CN100442597C - Method for manufacturing shell with radiating element and shell using same manufacture method - Google Patents
Method for manufacturing shell with radiating element and shell using same manufacture method Download PDFInfo
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- CN100442597C CN100442597C CNB2004100562715A CN200410056271A CN100442597C CN 100442597 C CN100442597 C CN 100442597C CN B2004100562715 A CNB2004100562715 A CN B2004100562715A CN 200410056271 A CN200410056271 A CN 200410056271A CN 100442597 C CN100442597 C CN 100442597C
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- radiant element
- electrically connected
- load point
- radiant
- conducting
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Abstract
The present invention relates to a method for manufacturing a shell with a radiating element, which comprises the steps: a) a thin film is provided with a radiating element which is provided with a feed-in point; B) a conductive element is electrically connected with the feed-in point; C) a base material which firmly holds the conductive element is formed, and the base material and the thin film together cover the radiating element.
Description
Technical field
The present invention relates to a kind of manufacture of casing, particularly relate to a kind of shell that has the manufacture of casing of radiant element and use this method manufacturing.
Background technology
More be progressive today in mechanics of communication, it is compact that the volume of mobile phone more and more tends to, relatively, and also relative being restricted in the applicable space of the antenna of mobile phone.At present general common antenna can be divided into exposed and concealed two kinds haply: exposed antenna includes unipole antenna (monopole antenna) and helical antenna (helix antenna) or the like; Concealed antenna has then comprised planar inverted F-shape antenna (Planar Inverted F Antenna) and microstrip type antenna (microstrip antenna) etc...Wherein, though exposed antenna can provide the function of preferable receiving and transmitting signal, on moulded, there is antenna to give prominence to shortcoming.And general concealed antenna is to be installed in casing inside one to be laid with on other printed circuit board (PCB) in order to the electronic component of reaching cell-phone function, though can reach the effect of conceal antenna, but laying the space originally with regard on the very limited circuit board, taken suitable space, relatively compressed the spendable space of other element, this more is exquisite, small and exquisite today for the mobile phone volume requirement, forms the difficulty in the design.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of manufacture of casing with radiant element that can effectively increase the laid space on the circuit board.
Another object of the present invention is to provide a kind of shell with radiant element.
A further object of the present invention is to provide the electronic installation that is embedded with radiant element in a kind of shell.
So, the present invention discloses a kind of manufacture of casing with radiant element and comprises: A) lay a radiant element on a film, wherein, this radiant element has a load point, A1) this film is compressed to a body that defines an accommodation space, and this radiant element is formed at the bottom surface of this accommodation space; A2) punching press cuts the unnecessary material of this film; B) conducting element is electrically connected this load point; C) form the base material of this conducting element of fixing, and make this base material and this radiant element of this film covering.
The present invention has also disclosed a kind of shell with radiant element, is used for being electrically connected with a circuit board, comprises a housing, a radiant element, a conducting element.This housing has an outer and internal layer, this skin is a flexible thin film, this flexible thin film is compressed to the body that defines an accommodation space, this radiant element is laid in this flexible thin film and is somebody's turn to do interior interlayer, and this radiant element is formed at the bottom surface of this accommodation space, and conducting element is electrically connected this radiant element and emergence goes out this housing, and this conducting element has one irregular, and this irregular face is electrically connected on this load point.
In addition, the present invention has disclosed a kind of electronic installation with radiant element in addition, comprises a housing, a radiant element, a conducting element, and a circuit board.This housing has an outer and internal layer, this skin is a flexible thin film, this flexible thin film is compressed to the body that defines an accommodation space, this radiant element is laid in this flexible thin film and is somebody's turn to do interior interlayer, and this radiant element is formed at the bottom surface of this accommodation space, and this radiant element has a load point, and conducting element is electrically connected this radiant element and emergence goes out this housing, this conducting element has one irregular, and this irregular face is electrically connected on this load point.Circuit board is laid with one in order to be electrically connected the signal transmitting and receiving module of this conducting element.
Description of drawings
Fig. 1 is a stereogram, and its explanation the present invention has the preferred embodiment of the shell of radiant element;
Fig. 2 is a cutaway view, and it illustrates this preferred embodiment; And
Fig. 3 is a flow chart, and its explanation the present invention has the manufacture of casing of radiant element.
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly present.
Before the present invention is described in detail, be noted that in the following description content similar elements is to represent with identical numbering.
Consult Fig. 1-Fig. 3, the present invention has the manufacture of casing of radiant element, in a housing 11, imbeds a radiant element 12, and one be electrically connected the conducting element 13 of this radiant element 12, and forms a shell 1 with radiant element.Thus, with the signal transmitting and receiving module (figure does not show) on this conducting element 13 electrical connections one circuit board 2, but reaching the function of receiving and transmitting signal, and reduce therefore that general radiation element 12 need be laid on the circuit board 2 and occupation space, and relatively increased the scope that other element can be laid.Generally be to can be applicable to mobile phone, wireless interspeaker etc.. with wireless mode, in the electronic installation of receiving and transmitting signal.
It is as described below that the present invention has the manufacture of casing of radiant element, step 601 goes up laying one radiant element 12 at a flat film 111 (film), wherein, this radiant element 12 has a load point 121, and an earth point 122, come transmission signals in order to be electrically connected conducting element 13, and in the present embodiment, the distribution method of above-mentioned radiant element 12, in the mode of electroplating, but the mode that also can print is laid on the film 111, should not exceed with the present embodiment revealer.Step 602 this film 111 is compressed to a body that defines an accommodation space 113, and radiant element 12 is the bottom surfaces that are formed at this accommodation space 113.Step 603, punching press cut the unnecessary material of this film 111.So, utilize step 601-603, can form one and be coated with radiant element 12 and define on the film 111 of an accommodation space 113.Wherein, what deserves to be explained is that press membrane 111 and the order of laying radiant element 12 can be exchanged mutually on film 111, also can reach identical purpose, so, should be with not exceeding that present embodiment discloses.
Thus, one need have the electronic installation of wireless receiving and transmitting signal function, then can utilize this shell with radiant element 1, again junction 132 electrical connections one of conducting element 13 are laid with the circuit board 2 of a signal transmitting and receiving module, can reach the signal transmitting and receiving function, and can reduce that general radiation element 12 need be laid on the circuit board 2 and occupation space, and relatively increased the scope that other element can be laid on circuit board 2, wherein, in the present embodiment, this junction 132 is a shell fragment, but also can a spring, or the copper post etc.., should be with not exceeding that present embodiment discloses.
Conclude above-mentioned, the present invention has the manufacture of casing of radiant element and uses the electronic installation of this method, be in a housing 11, what be embedded with that a radiant element 12 and is electrically connected that this radiant element 12 and emergence go out this housing connects element 13, and saved effectively that general radiation element 12 need be laid on the circuit board 2 and occupation space, and relatively increased the scope that other element can be laid on circuit board 2, so can reach its goal of the invention really.
The above person, it only is preferred embodiment of the present invention, can not limit scope of the invention process with this, all simple equivalent of being done according to claim of the present invention and invention description content change and modify, and all still belong in the scope that patent of the present invention contains.
Claims (9)
1. manufacture of casing with radiant element comprises:
A) lay a radiant element on a film, wherein, this radiant element has a load point
A1) this film is compressed to a body that defines an accommodation space, and this radiant element is formed at the bottom surface of this accommodation space;
A2) punching press cuts the unnecessary material of this film;
B) conducting element is electrically connected this load point; And
C) form the base material of this conducting element of fixing, and make this base material and this radiant element of this film covering.
2. according to the described manufacture of casing with radiant element of claim 1, wherein, this steps A is with mode of printing this radiant element to be laid on this film.
3. according to the described manufacture of casing with radiant element of claim 1, wherein, this step B pastes mode with conducting resinl to make this conducting element be electrically connected this load point.
4. according to the described manufacture of casing with radiant element of claim 1, wherein, this step B directly contacts this load point so that this conducting element is electrically connected this load point with this conducting element.
5. the shell with radiant element is used for being electrically connected with a circuit board, comprising:
One housing, this housing have an outer and internal layer, and this skin is a flexible thin film, and this flexible thin film is compressed to the body that defines an accommodation space;
One radiant element, this radiant element be laid in this flexible thin film and should in interlayer, and this radiant element is formed at the bottom surface of this accommodation space, this radiant element has a load point; And
One conducting element is electrically connected this radiant element and emergence and goes out this housing, and this conducting element has one irregular, and this irregular face is electrically connected on this load point.
6. according to the described shell of claim 5 with radiant element, wherein, this conducting element has an embedding part and a junction, and this embedding part is embedded in this housing, and being electrically connected on this load point, this junction flexibly is electrically connected on the signal transmitting and receiving intermodule in this embedding part and this circuit board.
7. electronic installation with radiant element comprises:
One housing, this housing have an outer and internal layer, and this skin is a flexible thin film, and this flexible thin film is compressed to the body that defines an accommodation space;
One radiant element, this radiant element be laid in this flexible thin film and should in interlayer, and this radiant element is formed at the bottom surface of this accommodation space, this radiant element has a load point;
One conducting element is electrically connected this radiant element and emergence and goes out this housing, and this conducting element has one irregular, and this irregular face is electrically connected on this load point; And
One circuit board is laid with one in order to be electrically connected the signal transmitting and receiving module of this conducting element.
8. according to the described electronic installation with radiant element of claim 7, wherein, this radiant element has a load point, and this conducting element is electrically connected on this load point.
9. according to the described electronic installation of claim 8 with radiant element, wherein, this conducting element has an embedding part and a junction in contrast to this embedding part, this embedding part is embedded in this housing, and being electrically connected on this load point, this junction flexibly is electrically connected on the signal transmitting and receiving intermodule of this embedding part and this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100562715A CN100442597C (en) | 2004-08-06 | 2004-08-06 | Method for manufacturing shell with radiating element and shell using same manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100562715A CN100442597C (en) | 2004-08-06 | 2004-08-06 | Method for manufacturing shell with radiating element and shell using same manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1731927A CN1731927A (en) | 2006-02-08 |
| CN100442597C true CN100442597C (en) | 2008-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100562715A Active CN100442597C (en) | 2004-08-06 | 2004-08-06 | Method for manufacturing shell with radiating element and shell using same manufacture method |
Country Status (1)
| Country | Link |
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| CN (1) | CN100442597C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157788A (en) * | 2010-12-24 | 2011-08-17 | 连展科技电子（昆山）有限公司 | Film antenna |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100979893B1 (en) * | 2008-08-06 | 2010-09-03 | 주식회사 이엠따블유 | Internal antenna of wireless device and manufacturing method of the same |
| CN102055055A (en) * | 2009-11-04 | 2011-05-11 | 纬创资通股份有限公司 | Method for manufacturing antenna |
| TWI469442B (en) * | 2010-10-15 | 2015-01-11 | Advanced Connectek Inc | Soft antenna |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394160A (en) * | 1991-09-04 | 1995-02-28 | Nec Corporation | Portable radio with coplanar ground and atenna conductive films formed on the inner surface of the case |
| JPH1146108A (en) * | 1997-07-25 | 1999-02-16 | Saitama Nippon Denki Kk | Structure of built-in antenna |
| CN1255784A (en) * | 1998-11-11 | 2000-06-07 | 松下电器产业株式会社 | Built-in antenna |
| CN1354534A (en) * | 2000-11-22 | 2002-06-19 | 松下电器产业株式会社 | Mobile radio device |
| CN1358007A (en) * | 2000-12-08 | 2002-07-10 | 广达电脑股份有限公司 | Built-in cellphone antenna |
| JP2003078333A (en) * | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | Radio communication apparatus |
| US20040140934A1 (en) * | 2003-01-15 | 2004-07-22 | Filtronic Lk Oy | Internal multiband antenna |
-
2004
- 2004-08-06 CN CNB2004100562715A patent/CN100442597C/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394160A (en) * | 1991-09-04 | 1995-02-28 | Nec Corporation | Portable radio with coplanar ground and atenna conductive films formed on the inner surface of the case |
| JPH1146108A (en) * | 1997-07-25 | 1999-02-16 | Saitama Nippon Denki Kk | Structure of built-in antenna |
| CN1255784A (en) * | 1998-11-11 | 2000-06-07 | 松下电器产业株式会社 | Built-in antenna |
| CN1354534A (en) * | 2000-11-22 | 2002-06-19 | 松下电器产业株式会社 | Mobile radio device |
| CN1358007A (en) * | 2000-12-08 | 2002-07-10 | 广达电脑股份有限公司 | Built-in cellphone antenna |
| JP2003078333A (en) * | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | Radio communication apparatus |
| US20040140934A1 (en) * | 2003-01-15 | 2004-07-22 | Filtronic Lk Oy | Internal multiband antenna |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157788A (en) * | 2010-12-24 | 2011-08-17 | 连展科技电子（昆山）有限公司 | Film antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1731927A (en) | 2006-02-08 |
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