CN100340001C - Nand快速存储器结构 - Google Patents
Nand快速存储器结构 Download PDFInfo
- Publication number
- CN100340001C CN100340001C CNB038139804A CN03813980A CN100340001C CN 100340001 C CN100340001 C CN 100340001C CN B038139804 A CNB038139804 A CN B038139804A CN 03813980 A CN03813980 A CN 03813980A CN 100340001 C CN100340001 C CN 100340001C
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- 238000006880 cross-coupling reaction Methods 0.000 title 1
- 238000007667 floating Methods 0.000 claims abstract description 128
- 238000002955 isolation Methods 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 39
- 230000008859 change Effects 0.000 claims description 14
- 238000012795 verification Methods 0.000 claims description 14
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000013500 data storage Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
Abstract
Description
Claims (20)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/175,764 US6894930B2 (en) | 2002-06-19 | 2002-06-19 | Deep wordline trench to shield cross coupling between adjacent cells for scaled NAND |
US10/175,764 | 2002-06-19 | ||
US10/353,570 US6898121B2 (en) | 2002-06-19 | 2003-01-28 | Deep wordline trench to shield cross coupling between adjacent cells for scaled NAND |
US10/353,570 | 2003-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1663046A CN1663046A (zh) | 2005-08-31 |
CN100340001C true CN100340001C (zh) | 2007-09-26 |
Family
ID=30002644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038139804A Expired - Lifetime CN100340001C (zh) | 2002-06-19 | 2003-06-09 | Nand快速存储器结构 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7170786B2 (zh) |
EP (1) | EP1514309B1 (zh) |
KR (1) | KR101110191B1 (zh) |
CN (1) | CN100340001C (zh) |
AU (1) | AU2003237515A1 (zh) |
WO (1) | WO2004001852A1 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6762092B2 (en) * | 2001-08-08 | 2004-07-13 | Sandisk Corporation | Scalable self-aligned dual floating gate memory cell array and methods of forming the array |
US6894930B2 (en) | 2002-06-19 | 2005-05-17 | Sandisk Corporation | Deep wordline trench to shield cross coupling between adjacent cells for scaled NAND |
ITTO20020997A1 (it) * | 2002-11-15 | 2004-05-16 | St Microelectronics Srl | Procedimento autoalllineato per la fabbricazione di |
US6917542B2 (en) | 2003-07-29 | 2005-07-12 | Sandisk Corporation | Detecting over programmed memory |
US6914823B2 (en) * | 2003-07-29 | 2005-07-05 | Sandisk Corporation | Detecting over programmed memory after further programming |
JP3966850B2 (ja) * | 2003-11-20 | 2007-08-29 | 株式会社東芝 | 半導体装置およびその製造方法 |
US7355237B2 (en) * | 2004-02-13 | 2008-04-08 | Sandisk Corporation | Shield plate for limiting cross coupling between floating gates |
US7388251B2 (en) * | 2004-08-11 | 2008-06-17 | Micron Technology, Inc. | Non-planar flash memory array with shielded floating gates on silicon mesas |
US7416956B2 (en) * | 2004-11-23 | 2008-08-26 | Sandisk Corporation | Self-aligned trench filling for narrow gap isolation regions |
US7381615B2 (en) * | 2004-11-23 | 2008-06-03 | Sandisk Corporation | Methods for self-aligned trench filling with grown dielectric for high coupling ratio in semiconductor devices |
US7436703B2 (en) * | 2005-12-27 | 2008-10-14 | Sandisk Corporation | Active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices |
KR100672162B1 (ko) * | 2005-12-28 | 2007-01-19 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자 및 그의 제조방법 |
KR100885790B1 (ko) * | 2006-01-04 | 2009-02-26 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자 및 그 제조 방법 |
JP2007193862A (ja) * | 2006-01-17 | 2007-08-02 | Toshiba Corp | 不揮発性半導体記憶装置 |
US20070228450A1 (en) * | 2006-03-29 | 2007-10-04 | Di Li | Flash memory device with enlarged control gate structure, and methods of making same |
US7745285B2 (en) * | 2007-03-30 | 2010-06-29 | Sandisk Corporation | Methods of forming and operating NAND memory with side-tunneling |
KR100900232B1 (ko) * | 2007-05-22 | 2009-05-29 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조방법 |
KR100909968B1 (ko) * | 2007-06-12 | 2009-07-29 | 삼성전자주식회사 | 구동방식을 개선한 입체 구조의 플래시 메모리 장치 및 그구동방법 |
JP5491705B2 (ja) * | 2008-05-22 | 2014-05-14 | 株式会社東芝 | 半導体装置 |
US7848144B2 (en) | 2008-06-16 | 2010-12-07 | Sandisk Corporation | Reverse order page writing in flash memories |
US8259529B2 (en) | 2008-08-21 | 2012-09-04 | Hynix Semiconductor Inc. | Semiconductor memory device and driving method thereof |
KR101096225B1 (ko) * | 2008-08-21 | 2011-12-22 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 및 그 구동방법 |
US7924591B2 (en) * | 2009-02-06 | 2011-04-12 | Macronix International Co., Ltd. | Memory device with shielding plugs adjacent to a dummy word line thereof |
US8692310B2 (en) | 2009-02-09 | 2014-04-08 | Spansion Llc | Gate fringing effect based channel formation for semiconductor device |
JP2012069193A (ja) | 2010-09-22 | 2012-04-05 | Toshiba Corp | 不揮発性半導体記憶装置およびその制御方法 |
JP2012069203A (ja) | 2010-09-22 | 2012-04-05 | Toshiba Corp | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の駆動方法 |
KR101182942B1 (ko) * | 2011-05-24 | 2012-09-13 | 에스케이하이닉스 주식회사 | 3차원 구조의 비휘발성 메모리 소자 및 그 제조 방법 |
KR102029923B1 (ko) * | 2013-05-31 | 2019-11-29 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그의 제조 방법 |
US20160181435A1 (en) * | 2014-12-22 | 2016-06-23 | Wafertech, Llc | Floating gate transistors and method for forming the same |
KR20170073980A (ko) * | 2015-12-21 | 2017-06-29 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 및 그것의 동작 방법 |
Citations (2)
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---|---|---|---|---|
US5640032A (en) * | 1994-09-09 | 1997-06-17 | Nippon Steel Corporation | Non-volatile semiconductor memory device with improved rewrite speed |
US6214665B1 (en) * | 1997-11-07 | 2001-04-10 | Kabushiki Kaisha Toshiba | Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same |
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US5043940A (en) | 1988-06-08 | 1991-08-27 | Eliyahou Harari | Flash EEPROM memory systems having multistate storage cells |
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US5313421A (en) | 1992-01-14 | 1994-05-17 | Sundisk Corporation | EEPROM with split gate source side injection |
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-
2003
- 2003-06-09 EP EP03736962.6A patent/EP1514309B1/en not_active Expired - Lifetime
- 2003-06-09 AU AU2003237515A patent/AU2003237515A1/en not_active Abandoned
- 2003-06-09 CN CNB038139804A patent/CN100340001C/zh not_active Expired - Lifetime
- 2003-06-09 WO PCT/US2003/018183 patent/WO2004001852A1/en active Application Filing
- 2003-06-09 KR KR1020047020775A patent/KR101110191B1/ko active IP Right Grant
-
2005
- 2005-03-21 US US11/086,648 patent/US7170786B2/en not_active Ceased
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5640032A (en) * | 1994-09-09 | 1997-06-17 | Nippon Steel Corporation | Non-volatile semiconductor memory device with improved rewrite speed |
US6214665B1 (en) * | 1997-11-07 | 2001-04-10 | Kabushiki Kaisha Toshiba | Semiconductor memory device having memory cells each having a conductive body of booster plate and a method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
KR101110191B1 (ko) | 2012-02-15 |
EP1514309B1 (en) | 2013-11-27 |
WO2004001852A1 (en) | 2003-12-31 |
KR20050044868A (ko) | 2005-05-13 |
CN1663046A (zh) | 2005-08-31 |
EP1514309A1 (en) | 2005-03-16 |
US20050162927A1 (en) | 2005-07-28 |
AU2003237515A1 (en) | 2004-01-06 |
US7170786B2 (en) | 2007-01-30 |
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Owner name: SANDISK TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SANDISK TECHNOLOGIES, INC. |
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Address after: Texas, USA Patentee after: Sandy Technology Corp. Address before: Texas, USA Patentee before: Sanindisco Technology Co.,Ltd. |
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