CA2589570C - High power led electro-optic assembly - Google Patents
High power led electro-optic assembly Download PDFInfo
- Publication number
- CA2589570C CA2589570C CA2589570A CA2589570A CA2589570C CA 2589570 C CA2589570 C CA 2589570C CA 2589570 A CA2589570 A CA 2589570A CA 2589570 A CA2589570 A CA 2589570A CA 2589570 C CA2589570 C CA 2589570C
- Authority
- CA
- Canada
- Prior art keywords
- assembly
- led
- reflector
- conductive
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5344—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/61—Joining from or joining on the inside
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/041—Ball lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Abstract
The present invention provides a high power LED electro-optic assembly including conductive heat sink and an LED mounted at one end of the heat sink.
The LED is in electrical engagement with the heat sink. The assembly also includes a reflector mounted at the other end of the heat sink. An insulating bond material is provided between the reflector and the sink. The assembly further includes a conductive bonding pin extending through the reflector and is in conductive engagement therewith and an electrical engagement which electrically engages the pin to the LED. Finally, an electric sleeve assembly where the sleeve is coated with an electrical insulating coating is applied to the LED electro-optic assembly.
The LED is in electrical engagement with the heat sink. The assembly also includes a reflector mounted at the other end of the heat sink. An insulating bond material is provided between the reflector and the sink. The assembly further includes a conductive bonding pin extending through the reflector and is in conductive engagement therewith and an electrical engagement which electrically engages the pin to the LED. Finally, an electric sleeve assembly where the sleeve is coated with an electrical insulating coating is applied to the LED electro-optic assembly.
Description
HIGH POWER LED ELECTRO-OPTIC ASSEMBLY
FIELD OF INVENTION
The present invention relates to light emitting diode ("LED") technology, particularly to improvements in LED assemblies to provide a desired optical output for various lighting applications.
BACKGROUND OF THE INVENTION
LED assemblies are well-known and commercially available. Such assemblies are employed in a wide variety of applications, typically for the production of ultraviolet radiation, used, for example, in effecting the curing of photo initiated adhesives and coative compositions.
Several factors play into the fabrication of LED assemblies. One is the control of high current supplied to the LEDs to provide a stable and reliable UV source.
Another is the position of the lens to hold the output optic in place. Also, a means to provide a path for electrical conduction is required to supply control for the LED. As the current increases to the LED, the need for a high current, higli reliability electrical contact becomes necessary.
Additionally, a reflector fonning the rays coming from the LED is often required.
Furthermore, a cooling system is required to carry the heat away from the assembly.
Presently, available, LED assemblies may not adequately offer all of these requirements.
Currently, manufacturers are providing a wide range of LED packages in a variety of forms. These packages range from conventional LED lamps to LEDs that use emitter chips of various sizes. While, many of the known LED assemblies produce a high light output, they produce a very disperse wide angle beam that is difficult to capture for efficient colliination and beam imaging in practical application, such as in a flashlight. As a result, a great deal of the output energy is lost as leakage out from the side of the LED package.
Additionally, light emitted from the LED assembly is ordinarily not evenly distributed. The shape of the light-emitting chip is projected on the target as a high intensity area. Reflections from the electrodes and walls from unpredictable patterns of light are superimposed on the main beam of light. As a result, undesirable hot spots and shadows appear on the object being illuminated. Accordingly, for any lighting application requiring a substantially even or uniform distribution of light over a predetermined area, a transmitting or partial diffuser must be used to scatter the light emitted from each individual LED assembly so that the hot spots and shadows do not appear on the object being illuminated. But, while a diffuser will eliminate hot spots and shadows, it is important that the "directivity" or geometry of the light beam emitted from an individual LED assembly not be degraded or diminished.
In order to overcome these above-noted disadvantages of known light sources, there is a need to provide an LED curing lamp asseinbly that has a flexible design, is easy to manufacture and reduces assembly cost.
SUMMARY OF THE INVENTION
In one embodiment of the present invention there is disclosed a LED electro-optic electrical sleeve assembly having a generally cylindrical sleeve coated with an electrical insulator. The assembly is divided into an upper portion and a lower portion, the upper and lower portion separated by an insulating material. At least one LED and a conductive reflector is mounted at the upper portion, where the reflector surrounds the LED. A conductive heat sink is mounted at the lower portion, and
FIELD OF INVENTION
The present invention relates to light emitting diode ("LED") technology, particularly to improvements in LED assemblies to provide a desired optical output for various lighting applications.
BACKGROUND OF THE INVENTION
LED assemblies are well-known and commercially available. Such assemblies are employed in a wide variety of applications, typically for the production of ultraviolet radiation, used, for example, in effecting the curing of photo initiated adhesives and coative compositions.
Several factors play into the fabrication of LED assemblies. One is the control of high current supplied to the LEDs to provide a stable and reliable UV source.
Another is the position of the lens to hold the output optic in place. Also, a means to provide a path for electrical conduction is required to supply control for the LED. As the current increases to the LED, the need for a high current, higli reliability electrical contact becomes necessary.
Additionally, a reflector fonning the rays coming from the LED is often required.
Furthermore, a cooling system is required to carry the heat away from the assembly.
Presently, available, LED assemblies may not adequately offer all of these requirements.
Currently, manufacturers are providing a wide range of LED packages in a variety of forms. These packages range from conventional LED lamps to LEDs that use emitter chips of various sizes. While, many of the known LED assemblies produce a high light output, they produce a very disperse wide angle beam that is difficult to capture for efficient colliination and beam imaging in practical application, such as in a flashlight. As a result, a great deal of the output energy is lost as leakage out from the side of the LED package.
Additionally, light emitted from the LED assembly is ordinarily not evenly distributed. The shape of the light-emitting chip is projected on the target as a high intensity area. Reflections from the electrodes and walls from unpredictable patterns of light are superimposed on the main beam of light. As a result, undesirable hot spots and shadows appear on the object being illuminated. Accordingly, for any lighting application requiring a substantially even or uniform distribution of light over a predetermined area, a transmitting or partial diffuser must be used to scatter the light emitted from each individual LED assembly so that the hot spots and shadows do not appear on the object being illuminated. But, while a diffuser will eliminate hot spots and shadows, it is important that the "directivity" or geometry of the light beam emitted from an individual LED assembly not be degraded or diminished.
In order to overcome these above-noted disadvantages of known light sources, there is a need to provide an LED curing lamp asseinbly that has a flexible design, is easy to manufacture and reduces assembly cost.
SUMMARY OF THE INVENTION
In one embodiment of the present invention there is disclosed a LED electro-optic electrical sleeve assembly having a generally cylindrical sleeve coated with an electrical insulator. The assembly is divided into an upper portion and a lower portion, the upper and lower portion separated by an insulating material. At least one LED and a conductive reflector is mounted at the upper portion, where the reflector surrounds the LED. A conductive heat sink is mounted at the lower portion, and
2 is in electrical engagement with the LED. Additionally a conductive bonding pin extends through the conductive reflector and is in conductive engagement therewith. An electrical engagement electrically engages the bonding pin to the LED, where the heat sink and the reflector form an electrically conductive location for supplying power to said LED.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a schematic view of a LED ray forming contact assembly of the present invention.
Fig. 2 is a schematic view of a LED optical transform assembly using the ray forming contact assembly of Fig. 1.
Fig. 3 is a schematic view of an electrical sleeve assembly of the present invention.
Fig. 4 is a schematic view of a LED, Electro-optic Assembly of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Referring to Fig. 1 of the present invention, there is shown a schematic view of a LED
ray forming contact assembly 10. The assembly 10 is a compact means of providing a way to simultaneously contact the LED with electrical contacts and form the rays coming from the LED as will be described liereinbelow. The contact assembly 10 is divided into two contacts, i.e., electrodes, an upper electrode 10a and lower electrode 10b, both made of inetal. The upper electrode l0a includes a metal reflector 12 preferably made of aluminum.
The metal reflector 12 is press fit into the electrode l0a to form a conductor reflector assembly. The metal reflector 12 may be shaped as a curve and functions to generally collimate and direct the LED light towards the lens and will be described in greater detail below.
In a preferred embodiment, the reflector 12 is shaped as an elliptic. A LED chip 14 is mounted in the electrode 10a, desirably positioned at the center and partially or wholly surrounded by the
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a schematic view of a LED ray forming contact assembly of the present invention.
Fig. 2 is a schematic view of a LED optical transform assembly using the ray forming contact assembly of Fig. 1.
Fig. 3 is a schematic view of an electrical sleeve assembly of the present invention.
Fig. 4 is a schematic view of a LED, Electro-optic Assembly of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Referring to Fig. 1 of the present invention, there is shown a schematic view of a LED
ray forming contact assembly 10. The assembly 10 is a compact means of providing a way to simultaneously contact the LED with electrical contacts and form the rays coming from the LED as will be described liereinbelow. The contact assembly 10 is divided into two contacts, i.e., electrodes, an upper electrode 10a and lower electrode 10b, both made of inetal. The upper electrode l0a includes a metal reflector 12 preferably made of aluminum.
The metal reflector 12 is press fit into the electrode l0a to form a conductor reflector assembly. The metal reflector 12 may be shaped as a curve and functions to generally collimate and direct the LED light towards the lens and will be described in greater detail below.
In a preferred embodiment, the reflector 12 is shaped as an elliptic. A LED chip 14 is mounted in the electrode 10a, desirably positioned at the center and partially or wholly surrounded by the
3 reflector 12. The LED chip 14 is further electrically isolated from the reflector 12. Because metal is a good electrical conductor, both the metal reflector 12 and the metal electrode l0a provide an electrical transfer path away from the LED chip 14. A conductive metal pin 15 desirably coated with gold is pressed into the assembly 10 in the upper electrode 10a as shown in Fig. 1. An electrical engagement such as a gold wire or wires 16 passes from the upper electrode 10a to the lead chip 14. One end of the gold wire 16 is soldered to the metal pin 15 and the other end is welded to the top surface of the LED chip 12 to electrically engage the pin 15 with the LED 14.
When current flows through a chip in an individual LED assembly, both light and heat are generated. Increasing the current through the chip raises the light output but increased current flow also raises the temperature of the chip in the individual LED assembly.
This temperature increase lowers the efficiency of the chip. Overheating is the main cause of the failure of individual LED assemblies. To assure safe operation, either the current, and as a result the light output, must be kept at a low level or some other means of transferring heat away from the chip in the individual LED assembly must be provided. Therefore, lower electrode 10b may be defined by with an electrically conducting thermal heat sink 18 which also serves to carry heat away from the LED chip 14. The upper electrode 10a and the lower electrode lOb are held together by an electrically insulating material 19 such as a non-conductive adhesive. The LED 14 is disposed in the assembly 10 in such a manner that the bottom surface is bonded or soldered to the thermal heat sink 18 via the bond material 19. In order to allow the electrical connection through the LED 14, voltage is applied to both upper and lower electrodes l0a and lOb respectively. This causes the heat sink 18 to carry off heat aiid the curved surface of the reflector 12 forms the light from the LED 14 into a desired pattern. Even though only single LED 14 is shown in Fig. 1, it is understood that multiple LEDs can be employed in the assembly 10.
When current flows through a chip in an individual LED assembly, both light and heat are generated. Increasing the current through the chip raises the light output but increased current flow also raises the temperature of the chip in the individual LED assembly.
This temperature increase lowers the efficiency of the chip. Overheating is the main cause of the failure of individual LED assemblies. To assure safe operation, either the current, and as a result the light output, must be kept at a low level or some other means of transferring heat away from the chip in the individual LED assembly must be provided. Therefore, lower electrode 10b may be defined by with an electrically conducting thermal heat sink 18 which also serves to carry heat away from the LED chip 14. The upper electrode 10a and the lower electrode lOb are held together by an electrically insulating material 19 such as a non-conductive adhesive. The LED 14 is disposed in the assembly 10 in such a manner that the bottom surface is bonded or soldered to the thermal heat sink 18 via the bond material 19. In order to allow the electrical connection through the LED 14, voltage is applied to both upper and lower electrodes l0a and lOb respectively. This causes the heat sink 18 to carry off heat aiid the curved surface of the reflector 12 forms the light from the LED 14 into a desired pattern. Even though only single LED 14 is shown in Fig. 1, it is understood that multiple LEDs can be employed in the assembly 10.
4 By providing one of the electrical contacts l0a in conjunction with the reflector and the other electrical contact lOb in conjunction with thermal heat sink, the LED ray forming contact assembly 10 is easy to manufacture, reduces the assembly cost and simplifies the final assembly. Furthermore, the LED ray forming contact assembly 10 also allows the scaling up to multiple LEDs in an assembly without adding significant complexity.
To further exemplify the operation of the entire optical assembly Fig. 2A-Fig.
illustrate an exemplary ray diagrams for a single LED assembly. It will be understood by those skilled in the art that a similar ray diagram results when the LED chip 14 of the single LED assembly is replaced by multiple LED chips 14.
Fig. 2A-Fig 2C show a LED optical transform assembly 20 using the LED forming contact assembly 10 of Fig. 1 in conjunction with miniature optical components to form a complete ray forming system. The optical coinponents include a lens 22 that directs the light generated by the LED chip 14 by focusing the light to a desired spot size by collimating the light to a desired location. The lens 22 may be attached or inolded precisely in the assembly so that it is centered at the collimated beam. The shape and/or size of the lens 22 may vary to shape the conical beam of light emitted from the LED assemblies to provide the desired optical illumination pattern.
The converging action of the lens 22 depends on both the radius of lens 22 and the positioning of the lens 22 with respect to the individual LED assembly 20.
Both the radius and position of the lens 22 may be established during the design process to optimize illumination of the object. The ability to precisely locate and fixture the optic lens 22 is a critical concept in this application. The lens 22 needs to be positioned at right distance from the LED 14 in order to achieve the desired light output.
In Fig. 2A, an optical lens 22a in shape of ball is partially located in the reflector 12 of the upper electrode 10a. Even though a ball shaped optic lens 22a is shown in the present
To further exemplify the operation of the entire optical assembly Fig. 2A-Fig.
illustrate an exemplary ray diagrams for a single LED assembly. It will be understood by those skilled in the art that a similar ray diagram results when the LED chip 14 of the single LED assembly is replaced by multiple LED chips 14.
Fig. 2A-Fig 2C show a LED optical transform assembly 20 using the LED forming contact assembly 10 of Fig. 1 in conjunction with miniature optical components to form a complete ray forming system. The optical coinponents include a lens 22 that directs the light generated by the LED chip 14 by focusing the light to a desired spot size by collimating the light to a desired location. The lens 22 may be attached or inolded precisely in the assembly so that it is centered at the collimated beam. The shape and/or size of the lens 22 may vary to shape the conical beam of light emitted from the LED assemblies to provide the desired optical illumination pattern.
The converging action of the lens 22 depends on both the radius of lens 22 and the positioning of the lens 22 with respect to the individual LED assembly 20.
Both the radius and position of the lens 22 may be established during the design process to optimize illumination of the object. The ability to precisely locate and fixture the optic lens 22 is a critical concept in this application. The lens 22 needs to be positioned at right distance from the LED 14 in order to achieve the desired light output.
In Fig. 2A, an optical lens 22a in shape of ball is partially located in the reflector 12 of the upper electrode 10a. Even though a ball shaped optic lens 22a is shown in the present
5 invention, it is understood that other different shapes of optics can be selected. The optics can be varied depending on the desired output. In the present invention, ball optic 22a is selected in order to produce the maximum light power density with the available LED output.
The LED output is focused to a desired spot just outside the ball optic lens 22a. If a collimated beain is desired, a half ball optical lens 22b as shown in Fig 2B
or a parabolic optical lens 22c shown in Fig. 2C may desirably be used. The parabolic optical lens 22b of Fig. 2B is positioned in such a manner that part of the lens lies in the reflector 12 and the other part is outside the assembly 20. This positioning of lens 22b emits a wide light pattern as shown in Fig. 2B thereby illuminating a much bigger area on a work piece.
Whereas, the parabolic optical lens 22c, as shown in Fig. 2C, is positioned completely outside the reflector 12 and/or the assembly 20. This positioning of lens 22c in Fig. 2C emits a narrower light pattern than the area in Fig. 2B thereby illuminating a specific area on a work piece. This method provides a rigid assembly that can be manufactured precisely and rapidly. The LED
ray forming contact assembly size, other optics lenses 22 can preferably be modified and further distances and positions between the LED 14 and the lens 22 can be varied to accommodate a wide range of optical components while minimizing the cost and complexity of the complete assembly.
The number of LED assemblies employed determines the size of a LED array and the desired output intensity. An end user can easily increase or decrease the output intensity by adding/reinoving LED assemblies to/from the LED array. Also, a user can change the operating wavelength of the assembly by replacing one or more LED assemblies of a first operating wavelength with one or more replacement assemblies having a second wavelength.
In addition, a user can replace damaged or expired LED assemblies witliout replacing the entire LED array.
The LED output is focused to a desired spot just outside the ball optic lens 22a. If a collimated beain is desired, a half ball optical lens 22b as shown in Fig 2B
or a parabolic optical lens 22c shown in Fig. 2C may desirably be used. The parabolic optical lens 22b of Fig. 2B is positioned in such a manner that part of the lens lies in the reflector 12 and the other part is outside the assembly 20. This positioning of lens 22b emits a wide light pattern as shown in Fig. 2B thereby illuminating a much bigger area on a work piece.
Whereas, the parabolic optical lens 22c, as shown in Fig. 2C, is positioned completely outside the reflector 12 and/or the assembly 20. This positioning of lens 22c in Fig. 2C emits a narrower light pattern than the area in Fig. 2B thereby illuminating a specific area on a work piece. This method provides a rigid assembly that can be manufactured precisely and rapidly. The LED
ray forming contact assembly size, other optics lenses 22 can preferably be modified and further distances and positions between the LED 14 and the lens 22 can be varied to accommodate a wide range of optical components while minimizing the cost and complexity of the complete assembly.
The number of LED assemblies employed determines the size of a LED array and the desired output intensity. An end user can easily increase or decrease the output intensity by adding/reinoving LED assemblies to/from the LED array. Also, a user can change the operating wavelength of the assembly by replacing one or more LED assemblies of a first operating wavelength with one or more replacement assemblies having a second wavelength.
In addition, a user can replace damaged or expired LED assemblies witliout replacing the entire LED array.
6 Regarding the optical properties of the optical assembly 10 and 20, each, LED
14, emits diffuse liglit at a predetermined optical power and a predetermined optical wavelength.
Exemplary LEDs 14 according to the present invention emit preferably greater than 500mw of optical power at desirably 405nm. The reflective cavity collimates a majority of the diffuse light emitted by the LED 14 when the LED 14 is placed at the desired location within the reflective cavity. The parabolic reflector 12 represents an exemplary reflective cavity that collimates the inajority of the light when the LED 14 is placed at or near the focal point of elliptic reflector 12, as shown in FIG. 2. It will be understood by those skilled in the art that the collimating means of the present invention is not limited to an elliptical reflector 14.
Other LED collimating means well understood by those skilled in the art may also be implemented in the present invention.
In order to make small optical assemblies, preferably such as LED optical assemblies, it is necessary to have a means to hold the output optic in place and also provide a path for electrical conduction. One such means is an electrical sleeve assembly 30 shown in Fig. 3.
The assembly 30 is preferably conducted of aluminum alloy including a generally cylindrical sleeve 32 preferably made of aluminum coated with an electrical insulating coating 34 such as a non-conductive adhesive. The outside of the sleeve 32 is masked to allow contact with an external electrical connection as will be described in greater detail below. The assembly 30 shows a cutaway drawing with slots 36 at upper ends as shown in Fig. 3.
These slots 36 are preferably machined into the sleeve after the sleeve 32 has been coated.
Since the slots 36 now allow bare metal assembly 30 to be exposed over a large area, the total exposed surface provides a very low resistance contact when the conductive coating such as an adhesive is applied between the sleeve slots 36 and the metal contact inside the sleeve 36.
The conductive adhesive connects the reflector 12 inside the assembly to the outside sleeve 32. Alternatively, a wire bonding may be applied to bond the reflector 12 to the sleeve 32.
14, emits diffuse liglit at a predetermined optical power and a predetermined optical wavelength.
Exemplary LEDs 14 according to the present invention emit preferably greater than 500mw of optical power at desirably 405nm. The reflective cavity collimates a majority of the diffuse light emitted by the LED 14 when the LED 14 is placed at the desired location within the reflective cavity. The parabolic reflector 12 represents an exemplary reflective cavity that collimates the inajority of the light when the LED 14 is placed at or near the focal point of elliptic reflector 12, as shown in FIG. 2. It will be understood by those skilled in the art that the collimating means of the present invention is not limited to an elliptical reflector 14.
Other LED collimating means well understood by those skilled in the art may also be implemented in the present invention.
In order to make small optical assemblies, preferably such as LED optical assemblies, it is necessary to have a means to hold the output optic in place and also provide a path for electrical conduction. One such means is an electrical sleeve assembly 30 shown in Fig. 3.
The assembly 30 is preferably conducted of aluminum alloy including a generally cylindrical sleeve 32 preferably made of aluminum coated with an electrical insulating coating 34 such as a non-conductive adhesive. The outside of the sleeve 32 is masked to allow contact with an external electrical connection as will be described in greater detail below. The assembly 30 shows a cutaway drawing with slots 36 at upper ends as shown in Fig. 3.
These slots 36 are preferably machined into the sleeve after the sleeve 32 has been coated.
Since the slots 36 now allow bare metal assembly 30 to be exposed over a large area, the total exposed surface provides a very low resistance contact when the conductive coating such as an adhesive is applied between the sleeve slots 36 and the metal contact inside the sleeve 36.
The conductive adhesive connects the reflector 12 inside the assembly to the outside sleeve 32. Alternatively, a wire bonding may be applied to bond the reflector 12 to the sleeve 32.
7
8 PCT/US2005/016900 The two slots 36 provide four open surfaces to make contact with the sleeve 32.
Furthermore, the electrical conductivity is maximized due to the length of the slots 36 and due to the fact that two surfaces for each of the two slots 36 provide a maximum surface area in a compact assembly. The shape of upper ends of the sleeve 32 are preferably modified to retain an optic that is being used with assembly 30. By simply placing an optic in the sleeve 32 and sliding onto preferably a LED assembly, then applying the conductive adhesive to the slots 36 or wire bonding the reflector 12 to the sleeve 32, an electro-optic assembly is electrically connected, as will be described in greater detail below with reference to Fig. 4.
The LED 14 is combined with the ray forming contact assembly 10, LED variable optical assembly 20 and the LED lens retaining electrical sleeve assembly 30 to form a complete LED electro-optic assembly 40 as shown in Fig. 4. LED 14 is bonded or soldered to the thermal heat sink 18 made of an electrically conductive material. Once the LED 14 is contacted to the thermal heat sink 18 with the insulating material 19, the ray forming contact assembly 10 is bonded in place. Again, the top surface of the LED 14 is bonded to the conductive metal pin 15 via the gold wire 16. The pin 15 is preferably coated with gold and is pressed into the metal contact assembly. Because the contact assembly metal is selected for reflectivity and electrical conductivity, it will direct the LED output and serve to electrically connect the top surface of the LED 14 to the outside surface of the ray forming contact assembly 10. Next, the LED variable optical assembly 20 is installed preferably with a ball optic lens 22a.
Finally, the LED lens retaining electrical sleeve assembly 30 is installed while applying the structural adhesive 34 on the thermal heat sink 18. The reflector 12 is preferably bonded to the thermal heat sink 18 with the structural adhesive 34.
So, the structural adhesive 34 functions to hold the assembly securely together, providing some thermal conduction and additional electrical insulation from the thermal heat sink 18.
Additionally, a conductive adhesive 42 is preferably applied to the slots 36 to bond the outside sleeve 32 to the reflector 12. Alternatively, as discussed above, a wire, preferably aluminum (not shown) may be used to wire bond between the reflector 12 inside the assembly and the outside sleeve 32 preferably made of aluminum. Preferably, inultiple wire bonds are used to bond the reflector 12 and a recess (not shown) below the surface of the outside sleeve 32. Also, the recess is desirably coated for protection. The conductive material is heat cured and the complete LED electro-optic assembly 40 is formed. Again, the assembly 40 shows only a single LED 14, multiple LED devices may preferably be bonded to the assembly.
Individual alignment of the LED 14 or multiple LEDs is required because no two individual LED assemblies are exactly the same. Differences arise from the positioning of the chip 14 inside the reflector 12, the positioning of the reflector cup 12, the positioning of the electrodes l0a and lOb, and the positioning of the optic lens 22. All of these factors affect the geometry and direction of the beam of light. Due to the manufacturing process of individual LED assemblies, the components in individual LED assemblies exhibit a very wide range of positional relationships. Therefore, for any application that requires illunzination of a specific area, each individual LED assembly must be manually aligned and then permanently held in place by some means of mechanical support.
While a single LED is used herein to illustrate the invention, it will be understood by those skilled in the art that the invention described herein applies to a plurality of LEDs or LED array. A plurality of LEDs may be arranged in any manner as desired for illumination.
Even though, in the present invention the LED 14 is shown to be a rectangular frame, those of ordinary skill in the art will understand that according to the disclosed invention, LED iliuminators may be formed in any shape suitable to provide light for a wide array of applications, including but not limited to photocuring, video, shop windows, photography or
Furthermore, the electrical conductivity is maximized due to the length of the slots 36 and due to the fact that two surfaces for each of the two slots 36 provide a maximum surface area in a compact assembly. The shape of upper ends of the sleeve 32 are preferably modified to retain an optic that is being used with assembly 30. By simply placing an optic in the sleeve 32 and sliding onto preferably a LED assembly, then applying the conductive adhesive to the slots 36 or wire bonding the reflector 12 to the sleeve 32, an electro-optic assembly is electrically connected, as will be described in greater detail below with reference to Fig. 4.
The LED 14 is combined with the ray forming contact assembly 10, LED variable optical assembly 20 and the LED lens retaining electrical sleeve assembly 30 to form a complete LED electro-optic assembly 40 as shown in Fig. 4. LED 14 is bonded or soldered to the thermal heat sink 18 made of an electrically conductive material. Once the LED 14 is contacted to the thermal heat sink 18 with the insulating material 19, the ray forming contact assembly 10 is bonded in place. Again, the top surface of the LED 14 is bonded to the conductive metal pin 15 via the gold wire 16. The pin 15 is preferably coated with gold and is pressed into the metal contact assembly. Because the contact assembly metal is selected for reflectivity and electrical conductivity, it will direct the LED output and serve to electrically connect the top surface of the LED 14 to the outside surface of the ray forming contact assembly 10. Next, the LED variable optical assembly 20 is installed preferably with a ball optic lens 22a.
Finally, the LED lens retaining electrical sleeve assembly 30 is installed while applying the structural adhesive 34 on the thermal heat sink 18. The reflector 12 is preferably bonded to the thermal heat sink 18 with the structural adhesive 34.
So, the structural adhesive 34 functions to hold the assembly securely together, providing some thermal conduction and additional electrical insulation from the thermal heat sink 18.
Additionally, a conductive adhesive 42 is preferably applied to the slots 36 to bond the outside sleeve 32 to the reflector 12. Alternatively, as discussed above, a wire, preferably aluminum (not shown) may be used to wire bond between the reflector 12 inside the assembly and the outside sleeve 32 preferably made of aluminum. Preferably, inultiple wire bonds are used to bond the reflector 12 and a recess (not shown) below the surface of the outside sleeve 32. Also, the recess is desirably coated for protection. The conductive material is heat cured and the complete LED electro-optic assembly 40 is formed. Again, the assembly 40 shows only a single LED 14, multiple LED devices may preferably be bonded to the assembly.
Individual alignment of the LED 14 or multiple LEDs is required because no two individual LED assemblies are exactly the same. Differences arise from the positioning of the chip 14 inside the reflector 12, the positioning of the reflector cup 12, the positioning of the electrodes l0a and lOb, and the positioning of the optic lens 22. All of these factors affect the geometry and direction of the beam of light. Due to the manufacturing process of individual LED assemblies, the components in individual LED assemblies exhibit a very wide range of positional relationships. Therefore, for any application that requires illunzination of a specific area, each individual LED assembly must be manually aligned and then permanently held in place by some means of mechanical support.
While a single LED is used herein to illustrate the invention, it will be understood by those skilled in the art that the invention described herein applies to a plurality of LEDs or LED array. A plurality of LEDs may be arranged in any manner as desired for illumination.
Even though, in the present invention the LED 14 is shown to be a rectangular frame, those of ordinary skill in the art will understand that according to the disclosed invention, LED iliuminators may be formed in any shape suitable to provide light for a wide array of applications, including but not limited to photocuring, video, shop windows, photography or
9 specialty product displays. Because of the durability and rugged construction of the disclosed LED illuminator, it may be used in outdoor settings, marine applications, or hostile environments.
Claims (28)
1. A LED electro-optic assembly comprising:
at least one LED;
a conductive heat pipe having mounted at one end thereof, said LED in electrical engagement therewith;
a conductive reflector mounted to said one end of said heat pipe and surrounding said LED;
an insulative member electrically isolating said conductive reflector from said heat pipe;
a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin with said LED;
wherein said heat pipe and said reflector form an electrically conductive location for supplying power to said LED.
at least one LED;
a conductive heat pipe having mounted at one end thereof, said LED in electrical engagement therewith;
a conductive reflector mounted to said one end of said heat pipe and surrounding said LED;
an insulative member electrically isolating said conductive reflector from said heat pipe;
a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin with said LED;
wherein said heat pipe and said reflector form an electrically conductive location for supplying power to said LED.
2. The assembly of claim 1 wherein said heat pipe includes a planar surface at said one end and wherein said LED is mounted to said surface.
3. The assembly of claim 2 wherein said reflector is an elliptical reflector having a central opening therethrough and wherein said LED is mounted in said central opening.
4. The assembly of claim 3 wherein said insulative member includes a bonding agent for securing said conductive reflector to said heat pipe.
5. The assembly of claim 1 wherein said bonding pin is gold plated.
6. The assembly of claim 1 wherein a wire jumper interconnects said bonding pin to said LED.
7. The assembly of claim 1 further including:
an optic lens member positioned adjacent to said conductive reflector, said optic lens member being spaced from said LED for focusing light rays emanating from said LED.
an optic lens member positioned adjacent to said conductive reflector, said optic lens member being spaced from said LED for focusing light rays emanating from said LED.
8. The assembly of claim 7 wherein said optic lens member is supported at least partially within said conductive reflector.
9. The assembly of claim 7 wherein said optic lens member is a ball optic for production of enhanced light power density.
10. The assembly of claim 7 wherein said optic lens member is a half ball optic for production of collimate light.
11. The assembly of claim 7 further including a conductive retaining sleeve supporting said heat pipe, said conductive reflector and said optic lens member.
12. The assembly of claim 11 wherein said conductive sleeve is placed in electrical continuity with said conductive reflector.
13. The assembly of claim 12 wherein said conductive sleeve is insulatively separated from said heat pipe.
14. The assembly of claim 12 wherein said conductive sleeve is insulatively separated from said heat pipe by an insulative adhesive which secures said sleeve to said heat pipe.
15. The assembly of claim 12 wherein said conductive sleeve is insulatively coated.
16. The assembly of claim 14 wherein said sleeve includes at least one passage therethrough adjacent said conductive reflector.
17. The assembly of claim 16 wherein said passage is filled with a conductive adhesive to establish conductive engagement between said sleeve and said reflector.
18. The assembly of claim 16 wherein said passage is electrically engaged with said sleeve and said reflector.
19. A method of forming a LED electro-optic assembly comprising the steps of:
conductively attaching at least one LED to a conductive heat pipe;
surrounding said LED with a conductive reflector, said reflector including a bonding pin extending through; and electrically engaging said bonding pin to said LED.
conductively attaching at least one LED to a conductive heat pipe;
surrounding said LED with a conductive reflector, said reflector including a bonding pin extending through; and electrically engaging said bonding pin to said LED.
20. A LED electro-optic electrical sleeve assembly comprising:
a generally cylindrical sleeve coated with an electrical insulator, having an upper portion and a lower portion, said upper and lower portion separated by an insulative member;
at least one LED and a conductive reflector having mounted at said upper portion, wherein said reflector surrounds said LED;
a conductive heat pipe having mounted at said lower portion, said LED in electrical engagement therewith;
a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin to said LED;
wherein said heat pipe and said reflector form an electrically conductive location for supplying power to said LED.
a generally cylindrical sleeve coated with an electrical insulator, having an upper portion and a lower portion, said upper and lower portion separated by an insulative member;
at least one LED and a conductive reflector having mounted at said upper portion, wherein said reflector surrounds said LED;
a conductive heat pipe having mounted at said lower portion, said LED in electrical engagement therewith;
a conductive bonding pin extending through said conductive reflector and in conductive engagement therewith; and an electrical engagement engaging said bonding pin to said LED;
wherein said heat pipe and said reflector form an electrically conductive location for supplying power to said LED.
21. The assembly of claim 20 further comprising a pair of slots located at an upper portion.
22. The assembly of claim 21 wherein said slots are coated with a conductive adhesive to bond said sleeve to the reflector.
23. The assembly of claim 21 wherein said reflector is bonded to said sleeve via an aluminum wire.
24. The assembly of claim 20 wherein said reflector is bonded to the heat pipe by said insulative member.
25. The assembly of claim 20 further comprising an optic lens member positioned adjacent to said reflector, said optic lens member being spaced and positioned from said LED for focusing light rays emanating from said LED.
26. The assembly of claim 25 wherein said upper portion retains said optic lens member.
27. The assembly of claim 25 wherein said optic lens member is supported at least partially within the reflector.
28. The assembly of claim 25 wherein said optic lens member is positioned completely outside said reflector.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57982404P | 2004-06-15 | 2004-06-15 | |
US60/579,824 | 2004-06-15 | ||
PCT/US2005/016900 WO2006001928A1 (en) | 2004-06-15 | 2005-05-13 | High power led electro-optic assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2589570A1 CA2589570A1 (en) | 2006-01-05 |
CA2589570C true CA2589570C (en) | 2010-04-13 |
Family
ID=35782111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2589570A Expired - Fee Related CA2589570C (en) | 2004-06-15 | 2005-05-13 | High power led electro-optic assembly |
Country Status (8)
Country | Link |
---|---|
US (2) | US7540634B2 (en) |
EP (1) | EP1766287B1 (en) |
JP (1) | JP2008503057A (en) |
CN (1) | CN100594327C (en) |
AT (1) | ATE553505T1 (en) |
CA (1) | CA2589570C (en) |
MX (1) | MXPA06014522A (en) |
WO (1) | WO2006001928A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2329756A (en) | 1997-09-25 | 1999-03-31 | Univ Bristol | Assemblies of light emitting diodes |
EP2298229A1 (en) | 2002-07-25 | 2011-03-23 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes for curing |
AU2003298561A1 (en) | 2002-08-23 | 2004-05-13 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes |
WO2006105638A1 (en) * | 2005-04-05 | 2006-10-12 | Tir Systems Ltd. | Electronic device package with an integrated evaporator |
US8030401B1 (en) | 2006-08-03 | 2011-10-04 | Henkel Corporation | Photoinitiated cationic epoxy compositions |
US7714037B1 (en) | 2006-12-15 | 2010-05-11 | Henkel Corporation | Photoinitiated cationic epoxy compositions and articles exhibiting low color |
FR2910483B1 (en) * | 2006-12-21 | 2010-07-30 | Inst Francais Du Petrole | METHOD OF CONVERTING CHARGES FROM RENEWABLE SOURCES IN GOODLY GASOLINE FUEL BASES. |
US7705064B2 (en) | 2007-07-23 | 2010-04-27 | Henkel Corporation | Photosensitive compounds, photopolymerizable compositions including the same, and methods of making and using the same |
CN101680620B (en) * | 2007-10-23 | 2013-05-01 | Lsi工业公司 | Device for holding and positioning an optic device and lighting assembly |
JP5503646B2 (en) * | 2008-07-03 | 2014-05-28 | コーニンクレッカ フィリップス エヌ ヴェ | SUPPORT MODULE FOR SOLID LIGHT SOURCE, LIGHTING DEVICE HAVING SUCH MODULE AND METHOD FOR PRODUCING SUCH LIGHTING DEVICE |
US8165434B2 (en) * | 2009-03-17 | 2012-04-24 | LumenFlow Corp. | High efficiency optical coupler |
US8192048B2 (en) * | 2009-04-22 | 2012-06-05 | 3M Innovative Properties Company | Lighting assemblies and systems |
WO2010132517A2 (en) * | 2009-05-12 | 2010-11-18 | David Gershaw | Led retrofit for miniature bulbs |
WO2010132526A2 (en) * | 2009-05-13 | 2010-11-18 | Light Prescriptions Innovators, Llc | Dimmable led lamp |
AT509016B1 (en) * | 2009-11-02 | 2012-12-15 | Mannheim Volker Dr | LIGHTING WITH AT LEAST ONE LED |
CN102074637B (en) * | 2009-11-19 | 2013-06-05 | 深圳市光峰光电技术有限公司 | Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure |
US8905573B2 (en) | 2011-01-13 | 2014-12-09 | Streamlight, Inc. | Portable light with hanger, clip and led module |
US9453624B2 (en) | 2011-01-13 | 2016-09-27 | Streamlight, Inc. | Portable light with light source module and light source module |
US9080084B2 (en) | 2011-07-25 | 2015-07-14 | Henkel IP & Holding GmbH | Photolytically induced redox curable compositions |
JP6224813B2 (en) * | 2013-03-13 | 2017-11-01 | オーエフエス ファイテル,エルエルシー | Light-emitting diode input for hybrid solar lighting systems |
US9357906B2 (en) | 2014-04-16 | 2016-06-07 | Engineered Medical Solutions Company LLC | Surgical illumination devices and methods therefor |
US20160106872A1 (en) * | 2014-10-17 | 2016-04-21 | Seth Martinez | Handheld device for destroying microorganisms |
US10940220B2 (en) | 2017-05-09 | 2021-03-09 | Crosby Innovations, LLC | Standalone UV-C sanitizing apparatus and method |
WO2018208933A1 (en) | 2017-05-09 | 2018-11-15 | Crosby Innovations, LLC | Handheld sanitizing device |
DE102020210845A1 (en) * | 2020-08-27 | 2022-03-03 | Siemens Energy Global GmbH & Co. KG | Microlens array and microoptical device |
Family Cites Families (174)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3512027A (en) * | 1967-12-12 | 1970-05-12 | Rca Corp | Encapsulated optical semiconductor device |
US3638013A (en) | 1969-04-02 | 1972-01-25 | Fiber Photics Inc | Dental apparatus utilizing fiber optics |
US3733481A (en) | 1970-06-11 | 1973-05-15 | Bausch & Lomb | Fiber optics light source |
US3712984A (en) | 1971-03-15 | 1973-01-23 | Canrad Precision Ind Inc | Instrument for transmitting ultraviolet radiation to a limited area |
US3868513A (en) | 1972-12-26 | 1975-02-25 | Dentsply Res & Dev | Ultraviolet radiation projector |
US3859536A (en) * | 1974-01-07 | 1975-01-07 | Corning Glass Works | Optical communication system source-detector pair |
US3970856A (en) | 1975-05-16 | 1976-07-20 | Cavitron Corporation | Ultraviolet light applicator |
US4184196A (en) | 1975-11-28 | 1980-01-15 | Moret Michel A | Diagnostic lamp, particularly for checking teeth |
FR2341815A1 (en) | 1976-02-23 | 1977-09-16 | Nath Guenther | DEVICE EMITTING RADIATION IN THE SPECTRAL ULTRAVIOLET AREA |
GB1578904A (en) | 1976-05-28 | 1980-11-12 | Kaltenbach & Voigt | Medical treatment chair |
US4048490A (en) | 1976-06-11 | 1977-09-13 | Union Carbide Corporation | Apparatus for delivering relatively cold UV to a substrate |
US4114274A (en) | 1976-11-12 | 1978-09-19 | Pelton & Crane Company | Movable power-operated instrument console and treatment chair apparatus |
JPS5396296A (en) | 1977-02-01 | 1978-08-23 | Morita Mfg | Stand for dental treatment |
DE7736502U1 (en) | 1977-09-27 | 1978-03-09 | Hamann, Arnold, 2061 Ahrensfelde | TREATMENT CHAIR WITH COLD LIGHT LAMP FOR DENTAL MEDICAL PURPOSES |
US4185891A (en) | 1977-11-30 | 1980-01-29 | Grumman Aerospace Corporation | Laser diode collimation optics |
AT355200B (en) | 1978-01-23 | 1980-02-25 | Espe Pharm Praep | RADIATION DEVICE FOR THE CURING OF RADIANT DIMENSIONS |
US4186748A (en) | 1978-02-06 | 1980-02-05 | Schlager Kenneth J | Thermographic apparatus for physical examination of patients |
US4229658A (en) | 1978-08-18 | 1980-10-21 | Dentsply Research & Development Corp. | Xenon light apparatus for supplying ultraviolet and visible spectra |
EP0011418A1 (en) | 1978-11-20 | 1980-05-28 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Manufacture of electroluminescent display devices |
US4230453A (en) | 1979-04-11 | 1980-10-28 | Litton Industrial Products Inc. | Light assembly for use with a dental handpiece |
US4346329A (en) * | 1979-08-27 | 1982-08-24 | Schmidt Robert C H | Aiming post light |
US4337759A (en) | 1979-10-10 | 1982-07-06 | John M. Popovich | Radiant energy concentration by optical total internal reflection |
US4385344A (en) | 1980-08-29 | 1983-05-24 | Dentsply Research & Development Corp. | Visible light apparatus for curing photo-curable compositions |
JPS5846817Y2 (en) | 1980-11-07 | 1983-10-25 | 株式会社 モリタ製作所 | dental treatment table |
DE3104239C2 (en) | 1981-02-06 | 1986-11-20 | Kaltenbach & Voigt Gmbh & Co, 7950 Biberach | Dental handpiece |
US4412134A (en) | 1981-07-15 | 1983-10-25 | Espe Fabrik Pharmazeutischer Praeparate Gmbh | Apparatus for irradiating dental objects |
US4445858A (en) | 1982-02-19 | 1984-05-01 | American Hospital Supply Corporation | Apparatus for photo-curing of dental restorative materials |
US4716296A (en) | 1982-04-26 | 1987-12-29 | Surgicorp | Apparatus for curing dental restorative composites |
US4450139A (en) | 1982-05-03 | 1984-05-22 | Solid State Systems, Corporation | Light generating apparatus for curing dental restorative composites |
US4836782A (en) | 1983-05-06 | 1989-06-06 | Dentsply Research & Development Corp. | Method for providing direct cool beam incident light on dental target |
US4666406A (en) | 1984-01-13 | 1987-05-19 | Kanca Iii John | Photocuring device and method |
US4729076A (en) | 1984-11-15 | 1988-03-01 | Tsuzawa Masami | Signal light unit having heat dissipating function |
FR2574616B1 (en) * | 1984-12-07 | 1987-01-23 | Radiotechnique Compelec | MATRIX OF ELECTRO-LUMINESCENT ELEMENT AND MANUFACTURING METHOD THEREOF |
US4610630A (en) | 1985-07-17 | 1986-09-09 | Progressive Machine Products, Inc. | Dental instrument stand |
DE3605278C1 (en) | 1986-02-19 | 1987-07-23 | Espe Pharm Praep | Circuit for feeding a dental photopolymerization device |
JPS62194652A (en) * | 1986-02-21 | 1987-08-27 | Hitachi Ltd | Semiconductor device |
DE3611132A1 (en) | 1986-04-03 | 1987-10-08 | Espe Stiftung | DENTAL RADIATION DEVICE |
US4673353A (en) | 1986-05-30 | 1987-06-16 | Nevin Donald M | Apparatus for applying a light-curable dental composition |
DE3719561C2 (en) | 1986-06-12 | 1998-12-10 | Morita Mfg | Medical light irradiation handpiece |
US4675785A (en) | 1986-07-31 | 1987-06-23 | Hubbell Incorporated | Heat distributing diode mounting assembly |
JPS63111886A (en) | 1986-10-29 | 1988-05-17 | 呉羽化学工業株式会社 | Cancer remedy apparatus using optical diode |
US4757381A (en) | 1987-03-05 | 1988-07-12 | Fuji Optical Systems, Inc. | Means and structure for prevention of cross contamination during use of dental camera |
FR2612764B1 (en) | 1987-03-26 | 1989-06-30 | Werly Marc | METHOD FOR SEALING A DENTAL CAVITY AND TOOL FOR IMPLEMENTING THE METHOD |
US4791634A (en) | 1987-09-29 | 1988-12-13 | Spectra-Physics, Inc. | Capillary heat pipe cooled diode pumped slab laser |
US4810194A (en) | 1987-11-04 | 1989-03-07 | Snedden John E | Disposable antiseptic dental shield |
US4935665A (en) | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
US4888489A (en) | 1988-05-09 | 1989-12-19 | Minnesota Mining And Manufacturing Company | Hand-held device for curing a dental restorative material |
US4846546A (en) | 1988-05-10 | 1989-07-11 | Joseph Cuda | Fiber optic light carrying curing probe |
US5316473A (en) | 1988-06-17 | 1994-05-31 | Dentsply Research & Development Corp. | Light curing apparatus and method |
US5003434A (en) | 1988-09-30 | 1991-03-26 | Den-Tal-Ez, Inc. | Miniature hand-held spot source of illumination |
KR910006706B1 (en) | 1988-12-12 | 1991-08-31 | 삼성전자 주식회사 | Manufacturing method of light emitted diode array head |
JPH02174272A (en) | 1988-12-17 | 1990-07-05 | Samsung Electron Co Ltd | Manufacture of light-emitting diode array |
US5046840A (en) | 1988-12-19 | 1991-09-10 | The Titan Corporation | Improvements in a system for determining atmospheric data relating to the movements of an airborne vehicle |
US4901324A (en) | 1988-12-19 | 1990-02-13 | Laser Diode Products, Inc. | Heat transfer device for cooling and transferring heat from a laser diode device and associated heat generating elements |
US5201655A (en) | 1988-12-21 | 1993-04-13 | Joshua Friedman | Optical light guide for controlling the irradiation of a dental restorative material |
US4963798A (en) | 1989-02-21 | 1990-10-16 | Mcdermott Kevin | Synthesized lighting device |
US5029335A (en) | 1989-02-21 | 1991-07-02 | Amoco Corporation | Heat dissipating device for laser diodes |
US5017140A (en) | 1989-05-15 | 1991-05-21 | Jay Ascher | Removable and disposable extension for a light guide of a dental curing light and its method of use |
US4948215A (en) | 1989-08-10 | 1990-08-14 | Joshua Friedman | Dental light-curing lamp unit with interchangeable autofocus light guides |
JPH0750767B2 (en) | 1989-09-07 | 1995-05-31 | マツダ株式会社 | Integrated circuit having metal substrate |
CA2007846C (en) | 1990-01-16 | 1996-12-10 | Randy Hood | Light guide coupling apparatus |
DE4028566C1 (en) | 1990-09-08 | 1992-03-05 | Heraeus Kulzer Gmbh, 6450 Hanau, De | |
US5150016A (en) | 1990-09-21 | 1992-09-22 | Rohm Co., Ltd. | LED light source with easily adjustable luminous energy |
US5115761A (en) | 1990-10-09 | 1992-05-26 | Efos Inc. | Light curing apparatus for a continuous linear product |
US5162696A (en) | 1990-11-07 | 1992-11-10 | Goodrich Frederick S | Flexible incasements for LED display panels |
US5160200A (en) * | 1991-03-06 | 1992-11-03 | R & D Molded Products, Inc. | Wedge-base LED bulb housing |
US5169632A (en) | 1991-03-28 | 1992-12-08 | Minnesota Mining And Manufacturing Company | Microcapsules from polyfunctional aziridines |
US5161879A (en) | 1991-04-10 | 1992-11-10 | Mcdermott Kevin | Flashlight for covert applications |
WO1993001486A1 (en) | 1991-07-12 | 1993-01-21 | Biotronics Technologies, Inc. | Atomic emission spectrometry |
US5147204A (en) | 1991-08-08 | 1992-09-15 | Minnesota Mining And Manufacturing Co. | Dental material curing apparatus |
US5173810A (en) | 1991-08-21 | 1992-12-22 | Aisens Co., Ltd. | Light transmitting lens for use with a photoelectric sensor |
US5195102A (en) | 1991-09-13 | 1993-03-16 | Litton Systems Inc. | Temperature controlled laser diode package |
CH685148A5 (en) * | 1991-11-20 | 1995-04-13 | Erik Larsen | Apparatus for the photodynamic stimulation of cells. |
US5233283A (en) | 1991-12-04 | 1993-08-03 | John Kennedy | Light curing device power control system |
US5253260A (en) | 1991-12-20 | 1993-10-12 | Hughes Aircraft Company | Apparatus and method for passive heat pipe cooling of solid state laser heads |
EP0553712A1 (en) | 1992-01-29 | 1993-08-04 | Kaltenbach & Voigt Gmbh & Co. | Laser treatment device, especially for medical or dental use |
JPH05304318A (en) | 1992-02-06 | 1993-11-16 | Rohm Co Ltd | Led array board |
US5242602A (en) | 1992-03-04 | 1993-09-07 | W. R. Grace & Co.-Conn. | Spectrophotometric monitoring of multiple water treatment performance indicators using chemometrics |
DE4211230C2 (en) | 1992-04-03 | 1997-06-26 | Ivoclar Ag | Rechargeable light curing device |
US5328368A (en) | 1992-04-20 | 1994-07-12 | Pinnacle Products | Dental cure light cover |
JPH06291428A (en) | 1992-05-08 | 1994-10-18 | Stanley Electric Co Ltd | Circuit board |
EP0920840A3 (en) | 1992-07-31 | 2000-03-29 | Molten Corporation | Small-sized light irradiator for dental use |
US5387800A (en) | 1992-08-19 | 1995-02-07 | Dymax Corporation | Prefocused lamp and reflector assembly |
US5265792A (en) | 1992-08-20 | 1993-11-30 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
CA2079698C (en) | 1992-10-02 | 1999-08-10 | John Kennedy | An unbreakable disposable photocuring guide |
US5290169A (en) | 1992-11-02 | 1994-03-01 | Joshua Friedman | Optical light guide for dental light-curing lamps |
US5309457A (en) | 1992-12-22 | 1994-05-03 | Minch Richard B | Micro-heatpipe cooled laser diode array |
US5302124A (en) | 1993-03-25 | 1994-04-12 | Pinnacle Products, Inc. | Disposable protective sleeve for dental apparatus such as light curing guns |
US5616141A (en) | 1993-04-09 | 1997-04-01 | Ion Laser Technology | Laser system for use in dental procedures |
US5457611A (en) | 1993-07-09 | 1995-10-10 | Gregg Laboratories, Inc. | Ambient air cooled light emitting instrument |
US5445608A (en) | 1993-08-16 | 1995-08-29 | James C. Chen | Method and apparatus for providing light-activated therapy |
US5371753A (en) | 1993-08-26 | 1994-12-06 | Litton Systems, Inc. | Laser diode mount |
US5371826A (en) | 1993-08-27 | 1994-12-06 | Demetron Research Corp. | Dental fiber optic light bundle with uniform taper |
US5420768A (en) | 1993-09-13 | 1995-05-30 | Kennedy; John | Portable led photocuring device |
JP2596646Y2 (en) | 1993-09-14 | 1999-06-21 | 株式会社モリテックス | Cordless light irradiator |
IT1272050B (en) * | 1993-11-10 | 1997-06-11 | Olivetti Canon Ind Spa | PARALLEL PRINTER DEVICE WITH MODULAR STRUCTURE AND RELATED CONSTRUCTION PROCEDURE. |
US5487662A (en) | 1994-03-22 | 1996-01-30 | Minnesota Mining And Manufacturing Company | Dental impression tray for photocurable impression material |
JP2596709B2 (en) | 1994-04-06 | 1997-04-02 | 都築 省吾 | Illumination light source device using semiconductor laser element |
US5521392A (en) | 1994-04-29 | 1996-05-28 | Efos Canada Inc. | Light cure system with closed loop control and work piece recording |
US5698866A (en) * | 1994-09-19 | 1997-12-16 | Pdt Systems, Inc. | Uniform illuminator for phototherapy |
US5504764A (en) | 1994-11-30 | 1996-04-02 | The United States Of America As Represented By The Secretary Of The Army | Micro-heatpipe cooling of solid-state slab |
US5660461A (en) | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
US5522225A (en) | 1994-12-19 | 1996-06-04 | Xerox Corporation | Thermoelectric cooler and temperature sensor subassembly with improved temperature control |
US5707139A (en) * | 1995-11-01 | 1998-01-13 | Hewlett-Packard Company | Vertical cavity surface emitting laser arrays for illumination |
US6046460A (en) * | 1995-11-17 | 2000-04-04 | Ivoclar Ag | Light curing device |
US5711665A (en) * | 1995-12-19 | 1998-01-27 | Minnesota Mining & Manufacturing | Method and apparatus for bonding orthodontic brackets to teeth |
US5617492A (en) | 1996-02-06 | 1997-04-01 | The Regents Of The University Of California | Fiber optic coupling of a microlens conditioned, stacked semiconductor laser diode array |
DE19613566C2 (en) * | 1996-04-04 | 1998-03-12 | Peter Rechmann | Device and method for curing a light-curing plastic filling material |
CA2251551C (en) * | 1996-04-11 | 2004-01-20 | Nikolai Taimurazovich Bagraev | Method for treating pathological conditions of tissues with non-coherent radiation and device therefor |
US5703394A (en) * | 1996-06-10 | 1997-12-30 | Motorola | Integrated electro-optical package |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
TW346391B (en) * | 1996-09-20 | 1998-12-01 | Kuraray Co | Method of polymerizing photo-polymerizable composition for dental use and dental light-curing apparatus for use therewith |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
DE29709228U1 (en) * | 1997-05-26 | 1998-09-24 | Thera Ges Fuer Patente | Light curing unit |
US6200134B1 (en) * | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
US6068474A (en) * | 1998-01-30 | 2000-05-30 | Ivoclar Ag | Light curing device |
US6113212A (en) * | 1998-04-16 | 2000-09-05 | Eastman Kodak Company | Method and apparatus for thermal control of LED printheads |
US6208788B1 (en) * | 1998-07-29 | 2001-03-27 | Ultradent Products, Inc. | Apparatus and methods for concentrating light through fiber optic funnels coupled to dental light guides |
JP4290887B2 (en) * | 1998-09-17 | 2009-07-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED bulb |
US6454789B1 (en) * | 1999-01-15 | 2002-09-24 | Light Science Corporation | Patient portable device for photodynamic therapy |
EP1031326A1 (en) * | 1999-02-05 | 2000-08-30 | Jean-Michel Decaudin | Device for photo-activation of photosensitive composite materials especially in dentistry |
US20030015667A1 (en) * | 1999-05-12 | 2003-01-23 | Macdougald Joseph A. | Curing unit |
DE19923564A1 (en) * | 1999-05-21 | 2000-11-23 | Manfred Franetzki | Dental instrument has energy reservoir contained in handle to reduce clutter in patient treatment area so that dentist operating efficiency is increased |
US6371636B1 (en) * | 1999-05-24 | 2002-04-16 | Jam Strait, Inc. | LED light module for vehicles |
US6193510B1 (en) * | 1999-07-28 | 2001-02-27 | Efraim Tsimerman | Medical device with time-out feature |
US6345982B1 (en) * | 1999-09-01 | 2002-02-12 | Darcy M. Dunaway | Dental light controller and concentrator |
US6171105B1 (en) * | 1999-09-21 | 2001-01-09 | Eg&G Ilc Technology, Inc. | Dental-restoration light-curing system |
US6981867B2 (en) * | 1999-09-24 | 2006-01-03 | Cao Group, Inc. | Curing light |
US6719558B2 (en) * | 1999-09-24 | 2004-04-13 | Densen Cao | Curing light |
US6988891B2 (en) * | 1999-09-24 | 2006-01-24 | Cao Group, Inc. | Curing light |
US7094054B2 (en) * | 1999-09-24 | 2006-08-22 | Cao Group, Inc. | Dental curing light |
US6186786B1 (en) * | 1999-12-02 | 2001-02-13 | Addent Inc. | Dental instrument |
US6350041B1 (en) * | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
CA2394202A1 (en) * | 1999-12-17 | 2001-06-21 | The Ohio State University | Heat engine |
US6492725B1 (en) * | 2000-02-04 | 2002-12-10 | Lumileds Lighting, U.S., Llc | Concentrically leaded power semiconductor device package |
DE10011892A1 (en) * | 2000-03-03 | 2001-09-20 | Jenoptik Jena Gmbh | Mounting substrate and heat sink for high-performance diode laser bars |
US6554463B2 (en) * | 2000-05-19 | 2003-04-29 | Addent Inc. | Optical waveguide concentrator and illuminating device |
DE10038213A1 (en) * | 2000-08-04 | 2002-03-07 | Osram Opto Semiconductors Gmbh | Radiation source and method of making a lens mold |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
US6552368B2 (en) * | 2000-09-29 | 2003-04-22 | Omron Corporation | Light emission device |
JP2002134825A (en) * | 2000-10-20 | 2002-05-10 | Furukawa Electric Co Ltd:The | Laser diode module and mounting substrate |
US6398383B1 (en) * | 2000-10-30 | 2002-06-04 | Yu-Hwei Huang | Flashlight carriable on one's person |
JP4646166B2 (en) * | 2000-11-08 | 2011-03-09 | 古河電気工業株式会社 | Light source consisting of a laser diode module |
JP4690536B2 (en) * | 2000-11-24 | 2011-06-01 | 古河電気工業株式会社 | Light source consisting of laser diode module |
CA2332190A1 (en) * | 2001-01-25 | 2002-07-25 | Efos Inc. | Addressable semiconductor array light source for localized radiation delivery |
US6695614B2 (en) * | 2001-02-01 | 2004-02-24 | Ivoclar Vivadent Ag | Light beam hardening apparatus for curing material |
JP2002246650A (en) * | 2001-02-13 | 2002-08-30 | Agilent Technologies Japan Ltd | Light-emitting diode and its manufacturing method |
JP2002280659A (en) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | Light source constituted of laser diode module |
TW567742B (en) * | 2001-03-22 | 2003-12-21 | Ind Tech Res Inst | Cooling apparatus of liquid crystal projector |
US6709128B2 (en) * | 2001-03-26 | 2004-03-23 | Ocumed, Inc. | Curing system |
JP4050482B2 (en) * | 2001-04-23 | 2008-02-20 | 豊田合成株式会社 | Semiconductor light emitting device |
US6511317B2 (en) * | 2001-04-26 | 2003-01-28 | New Photonic, Llc | Device for curing photosensitive dental compositions with off-axis lens and method of curing |
US7001057B2 (en) * | 2001-05-23 | 2006-02-21 | Ivoclar Vivadent A.G. | Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof |
US20030036031A1 (en) * | 2001-08-20 | 2003-02-20 | Lieb Joseph Alexander | Light-emitting handpiece for curing photopolymerizable resins |
US6827468B2 (en) * | 2001-12-10 | 2004-12-07 | Robert D. Galli | LED lighting assembly |
US6692252B2 (en) * | 2001-12-17 | 2004-02-17 | Ultradent Products, Inc. | Heat sink with geometric arrangement of LED surfaces |
KR100991830B1 (en) * | 2001-12-29 | 2010-11-04 | 항조우 후양 신잉 띠앤즈 리미티드 | A LED and LED lamp |
US6702576B2 (en) * | 2002-02-22 | 2004-03-09 | Ultradent Products, Inc. | Light-curing device with detachably interconnecting light applicator |
JP3912607B2 (en) * | 2002-06-19 | 2007-05-09 | サンケン電気株式会社 | Manufacturing method of semiconductor light emitting device |
US7134875B2 (en) * | 2002-06-28 | 2006-11-14 | 3M Innovative Properties Company | Processes for forming dental materials and device |
JP4241184B2 (en) * | 2002-07-25 | 2009-03-18 | パナソニック電工株式会社 | Photoelectric component |
US7182597B2 (en) * | 2002-08-08 | 2007-02-27 | Kerr Corporation | Curing light instrument |
US20040032728A1 (en) * | 2002-08-19 | 2004-02-19 | Robert Galli | Optical assembly for LED chip package |
DE10242366B4 (en) * | 2002-09-12 | 2010-10-21 | Ivoclar Vivadent Ag | Light curing device for curing light-curable materials |
US20040070990A1 (en) * | 2002-10-01 | 2004-04-15 | Witold Szypszak | LED illuminator and method of manufacture |
US6880954B2 (en) * | 2002-11-08 | 2005-04-19 | Smd Software, Inc. | High intensity photocuring system |
US6994546B2 (en) * | 2002-12-18 | 2006-02-07 | Ultradent Products, Inc. | Light curing device with detachable power supply |
US6991356B2 (en) * | 2002-12-20 | 2006-01-31 | Efraim Tsimerman | LED curing light |
US6921971B2 (en) * | 2003-01-15 | 2005-07-26 | Kyocera Corporation | Heat releasing member, package for accommodating semiconductor element and semiconductor device |
US6999318B2 (en) * | 2003-07-28 | 2006-02-14 | Honeywell International Inc. | Heatsinking electronic devices |
US20050077865A1 (en) * | 2003-08-26 | 2005-04-14 | Intermec Ip Corp. | Portable computing device peripheral employing fuel cell to recharge battery |
WO2005031894A2 (en) * | 2003-09-22 | 2005-04-07 | New Option Lighting, Llc | Process and apparatus for improving led performance |
US7321161B2 (en) * | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
CN101014295A (en) * | 2004-07-02 | 2007-08-08 | 底斯柯斯牙齿印模公司 | Curing light device having a reflector |
-
2005
- 2005-05-13 CA CA2589570A patent/CA2589570C/en not_active Expired - Fee Related
- 2005-05-13 AT AT05756045T patent/ATE553505T1/en active
- 2005-05-13 EP EP05756045A patent/EP1766287B1/en not_active Not-in-force
- 2005-05-13 CN CN200580024181A patent/CN100594327C/en not_active Expired - Fee Related
- 2005-05-13 JP JP2007516500A patent/JP2008503057A/en active Pending
- 2005-05-13 US US11/629,591 patent/US7540634B2/en active Active
- 2005-05-13 MX MXPA06014522A patent/MXPA06014522A/en active IP Right Grant
- 2005-05-13 WO PCT/US2005/016900 patent/WO2006001928A1/en active Application Filing
-
2006
- 2006-12-14 US US11/640,645 patent/US20070091618A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1766287B1 (en) | 2012-04-11 |
JP2008503057A (en) | 2008-01-31 |
CA2589570A1 (en) | 2006-01-05 |
EP1766287A4 (en) | 2007-07-18 |
US7540634B2 (en) | 2009-06-02 |
WO2006001928A1 (en) | 2006-01-05 |
US20070091618A1 (en) | 2007-04-26 |
ATE553505T1 (en) | 2012-04-15 |
US20080273329A1 (en) | 2008-11-06 |
MXPA06014522A (en) | 2007-03-23 |
CN100594327C (en) | 2010-03-17 |
CN101031751A (en) | 2007-09-05 |
EP1766287A1 (en) | 2007-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2589570C (en) | High power led electro-optic assembly | |
US7847480B2 (en) | Light emitting diode unit and method for manufacturing light emitting diode unit | |
US6452217B1 (en) | High power LED lamp structure using phase change cooling enhancements for LED lighting products | |
JP4621681B2 (en) | Improved LED lighting module | |
US7275841B2 (en) | Utility lamp | |
US6974234B2 (en) | LED lighting assembly | |
US8330342B2 (en) | Spherical light output LED lens and heat sink stem system | |
US20070030676A1 (en) | Light-emitting module and light-emitting unit | |
US9360190B1 (en) | Compact lens for high intensity light source | |
JP2011253622A (en) | Light source unit of semiconductor type light source of lighting fixture for vehicle, lighting fixture for vehicle | |
KR100751084B1 (en) | Light emitting device | |
CA2585755C (en) | Led assembly with led-reflector interconnect | |
KR100893033B1 (en) | Led electro-optically assembly and method of forming the same | |
JP2014192144A (en) | Lighting lamp, lighting device and manufacturing method of lighting lamp | |
JP5891398B2 (en) | lighting equipment | |
CN113410748A (en) | Laser light source packaging structure | |
CN117080858A (en) | Circumferential array integrated semiconductor laser | |
CN112823762A (en) | Wide-spectrum light curing lamp bead, light emergent fusion method thereof and dental light curing machine | |
CN112066275A (en) | LED light source module and lighting device | |
BR102018012912A2 (en) | Secondary optics system included in lamp and luminaire with LED electronic board | |
IE84147B1 (en) | A utility lamp | |
IE20050086U1 (en) | A utility lamp | |
IES84104Y1 (en) | A utility lamp |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20130513 |