CN100417523C

CN100417523C - Ink-jet printing head with isolated nozzle controller

Info

Publication number: CN100417523C
Application number: CNB2005100537991A
Authority: CN
Inventors: 卡·西尔弗布鲁克
Original assignee: Silverbrook Research Pty Ltd
Current assignee: Silverbrook Research Pty Ltd
Priority date: 2000-05-24
Filing date: 2000-05-24
Publication date: 2008-09-10
Anticipated expiration: 2020-05-24
Also published as: CN1657290A

Abstract

The present invention provides an ink jet print head which comprises a nozzle cavity 34, a nozzle and a controller 28, wherein the nozzle cavity 34 is used for containing ink 40; the nozzle is limited with an opening 24 which is communicated with a fluid of the nozzle cavity 34; the controller 28 is connected with the nozzle 22 and is isolated from the ink 40 which is contained in the nozzle cavity 34. When the present invention is used, the controller 28 controls the nozzle 22 to jet the ink 40 out from the nozzle cavity 34 via the opening 24.

Description

The ink jet-print head that has the nozzle controller of isolation

The application is dividing an application of the Chinese patent application 00819573.0 that is entitled as " ink jet-print head that has the moving nozzle of outer cartridge controller " that proposed on May 24th, 2000.

Technical field

The present invention relates to ink jet-print head, relate in particular to a kind of ink jet-print head with a nozzle array, each nozzle in its this nozzle array all is a moving nozzle that has outer cartridge controller.

Background technology

The patent application of awaiting the reply jointly

The whole bag of tricks relevant with the present invention, system and device disclose in following patent application of awaiting the reply jointly.These patent applications are that patent applicant of the present invention or assignee and the present invention apply for simultaneously:

PCT/AU00/00518，PCT/AU00/00519，PCT/AU00/00520，PCT/AU00/00521，

PCT/AU00/00522，PCT/AU00/00523，PCT/AU00/00524，PCT/AU00/00525，

PCT/AU00/00526，PCT/AU00/00527，PCT/AU00/00528，PCT/AU00/00529，

PCT/AU00/00530，PCT/AU00/00531，PCT/AU00/00532，PCT/AU00/00533，

PCT/AU00/00534，PCT/AU00/00535，PCT/AU00/00536，PCT/AU00/00537，

PCT/AU00/00538，PCT/AU00/00539，PCT/AU00/00540，PCT/AU00/00541，

PCT/AD00/00542，PCT/AU00/00543，PCT/AU00/00544，PCT/AU00/00545，

PCT/AU00/00547，PCT/AU00/00546，PCT/AU00/00554，PCT/AU00/00556，

PCT/AU00/00557，PCT/AU00/00558，PCT/AU00/00559，PCT/AU00/00560，

PCT/AU00/00561，PCT/AU00/00562，PCT/AU00/00563，PCT/AU00/00564，

PCT/AU00/00565，PCT/AU00/00566，PCT/AU00/00567，PCT/AU00/00568，

PCT/AU00/00569，PCT/AU00/00570，PCT/AU00/00571，PCT/AU00/00572，

PCT/AU00/00573，PCT/AU00/00574，PCT/AU00/00575，PCT/AU00/00576，

PCT/AU00/00577，PCT/AU00/00578，PCT/AU00/00579，PCT/AU00/00581，

PCT/AU00/00580，PCT/AU00/00582，PCT/AU00/00587，PCT/AU00/00588，

PCT/AU00/00589，PCT/AU00/00583，PCT/AU00/00593，PCT/AU00/00590，

PCT/AU00/00591，PCT/AU00/00592，PCT/AU00/00584，PCT/AU00/00585，

PCT/AU00/00586，PCT/AU00/00594，PCT/AU00/00595，PCT/AU00/00596，

PCT/AU00/00597，PCT/AU00/00598，PCT/AU00/00516，PCT/AU00/00517，

PCT/AU00/00511，PCT/AU00/00501，PCT/AU00/00502，PCT/AU00/00503，

PCT/AU00/00504，PCT/AU00/00505，PCT/AU00/00506，PCT/AU00/00507，

PCT/AU00/00508，PCT/AU00/00509，PCT/AU00/00510，PCT/AU00/00512，

PCT/AU00/00513，PCT/AU00/00514，PCT/AU00/00515

This in conjunction with above-mentioned patent application of awaiting the reply jointly as cross reference.

We the U.S. Patent application that awaits the reply jointly (application number: 09/112,821) in brief a kind of moving nozzle device.This moving nozzle device is controlled the displacement of moving nozzle by a kind of magnetic control element regulation, thereby controls the ejection of ink.

A problem of this design is that the parts of moving nozzle device must carry out hydrophobic to be handled, and enters in the controller zone to prevent ink.

The invention provides a kind of moving nozzle device that hydrophobic is handled that do not need to carry out.

Summary of the invention

The invention provides a kind of ink jet-print head, it comprises at least one nozzle assembly, each described nozzle assembly comprises: the nozzle that can move, described nozzle has one and limits the corolla part of nozzle opening and partly go up an extended shirt rim part from corolla, described nozzle opening is communicated with a nozzle chambers fluid that is used for ccontaining ink, described shirt rim part limits the part of the outer wall of described nozzle chambers, and on a base plate of nozzle chambers, be limited with an ink entry hole, limit the second portion of described nozzle chambers outer wall around the enclosure wall of described ink entry hole setting; Can control the thermal flexure type controller that described nozzle moves for one; And attaching parts that described thermal flexure type controller are connected to described nozzle; Wherein, in use, when described thermal flexure type controller heated bending, described attaching parts pass motion to described nozzle makes described nozzle produce displacement, thus by described opening by described nozzle chambers injection ink.

In the present invention, " nozzle " speech is interpreted as having the element of an opening, rather than opening itself.

Above-mentioned shirt rim part can move with respect to substrate, and more particularly, this shirt rim part is the substrate shift reciprocately relatively, and during displacement, ink is sprayed forward, during displacement, can replenish ink in nozzle chambers backward.When the partial dislocation of shirt rim, above-mentioned enclosure wall can be used as restraining device, prevents that ink from spilling from nozzle chambers.And this enclosure wall preferably has involute lip limit part or scrapes part, with as a kind of seal means.Though between above-mentioned lip limit part and the shirt rim part certain interval is arranged because ink viscosity is higher and this gap is very narrow, when nozzle when substrate moves, lip limit or scrape part and can prevent that ink from spilling.

Above-mentioned controller can be made of two crossbeams, and a crossbeam wherein is as active beam, other one as passive beam." active beam " is meant that when controller started, electric current can flow through this beam, and " passive beam " upward do not have electric current to pass through this moment.Because the special tectonic of controller, when electric current flow through active beam, active beam was owing to the resistance themogenesis expands, because passive beam is limited, so bending motion is passed to attaching parts, thereby made nozzle produce displacement.

Above-mentioned beam can at one end use the anchor sheet to fix, and the other end extends upward and links to each other with attaching parts from substrate.Attaching parts comprise one arm, and an end of arm links to each other with controller, and the other end connects nozzle, forms a kind of cantilever design.Therefore, the bending motion of an end that links to each other with controller is exaggerated at the other end, makes nozzle produce required displacement.

Printhead can have a plurality of nozzles, and each nozzle all has controller and the attaching parts that are arranged in on-chip correspondence.Each nozzle and its controller and attaching parts constitute a complete nozzle assembly.

Printhead can be by planar integrated circuit deposition, lithographic printing and etching technics manufacturing, and nozzle assembly also can use these technologies to be produced on the printhead.

Substrate can have an integrated drive circuit layer.This integrated drive electronics layer can use the manufacturing of CMOS processing technology.

Description of drawings

Introduce the present invention in detail below in conjunction with accompanying drawing:

Fig. 1 is the schematic perspective view of the nozzle assembly of the ink jet-print head of realization according to the present invention;

Fig. 2 is the schematic perspective view of the action of the nozzle assembly among Fig. 1 to Fig. 4;

Fig. 5 is the stereogram that constitutes the nozzle array of ink jet-print head;

Fig. 6 is the partial enlarged drawing of the nozzle array of Fig. 5;

Fig. 7 is the stereogram that has the ink jet-print head of a nozzle guard cap;

Fig. 8 a is the step stereogram of making nozzle assembly on ink jet-print head to 8r;

Fig. 9 a is the side sectional view of manufacturing step to 9r;

Figure 10 a is depicted as the template layout of using in each step of manufacture process to 10k;

Figure 11 a is the stereogram of the action of the nozzle assembly made according to the method for Fig. 8 and Fig. 9 to 11c;

Figure 12 a is the side sectional view of the action of the nozzle assembly made according to Fig. 8 and Fig. 9 to 12c.

The specific embodiment

Figure 1 shows that a nozzle assembly 10 of realizing according to the present invention.An ink jet-print head has a plurality of said nozzle assemblies 10, and this nozzle assembly forms an array 14 (seeing Fig. 5 and Fig. 6) on silicon chip 16.Nozzle array 14 will describe in detail below.

Assembly 10 comprises a silicon chip (silicon wafer in other words) 16 that deposits one deck dielectric layer 18.On dielectric layer 18, deposit one deck CMOS passivation layer 20.

Each nozzle assembly 10 comprises the attaching parts of a nozzle that has a nozzle opening 24 22, lever arm 26 forms, and a controller 28.Lever arm 26 is connected to controller on the nozzle 22.

To shown in Figure 4, nozzle has a corolla part 30, extends a shirt rim part 32 from corolla part 30 as Fig. 2.Shirt rim part 32 constitutes the part of the outer wall (seeing that Fig. 2 is to Fig. 4) of nozzle chambers 34.Nozzle opening 24 communicates with the liquid road of nozzle chambers 34.It should be noted that nozzle opening 24 has a circle flange 36, this flange 36 makes the ink 40 in the nozzle chambers 34 form meniscus 38 (see figure 2)s on the convex edge.

On the bottom 46 of nozzle chambers 34, have an ink entry hole 42 (as shown in Figure 6).Ink entry hole 42 communicates with ink admission passage 48 by silicon chip 16.

There is a corral wall 50 outer ring in ink entry hole 42, and enclosure wall 46 extends upward from the bottom.The shirt rim part 32 of said nozzle 22 constitutes the first of nozzle chambers 34 outer walls, and above-mentioned enclosure wall 50 constitutes the second portion of the outer wall of nozzle chambers 34.

The free ending tool of enclosure wall 50 has the lip limit 52 of inside upset, and the sealing ink is played on this lip limit, and when nozzle 22 moved, lip limit 52 can stop ink to spill.Because the viscosity of ink 40 is higher, and the gap between lip limit 52 and the shirt rim part 32 is very little, under the surface tension effects of ink 40, the effect of sealing ink is played on lip limit 52, prevents that ink 40 from spilling from nozzle chambers 34.

Controller 28 is a kind of thermal flexure type adjusting devices, it be connected from silicon chip 16 upwardly extending (extending upward from CMOS passivation layer 20 more precisely) anchor sheet 54.Anchor sheet 54 is installed on the conductive spacer 56, and conductive spacer 56 is as the electric power connecting path that is connected with controller 28.

Controller 28 comprises first beam (58, active beam) and second beam (60, passive beam), and active beam is on passive beam.In a preferred embodiments, beam 58 and beam 60 all are made of conducting ceramic material or contain conducting ceramic material (for example titanium nitride TiN).

First end of beam 58 and beam 60 all is fixed on the anchor sheet 54, and the other end is connected with lever arm 26.When electric current passed through active beam 58, beam 58 can be because resistance be given birth to fuel factor generation thermal expansion.And do not have electric current to pass through on the passive beam 60, so can not expand simultaneously with active beam 58, therefore, beam 58 and beam 60 can produce bending motion, cause lever arm 26 and nozzle 22 to silicon chip 16 displacements, as shown in Figure 3.At this moment, ink can eject by nozzle opening 24, as 62 among Fig. 3.After the thermal source on the active beam 58 is eliminated, promptly stop electric current, nozzle 22 will turn back to its static position, as shown in Figure 4.When nozzle 22 turns back to its static position,, can produce a China ink 64, shown in label among Fig. 4 66 because the ink droplet neck is disconnected.Then, ink droplet 64 is fallen on the printed media, for example a piece of paper.Because the formation of ink droplet 64 can produce a reverse meniscus 68 as shown in Figure 4.Oppositely meniscus 68 causes ink 40 flow nozzle chambeies 34, thereby forms new meniscus 38 (see figure 2)s immediately, for ready from nozzle assembly 10 next melted ink of ejection.

Refer now to Fig. 5 and Fig. 6, wherein described nozzle array 14 in more detail.Nozzle array 14 is used for four-color printhead.So this nozzle array 14 is made of 4 nozzle assembly groups 70, each nozzle assembly group provides a kind of color.Nozzle assembly 10 in each nozzle assembly group 70 is set to two nozzle assembly rows 72 and 74.A nozzle assembly 10 in the nozzle assembly group 70 of having drawn in more detail among Fig. 6.

In order more closely to pack the nozzle assembly 10 among the

nozzle assembly row

72 and 74, the nozzle assembly 10 among the nozzle assembly row 74 is with respect to stagger certain distance or be staggered of the nozzle assembly 10 among the nozzle assembly row 72.And the distance between the nozzle assembly 10 among the nozzle assembly row 72 is enough big, so that the lever arm 26 of the nozzle assembly among the nozzle assembly row 74 is by adjacent nozzles assembly 10 among the nozzle assembly row 72.Need to prove that each nozzle assembly 10 all is a dumb-bell shape, therefore, the nozzle 22 among the nozzle assembly row 72 is nested between the nozzle 22 and controller 28 of the adjacent nozzle assembly 10 among the nozzle assembly row 74.

And for the ease of packing the nozzle 22 among the

nozzle assembly row

72 and 74 more compactly, each nozzle 22 all is hexagonal.

The people in the industry readily appreciates that, in actual use, when nozzle 22 when silicon chip 16 moves, because nozzle opening 24 has a low-angle with nozzle chambers 34, so ink offset from perpendicular slightly when ejection.And the design among Fig. 5 and Fig. 6 has overcome this problem.In above-mentioned two figure, the controller 28 of the nozzle assembly 10 among the

nozzle assembly row

72 and 74 extends to a side of

nozzle assembly row

72 and 74 along same direction.Therefore, the ink droplet of nozzle 22 ejections from nozzle assembly row 72 is parallel to each other with the ink droplet of nozzle 22 ejections from nozzle assembly row 74, thereby has improved print quality.

And as shown in Figure 5, silicon chip 16 has some adhesive pads 76, and these adhesive pads provide through the electrical connection of pad 56 to the controller 28 of nozzle assembly 10.These electrical connections form by cmos layer (not illustrating among the figure).

Please refer to an example of the present invention shown in Figure 7.Simultaneously with reference to preceding figure, the symbol in two drawings is corresponding mutually.

In this example, a nozzle guard cap 80 has been installed on the silicon chip 16 of nozzle array 14.Nozzle guard cap 80 has a main part 82, and this main part 82 has a plurality of passages 84.The nozzle opening 24 of the nozzle assembly 10 in passage 84 and the array 14 is corresponding, and when ink during from any one nozzle opening 24 ejection, ink droplet can be by corresponding passage 84 before getting to printed media.

Main part 82 has certain interval with nozzle assembly 10, by pole pillar 86 supports in other words.One of them pillar 86 has an air inlet openings 88.

In use, when array 14 work, air is inhaled into from air inlet openings 88, and passes through passage 84 with ink.

Because air is different with the speed of ink droplet 64 by the speed of passage 84, so ink droplet 64 can not be subjected to air influence.For example, ink droplet 64 is approximately 3 meter per seconds from the speed of nozzle 22 ejection, and the speed of air by passage 84 is approximately 1 meter per second.

The effect of air is to make passage 84 can not be mingled with foreign particles.If some foreign matter (for example dust granule) drops in the nozzle assembly 10, can produce harmful effect to nozzle.The mode that employing is supplied gas by air inlet openings 88 pressures of nozzle guard cap 80 can be avoided the problems referred to above to a great extent.

Please refer to Fig. 8 to Figure 10, wherein show the technical process of making nozzle assembly 10.

From silicon chip (silicon wafer in other words) 16, at surface deposition one deck dielectric layer (oxide skin(coating) in other words) 18 of silicon chip 16.This dielectric layer 18 is CVD oxides of one deck 1.5 micron thickness.On dielectric layer 18, add one deck resist, use mould 100 to carry out printing treatment then.

Through after the printing treatment, use plasma etching method that dielectric layer 18 is etched on the layer of silicon chip 16, remove resist then, cleaning dielectric layer 18, through above-mentioned steps, ink entry hole 42 has just formed.

In Fig. 8 b, the aluminium 102 of deposition 0.8 micron thickness adds one deck resist then on dielectric layer 18, uses mould 104 to carry out printing treatment.Then, adopt the plasma etching mode that aluminium 102 is etched into dielectric layer 18, remove resist, this layer is cleared up.This processing step formed adhesive pad and with the interconnecting channel of inkjet controller 28.Interconnecting channels is connected to a nmos drive transistor and a bus plane, and connection line forms at cmos layer (not illustrating among the figure).

Then, on resulting device, deposit the PECVD nitride of 0.5 micron thickness again, as CMOS passivation layer 20.On passivation layer 20, add one deck resist, use mould 106 to carry out printing treatment then.Through after the printing treatment, the use plasma etching method to the layer of aluminium 102, in 42 zones, ink entry hole, should etch into nitride etch on the layer of silicon chip 16.Remove resist, then equipment is cleared up.

Spinning one deck sacrifice layer 108 on passivation layer 20.This layer 108 is the light-sensitive polyimide of 6 micron thickness or the high-temperature anticorrosive agent of 4 micron thickness.Layer 108 oven dry, use mould 110 to carry out printing treatment then.After the printing treatment, if layer 108 make by polyimide material, so should be to its baking 1 hour under 400 ℃ of temperature; If layer 108 is made of the high-temperature anticorrosive agent, so should be in the temperature more than 300 ℃ to its baking 1 hour.It should be noted that when designing mould 110, should be taken into account the pattern distortions of the sacrifice layer 108 that is caused by shrinking.

Next step shown in Fig. 8 e, adds second layer sacrifice layer 112 on product.Sacrifice layer 112 can be the light-sensitive polyimide of 2 micron thickness of spinning, also can be the high-temperature anticorrosive agent of 1.3 micron thickness.After sacrifice layer 112 oven dry, use mould 114 to carry out printing treatment.Through after the printing treatment,, should toast 1 hour down at 400 ℃ for the sacrifice layer 112 that constitutes by polyimides; For the sacrifice layer 112 that constitutes by the high-temperature anticorrosive agent, should be baking under the temperature more than 300 ℃ about 1 hour.

Then, the multiple layer metal layer 116 of deposition one deck 0.2 micron thickness on product.The part of this metal level 116 will constitute the passive beam 60 of controller 28.

The processing method of metal level 116 is: 300 ℃ of left and right sides sputters

Thick titanium nitride TiN, sputter then

Thick tantalum nitride TaN, sputter then

Thick tantalum nitride TaN and

Thick titanium nitride TiN, sputter more at last Thick thick titanium nitride TiN.

Also can use TiB ₂, MoSi ₂Or (Ti, Al) N replaces TiN.

Then, use mould 118 to carry out printing treatment to metal level 116, use plasma etching method to etch into sacrifice layer 112 then, next step removes the corrosion inhibitor that is added on the metal level 116 carefully, notes not injuring

sacrifice layer

108 or 112.

Next step, the high-temperature anticorrosive agent of the light-sensitive polyimide of spinning one deck 4 micron thickness or 2.6 micron thickness on metal level 116 forms the 3rd layer of sacrifice layer 120.Sacrifice layer 120 uses mould 122 to carry out printing treatment through after drying.Carry out the heat baking then.For polyimides, should toast about 1 hour sacrifice layer 120 under 400 ℃; For the high-temperature anticorrosive agent, should toast about 1 hour sacrifice layer 120 more than 300 ℃.

Next step deposits second layer multiple layer metal layer 124 again on sacrifice layer 120.The composition of metal level 124 is identical with metal level 116, and technology mode is also identical.Need to prove that metal level 116 and metal level 124 all are conductive layers.

Then, use mould that metal level 124 is carried out printing treatment.Next step uses plasma etching method that metal level 124 is etched into sacrifice layer 120 (polyimides or high-temperature anticorrosive agent), then, the resist layer that is added on the metal level 124 is taken off carefully, notes not injuring sacrifice layer 108,112 or 120.Need to prove that the remainder of metal level 124 will constitute the active beam 58 of controller 28.

Next step, the high-temperature anticorrosive agent of the light-sensitive polyimide of spinning one deck 4 micron thickness or 2.6 micron thickness on metal level 124 forms the 4th layer of sacrifice layer 128.Sacrifice layer 128 uses mould 130 to carry out printing treatment through after drying, the isolated part shown in remaining Fig. 9 k.Then, for polyimide material, should under 400 ℃, toast 1 hour by the remainder to sacrifice layer 128; For the high-temperature anticorrosive agent material, should under the temperature more than 300 ℃, toast 1 hour by the remainder to sacrifice layer 128.

Please refer to Figure 81, on the said goods, deposit the dielectric layer 132 of one deck high Young's modulus again.Dielectric layer 132 is made of the silicon nitride or the aluminium oxide of 1 micron left and right thickness.The depositing temperature of dielectric layer 132 should be lower than the heat baking temperature of sacrifice layer 108,112,120,128.Dielectric layer 132 should have high resiliency modulus, chemical inertness and to the good bonding of TiN.

Next step in the light-sensitive polyimide of spinning one deck 2 micron thickness or the high-temperature anticorrosive agent of 1.3 micron thickness, forms the 5th sacrifice layer 134 on the said goods.Sacrifice layer 134 uses mould 136 to carry out printing treatment through after drying.Then, if polyimide material should toast 1 hour by the remainder to sacrifice layer 134 under 400 ℃; If the high-temperature anticorrosive agent should be toasted about 1 hour at the remainder to sacrifice layer 134 under the temperature more than 300 ℃.

Then, adopt plasma etching method that dielectric layer 132 is etched into sacrifice layer 128, note not injuring sacrifice layer 134.

Above-mentioned steps forms the anchor sheet 54 of nozzle opening 24, lever arm 26 and nozzle assembly 10.

Next step, the dielectric layer 138 of deposition one deck high Young's modulus on the said goods.The deposition process of dielectric layer 138 is: be lower than under the heat baking temperature of sacrifice layer 108,112,120 and 128 silicon nitride or the aluminium nitride of deposition one deck 0.2 micron thickness.

Next step shown in Fig. 8 p, uses to have the degree of depth of the plasma etching method of directionality to 0.35 micron of dielectric layer 138 etching.The purpose of etching is to remove dielectric from all surface, only stays the dielectric on the sidewall of dielectric layer 132 and sacrifice layer 134.This step forms the nozzle flange 36 around the nozzle opening 24, and this nozzle flange 36 makes ink produce above-mentioned meniscus.

Then, on product, add one deck antiultraviolet (UV) adhesive tape 140, the resist behind 4 millimeters of silicon chip 16 back side spinning one decks.Use mould 142 to carry out back-etching then and handle, form ink admission passage 48.Remove corrosion inhibitor from silicon chip 16 then.

One deck antiultraviolet UV adhesive tape (not illustrating among the figure) is pasted at the back side at silicon chip 16.Remove adhesive tape 140 then.Next step is handled sacrifice layer 108,112,120,128 and 134 in oxygen plasma, form the final nozzle assembly 10 shown in Fig. 8 r and Fig. 9 r.For ease of reference, the dash number among above-mentioned two figure is identical with the numbering among Fig. 1, with the associated components of reflection nozzle assembly 10.Figure 11 and 12 is depicted as the work schematic diagram of the nozzle assembly of making according to above-mentioned technical process 10.These accompanying drawings are corresponding to Fig. 4 with Fig. 2.

The insider readily understands, can carry out the variation or the modification of various equivalences according to the present invention who describes in the above-mentioned example.Example of the present invention only is used for illustrating summary of the invention, should not limit scope of invention.Any device that carries out equivalent variations or modification according to the present invention all should belong to scope of the present invention.

Claims

1. ink jet-print head, it comprises at least one nozzle assembly, each described nozzle assembly comprises:

The nozzle that can move, described nozzle has one and limits the corolla part of nozzle opening and partly go up an extended shirt rim part from corolla, described nozzle opening is communicated with a nozzle chambers fluid that is used for ccontaining ink, described shirt rim part limits the part of the outer wall of described nozzle chambers, and on a base plate of nozzle chambers, be limited with an ink entry hole, limit the second portion of described nozzle chambers outer wall around the enclosure wall of described ink entry hole setting;

Can control the thermal flexure type controller that described nozzle moves for one; And

Attaching parts that described thermal flexure type controller are connected to described nozzle;

Wherein, in use, when described thermal flexure type controller heated bending, described attaching parts pass motion to described nozzle makes described nozzle produce displacement, thus by described opening by described nozzle chambers injection ink.

2. printhead as claimed in claim 1 is characterized in that,

When described shirt rim part by the actuating of described thermal flexure type controller during with respect to the displacement of the base plate of described nozzle chambers, described enclosure wall is used for as suppressing the restraining device that ink spills from described nozzle chambers.

3. printhead as claimed in claim 1 is characterized in that, described thermal flexure type controller is made of two beams, and one as active beam, and another is as passive beam.

4. printhead as claimed in claim 1 is characterized in that,

Described thermal flexure type controller and described nozzle are arranged on the substrate, and described nozzle chambers is arranged in the described substrate; And

One end of each beam anchors to one and is installed on the described on-chip anchor sheet, and the other end links to each other with described attaching parts.

5. printhead as claimed in claim 1 is characterized in that, described attaching parts comprise an arm, and described arm has first end that is connected with described thermal flexure type controller with cantilevered fashion and second end that is connected with described nozzle.