CN100403861C - 将集成电路封装体固定于电路板上的方法 - Google Patents
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Abstract
一种用来将一集成电路封装体固定于一电路板上的方法,所述封装体包括多个电连接点以内限于一周界的方式排列,所述方法包括将所述封装体置放于所述电路板上,以使所述封装体的主要表面邻接于所述电路板的一主要表面、透过所述多个电连接点将所述封装体电连接至所述电路板、以及设置至少一锚状物,其以机械性的方式将所述封装体固定于所述电路板上。其中所述锚状物并不于所述封装体与所述电路板之间提供任何电连接的功能。
Description
技术领域
本发明是提供一种集成电路封装体,尤指一种将集成电路封装体固定于电路板上的方法。
背景技术
集成电路通常是内建于一以陶瓷或复合材料制成的封装体,所述封装体可用来保护集成电路免受机械、电、及热等的破坏。所述封装体包括多个连接点,其上附有焊锡球或钉针,其可使集成电路晶片得以电连接于一电路板上,同时并使所述封装体得以机械性的方式固定于所述电路板上。所述焊锡球或钉针的功用在于提供电连接及机械式连接。
图1为现有内含一集成电路晶片16(显示于图2)的集成电路封装体10的仰视图。封装体10的底部表层上设有多个排列成格子状阵列的焊锡球12,其用来将封装体10固定于一电路板上。
请参考图2,图2为现有将集成电路封装体10固定于一电路板14后所产生的电子元件组18的侧视图。内含集成电路晶片16的集成电路封装体10是利用多个焊锡球12固定于电路板14上。在制造的过程中,焊锡球12将融解于封装体10及电路板14之间形成两者间的电连接及机械式连接。
焊锡球12会被由热感应机械性负荷或直接机械性负荷电子元件组18所产生的压力破坏。举例来说,封装体10和电路板14的热膨胀系数通常不同,当电子元件组18被加热或冷却时,因为电路板14和封装体10是以不同的速率膨胀或收缩,因此焊锡球12就会受到很大的压力。此外,电路板14于制造、填装及测试过程时会被外力所挤压而变形。然而,因为集成电路封装体10的刚性明显高于电路板14的刚性,致使焊锡球12承受了很高的压力造成机械性崩溃。然而在机械性负荷的情形下,存在于焊锡球12中的主要压力可能不足以造成立即性的崩溃,但循环的机械性或热负荷则会造成疲劳性崩溃。
请参考图3,图3为电子元件组18由于电路板14及封装体10不同的热收缩反应而沿一轴线弯曲的示意图。举例来说,此情形是由于电子元件组18由高于其周围的温度冷却时,造成所述电路板14对封装体10收缩的更剧烈。当电子元件组18冷却时,位于焊锡球12a及12b两列之间的焊锡球因所受到的张力过大而破裂。在焊锡球机械性的崩溃后,集成电路封装体10不再有效地电连接于电路板14上,再者,若电路板14上的机械性负荷由于某种原因一直未被松开,封装体10就有可能会完全地由电路板14上分离。
现有以焊锡球将集成电路封装体以机械式的方式连接至电路板的方法容易导致机械性崩溃。当电路板及封装体承受机械性负荷或热感应式机械性负荷时,焊锡球将会机械性的崩溃。
发明内容
因此本发明的主要目的在于提供一种将一集成电路封装体固定于一电路板上的方法,以使其间的机械性连接强度得以增加以解决上述的问题。
本发明的用来将一集成电路封装体固定于一电路板上的方法,其中所述集成电路封装体包括多个电连接点以内限于一周界的方式排列,所述方法包括将所述集成电路封装体置放于所述电路板上,以使所述集成电路封装体的主要表面邻接于所述电路板的一主要表面、透过所述多个电连接点将所述集成电路封装体电连接至所述电路板、以及将一锚状物的一端固定于所述集成电路封装体上,另一端以热融的方式固定于所述电路板上,并通过所述锚状物来支撑集成电路封装体而防止压毁锡球。其中所述锚状物并不在所述集成电路封装体与所述电路板之间提供任何电连接功能。
附图说明
图1为一现有集成电路封装体的仰视图。
图2为一现有方法的侧视图,说明将如图1所示的集成电路封装体固定于一电路板上。
图3为如图2所示的组合沿一轴线弯曲的侧视图。
图4为本发明的透视图,说明将一集成电路封装体固定于一电路板上。
图5为如图4所示的集成电路封装体的仰视图。
图6为如图4所示的组合的侧视图。
图7为如图4所示的组合沿一轴线弯曲的侧图。
图8为本发明第二实施例的侧视图。
图9为本发明第三实施例的侧视图。
图10为本发明第四实施例的仰视图。
图式的符号说明
10集成电路封装体 12多个焊锡球
12a焊锡球 12b焊锡球
14电路板 16集成电路晶片
18电子元件组 20集成电路封装体
22电路板 24电子元件组
26集成电路晶片 28锚状钉针
30焊锡球 32区域
34多个剩余的焊锡球 36焊锡带
具体实施方式
本发明于第一实施例中是以四根钉针来加强一集成电路封装体及一电路板之间的机械性固定强度。而在另外的三个实施例中是以导线及焊锡做为加强固定的装置。本发明所公开的方法可用于许多现代集成电路封装体的固定系统中。
图4为利用第一实施例的方法将内含一集成电路晶片26的集成电路封装体20固定于一电路板22上以组合出一电子元件组24的立体图。封装体20先于所述电路板22上排成直线,接着封装体20透过多个焊锡球30(显示于图5)电连接于所述电路板22。封装体20另利用一组四个锚状钉针28以机械式的固定于电路板22上。于电子元件组24被组合出来时,锚状钉针28也同时由产生作为电连接之用的焊锡球30的同一装置所产生。钉针28提供封装体20加强的机械式固定于电路板22上。
请参考图5,图5为集成电路封装体20的仰视图,图5中显示多个焊锡球30是以格子状阵列的排列方式设置于封装体20的下层表面以将封装体20电连接至电路板22。每一个锚状钉针28是设置于封装体20的角落。在实际应用上,锚状钉针28刚好符合封装体20所形成的洞,但是锚状钉针28也可很轻易的直接融于封装体20的底部以达到相同的固定功效。锚状钉针28安置于封装体20的四个角落位于由最外层的焊锡球30所围成的周界之外,以这样的排列确保锚状钉针28可以支撑任何加诸于封装体20或电路板22上的负荷。或者,锚状钉针28可以与焊锡球30混合排列,但是不建议这样的排列,因为焊锡球30通常聚集相当地靠近。本发明并不受限于图5中所示的焊锡球30的排列方式。再者,焊锡球30可以为钉针或其他可用来提供封装体20及电路板22之间的电连接的装置。
锚状钉针28确切的直径、长度及材料决定于焊锡球30的精确的排列位置及其使用的材料以及其他的设计参数。然而,锚状钉针28并不提供集成电路封装体20及电路板22之间的电连接。此处所述的优选实施例,锚状钉针28的直径约等于多个焊锡球30的平均直径,其材料比焊锡球30的材料有着更高的耐压及韧度。
请参考图6,图6显示电子元件组24的侧视图,图6中所示的锚状钉针28是贯穿于集成电路封装体20及电路板22中。在优选实施例中,每一个钉针28在封装体20端具有一斜状的头而于电路板22端则具有一不可移去式的扁平紧固物。如前面所提到的,钉针28确切的形状、大小及末端连接决定于设计时考虑到的所有必要因素。基本上,钉针28被设计为将封装体20固定于电路板22上。
图6也显示多个焊锡球30提供集成电路封装体20电连接于电路板22,此连接法为现有的技术。
若电子元件组24受到热感应机械式负荷或直接机械式负荷,此两者可能如前面现有技术中所详述的同时且循环地发生,电子元件组24可能会沿一轴线弯曲,如图7所示。一般来说,电子元件组24可能会沿许多的轴线弯曲,但为了清楚起见,仅标示一轴线在此优选实施例的叙述中。沿多轴线弯曲的情形可用熟知的重叠原理(superposition)来达成。由于不同的膨胀系数,若电子元件组24经历了热感应机械式负荷,或由于不同的韧度,若电子元件组24经历了直接机械式负荷,电路板22明显地比集成电路封装体20更弯曲。不管是何种情形的弯曲,焊锡球30及锚状钉针28皆受到一张力的负荷。锚状钉针28的机械特性使其能提供大部分原应由焊锡球30所提供的负荷。注意电路板22由锚状钉针28所维持的区域32用来符合封装体20的形状。如此一来,没有任何的焊锡球30会承受一大到足以造成立即性或疲劳性的崩溃的压力。
本发明方法的第二实施例如图8所示,图8为集成电路封装体20及电路板22的侧视图。封装体20是以多个金属带32固定于电路板22上,金属带32沿集成电路封装体20上最外层的焊锡球30所围成的周界外的四个角。金属带32融解于封装体20及电路板22的四边上,并且金属带32也由产生作为电连接之用的焊锡球30的同一装置于制作焊锡球30的同时所产生。值得注意的是金属带32并不提供任何的电连接于封装体20及电路板22之间。金属带32的确切的数量、尺寸、布置及材料决定于相关的设计参数,例如预期的制造或操作的温度范围及外部的负荷。
本发明方法的第三实施例如图9所示,图9为集成电路封装体20及电路板22的侧视图。封装体20以多个剩余的焊锡球34固定于电路板22上。焊锡球34设置于所述集成电路封装体20的四个角落。这些以机械式的方式将集成电路封装体20固定于电路板22的焊锡球34是融解于封装体20的底层及电路板22上,并且由制造作为电连接之用的焊锡球30的装置于制作焊锡球30的同时被制作。如前述实施例相似,剩余的焊锡球34并不提供任何的电连接于封装体20及电路板22之间。剩余的焊锡球34的确切的数量、尺寸、布置及材料决定于相关的设计参数,例如预期的制造或操作的温度范围及外部的负荷。
本发明的第四实施例如图10所示,图10为集成电路封装体20的仰视图。为清楚起见,电路板22并未显示于图10中。一连续的焊锡带36是沿集成电路封装体20的周界置放用来以机械式的方式将封装体20连接至电路板22。焊锡带36是由制造作为电连接之用的焊锡球30的装置于制作焊锡球30的同时被制作。焊锡带36并不提供任何的电连接于封装体20及电路板之间。连续的焊锡带36的确切的数量、尺寸、布置及材料决定于相关的设计参数,例如预期的制造或操作的温度范围及外部的负荷。或者,焊锡带36不需要是连续的,其也可能分为一段一段的。
总之,如所述用来将集成电路封装体固定至电路板上的方法提供一加强的机械式连接。相较于先前技术,本发明的锚状物充分的分摊热感应或直接机械负荷,而两者可能同时且循环的发生,防止焊锡球受到过大的压力而破裂。此加强韧度的封装体固定法将减少焊锡球机械性的崩溃。
以上所述仅为本发明的优选实施例,凡依本发明权利要求所做的均等变化与修饰,皆应属本发明专利的涵盖范围。
Claims (11)
1.一种用来将一集成电路封装体固定于一电路板上的方法,所述集成电路封装体包括多个电连接点,所述多个电连接点是以内限于一周界的排列方式被设置于所述集成电路封装体的主要表面上,所述方法包括有:
将所述集成电路封装体放置于所述电路板上,以使所述集成电路封装体的主要表面邻接于所述电路板的一主要表面;
透过所述多个电连接点将所述集成电路封装体电连接至所述电路板;以及
将一锚状物的一端固定于所述集成电路封装体上,另一端以热融的方式固定于所述电路板上,并通过所述锚状物来支撑集成电路封装体而防止压毁锡球;
其中所述锚状物并不在所述集成电路封装体与所述电路板之间提供任何电连接的功能。
2.如权利要求1所述的方法,其中所述锚状物是被设置于所述周界以外的位置。
3.如权利要求2所述的方法,其中所述集成电路封装体的主要表面的形状为矩形,而所述多个电连接点的排列方式为格子状阵列。
4.如权利要求3所述的方法,其中所述锚状物是被设置于所述集成电路封装体的主要表面的四个角落。
5.如权利要求3所述的方法,其中所述锚状物是沿着所述集成电路封装体的主要表面的四个边做设置。
6.如权利要求3所述的方法,其中所述锚状物是被设置于所述集成电路封装体的边缘。
7.如权利要求1所述的方法,其中所述锚状物为一金属带。
8.如权利要求1所述的方法,其中所述锚状物为一未接任何讯号的焊锡球。
9.如权利要求1所述的方法,其中所述锚状物为一细长的焊料。
10.如权利要求1所述的方法,其中所述透过所述多个电连接点将所述集成电路封装体电连接至所述电路板步骤,与所述将一锚状物的一端固定于所述集成电路封装体上,另一端以热融的方式固定于所述电路板上步骤,是同时且被相同的装置所完成。
11.如权利要求1所述的方法,其中所述电连接点为焊锡球。
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US10/064,462 US6978539B2 (en) | 2002-07-17 | 2002-07-17 | Method for attaching an integrated circuit package to a circuit board |
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JP2006339316A (ja) * | 2005-05-31 | 2006-12-14 | Toshiba Corp | 半導体装置、半導体装置実装基板、および半導体装置の実装方法 |
US7781867B2 (en) * | 2007-12-28 | 2010-08-24 | Fujitsu Limited | Method and system for providing an aligned semiconductor assembly |
DE112009004069T5 (de) * | 2009-01-30 | 2012-06-21 | Hewlett-Packard Development Co., L.P. | Integrierte-Schaltung-Befestigungsstruktur mitLötkugeln und Anschlussstiften |
US10096540B2 (en) | 2011-05-13 | 2018-10-09 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance |
US9953909B2 (en) * | 2016-07-18 | 2018-04-24 | Intel Corporation | Ball grid array (BGA) with anchoring pins |
CN106646969A (zh) * | 2016-11-22 | 2017-05-10 | 深圳市华星光电技术有限公司 | Coa型液晶面板的制作方法及coa型液晶面板 |
CN108505221B (zh) * | 2018-04-17 | 2020-06-30 | 深圳智能量科技服饰有限公司 | 纺织品上芯片无焊固定方法 |
CN114189988A (zh) * | 2021-12-29 | 2022-03-15 | 维沃移动通信有限公司 | 一种印刷电路板组件和电子设备 |
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US20040010911A1 (en) | 2004-01-22 |
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