CA976043A - Activation method for electroless plating - Google Patents

Activation method for electroless plating

Info

Publication number
CA976043A
CA976043A CA151,498A CA151498A CA976043A CA 976043 A CA976043 A CA 976043A CA 151498 A CA151498 A CA 151498A CA 976043 A CA976043 A CA 976043A
Authority
CA
Canada
Prior art keywords
electroless plating
activation method
activation
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA151,498A
Other versions
CA151498S (en
Inventor
John H. Rolker
Bradley A. Carson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bell and Howell Co
Original Assignee
Bell and Howell Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell and Howell Co filed Critical Bell and Howell Co
Application granted granted Critical
Publication of CA976043A publication Critical patent/CA976043A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
CA151,498A 1971-09-30 1972-09-12 Activation method for electroless plating Expired CA976043A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US185106A US3900320A (en) 1971-09-30 1971-09-30 Activation method for electroless plating

Publications (1)

Publication Number Publication Date
CA976043A true CA976043A (en) 1975-10-14

Family

ID=22679617

Family Applications (1)

Application Number Title Priority Date Filing Date
CA151,498A Expired CA976043A (en) 1971-09-30 1972-09-12 Activation method for electroless plating

Country Status (7)

Country Link
US (1) US3900320A (en)
JP (1) JPS4842928A (en)
CA (1) CA976043A (en)
DE (1) DE2245761C2 (en)
FR (1) FR2154711B1 (en)
GB (1) GB1402898A (en)
IT (1) IT968444B (en)

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US4751276A (en) * 1986-12-24 1988-06-14 Exxon Research And Engineering Company Method for preparing functional alpha-olefin polymers and copolymers
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US5409782A (en) * 1988-05-02 1995-04-25 Orient Watch Company Composite film
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US5506091A (en) * 1990-04-20 1996-04-09 Nisshinbo Industries, Inc. Photosensitive resin composition and method of forming conductive pattern
DE4015717A1 (en) * 1990-05-16 1991-11-21 Bayer Ag FORMULATION FOR ACTIVATING SUBSTRATE SURFACES FOR THEIR CURRENT METALIZATION
JP2889348B2 (en) * 1990-06-07 1999-05-10 花王株式会社 Absorbent articles
US5186984A (en) * 1990-06-28 1993-02-16 Monsanto Company Silver coatings
DE4036591A1 (en) * 1990-11-16 1992-05-21 Bayer Ag PRIMER FOR METALLIZING SUBSTRATE SURFACES
DE4107644A1 (en) * 1991-03-09 1992-09-10 Bayer Ag HYDROPRIMER FOR METALLIZING SUBSTRATE SURFACES
US5648201A (en) * 1991-04-25 1997-07-15 The United Sates Of America As Represented By The Secretary Of The Navy Efficient chemistry for selective modification and metallization of substrates
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BE1007879A3 (en) * 1994-01-05 1995-11-07 Blue Chips Holding Polymer resin viscosity adjustable for filing on palladium catalyst substrate, method of preparation and use.
US5900351A (en) * 1995-01-17 1999-05-04 International Business Machines Corporation Method for stripping photoresist
US5645930A (en) * 1995-08-11 1997-07-08 The Dow Chemical Company Durable electrode coatings
TW367504B (en) * 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer
US6030708A (en) * 1996-10-28 2000-02-29 Nissha Printing Co., Ltd. Transparent shielding material for electromagnetic interference
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US6261740B1 (en) 1997-09-02 2001-07-17 Kodak Polychrome Graphics, Llc Processless, laser imageable lithographic printing plate
US6093636A (en) * 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6333141B1 (en) 1998-07-08 2001-12-25 International Business Machines Corporation Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
US6399666B1 (en) 1999-01-27 2002-06-04 International Business Machines Corporation Insulative matrix material
US6703186B1 (en) * 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
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US8071178B2 (en) * 2005-06-09 2011-12-06 Omron Corporation Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film
US7776394B2 (en) * 2005-08-08 2010-08-17 E.I. Du Pont De Nemours And Company Atomic layer deposition of metal-containing films using surface-activating agents
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US8974869B2 (en) * 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
CN102965646B (en) * 2011-08-17 2015-05-13 罗门哈斯电子材料有限公司 Stable catalyst solution for electroless metallization
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EP2559485B1 (en) * 2011-08-17 2017-03-29 Rohm and Haas Electronic Materials, L.L.C. Stable tin free catalysts for electroless metallization
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US11267576B2 (en) 2013-07-09 2022-03-08 Raytheon Technologies Corporation Plated polymer nosecone
EP3019313A4 (en) * 2013-07-09 2017-04-05 United Technologies Corporation Ceramic-encapsulated thermopolymer pattern or support with metallic plating
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Also Published As

Publication number Publication date
DE2245761C2 (en) 1982-07-29
FR2154711A1 (en) 1973-05-11
FR2154711B1 (en) 1977-01-14
DE2245761A1 (en) 1973-04-05
GB1402898A (en) 1975-08-13
JPS4842928A (en) 1973-06-21
IT968444B (en) 1974-03-20
US3900320A (en) 1975-08-19

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