CN100444315C - Exposure apparatus and method for producing device - Google Patents

Exposure apparatus and method for producing device Download PDF

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Publication number
CN100444315C
CN100444315C CNB2003801054206A CN200380105420A CN100444315C CN 100444315 C CN100444315 C CN 100444315C CN B2003801054206 A CNB2003801054206 A CN B2003801054206A CN 200380105420 A CN200380105420 A CN 200380105420A CN 100444315 C CN100444315 C CN 100444315C
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mentioned
substrate
light
liquid
exposure
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CN1723538A (en
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水谷英夫
马込伸贵
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Nikon Corp
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Nikon Corp
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Abstract

An exposure apparatus, wherein an exposure of a substrate (P) is carried out by filling at least a portion of the space between a projection optical system and the substrate (P) with a liquid and projecting an image of a pattern onto the substrate (P) via the projection optical system and the liquid, includes a bubble detector (20) which detects air bubble or bubbles in the liquid between the projection optical system and the substrate (P). Consequently, the exposure apparatus is capable of suppressing deterioration of a pattern image caused by bubbles in the liquid when an exposure is carried out while filling the space between the projection optical system and the substrate with the liquid.

Description

Exposure device and device making method
Technical field
The present invention relates to be full of under the state of liquid, use exposure device that looks like to expose by projection optical system institute projected pattern and the device making method that uses this exposure device at least a portion between projection optical system and the substrate.
Background technology
Semiconductor device or liquid crystal display device are to make to photosensitive on-chip, so-called photolithographic method by the pattern transfer that will be formed on the mask.Employed exposure device in this photoetching process operation has the supporting mask platform of mask and the chip bench of bearing substrate, Yi Bian mobile one by one mask platform and chip bench arrive substrate via projection optical system with the pattern transfer of mask.In recent years, wish the further high-resolutionization of projection optical system for the further highly integrated people that adapt to device pattern.The exploring degree of the big more then projection optical system of numerical aperture of the short more or projection optical system of the exposure wavelength that uses is just high more.For this reason, the employed exposure wavelength of exposure device is the short wavelengthization year by year, and the numerical aperture of projection optical system also constantly increases.And though the exposure wavelength of current main-stream is the 248nm of KrF exciplex laser, more the 193nm of short wavelength's ArF exciplex laser also just constantly is practical.In addition, also very important with the same depth of focus of exploring degree (DOF) when exposing.Exploring degree R and depth of focus δ represent with following formula respectively.
R＝k 1·λ/NA ...(1)
δ＝±k 2·λ/NA 2 ...(2)
Here, λ is an exposure wavelength, and NA is the numerical aperture of projection optical system, k 1, k 2It is processing coefficient (process coefficient).As can be known in order to improve exploring degree R, if exposure wavelength lambda is shortened, depth of focus δ just becomes narrow to make numerical aperture NA become greatly then according to (1) formula, (2) formula.
If the too narrow substrate surface that makes of depth of focus δ is with respect to the identical difficulty that will become of the image planes of projection optical system, the tolerance limit during exposure actions (margin) probably will be not enough.Thereby the method as shortening the exposure wavelength and the expansion depth of focus has in fact for example proposed No. 99/49504 disclosed immersion method of communique of international publication.This immersion method is that liquid such as water or organic solvent is full of below projection optical system and between the substrate surface, utilizing the exposure light wavelength in the liquid is that airborne 1/n (n is that liquid refractive index is generally about 1.2～1.6) this point is improved the exploring degree, simultaneously the depth of focus is enlarged the doubly such method of about n.
Carry out under the situation of exposure-processed utilizing immersion method, if in the liquid between projection optical system and substrate (particularly, the surface of substrate) have gas part such as bubble, then since this bubble (gas part) influence that formed pattern image probably can deterioration on the substrate.For example, be not only the situation that bubble is contained in the liquid of being supplied with, in addition the possibility that in liquid, is taking place after the supply.If it is bad to place the imaging of this pattern image, will be found as defective item in the stage that becomes resulting devices, probably can cause the low of device production.
In addition, when the exposure-processed of carrying out, also to consider to form the situation of gas part because of become state that akinesia etc., some reason will be created at least a portion underfill liquid between projection optical system and the substrate of the fluid Supplying apparatus to feed fluid between projection optical system and the substrate based on immersion method.That is, the whole or part of pattern image probably will be not via liquid project on the substrate.In this case, pattern image possibility of imaging not on substrate is just arranged, if remain untouched place then up to become resulting devices can not find defective, just might cause productive lowly.
And then, in utilizing the exposure device of immersion method, the situation that has the liquid via the image planes side of projection optical system to carry out various measurements, when there is gas part in the image planes side in projection optical system and under the situation about not being full of with enough liquid, measure error takes place in addition or sink into the possibility of immeasurable state.
Summary of the invention
The present invention finishes in view of such situation, its objective is that providing a kind of is utilizing the device making method that also can suppress the low exposure device of productivity and use this exposure device under the situation of immersion method.In addition, its objective is provides a kind of when full of liquid carries out exposure-processed between projection optical system and the substrate, can detect to result from the exposure device of deterioration etc. of pattern image of the bubble in the liquid and the device making method that uses this exposure device.And then its objective is provides a kind of can suppress the to result from productive low exposure device of underfill liquid between projection optical system and substrate and the device making method that uses this exposure device.In addition, the present invention still can suppress ill-exposed or measure the exposure device of generation such as bad and the device making method that uses this exposure device utilizing to provide a kind of under the situation of immersion method.
In order to solve above-mentioned problem, the present invention adopts the following formation corresponding with Fig. 1～Figure 16 shown in the execution mode.Wherein, be attached to parenthesized the symbol only example of this key element, the not intention that each key element is limited on each key element.
According to the 1st technical scheme of the present invention, provide a kind of and be transferred to the picture of pattern on the substrate and, possess: the projection optical system that the picture of pattern is projected to substrate the exposure device that substrate exposes via liquid; And have and project light at the projection system on the aforesaid liquid between this projection optical system and the above-mentioned substrate and accept air-foam detector from the receiving system of the light of the aforesaid liquid between this projection optical system and above-mentioned substrate, above-mentioned air-foam detector detects the bubble in the liquid between this projection optical system and above-mentioned substrate according to the output of above-mentioned receiving system.
According to the present invention, when carrying out exposure-processed based on immersion method, by utilizing air-foam detector to detect bubble in the liquid between projection optical system and the substrate, just can detect the very big part that relates to the pattern transfer precision, be the information of the bubble in the liquid between relevant projection optical system and the substrate.Owing to can hold ill-exposed (bad shooting) based on this testing result, so can implement to be used to keep the appropriate disposal of high device production.
According to the 2nd technical scheme of the present invention, provide a kind of and pattern image is transferred on the substrate (P) and to the exposure device (EX) that substrate (P) exposes via liquid (50), possess: the projection optical system (PL) that above-mentioned pattern image is projected to substrate (P); And the fluid low checkout gear (20) that the deficiency of the liquid (50) between projection optical system (PL) and the substrate (P) is detected.
According to the present invention, when carrying out exposure-processed, just can detect the liquid that between projection optical system and substrate, is full of and deficiency whether occur by the fluid low checkout gear based on immersion method.Thereby, just can be based on the early stage generation of holding ill-exposed or bad shooting of this testing result, just can implement to be used for not making to result from the appropriate disposal of bad device generation of fluid low.For example, detecting under the hydropenic situation, just can suppress the generation of ill-exposed or bad shooting by solving to expose again after this water deficiency.
According to the 3rd technical scheme of the present invention, provide a kind of and be mapped to substrate via the illumination that will expose of projection optical system and liquid, on measurement component or the transducer and to above-mentioned substrate, the exposure device that measurement component or transducer expose, possess: gas detecting system, have light projected and be positioned at this projection optical system and above-mentioned substrate, projection system on the aforesaid liquid between measurement component or the transducer and acceptance are from being positioned at this projection optical system and above-mentioned substrate, the receiving system of the light of the aforesaid liquid between measurement component or the transducer, the above-mentioned gas detection system has or not gas partly to detect based on the output from above-mentioned receiving system in the light path to above-mentioned exposure light.
According to the present invention, by having or not of the gas part in the light path that detects exposure light with gas detecting system, for example just can hold in the exposure of substrate, the bad or bad shooting of imaging of pattern image has partly taken place whether to result from this gas.Thus, just can implement to be used to keep the appropriate disposal of high device production.In addition, owing to beginning the exposure of substrate again on the basis that can in light path, not have after gas situation is partly confirmed, so can also suppress the generation of bad device to exposure light.
According to the 4th technical scheme of the present invention, provide a kind of via projection optical system and the liquid exposure device that illumination is mapped to substrate and above-mentioned substrate is exposed that will expose, possess: will detect light via above-mentioned on-chip liquid and project on the above-mentioned substrate, be received in the detection light that is reflected on the above-mentioned substrate simultaneously, face position detecting system with the face position of detecting above-mentioned substrate, wherein, based on the output of above-mentioned position detecting system, detect in the light path of above-mentioned detection light and have or not the gas part.
According to the present invention, by using the face position detecting system system that detects the face positional information of substrate via liquid, detect having or not of gas part in the light path of this detection light, just can hold the bad or bad shooting of imaging that for example in the exposure of substrate, whether results from this gas part and pattern image has taken place.Thus, just can implement to be used to keep the appropriate disposal of high device production.In addition, by the face position detecting system being also used as the gas detecting system that detects that has or not, just can detect and that device is constituted is complicated having or not of gas part to gas part.
In addition, in the present invention, also provide a kind of and be the device making method of feature in order to exposure device (EX) with above-mentioned form.
Description of drawings
Fig. 2 is the figure that the position of leading section and the fluid Supplying apparatus and the liquid withdrawal system of expression projection optical system concerns.
Fig. 3 is expression supply nozzle and the figure that reclaims the configuration example of nozzle.
Fig. 4 is the plane graph of expression air-foam detector.
Fig. 5 is the flow chart of an example of expression bubble testing process.
Fig. 6 is the plane graph of the on-chip shooting area of expression.
It is the figure that is used to illustrate about the detection light of air-foam detector that Fig. 7 (a) reaches (b).
Fig. 8 is the figure of an execution mode of expression gas detecting system related to the present invention.
Fig. 9 is used for the schematic diagram that describes with regard to gas detecting system related to the present invention.
Figure 10 is that expression utilizes the gas of gas detecting system related to the present invention partly to detect the figure of action.
Figure 11 is that expression utilizes the gas of gas detecting system related to the present invention partly to detect the figure of action.
Figure 12 (a)～(c) is that expression utilizes the gas of gas detecting system related to the present invention partly to detect the figure of action.
Figure 13 is used for the schematic diagram that describes with regard to gas detecting system related to the present invention.
Figure 14 is the figure of an execution mode of expression gas detecting system related to the present invention.
Figure 15 is that expression utilizes the gas of gas detecting system related to the present invention partly to detect the figure of action.
Figure 16 is the flow chart of an example of the manufacturing process of expression semiconductor device.
Embodiment
Below, on one side describe with reference to accompanying drawing on one side with regard to exposure device of the present invention and device making method, the present invention is not limited thereto.Fig. 1 is the summary pie graph of an execution mode of expression exposure device of the present invention.
In Fig. 1, exposure device EX possesses: the mask platform MST of supporting mask M, the chip bench PST of bearing substrate P, the lamp optical system IL that the mask M that mask platform MST is supported with exposure light EL throws light on, the projection optical system PL of the substrate P that the pattern image projection exposure of the mask M that will be thrown light on exposure light EL is supported to chip bench PST, the control device CONT of control is all together in all actions to exposure device EX, be connected to the storage device MRY of the control device CONT storage information relevant with exposure-processed, and the display unit DS of the demonstration information relevant with exposure-processed.
Here, in the present embodiment, with use on one side with mask M and substrate P towards carry out in direction different mutually on the scanning direction (contrary direction) with moved further one side will be on mask M formed pattern exposure (the portable one by one exposure device of so-called scanning: scanning stepper) situation as exposure device EX describes as example to the scanning exposure apparatus of substrate P.In the following description, if the direction consistent with the optical axis AX of projection optical system PL is Z-direction, the synchronous moving direction (scanning direction) that is located at perpendicular to mask M in the plane of Z-direction and substrate P is X-direction, establishes direction (non-scanning direction) Y direction perpendicular to Z-direction and Y direction.In addition, will be made as θ X, θ Y and θ Z direction around the direction of X-axis, Y-axis and Z axle respectively.In addition, said here " substrate " is included in the situation that has applied resist (resist) on the semiconductor wafer, and " mask " is included in the netting twine (reticle) that forms on the substrate through the equipment pattern of reduced projection.
Lamp optical system IL throws light on to the mask M that mask platform MST is supported with exposure light EL, have exposure light source, make the illumination homogenization of the light beam that penetrates from exposure light source the optics integrator, to condenser, the relay lens system of carrying out optically focused from the exposure light EL of optics integrator, will utilize the light EL that exposes mask M on the field of illumination set the variable field of view aperture etc. of slit-shaped for.Thrown light on the exposure light EL of the Illumination Distribution of homogeneous by lamp optical system IL in regulation field of illumination on the mask M.As the exposure light EL that penetrates from lamp optical system IL, for example use to swash and penetrate light (wavelength 248nm) extreme ultraviolet light (DUV light) of etc.ing from the bright line (g line, h line, i line) of the ultra-violet (UV) band that mercury vapor lamp penetrates and KrF exciplex, or sharp light (wavelength 193nm) and the F of penetrating of ArF exciplex 2Swash and penetrate light (wavelength 157nm) equal vacuum ultraviolet light (VUV light) etc.Use the ArF exciplex to swash in the present embodiment and penetrate light.
Mask platform MST supports mask M, can be in the plane perpendicular to the optical axis AX of projection optical system PL, be to carry out 2 dimensions in the XY plane to move and can carry out small rotation along θ Z direction.Mask platform MST is driven by mask platform drive unit MSTD such as linear motors.Mask platform drive unit MSTD is controlled by control device CONT.The position and the anglec of rotation of the 2 dimension directions of the mask M on the mask platform MST are measured in real time by laser interferometer, and measurement result is output to control device CONT.Control device CONT drives the location of carrying out the mask M that mask platform MST supported thus based on the measurement result of laser interferometer to mask platform drive unit MSTD.
To be PL carry out projection exposure with the pattern of mask M with the projection multiplying power β of regulation to projection optics on substrate P, is made of a plurality of optical elements (lens), and lens barrel (barrel) PK that these optical elements are used as metal parts supports.In the present embodiment, projection optical system PL is that projection multiplying power β is for example 1/4 or 1/5 reduction system.In addition, projection optical system PL waits some in times system and the expansion system.In addition, in the front (substrate P side) of the projection optical system PL of present embodiment, optical element (lens) 60 exposes from lens barrel PK.This optical element 60 is provided with respect to lens barrel PK is detachable (replacing).
Chip bench PST supporting substrate P possesses the Z workbench 51 that keeps substrate P via substrate holder, the XY worktable 52 of supporting Z workbench 51, and the pedestal 53 of supporting XY worktable 52.Chip bench PST is driven by chip bench drive unit PSTD such as linear motors.Chip bench drive unit PSTD is controlled by control device CONT.Control position on position (focal position) on the Z-direction of the substrate P that Z workbench 51 kept and θ X, the θ Y direction by driving Z workbench 51.In addition, control position on the XY direction of substrate P (with the position of the parallel in fact direction of the image planes of projection optical system PL) by driving XY worktable 52.Promptly, the focal position of 51 couples of substrate P of Z workbench and inclination angle are controlled in automatic focus (auto-focus) mode and (auto-leveling) mode of automatically adjusting is fit to the image planes of projection optical system PL with the surface of substrate P, and XY worktable 52 is carried out the X-direction of substrate P and the location on the Y direction.In addition, self-evidently also Z workbench and XY worktable can be provided with integratedly.
On chip bench PST (Z workbench 51), be provided with the moving lens 54 that moves with respect to projection optical system PL with chip bench PST.In addition, be provided with laser interferometer 55 in the position relative with moving lens 54.The position and the anglec of rotation of the 2 dimension directions of the substrate P on the chip bench PST are measured in real time by laser interferometer 55, and measurement result is output to control device CONT.Control device CONT drives the location of carrying out the substrate P that supported on the chip bench PST thus based on the measurement result of laser interferometer 55 to chip bench drive unit PSTD.
In the present embodiment, for exposure wavelength essence is shortened to improve the exploring degree, simultaneously the expansion of depth of focus essence is suitable for immersion method.For this reason, at least the pattern image with mask M be transferred on the substrate P during, the front end face of the optical element (lens) 60 of the substrate P side of the surface of substrate P and projection optical system PL (below) be full of the liquid 50 of regulation between 7.As described above, the front lens 60 that constitute at projection optical system PL expose, and liquid 50 only contacts with lens 60.Thus, just can prevent the corrosion etc. of the lens barrel PK that forms by metal.In the present embodiment, on liquid 50, use pure water.Pure water not only swashs at the ArF exciplex penetrates light, for example is made as from the bright line (g line, h line, i line) of the ultra-violet (UV) band that mercury vapor lamp penetrates and KrF exciplex at the light EL that will expose and also can sees through this exposure light EL under the sharp situation of penetrating light extreme ultraviolet lights (DUV light) such as (wavelength 248nm).
Exposure device EX has the liquid withdrawal system 2 to the liquid 50 in the fluid Supplying apparatus 1 of the liquid 50 of the 56 supply regulations of the space between the front end face of projection optical system PL (front end faces of lens 60) 7 and the substrate P and recovery space 56.Fluid Supplying apparatus 1 is used at least a portion between projection optical system PL and the substrate P is full of with liquid 50, has the container of accommodating liquid 50, force (forcing) pump etc.On fluid Supplying apparatus 1, connect an end of supply pipe 3, connecting supply nozzle 4 in the other end of supply pipe 3.Fluid Supplying apparatus 1 is via supply pipe 3 and 4 pairs of spaces of supply nozzle, 56 feed fluids 50.Fluid Supplying apparatus 1 will supply to the temperature of the liquid 50 in space 56 and set with degree with the temperature (for example 23 ℃) in the chamber of for example being accommodated with exposure device EX.
Liquid withdrawal system 2 has the container of the liquid 50 that suction pump, collecting post reclaim etc.On liquid withdrawal system 2, connecting an end of recovery tube 6, connecting recovery nozzle 5 in the other end of recovery tube 6.Liquid withdrawal system 2 reclaims via the liquid 50 that reclaims nozzle 5 and 6 pairs of spaces 56 of recovery tube.When to space 56 fulls of liquid 50, control device CONT drives fluid Supplying apparatus 1, space 56 is supplied with the liquid 50 of ormal weight via supply pipe 3 and supply nozzle 4 time per units, drive liquid withdrawal system 2 simultaneously, via the liquid 50 that reclaims nozzle 5 and recovery tube 6 time per units 56 recovery ormal weights from the space.Thus, keeping liquid 50 at the front end face 7 of projection optical system PL and the space 56 between the substrate P.
Exposure device EX has the air-foam detector 20 of the bubble in the liquid 50 that detects the space 56 between projection optical system PL and the substrate P.Air-foam detector 20 has the projection system 21 and the receiving system 22 of acceptance from the detection light of the liquid 5 in space 56 that liquid 50 projections in space 56 are detected light with the bubble in the optical mode tracer liquid 50.Projection system 21 throws from incline direction the surface of substrate P by detecting light, will detect the liquid 50 that light projects space 56.Projection system 21 throws the surface of substrate P from detecting light with respect to the optical axis AX of projection optical system PL in the position of leaving as the X-direction of the scanning direction of substrate P.In the present embodiment, projection system 21 is arranged on respect to the optical axis AX of projection optical system PL in-position that directions X leaves, and receiving system 22 is arranged on respect to the optical axis AX of projection optical system PL in+position that directions X leaves.
Fig. 2 is the part expanded view of Fig. 1 of bottom, fluid Supplying apparatus 1 and liquid withdrawal system 2 etc. of the projection optical system PL of expression exposure device EX.In Fig. 2,60 its leading section 60A of lens bottom of projection optical system PL only remain necessary part and in the elongated rectangular formation of Y direction (non-scanning direction) in the scanning direction.A part of pattern image of mask M is projected to the rectangular projection region PA under the front end face 60A when scan exposure, move with speed V at-directions X (perhaps+directions X) with respect to projection optical system PL mask M, synchronised makes substrate P move with speed β V (β is the projection multiplying power) at+directions X (perhaps-directions X) via XY worktable 52 therewith.Then, behind the end exposure to a shooting area, the stepping by substrate P makes next shooting area move to the scanning starting position, below, carry out exposure-processed successively in step-scan (step-and-scan) mode for each shooting area.In the present embodiment, the moving direction that is parallel to substrate P flows through liquid 50 and so sets.
Fig. 3 is leading section (end portion) 60A of the lens 60 of expression projection optical system PL, at the supply nozzle 4 of X-direction feed fluid 50 (4A～4C) and the figure of the position of the recovery nozzle 5 of withdrawal liquid 50 (5A, 5B) relation.In Fig. 3, the front end face 60A of lens 60 is shaped as at the elongated rectangle of Y direction, at 3 supply nozzle 4A～4C of+directions X side configuration, reclaim nozzle 5A, 5B so that clip the leading section 60A of the lens 60 of projection optical system PL in X-direction in-2 of directions X side configurations.Then, supply nozzle 4A～4C is connected to fluid Supplying apparatus 1 via supply pipe 3, reclaims nozzle 5A, 5B and is connected to liquid withdrawal system 2 via recovery tube 4.In addition, supply nozzle 4A～4C supply nozzle 8A～8C and reclaiming nozzle 9A, 9B with the position configuration that nozzle 5A, the 5B center with respect to leading section 60A of reclaiming has roughly rotated 180 °.Supply nozzle 4A～4C and recovery nozzle 9A, 9B arrange on Y direction alternately, supply nozzle 8A～8C and recovery nozzle 5A, 5B arrange on Y direction alternately, supply nozzle 8A～8C is connected to fluid Supplying apparatus 1 via supply pipe 10, reclaims nozzle 9A, 9B and is connected to liquid withdrawal system 2 via recovery tube 11.
Towards the scanning direction (directions X) shown in the arrow Xa (with reference to Fig. 3) substrate P is moved under the situation of carrying out scan exposure, use supply pipe 3, supply nozzle 4A～4C, recovery tube 4 and reclaim nozzle 5A, 5B, carry out the supply and the recovery of liquid 50 by means of fluid Supplying apparatus 1 and liquid withdrawal system 2.Promptly, when substrate P court-directions X moves, (4A～4C) liquid 50 is fed between projection optical system PL and the substrate P from fluid Supplying apparatus 1 via supply pipe 3 and supply nozzle 4, simultaneously be recycled to liquid withdrawal system 2, flow at-directions X in order to be full of between lens 60 and the substrate P liquid 50 via reclaiming nozzle 5 (5A, 5B) and recovery tube 6 liquid 50.On the other hand, towards the scanning direction (+directions X) shown in the arrow Xb substrate P is moved under the situation of carrying out scan exposure, use supply pipe 10, supply nozzle 8A～8C, recovery tube 11 and reclaim nozzle 9A, 9B, carry out the supply and the recovery of liquid 50 by means of fluid Supplying apparatus 1 and liquid withdrawal system 2.Promptly, when substrate P court+directions X moves, (8A～8C) liquid 50 is supplied between projection optical system PL and the substrate P from fluid Supplying apparatus 1 via supply pipe 10 and supply nozzle 8, simultaneously be recycled to liquid withdrawal system 2, flow at+directions X in order to be full of between lens 60 and the substrate P liquid 50 via reclaiming nozzle 9 (9A, 9B) and recovery tube 11 liquid 50.Like this, control device CONT uses fluid Supplying apparatus 1 and liquid withdrawal system 2 to flow through liquid 50 along the same direction of the moving direction of the moving direction of substrate P and substrate.In this case, the liquid of being supplied with via supply nozzle 4 from fluid Supplying apparatus 1 50 for example, since follow to substrate P-the mobile space 56 that is introduced into of directions X flows like this, so also liquid 50 easily can be supplied with space 56 even if the energize of fluid Supplying apparatus 1 is less.And, by switch the direction that liquid 50 is flowed according to the scanning direction, edge+directions X or-can both be full of with liquid 50 between the front end face 7 and substrate P of lens 60 under the situation of directions X either direction scanning substrate P, and can obtain the higher exploring degree and the wider depth of focus.
Fig. 4 is the plane graph that the summary of expression air-foam detector 20 constitutes.Projection system 21 and receiving system 22 be provided in leading section 60A that X-direction clips the lens 60 of projection optical system PL, be the PA of view field on the substrate P of projection optical system PL.Projection system 21 has at Y direction a plurality of projection units (projector) 21A arranged side by side, and projection detects light to substrate P from separately projection unit 21A.Set for identical angle from the detection light that a plurality of projection unit 21A throwed respectively with respect to the incident angle on substrate P surface.Receiving system 22 has and the corresponding a plurality of light accepting parts of the projection unit 21A of projection system 21 (light-receiver) 22A.Do not reflect on the surface of substrate P by liquid 50 from separately the detection light that projection unit 21A throwed has the situation of bubble liquid under, 22A accepts with light accepting part.
In addition, receiving system 22 has light accepting part 22B, the 22C that is not directly disposed on the position of incident from the detection light of projection system 21.Under the situation that in liquid, has bubble, run into the scattered light that bubble in the liquid carries out reflex time from the detection light of projection system 21, accept (dark field detection) with this light accepting part 22B, 22C.
Among a plurality of detection light of projection system 21 projection a part detect light L1 be projected onto with substrate P on the corresponding zone of leading section 60A (PA of view field of projection optical system PL) of lens 60, remaining detection light L2 is projected onto the zone in Y direction two outsides of the PA of view field.In addition, projection system 21 detects light Le to throwing near the boundary portion in the Y direction of the PA of view field with at least a portion among a plurality of detection light.Here, since leading section 60A and substrate P to lens 60 between, promptly with substrate P on the corresponding part of the PA of view field by fluid Supplying apparatus 1 feed fluid 50, so just become the immersion liquid part with the corresponding part of the PA of view field.
Fig. 7 (a) is the schematic diagram of watching from the side attached to the state of the bubble 18 irradiating and detecting light on the surface of substrate P.Fig. 7 (b) is the plane graph of Fig. 7 (a).
Shown in Fig. 7 (a), be point-source of light for example detecting light, the diameter of its light beam is under the situation of D1, by detecting light substrate P is throwed from incline direction, and the detection light on the substrate P just becomes shown in Fig. 7 (b) like that to be established X-direction (scanning direction) and be the ellipticity of length direction.The big or small D2 of the length direction of the ellipticity surveyed area of the detection light on the substrate P is bigger than above-mentioned diameter D1.Promptly, for example will detect under the situation that light shines from vertical direction the surface of substrate P, size on the X-direction of the surveyed area of detection light just becomes D1, just can detect bubble 18 by the surveyed area of the D2 bigger than D1 on X-direction by detecting light from oblique direction.Thereby when the bubble 18 on the substrate P that detect to detect in the enterprising line scanning of X-direction, bubble 18 just is detected comparing on the wider surveyed area with the surveyed area of diameter D1, and air-foam detector 20 just can improve the accuracy of detection of bubble 18.In addition, to detect light be that point-source of light is illustrated though here establish, and also can obtain same effect even if detect only slit light.
Then, on one side with reference to the flow chart of Fig. 5 on one side just the exposure device EX of use with above-mentioned formation via projection optical system PL and liquid 50 process that the pattern of mask M exposes on substrate P is described.
At first, with the mask M mask platform MST that packs into, chip bench PST simultaneously packs substrate P into.Then, control device CONT drives fluid Supplying apparatus 1 and liquid withdrawal system 2, and beginning is supplied with action for the liquid in space 56.Thus, just below projection optical system PL, be full of liquid 50 (step S1) between the PA of view field of 7 (leading section 60A) and substrate P.
Secondly, control device CONT is drive substrate platform PST and at X-direction scanning substrate P on one side, Yi Bian use exposure light EL that mask M is thrown light on from lamp optical system IL, via projection optical system PL and liquid 50 with the graphic pattern projection of mask M to substrate P.Meanwhile, control device CONT will detect light by means of projection system 21 substrate P will be throwed from incline direction.Control device CONT detects the position on the Z-direction on substrate P surface on one side, on one side substrate P is carried out exposure-processed (step S2).
Project detection light on the substrate P by being filled in the liquid 50 the space 56 from projection system 21, be projected onto the view field on the substrate P.Here, as shown in Figure 4, the surface of the substrate P in view field exists (adhering to) under the situation of bubble 18, and the detection light that is projected onto bubble 18 carries out scattering.Because the part of the detection light that is throwed on the bubble 18 is carried out scattering, can just not incide light accepting part 22B, 22C by detected stronger light usually, just reduce with the corresponding luminous intensity of being accepted by light accepting part 22A of this detection light.The testing result of light accepting part 22A, 22B and 22C is output to control device CONT, and control device CONT is based on detecting whether there is bubble (step S3) on substrate P by these receiving system 22 detected light intensities.
Here, control device CONT can be based on detect size or the quantity that light intensity is obtained bubble 18 with light accepting part 22B, 22C.For example, since less bubble with bigger angle scattered light, so control device CONT can obtain the size of obtaining bubble 18 from the scattering direction of light of bubble 18 therefrom based on the testing result of light accepting part 22B, 22C.And then, can also be by the light intensity that receives being detected the quantity of the bubble 18 of obtaining the per unit area on the substrate P.
At this moment, the position of the XY direction of substrate P determined according to the measurement result of laser interferometer 55, and the position that is provided with in the Y direction of the light accepting part 22A of the detection light that receives on the bubble 18 simultaneously to be throwed is also determined based on design load.Thereby control device CONT just can determine the position that bubble 18 exists on substrate P based on the information that the position is set of the measurement result of laser interferometer 55 and the relevant light accepting part 22A that the light intensity of accepting is reduced.In case determine the position that bubble 18 exists, control device CONT just stores the positional information of this bubble 18 into storage device MRY (step S4).
In addition, projection detects light to control device CONT to substrate P on one side by in X-direction substrate P being scanned on one side, just can detect bubble 18 existence have or not or number of bubbles etc., about the information of the bubble 18 of each shooting area.
Here, whether in storage device MRY, storing to substrate P with the transfer printing of desirable pattern transfer precision the threshold information of relevant bubble 18 of pattern.This threshold value comprises the threshold value of the amount (number) of the threshold value of relevant bubble 18 sizes or relevant bubble 18 for a shooting area.The threshold information that control device CONT is stored storage device MRY with utilize the bubble testing result of air-foam detector 20 to compare (step S5).
Then, control device CONT judges that the bubble testing result utilize air-foam detector 20 is whether more than above-mentioned threshold value (step S6).
For example, though the bubbles such as situation 18 that have the less bubble of diameter 18 to swim a little in liquid 50 are present in the situation that can obtain desirable pattern transfer precision in the liquid.Therefore, obtain the amount and the big or small D threshold value of relevant bubble 18 in advance, if the bubble testing result can be carried out the exposure of substrate P in above-mentioned threshold value rightly with next being judged as.That is, the threshold information of the relevant bubble that control device CONT is stored with reference to storage device MRY judges based on the testing result of air-foam detector 20 whether the exposure of substrate P is carried out rightly.In addition, threshold value is for example obtained in advance experimentally, is stored among the storage device MRY.
Be judged as bubble 18 under the situation below the above-mentioned threshold value, just be judged as under the situation that the exposure of substrate P carried out rightly, control device CONT proceeds exposure-processed.On the other hand, be judged as bubble 18 under the situation more than the above-mentioned threshold value, that is, be judged as under the situation that existence because of bubble 18 makes that the exposure of substrate P do not carry out rightly, control device CONT for example interrupts the exposure-processed action, perhaps drive display unit DS or not shown alarm device, there is the intention of the bubble of permissible range above (more than the threshold value) in notice, perhaps the positional information of the bubble on the substrate P 18 is handled (step S7) with display unit DS demonstration etc.
Here, as shown in Figure 6, consider the situation that a plurality of shooting area SH on the substrate P are exposed respectively.In this case, even if be judged as bubble 18 in step S6 under the situation more than the above-mentioned threshold value, control device CONT also proceeds exposure-processed.At this moment, utilize the detection of the bubble 18 of air-foam detector 20 in a plurality of shooting area SH exposure separately of control device CONT on substrate P, with reference to above-mentioned threshold information and the positional information of utilizing the bubble of laser interferometer, the shooting area SH ' that makes the imaging of pattern image not carry out rightly because of bubble 18 among a plurality of shooting area SH is stored in (step S8) among the storage device MRY.After exposure-processed finishes, just can be based on institute's canned data among the storage device MRY, to the shooting area SH ' that the imaging of pattern image among a plurality of shooting area SH is not carried out rightly, do not carry out the exposure-processed of other array thereafter, perhaps recoat resist and expose once more.
In the present embodiment, among a plurality of detection light, projection detects light L1 to the PA of view field on the substrate P, to the both sides boundary portion projection detection light Le of Y direction.Based on being subjected to the light result in the receiving system 22 of this detection light L1 or Le, whether just can judge in space 56 filled with liquid 50.For example, under the situation of the state that is not keeping liquid 50 in a near part that occurs in space 56 boundary portion of the PA of view field on the substrate P because of bad situations such as peeling off of liquid 50, the light path that detects light Le changes and is not subjected to light and becomes non-incident state at receiving system 22.Control device CONT just can based on the light accepting part 22A that detects light Le be subjected to the light result, judging does not have full of liquid 50 in space 56.In addition, also consider for example fluid Supplying apparatus 1 former thereby akinesia because of some, not enough situation appears in the liquid 50 between projection optical system PL and the substrate P.Even if in the case, the light path of detection light L1 changes and becomes non-incident state for light accepting part 22A.Control device CONT just can based on light accepting part 22A be subjected to the light result, the liquid that detects space 56 occurs not enough.Like this, air-foam detector 20 also has the function as the fluid low checkout gear that liquid 50 deficiencies between projection optical system PL and the substrate P are detected.In addition, herein, " fluid low " not only be meant liquid in space 56 partly or on amount situation about being supplied with, also comprise the complete non-existent situation that becomes.
Control device CONT also utilizes the detection of the scarce liquid (fluid low) of fluid low checkout gear 20 in a plurality of shooting area SH exposure separately on substrate P in the case, and, store shooting area (bad shooting area) SH ' that fluid low takes place among a plurality of shooting area SH into storage device MRY in exposure based on the position measurements of laser interferometer.Then, after exposure-processed finishes, based on institute's canned data among the storage device MRY, the shooting area SH ' that does not carry out the imaging of pattern image rightly to resulting from fluid low among a plurality of shooting area SH, the exposure-processed of other arrays after not carrying out perhaps recoats resist and exposes once more.
In addition, though above-mentioned fluid low checkout gear is to detect the formation whether fluid low takes place with optical mode, but for example, the supply pipe 3 that also can be by being arranged at fluid Supplying apparatus 1 or the flowmeter (flow detector) of supply nozzle 4 constitute the fluid low checkout gear.Flow detector detects the fluid flow of the time per unit of the liquid 50 supplied with in the space 56, and testing result is outputed to control device CONT.Control device CONT is based on the testing result of flow detector, under the flow of liquid is situation below the setting, just is judged as the generation fluid low.
In addition, also consider to be not only the situation that less gas part as bubble and the bigger gas compartment (gas part) have produced in liquid, maybe when having begun the liquid supply from fluid Supplying apparatus 1, in the remaining situation of image planes side gas of projection optical system PL.Even under these circumstances, become non-incident state owing to detect light L1 with respect to light accepting part 22A, so also can detect the having or not of gas part of the image planes side of this projection optical system PL based on the light result that is subjected to of light accepting part 22A.Like this, air-foam detector 20 not only carries out the detection of the bubble in the liquid, also has the function that has or not of the gas part that detects between projection optical system PL and the substrate P.
As described above such, air-foam detector 20 by the bubble 18 that is provided with in the liquid 50 that the space 56 between projection optical system PL and substrate P is full of detects just can detect the information of the pattern transfer precision being brought the bubble 18 of very big influence in space 56.Thus, just can implement to be used to keep good productive appropriate disposal, in addition, when in liquid, existing under the alveolate situation, by judging based on the testing result of bubble whether pattern is able to transfer printing rightly, just can be for example only will be adopted as goods by the device of the shooting area of transfer printing rightly, and perhaps implement to be used for exposure-processed had no progeny for the time being and remove bubble processing corresponding to pattern.
In addition, though in the present embodiment, the situation that just detects the bubble 18 on the surface that is attached to substrate P is illustrated, even but under the situation of the bubble that in liquid 50, swimming, owing to change, so also can the bubble quantity and bubble of being swum in the liquid 50 be detected by the light intensity that receiving system 22 is accepted to the bubble irradiating and detecting light that is swimming.In addition, because the detection light that the bubble that is swimming is detected is different at the light intensity of light accepting part 22B, the suffered light of 22c with the detection light that the bubble that is attached to substrate P is detected, thus can also be based on light accepting part 22B, 22C be subjected to the light result to differentiate detected bubble to swim or be attached to substrate P.And then following 7 irradiating and detecting light that can also be by projection optical system PL detect the relevant information that is attached to following 7 the bubble of projection optical system PL.In addition, the part from the detection light of projection system 21 can also be used for the detection of the surface location of substrate P.
In addition, though in the present embodiment, projection system 21 is parallel to the XZ plane, and projection detects light to substrate P from the position that the self-scanning direction of substrate P is left, and seeks the improvement of accuracy of detection thus, is parallel to the formation of YZ plane to substrate P projection detection light but also can adopt.In addition, though in the present embodiment, substrate P is radiated at Y direction arranges a plurality of point-source of lights (detection light), for example also can be on one side at point-source of light of Y direction scanning, on one side to this point-source of light at X-direction scanning substrate P.Perhaps, also can extend point-source of light is projected substrate P in Y direction.Even this formation also can be carried out for the bubble detection action of substrate P surface to the regulation zone.
In addition, though in the above-described embodiment, the situation that just forms the immersion liquid zone on substrate P is illustrated, but also considers the image planes side of projection optical system PL is full of with liquid under the situation of various measurement components on the use chip bench PST (Z workbench 51) or transducer.When measuring via liquid with measurement component or transducer like this, when there is gas part (bubble in the liquid etc.) in the image planes side at projection optical system PL and might becomes under the situation of measure error, also can use air-foam detector 20 to come having or not of detected gas part etc.In addition, about can be used on various measurement components on the chip bench PST (Z workbench 51) or transducer to particular content, at Japan Patent Publication Laid-Open 2002-14005 communique, the flat 11-16816 communique of Japan Patent Publication Laid-Open, the clear 57-117238 communique of Japan Patent Publication Laid-Open, the flat 11-238680 communique of Japan Patent Publication Laid-Open, Japan Patent Publication Laid-Open 2000-97916 communique, the flat 4-324923 communique of Japan Patent Publication Laid-Open etc. is documented, home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of these documents respectively and as a part described herein.
Then, with reference to Fig. 8 and meanwhile describe with regard to other execution modes of the present invention.In the following description, for the additional same mark of component part identical with above-mentioned execution mode or that be equal to, and the simple or omission with its explanation.
Fig. 8 is near the side view of leading section of expression projection optical system PL.In Fig. 8, full of liquid 50 between the optical element 60 of the leading section of projection optical system PL and the substrate P is formed with 50 pairs of immersion liquid zones of liquid AR on substrate P.In addition, in Fig. 8, omitted in the supply nozzle 4 of feed fluid 50 on the substrate P and the 5 pairs of diagrams of recovery nozzle that reclaim the liquid 50 on the substrate P.
In addition, though in the following explanation of present embodiment, optical element 60 opposed situations with regard to substrate P and projection optical system PL describe, but as at Japan Patent Publication Laid-Open 2002-14005 communique, the flat 11-16816 communique of Japan Patent Publication Laid-Open, the clear 57-117238 communique of Japan Patent Publication Laid-Open, the flat 11-238680 communique of Japan Patent Publication Laid-Open, Japan Patent Publication Laid-Open 2000-97916 communique, the flat 4-324923 communiques of Japan Patent Publication Laid-Open etc. are disclosed like that, and are like this too under the situation of the optical element 60 that the various measurement components on the chip bench PST (Z workbench 51) or transducer are opposite to projection optical system PL.
Exposure device EX has the focus detection system 70 of the face positional information that detects substrate P.Focus detection system 70 has projection system 71 and the receiving system 72 that the PA of view field that clips projection optical system PL is arranged at its both sides respectively, detect light La on substrate P surface (plane of exposure) from the tilted direction projection via the liquid on the substrate P 50 from projection system 71, be received in substrate P by receiving system 72 and go up reflection detecting light (reverberation) La.Control device CONT, in the action of control focus detection system 70, based on receiving system 72 be subjected to the light result, detect with respect to stipulated standard in the face of the position (focal position) on the Z-direction on substrate P surface and tilt.In addition, in Fig. 8, projection system 71 and receiving system 72 clip the PA of view field and are arranged at the position of leaving from the PA of view field in the side separately of ± directions X, and projection system 71 and receiving system 72 also can clip the PA of view field and be provided with in the side separately of ± Y direction.
The projection system 71 of focus detection system 70 has a plurality of projection units, as shown in Figure 9, and a plurality of detection light La of projection on substrate P.In addition, receiving system 72 has a plurality of light accepting parts corresponding to a plurality of projection units.Thus, substrate P surface just can be tried to achieve to, each focal position on rectangular a plurality of each points (each position) for example by focus detection system 70.In addition, can obtain the posture of the incline direction of substrate P based on the focal position on a plurality of each points of being obtained.In addition, formation about focus detection system 70, for example in the flat 8-37149 communique of Japan Patent Publication Laid-Open, at length put down in writing, home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of the document and as a part described herein.
Control device CONT is based on the testing result of focus detection system 70, via the Z workbench 51 (with reference to Fig. 1) of chip bench drive unit PSTD drive substrate platform PST, control thus position (focal position) on the Z-direction of the substrate P that is kept on the Z workbench 51, and θ X, θ Y direction on the position.Promptly, Z workbench 51 bases are moved based on the instruction from control device CONT of the testing result of focus detection system 70, and the surface (plane of exposure) that the focal position (Z position) of control substrate P and inclination angle make substrate P is fit to via projection optical system PL and liquid 50 formed image planes.
Turn back to Fig. 8, be provided with the 1st optics 81 that can see through the detection light La that penetrates from the projection system 71 of focus detection system 70 and the 2nd optics 82 that can see through the detection light La that on substrate P, is reflected near the leading section of projection optical system PL.The 1st optics 81 and the 2nd optics 82 are supported with the state that the optical element 60 with projection optical system PL front end separates, the 1st optics 81 is configured in optical element 60-directions X side, the 2nd optics 82 be configured in optical element 60+the directions X side.In addition, the 1st optics 81 and the 2nd optics 82 and being arranged at do not hinder the position of moving of the light path of exposure light EL and substrate P and can touch the position of the liquid 50 of immersion liquid zone AR.
As shown in Figure 8, in the exposure-processed of substrate P, (with reference to Fig. 1) supplies to liquid 50 on the substrate P from fluid Supplying apparatus 1, so that the light path of the exposure light EL by projection optical system PL that is the light path of the exposure light EL between optical element 60 and the substrate P (PA of view field on the substrate P) all are full of with liquid 50.In addition, when the light path of the exposure light EL between optical element 60 and the substrate P all is full of, becomes immersion liquid zone AR and cover all such specified states of the PA of view field with liquid 50 on substrate P, the liquid 50 that forms immersion liquid zone AR just adhesion (contact) in the 1st optics 81 and the 2nd optics 82 end face separately.Form immersion liquid zone AR on the substrate P, liquid 50 is adhered under the state of the 1st optics 81 and the 2nd optics 82 end face separately, the light path among detection light La that penetrates from the projection system 71 of focus detection system 70 and the light path of the reverberation La on the substrate P between the 2nd optics 82 of the 1st optics 81 all is full of with liquid 50.In addition, under the state that the light path that detects light La all is full of with liquid 50, the PA of view field that shines the projection optical system PL on the substrate P from the detection light La of projection system 71 ejaculations of focus detection system 70 so sets.In addition, also can be to the outside of the PA of view field, the detection light that particularly PA of view field shone in the position of the scanning direction of leaving substrate P (X-direction).
Under the state that form with the state of regulation at immersion liquid zone AR, the light path of the detection light La between the 2nd optics 82 of the 1st optics 81 all is full of with liquid 50, the detection light La that penetrates from the projection system 71 of focus detection system 70, liquid 50 by the 1st optics 81 and immersion liquid zone AR is radiated at substrate P (PA of view field) with desired state, and scattering or refraction etc. can not take place.Be subjected to light at receiving system 72 with desired state from the reverberation La of substrate P liquid 50 and the 2nd optics 82 by immersion liquid zone AR.In other words, the detection light La that penetrates at the projection system 71 from focus detection system 70 is subjected to the light time by receiving system 72, and immersion liquid zone AR is just formed with the state of regulation.Like this, just can with optical mode whole whether being full of with liquid 50 in the light path that detects light La do not detected based on the output of the receiving system 72 of focus detection system 70.
In addition, as described above, under the situation that immersion liquid zone AR forms with the state of regulation, the detection light La that penetrates from the projection system 71 of focus detection system 70, just shine the PA of view field of projection optical system PL, and at least a portion of the light path of the exposure light EL by comprising the PA of view field.Thus, focus detection system 70 just can be based on the output of receiving system 72, and whether the light path that detects exposure light EL with optical mode is full of with liquid 50.
In addition, though establish the 1st optics 81 and the 2nd optics 82 here for separate parts are illustrated, the 1st optics 81 and the 2nd optics 82 are constituted like this as the optical element 60 that a ring-type optics surrounds the leading section of projection optical system PL.Can be to a part of irradiating and detecting light of ring-type optics, via the detection light of ring-type optics acceptance by immersion liquid zone AR and substrate P surface.Optics is formed in the form of a ring and make the liquid 50 of immersion liquid zone AR be adhered to the medial surface of ring-type optics, just can keep the shape of the regional AR2 of immersion liquid thus well.In addition, though in the present embodiment, the 1st optics 81 and the 2nd optics 82 separate setting with respect to projection optical system PL, also can be provided with integratedly with the optical element 60 of projection optical system PL.
In addition, by to as the liquid contact surface of the end face of above-mentioned the 1st, the 2nd optics 81,82 or the liquid contact surface of above-mentioned ring-type optics, for example carry out the lyophily processing and be made as lyophily, the liquid 50 of immersion liquid zone AR just becomes and is easy to adhere to the liquid contact surface of optics, so just can be easy to keep the shape of immersion liquid zone AR.
Figure 10 is the figure that exists the state of bubble 18 in the liquid 50 of expression immersion liquid zone AR.As shown in figure 10, among a plurality of detection light La that the projection system 71 from focus detection system 70 penetrates, the detection light La that runs into bubble 18 produces scattering or refraction etc.Thus, meet the detection light La of bubble 18, just accepted with the state that has reduced light quantity at receiving system 72, perhaps since its light path change and be not subjected to light.That is, under the situation that bubble (gas part) 18 is arranged in liquid 50, the intensity variation (reduction) of receiving system 72 suffered light.Thereby focus detection system 70 just can detect the bubble (gas part) 18 that exists in the liquid 50 of formed immersion liquid zone AR on the light path of exposure light EL based on the output of receiving system 72 with optical mode.Because immersion liquid zone AR forms on the light path of exposure light EL, in addition, detect the view field PA of light La irradiation as the part of the light path of exposure light EL, so focus detection system 70 just can be based on the output of receiving system 72, whether the light path that detects the light EL that has or not, promptly exposes of the bubble (gas part) in the light path of exposure light EL is full of with liquid 50.And then focus detection system 70 just can detect the bubble (gas part) in the light path of the detection light La in the liquid 50.
Here, bubble 18 in Figure 10, comprise the bubble 18A that swims in liquid 50, attached to the bubble 18B of the end face (liquid contact surface) of the 1st optics 81, attached to the bubble 18C of the end face (liquid contact surface) of the 2nd optics 82 and attached to the bubble on the substrate P (not shown).Like this, when in the liquid 50 of immersion liquid zone AR, existing under the situation of bubble 18, the detection light La that penetrates owing to the projection system 71 from focus detection system 70 produces scattering or refraction etc., light quantity (light income) for receiving system 72 is changed, perhaps make its optical path change and can't be accepted (reference marks Lb) by receiving system 72, detect in the liquid 50 of immersion liquid zone AR set on the light path of exposure light EL and have or not gas partly (bubble) so focus detection system 70 just can be based on the output of receiving system 72.
In addition, in the present embodiment, owing to be the output of focus detection system 70 based on receiving system 72, the formation that bubble 18 in the light path that detects light La is detected, so certainly detect attached to the bubble on the substrate P or attached to the bubble 18 (18B, 18C) of the 1st, the 2nd optics 81,82, also can detect for the bubble 18 (18A) that swims in the liquid 50 that forms immersion liquid zone AR.For this reason, if on the light path that detects light La, then also can detect the bubble 18 that exists on the position beyond the light path of the exposure light EL in the liquid 50 of immersion liquid zone AR.Control device CONT detects while the face positional information of using 70 couples of substrate P of focus detection system and carries out exposure-processed.Focus detection system 70 can throw in the exposure-processed of substrate P and detect light La having or not or detects gas having or not partly in the light path of light La with gas part on the light path that detects exposure light EL, in the liquid 50.Certainly, focus detection system 70 also can have or not gas partly to detect in the liquid 50 of timing to immersion liquid zone AR beyond exposure-processed.
In addition, if focus detection system 70 on the light path that detects light La, then also can detect the bubble 18 that exists on the position beyond the light path of the exposure light EL in the liquid 50 of immersion liquid zone AR.For example, in scan exposure, the bubble 18 that exists on the position beyond the light path of exposure light EL follows moving of substrate P to move in liquid 50 and be configured on the light path of the light EL that exposes or be attached under the situation of substrate P or optical element 60, also can be by focus detection system 70, be configured on the light path of exposure light EL at the bubble 18 that exists on the position beyond the light path of exposure light EL or before being attached to substrate P or optical element 60, detect this bubble 18.Thereby, just can be in exposure-processed, before the bubble 18 in liquid 50 of for example swimming is configured on the light path of exposure light EL or substrate P goes up, predict that based on the output of focus detection system 70 bubble 18 is configured on the light path of exposure light EL or on the substrate P, for example carry out that exposure-processed stops or the appropriate processing such as driving of alarm device.Thus, just can avoid the bad situation that ill-exposed or bad shooting takes place.
In addition, because the projection system 71 of focus detection system 70 shines rectangular each point on the substrate P with a plurality of detection light La, so a plurality of detection light La luminous intensity (light income) separately that focus detection system 70 just can be accepted based on receiving system 72 is obtained the positional information of bubble 18.Here, a plurality of detection light La irradiation position information is separately determined based on design load.Control device CONT, can based among a plurality of detection light La, the irradiation position information of the detection light La that reduced of the luminous intensity that incides each light accepting part of receiving system 72, the information that the position is set of the light accepting part of perhaps relevant receiving system 72 corresponding to this detections light La is determined the position (light path of the detection light of bubble 18 existence) of bubble 18.
In addition, as shown in figure 11, liquid 50 fully be not full of between the optical element 60 of projection optical system PL and the substrate P, the part of liquid 50 is used up, immersion liquid zone AR forms with the state of regulation and the possibility that generates gas zones AG in the light path of exposure light EL is not arranged.Focus detection system 70 can also detect having or not of this gas zones AG.In addition, gas zones AG for example because of the liquid 50 that moves of following substrate P peel off or the action of fluid Supplying apparatus 1 is bad etc. produces.In Figure 11, gas zones AG forms near the 2nd optics 82, and liquid 50 inadhesion (contact) of immersion liquid zone AR are in the end face of the 2nd optics 82.In the case, also be detection light La from projection system 71 ejaculations of focus detection system 70, on the interface of the liquid 50 of immersion liquid zone AR and gas zones AG scattering or refraction taking place, is subjected to light or is not subjected to light with the state that has reduced light quantity at receiving system 72.Focus detection system 70 just can be based on the output of receiving system 72, and whether the light path that detects the light EL that has or not, promptly exposes of the gas zones AG in the light path of exposure light EL among the AR of immersion liquid zone is full of with liquid 50.In addition, in the case, also be that control device CONT carries out exposure-processed while the face positional information of using focus detection system 70 to detect substrate P, so can be based on the output of this focus detection system 70 (receiving system 72), detect having or not or detecting gas having or not partly in the light path of light La of gas part in the light path that in the exposure of substrate P, detects exposure light EL.Then, when in exposure-processed, detecting under the situation of gas zones AG with focus detection system 70, control device CONT just can be based on the output of focus detection system 70, and embodiment is as stopping exposure actions or the liquid quantity delivered of utilizing fluid Supplying apparatus 1 or the liquids recovery amount of utilizing liquid withdrawal system 2 being adjusted immersion liquid zone AR is maintained at the appropriate disposal such as state of regulation.
So, when substrate P being carried out the immersion exposure processing, shown in Figure 12 (a), after substrate P is encased in chip bench PST, before beginning exposure-processed, carry out on substrate P, forming the immersion liquid zone formation action of immersion liquid zone AR by driving fluid Supplying apparatus 1 and liquid withdrawal system 2.At this moment, control device CONT on one side will detect light La by the projection system 71 of focus detection system 70 and shine substrate P and carry out on one side that immersion liquid before the exposure-processed is regional to form action, thus just can be based on the output of focus detection system 70 (receiving system 72), whether the exposure of judging substrate P begins appropriately.That is, immersion liquid before exposure-processed zone forms in the action, shown in Figure 12 (b), fully forms as yet and exists under the situation of gas zones AG at immersion liquid zone AR, and the luminous intensity that arrives the detection light La of receiving system 72 reduces.Control device CONT is based on the output of the receiving system 72 of focus detection system 70, is judged as immersion liquid zone AR and fully forms as yet, and be judged as the beginning immersion exposure and handle incorrect.Control device CONT proceeds the formation action of immersion liquid zone and is formed with the state of regulation up to immersion liquid zone AR, according to circumstances the liquid quantity delivered of fluid Supplying apparatus 1 or the liquids recovery amount of liquid withdrawal system 2 are changed, perhaps the regional operation condition that forms of relevant immersion liquid such as position to mobile substrate P changes.Shown in Figure 12 (c), if immersion liquid zone AR fully forms, the light path of the detection light La between the 2nd optics 82 of the 1st optics 81 is full of with liquid 50, then the light path of the optical element 60 of projection optical system PL and the exposure light EL between the substrate P also is full of with liquid 50.Under this state, because the detection light La that penetrates from projection system 71 incides receiving system 72 with the luminous intensity of stipulating, so control device CONT is based on the output of the receiving system 72 of focus detection system 70, be judged as immersion liquid zone AR and be formed, and be judged as the beginning immersion exposure and handle comparatively appropriate.Then, control device CONT begins to expose the irradiation of light EL to carry out exposure-processed.
So, as described above, in the exposure of substrate P, in the AR of the immersion liquid zone of the light path that is comprising exposure light EL by focus detection system 70, detect under the situation of gas parts such as bubble 18 or gas zones AG, control device CONT just stops the processing such as exposure-processed of this substrate P, though also consider on the light path of exposure light EL, to be full of liquid 50, detect light La and not taken place by the situation of light at receiving system 72 with the luminous intensity of regulation.In this case, handle, stop the bad situation of exposure-processed although immersion exposure takes place to carry out.For example, as shown in figure 13, among a plurality of detection light La1～La5 that throwed from the projection system 71 of focus detection system 70, shine the edge part E of substrate P and be arranged at the detection light La3 in the gap 58 between the flat board member 57 around the substrate P, the possibility that scattering or refraction etc. takes place and be not subjected to light with the luminous intensity of regulation at receiving system 72 is just arranged.Here, flat board member 57 is to be the endless member that concentric shape is provided with on substrate P, the top roughly the same height of the top and substrate P of flat board member 57, by means of this flat board member 57, even when carrying out immersion exposure near the edge part E of substrate P, also can keep liquid 50 to keep the shape of immersion liquid zone AR under the optical element 60 at projection optical system PL.Be formed with gap 58 between substrate P and the flat board member 57, be irradiated to the detection light La3 in this gap 58, although just there is immersion liquid zone AR to be formed well, but be not subjected to the possibility of light at receiving system 72 with the luminous intensity of regulation, in this case, will control device CONT stops exposure-processed based on the output of receiving system 72 bad situation take place.In addition, also consider not to be provided with the formation of flat board member 57, in this case, although just have between substrate P and chip bench PST (Z workbench 51) to form step difference, near the substrate P the edge part E, be formed with immersion liquid zone AR, shine the detection light La3 in the outside of substrate P, La4, La5 etc. are not subjected to light at receiving system 72 with the luminous intensity of regulation possibility.
In this case, the positional information of the edge part E (gap 58) of the substrate P that control device CONT fastens based on the measurement result of the laser interferometer 55 (with reference to Fig. 1) of the position of the chip bench PST that measures bearing substrate P with the stage coordinates of laser interferometer 55 defineds is controlled exposure actions.Particularly, for example, during registration process before exposure-processed etc. in, control device CONT obtain in advance the substrate P that above-mentioned stage coordinates fastens edge part E (gap 58) positional information and store storage device MRY into.Then, while control device CONT utilizes the positional information measurement of 55 couples of substrate P of laser interferometer to carry out exposure-processed.In exposure-processed, whether the positional information of the edge part E of the substrate P that control device CONT is stored with reference to storage device MRY is judged to shine near the edge part E of the substrate P that comprises gap 58 light of detection La.For example, shining under the situation that detects light La when being judged as in gap 58, even if the situation of sensitization takes place to be reduced or not to be able to by the light quantity of the detection light La of receiving system 72 suffered light, control device CONT also ignores the output of receiving system 72, proceeds exposure-processed.By handling like this, handle the bad situation that stops exposure-processed and so on well although just can avoid immersion exposure.
Figure 14 is the figure of expression other execution modes of the present invention.The characteristic of present embodiment is that the optical element 60 that can see through the optics 81,82 of detection light La of focus detection system 70 and projection optical system PL becomes one this point is set.The detection light La of part or all sets like this by a part of (leading section) optical element 60 among a plurality of optical elements that constitute projection optical system PL among a plurality of detection light La that penetrate from the projection system 71 of focus detection system 70.Focus detection system 70 will detect light La via optical element 60 and project on the substrate P.Utilize this formation focus detection system 70 also can detect having or not of gas part in the light path of exposure light EL.In addition, in Figure 14, optics 81,82 lower surface (liquid contact surface) separately is for being roughly parallel to the tabular surface on XY plane, with the roughly the same height of front end face (lower surface) of optical element 60.The liquid 50 of immersion liquid zone AR is adhered to the lower surface of optics 81,82 and the lower surface of optical element 60, and between projection optical system PL and substrate P, immersion liquid zone AR is formed on the broad zone.
In addition, as shown in figure 15, when in the liquid 50 of immersion liquid zone AR, existing under the situation of bubble 18, same with above-mentioned execution mode, because the detection light La that penetrates from projection system 71 runs into bubble 18 and scattering etc., so be subjected to light with the state that luminous intensity has reduced at receiving system 72.Thus, focus detection system 70 just can be based on the output of receiving system 72, detects in the light path of exposure light EL among the AR of immersion liquid zone or detect having or not of bubble (gas part) 18 in the light path of light La.
In addition, optics 81,82 both can constitute with separate separately parts in the case, and the optical element 60 that also can surround the leading section of projection optical system PL forms so in the form of a ring integratedly.
As described above, the liquid in the present embodiment 50 has used pure water.Pure water can easily obtain in a large number at semiconductor fabrication factory etc., also has not the advantage for the bad influence of photoresist on the substrate P (photoresist) or optical element (lens) etc. simultaneously.In addition, for the bad influence of environment, the amount of impurity is extremely not low simultaneously for pure water, so can also expect the surface of substrate P and be arranged at the effect that the surface of optical element of the front end face of projection optical system PL is cleaned.
And, pure water (water) is that the refractive index n of the exposure light EL of 193nm degree is considered to about 1.44～1.47 with respect to wavelength, penetrate under the situation of light (wavelength 193nm) as the light source of exposure light EL utilizing the ArF exciplex to swash, on substrate P with 1/n, promptly about 131～134nm degree is obtained higher exploring degree by the short wavelengthization.And then, compare in the depth of focus and the air doubly, promptly about 1.44～1.47 times of degree are extended with about n, so under the situation that the situation that can guarantee and use in air gets final product with the depth of focus of degree, the numerical aperture of projection optical system PL is further increased, and the exploring degree also will improve in this.
In the present embodiment, at the front end of projection optical system PL lens 60 have been installed, but, can also be used optical sheet in the adjustment of optical characteristics, for example aberration (spherical aberration, coma aberration etc.) at projection optical system PL as the optical element of the front end that is installed on projection optical system PL.It perhaps also can be the planopaallel plate that can see through exposure light EL.By being made as planopaallel plate with the optical element that liquid 50 contacts than lens cheapness, even the material that reduces in the homogeneity of adhering to the transmission coefficient that makes projection optical system PL, the illumination of exposure light EL on the substrate P and Illumination Distribution on this planopaallel plate when the carrying of exposure device EX, assembling, adjustment etc. (for example silicon family organic substance etc.), only before feed fluid 50, change this planopaallel plate and get final product, have the advantage lower and so on than its replacement cost of situation that will be made as lens with the optical element that liquid 50 contacts.Promptly, the surface of making adhering to of impurity the liquid 50 etc. the optical element that contacts with liquid 50 dirty owing to the particle or result from of splashing that takes place from resist because of the irradiation of exposure light EL, so need change this optical element termly, by this optical element being made as cheap planopaallel plate, compare the cost step-down that just can make the replacing parts with lens, and can make and change the desired time and shorten, can also suppress the low of the rising of maintenance cost (operating cost) or production capacity.
In addition, under the optical element of the front end of the projection optical system PL produced because of flowing of liquid 50 and the bigger situation of the pressure between the substrate P, can also not replaceable this optical element but firmly fix optical element so that it can be because of this pressure activity.
In addition, though in the present embodiment, be the formation that between projection optical system PL and substrate P surface, is full of, but also can be the constituting of full of liquid 50 under the state that the cover glass be made up of planopaallel plate is installed on the surface of substrate P for example with liquid 50.At this moment, cover glass also constitutes the part of projection optical system PL.That is, the whole optical elements that exist on the light path with the exposure light EL between mask M and the substrate P are made as projection optical system.
In addition, though the liquid 50 of present embodiment is water, also can be the liquid beyond the water, for example, be F at the light source of exposure light EL 2Under the situation of laser, because this F 2Swash penetrate light can permeate water, so can also be to see through F as liquid 50 in the case 2Swash for example fluorine family oil (liquid of fluorine family) of penetrating light and cross fluorinated polyether (PFPE).In addition, as liquid 50, can also use in addition have for the permeability of exposure light EL and refractive index is high as far as possible, to the stable liquid of the photoresist coated (red deal oil for example: cedar oil) on projection optical system PL or substrate P surface.
In the respective embodiments described above, the shape of said nozzle does not limit especially, for example can carry out the supply or the recovery of liquid 50 with two pairs of nozzles for the long limit of leading section 60A yet.In addition, since in the case from+directions X or-either direction of directions X all can carry out the supply and the recovery of liquid 50, so also can dispose supply nozzle up and down side by side and reclaim nozzle.
In addition; substrate P as the respective embodiments described above; be not only the semiconductor wafer of semiconductor device manufacturing usefulness, the glass substrate that also applicable display device is used or, the ceramic sheet used of film magnetic head or used mask or master (synthetic quartz, silicon wafer) of netting twine etc. in exposure device.
In addition, though in the above-described embodiment, employing is the local exposure device that is full of with liquid between projection optical system PL and substrate P, but the immersion exposure device that among liquid bath (liquid bath), moves for the maintenance workbench that makes the substrate that keeps exposure object or, on workbench, form the liquid tank (liquid pool) of prescribed depth and keep the immersion exposure device of substrate also can be suitable for the present invention therein.Make the structure and the exposure actions of the immersion exposure device that the workbench of the substrate that keeps exposure object moves among liquid bath, for example in the flat 6-124873 communique of Japan Patent Publication Laid-Open, put down in writing in detail, the liquid tank that forms prescribed depth on workbench also keeps the structure and the exposure actions of the immersion exposure device of substrate therein, for example at flat 10-303114 communique of Japan Patent Publication Laid-Open or United States Patent (USP) the 5th, 825, put down in writing in detail in No. 043, home in the scope that decree allowed of the specified or selected country of border application, quote the record content of these documents and as a part described herein.
As exposure device EX, except with moved further mask M and substrate P the scanning exposure apparatus (scanning stepper) in step-scan (step-and-scan) mode of the pattern of mask M being carried out scan exposure, can also be applicable to making under the static state of mask M and substrate P the pattern of mask M is summed up exposure, make substrate P successively the stepping stepping of moving repeat the projection aligner (stepper: portable one by one exposure device) of (step-and-repeat) mode.In addition, the present invention can also be applicable to the exposure devices of 2 overlapping steppings of carrying out transfer printing of pattern part being sewed up (step-and-stitch) mode on substrate P at least.
In addition, the present invention can also be applicable to the exposure device of double-workbench (twin-stage) type.The structure of the exposure device of double-workbench type and exposure actions, for example at the flat 10-163099 of Japan Patent Publication Laid-Open number and the flat 10-214783 of Japan Patent Publication Laid-Open number (corresponding United States Patent (USP) 6,341,007,6,400,441,6,549,269 and 6,590,634), special table 2000-505958 number (corresponding United States Patent (USP) 5,969,441) or United States Patent (USP) 6,208, disclose in 407, home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of these documents respectively and as a part described herein.
Kind as exposure device EX, be not limited to the exposure device of the semiconductor element manufacturing usefulness of exposure semiconductor element pattern on substrate P, the liquid crystal display cells manufacturing with or the exposure device of display manufacturing usefulness or the be used for exposure device etc. of making film magnetic head, imaging apparatus (CCD) or netting twine or mask etc. also can extensively be suitable for.
In chip bench PST or mask platform MST, use under the situation of linear motor, also can use the air floating type that has utilized air bearing and utilize Lorentz force or reactance power a certain in the magnetic suspension type.In addition, each workbench PST, MST both can be the types that moves along guide rail, also can be the nothing guiding types that guide rail is not set.The example that utilizes linear motor in workbench is at United States Patent (USP) 5,623, and 853 and 5,528, disclose in 118, home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of these documents respectively and as a part described herein.
As the driving mechanism of each workbench PST, MST, the opposed planar motors that drives each workbench PST, MST by means of electromagnetic force in armature unit of coil of can also having used with two-dimensional arrangement the magnet unit of magnet, two-dimensional arrangement.In this case, a certain side in magnet unit and the armature unit is connected to workbench PST, MST, the all-moving surface side that the opposing party of magnet unit and armature unit is arranged at workbench PST, MST gets final product.
To take place counter-force is not passed to projection optical system PL in order making, also can to use frame parts mechanically to be discharged into ground (the earth) because of moving of chip bench PST.The processing method of this counter-force, for example, at United States Patent (USP) 5,528, at length disclose in 118 (the flat 8-166475 communiques of Japan Patent Publication Laid-Open), home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of the document and as a part described herein.
To take place counter-force is not passed to projection optical system PL in order making, also can to use frame parts mechanically to be discharged into ground (the earth) because of moving of mask platform MST.The processing method of this counter-force, for example, at United States Patent (USP) 5,874, at length disclose in 820 (the flat 8-330224 communiques of Japan Patent Publication Laid-Open), home in the scope that is allowed in the decree of the specified or selected country of border application, quote the record content of the document and as a part described herein.
As described above, the exposure device EX of the application's execution mode makes mechanical precision, electric precision, optical accuracy to guarantee regulation by the various subsystems that assembling comprises each inscape of enumerating in the scope that the application's patent requires.In order to ensure these various precision, before and after this assembling, carry out for the adjustment that reaches optical accuracy, carry out for the adjustment that reaches mechanical precision, carry out in order to reach the adjustment of electric precision for various electrical systems for various machinery system for various optical systems.Assembling procedure from various subsystems to exposure device comprises the distribution connection of the mutual mechanical connection of various subsystems, electric circuit, the pipe arrangement connection of air pressure circuit etc.Self-evident at various subsystems from then on before the assembling procedure of exposure device, each subsystem assembling procedure is separately arranged.In case various subsystems finish to the assembling procedure of exposure device, just comprehensively adjust, and guarantee as all various precision of exposure device.In addition, wishing that being manufactured on of exposure device managed in the clean room of temperature and cleannes etc. carries out.
The micro element of semiconductor device etc., make through following steps as shown in figure 16, promptly, carry out the step 201 of the functional performance design of micro element, exposure-processed step 204, the device number of assembling steps (comprising cutting action, bond sequence, packaging process) 205 that make step 202, make step 203, the exposure device EX by aforementioned embodiments exposes the pattern of mask on substrate and check step 206 etc. as the substrate of the base material of device based on the mask (netting twine) of this design procedure.In addition, in exposure-processed step 204, be included in the preceding surface-treated step of carrying out substrate for the hydrophily of substrate and liquid is adjusted of exposure.
Utilizability on the industry
According to the present invention, when carrying out exposure-processed based on immersion method, just can be by means of gas Bubble detector or gas detecting system, to as and the very big part of pattern transfer accuracy relation, The gas that comprises the bubble in the liquid between projection optical system and the substrate partly detects. In addition, whether the liquid that can also detect between projection optical system and the substrate is used up, or throws The image planes side of shadow optical system whether use exposure or measuring fully liquid be full of. Based on this testing result, just can implement be used to keeping good productive appropriate disposal.

Claims (20)

1. one kind is transferred to the picture of pattern on the substrate via liquid and to the exposure device that substrate exposes, possesses:
The picture of pattern is projected to the projection optical system of substrate; And
Have and project light at the projection system on the aforesaid liquid between this projection optical system and the above-mentioned substrate and accept air-foam detector from the receiving system of the light of the aforesaid liquid between this projection optical system and above-mentioned substrate, above-mentioned air-foam detector detects the bubble in the liquid between this projection optical system and above-mentioned substrate according to the output of above-mentioned receiving system.
2. according to the described exposure device of claim 1, it is characterized in that:
Above-mentioned substrate moves in the scanning direction of regulation on one side and carries out scan exposure on one side,
The position projection light of above-mentioned projection system from separating with respect to the optical axis of above-mentioned projection optical system in above-mentioned scanning direction.
3. according to the described exposure device of claim 2, it is characterized in that having:
Supply with the feedway of aforesaid liquid,
Wherein, aforesaid liquid in above-mentioned scan exposure, and above-mentioned scanning direction between above-mentioned projection optical system and above-mentioned substrate, flow abreast.
4. according to the described exposure device of claim 1, it is characterized in that:
Above-mentioned air-foam detector is based on the amount that detects above-mentioned bubble with the detected light intensity of above-mentioned receiving system.
5. according to the described exposure device of claim 1, it is characterized in that:
Based on the testing result of above-mentioned air-foam detector, judge whether the exposure of above-mentioned substrate is carried out rightly.
6. according to the described exposure device of claim 5, it is characterized in that:
Utilizing above-mentioned air-foam detector to carry out bubble in to the exposure separately of above-mentioned on-chip a plurality of shooting areas detects, and, store the shooting area that causes not carrying out rightly the imaging of above-mentioned pattern image in above-mentioned a plurality of shooting area because of above-mentioned bubble based on each testing result.
7. one kind is mapped on substrate, measurement component or the transducer and to the exposure device that above-mentioned substrate, measurement component or transducer expose, possesses via the illumination that will expose of projection optical system and liquid:
Gas detecting system, have and project light at the projection system on the aforesaid liquid between this projection optical system and above-mentioned substrate, measurement component or the transducer and accept receiving system from the light of the aforesaid liquid between this projection optical system and above-mentioned substrate, measurement component or transducer, the above-mentioned gas detection system has or not gas partly to detect based on the output from above-mentioned receiving system in the light path to above-mentioned exposure light.
8. according to the described exposure device of claim 7, it is characterized in that:
The above-mentioned gas detection system detects the bubble in the light path of above-mentioned exposure light.
9. according to the described exposure device of claim 7, it is characterized in that:
Whether the above-mentioned gas detection system is full of by liquid the light path of above-mentioned exposure light and detects.
10. according to the described exposure device of claim 7, it is characterized in that:
Based on the output of above-mentioned gas detection system, judge whether appropriate the exposure to above-mentioned substrate, measurement component or transducer begins.
11., it is characterized in that according to the described exposure device of claim 7:
The above-mentioned gas detection system has or not gas to detect in the light path to above-mentioned exposure light in to the exposure of above-mentioned substrate, measurement component or transducer.
12., it is characterized in that according to the described exposure device of claim 7:
The above-mentioned gas detection system has by will detect light via the liquid on above-mentioned substrate, measurement component or the transducer and projects on above-mentioned substrate, measurement component or the transducer and by above-mentioned receiving system from above-mentioned projection system and accept the face position detecting function that its reverberation detects the face position of above-mentioned substrate, measurement component or transducer.
13. one kind via projection optical system and the liquid exposure device that illumination is mapped to substrate and above-mentioned substrate is exposed that will expose, and possesses:
To detect light via above-mentioned on-chip liquid and project on the above-mentioned substrate, be received in the detection light that is reflected on the above-mentioned substrate simultaneously, with the face position detecting system of the face position of detecting above-mentioned substrate,
Wherein, based on the output of above-mentioned position detecting system, detect in the light path of above-mentioned detection light and have or not the gas part.
14., it is characterized in that according to the described exposure device of claim 13:
Above-mentioned detection light is by the light path of above-mentioned exposure light.
15., it is characterized in that according to the described exposure device of claim 13:
Based on the output of above-mentioned position detecting system, detect the bubble in the light path of above-mentioned detection light.
16., it is characterized in that according to the described exposure device of claim 13:
Based on the output of above-mentioned position detecting system, judge whether appropriate the exposure of above-mentioned substrate begins.
17., it is characterized in that according to the described exposure device of claim 13:
Based on the output of above-mentioned position detecting system, in the exposure of above-mentioned substrate, have or not gas in the light path of the above-mentioned detection light of detection.
18., it is characterized in that according to the described exposure device of claim 13:
Above-mentioned position detecting system projects a plurality of detection light on the above-mentioned substrate.
19., it is characterized in that according to the described exposure device of claim 13:
Above-mentioned position detecting system projects above-mentioned detection light on the above-mentioned substrate via a part of optics of above-mentioned projection optical system.
20. a device making method is characterized in that:
Utilize any described exposure device in the claim 1,7 and 13.
CNB2003801054206A 2002-12-10 2003-12-09 Exposure apparatus and method for producing device Expired - Fee Related CN100444315C (en)

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