CA2590622C - Identification system - Google Patents

Identification system Download PDF

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Publication number
CA2590622C
CA2590622C CA2590622A CA2590622A CA2590622C CA 2590622 C CA2590622 C CA 2590622C CA 2590622 A CA2590622 A CA 2590622A CA 2590622 A CA2590622 A CA 2590622A CA 2590622 C CA2590622 C CA 2590622C
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CA
Canada
Prior art keywords
signal
release system
receiving unit
output unit
specific coding
Prior art date
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Active
Application number
CA2590622A
Other languages
French (fr)
Other versions
CA2590622A1 (en
Inventor
Wolfgang Clemens
Walter Fix
Andreas Ullmann
Werner Reinhart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leonhard Kurz Stiftung and Co KG
PolyIC GmbH and Co KG
Original Assignee
Leonhard Kurz Stiftung and Co KG
PolyIC GmbH and Co KG
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Publication date
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Publication of CA2590622A1 publication Critical patent/CA2590622A1/en
Application granted granted Critical
Publication of CA2590622C publication Critical patent/CA2590622C/en
Active legal-status Critical Current
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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073Special arrangements for circuits, e.g. for protecting identification code in memory
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

Abstract

The invention relates to a security element in the form of a flexible, multilayer film body and to an identification system comprising a security element of this type. The security element has a receiving unit (61) for receiving an electromagnetic verification signal (7) containing a specific coding from a verification device, an output unit (66) for outputting an enable signal, and an electronic release system (63, 64, 65) having active and/or passive organic components. The electronic release system (63, 64, 65) checks whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit (66) for outputting the enable signal if the signal received by the receiving unit (61) contains the specific coding.

Description

Identification system The invention relates to an identification system, and to a security element in the form of a flexible, multilayer film body for use in an identification system.

It is known to provide merchandize, articles or security documents with information that can be read out electronically, by means of so-called RFID
transponders (RFID = Radio Frequency Identification).
Usually, such RFID transponders essentially comprise two components, an antenna and a silicon chip. Antenna and silicon chip are mounted on a common carrier substrate and electrically connected to one another by means of contact-connection. The RF carrier (RF - Radio Frequency) transmitted by the base station is fed back to the base station and an item of identification information is modulated onto the fed-back signal.
Furthermore, DE 101 41 440 Cl describes an RFID
transponder constructed - with the exception of the antenna - substantially from organic components.

The carrier signal emitted by a base station is coupled into an antenna resonant circuit of the RFID
transponder and the induced voltage is then rectified.
The rectified voltage supplies a logic IC of the RFID
transponder that drives a modulation transistor. The modulation transistor is driven by the logic IC with a bit sequence representing the identification information, so that the attenuation of the resonant circuit is modulated according to the binary signal.
The antenna's radiating behavior that changes as a result of this is detected by the base station and acquired as response signal of the RFID transponder.
Organic circuits are significantly slower than conventional silicon-based circuits since organic semiconductors generally have lower charge carrier mobility than silicon and organic field effect transistors are based on the principle of charge carrier accumulation rather than on the principle of charge carrier inversion, which results in a lower switching speed in comparison with silicon transistors and a different switching behavior (e.g. unsuitability for AC voltage). This restricts the area of application of electronic circuits composed of organic components and demands novel circuit concepts - in comparison with conventional circuits based on silicon technology.

WO 00/07151 furthermore describes the application of RFID technology for safeguarding valuable documents, for example banknotes, checks, share certificates and the like. The output signal emitted by the RFID
transponder and containing the items of identification information constitutes an authenticity feature and is checked in order to check the authenticity of the security document. The output signal emitted by the RFID transponder when the carrier frequency is coupled in contains e.g. the individual serial number of the security document, which is furthermore also printed on the security document. By checking these two items of information, it is ascertained whether or not the security document is a forgery.

EP 1 134 694 Al likewise describes the application of a transponder to a security document. In this case, too, the transponder serves as a feature for identifying forgeries or for locating the document.

Furthermore WO 03/057501 Al describes applying an electronic circuit to a valuable or security document, at least one element of the electronic circuit being printed onto the valuable or security document. In this case, this imprint can be effected by means of electrically conductive printing inks.

_ 3 -In this case, the electronic circuit has a power sOurce in the form of a printed battery, solar cell or an antenna. The electronic circuit furthermore has an output device, for example an LED.
An apparatus for checking the valuable or security document detects the properties of the field emitted by said output device, compares the properties with predefined properties and thus determines whether or not the valuable or security document is genuine.

In a manner similar to that in the above-described application of an RFID transponder on a security document, an identification signal emitted by the security document is thus checked for the purpose of determining the authenticity of the security document.
In this case, what is disadvantageous about such methods is that checking the authenticity of the security documents can only be carried out with technically complicated apparatuses.

The invention is based on the object of specifying an improved identification system, in particular for identifying the authenticity of security documents.

This object is achieved by a security element in the form of a flexible, multilayer film body, which security element has a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device, an output unit for outputting an enable signal and an electronic release system constructed at least partly from active and/or passive organic components, wherein the electronic release system is configured in such a way that it checks whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding. This object is furthermore achieved by an identification system comprising a verification device and at least one security element in the form of a flexible multilayer film body, in which the verification device is provided with a transmitting device for emitting an electromagnetic verification signal containing a specific coding, and the security element has a receiving unit for receiving the verification signal, an output unit for outputting an enable signal, and an electronic release system constructed at least partly from active and/or passive organic components, which electronic release system checks whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding.

The invention makes it possible to provide security features which both afford a high degree of security against forgery and can be produced cost-effectively and can be checked for their authenticity with little expenditure in terms of time and costs. The checking of the security elements is configured in a particularly simple manner in this case. For example, it is not necessary to check a serial number that is output by the security element and, under certain circumstances, comprises a multiplicity of numerals. The checking of the security feature is feasible with little outlay, even for the layperson. The security element comprises a flexible, multilayer film body with active and/or passive organic components, so that imitation of the security feature by means of generally accessible technologies, for example by means of electronic circuits based on silicon technology, is only feasible with high outlay or at least immediately recognizable.
Furthermore, the invention affords the possibility by increasing the complexity of the verification device, of improving the security against forgery afterward without making changes in the security elements, for example by checking the reaction of the security element to changes in the verification signal.
Consequently, increasing protection against forgeries does not necessitate replacing a multiplicity of security elements that are already in circulation.
Furthermore, it is thereby possible to realize a gradated checking of the security feature depending on the respective requirements.

Advantageous configurations of the invention are presented in the subclaims.

The verification device can additionally be provided with sensor-technological elements for detecting influences such as pressure, temperature, moisture.

It is particularly advantageous if an optical output unit for outputting an optical enable signal is used as the output unit. The output unit has, by way of example, one or more electrochromic elements, thermochromic elements, electrophoretic elements or liquid crystalline elements (liquid crystal = LC) or organic light emitting diodes. The enable signal can thus be detected directly and unambiguously by the observer. Furthermore, it is also possible for the enable signal to be conveyed to the user acoustically or via the sense of touch for example by means of a piezoelement or a loudspeaker, olfactorily (e.g. sense of smell) or thermally (cooling or heating element).
Furthermore, there is the possibility of outputting the enable signal as machine-readable information that can be detected by the verification device. It is possible, for example, to output as the enable signal an electromagnetic signal that can be detected by a receiver (antenna, photosensor,...) of the verification device. An outputting of an electrical signal via conductive contacts is likewise possible. Furthermore, the abovementioned embodiment variants can be combined with one another.

The receiving unit of the security element preferably has an antenna structure comprising a structured electrically conductive layer for receiving the electromagnetic verification signal. In this case, the antenna structure is adapted in terms of its size and shaping to the coupling method and frequency range used by the verification signal. Furthermore, it is possible in this case, too, to provide two or more antennas for example for different frequencies. Frequency ranges that can be used are e.g. 125-135 MHz, 13-14 MHz, 6-8 MHz, 20-40 MHz, 860-950 MHz or 1.7-2.5 GHz. The electromagnetic coupling can be effected inductively, capacitively or by dipole interaction; this depends on the transmitter, the antenna and the distance between transmitter and antenna. RF sources used may be transmitters specially constructed for this or else RFID transmitters, mobile radio terminals, radio interfaces, RF television signals, and also infrared (IR) and UV sources.

Furthermore, it is also possible for the electromagnetic verification signal to lie in the range of visible light, in the infrared range or W range, and for the receiving unit to be provided with corresponding sensors, for example a photodiode or solar cell, for receiving such electromagnetic radiation. Preferably, such sensors are at least partly constructed from organic layers.

The electronic release system preferably comprises one or more layers that comprise layers composed of organically conductive and/or semiconducting materials and are produced by printing technology. In this case, the electronic release system preferably comprises passive organic components, for example organic diodes, and also active organic components, for example organic field effect transistors or organic memory elements.

In one preferred exemplary embodiment of the invention, the electronic release system checks the signal received by the receiving unit in respect of whether the signal waveform of the signal corresponds to the specific coding. In the simplest case, for this purpose, the electronic release system checks the frequency and/or the amplitude of the received signal in respect of whether it corresponds to a predetermined value. In the simplest case, therefore, the coding is provided solely by a specific largely fixed RF carrier frequency. Thus, the electronic release system determines, for example by means of a bandpass filter and a window discriminator connected downstream, whether the received signal has signal components (of a predetermined field strength) in a predetermined frequency range. By connecting a plurality of such circuits in parallel, which, under certain circumstances, are connected to one another by means of a logic gate, it is possible to check the presence of complex signal waveforms using organic components.

Furthermore, it is possible for the electronic release system to check the signal received by the receiving unit in respect of the direction from which the signal impinges on the security element, and to drive the output unit for outputting the enable signal only when the signal received by the receiving unit impinges on the security element from a predetermined direction. It is thus possible, for example, for the receiving unit to have a plurality of antenna structures which are arranged in a phased array arrangement and are connected to the electronic release system. After evaluation of the signals received by the various antenna structures, it is possible for the e'lectronic release system to determine the direction of incidence of the verification signal. The enable signal is output only when the security element is held in a specific position with respect to the verif.ication device. If the .security element is rotated, for example, then an organic light emitting diode or any other output element that outputs an enable signal lights up only at a specific angular position with respect to the verification device.

In accordance with a further advantageous exemplary embodiment of the invention, the enable signal is output only when a predetermined combination of different types of input signals that can be detected is present. The verification signal thus comprises a specific combination of different types of input signals, for example RF + light, light + pressure or RF, IR + temperature. The electronic release system checks the combination of the input signals in respect of whether or not it contains the specific coding, e.g.
the specific combination, and drives the output unit accordingly.

In accordance with a further preferred exemplary embodiment of the invention, the electronic release system checks the signal received by the receiving unit in respect of whether the change in the signal waveform of the signal corresponds to the specific coding. Thus, the electronic release system checks, by way of example, whether the change in the frequency, the phase and/or the amplitude of the received signal corresponds to predetermined values. By way of example, the electronic release system determines, by means of the assembly described above, at specific time intervals, the signal strength in specific frequency bands, compares the latter with specific threshold values and stores the signal thus obtained in a shift register serving as a buffer. By comparing the signal pattern stored in the shift register with a signal pattern stored in an organic memory, it is then determined ,whether the change in the signal waveform of the received signal corresponds to the specific coding.
Furthermore, it is also possible for the electronic release system to demodulate the signal received by the receiving unit and to check a code word contained in the demodulated signal in respect of whether it corresponds to the specific coding. The signal received by the receiving unit is thus fed to a low-pass filter, for example, converted into a binary signal and compared with a predetermined code stored in an organic memory.

The security element furthermore has a power supply unit for feeding the electronic release system and the output unit. The power supply unit comprises, by way of example, a battery, a solar cell, or else an antenna with downstream rectification and storage capacitor for coupling in radiated-in HF power (HF = High Frequency).
Furthermore, different power supply units can also be combined, e.g. rechargeable batteries with solar cells.
It is advantageous in this case to integrate all these elements in the multilayer film body.
Furthermore, it is also possible for the security element optionally to have a sensor unit by means of which, by way of example, pressure, temperature or moisture are detected and fed as input signal to the electronic release system. The enable signal is then also emitted in a manner dependent on the values determined by said sensors.

The invention is explained below by way of example on the basis of a plurality of exemplary embodiments with the aid of the accompanying drawings.

Figure 1 shows a schematic illustration of an identification system according to the invention with a verification device and a security element.

Figure 2 shows a block diagram of the security element according to Figure 3.

Figure 3 shows a schematic illustration of the construction of a security element according to the invention.
Figure 1 shows an identification system comprising a verification device 1, comprising an object 2 to be safeguarded, and comprising a security element 3.

The object 2 to be safeguarded is a security document such as, for example, an ID document or a banknote, a product, a product packaging or product wrapping. The security element 3 is applied to the object 2 to be safeguarded for example by hot embossing, lining, adhesive bonding or laminating. The security element 3 is thus applied for example to a carrier material of the object to be safeguarded or to the product surface itself, for example to paper, cardboard, coated paper, a plastic, a plastic film e.g. made of polyester or PVC, or a coated film. Furthermore, it is also possible for the security element 3 to be integrated into the object to be safeguarded, for example by laminating the security element in between two plastic layers of the object to be safeguarded.
The security element 3 comprises a multilayer, flexible film body comprising one or more electrical functional layers. The electrical functional layers of the film body comprise (organically) conductive layers, organically semiconducting layers, and/or organic insulator layers, which are arranged one above another, at least partly in structured form. Alongside said electrical functional layers, the multilayer film body optionally also comprises one or more carrier layers, protective layers, decorative layers, adhesion promoting layers or adhesive layers.

The electrically conductive functional layers preferably comprise a conductive, structured metallization, preferably made of gold or silver.
However, provision may also be made for forming sai.d functional layers from an inorganic electrically conductive material, for example indium tin oxide, or a conductive polymer, for example polyaniline or polypyrrole.

The organic semiconducting functional layers comprise for example conjugated polymers such as polythiophenes, polythienylene vinylenes or polyfluorene derivatives, which are applied from solution by spin-coating, blade coating or printing. So-called "small molecules", that is to say oligomers such as sexithiophene or pentacene, which are vapor-deposited by means of a vacuum technique are also suitable as organic semiconductor layer. These organic layers are preferably applied already in a partially structured manner or in a manner structured in patterned fashion by means of a printing method (intaglio printing., screen printing, pad printing). For this purpose, the organic materials provided for the layers are formed as soluble polymers, where the term polymer in this case, as already described further above, also includes oligomers and "small molecules".
The verification device 1 has a transmitting device 11, which emits an electromagnetic verification signal 4 containing a specific coding. The verification device 1 may be a specific device developed for checking the authenticity of the security element 3. However, it is also possible for the verification device to be a device that is only additionally used for this purpose.
Thus, the verification device 1 may be, by way of example, a mobile radio terminal, computer or PDA (=

Personal Digital Assistant). In this case, the transmitting device is formed by a GSM/UMTS transceiver or a transceiver for a radio interface for the near range, for example Bluetooth.
As a result of the interaction of the electrical functional layers of the security element 3, the electrical functions of the security element 3 that are described below with reference to Figure 2 are provided when the electromagnetic verification signal 4 impinges on the security element 3.

Figure 2 shows an electrical-functional schematic illustration of the security element 3 with various electrical functional groups 31 to 35 implemented in the security element 3.

As indicated in Figure 2, the functional groups 31 to 35 preferably form separate systems that are connected to one another via electrical contact points.

The electrical functional group 31 is a receiving unit 31 for receiving the verification signal 4. If an RF
signal is used as the verification signal 4, then the functional group 31 comprises an antenna structure adapted to the frequency range and the intended coupling method of the verification signal 4. Said antenna structure is formed by one or more structured, electrically conductive layers or layer regions of the multilayer flexible film body.

The electrical functional group 34 has one or more sensors that detect additional input signals. In this case, said sensors detect for example pressure, temperature, visible light, UV radiation or IR
radiation and forward an electrical signal that represents the detected quantities to the functional group 34. The functional group 34 could also be dispensed with.

The electrical functional group 35 is a power supply unit. The electrical functional group 35 can also be dispensed with if the power of the verification signal 4 that is coupled into the functional group 31 is used for operating the rest of the functional groups 32, 33 and, under certain circumstances, 34.

The electrical functional group 33 is an output unit 33 for outputting an enable signal. The functional group 33 preferably comprises an electrochromic element, a thermochromic element, an electroluminescent element, an electrophosphorescent element, a liquid crystal element or an organic light emitting diode, which output an optical enable signal in response to a corresponding electrical input signal. The electrical functional group 33 is thus generally formed by three or more layers or layer regions of the flexible multilayer film body that lie one above another and comprise two structured electrically conductive electrode layers and at least one optically active layer lying in between. In this case, it is also possible for the electrical functional group 33 to have two or more interconnected elements of this type. In addition, the functional group 33 can also have a piezoelement for generating a sound signal or a signal that can be detected by tactile means, and/or an element for generating a signal that can be detected thermally or by the sense of smell.
The electrical functional group 32 is an electronic release system comprising one or more active and/or passive, interconnected organic components. The electrical functional group 32 is thus formed by at least three layers or layer regions of the flexible multilayer film body that lie one above another and have at least two structured electrically conductive electrode layers and at least one electrical functional layer lying in between. One or more active and/or passive, interconnected organic components are thereby formed. In this case, the electronic release system preferably comprises passive.organic components, for example organic diodes, and also active organic components, for example organic field effect transistors or organic memory elements.

The electronic release system realized by the interconnection of the electrical components of the functional group 32 checks whether or not a signal received by the functional group 31 contains the specific coding, and drives the functional group 33 for outputting the enable signal if the signal received by the functional group 31 contains the specific coding.
In the simplest case, the functional group 32 together with the functional group 31 forms a selective resonant circuit which is formed by an antenna and an organic capacitor and which can only be excited with an entirely specific frequency/frequency bandwidth. For the case of the suitable frequency, an optical element of the functional group is altered by current or voltage applied by the functional group 33. Preferably, the optical element is in this case altered by a DC
current or a DC voltage, which are generated by organic components, e.g. an organic diode. In this case, the functional group 32 can furthermore have an organic field effect transistor which is connected up as a window discriminator and which drives the functional group 32. In this case, said organic field effect transistor can furthermore be connected to one or more upstream organic components that realize a further bandpass filter, to an additional coupling antenna serving for power supply or selection of further frequencies, or to some other power supply.

Figure 3 shows a schematic illustration of a further electrical-functional configuration of the security element 3.

Figure 3 shows a transmitting device 5, a verification signal 5 and a plurality of electrical components 61 to 66 that are connected to one another and implemented by the interaction of the electrical functional layers of the multilayer film body. The illustration chosen in Figure 3 indicates the spatial arrangement of these electrical components with respect to a vertical sectional plane of the multilayer film body.
The component 61 is an antenna. The component 62 is an organic capacitor . The components 63 and 64 form an organic rectifier having e.g. an organic diode and an organic field effect transistor. The component 65 is an organic circuit element that implements a logic operation.

As indicated in Figure 3, the signal waveform, here the amplitude, of the electromagnetic signal emitted by the transmitting device 5 onto the security element changes.

The selective resonant circuit formed by the components 61 and 62 is designed in such a way that it can be excited by the transmitter 5 only with a specific frequency or within a specific, narrowly limited frequency band. The voltage present at the resonant circuit is tapped off via the organic rectifier and fed to the organic circuit element 65. The specific code word that is contained in the signal 7 in coded fashion by means of amplitude modulation is checked by the organic circuit element 65 in respect of whether it corresponds to a predetermined code word preferably stored in an organic memory. This checking is preferably realized by means of a shift register and a comparator - connected to the latter and the organic memory - with an organic field effect transistor that is connected downstream and functions as a driver. If this is the case, then a current or a voltage is applied to the component 66, which is an optical element. By virtue of the applied current or the applied voltage, the optical properties of the component 66 change, such that an enable signal discernible to the user is coded into the light reflected by the component 66.

Claims (19)

1. A security element in the form of a flexible multilayer film body, comprising:
a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device;
an output unit for outputting an enable signal; and an electronic release system having active and/or passive organic components, wherein the electronic release system is configured to check whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode;
wherein the electronic release system is further configured to check the signal received by the receiving unit in respect of the direction from which the signal impinges on the security element, and drives the output unit for outputting the enable signal if the signal received by the receiving unit impinges on the security element from a predetermined direction.
2. The security element as claimed in claim 1 wherein the output unit has a piezoelement for generating a sound signal or a signal that can be detected by a tactile device.
3. The security element as claimed in claim 1, wherein the output unit is configured for generating a signal that can be detected thermally or by the sense of smell.
4. The security element as claimed in claim 1 wherein the receiving unit comprises an antenna structure comprising a structured electrically conductive layer for receiving the electromagnetic verification signal.
5. The security element as claimed in claim 1 wherein the electronic release system is configured to check the signal received by the receiving unit in respect of whether the signal waveform of the received signal corresponds to a specific coding comprising the frequency and/or the amplitude of the signal of a predetermined value.
6. The security element as claimed in claim 1 wherein the electronic release system comprises one or more layers that are composed of organic conductive and/or semiconducting materials and are produced by printing technology.
7. The security element as claimed in one of the preceding claims, wherein the receiving unit, the output unit and the electronic release system form separate systems that are connected to one another via electrical contact points.
8. An identification system, comprising: a verification device with a transmitting unit for emitting an electromagnetic verification signal containing a specific coding; and at least one security element in the form of a flexible, multilayer film body, which security element contains a receiving unit for receiving the verification signal, an output unit for outputting an enable signal and an electronic release system having active and/or passive organic components, wherein the electronic release system is configured in such a way that it checks whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode.
9. A security element in the form of a flexible multilayer film body, comprising:

a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device;
an output unit for outputting an enable signal; and an electronic release system having active and/or passive organic components, wherein the electronic release system is configured to check whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode;
wherein the electronic release system is configured to check the signal received by the receiving unit in respect of whether the change in the signal waveform of the signal corresponds to the specific coding comprising a change in the frequency, phase and/or the amplitude of the signal corresponding to predetermined values.
10. The security element as claimed in claim 9 wherein the output unit has a piezoelement for generating a sound signal or a signal that can be detected by a tactile device.
11. The security element as claimed in claim 10 wherein the electronic release system is configured to check the signal received by the receiving unit in respect of whether the signal waveform of the received signal corresponds to a specific coding comprising the frequency and/or the amplitude of the signal of a predetermined value.
12. The security element as claimed in claim 10 wherein the electronic release system comprises one or more layers that are composed of organic conductive and/or semiconducting materials and are produced by printing technology.
13. A security element in the form of a flexible multilayer film body, comprising:
a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device;
an output unit for outputting an enable signal;
an electronic release system having active and/or passive organic components, wherein the electronic release system is configured to check whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode; wherein the electronic release system is further configured to check the signal received by the receiving unit in respect of whether a code word contained in the modulated signal corresponds to the specific coding as to whether said code word matches a predetermined code word stored in a memory of the security element; and wherein the electronic release system is further configured to check the signal received by the receiving unit in respect of whether the signal waveform of the received signal corresponds to a specific coding comprising the frequency and/or the amplitude of the signal of a predetermined value.
14. The security element as claimed in claim 13 wherein the output unit has a piezoelement for generating a sound signal or a signal that can be detected by a tactile device.
15. The security element as claimed in claim 13 wherein the electronic release system comprises one or more layers that are composed of organic conductive and/or semiconducting materials and are produced by printing technology.
16. A security element in the form of a flexible multilayer film body, comprising:
a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device;
an output unit for outputting an enable signal;
an electronic release system having active and/or passive organic components, wherein the electronic release system is configured to check whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode;
wherein the security element includes a power unit for applying power to said output unit and electronic release system; and wherein the electronic release system is further configured to check the signal received by the receiving unit in respect of whether the signal waveform of the received signal corresponds to a specific coding comprising the frequency and/or the amplitude of the signal of a predetermined value.
17. The security element as claimed in claim 16 wherein the output unit has a piezoelement for generating a sound signal or a signal that can be detected by a tactile device.
18. The security element as claimed in claim 16 wherein the electronic release system comprises one or more layers that are composed of organic conductive and/or semiconducting materials and are produced by printing technology.
19. A security element in the form of a flexible multilayer film body, comprising:

a receiving unit for receiving an electromagnetic verification signal containing a specific coding from a verification device;
an output unit for outputting an enable signal; and an electronic release system having active and/or passive organic components, wherein the electronic release system is configured to check whether or not a signal received by the receiving unit contains the specific coding, and drives the output unit for outputting the enable signal if the signal received by the receiving unit contains the specific coding, and in that the output unit has at least one electrochromic element, a thermochromic element, an electroluminescent element, an electrophoretic element, a liquid crystal element or an organic light emitting diode;
wherein the security element includes a sensor unit for sensing any one of a plurality of different parameters and feeding the sensed parameter as an input to the release system.
CA2590622A 2004-12-10 2005-12-06 Identification system Active CA2590622C (en)

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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1988514A1 (en) * 2007-05-04 2008-11-05 Acreo AB Security document circuit
DE102007043407A1 (en) * 2007-09-12 2009-03-19 Polyic Gmbh & Co. Kg Multilayer flexible film body
DE102008026216B4 (en) * 2008-05-30 2010-07-29 Polyic Gmbh & Co. Kg Electronic switch
BR112014017150A8 (en) 2012-01-13 2017-07-04 Arjo Wiggins Fine Papers Ltd method for producing a sheet
DE102014225720A1 (en) * 2014-12-12 2016-06-16 Bundesdruckerei Gmbh LED module
US10339531B2 (en) 2016-06-10 2019-07-02 Bank Of America Corporation Organic light emitting diode (“OLED”) security authentication system
US9697388B1 (en) 2016-06-14 2017-07-04 Bank Of America Corporation Unfoldable OLED reader/displays for the visually-impaired
US10163154B2 (en) 2016-06-21 2018-12-25 Bank Of America Corporation OLED (“organic light emitting diode”) teller windows
US10460135B1 (en) 2016-06-21 2019-10-29 Bank Of America Corporation Foldable organic light emitting diode (“OLED”) purchasing instrument reader
US9747539B1 (en) 2016-06-21 2017-08-29 Bank Of America Corporation Organic light emitting diode (“OLED”) travel card
US10970027B2 (en) 2016-06-21 2021-04-06 Bank Of America Corporation Combination organic light emitting diode (“OLED”) device
US10783336B2 (en) 2016-06-21 2020-09-22 Bank Of America Corporation Reshape-able OLED device for positioning payment instrument
US9665818B1 (en) 2016-06-21 2017-05-30 Bank Of America Corporation Organic light emitting diode (“OLED”) universal plastic
US9858558B1 (en) 2016-07-08 2018-01-02 Bank Of America Corporation Multi-screen automated teller machine (ATM)/automated teller assist (ATA) machines for use by wheelchair users
US9760124B1 (en) 2016-07-11 2017-09-12 Bank Of America Corporation Organic light emitting diode (“OLED”)-based displays
US10580068B2 (en) 2016-07-11 2020-03-03 Bank Of America Corporation OLED-based secure monitoring of valuables
US10043183B2 (en) 2016-08-30 2018-08-07 Bank Of America Corporation Organic light emitting diode (“OLED”) visual authentication circuit board
US10176676B2 (en) 2016-09-23 2019-01-08 Bank Of America Corporation Organic light emitting diode (“OLED”) display with quick service terminal (“QST”) functionality
US11138488B2 (en) 2019-06-26 2021-10-05 Bank Of America Corporation Organic light emitting diode (“OLED”) single-use payment instrument
US11367320B2 (en) * 2019-09-24 2022-06-21 Caterpillar Inc. Systems and methods for part identification
DE102020209012A1 (en) * 2020-07-17 2022-01-20 Bundesdruckerei Gmbh Lamination body with an activatable actuator and method for verifying the lamination body

Family Cites Families (198)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB723598A (en) 1951-09-07 1955-02-09 Philips Nv Improvements in or relating to methods of producing electrically conductive mouldings from plastics
US3512052A (en) 1968-01-11 1970-05-12 Gen Motors Corp Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
DE2102735B2 (en) 1971-01-21 1979-05-10 Transformatoren Union Ag, 7000 Stuttgart Mill, eg for grinding plastics fillers - with electric circuit for controlling the throughput of the mill
US3769096A (en) 1971-03-12 1973-10-30 Bell Telephone Labor Inc Pyroelectric devices
JPS543594B2 (en) 1973-10-12 1979-02-24
DE2407110C3 (en) 1974-02-14 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Sensor for the detection of a substance contained in a gas or a liquid
JPS54101176A (en) 1978-01-26 1979-08-09 Shinetsu Polymer Co Contact member for push switch
US4442019A (en) 1978-05-26 1984-04-10 Marks Alvin M Electroordered dipole suspension
US4246298A (en) 1979-03-14 1981-01-20 American Can Company Rapid curing of epoxy resin coating compositions by combination of photoinitiation and controlled heat application
JPS5641938U (en) 1979-09-10 1981-04-17
US4340057A (en) 1980-12-24 1982-07-20 S. C. Johnson & Son, Inc. Radiation induced graft polymerization
EP0108650A3 (en) 1982-11-09 1986-02-12 Zytrex Corporation Programmable mos transistor
DE3321071A1 (en) 1983-06-10 1984-12-13 Basf Ag PRESSURE SWITCH
DE3338597A1 (en) 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
US4554229A (en) 1984-04-06 1985-11-19 At&T Technologies, Inc. Multilayer hybrid integrated circuit
JPS6265472A (en) 1985-09-18 1987-03-24 Toshiba Corp Mis type semiconductor element
DE3768112D1 (en) 1986-03-03 1991-04-04 Toshiba Kawasaki Kk RADIATION DETECTOR.
EP0268370B1 (en) 1986-10-13 1995-06-28 Canon Kabushiki Kaisha Switching device
GB2215307B (en) 1988-03-04 1991-10-09 Unisys Corp Electronic component transportation container
EP0350179B1 (en) 1988-06-21 1994-01-19 Gec Avery Limited Manufacturing portable electronic tokens
US5364735A (en) 1988-07-01 1994-11-15 Sony Corporation Multiple layer optical record medium with protective layers and method for producing same
US4937119A (en) 1988-12-15 1990-06-26 Hoechst Celanese Corp. Textured organic optical data storage media and methods of preparation
US5892244A (en) 1989-01-10 1999-04-06 Mitsubishi Denki Kabushiki Kaisha Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor
US6331356B1 (en) 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
EP0418504B1 (en) 1989-07-25 1995-04-05 Matsushita Electric Industrial Co., Ltd. Organic semiconductor memory device having a MISFET structure and its control method
FI84862C (en) 1989-08-11 1992-01-27 Vaisala Oy Capacitive humidifier construction and method of making it
US5206525A (en) 1989-12-27 1993-04-27 Nippon Petrochemicals Co., Ltd. Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials
FI91573C (en) 1990-01-04 1994-07-11 Neste Oy Method for manufacturing electronic and electro-optical components and circuits
JP2969184B2 (en) 1990-04-09 1999-11-02 カシオ計算機株式会社 Thin film transistor memory
FR2664430B1 (en) 1990-07-04 1992-09-18 Centre Nat Rech Scient THIN FILM FIELD EFFECT TRANSISTOR WITH MIS STRUCTURE, IN WHICH THE INSULATION AND THE SEMICONDUCTOR ARE MADE OF ORGANIC MATERIALS.
DE4103675C2 (en) 1991-02-07 1993-10-21 Telefunken Microelectron Circuit for voltage surge of AC input signals
FR2673041A1 (en) 1991-02-19 1992-08-21 Gemplus Card Int METHOD FOR MANUFACTURING INTEGRATED CIRCUIT MICROMODULES AND CORRESPONDING MICROMODULE.
EP0501456A3 (en) 1991-02-26 1992-09-09 Sony Corporation Video game computer provided with an optical disc drive
US5408109A (en) 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
EP0511807A1 (en) 1991-04-27 1992-11-04 Gec Avery Limited Apparatus and sensor unit for monitoring changes in a physical quantity with time
JP3224829B2 (en) 1991-08-15 2001-11-05 株式会社東芝 Organic field effect device
JPH0580530A (en) 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5173835A (en) 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
EP0610183B1 (en) 1991-10-30 1995-05-10 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Exposure device
JP2709223B2 (en) 1992-01-30 1998-02-04 三菱電機株式会社 Non-contact portable storage device
EP0603939B1 (en) 1992-12-21 1999-06-16 Koninklijke Philips Electronics N.V. N-type conductive polymer and method of preparing such a polymer
DE4243832A1 (en) 1992-12-23 1994-06-30 Daimler Benz Ag Push button arrangement
JP3457348B2 (en) 1993-01-15 2003-10-14 株式会社東芝 Method for manufacturing semiconductor device
FR2701117B1 (en) 1993-02-04 1995-03-10 Asulab Sa Electrochemical measurement system with multizone sensor, and its application to glucose measurement.
EP0615256B1 (en) 1993-03-09 1998-09-23 Koninklijke Philips Electronics N.V. Method of manufacturing a pattern of an electrically conductive polymer on a substrate surface and method of metallizing such a pattern
US5567550A (en) 1993-03-25 1996-10-22 Texas Instruments Incorporated Method of making a mask for making integrated circuits
DE4312766C2 (en) 1993-04-20 1997-02-27 Telefunken Microelectron Circuit for voltage boost
JPH0722669A (en) 1993-07-01 1995-01-24 Mitsubishi Electric Corp Plastic functional element
CA2170402C (en) 1993-08-24 2000-07-18 Michael P. Allen Novel disposable electronic assay device
JP3460863B2 (en) 1993-09-17 2003-10-27 三菱電機株式会社 Method for manufacturing semiconductor device
FR2710413B1 (en) 1993-09-21 1995-11-03 Asulab Sa Measuring device for removable sensors.
US5556706A (en) 1993-10-06 1996-09-17 Matsushita Electric Industrial Co., Ltd. Conductive layered product and method of manufacturing the same
IL111151A (en) 1994-10-03 1998-09-24 News Datacom Ltd Secure access systems
EP0708987B1 (en) 1994-05-16 2003-08-13 Koninklijke Philips Electronics N.V. Semiconductor device provided with an organic semiconductor material
IL110318A (en) 1994-05-23 1998-12-27 Al Coat Ltd Polyaniline-containing solutions for preparing transparent electrodes for liquid crystal devices
US5684884A (en) 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
JP3246189B2 (en) 1994-06-28 2002-01-15 株式会社日立製作所 Semiconductor display device
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5574291A (en) 1994-12-09 1996-11-12 Lucent Technologies Inc. Article comprising a thin film transistor with low conductivity organic layer
US5630986A (en) 1995-01-13 1997-05-20 Bayer Corporation Dispensing instrument for fluid monitoring sensors
DE19506907A1 (en) 1995-02-28 1996-09-05 Telefunken Microelectron Voltage or current level input signal changing circuit for e.g. EEPROM
JP3068430B2 (en) 1995-04-25 2000-07-24 富山日本電気株式会社 Solid electrolytic capacitor and method of manufacturing the same
JPH0933645A (en) 1995-07-21 1997-02-07 Oki Electric Ind Co Ltd Power supply circuit of transponder
US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
US5625199A (en) 1996-01-16 1997-04-29 Lucent Technologies Inc. Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors
US6326640B1 (en) 1996-01-29 2001-12-04 Motorola, Inc. Organic thin film transistor with enhanced carrier mobility
GB2310493B (en) 1996-02-26 2000-08-02 Unilever Plc Determination of the characteristics of fluid
JP3080579B2 (en) 1996-03-06 2000-08-28 富士機工電子株式会社 Manufacturing method of air rear grid array package
DE19629656A1 (en) 1996-07-23 1998-01-29 Boehringer Mannheim Gmbh Diagnostic test carrier with multilayer test field and method for the determination of analyte with its aid
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US6344662B1 (en) 1997-03-25 2002-02-05 International Business Machines Corporation Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages
US5946551A (en) 1997-03-25 1999-08-31 Dimitrakopoulos; Christos Dimitrios Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric
KR100248392B1 (en) 1997-05-15 2000-09-01 정선종 The operation and control of the organic electroluminescent devices with organic field effect transistors
JPH10326330A (en) * 1997-05-23 1998-12-08 Takashi Adachi Information recording card
JP4509228B2 (en) 1997-08-22 2010-07-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Field effect transistor made of organic material and method of manufacturing the same
EP1296280A1 (en) 1997-09-11 2003-03-26 Precision Dynamics Corporation Rf-id tag with integrated circuit consisting of organic materials
BR9811636A (en) * 1997-09-11 2000-08-08 Precision Dynamics Corp Radio frequency identification label on flexible substrate
US6251513B1 (en) 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
JPH11142810A (en) 1997-11-12 1999-05-28 Nintendo Co Ltd Portable information processor
US5997817A (en) 1997-12-05 1999-12-07 Roche Diagnostics Corporation Electrochemical biosensor test strip
JP2001510670A (en) 1997-12-05 2001-07-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Identification transponder
US5998805A (en) 1997-12-11 1999-12-07 Motorola, Inc. Active matrix OED array with improved OED cathode
US6083104A (en) 1998-01-16 2000-07-04 Silverlit Toys (U.S.A.), Inc. Programmable toy with an independent game cartridge
EP1051745B1 (en) 1998-01-28 2007-11-07 Thin Film Electronics ASA A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
US6045977A (en) 1998-02-19 2000-04-04 Lucent Technologies Inc. Process for patterning conductive polyaniline films
JPH11249494A (en) 1998-03-03 1999-09-17 Canon Inc Drum flange, cylindrical member, process cartridge and electrophotographic image forming device
DE19816860A1 (en) 1998-03-06 1999-11-18 Deutsche Telekom Ag Chip card, especially credit card
US6033202A (en) 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
DE69918308T2 (en) 1998-04-10 2004-10-21 E Ink Corp ELECTRONIC DISPLAY BASED ON ORGANIC FIELD EFFECT TRANSISTORS
GB9808061D0 (en) 1998-04-16 1998-06-17 Cambridge Display Tech Ltd Polymer devices
NL1008929C2 (en) 1998-04-20 1999-10-21 Vhp Ugchelen Bv Substrate made of paper provided with an integrated circuit.
GB9808806D0 (en) 1998-04-24 1998-06-24 Cambridge Display Tech Ltd Selective deposition of polymer films
TW410478B (en) 1998-05-29 2000-11-01 Lucent Technologies Inc Thin-film transistor monolithically integrated with an organic light-emitting diode
US5967048A (en) 1998-06-12 1999-10-19 Howard A. Fromson Method and apparatus for the multiple imaging of a continuous web
KR100282393B1 (en) 1998-06-17 2001-02-15 구자홍 method for fabricating Organic Electroluminescent display Device
IL141074A0 (en) * 1998-07-27 2002-02-10 Brosow Joergen Security paper, method and device for checking the authenticity of documents recorded thereon
DE19836174C2 (en) 1998-08-10 2000-10-12 Illig Maschinenbau Adolf Heater for heating thermoplastic sheets and method for adjusting the temperature of this heater
US6215130B1 (en) 1998-08-20 2001-04-10 Lucent Technologies Inc. Thin film transistors
ES2306525T3 (en) 1998-08-26 2008-11-01 Sensors For Medicine And Science, Inc. OPTICAL-BASED DETECTION DEVICES.
JP4493741B2 (en) 1998-09-04 2010-06-30 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
DE19851703A1 (en) 1998-10-30 2000-05-04 Inst Halbleiterphysik Gmbh Electronic structure, e.g. FET, is produced by plotting, spraying, spin coating or spreading of insulating, semiconducting and-or conductive layers onto a substrate
US6384804B1 (en) 1998-11-25 2002-05-07 Lucent Techonologies Inc. Display comprising organic smart pixels
US6506438B2 (en) 1998-12-15 2003-01-14 E Ink Corporation Method for printing of transistor arrays on plastic substrates
US6321571B1 (en) 1998-12-21 2001-11-27 Corning Incorporated Method of making glass structures for flat panel displays
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
DE60027483T2 (en) 1999-01-15 2007-05-03 3M Innovative Properties Co., Saint Paul Material patterning method
GB2347013A (en) 1999-02-16 2000-08-23 Sharp Kk Charge-transport structures
JP3990539B2 (en) 1999-02-22 2007-10-17 新日本製鐵株式会社 High-strength hot-dip galvanized steel sheet and high-strength galvannealed steel sheet excellent in plating adhesion and press formability and method for producing the same
US6300141B1 (en) 1999-03-02 2001-10-09 Helix Biopharma Corporation Card-based biosensor device
US6180956B1 (en) 1999-03-03 2001-01-30 International Business Machine Corp. Thin film transistors with organic-inorganic hybrid materials as semiconducting channels
US6207472B1 (en) 1999-03-09 2001-03-27 International Business Machines Corporation Low temperature thin film transistor fabrication
US6878312B1 (en) 1999-03-29 2005-04-12 Seiko Epson Corporation Composition, film manufacturing method, as well as functional device and manufacturing method therefore
TW475269B (en) 1999-03-30 2002-02-01 Seiko Epson Corp Method of manufacturing thin-film transistor
US6498114B1 (en) 1999-04-09 2002-12-24 E Ink Corporation Method for forming a patterned semiconductor film
US6072716A (en) 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
FR2793089B3 (en) 1999-04-28 2001-06-08 Rene Liger TRANSPONDER WITH INTEGRATED ANTENNA
DE19919448A1 (en) 1999-04-29 2000-11-02 Miele & Cie Cooling device and method for indicating germs
DE19921024C2 (en) 1999-05-06 2001-03-08 Wolfgang Eichelmann Video game system
US6383664B2 (en) 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
EP1052594A1 (en) 1999-05-14 2000-11-15 Sokymat S.A. Transponder and molding die, and their method of manufacture
EP1188144B1 (en) 1999-05-17 2003-12-17 The Goodyear Tire & Rubber Company Rf transponder and method for controlling rf signal modulation in a passive transponder
TW556357B (en) 1999-06-28 2003-10-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
US6366017B1 (en) * 1999-07-14 2002-04-02 Agilent Technologies, Inc/ Organic light emitting diodes with distributed bragg reflector
JP2001085272A (en) 1999-07-14 2001-03-30 Matsushita Electric Ind Co Ltd Variable capacitor
DE19933757A1 (en) 1999-07-19 2001-01-25 Giesecke & Devrient Gmbh Manufacturing chip card with integral battery involves applying first conducting track structure, electrolyte and second conducting track structure to form opposite polarity electrodes
DE19935527A1 (en) 1999-07-28 2001-02-08 Giesecke & Devrient Gmbh Active film for chip cards with display
US7071824B2 (en) * 1999-07-29 2006-07-04 Micron Technology, Inc. Radio frequency identification devices, remote communication devices, identification systems, communication methods, and identification methods
DE19937262A1 (en) 1999-08-06 2001-03-01 Siemens Ag Arrangement with transistor function
US6593690B1 (en) 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
EP1085320A1 (en) 1999-09-13 2001-03-21 Interuniversitair Micro-Elektronica Centrum Vzw A device for detecting an analyte in a sample based on organic materials
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
KR100477146B1 (en) 1999-09-28 2005-03-17 스미도모쥬기가이고교 가부시키가이샤 Laser drilling method and laser drilling device
US6340822B1 (en) 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
JP2004538618A (en) 1999-10-11 2004-12-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Integrated circuit
US6335539B1 (en) 1999-11-05 2002-01-01 International Business Machines Corporation Method for improving performance of organic semiconductors in bottom electrode structure
US6284562B1 (en) 1999-11-17 2001-09-04 Agere Systems Guardian Corp. Thin film transistors
EP1103916A1 (en) 1999-11-24 2001-05-30 Infineon Technologies AG IC-card
US6136702A (en) 1999-11-29 2000-10-24 Lucent Technologies Inc. Thin film transistors
US6621098B1 (en) 1999-11-29 2003-09-16 The Penn State Research Foundation Thin-film transistor and methods of manufacturing and incorporating a semiconducting organic material
US6197663B1 (en) 1999-12-07 2001-03-06 Lucent Technologies Inc. Process for fabricating integrated circuit devices having thin film transistors
CA2394895C (en) 1999-12-21 2014-01-28 Plastic Logic Limited Forming interconnects
KR100940110B1 (en) 1999-12-21 2010-02-02 플라스틱 로직 리미티드 Inkjet-fabricated intergrated circuits amd method for forming electronic device
US7002451B2 (en) * 2000-01-11 2006-02-21 Freeman Jeffrey R Package location system
JP2002162652A (en) 2000-01-31 2002-06-07 Fujitsu Ltd Sheet-like display device, resin spherical body and microcapsule
US6706159B2 (en) 2000-03-02 2004-03-16 Diabetes Diagnostics Combined lancet and electrochemical analyte-testing apparatus
TW497120B (en) 2000-03-06 2002-08-01 Toshiba Corp Transistor, semiconductor device and manufacturing method of semiconductor device
JP3614747B2 (en) 2000-03-07 2005-01-26 Necエレクトロニクス株式会社 BOOST CIRCUIT, IC CARD WITH THE SAME AND ELECTRONIC DEVICE WITH THE SAME
DE10012204A1 (en) 2000-03-13 2001-09-20 Siemens Ag Electronic postage stamp for identifying postal articles
EP1134694A1 (en) 2000-03-16 2001-09-19 Infineon Technologies AG Document with integrated electronic circuit
WO2001073109A2 (en) 2000-03-28 2001-10-04 Diabetes Diagnostics, Inc. Continuous process for manufacture of disposable electro-chemical sensor
US6329226B1 (en) 2000-06-01 2001-12-11 Agere Systems Guardian Corp. Method for fabricating a thin-film transistor
DE10032260B4 (en) 2000-07-03 2004-04-29 Texas Instruments Deutschland Gmbh Circuit arrangement for doubling the voltage of a battery
DE10033112C2 (en) 2000-07-07 2002-11-14 Siemens Ag Process for the production and structuring of organic field-effect transistors (OFET), OFET produced thereafter and its use
US7875975B2 (en) 2000-08-18 2011-01-25 Polyic Gmbh & Co. Kg Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
DE10120687A1 (en) 2001-04-27 2002-10-31 Siemens Ag Encapsulated organic-electronic circuit has electronic components especially made of organic material and arranged between at least two layers forming barrier
JP2002068324A (en) 2000-08-30 2002-03-08 Nippon Sanso Corp Heat-insulating container
DE10043204A1 (en) 2000-09-01 2002-04-04 Siemens Ag Organic field-effect transistor, method for structuring an OFET and integrated circuit
DE10044842A1 (en) 2000-09-11 2002-04-04 Siemens Ag Organic rectifier, circuit, RFID tag and use of an organic rectifier
DE10045192A1 (en) 2000-09-13 2002-04-04 Siemens Ag Organic data storage, RFID tag with organic data storage, use of an organic data storage
DE10047171A1 (en) 2000-09-22 2002-04-18 Siemens Ag Electrode and/or conductor track used for components of OFETs and OLEDs is produced by treating an organic functional polymer with a chemical compound
KR20020036916A (en) 2000-11-11 2002-05-17 주승기 Method of crystallizing a silicon thin film and semiconductor device fabricated thereby
DE10058559A1 (en) 2000-11-24 2002-05-29 Interactiva Biotechnologie Gmb System for distribution of refrigerated goods has communication network connecting supplier to local storage areas and hence to customers
KR100390522B1 (en) 2000-12-01 2003-07-07 피티플러스(주) Method for fabricating thin film transistor including a crystalline silicone active layer
DE10061297C2 (en) 2000-12-08 2003-05-28 Siemens Ag Procedure for structuring an OFET
GB2371910A (en) 2001-01-31 2002-08-07 Seiko Epson Corp Display devices
DE10105914C1 (en) 2001-02-09 2002-10-10 Siemens Ag Organic field effect transistor with photo-structured gate dielectric and a method for its production
ATE540437T1 (en) 2001-03-02 2012-01-15 Fujifilm Corp PRODUCTION METHOD OF AN ORGANIC THIN FILM DEVICE
US6819244B2 (en) * 2001-03-28 2004-11-16 Inksure Rf, Inc. Chipless RF tags
DE10117663B4 (en) 2001-04-09 2004-09-02 Samsung SDI Co., Ltd., Suwon Process for the production of matrix arrangements based on various types of organic conductive materials
DE10120686A1 (en) 2001-04-27 2002-11-07 Siemens Ag Process for producing thin homogeneous layers with the help of screen printing technology, device for carrying out the process and its use
US6781868B2 (en) 2001-05-07 2004-08-24 Advanced Micro Devices, Inc. Molecular memory device
US20020170897A1 (en) 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
EP2315289A3 (en) 2001-05-23 2011-09-28 Plastic Logic Limited Laser patterning of devices
US6870180B2 (en) 2001-06-08 2005-03-22 Lucent Technologies Inc. Organic polarizable gate transistor apparatus and method
DE20111825U1 (en) * 2001-07-20 2002-01-17 Lammering Thomas Print media
DE10141440A1 (en) 2001-08-23 2003-03-13 Daimler Chrysler Ag tripod
JP2003089259A (en) 2001-09-18 2003-03-25 Hitachi Ltd Pattern forming method and pattern forming apparatus
CA2461355A1 (en) 2001-09-20 2003-04-03 Peter-Joachim Neymann Patient card
US7351660B2 (en) 2001-09-28 2008-04-01 Hrl Laboratories, Llc Process for producing high performance interconnects
US6679036B2 (en) 2001-10-15 2004-01-20 Shunchi Crankshaft Co., Ltd. Drive gear shaft structure of a self-moving type mower
DE10151440C1 (en) 2001-10-18 2003-02-06 Siemens Ag Organic electronic component for implementing an encapsulated partially organic electronic component has components like a flexible foil as an antenna, a diode or capacitor and an organic transistor.
DE10163266A1 (en) 2001-12-21 2003-07-03 Giesecke & Devrient Gmbh Document of value and device for processing documents of value
DE10163267A1 (en) * 2001-12-21 2003-07-03 Giesecke & Devrient Gmbh Banknotes incorporating an electronic, data containing, circuit and transceiver and a device for processing said notes ensure that banknote handling is greatly simplified
CA2471415A1 (en) * 2001-12-21 2003-07-03 Giesecke & Devrient Gmbh Sheet material and apparatuses and methods for producing and processing such sheet material
DE10209400A1 (en) 2002-03-04 2003-10-02 Infineon Technologies Ag Transponder circuit for a transponder has a rectifier circuit with a component that has a coating of organic material
DE10219905B4 (en) 2002-05-03 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelectronic component with organic functional layers and two carriers and method for producing such an optoelectronic component
US6812509B2 (en) 2002-06-28 2004-11-02 Palo Alto Research Center Inc. Organic ferroelectric memory cells
AT502890B1 (en) * 2002-10-15 2011-04-15 Atomic Austria Gmbh ELECTRONIC MONITORING SYSTEM FOR CHECKING BZW. RECORDING OF A SPORTS COMBINATION COMPOSED OF MULTIPLE SPORTS
US6870183B2 (en) 2002-11-04 2005-03-22 Advanced Micro Devices, Inc. Stacked organic memory devices and methods of operating and fabricating
US20060118778A1 (en) 2002-11-05 2006-06-08 Wolfgang Clemens Organic electronic component with high-resolution structuring and method for the production thereof
US20060035423A1 (en) 2002-11-19 2006-02-16 Walter Fix Organic electronic component comprising the same organic material for at least two functional layers
DE50306538D1 (en) 2002-11-19 2007-03-29 Polyic Gmbh & Co Kg ORGANIC ELECTRONIC SWITCHING WITH A STRUCTURED SEMICONDUCTIVE FUNCTIONAL LAYER AND MANUFACTURING METHOD THEREFOR
US6975221B2 (en) * 2003-01-02 2005-12-13 Monck Joan M Luggage identifier for air and rail travelers
JP2004341712A (en) * 2003-05-14 2004-12-02 Canon Inc Data transfer automatic continuous processing
US7347382B2 (en) * 2004-02-06 2008-03-25 T-Ink, Llc System for securing personal cards
US7233250B2 (en) * 2004-12-29 2007-06-19 Avery Dennison Corporation Radio frequency identification device with visual indicator
US20080067247A1 (en) * 2006-09-15 2008-03-20 Mcgregor Travis M Biometric authentication card and method of fabrication thereof

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US7940159B2 (en) 2011-05-10
JP2008523479A (en) 2008-07-03
US20090237248A1 (en) 2009-09-24
EP1828963B1 (en) 2013-01-30
AU2005313716A1 (en) 2006-06-15
AU2005313716B2 (en) 2010-12-02
TW200634653A (en) 2006-10-01
KR20070090912A (en) 2007-09-06
MX2007006438A (en) 2007-07-20
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CN101076814A (en) 2007-11-21
TWI329840B (en) 2010-09-01

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