CN100388484C - Composite LED package structure - Google Patents

Composite LED package structure Download PDF

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Publication number
CN100388484C
CN100388484C CNB2005100767071A CN200510076707A CN100388484C CN 100388484 C CN100388484 C CN 100388484C CN B2005100767071 A CNB2005100767071 A CN B2005100767071A CN 200510076707 A CN200510076707 A CN 200510076707A CN 100388484 C CN100388484 C CN 100388484C
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CN
China
Prior art keywords
package structure
light
emitting diode
substrate
diode chip
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Expired - Fee Related
Application number
CNB2005100767071A
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Chinese (zh)
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CN1877832A (en
Inventor
宋柏霖
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Individual
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Individual
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Priority to CNB2005100767071A priority Critical patent/CN100388484C/en
Publication of CN1877832A publication Critical patent/CN1877832A/en
Application granted granted Critical
Publication of CN100388484C publication Critical patent/CN100388484C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The present invention discloses a packing structure of a composite light emitting diode, which comprises a first basal plate with a first surface and a second surface, a second basal plate with a first surface and a second surface, a first light emitting diode chip positioned on the first surface of the first basal plate, and a second light emitting diode chip positioned on the first surface of the second basal plate, wherein the second surface of the second basal plate and the second surface of the first basal plate are packed in the mode of contact.

Description

Composite LED package structure
Technical field
The present invention relates to a kind of package structure for LED, particularly a kind of composite LED package structure.
Background technology
LED compares with incandescent osram lamp and fluorescent lamp, it is little (many that LED has a volume, multiple combination), caloric value low (not having thermal radiation), little (the low-voltage of power consumption, the low current starting), life-span long (more than 10,000 hours), reaction speed fast (can at high-frequency operation), environmental protection is (shatter-proof, shock-resistant being difficult for breaks, discarded object is recyclable, do not pollute), but the planar package easy exploiting becomes advantages such as compact product, less than the high power consumption of incandescent lamp bulb, shortcomings such as the frangible and mercurous pollution problems of fluorescent lamp discarded object, had an optimistic view of in following 10 years by industry, become and substitute one of the traditional lighting utensil commodity of having great potentialities.
With present application, no matter be with incandescent osram lamp or with the light source of light-emitting diode chip for backlight unit as light fixture, all be difficult to make it to have the illumination zone at comprehensive (approximate 360 degree) no dead angle, it always has the light source dorsal part to be difficult to the place of direct lighting, therefore for the application of some floor lamps, for example with single park street lamp, have unavoidably illumination less than the place, if make the park floor lamp seldom just have dark dead angle easily, cause the common people dare not stay evening.And at present for addressing this problem, can only just can reach the purpose that whole park does not have dark dead angle with more floor lamp, but this measure meeting increases its cost expenditure and follow-up electricity charge burden.
On the other hand, no matter at present be incandescent osram lamp or with light-emitting diode chip for backlight unit during as the light source of light fixture, as long as tungsten filament burns out or chip failure just can make light fixture lose the illumination effect, for masses, can cause and more to change the bulb or the inconvenience of light-emitting diode chip for backlight unit, if light fixture is in the place of being inconvenient to change, ceiling for example, the action of replacing is a burden especially concerning the user.Moreover if light source is to be applied to emergency lighting, under the situation of unmanned often maintenance, light source loses illumination functions and forgets replacing, just loses the effect of its Emergency Light easily at the time of emergency.
Still to have above-mentioned illumination zone comprehensive inadequately in view of the light source that is applied to light fixture at present, just needs the problem changed in case damage, and this light-source structure just has the necessity that need be enhanced, and can further be of value to popular life with expectation.
Summary of the invention
In view of above problem, main purpose of the present invention is to provide a kind of composite LED package structure, promptly by the reverse combination of two LED encapsulation constructions up and down, to solve the existing in prior technology problem.By the oppositely design of luminous package structure up and down of the present invention, its illumination zone can be near 360 degree.
Also have, by in parallel or each other circuit design, both may command are luminous together or distinctly luminous, make this composite LED structure when being applied to light fixture, can not make this light fixture lose illumination functions because of luminescence chip loses efficacy.
Therefore, for reaching above-mentioned purpose, a kind of composite LED package structure disclosed in this invention comprises: first substrate has first surface and second surface; Second substrate has first surface and second surface; First light-emitting diode chip for backlight unit is positioned at the first surface of first substrate; Reach second light-emitting diode chip for backlight unit, be positioned at the first surface of second substrate; Wherein, the second surface of the second surface of second substrate and first substrate is packaged into one contiguously.
Therefore, for achieving the above object, a kind of composite LED package structure disclosed in this invention comprises: substrate has first surface and second surface; First light-emitting diode chip for backlight unit is positioned at the first surface of substrate; Reach second light-emitting diode chip for backlight unit, be positioned at the second surface of substrate.
Above-mentioned each substrate all can be transparency carrier.
The above-mentioned light-emitting diode transparent chip of going up can have a wiring to be electrically connected at this upper substrate; Following light-emitting diode transparent chips can have a wiring to be electrically connected at this infrabasal plate.
The above-mentioned light-emitting diode transparent chip of going up can be coated by a transparent cover body; Above-mentioned light-emitting diode transparent chips down can be coated by a transparent cover body.
For making purpose of the present invention, structure, feature and function thereof there are further understanding, now are described in detail as follows in conjunction with execution mode.Above about content of the present invention explanation and the explanation of following execution mode be used for demonstration and explain principle of the present invention, and provide patent claim of the present invention further to explain.
Below in execution mode, be described in detail detailed features of the present invention and advantage, its content is enough to make any those skilled in the art to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claim and accompanying drawing, any those skilled in the art can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Fig. 1 constructs last better embodiment for composite LED package structure of the present invention;
Fig. 2 is composite LED package structure structure of the present invention back one better embodiment; And
Fig. 3 is composite LED package structure structure of the present invention back one better embodiment.
Wherein, Reference numeral:
1 upper substrate
Package structure for LED on 2
4 times package structure for LED
Light-emitting diode chip for backlight unit on 5
7 upper cover body
9 wiring
11 connection pads (pad)
13 electrical patterns
15 infrabasal plates
17 times light-emitting diode chip for backlight unit
19 connection pads (pad)
21 electrical patterns
23 wiring
25 lower covers
Embodiment
See also Fig. 1 and Fig. 2, be respectively before the composite LED package structure structure of the present invention and the better embodiment behind the structure dress.
As shown in the figure, composite LED package structure of the present invention comprises two LED package partly, and one is package structure for LED 4 under last package structure for LED 2, is.It is characterized in that package structure for LED 2 combines for substrate is back-to-back with this time package structure for LED 4 on this.The function of its respective components below will be described in detail in detail.
Last package structure for LED 2 comprises a upper substrate 1; Light-emitting diode chip for backlight unit 5 is positioned on this upper substrate 1 and can forms upper cover body 7 by the printing opacity filler and coats on one.This upper cover body 7 is formed by light transmissive material, and the light that light-emitting diode chip for backlight unit 5 is produced is appeared.
Upper substrate 1 can be metal substrate or non-metal base plate or transparency carrier, this substrate 1 outer connection pad 11 or electrical pattern 13 that provides light-emitting diode chip for backlight unit 5 to electrically connect that comprise.Each connection pad 11 or electrical 13 in pattern are not to be communicated with to become the insulation isolation; Wiring 9 can be by conducting resinl (not shown) coating with connection pad 11 and the light-emitting diode chip for backlight unit 5 of being of coupled connections.Be unlikely to come off for being easy to welding, conducting resinl general all with gold, silver, tin, chromium, nickel or its alloy as electric conducting material because golden material is more expensive, and the reflecting effect of sodium yellow is relatively poor, so less being used.
Last light-emitting diode chip for backlight unit 5 can be the versicolor chip that has in any known or commodity.Following package structure for LED 4 has an infrabasal plate 15; Once light-emitting diode chip for backlight unit 17 is positioned on this substrate 15, and can form lower cover 25 coatings by the printing opacity filler.This lower cover 25 is formed by light transmissive material, and the light that light-emitting diode chip for backlight unit 17 is produced is appeared.
Infrabasal plate 13 can be metal substrate or non-metal base plate or transparency carrier, and the connection pad 19 or the electrical pattern 21 that provide light-emitting diode chip for backlight unit 17 to electrically connect can be provided on this infrabasal plate 13.Be not communicated with into the insulation isolation between each connection pad 19 or the electrical pattern 21; If what provide is connection pad 19, this wiring 23 can be by conducting resinl (not shown) coating with connection pad 19 and the light-emitting diode chip for backlight unit 17 of being of coupled connections.And comprising the opposite side of light-emitting diode chip for backlight unit 17, infrabasal plate 13 combines with the back side of upper substrate 1.
Be unlikely to come off for being easy to welding, above-mentioned conducting resinl general all with gold, silver, tin, chromium, nickel or its alloy as electric conducting material because golden material is more expensive, and the reflecting effect of sodium yellow is relatively poor, so less being used.
Following light-emitting diode chip for backlight unit 17 can be common versicolor chip in any known or commodity.
Wherein upper and lower cover body 7,25, are made up of light transmissive material, and the technology of utilization comprises the mold of low pressure molding (molding) technology or sealing (encapsulated) technology to finish the defencive function of this lid 7.Above-mentioned light transmissive material for example is an epoxy resin.
In addition, last package structure for LED 2 and following package structure for LED 4 that above-mentioned composite LED package structure comprises can be the homotype package structure for LED, also can be difference, it focuses on this package structure for LED need belong to substrate one side light emitting-type.
Also have, though above-mentioned execution mode with two substrates as an example, but in the practical application also two substrates be combined into one, promptly only be respectively equipped with light-emitting diode chip for backlight unit in both sides with a substrate.
The engaging process of package structure for LED up and down below will be described in detail in detail.
After the package structure for LED 2,4,, just finished the making of composite LED package structure of the present invention about assembling separately with the back-to-back alignment combination of substrate of two light emitting diode constructions 4 up and down.Wherein the joint of upper and lower base plate 1,13 can be by connection pad 13,19 separately.
Package structure for LED 2 wherein, 4 circuit design can be decided according to demand, for example shown in the 3rd figure, package structure for LED 2 up and down, 4 can adopt the parallel circuits design, and so when a light-emitting diode chip for backlight unit lost efficacy, this composite LED package structure was still possessed another light-emitting diode chip for backlight unit and can be acted on, therefore this structure applications is when lighting device, and lighting device just can not lose illuminating effect because of a chip failure.In addition, package structure for LED 2,4 be except that adopting parallel circuits design with simultaneously luminous up and down, also can adopt each other circuit design to make it as required can be simultaneously luminous or distinctly luminous.The foregoing circuit design is known, and non-emphasis of the present invention, therefore just repeats no more.
According to the above, composite LED package structure of the present invention can reach the effect of illumination zone near 360 degree by reverse up and down package structure for LED, therefore by the present invention, just can be applicable to light fixture or various floor lamp does not have the effect at dead angle to reach comprehensive illumination.
And, in parallel or each other circuit design by upper and lower circuit, this composite LED package structure also can send the light source of package structure for LED or following package structure for LED as required separately, or when wherein a light-emitting diode chip for backlight unit lost efficacy, therefore the lighting device of using this structure can not lose the illumination function.
Via above-mentioned, the present invention sees through the combination of two reverse package structure for LED up and down, and the lighting space at comprehensive no dead angle just can be provided, and also can avoid on the other hand just losing the puzzlement of illumination functions because of a bulb breaks down in the known light fixture.
Certainly; the present invention also can have other numerous embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (6)

1. a composite LED package structure is characterized in that, comprises:
One first substrate has a first surface and a second surface;
One second substrate has a first surface and a second surface;
One first light-emitting diode chip for backlight unit is positioned at the described first surface of described first substrate; And
One second light-emitting diode chip for backlight unit is positioned at the described first surface of described second substrate;
The described second surface of described second substrate and the described second surface of described first substrate are packaged into one contiguously.
2. composite LED package structure as claimed in claim 1 is characterized in that, the described light-emitting diode chip for backlight unit of going up is electrically connected at described upper substrate by a wiring.
3. composite LED package structure as claimed in claim 1 is characterized in that, described light-emitting diode chip for backlight unit down is electrically connected at described infrabasal plate by a wiring.
4. composite LED package structure as claimed in claim 1 is characterized in that, the described light-emitting diode chip for backlight unit of going up is coated by a transparent cover body.
5. composite LED package structure as claimed in claim 1 is characterized in that, described light-emitting diode chip for backlight unit is down coated by a transparent cover body.
6. composite LED package structure as claimed in claim 1 is characterized in that, described first substrate and described second substrate are a transparency carrier.
CNB2005100767071A 2005-06-10 2005-06-10 Composite LED package structure Expired - Fee Related CN100388484C (en)

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Application Number Priority Date Filing Date Title
CNB2005100767071A CN100388484C (en) 2005-06-10 2005-06-10 Composite LED package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100767071A CN100388484C (en) 2005-06-10 2005-06-10 Composite LED package structure

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CN1877832A CN1877832A (en) 2006-12-13
CN100388484C true CN100388484C (en) 2008-05-14

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102052624B (en) * 2009-11-09 2013-09-25 亿光电子工业股份有限公司 Dimmer lighting assembly and manufacturing method thereof
CN104157770B (en) * 2013-05-14 2017-01-25 展晶科技(深圳)有限公司 LED module group
CN104157641B (en) * 2013-05-14 2017-06-20 展晶科技(深圳)有限公司 Light emitting diode module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283809A (en) * 1996-04-17 1997-10-31 Iwasaki Electric Co Ltd Layered monolithic light emitting diode
US6346777B1 (en) * 2000-11-03 2002-02-12 Ledart Co., Ltd. Led lamp apparatus
US6563139B2 (en) * 2001-09-11 2003-05-13 Chang Hsiu Hen Package structure of full color LED form by overlap cascaded die bonding
CN1474462A (en) * 2002-08-06 2004-02-11 英属维尔京群岛商钜星有限公司 Package structure of surface adhesive light -emitting diode and its producing method
CN1492506A (en) * 2002-10-22 2004-04-28 洲磊科技股份有限公司 Polycrystalline light-emitting diode module package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283809A (en) * 1996-04-17 1997-10-31 Iwasaki Electric Co Ltd Layered monolithic light emitting diode
US6346777B1 (en) * 2000-11-03 2002-02-12 Ledart Co., Ltd. Led lamp apparatus
US6563139B2 (en) * 2001-09-11 2003-05-13 Chang Hsiu Hen Package structure of full color LED form by overlap cascaded die bonding
CN1474462A (en) * 2002-08-06 2004-02-11 英属维尔京群岛商钜星有限公司 Package structure of surface adhesive light -emitting diode and its producing method
CN1492506A (en) * 2002-10-22 2004-04-28 洲磊科技股份有限公司 Polycrystalline light-emitting diode module package

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Granted publication date: 20080514

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