CN100428250C - Method for controlling conductor length between through hole and welding disk of printed circuit board - Google Patents
Method for controlling conductor length between through hole and welding disk of printed circuit board Download PDFInfo
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- CN100428250C CN100428250C CNB200510110102XA CN200510110102A CN100428250C CN 100428250 C CN100428250 C CN 100428250C CN B200510110102X A CNB200510110102X A CN B200510110102XA CN 200510110102 A CN200510110102 A CN 200510110102A CN 100428250 C CN100428250 C CN 100428250C
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Abstract
The present invention relates to an electronic technology and discloses a control method for the length of a conducting wire between a through hole and a bonding pad of a printed circuit board so that for PCB design under the condition that the length of a conducting wire between a bonding pad and a through hole is limited, design efficiency and design quality can be improved. In the present invention, the through hole is provided with a virtual point; through the characteristic that the distance between the virtual point and the bonding pad can be automatically measured, the length of the conducting wire is automatically adjusted; specific steps for the automatic adjustment of the length of the conducting wire are provided.
Description
Technical field
The present invention relates to electronic technology, particularly the PCB design technology in the electronic technology.
Background technology
Along with the development of infotech, electronic equipment and people's life is more and more closer, and they almost appear at each corner of life.Printed circuit board (PCB) (Printed Circuit Board is called for short " PCB ") appears in most electronic equipments as important components.Except fixing various electron devices, the major function of PCB is to provide mutual being electrically connected for the various electron devices above it.Those of ordinary skill in the art knows that the substrate of PCB is to be made by the heat insulation and unbending material of insulation, provides the circuit of electron device to connect on the surface of pcb board by lead.
Various electron devices can directly be welded on the pcb board, and are for immobilising device and guarantee device pin and the pcb board in corresponding place has circuit connecting relation, corresponding local according to device pin size design conductive contact surfaces, i.e. a pad on pcb board.
Along with electronic equipment becomes increasingly complex, the electron device on the PCB is more and more, and circuit connects and becomes increasingly complex, and in one plane can not cross wire, the wiring of individual layer can not meet the demands, and so just having occurred can bilayer or the PCB of multilayer wiring.Only the PCB that in one plane connects up is called single sided board, is called dual platen at the PCB of two enterprising row wirings in plane, is called multilayer board at the PCB of the enterprising row wiring in a plurality of planes.Lead on the Different Plane layer can connect by the plated through-hole from one deck of PCB to other one deck, and these plated through-holes are called via hole.
Along with the extensive raising of system design complicacy and integrated level, the frequency of operation of electronic equipment also improves greatly, and this will produce the integrity issue of transmission line effect and signal.The lead of PCB can produce electric capacity, resistance and the inductive effect of serial or parallel connection during high-frequency work, and relative frequency of operation, and the time-delay that lead produces can not be ignored, and these are commonly referred to as transmission line effect.Sometimes in order to guarantee the signal quality of pcb board upper conductor transmission, the width and the length of the lead on the pcb board is had strict requirement.As jitty RAMBUS (a kind of chip), its pad just has specific (special) requirements to the track lengths of via hole.Figure 1 shows that the surface wiring of the pcb board of jitty RAMBUS.Wherein, little grey round dot is the pad of device, and big grey round dot is a via hole, and white is the lead of connection pads and via hole.On pcb board shown in Figure 1, the lead that width is thinner all has length requirement.In general, for the constrained lead of length, its length allows length to limit by wiring maximum/minimum, during the design pcb board, needs the length of this lead of control to allow between the length between wiring maximum/minimum.When PCB layout, its long measure is generally mil (MIL).
Along with the raising of wiring density and frequency of operation, the wiring rule of pcb board becomes increasingly complex, very important link when wiring has become the PCB design.Although existing electric design automation (Electronic Design Automation, abbreviation " EDA ") instrument is very powerful, general eda tool all can provide auto-placement tool to finish the wiring of pcb board to assist the designer, but, can not guarantee to complete successfully self routing for the wiring rule of more complicated.
In general, for length of arrangement wire the lead of strict demand is arranged, eda tool software can be listed the constraint of length of arrangement wire, and carries out self routing according to constraint.But pad is when the length of arrangement wire of via hole has constraint rule, and existing eda tool software can not carry out self routing according to these constraint rules, at this moment just needs to consider other wiring solution.
Existing technical scheme adopts manual wiring to realize the control of via hole to conductor length between pad, at first manual lead is pulled out from pad of designer beaten via hole then, and then the length of measurement lead, if just having lacked, elongates a bit again by lead, transfer weak point a bit again if just grown, up to meeting the requirements.As shown in Figure 2, the designer can watch the length of the selected lead of functional measurement by the track lengths that eda tool provides, and carries out manual setting according to the length constraint rule.
Existing technical scheme adopts manual mode to carry out pad and has been wiring under the limited situation of hole guide wire length, the operation of backguy during to all these harness wirings, measurement and adjustment length all needs manual carrying out, if after the manual wiring accidental modification lead can not be found yet, check after design is finished also needs manually to carry out, so efficient is very low and quality can't guarantee, and carry out error checking and revise very difficulty for a pcb board of having finished design, need cost more time and expense.
Therefore, in actual applications, there is following problem in existing technical scheme: efficient is low, quality can't guarantee, needs more design time and higher design cost.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide the method for conductor length control between a kind of via hole of printed circuit board (PCB) and pad, makes to be PCB design under the limited situation of hole guide wire length for pad, can improve design efficiency and quality.
For achieving the above object, the invention provides the method for conductor length control between a kind of via hole of printed circuit board (PCB) and pad, comprise following steps:
A carries out the wiring of top layer lead and beats via hole according to the rule of design tool support, finishes the wiring of other lead except via hole arrives the constrained lead of pad length;
B virtual point is set on the via hole of printed circuit board (PCB) and described virtual point is set and described pad between the length rule, store described virtual point and length rule;
C adjusts the length and the position of the lead between described pad and described via hole according to the length rule that sets;
Wherein, when adjusting, lead obtains distance between corresponding via hole and pad by measuring distance between described virtual point and pad.
Wherein, described step C also comprises following substep:
C1 is stretched to the length that described length rule is set with lead between described via hole and described pad;
C2 progressively checks the distance of described lead to other lead or described pad along assigned direction, if the lead of this distance less than predetermined distance then by shrinking this place is to satisfy the distance regulation, and, reach the length of length rule setting again or reach limit of stretch until this lead satisfying apart from stretching this lead at this place to a layback under the defined terms along assigned direction;
Described step C1 and C2 are carried out in circulation.
In this external described method, when described step C1 and C2 were carried out in circulation, the described assigned direction in adjacent twice circulation among the step C2 can be identical or different.
In this external described method, described assigned direction comprises:
From top to bottom, from top to bottom, from left to right, from right to left and other any one rectilinear direction.
In this external described method, the number of times that described step C1 and C2 circulation are carried out is set in advance.
In this external described method, among the described step B, when being set, described virtual point also comprises following substep:
The B1 input is as the position of the described pad of starting point;
B2 searches for to first via hole along described lead from the described position of input;
B3 obtains this via hole coordinate and set described virtual point on this coordinate.
Before described step B, also comprise following steps:
D checks in the list of rules of described virtual point correspondence whether the conductor length between described via hole and pad meets rule.
By relatively finding, the key distinction of technical scheme of the present invention and prior art is, the present invention is provided with T point (being virtual point) on via hole, the characteristics of utilizing the distance of T point and pad to measure automatically, automatically adjust conductor length, and the concrete steps of automatic adjustment conductor length are provided.
Difference on this technical scheme, brought comparatively significantly beneficial effect, promptly owing to utilize the present invention program to carry out self routing to the lead between pad and the via hole, therefore improved the efficient of wiring greatly, shortened design time, and because the reliability of self routing is higher and wiring can be checked by list of rules is unified after finishing, can obviously improve the quality of products and work efficiency, effectively avoid the inspection and the modification of pcb board that design is finished, greatly reduced design total expenses and T.T..
Description of drawings
Fig. 1 is the surface wiring synoptic diagram of the pcb board of jitty RAMBUS;
Fig. 2 is a synoptic diagram of watching the length of the selected lead of functional measurement by the track lengths that eda tool provides;
Fig. 3 is the flow process according to conductor length control between the PCB via hole of better embodiment of the present invention and pad;
Fig. 4 be the rule wiring of supporting according to design tool in first better embodiment of the present invention and beat via hole after PCB top layer cabling synoptic diagram;
Fig. 5 is the top layer cabling synoptic diagram that adds T point back PCB in first better embodiment of the present invention on via hole;
Fig. 6 is a list of rules synoptic diagram of in first better embodiment of the present invention that corresponding section lead of each T point having been set the length rule;
Fig. 7 is provided with the flow process that T is ordered according to first better embodiment of the present invention on via hole;
Fig. 8 carries out the flow process of self routing according to first better embodiment of the present invention according to the length rule of via hole and pad;
Fig. 9 is according to the pad of pcb board and the wiring synoptic diagram between the via hole after the automatic adjustment pad of first better embodiment of the present invention and the conductor length between the via hole;
Figure 10 is the list of rules of lead between pad and the via hole in the design tool of first better embodiment of the present invention.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, the present invention is described in further detail below in conjunction with accompanying drawing.
Consider that present eda tool can measure the T point automatically to the pad distance, the present invention program increases the T point automatically on via hole, and at each T point setting constraint rule, just can use the self routing function of eda tool to connect up then, can also whether meet the requirements by list of rules inspection wiring at last.By utilizing the present invention program, become manual wiring and be to have very great help self routing for the raising of pcb board design efficiency and quality, also made things convenient for inspection, also shortened design time simultaneously, reduced design cost.
According to the flow process of conductor length control between the PCB via hole of better embodiment of the present invention and pad as shown in Figure 3.
At first enter step 310, carry out the wiring of top layer lead and beat via hole according to the rule of design tool support.Persons of ordinary skill in the art may appreciate that this step can finish except the wiring of via hole to other lead of the constrained lead of pad length, connect up and beat hole operation and can adopt also can adopt manually automatically and finish.In first better embodiment of the present invention, after step 310 was finished, the top layer cabling of PCB as shown in Figure 4.In Fig. 4, via hole all has length restriction to the thinner lead of width between pad, only having finished via hole this moment is connected with circuit between pad, because the restriction of existing design tool, the result of self routing is that the lead between via hole and pad is short as much as possible under the regular prerequisite that meets the design tool support, does not realize the length control of these leads.
Then enter step 320, in the length rule that lead between T point and setting via hole and pad is set on the via hole.Need to prove, though the T point is a virtual point, but existing design tool can support to measure automatically pad to the conductor length between the T point, by measuring the conductor length between via hole and pad automatically and the length rule is set for this section lead in that the T point being set on the via hole.Existing design tool does not support via hole to measure automatically to the conductor length between pad, and the present invention measures to the conductor length between pad automatically by realize via hole indirectly at automatic " subsides " T point on the via hole.It is to realize the self-adjusting basis of conductor length that via hole is measured automatically to the conductor length between pad.In first better embodiment of the present invention, increased behind the T point part PCB surface as shown in Figure 5, only shown among this figure that part via hole, pad and the circuit between them connect, wherein, square pattern is the T point that increases newly.In first better embodiment of the present invention, the list of rules that corresponding section lead of each T point has been set the length rule as shown in Figure 6.Among Fig. 6, I28A_RDR2_DQB0 is the signal name that this section lead transmits; The meaning of U47.N4:I28A_RDR2_DQB0.T.1 is two points in this signal, and promptly U47.N4 (pad of device) is to the distance of I28A_RDR2_DQB0.T.1 (the T point of increase); I2.. be the rule name of composing; 61MIL and 62MIL minimum length and the maximum length that allows of wiring of allowing of representing respectively to connect up; First digit behind the 61MIL is represented actual track lengths, and how much poor back to back negative number representation is also from the minimum length that allows of wiring; First digit is represented actual track lengths behind the 62MIL, and in fact back to back numeral lacks what than the maximum length that allows of wiring.
In first better embodiment of the present invention, the operation that T orders is set on via hole in the step 320 can be carried out automatically, also comprises some substeps, and its flow process as shown in Figure 7.
When the T point was set on a via hole, at first execution in step 710, the position of input starting point pad.For example, the position of the starting point pad of input is U1.1.
Then enter step 720, search is until first via hole from the starting point pad along thread guide path.If the starting point pad locations of input is U1.1 in step 710, then in this step, be that the thread guide path that the pad of U1.1 connects is searched for along the position, first via hole that connects until this lead.
Then enter step 730, read this via hole coordinate.Wherein, the coordinate of via hole can be expressed as (a, form b).
At last, in step 740, set the T point in this via hole coordinate.If the via hole coordinate that obtains in step 730 is for (a, b), then in this step, (a b) goes up T point of automatic setting at coordinate.
After the T point being set on the via hole and setting the length rule of lead between via hole and pad, enter step 330, carry out self routing according to the length rule of lead between via hole and pad.Those having ordinary skill in the art will appreciate that, thereby owing to can measure conductor length between via hole and pad automatically being provided with the T point on the via hole, therefore can no longer need manually every lead to be connected up according to the regular self routing of the length of via hole and pad so that the conductor length between via hole and pad meets rule request.Because the result of self routing is that the lead between via hole and pad is short as much as possible under the regular prerequisite that meets the design tool support, so the operation in this step mainly is that lead is stretched.Need to prove that lead can be stretched as circular arc, also can be for arbitrarily angled.
In first better embodiment of the present invention, step 330 also comprises some substeps, and its flow process as shown in Figure 8.
When the lead between via hole and the pad is carried out self routing according to the length rule, at first enter step 810, obtain the length that lead need stretch between via hole and the pad.In first better embodiment of the present invention, by the T point is set on via hole, computing machine can read the current length of every lead between via hole and pad automatically, and obtain the maximum length that allows of wiring of this lead according to the length rule of correspondence, deduct current length with the maximum permission of the wiring length of this lead and promptly can obtain the tensile elongation that this lead need stretch.
Then enter step 820, do not consider spacing between lead and adjacent wires or the pad, according to the tensile elongation that obtains in the step 810 this lead that stretches.Wherein, the wire shape after stretching in this step is unqualified, can be circular arc, also can be for arbitrarily angled.
Then enter step 830, check from the top down whether spacing is too little between lead and adjacent wires or the pad,, otherwise directly enter step 850 if then enter step 840.Wherein, the spacing of lead and adjacent wires or pad limited by rule before design PCB.This step is checked lead and its, and whether the spacing of Square wire or pad is too little down, if too little then need to adjust.
If check to find that from top to bottom lead and adjacent wires or solder pad space length are too little, then in step 840, shrink this lead, guarantee downwards to satisfy under the condition of spacing and replenish tensile elongation as far as possible.In first better embodiment of the present invention, if this step inspection has found that the lead or the solder pad space length of its below of a conductor spacing between via hole and pad are too little, then adjust this lead and make itself and the lead of its below or the spacing of pad conform with rule, the length of this lead is met the demands.Wherein, the shape of lead and move towards unqualified during adjustment.
If check from top to bottom and find that lead and adjacent wires or solder pad space length are suitable, then this lead is not handled direct execution in step 850, repeating step 810 and 820.
Then enter step 860, check from bottom to top whether spacing is too little between lead and adjacent wires or the pad,, otherwise directly enter step 880 if then enter step 870.This step inspection whether be that lead and its are gone up the spacing of Square wire or pad too little, if too little then need adjustment.
If check to find that from top to bottom lead and adjacent wires or solder pad space length are too little, then in step 870, shrink this lead, guarantee upward to satisfy under the condition of spacing and replenish tensile elongation as far as possible.In first better embodiment of the present invention, if this step inspection has found that the lead or the solder pad space length of its top of a conductor spacing between via hole and pad are too little, then adjust this lead and make the lead or the solder pad space length of itself and top conform with rule, the length of this lead is met the demands.Wherein, the shape of lead and move towards unqualified during adjustment.
If check from top to bottom and find that lead and adjacent wires or solder pad space length are suitable, then this lead is not handled direct execution in step 880, repeating step 810 and 820.
Then enter step 890, check from left to right whether spacing is too little between lead and adjacent wires or the pad,, otherwise directly enter step 910 if then enter step 900.This step inspection be whether the spacing of lead and its right-hand lead or pad too little, if too little then need to adjust.
If check that spacing is too little between lead and adjacent wires or the pad from left to right, then in step 900, shrink this lead, satisfy to right-hand assurance under the condition of spacing and replenish tensile elongation as far as possible.In first better embodiment of the present invention, if this step inspection has found that its right-hand lead of a conductor spacing or solder pad space length between via hole and pad are too little, then adjust this lead and make itself and right-hand lead or the solder pad space length conform with rule, the length of this lead is met the demands.Wherein, the shape of lead and move towards unqualified during adjustment.
If check that spacing is suitable between lead and adjacent wires or the pad from left to right, then this lead is not handled direct execution in step 910, repeating step 810 and 820.
Then enter step 920, check from right to left whether spacing is too little between lead and adjacent wires or the pad,, otherwise directly enter step 940 if then enter step 930.This step inspection be whether the spacing of lead and its left lead or pad too little, if too little then need to adjust.
If check spacing between lead and adjacent wires or the pad from right to left, then in step 930, shrink this lead, guarantee to satisfy to left under the condition of spacing and replenish tensile elongation as far as possible.In first better embodiment of the present invention, if this step inspection has found that its right-hand lead of a conductor spacing or solder pad space length between via hole and pad are too little, then adjust this lead and make itself and right-hand lead or the solder pad space length conform with rule, the length of this lead is met the demands.Wherein, the shape of lead and move towards unqualified during adjustment.
If check that spacing is suitable between lead and adjacent wires or the pad from right to left, then this lead not to be handled, execution in step 940 judges whether to reach the cycling number of times, if then finish, otherwise enters step 810 once more.Wherein, the cycling number of times can be set by the designer before self routing.
In first better embodiment of the present invention, adjust the conductor length between pad and the via hole automatically after, the pad of pcb board and the wiring between the via hole are as shown in Figure 9.
Need to prove, if desired check whether the conductor length between pad and the via hole meets the requirements after finishing in steps, no longer need manually check one by one according to existing scheme, can directly from the list of rules of design tool, check, whether length meets, requires also to come into plain view, as shown in figure 10.
Though pass through with reference to some of the preferred embodiment of the invention, the present invention is illustrated and describes, but those of ordinary skill in the art should be understood that and can do various changes to it in the form and details, and without departing from the spirit and scope of the present invention.
Claims (5)
1. the method for conductor length control between the via hole of a printed circuit board (PCB) and pad is characterized in that, comprises following steps:
A carries out the wiring of top layer lead and beats via hole according to the rule of design tool support, finishes the wiring of other lead except via hole arrives the constrained lead of pad length;
B virtual point is set on the via hole of printed circuit board (PCB) and described virtual point is set and described pad between the length rule, store described virtual point and length rule;
C adjusts the length and the position of the lead between described pad and described via hole according to the length rule that sets, up to satisfying predetermined termination condition;
Wherein, when adjusting, lead obtains distance between corresponding via hole and pad by measuring distance between described virtual point and pad.
2. the method for conductor length control between the via hole of printed circuit board (PCB) according to claim 1 and pad is characterized in that described step C comprises following substep:
C1 is stretched to the length that described length rule is set with lead between described via hole and described pad;
C2 progressively checks the distance of described lead to other lead or described pad along assigned direction, if the lead of this distance less than predetermined distance then by shrinking this place is to satisfy the distance regulation, and, reach the length of length rule setting again or reach limit of stretch until this lead satisfying apart from stretching this lead at this place to a layback under the defined terms along assigned direction;
Described step C1 and C2 are carried out in circulation, up to satisfying predetermined termination condition;
Wherein, when described step C1 and C2 were carried out in circulation, the described assigned direction in adjacent twice circulation among the step C2 can be identical or different;
Described termination condition is that circulation reaches predetermined times.
3. the method for conductor length control between the via hole of printed circuit board (PCB) according to claim 2 and pad is characterized in that described assigned direction comprises:
From top to bottom, from top to bottom, from left to right, from right to left and any one rectilinear direction.
5. according to the method for conductor length control between the via hole of each described printed circuit board (PCB) in the claim 1 to 3 and pad, it is characterized in that, among the described step B, comprise following substep when described virtual point is set:
The B1 input is as the position of the described pad of starting point;
B2 searches for to first via hole along described lead from the described position of input;
B3 obtains this via hole coordinate and set described virtual point on this coordinate.
6. according to the method for conductor length control between the via hole of each described printed circuit board (PCB) in the claim 1 to 4 and pad, it is characterized in that, after described step C, also comprise following steps:
D checks in the list of rules of described virtual point correspondence whether the conductor length between described via hole and pad meets rule.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510110102XA CN100428250C (en) | 2005-11-08 | 2005-11-08 | Method for controlling conductor length between through hole and welding disk of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510110102XA CN100428250C (en) | 2005-11-08 | 2005-11-08 | Method for controlling conductor length between through hole and welding disk of printed circuit board |
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| CN1858750A CN1858750A (en) | 2006-11-08 |
| CN100428250C true CN100428250C (en) | 2008-10-22 |
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| CNB200510110102XA Expired - Fee Related CN100428250C (en) | 2005-11-08 | 2005-11-08 | Method for controlling conductor length between through hole and welding disk of printed circuit board |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201855B (en) * | 2006-12-13 | 2010-05-19 | 英业达股份有限公司 | Method for wiring path of switching signal line |
| CN101236078B (en) | 2007-02-02 | 2011-01-05 | 鸿富锦精密工业（深圳）有限公司 | Capacitance to via hole guide wire length checking system and method |
| TWI409654B (en) * | 2007-02-12 | 2013-09-21 | Hon Hai Prec Ind Co Ltd | System and method for checking distance between capacitance and via |
| CN101271481B (en) * | 2007-03-23 | 2011-06-15 | 英业达股份有限公司 | Through-hole component auxiliary arranging system and method |
| CN101533827B (en) * | 2008-03-11 | 2012-06-27 | 松下电器产业株式会社 | Semiconductor integrated circuit device |
| CN104573157A (en) * | 2013-10-24 | 2015-04-29 | 英业达科技有限公司 | Method and device for checking printed circuit |
| CN106802970B (en) | 2015-11-26 | 2020-05-19 | 英业达科技有限公司 | Printed circuit board layout method and system |
| TWI566114B (en) * | 2015-12-03 | 2017-01-11 | 英業達股份有限公司 | Method and system for printed circuit board layout |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151868A (en) * | 1989-02-06 | 1992-09-29 | Hitachi, Ltd. | Signal line terminal allocation method |
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2005
- 2005-11-08 CN CNB200510110102XA patent/CN100428250C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151868A (en) * | 1989-02-06 | 1992-09-29 | Hitachi, Ltd. | Signal line terminal allocation method |
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