CA911064A - Thin film crossover structure and method - Google Patents

Thin film crossover structure and method

Info

Publication number
CA911064A
CA911064A CA911064A CA911064DA CA911064A CA 911064 A CA911064 A CA 911064A CA 911064 A CA911064 A CA 911064A CA 911064D A CA911064D A CA 911064DA CA 911064 A CA911064 A CA 911064A
Authority
CA
Canada
Prior art keywords
thin film
crossover structure
film crossover
thin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA911064A
Inventor
Marcantonio Gabriel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsystems International Ltd
Original Assignee
Microsystems International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsystems International Ltd filed Critical Microsystems International Ltd
Application granted granted Critical
Publication of CA911064A publication Critical patent/CA911064A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CA911064A 1970-11-02 1970-11-02 Thin film crossover structure and method Expired CA911064A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA97155 1970-11-02

Publications (1)

Publication Number Publication Date
CA911064A true CA911064A (en) 1972-09-26

Family

ID=4087929

Family Applications (1)

Application Number Title Priority Date Filing Date
CA911064A Expired CA911064A (en) 1970-11-02 1970-11-02 Thin film crossover structure and method

Country Status (3)

Country Link
CA (1) CA911064A (en)
DE (1) DE2146328A1 (en)
GB (1) GB1348659A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180311A (en) * 1991-01-22 1993-01-19 Hughes Aircraft Company Resilient interconnection bridge
US5283949A (en) * 1992-11-03 1994-02-08 Jurisich Peter L Method of producing a printed circuit board having a conductive pattern thereon

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3240425A1 (en) * 1982-11-02 1984-05-03 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Miniature wire link for producing connections on assemblies
US5030385A (en) * 1988-03-25 1991-07-09 E. I. Du Pont De Nemours And Company Process of inhibiting corrosion
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
DE19936198A1 (en) * 1999-07-31 2001-02-01 Mannesmann Vdo Ag Circuit board
US20040061232A1 (en) 2002-09-27 2004-04-01 Medtronic Minimed, Inc. Multilayer substrate
US7138330B2 (en) * 2002-09-27 2006-11-21 Medtronic Minimed, Inc. High reliability multilayer circuit substrates and methods for their formation
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180311A (en) * 1991-01-22 1993-01-19 Hughes Aircraft Company Resilient interconnection bridge
US5283949A (en) * 1992-11-03 1994-02-08 Jurisich Peter L Method of producing a printed circuit board having a conductive pattern thereon

Also Published As

Publication number Publication date
GB1348659A (en) 1974-03-20
DE2146328A1 (en) 1972-05-10

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