CA913812A - Method of forming leads for attachment to semi-conductor devices - Google Patents

Method of forming leads for attachment to semi-conductor devices

Info

Publication number
CA913812A
CA913812A CA913812DA CA913812A CA 913812 A CA913812 A CA 913812A CA 913812D A CA913812D A CA 913812DA CA 913812 A CA913812 A CA 913812A
Authority
CA
Canada
Prior art keywords
semi
attachment
conductor devices
forming leads
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Inventor
E. Kauffman John
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jade Corp
Original Assignee
Jade Corp
Publication date
Application granted granted Critical
Publication of CA913812A publication Critical patent/CA913812A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CA913812D Method of forming leads for attachment to semi-conductor devices Expired CA913812A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA913812T

Publications (1)

Publication Number Publication Date
CA913812A true CA913812A (en) 1972-10-31

Family

ID=36421345

Family Applications (1)

Application Number Title Priority Date Filing Date
CA913812D Expired CA913812A (en) Method of forming leads for attachment to semi-conductor devices

Country Status (1)

Country Link
CA (1) CA913812A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip

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