CN100345318C - 增强界面热电冷却器 - Google Patents
增强界面热电冷却器 Download PDFInfo
- Publication number
- CN100345318C CN100345318C CNB018199593A CN01819959A CN100345318C CN 100345318 C CN100345318 C CN 100345318C CN B018199593 A CNB018199593 A CN B018199593A CN 01819959 A CN01819959 A CN 01819959A CN 100345318 C CN100345318 C CN 100345318C
- Authority
- CN
- China
- Prior art keywords
- tip
- thermoelectric
- thermal element
- metal
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/731,616 US6403876B1 (en) | 2000-12-07 | 2000-12-07 | Enhanced interface thermoelectric coolers with all-metal tips |
US09/731,616 | 2000-12-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1478307A CN1478307A (zh) | 2004-02-25 |
CN100345318C true CN100345318C (zh) | 2007-10-24 |
Family
ID=24940257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018199593A Expired - Fee Related CN100345318C (zh) | 2000-12-07 | 2001-11-23 | 增强界面热电冷却器 |
Country Status (10)
Country | Link |
---|---|
US (2) | US6403876B1 (zh) |
EP (1) | EP1340266A2 (zh) |
JP (1) | JP4289658B2 (zh) |
KR (1) | KR100558800B1 (zh) |
CN (1) | CN100345318C (zh) |
AU (1) | AU2002220821A1 (zh) |
CA (1) | CA2427426C (zh) |
IL (1) | IL156320A0 (zh) |
TW (1) | TW565960B (zh) |
WO (1) | WO2002047176A2 (zh) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6505468B2 (en) | 2000-03-21 | 2003-01-14 | Research Triangle Institute | Cascade cryogenic thermoelectric cooler for cryogenic and room temperature applications |
EP1384035A4 (en) * | 2001-04-09 | 2006-07-26 | Nextreme Thermal Solutions Inc | THERMOELECTRIC HEATING AND COOLING THERMAL FILM DEVICES FOR GENOMIC AND PROTEOMIC DNA CHIPS, THERMO-OPTICAL SWITCHING CIRCUITS, AND IR MARKERS |
EP1433208A4 (en) * | 2001-10-05 | 2008-02-20 | Nextreme Thermal Solutions Inc | LOW-DIMENSIONAL STRUCTURES, ELECTRON EMITTERS AND PHONES BLOCKERS |
US6712258B2 (en) * | 2001-12-13 | 2004-03-30 | International Business Machines Corporation | Integrated quantum cold point coolers |
US20040018729A1 (en) * | 2002-02-11 | 2004-01-29 | Ghoshal Uttam Shyamalindu | Enhanced interface thermoelectric coolers with all-metal tips |
KR20050000514A (ko) * | 2002-04-15 | 2005-01-05 | 리써치 트라이앵글 인스티튜트 | 양면 펠티어 접합을 이용하는 열전 장치 및 그 열전장치의 제조 방법 |
US20050016575A1 (en) * | 2003-06-13 | 2005-01-27 | Nalin Kumar | Field emission based thermoelectric device |
KR20060133974A (ko) * | 2003-10-16 | 2006-12-27 | 더 유니버시티 오브 아크론 | 탄소 나노섬유 기판 상의 탄소 나노튜브 |
US20100257871A1 (en) * | 2003-12-11 | 2010-10-14 | Rama Venkatasubramanian | Thin film thermoelectric devices for power conversion and cooling |
US7638705B2 (en) * | 2003-12-11 | 2009-12-29 | Nextreme Thermal Solutions, Inc. | Thermoelectric generators for solar conversion and related systems and methods |
US20050150536A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials |
US20050150539A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Monolithic thin-film thermoelectric device including complementary thermoelectric materials |
US20050150535A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers, Inc. | Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor |
US20050150537A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers Inc. | Thermoelectric devices |
US20050160752A1 (en) * | 2004-01-23 | 2005-07-28 | Nanocoolers, Inc. | Apparatus and methodology for cooling of high power density devices by electrically conducting fluids |
US7508110B2 (en) * | 2004-05-04 | 2009-03-24 | Massachusetts Institute Of Technology | Surface plasmon coupled nonequilibrium thermoelectric devices |
US7305839B2 (en) * | 2004-06-30 | 2007-12-11 | General Electric Company | Thermal transfer device and system and method incorporating same |
US20060048809A1 (en) * | 2004-09-09 | 2006-03-09 | Onvural O R | Thermoelectric devices with controlled current flow and related methods |
US20060068611A1 (en) * | 2004-09-30 | 2006-03-30 | Weaver Stanton E Jr | Heat transfer device and system and method incorporating same |
US20060076046A1 (en) * | 2004-10-08 | 2006-04-13 | Nanocoolers, Inc. | Thermoelectric device structure and apparatus incorporating same |
US7523617B2 (en) | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
US8063298B2 (en) * | 2004-10-22 | 2011-11-22 | Nextreme Thermal Solutions, Inc. | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields |
US20060090787A1 (en) * | 2004-10-28 | 2006-05-04 | Onvural O R | Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles |
US7260939B2 (en) * | 2004-12-17 | 2007-08-28 | General Electric Company | Thermal transfer device and system and method incorporating same |
US7475551B2 (en) | 2004-12-23 | 2009-01-13 | Nanocoolers, Inc. | System employing temporal integration of thermoelectric action |
US7296417B2 (en) * | 2004-12-23 | 2007-11-20 | Nanocoolers, Inc. | Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator |
US7293416B2 (en) * | 2004-12-23 | 2007-11-13 | Nanocoolers, Inc. | Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle |
US7498507B2 (en) * | 2005-03-16 | 2009-03-03 | General Electric Company | Device for solid state thermal transfer and power generation |
US20070028956A1 (en) * | 2005-04-12 | 2007-02-08 | Rama Venkatasubramanian | Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices |
WO2007002342A2 (en) * | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures |
WO2007002337A2 (en) | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures |
US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US20070137687A1 (en) * | 2005-12-15 | 2007-06-21 | The Boeing Company | Thermoelectric tunnelling device |
US7679203B2 (en) * | 2006-03-03 | 2010-03-16 | Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
US8018053B2 (en) * | 2008-01-31 | 2011-09-13 | Northrop Grumman Systems Corporation | Heat transfer device |
US9435571B2 (en) | 2008-03-05 | 2016-09-06 | Sheetak Inc. | Method and apparatus for switched thermoelectric cooling of fluids |
CN101978517A (zh) * | 2008-03-19 | 2011-02-16 | 史泰克公司 | 金属芯热电冷却和动力产生装置 |
WO2010065082A1 (en) * | 2008-12-04 | 2010-06-10 | Sheetak Inc. | Enhanced metal-core thermoelectric cooling and power generation device |
IN2012DN01366A (zh) | 2009-07-17 | 2015-06-05 | Sheetak Inc | |
US9601677B2 (en) * | 2010-03-15 | 2017-03-21 | Laird Durham, Inc. | Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces |
KR101108191B1 (ko) * | 2010-05-24 | 2012-02-06 | 에스비리모티브 주식회사 | 배터리 팩 |
FR2963165A1 (fr) * | 2010-07-22 | 2012-01-27 | St Microelectronics Crolles 2 | Procede de generation d'energie electrique dans un dispositif semi-conducteur, et dispositif correspondant |
JP5771852B2 (ja) * | 2011-02-27 | 2015-09-02 | 眞人 馬淵 | 熱電材料に伝熱量を低減し作業物質流は本来の熱電材料以上となる空間部分あるいは繋がった空間部分を含んだ熱電変換素子 |
ITRM20110196A1 (it) * | 2011-04-19 | 2012-10-20 | Annamaria Gerardino | Dispositivo per la generazione di energia elettrica a partire da fonti di calore . |
US9852870B2 (en) | 2011-05-23 | 2017-12-26 | Corporation For National Research Initiatives | Method for the fabrication of electron field emission devices including carbon nanotube field electron emisson devices |
KR20130009442A (ko) * | 2011-07-15 | 2013-01-23 | 삼성전기주식회사 | 열전 모듈 |
EP2774188B1 (en) * | 2011-11-02 | 2018-05-16 | Cardinal Solar Technologies Company | Thermoelectric device technology |
TWI499101B (zh) | 2012-07-13 | 2015-09-01 | Ind Tech Res Inst | 熱電轉換結構及使用其之散熱結構 |
JP6307679B2 (ja) * | 2012-08-21 | 2018-04-18 | 眞人 馬淵 | 熱電材料に伝熱量を低減し作業物質流は本来の熱電材料以上となる空間部分あるいは架橋した空間部分に手掛りを持つ熱電変換素子 |
JP6350817B2 (ja) * | 2014-08-23 | 2018-07-04 | 眞人 馬淵 | 熱電材料、熱電変換素子及び熱電材料から成るπ型モジュール群乃至π型モジュール群以外と熱変電換素子の組み合わせから成るモジュール群 |
US10088697B2 (en) * | 2015-03-12 | 2018-10-02 | International Business Machines Corporation | Dual-use electro-optic and thermo-optic modulator |
US10527871B2 (en) * | 2015-03-16 | 2020-01-07 | California Institute Of Technology | Differential ring modulator |
WO2016191386A1 (en) | 2015-05-22 | 2016-12-01 | California Institute Of Technology | Optical ring modulator thermal tuning technique |
KR101995614B1 (ko) * | 2015-09-08 | 2019-07-02 | 포항공과대학교 산학협력단 | 비대칭 수직 나노선 어레이를 이용한 열전소자 및 이의 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4492809A (en) * | 1975-10-22 | 1985-01-08 | Reinhard Dahlberg | Thermoelectrical arrangement |
DE3404138A1 (de) * | 1984-02-07 | 1985-08-08 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische anordnung mit engewiderstaenden |
JPH05226704A (ja) * | 1992-02-10 | 1993-09-03 | Matsushita Electric Ind Co Ltd | 熱電装置およびその製造方法 |
US5712448A (en) * | 1996-02-07 | 1998-01-27 | California Institute Of Technology | Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3880674A (en) * | 1970-01-20 | 1975-04-29 | Rockwell International Corp | Thermoelectric elements and devices and process therefor |
JPS6018753B2 (ja) * | 1979-03-09 | 1985-05-11 | 大日本印刷株式会社 | やすりの製造方法 |
JPS57207362A (en) * | 1981-06-16 | 1982-12-20 | Mitsubishi Electric Corp | Semiconductor device |
DE3404137A1 (de) * | 1984-02-07 | 1985-08-08 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische anordnung mit fremdschicht-kontakten |
DE3818192A1 (de) * | 1988-05-28 | 1989-12-07 | Dahlberg Reinhard | Thermoelektrische anordnung mit tunnelkontakten |
US5580827A (en) * | 1989-10-10 | 1996-12-03 | The Board Of Trustees Of The Leland Stanford Junior University | Casting sharpened microminiature tips |
JP2670366B2 (ja) * | 1989-11-09 | 1997-10-29 | 日本原子力発電株式会社 | 熱電発電素子 |
EP0437654A1 (de) * | 1990-01-16 | 1991-07-24 | Reinhard Dr. Dahlberg | Thermoelement-Schenkel mit richtungsabhängiger Quantisierung der Ladungsträger |
JPH05168846A (ja) | 1990-10-30 | 1993-07-02 | Nippondenso Co Ltd | 除湿装置 |
US5130276A (en) | 1991-05-16 | 1992-07-14 | Motorola Inc. | Method of fabricating surface micromachined structures |
JPH0539966A (ja) | 1991-08-07 | 1993-02-19 | Matsushita Electric Ind Co Ltd | ヒートポンプデバイス |
US5399238A (en) * | 1991-11-07 | 1995-03-21 | Microelectronics And Computer Technology Corporation | Method of making field emission tips using physical vapor deposition of random nuclei as etch mask |
JP2924369B2 (ja) | 1991-11-20 | 1999-07-26 | 松下電器産業株式会社 | ヒートポンプデバイス |
RU2034207C1 (ru) | 1992-11-05 | 1995-04-30 | Товарищество с ограниченной ответственностью компании "Либрация" | Способ охлаждения объекта каскадной термоэлектрической батареей |
US5900071A (en) * | 1993-01-12 | 1999-05-04 | Massachusetts Institute Of Technology | Superlattice structures particularly suitable for use as thermoelectric materials |
AU6859294A (en) | 1993-05-25 | 1994-12-20 | Industrial Research Limited | A peltier device |
JPH08125237A (ja) * | 1994-10-28 | 1996-05-17 | Aisin Seiki Co Ltd | 熱電素子 |
JPH08185794A (ja) * | 1994-12-27 | 1996-07-16 | Toshiba Corp | マイクロエミッタ電極の製造方法およびマイクロエミッタ装置 |
JP3365109B2 (ja) | 1994-12-28 | 2003-01-08 | ソニー株式会社 | データ再生装置及びデータ再生方法 |
KR100208474B1 (ko) * | 1995-10-24 | 1999-07-15 | 박원훈 | 전계 방출용 마이크로-팁 및 그 제조방법 |
JPH10146799A (ja) * | 1996-11-14 | 1998-06-02 | Lintec Corp | 抜き型の製造方法 |
US5966941A (en) | 1997-12-10 | 1999-10-19 | International Business Machines Corporation | Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms |
US5867990A (en) | 1997-12-10 | 1999-02-09 | International Business Machines Corporation | Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms |
US6000225A (en) | 1998-04-27 | 1999-12-14 | International Business Machines Corporation | Two dimensional thermoelectric cooler configuration |
US6388185B1 (en) | 1998-08-07 | 2002-05-14 | California Institute Of Technology | Microfabricated thermoelectric power-generation devices |
US6161388A (en) | 1998-12-28 | 2000-12-19 | International Business Machines Corporation | Enhanced duty cycle design for micro thermoelectromechanical coolers |
-
2000
- 2000-12-07 US US09/731,616 patent/US6403876B1/en not_active Expired - Lifetime
-
2001
- 2001-11-23 WO PCT/GB2001/005188 patent/WO2002047176A2/en active IP Right Grant
- 2001-11-23 CN CNB018199593A patent/CN100345318C/zh not_active Expired - Fee Related
- 2001-11-23 AU AU2002220821A patent/AU2002220821A1/en not_active Abandoned
- 2001-11-23 IL IL15632001A patent/IL156320A0/xx not_active IP Right Cessation
- 2001-11-23 JP JP2002548793A patent/JP4289658B2/ja not_active Expired - Fee Related
- 2001-11-23 CA CA002427426A patent/CA2427426C/en not_active Expired - Fee Related
- 2001-11-23 KR KR1020037007349A patent/KR100558800B1/ko not_active IP Right Cessation
- 2001-11-23 EP EP01999222A patent/EP1340266A2/en not_active Withdrawn
- 2001-12-04 TW TW090129980A patent/TW565960B/zh not_active IP Right Cessation
-
2002
- 2002-02-11 US US10/073,695 patent/US6740600B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4492809A (en) * | 1975-10-22 | 1985-01-08 | Reinhard Dahlberg | Thermoelectrical arrangement |
DE3404138A1 (de) * | 1984-02-07 | 1985-08-08 | Reinhard Dr. 7101 Flein Dahlberg | Thermoelektrische anordnung mit engewiderstaenden |
JPH05226704A (ja) * | 1992-02-10 | 1993-09-03 | Matsushita Electric Ind Co Ltd | 熱電装置およびその製造方法 |
US5712448A (en) * | 1996-02-07 | 1998-01-27 | California Institute Of Technology | Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices |
Non-Patent Citations (1)
Title |
---|
PRFRIGERATION TECHNOLOGIES FOR SUB-AMBIENT TEMPERATURE OPERATION OF COMPRTING SYSTEMS U GHOSHAL ET AL,2000 IEEE INTERNATIONAL SOLID.STATE CIRCUITS CONFERENCE. DIGEST OF TECHNICAL PAPERS 2000 * |
Also Published As
Publication number | Publication date |
---|---|
CA2427426C (en) | 2008-02-19 |
TW565960B (en) | 2003-12-11 |
CA2427426A1 (en) | 2002-06-13 |
KR20030059300A (ko) | 2003-07-07 |
KR100558800B1 (ko) | 2006-03-10 |
IL156320A0 (en) | 2004-01-04 |
CN1478307A (zh) | 2004-02-25 |
EP1340266A2 (en) | 2003-09-03 |
JP2004515924A (ja) | 2004-05-27 |
AU2002220821A1 (en) | 2002-06-18 |
US20020166839A1 (en) | 2002-11-14 |
US6740600B2 (en) | 2004-05-25 |
WO2002047176A3 (en) | 2002-12-05 |
WO2002047176A2 (en) | 2002-06-13 |
US6403876B1 (en) | 2002-06-11 |
JP4289658B2 (ja) | 2009-07-01 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171120 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171120 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071024 Termination date: 20191123 |