CA2589570A1 - High power led electro-optic assembly - Google Patents

High power led electro-optic assembly Download PDF

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Publication number
CA2589570A1
CA2589570A1 CA002589570A CA2589570A CA2589570A1 CA 2589570 A1 CA2589570 A1 CA 2589570A1 CA 002589570 A CA002589570 A CA 002589570A CA 2589570 A CA2589570 A CA 2589570A CA 2589570 A1 CA2589570 A1 CA 2589570A1
Authority
CA
Canada
Prior art keywords
assembly
reflector
led
conductive
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002589570A
Other languages
French (fr)
Other versions
CA2589570C (en
Inventor
Ronald E. Belek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corporation
Ronald E. Belek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corporation, Ronald E. Belek filed Critical Henkel Corporation
Publication of CA2589570A1 publication Critical patent/CA2589570A1/en
Application granted granted Critical
Publication of CA2589570C publication Critical patent/CA2589570C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5344—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61—Joining from or joining on the inside
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/041—Ball lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

The present invention provides a high power LED electro-optic assembly (40) including conductive heat sink (18) and an LED (14) mounted at one end of the heat sink. The LED (14) is in electrical engagement with the heat sink (18). The assembly (40) also includes a reflector (2) mounted at the other end of the heat sink. An insulating bond material (19) is provided between the reflector and the sink. The assembly (40) further includes a conductive bonding pin (15) extending through the reflector (12) and is in conductive engagement therewith and an electrical engagement (16) which electrically engages the pin (15) to the LED (14). Finally, an electric sleeve assembly (30) where the sleeve (32) is coated with an electrical insulating coating (34) is applied to the LED electro-optic assembly.

Claims (30)

1. A LED electro-optic assembly comprising:
at least one LED;

a conductive heat sink having mounted at one end thereof, said LED in electrical engagement therewith;

a conductive reflector mounted to said one end of said heat sink and surrounding said LED;

an insulative member electrically isolating said conductive reflector from said heat sink;

a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin with said LED;

wherein said heat sink and said reflector form an electrically conductive location for supplying power to said LED.
2. The assembly of claim 1 wherein said heat sink includes a planar surface at said one end and wherein said LED is mounted to said surface.
3. The assembly of claim 2 wherein said reflector is an elliptical reflector having a central opening therethrough and wherein said LED is mounted in said central opening.
4. The assembly of claim 3 wherein said insulative member includes a bonding agent for securing said conductive reflector to said heat sink.
5. The assembly of claim 1 wherein said heat sink is a heat pipe.
6. The assembly of claim 1 wherein said bonding pin is gold plated.
7. The assembly of claim 1 wherein said wire bond is a wire jumper interconnecting said bonding pin to said LED.
8. The assembly of claim 1 further including:

an optic lens member positioned adjacent to said optical reflector, said optic lens member being spaced from said LED for focusing light rays emanating from said LED.
9. The assembly of claim 7 wherein said optic lens member is supported at least partially within said optic reflector.
10. The assembly of claim 7 wherein said optic lens member is a ball optic for production of enhanced light power density.
11. The assembly of claim 7 wherein said optic lens member is a half ball optic for production of collimate light.
12. The assembly of claim 7 further including a conductive retaining sleeve supporting said heat sink, said reflector and said optic lens member.
13. The assembly of claim 12 wherein said conductive sleeve is placed in electrical continuity with said conductive reflector.
14. The assembly of claim 13 wherein said conductive sleeve is insulatively separated from said heat pipe.
15. The assembly of claim 13 wherein said conductive sleeve is insulatively separated from said heat pipe by an insulative adhesive which secures said sleeve to said heat pipe.
16. The assembly of claim 13 wherein said conductive sleeve is insulatively coated.
17. The assembly of claim 15 wherein said sleeve includes at least one passage therethrough adjacent said conductive reflector.
18. The assembly of claim 17 wherein said passage is filled with a conductive adhesive to establish conductive engagement between said sleeve and said reflector.
19. The assembly of claim 17 which said passage is electrically engaged with said sleeve and said reflector.
20. A method of forming a LED electro-optic assembly comprising the steps of:
conductively attaching at least one LED to a conductive heat sink;

surrounding said LED with a conductive reflector, said reflector including a bonding pin extending through; and electrically engaging said bonding pin to said LED.
21. A LED electro-optic retaining assembly comprising:
a generally cylindrical sleeve having an upper portion and a lower portion, said sleeve coated with an electrical insulator;
at least one passage located at an upper portion for insertion of a bonding agent, wherein said upper portion is modified to retain said electro-optic.
22. A LED electro-optic electrical sleeve assembly comprising:
a generally cylindrical sleeve coated with an electrical insulator, having an upper portion and a lower portion, said upper and lower portion separated by an insulative member;
at least one LED and a conductive reflector having mounted at said upper portion, wherein said reflector surrounds said LED;
a conductive heat sink having mounted at said lower portion, said LED in electrical engagement therewith;
a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin to said LED;
wherein said heat sink and said reflector form an electrically conductive location for supplying power to said LED.
23. The assembly of claim 22 further comprising a pair of slots located at an upper portion.
24. The assembly of claim 23 wherein said slots are coated with a conductive adhesive to bond said sleeve to the reflector.
25. The assembly of claim 23 wherein said reflector is bonded to said sleeve via an aluminum wire.
26. The assembly of claim 22 wherein said reflector is bonded to the heat sink by said insulative member.
27. The assembly of claim 22 further comprising an optic lens member positioned adjacent to said reflector, said optic lens member being spaced and positioned from said LED for focusing light rays emanating from said LED.
28. The assembly of claim 27 wherein said upper portion retains said optic lens member.
29. The assembly of claim 27 wherein said optic lens member is supported at least partially within the reflector.
30. The assembly of claim 27 wherein said optic lens member is positioned completely outside said reflector.
CA2589570A 2004-06-15 2005-05-13 High power led electro-optic assembly Expired - Fee Related CA2589570C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57982404P 2004-06-15 2004-06-15
US60/579,824 2004-06-15
PCT/US2005/016900 WO2006001928A1 (en) 2004-06-15 2005-05-13 High power led electro-optic assembly

Publications (2)

Publication Number Publication Date
CA2589570A1 true CA2589570A1 (en) 2006-01-05
CA2589570C CA2589570C (en) 2010-04-13

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Family Applications (1)

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CA2589570A Expired - Fee Related CA2589570C (en) 2004-06-15 2005-05-13 High power led electro-optic assembly

Country Status (8)

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US (2) US7540634B2 (en)
EP (1) EP1766287B1 (en)
JP (1) JP2008503057A (en)
CN (1) CN100594327C (en)
AT (1) ATE553505T1 (en)
CA (1) CA2589570C (en)
MX (1) MXPA06014522A (en)
WO (1) WO2006001928A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
EP1872401B1 (en) * 2005-04-05 2018-09-19 Philips Lighting Holding B.V. Electronic device package with an integrated evaporator
US8030401B1 (en) 2006-08-03 2011-10-04 Henkel Corporation Photoinitiated cationic epoxy compositions
US7714037B1 (en) 2006-12-15 2010-05-11 Henkel Corporation Photoinitiated cationic epoxy compositions and articles exhibiting low color
FR2910483B1 (en) * 2006-12-21 2010-07-30 Inst Francais Du Petrole METHOD OF CONVERTING CHARGES FROM RENEWABLE SOURCES IN GOODLY GASOLINE FUEL BASES.
US7705064B2 (en) 2007-07-23 2010-04-27 Henkel Corporation Photosensitive compounds, photopolymerizable compositions including the same, and methods of making and using the same
JP5081307B2 (en) 2007-10-23 2012-11-28 エルエスアイ・インダストリーズ・インコーポレーテッド Optical unit positioning device
RU2011103797A (en) * 2008-07-03 2012-08-10 Конинклейке Филипс Электроникс Н.В. (Nl) BEARING MODULE FOR A SOLID SOLID LIGHT SOURCE, LIGHTING DEVICE CONTAINING SUCH MODULE, AND METHOD FOR PRODUCING SUCH LIGHTING DEVICE
US8165434B2 (en) * 2009-03-17 2012-04-24 LumenFlow Corp. High efficiency optical coupler
US8192048B2 (en) * 2009-04-22 2012-06-05 3M Innovative Properties Company Lighting assemblies and systems
WO2010132517A2 (en) * 2009-05-12 2010-11-18 David Gershaw Led retrofit for miniature bulbs
WO2010132526A2 (en) * 2009-05-13 2010-11-18 Light Prescriptions Innovators, Llc Dimmable led lamp
AT509016B1 (en) * 2009-11-02 2012-12-15 Mannheim Volker Dr LIGHTING WITH AT LEAST ONE LED
CN102074637B (en) * 2009-11-19 2013-06-05 深圳市光峰光电技术有限公司 Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure
US8905573B2 (en) 2011-01-13 2014-12-09 Streamlight, Inc. Portable light with hanger, clip and led module
US9453624B2 (en) 2011-01-13 2016-09-27 Streamlight, Inc. Portable light with light source module and light source module
US9080084B2 (en) 2011-07-25 2015-07-14 Henkel IP & Holding GmbH Photolytically induced redox curable compositions
JP6224813B2 (en) * 2013-03-13 2017-11-01 オーエフエス ファイテル，エルエルシー Light-emitting diode input for hybrid solar lighting systems
US9357906B2 (en) 2014-04-16 2016-06-07 Engineered Medical Solutions Company LLC Surgical illumination devices and methods therefor
US20160106872A1 (en) * 2014-10-17 2016-04-21 Seth Martinez Handheld device for destroying microorganisms
US10940220B2 (en) 2017-05-09 2021-03-09 Crosby Innovations, LLC Standalone UV-C sanitizing apparatus and method
US10849995B2 (en) 2017-05-09 2020-12-01 Crosby Innovations, LLC Handheld sanitizing device
DE102020210845A1 (en) * 2020-08-27 2022-03-03 Siemens Energy Global GmbH & Co. KG Microlens array and microoptical device

Family Cites Families (174)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512027A (en) * 1967-12-12 1970-05-12 Rca Corp Encapsulated optical semiconductor device
US3638013A (en) * 1969-04-02 1972-01-25 Fiber Photics Inc Dental apparatus utilizing fiber optics
US3733481A (en) * 1970-06-11 1973-05-15 Bausch & Lomb Fiber optics light source
US3712984A (en) * 1971-03-15 1973-01-23 Canrad Precision Ind Inc Instrument for transmitting ultraviolet radiation to a limited area
US3868513A (en) * 1972-12-26 1975-02-25 Dentsply Res & Dev Ultraviolet radiation projector
US3859536A (en) * 1974-01-07 1975-01-07 Corning Glass Works Optical communication system source-detector pair
US3970856A (en) 1975-05-16 1976-07-20 Cavitron Corporation Ultraviolet light applicator
US4184196A (en) * 1975-11-28 1980-01-15 Moret Michel A Diagnostic lamp, particularly for checking teeth
JPS52110053A (en) * 1976-02-23 1977-09-14 Nath Guenther Uv illuminator
GB1578904A (en) 1976-05-28 1980-11-12 Kaltenbach & Voigt Medical treatment chair
US4048490A (en) 1976-06-11 1977-09-13 Union Carbide Corporation Apparatus for delivering relatively cold UV to a substrate
US4114274A (en) 1976-11-12 1978-09-19 Pelton & Crane Company Movable power-operated instrument console and treatment chair apparatus
JPS5396296A (en) 1977-02-01 1978-08-23 Morita Mfg Stand for dental treatment
DE7736502U1 (en) 1977-09-27 1978-03-09 Hamann, Arnold, 2061 Ahrensfelde TREATMENT CHAIR WITH COLD LIGHT LAMP FOR DENTAL MEDICAL PURPOSES
US4185891A (en) * 1977-11-30 1980-01-29 Grumman Aerospace Corporation Laser diode collimation optics
AT355200B (en) 1978-01-23 1980-02-25 Espe Pharm Praep RADIATION DEVICE FOR THE CURING OF RADIANT DIMENSIONS
US4186748A (en) * 1978-02-06 1980-02-05 Schlager Kenneth J Thermographic apparatus for physical examination of patients
US4229658A (en) 1978-08-18 1980-10-21 Dentsply Research & Development Corp. Xenon light apparatus for supplying ultraviolet and visible spectra
EP0011418A1 (en) 1978-11-20 1980-05-28 THE GENERAL ELECTRIC COMPANY, p.l.c. Manufacture of electroluminescent display devices
US4230453A (en) 1979-04-11 1980-10-28 Litton Industrial Products Inc. Light assembly for use with a dental handpiece
US4346329A (en) 1979-08-27 1982-08-24 Schmidt Robert C H Aiming post light
US4337759A (en) 1979-10-10 1982-07-06 John M. Popovich Radiant energy concentration by optical total internal reflection
US4385344A (en) * 1980-08-29 1983-05-24 Dentsply Research & Development Corp. Visible light apparatus for curing photo-curable compositions
JPS5846817Y2 (en) 1980-11-07 1983-10-25 株式会社 モリタ製作所 dental treatment table
DE3104239C2 (en) 1981-02-06 1986-11-20 Kaltenbach & Voigt Gmbh & Co, 7950 Biberach Dental handpiece
US4412134A (en) 1981-07-15 1983-10-25 Espe Fabrik Pharmazeutischer Praeparate Gmbh Apparatus for irradiating dental objects
US4445858A (en) * 1982-02-19 1984-05-01 American Hospital Supply Corporation Apparatus for photo-curing of dental restorative materials
US4716296A (en) 1982-04-26 1987-12-29 Surgicorp Apparatus for curing dental restorative composites
US4450139A (en) * 1982-05-03 1984-05-22 Solid State Systems, Corporation Light generating apparatus for curing dental restorative composites
US4836782A (en) 1983-05-06 1989-06-06 Dentsply Research & Development Corp. Method for providing direct cool beam incident light on dental target
US4666406A (en) * 1984-01-13 1987-05-19 Kanca Iii John Photocuring device and method
DE3480294D1 (en) * 1984-11-15 1989-11-30 Japan Traffic Manage Tech Ass Signal light unit having heat dissipating function
FR2574616B1 (en) * 1984-12-07 1987-01-23 Radiotechnique Compelec MATRIX OF ELECTRO-LUMINESCENT ELEMENT AND MANUFACTURING METHOD THEREOF
US4610630A (en) 1985-07-17 1986-09-09 Progressive Machine Products, Inc. Dental instrument stand
DE3605278C1 (en) 1986-02-19 1987-07-23 Espe Pharm Praep Circuit for feeding a dental photopolymerization device
JPS62194652A (en) * 1986-02-21 1987-08-27 Hitachi Ltd Semiconductor device
DE3611132A1 (en) 1986-04-03 1987-10-08 Espe Stiftung DENTAL RADIATION DEVICE
US4673353A (en) 1986-05-30 1987-06-16 Nevin Donald M Apparatus for applying a light-curable dental composition
US4826431A (en) * 1986-06-12 1989-05-02 Kabushiki Kaisha Morita Seisakusho Medical laser handpiece
US4675785A (en) 1986-07-31 1987-06-23 Hubbell Incorporated Heat distributing diode mounting assembly
JPS63111886A (en) * 1986-10-29 1988-05-17 呉羽化学工業株式会社 Cancer remedy apparatus using optical diode
US4757381A (en) 1987-03-05 1988-07-12 Fuji Optical Systems, Inc. Means and structure for prevention of cross contamination during use of dental camera
FR2612764B1 (en) * 1987-03-26 1989-06-30 Werly Marc METHOD FOR SEALING A DENTAL CAVITY AND TOOL FOR IMPLEMENTING THE METHOD
US4791634A (en) 1987-09-29 1988-12-13 Spectra-Physics, Inc. Capillary heat pipe cooled diode pumped slab laser
US4810194A (en) * 1987-11-04 1989-03-07 Snedden John E Disposable antiseptic dental shield
US4935665A (en) 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US4888489A (en) 1988-05-09 1989-12-19 Minnesota Mining And Manufacturing Company Hand-held device for curing a dental restorative material
US4846546A (en) 1988-05-10 1989-07-11 Joseph Cuda Fiber optic light carrying curing probe
US5316473A (en) * 1988-06-17 1994-05-31 Dentsply Research & Development Corp. Light curing apparatus and method
US5003434A (en) * 1988-09-30 1991-03-26 Den-Tal-Ez, Inc. Miniature hand-held spot source of illumination
KR910006706B1 (en) 1988-12-12 1991-08-31 삼성전자 주식회사 Manufacturing method of light emitted diode array head
JPH02174272A (en) * 1988-12-17 1990-07-05 Samsung Electron Co Ltd Manufacture of light-emitting diode array
US4901324A (en) * 1988-12-19 1990-02-13 Laser Diode Products, Inc. Heat transfer device for cooling and transferring heat from a laser diode device and associated heat generating elements
US5046840A (en) 1988-12-19 1991-09-10 The Titan Corporation Improvements in a system for determining atmospheric data relating to the movements of an airborne vehicle
US5201655A (en) * 1988-12-21 1993-04-13 Joshua Friedman Optical light guide for controlling the irradiation of a dental restorative material
US4963798A (en) 1989-02-21 1990-10-16 Mcdermott Kevin Synthesized lighting device
US5029335A (en) 1989-02-21 1991-07-02 Amoco Corporation Heat dissipating device for laser diodes
US5017140A (en) * 1989-05-15 1991-05-21 Jay Ascher Removable and disposable extension for a light guide of a dental curing light and its method of use
US4948215A (en) 1989-08-10 1990-08-14 Joshua Friedman Dental light-curing lamp unit with interchangeable autofocus light guides
JPH0750767B2 (en) 1989-09-07 1995-05-31 マツダ株式会社 Integrated circuit having metal substrate
CA2007846C (en) 1990-01-16 1996-12-10 Randy Hood Light guide coupling apparatus
DE4028566C1 (en) * 1990-09-08 1992-03-05 Heraeus Kulzer Gmbh, 6450 Hanau, De
US5150016A (en) 1990-09-21 1992-09-22 Rohm Co., Ltd. LED light source with easily adjustable luminous energy
US5115761A (en) * 1990-10-09 1992-05-26 Efos Inc. Light curing apparatus for a continuous linear product
US5162696A (en) 1990-11-07 1992-11-10 Goodrich Frederick S Flexible incasements for LED display panels
US5160200A (en) 1991-03-06 1992-11-03 R & D Molded Products, Inc. Wedge-base LED bulb housing
US5169632A (en) 1991-03-28 1992-12-08 Minnesota Mining And Manufacturing Company Microcapsules from polyfunctional aziridines
US5161879A (en) 1991-04-10 1992-11-10 Mcdermott Kevin Flashlight for covert applications
AU2419192A (en) * 1991-07-12 1993-02-11 Biotronics Technologies, Inc. Atomic emission spectrometry
US5147204A (en) 1991-08-08 1992-09-15 Minnesota Mining And Manufacturing Co. Dental material curing apparatus
US5173810A (en) 1991-08-21 1992-12-22 Aisens Co., Ltd. Light transmitting lens for use with a photoelectric sensor
US5195102A (en) * 1991-09-13 1993-03-16 Litton Systems Inc. Temperature controlled laser diode package
CH685148A5 (en) * 1991-11-20 1995-04-13 Erik Larsen Apparatus for the photodynamic stimulation of cells.
US5233283A (en) 1991-12-04 1993-08-03 John Kennedy Light curing device power control system
US5253260A (en) 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
EP0553712A1 (en) 1992-01-29 1993-08-04 Kaltenbach & Voigt Gmbh & Co. Laser treatment device, especially for medical or dental use
JPH05304318A (en) * 1992-02-06 1993-11-16 Rohm Co Ltd Led array board
US5242602A (en) 1992-03-04 1993-09-07 W. R. Grace & Co.-Conn. Spectrophotometric monitoring of multiple water treatment performance indicators using chemometrics
DE4211230C2 (en) 1992-04-03 1997-06-26 Ivoclar Ag Rechargeable light curing device
US5328368A (en) 1992-04-20 1994-07-12 Pinnacle Products Dental cure light cover
JPH06291428A (en) 1992-05-08 1994-10-18 Stanley Electric Co Ltd Circuit board
EP0581226A3 (en) 1992-07-31 1995-05-24 Molten Corp Photopolymerization reactor and small-sized light irradiator for dental use.
US5387800A (en) 1992-08-19 1995-02-07 Dymax Corporation Prefocused lamp and reflector assembly
US5265792A (en) 1992-08-20 1993-11-30 Hewlett-Packard Company Light source and technique for mounting light emitting diodes
CA2079698C (en) * 1992-10-02 1999-08-10 John Kennedy An unbreakable disposable photocuring guide
US5290169A (en) * 1992-11-02 1994-03-01 Joshua Friedman Optical light guide for dental light-curing lamps
US5309457A (en) * 1992-12-22 1994-05-03 Minch Richard B Micro-heatpipe cooled laser diode array
US5302124A (en) * 1993-03-25 1994-04-12 Pinnacle Products, Inc. Disposable protective sleeve for dental apparatus such as light curing guns
US5616141A (en) * 1993-04-09 1997-04-01 Ion Laser Technology Laser system for use in dental procedures
US5457611A (en) 1993-07-09 1995-10-10 Gregg Laboratories, Inc. Ambient air cooled light emitting instrument
US5445608A (en) 1993-08-16 1995-08-29 James C. Chen Method and apparatus for providing light-activated therapy
US5371753A (en) 1993-08-26 1994-12-06 Litton Systems, Inc. Laser diode mount
US5371826A (en) 1993-08-27 1994-12-06 Demetron Research Corp. Dental fiber optic light bundle with uniform taper
US5420768A (en) * 1993-09-13 1995-05-30 Kennedy; John Portable led photocuring device
JP2596646Y2 (en) 1993-09-14 1999-06-21 株式会社モリテックス Cordless light irradiator
IT1272050B (en) * 1993-11-10 1997-06-11 Olivetti Canon Ind Spa PARALLEL PRINTER DEVICE WITH MODULAR STRUCTURE AND RELATED CONSTRUCTION PROCEDURE.
US5487662A (en) * 1994-03-22 1996-01-30 Minnesota Mining And Manufacturing Company Dental impression tray for photocurable impression material
JP2596709B2 (en) 1994-04-06 1997-04-02 都築 省吾 Illumination light source device using semiconductor laser element
US5521392A (en) * 1994-04-29 1996-05-28 Efos Canada Inc. Light cure system with closed loop control and work piece recording
US5698866A (en) * 1994-09-19 1997-12-16 Pdt Systems, Inc. Uniform illuminator for phototherapy
US5504764A (en) * 1994-11-30 1996-04-02 The United States Of America As Represented By The Secretary Of The Army Micro-heatpipe cooling of solid-state slab
US5660461A (en) 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US5522225A (en) 1994-12-19 1996-06-04 Xerox Corporation Thermoelectric cooler and temperature sensor subassembly with improved temperature control
US5707139A (en) * 1995-11-01 1998-01-13 Hewlett-Packard Company Vertical cavity surface emitting laser arrays for illumination
US6046460A (en) * 1995-11-17 2000-04-04 Ivoclar Ag Light curing device
US5711665A (en) * 1995-12-19 1998-01-27 Minnesota Mining & Manufacturing Method and apparatus for bonding orthodontic brackets to teeth
US5617492A (en) * 1996-02-06 1997-04-01 The Regents Of The University Of California Fiber optic coupling of a microlens conditioned, stacked semiconductor laser diode array
DE19613566C2 (en) * 1996-04-04 1998-03-12 Peter Rechmann Device and method for curing a light-curing plastic filling material
EP0906770A1 (en) * 1996-04-11 1999-04-07 Nikolai Taimourasovich Bagraev Method for treating pathological conditions of tissues with non-coherent radiation and device therefor
US5703394A (en) * 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
CA2216053C (en) * 1996-09-20 2007-06-26 Kuraray Co., Ltd. Method of polymerizing photo-polymerizable composition for dental use and dental light-curing apparatus for use therewith
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
DE29709228U1 (en) * 1997-05-26 1998-09-24 Thera Ges Fuer Patente Light curing unit
US6200134B1 (en) * 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
US6068474A (en) * 1998-01-30 2000-05-30 Ivoclar Ag Light curing device
US6113212A (en) * 1998-04-16 2000-09-05 Eastman Kodak Company Method and apparatus for thermal control of LED printheads
US6208788B1 (en) * 1998-07-29 2001-03-27 Ultradent Products, Inc. Apparatus and methods for concentrating light through fiber optic funnels coupled to dental light guides
CN1125939C (en) * 1998-09-17 2003-10-29 皇家菲利浦电子有限公司 LED lamp
US6454789B1 (en) * 1999-01-15 2002-09-24 Light Science Corporation Patient portable device for photodynamic therapy
EP1031326A1 (en) * 1999-02-05 2000-08-30 Jean-Michel Decaudin Device for photo-activation of photosensitive composite materials especially in dentistry
US20030015667A1 (en) * 1999-05-12 2003-01-23 Macdougald Joseph A. Curing unit
DE19923564A1 (en) * 1999-05-21 2000-11-23 Manfred Franetzki Dental instrument has energy reservoir contained in handle to reduce clutter in patient treatment area so that dentist operating efficiency is increased
US6371636B1 (en) * 1999-05-24 2002-04-16 Jam Strait, Inc. LED light module for vehicles
US6193510B1 (en) * 1999-07-28 2001-02-27 Efraim Tsimerman Medical device with time-out feature
US6345982B1 (en) * 1999-09-01 2002-02-12 Darcy M. Dunaway Dental light controller and concentrator
US6171105B1 (en) * 1999-09-21 2001-01-09 Eg&G Ilc Technology, Inc. Dental-restoration light-curing system
US7094054B2 (en) * 1999-09-24 2006-08-22 Cao Group, Inc. Dental curing light
US6988891B2 (en) * 1999-09-24 2006-01-24 Cao Group, Inc. Curing light
US6719558B2 (en) * 1999-09-24 2004-04-13 Densen Cao Curing light
US6981867B2 (en) * 1999-09-24 2006-01-03 Cao Group, Inc. Curing light
US6186786B1 (en) * 1999-12-02 2001-02-13 Addent Inc. Dental instrument
US6350041B1 (en) * 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
US7062913B2 (en) * 1999-12-17 2006-06-20 The Ohio State University Heat engine
US6492725B1 (en) * 2000-02-04 2002-12-10 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package
DE10011892A1 (en) * 2000-03-03 2001-09-20 Jenoptik Jena Gmbh Mounting substrate and heat sink for high-performance diode laser bars
US6554463B2 (en) * 2000-05-19 2003-04-29 Addent Inc. Optical waveguide concentrator and illuminating device
DE10038213A1 (en) * 2000-08-04 2002-03-07 Osram Opto Semiconductors Gmbh Radiation source and method of making a lens mold
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US6552368B2 (en) * 2000-09-29 2003-04-22 Omron Corporation Light emission device
JP2002134825A (en) * 2000-10-20 2002-05-10 Furukawa Electric Co Ltd:The Laser diode module and mounting substrate
US6398383B1 (en) * 2000-10-30 2002-06-04 Yu-Hwei Huang Flashlight carriable on one's person
JP4646166B2 (en) * 2000-11-08 2011-03-09 古河電気工業株式会社 Light source consisting of a laser diode module
JP4690536B2 (en) * 2000-11-24 2011-06-01 古河電気工業株式会社 Light source consisting of laser diode module
CA2332190A1 (en) * 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
US6695614B2 (en) * 2001-02-01 2004-02-24 Ivoclar Vivadent Ag Light beam hardening apparatus for curing material
JP2002246650A (en) * 2001-02-13 2002-08-30 Agilent Technologies Japan Ltd Light-emitting diode and its manufacturing method
JP2002280659A (en) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The Light source constituted of laser diode module
TW567742B (en) * 2001-03-22 2003-12-21 Ind Tech Res Inst Cooling apparatus of liquid crystal projector
US6709128B2 (en) * 2001-03-26 2004-03-23 Ocumed, Inc. Curing system
JP4050482B2 (en) * 2001-04-23 2008-02-20 豊田合成株式会社 Semiconductor light emitting device
US6511317B2 (en) * 2001-04-26 2003-01-28 New Photonic, Llc Device for curing photosensitive dental compositions with off-axis lens and method of curing
US7001057B2 (en) * 2001-05-23 2006-02-21 Ivoclar Vivadent A.G. Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof
US20030036031A1 (en) * 2001-08-20 2003-02-20 Lieb Joseph Alexander Light-emitting handpiece for curing photopolymerizable resins
US6827468B2 (en) * 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
US6692252B2 (en) * 2001-12-17 2004-02-17 Ultradent Products, Inc. Heat sink with geometric arrangement of LED surfaces
WO2003056636A1 (en) * 2001-12-29 2003-07-10 Hangzhou Fuyang Xinying Dianzi Ltd. A led and led lamp
US6702576B2 (en) * 2002-02-22 2004-03-09 Ultradent Products, Inc. Light-curing device with detachably interconnecting light applicator
US7429757B2 (en) * 2002-06-19 2008-09-30 Sanken Electric Co., Ltd. Semiconductor light emitting device capable of increasing its brightness
US7134875B2 (en) * 2002-06-28 2006-11-14 3M Innovative Properties Company Processes for forming dental materials and device
JP4241184B2 (en) * 2002-07-25 2009-03-18 パナソニック電工株式会社 Photoelectric component
US7182597B2 (en) * 2002-08-08 2007-02-27 Kerr Corporation Curing light instrument
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
DE10242366B4 (en) * 2002-09-12 2010-10-21 Ivoclar Vivadent Ag Light curing device for curing light-curable materials
US20040070990A1 (en) * 2002-10-01 2004-04-15 Witold Szypszak LED illuminator and method of manufacture
US6880954B2 (en) * 2002-11-08 2005-04-19 Smd Software, Inc. High intensity photocuring system
US6994546B2 (en) * 2002-12-18 2006-02-07 Ultradent Products, Inc. Light curing device with detachable power supply
US6991356B2 (en) * 2002-12-20 2006-01-31 Efraim Tsimerman LED curing light
US6921971B2 (en) * 2003-01-15 2005-07-26 Kyocera Corporation Heat releasing member, package for accommodating semiconductor element and semiconductor device
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US20050077865A1 (en) * 2003-08-26 2005-04-14 Intermec Ip Corp. Portable computing device peripheral employing fuel cell to recharge battery
WO2005031894A2 (en) * 2003-09-22 2005-04-07 New Option Lighting, Llc Process and apparatus for improving led performance
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
EP1776059A2 (en) * 2004-07-02 2007-04-25 Discus Dental Impressions Inc. Curing light having a reflector

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US20070091618A1 (en) 2007-04-26

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