitance, the system comprising:
a jack connector being shaped to receive the plug connector, the jack connector having a plurality of jack contact members and configured to receive the plug connector such that each of the plurality of jack contact members is electrically coupled to a different one of the plurality of plug connector elements, the plurality of jack contact members including a first tip jack contact member and a first ring jack contact member positioned to electrically couple with the tip plug connector element and the ring plug connector element, respectively, of the first pair of the plurality of plug connector elements when the jack connector receives the plug connector, and a second tip jack contact member and a second ring jack contact member positioned to electrically couple with the tip plug connector element and the ring plug connector element, respectively, of the second pair of plug connector elements when the jack connector receives the plug connector;
an insulation displacement connector (IDC) configured to receive a plurality of wires and having a plurality of IDC elements, each of the plurality of IDC
elements configured to be coupled to a different one of the plurality of wires;
a circuit board having a plurality of jack pads, a plurality of IDC pads, and a plurality of internal conductors, each of the plurality of jack pads being electrically coupled in a different one of the plurality of jack contact members so that a first tip jack pad, a first ring] jack pad, a second tip jack pad, and a second ring jack pad are electrically coupled to the first tip jack contact member, the first ring jack contact member, the second tip jack contact member, and the second ring jack contact member, respectively, each of the plurality of IDC pads being electrically coupled to a different one of the plurality of IDC elements, each of the plurality of internal conductors being electrically coupled to a different one of the plurality of jack pads and a different one of the plurality of IDC pads; and a third capacitance electrically coupled between the first ring jack pad and the second tip jack pad, the third capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance to reduce cross-talk between the first and second pairs of the plurality of plug connector elements.
2. The system of claim 1 wherein the jack connector is configured to engaged with the plug connector as an RJ45 jack connector.
3. The system of claim 1 wherein the plurality of internal conductors are a plurality of wire traces.
4. The system of claim 3 wherein the third capacitance results from at least one interdigitated portion of one of the plurality of wire traces.
5. The system of claim 1 wherein the plurality of IDC elements are grouped into pairs, each pair of the plurality of IDC elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the plurality of IDC pads of the circuit board including a first tip IDC pad electrically coupled to the first tip jack pad, a first ring IDC pad electrically coupled to the first ring jack pad, a second tip IDC pad electrically coupled to the second tip jack pad, and a second ring IDC pad electrically coupled to the second ring jack pad by ones of the plurality of internal conductors, wherein the IDC has a fourth capacitance electrically coupled between a first tip IDC element of a first pair of the plurality of IDC elements and a second ring IDC
element of a second pair of the plurality of IDC elements, the first tip IDC
element being electrically coupled to the first tip IDC pad, and the second ring IDC element being electrically coupled to the second ring IDC pad, a fifth capacitance electrically coupled between a first ring IDC element or the first pair of the plurality of IDC
elements and a second tip IDC element of the second pair of the plurality of IDC elements, the first ring IDC element being electrically coupled to the first ring IDC pad, and the second tip IDC
element being electrically coupled to the second tip IDC pad, the fourth capacitance being greater than the fifth capacitance, and wherein the third capacitance is further sized, at least in part, with respect to the difference in values between the fourth capacitance and the fifth capacitance.
6. The system of claim 5, comprising a sixth capacitance electrically coupled between the first tip jack pad and the second tip jack pad, and a seventh capacitance electrically coupled between the first ring jack pad and the second ring jack pad, the sixth capacitance and the seventh capacitance being sized in values with respect to the values of the first capacitance, second capacitance, third capacitance, fourth capacitance, and fifth capacitance.
7. The system of claim 6 wherein the sixth capacitance and the seventh capacitance are sized in values so that the sum of the values of the sixth capacitance and the seventh capacitance approximates the sum of the values of the first capacitance, the second capacitance, the third capacitance, the fourth capacitance and the fifth capacitance.
8. The system of claim 6 wherein the sixth capacitance includes a plurality of adjacently arranged interdigitated wire trace capacitors, and the seventh capacitance includes a plurality of adjacently arranged interdigitated wire trace capacitors.
9. The system of claim 5 wherein the third capacitance is further sized to approximate to a sum of the difference in values between the first capacitance and the second capacitance, plus the difference in values between the fourth capacitance and the fifth capacitance.
10. A system for at least one plug connector, the plug connector having a plurality of plug connector elements being grouped into pairs, each pair of the plurality of plug connector elements having a tip plug connector element and a ring plug connector element configured to be coupled to a different wire pair, the system comprising:
a jack connector being shaped to receive the plug connector, the jack connector having a plurality of jack contact members and configured to receive the plug connector such that each of the plurality of jack contact members is electrically coupled to a different one of the plurality of plug connector elements;
an insulation displacement connector (IDC) configured to receive a plurality of wires and having a plurality of IDC elements, each of the plurality of IDC
elements configured to be coupled to a different one of the plurality of wires, the plurality of IDC elements being grouped into pairs, each pair of the plurality of IDC
elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the IDC having a first capacitance between a first tip IDC element of a first pair of the plurality of IDC elements and a second ring IDC element of a second pair of the plurality of IDC elements, the IDC having a second capacitance between a first ring IDC element of the first pair of the plurality of IDC
elements and a second tip IDC element of the second pair of the plurality of IDC elements, the first capacitance being greater than the second capacitance;
a circuit board having a plurality of jack pads, a plurality of IDC pads, and a plurality of internal conductors, each of the plurality of jack pads being electrically coupled to a different one of the plurality of jack contact members, each of the plurality of IDC pads being electrically coupled to a different one of the plurality of IDC elements so that a first tip IDC pad, a first ring IDC pad, a second tip IDC pad, and a second ring IDC pad are electrically coupled to the first tip IDC element, the first ring IDC element, the second tip IDC element, and the second ring IDC element, respectively, each of the plurality of internal conductors being electrically coupled to a different one of the plurality of jack pads and a different one of the plurality of IDC pads; and a third capacitance electrically coupled between the first ring IDC pad and the second tip IDC pad, the capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance to reduce cross-talk between the first and second pairs of the plurality of IDC
elements.
11. A system for at least one first connector, the first connector having a plurality of first connector elements being grouped into pairs, each pair of the plurality of first connector elements having a tip first connector element and a ring first connector element configured to be coupled to a different wire pair, the first connector having a first capacitance between a tip first connector element of a first pair of the plurality of first connector elements and a ring first connector element of a second pair of the plurality of first connector elements, the first connector having a second capacitance between a ring first connector element of the first pair of the plurality of first connector elements and a tip first connector element of the second pair of the plurality of first connector elements, the first capacitance being greater than the second capacitance, the system comprising:
a second connector being shaped to receive the first connector, the second connector having a plurality of second contact members and configured to receive the first connector such that each of the plurality of second contact members is electrically coupled to a different one of the plurality of first connector elements, the plurality of second contact members including a first tip second contact member and a first ring second contact member positioned to electrically couple with the tip first connector element and the ring first connector element, respectively, of the first pair of the plurality of first connector elements when the second connector receives the first connector, and a second tip second contact member and a second ring second contact member positioned to electrically couple with the tip first connector element and the ring first connector element, respectively, of the second pair of first connector elements when the second connector receives the first connector;
an insulation displacement connector (IDC) configured to receive a plurality of wires and having a plurality of IDC elements, each of the plurality of IDC
elements configured to be coupled to a different one of the plurality of wires;
a circuit board having a plurality of second connector pads, a plurality of IDC pads, and a plurality of internal conductors, each of the plurality of second connector pads being electrically coupled to a different one of the plurality of second contact members so that a first tip second connector pad, a first ring second connector pad, a second tip second connector pad, and a second ring second connector pad are electrically coupled to the first tip second contact member, the first ring second contact member, the second tip second contact member, and the second ring second contact member, respectively, each of the plurality of IDC pads being electrically coupled to a different one of the plurality of IDC elements, each of the plurality of internal conductors being electrically coupled to a different one of the plurality of second connector pads and a different one of the plurality of IDC pads; and a third capacitance electrically coupled between the first ring second pad and the second tip second pad, the third capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance.
12. The system of claim 11 wherein the plurality of IDC elements are grouped into pairs, each pair of the plurality of IDC elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the plurality of IDC pads of the circuit board including a first tip IDC pad electrically coupled to the first tip second pad, a first ring IDC pad electrically coupled to the first ring second pad, a second tip IDC pad electrically coupled to the second tip second pad, and a second ring IDC pad electrically coupled to the second ring second pad by ones of the plurality of internal conductors, wherein the IDC has a fourth capacitance electrically coupled between a first tip IDC element of a first pair of the plurality of IDC
elements and a second ring IDC element of a second pair of the plurality of IDC elements, the first tip IDC element being electrically coupled to the first tip IDC pad, and the second ring IDC
element being electrically coupled to the second ring IDC pad, a fifth capacitance electrically coupled between a first ring IDC element of the first pair of the plurality of IDC elements and a second tip IDC element of the second pair of the plurality of IDC
elements, the first ring IDC element being electrically coupled to the first ring IDC pad, and the second tip IDC element being electrically coupled to the second tip IDC pad, the fourth capacitance being greater than the fifth capacitance, and wherein the third capacitance is further sized at least in part, with respect to the difference in values between the fourth capacitance and the fifth capacitance.
13. A system for at least one first connector, the first connector having a plurality of first connector elements being grouped into pairs, each pair of the plurality of first connector elements having a tip first connector element and a ring first connector element configured to be coupled to a different wire pair, the system comprising:
a second connector being shaped to receive the first connector, the second connector having a plurality of second contact members and configured to receive the first connector such that each of the plurality of second contact members is electrically coupled to a different one of the plurality of first connector elements;
an insulation displacement connector (IDC) configured to receive a plurality of wires and having a plurality of IDC elements, each of the plurality of IDC
elements configured to be coupled to a different one of the plurality of wires, the plurality of IDC elements being grouped into pairs, each pair of the plurality of IDC
elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the IDC having a first capacitance between a first tip IDC element of a first pair of the plurality of IDC elements and a second ring IDC element of a second pair of the plurality of IDC elements, the IDC having a second capacitance between a first ring IDC element of the first pair of the plurality of IDC
elements and a second tip IDC element of the second pair of the plurality of IDC elements, the first capacitance being greater than the second capacitance;
a circuit board having a plurality of second connector pads, a plurality of IDC pads, and a plurality of internal conductors, each of the plurality of second connector pads being electrically coupled to a different one of the plurality of second contact members, each of the plurality of IDC pads being electrically coupled to a different one of the plurality of IDC elements so that a first tip IDC pad, a first ring IDC
pad, a second tip IDC pad and a second ring IDC pad are electrically coupled to the first tip IDC element, the first ring IDC element, the second tip IDC element, and the second ring IDC element, respectively, each of the plurality of internal conductors being electrically coupled to a different one of the plurality of second connector pads and a different one of the plurality of IDC pads; and a third capacitance electrically coupled between the first ring IDC pad and electrically coupled to the second tip IDC pad, the capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance.
14. A system for at least one plug connector, the plug connector having a plurality of plug connector elements being grouped into pairs, each pair of the plurality of plug connector elements having a tip plug connector element and a ring plug connector element configured to be coupled to a different wire pair, the plug connector having a first capacitance between a tip plug connector element of a first pair of the plurality or plug connector elements and a ring plug connector element of a second pair of the plurality of plug connector elements, the plug connector having a second capacitance between a ring plug connector element of the first pair of the plurality of plug connector elements and a tip plug connector element of the second pair of the plurality of plug connector elements, the first capacitance being greater than the second capacitance, the system comprising:
a jack connector being shaped to receive the plug connector, the jack connector having a plurality of jack contact members and configured to receive the plug connector such that each of the plurality of jack contact members is electrically coupled to a different one of the plurality of plug connector elements, the plurality of jack contact members including a first tip jack contact member and a first ring jack contact member being positioned to electrically couple with the tip plug connector element and the ring plug connector element, respectively, of the first pair of the plurality of plug connector elements when the jack connector receives the plug connector, and a second tip jack contact member and a second ring jack contact member being positioned to electrically couple with the tip plug connector element and the ring plug connector element, respectively, of the second pair of plug connector elements when the jack connector receives the plug connector; and a third capacitance electrically coupled between the first ring jack contact member and the second tip jack contact member, the third capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance.
15. The system of claim 14, comprising:
a plurality of insulation displacement connector (IDC) elements being grouped into pairs, each pair of the plurality of IDC elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the plurality of IDC elements including a first tip IDC element being electrically coupled to the first tip jack contact member, a first ring IDC element being electrically coupled to the first ring jack contact member, a second tip IDC element being electrically coupled to the second tip jack contact member and a second ring IDC element being electrically coupled to the second ring jack contact member;

a fourth capacitance electrically coupled between the first tip IDC element and the second ring IDC element; and a fifth capacitance electrically coupled between the first ring IDC element and the second tip IDC element, the fourth capacitance being greater than the fifth capacitance, and wherein the third capacitance is further sized at least in part, with respect to the difference in values between the fourth capacitance and the fifth capacitance.
16. The system of claim 15, comprising a sixth capacitance electrically coupled between the first tip jack contact member and the second tip jack contact member, and a seventh capacitance electrically coupled between the first ring jack contact member and the second ring jack contact member, the sixth capacitance and the seventh capacitance being sized in values with respect to the values of the first capacitance, second capacitance, third capacitance, fourth capacitance, and fifth capacitance.
17. The system of claim 16 wherein the sixth capacitance and the seventh capacitance are sized in values so that the sum of the values of the sixth capacitance and the seventh capacitance approximates the sum of the values of the first capacitance, the second capacitance, the third capacitance, the fourth capacitance and the fifth capacitance.
18. The system of claim 16 wherein the sixth capacitance includes a plurality of adjacently arranged interdigitated wire trace capacitors, and the seventh capacitance includes a plurality of adjacently arranged interdigitated wire trace capacitors.
19. The system of claim 15 herein the third capacitance is further sized to approximate a sum of the difference in values between the first capacitance and the second capacitance, plus the difference in values between the fourth capacitance and the fifth capacitance.
20. A system comprising:
an insulation displacement connector (IDC) configured to receive a plurality of wires and having a plurality of IDC elements, each of the plurality of IDC
elements configured to be coupled to a different one of the plurality of wires, the plurality of IDC elements being grouped into pairs, each pair of the plurality of IDC
elements having a tip IDC element and a ring IDC element configured to be coupled to a different wire pair, the IDC having a first capacitance between a first tip IDC element of a first pair of the plurality of IDC elements and a second ring IDC element of a second pair of the plurality of IDC elements, the IDC having a second capacitance between a first ring IDC element of the first pair of the plurality of IDC
elements and a second tip IDC element of the second pair of the plurality of IDC elements, the first capacitance being greater than the second capacitance; and a third capacitance electrically coupled between the first ring IDC element and the second tip IDC element, the third capacitance sized, at least in part, with respect to the difference in values between the first capacitance and the second capacitance.
21. A method for compensating crosstalk in a connector plug having a first pair of pins and a second pair of pins, the crosstalk resulting from a first capacitance electrically coupled between a first pair of pins and a second capacitance electrically coupled between a second pair of pins, the second capacitance being smaller in value than the first capacitance, the method comprising:
electrically coupling a third capacitance between the second pair of pins when a jack receives the plug.
22. The method of claim 21 wherein the third capacitance is sized to approximate the difference in value between the first capacitance and the second capacitance.
23. A method for compensating crosstalk in an insulation displacement connector having a first pair of pins and a second pair of pins, the crosstalk resulting from a first capacitance electrically coupled between a first pair of pins and a second capacitance electrically coupled between a second pair of pins, the second capacitance being smaller in value than the first capacitance, the method comprising:
electrically coupling a third capacitance between the second pair of pins.
24. The method of claim 23 wherein the third capacitance is sized to approximate the difference in value between the first capacitance and the second capacitance.
CA2567104A 2004-05-17 2005-05-03 Crosstalk compensation with balancing capacitance system and method Active CA2567104C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/847,216 2004-05-17
US10/847,216 US7038554B2 (en) 2004-05-17 2004-05-17 Crosstalk compensation with balancing capacitance system and method
PCT/US2005/015283 WO2005117200A1 (en) 2004-05-17 2005-05-03 Crosstalk compensation with balancing capacitance system and method

Publications (2)

Publication Number Publication Date
CA2567104A1 true CA2567104A1 (en) 2005-12-08
CA2567104C CA2567104C (en) 2012-12-11

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US (1) US7038554B2 (en)
EP (1) EP1756906A4 (en)
KR (1) KR20070012740A (en)
CN (1) CN1957499A (en)
AU (1) AU2005330572B2 (en)
BR (1) BRPI0511093A (en)
CA (1) CA2567104C (en)
MX (1) MXPA06013438A (en)
TW (1) TWI375375B (en)
WO (1) WO2005117200A1 (en)

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US20050253662A1 (en) 2005-11-17
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EP1756906A1 (en) 2007-02-28
US7038554B2 (en) 2006-05-02
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AU2005330572A8 (en) 2008-08-14
AU2005330572B2 (en) 2010-02-18
CN1957499A (en) 2007-05-02
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AU2005330572A1 (en) 2006-12-07
KR20070012740A (en) 2007-01-26

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