CN100444370C - 半导体装置、电路基板、电光学装置以及电子机器 - Google Patents

半导体装置、电路基板、电光学装置以及电子机器 Download PDF

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CN100444370C
CN100444370C CNB2005100758072A CN200510075807A CN100444370C CN 100444370 C CN100444370 C CN 100444370C CN B2005100758072 A CNB2005100758072 A CN B2005100758072A CN 200510075807 A CN200510075807 A CN 200510075807A CN 100444370 C CN100444370 C CN 100444370C
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resin
semiconductor device
electrode
mentioned
conducting film
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CN1716586A (zh
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田中秀一
伊东春树
有贺泰人
田村良平
高野道义
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Seiko Epson Corp
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Seiko Epson Corp
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

本发明涉及一种能够可靠地进行与对方侧基板之间的导电连接的半导体装置(121)。半导体装置(121)具有形成在有源面(121a)中的电极焊盘(24)以及树脂凸起(12)，与从电极焊盘(24)的表面到树脂凸起(12)的表面之间所设置的导电膜(20)，通过树脂凸起(12)及其表面的导电膜(20)形成树脂凸起电极(10)，经该树脂凸起电极(10)与对方侧基板导电连接，导电膜(20)夹持树脂凸起(12)一直延伸到电极焊盘(24)的相反侧，形成检查用电极(30)。

Description

半导体装置、电路基板、电光学装置以及电子机器
技术领域
本发明涉及一种半导体装置、电路基板、电光学装置以及电子机器。
背景技术
安装在各种电子机器中的电路基板或液晶显示装置等当中，将IC芯片等半导体装置安装在基板上。例如，液晶显示装置中，用来驱动液晶屏的液晶驱动用IC芯片，安装在构成液晶屏的玻璃基板(对方侧基板)中(所谓的COG构造)。在象这样将使用硬硅基板的IC芯片，安装在硬玻璃基板上的情况下，很难吸收IC芯片与玻璃基板之间的翘曲。因此，IC芯片中形成有凸起电极，将该凸起电极压扁而安装在玻璃基板上，通过这样将两者导电连接起来。
最近，伴随着液晶显示装置的高精细化，IC芯片的端子数也增加，另外，对IC芯片的小型化的要求也很迫切。因此，需要让形成在IC芯片中的凸起电极之间的间距较窄。另外，以前的凸起电极，是通过在保护层开口部中实施电解镀Au等而形成的，因此，凸起电极的窄间距化，需要保护层开口部的纵横比交大。所以，以前的凸起电极中，很难与窄间距化相对应。
因此，如图9所示的树脂凸起电极10被开发出来。树脂凸起电极10，是通过在树脂凸起12的表面形成导电膜20，并将该导电膜20与IC芯片21的电极焊盘24相连接而形成的(参照例如专利文献1)。如果将该树脂凸起电极10与对方侧基板相接触，树脂凸起12便会弹性变形，因此能够吸收IC芯片21以及对方侧基板的翘曲。另外，由于并不需要加大纵横比，从而还能够与凸起电极的窄间距化相对应。
另外，构成IC芯片21的晶体管等电子元件(未显示)的动作检查，以及到该电子元件的导通检查，是通过将检查用探针，接触作为与对方侧基板之间的导电连接部的凸起电极的顶部来进行的。
专利文献1：特开平2-272737号公报。
但是，存在如果用检查用探针接触凸起电极的顶部，凸起电极的顶部就会被削去这一问题。
以前的凸起电极，由于电解镀Au而形成了相当的厚度。因此，即使由于和检查用探针之间的接触而使得凸起电极的顶部被削去，凸起电极与对方侧基板之间将无法导电。但是，树脂凸起电极10中，树脂凸起12的表面的导电膜20非常薄。因此，一旦由于和检查用探针之间的接触而使得树脂凸起电极10的导电膜20被削去，树脂凸起电极10与对方侧基板之间就有可能会无法导电连接。
另外，也考虑在电极焊盘24与树脂凸起电极10之间设置检查部，让检查用探针与该检查部中的导电膜20相接触来进行各种检查。但是，这种情况下，无法对电极焊盘24到树脂凸起电极10之间的全体导通状态进行检查。并且，一旦由于和检查用探针之间的接触而使得检查部中的导电膜20被削去，树脂凸起电极10与对方侧基板之间的导通就有可能会被切断。
另外，半导体装置的有源面中形成有氧化硅或氮化硅等脆性材料所制成的绝缘膜26，该绝缘膜26的表面形成有导电膜20。因此，如果检查用探针与检查部中的导电膜20相接触，该冲击有可能会破坏脆性材料所制成的绝缘膜26。
发明内容
本发明是为了解决上述以前的问题而提出，目的在于提供一种能够防止检查时的破坏，另外还能够可靠地进行与对方侧基板之间的导电连接的半导体装置。
另外，本发明的目的还在于，提供一种导电连接的可靠性优异的电路基板、电光学装置以及电子机器。
为实现上述目的，本发明的半导体装置，其具有形成在有源面中的电极焊盘以及树脂凸起，从上述电极焊盘的表面到上述树脂凸起的表面之间所设置的导电膜，经设置在上述树脂凸起的表面的上述导电膜与对方侧基板导电连接，其特征在于，上述导电膜从上述电极焊盘，夹持上述树脂凸起一直延伸到相反侧，形成检查用电极。
通过该构成，通过树脂凸起及其表面的导电膜形成作为与对方侧基板之间的导电连接部的树脂凸起电极，夹持该树脂凸起电极在电极焊盘的相反侧形成检查用电极，因此，通过让检查用探针接触该检查用电极，能够简单地进行从树脂凸起电极到电极焊盘之间的导通检查。另外，即使由于与检查用探针之间的接触而导致构成检查用电极的的导电膜的一部分被削去，也不会给半导体装置的导通性能造成影响，因此，能够可靠地进行与对方侧基板之间的导电连接。
另外，本发明的另一种半导体装置，具有：电极焊盘以及树脂凸起，相邻配置，并形成在有源面上；和导电膜，延续设置在上述电极焊盘的表面和上述树脂凸起的表面上；上述半导体装置通过设置在上述树脂凸起的表面的上述导电膜与安装基板导电连接；在上述有源面上形成有树脂层；上述导电膜设置在上述树脂层的上方，从上述电极焊盘经过上述树脂凸起一直延伸到所述电极焊盘的相反一侧，形成检查用电极。
通过该构成，与上述相同，能够简单地进行从树脂凸起电极到电极焊盘之间的导通检查，从而可靠地进行与对方侧基板之间的导电连接。并且，由于在具有弹性的树脂层的表面形成检测用电极，所以还能够在检查用电极与检查用探针之间的接触所产生的冲击中，保护半导体装置的有源面。
另外，作为优选方式，上述树脂凸起形成在上述树脂层的表面。
根据该构成，能够通过树脂层让有源面平坦化，因此，能够高精度地形成树脂凸起的高度尺寸。通过使用该树脂凸起来构成树脂凸起电极，能够可靠地进行与对方侧基板之间的电连接。
另外，作为优选方式，上述树脂凸起与上述树脂层，由相同的树脂材料构成。
根据该构成，由于树脂凸起与树脂层之间互相密合，因此能够提高树脂凸起电极的可靠性，可靠地进行与对方侧基板之间的导电连接。
另外，作为优选方式，上述树脂凸起及/或上述树脂层，由感光性树脂材料构成。
根据该构成，由于能够高精度地形成树脂凸起及/或树脂层，因此，能够可靠地让电极焊盘开口。
另外，作为优选方式，上述导电膜通过溅射法形成，并通过蚀刻法形成图形。
通过该构成，能够简单地形成导电膜，从而能够降低制造费用。
另外，作为优选方式，上述导电膜的表面中，利用导电材料形成有上述导电膜的加强部件。
根据该构成，能够通过加强部件来保护导电膜，另外还能够降低导电膜的电阻。因此，能够可靠地进行与对方侧基板之间的导电连接。
另外，本发明的电路基板特征在于，安装有如各种方式中任一个所述的半导体装置。
通过该构成，能够提供一种导电连接的可靠性优越的电路基板。
另外，本发明的电光学装置的特征在于，具有上述半导体装置或上述电路基板。
通过该构成，能够提供一种导电连接的可靠性优越的电光学装置。
另外，本发明的电子机器的特征在于，具有上述电路基板或上述的电光学装置。
通过该构成，能够提供一种导电连接的可靠性优越的电子机器。
附图说明
图1为实施方式1的相关半导体装置的说明图。
图2为实施方式1的相关半导体装置的立体图。
图3为检查用电极的再设置的说明图。
图4为实施方式2的相关半导体装置的说明图。
图5为实施方式3的相关半导体装置的说明图。
图6为作为电光学装置的实施方式之一的液晶显示装置的模式图。
图7为液晶显示装置中的半导体装置的安装构造的说明图。
图8为电子机器一例的立体图。
图9为树脂凸起电极的说明图。
图中：10-树脂凸起电极，12-树脂凸起，20-导电膜，24-电极焊盘，30-检查用电极，121-半导体装置，121a-有源面。
具体实施方式
下面对照附图对本发明的实施方式进行详细说明。另外，以下的说明中所使用的各个附图中，由于能够识别各个部件的大小的原因，而适当变更各个部件的比例。
(实施方式1)
首先对照图1至图3，对本发明的实施方式1进行说明。
图1为实施方式1的相关半导体装置的说明图。实施方式1中的半导体装置121，具有形成在有源面121a中的电极焊盘24以及树脂凸起12，以及设置在从电极焊盘24的表面到树脂凸起12的表面之间的导电膜20，通过该树脂凸起12以及导电膜20构成树脂凸起电极10。并且夹持该树脂凸起电极10导电膜20延伸到电极焊盘24的相反侧，形成检查用电极30。
(半导体装置)
图2为实施方式1的相关半导体装置的立体图。半导体装置121例如是驱动液晶显示装置的象素的IC芯片，其有源面下形成有薄膜晶体管等多个电子元件，以及将各个电子元件之间连接起来的布线等(均未图示)。图2中所示的实施方式1的半导体装置121中，多个电极焊盘24沿着该有源面121a的长边而设置。该电极焊盘24从上述电子元件等中引出。另外，有源面121a中的电极焊盘列24a的内侧，形成有沿着该电极焊盘列24a呈直线状连续的树脂凸起12。另外，在从电极焊盘24的表面到树脂凸起12的表面之间形成有多个导电膜20。通过该设置在树脂凸起12的表面的导电膜20构成多个树脂凸起电极10。
图1(a)为树脂凸起电极10的周边的平面放大图，图1(b)为图1(a)的A-A线中的侧面剖视图。如图1(b)所示，半导体装置121的有源面121a的周边部中，排列形成有Al等导电性材料所构成的多个电极焊盘24。另外，半导体装置121的有源面的全部中，形成有SiN等电气绝缘材料所制成的钝化膜26，上述各个电极焊盘24的表面上，形成有钝化膜26的开口部。
如图1(a)所示，该钝化膜26的表面，也即电极焊盘列24a的内侧，形成有树脂凸起12。树脂凸起12是直线状连续的凸条，与电极焊盘列24a平行设置。该树脂凸起12由聚酰亚胺树脂或丙烯树脂、酚树脂、环氧树脂、硅树脂、改性聚酰亚胺树脂等弹性树脂材料制成。另外，树脂凸起12最好通过感光性树脂形成。这种情况下，将感光性树脂覆盖在钝化膜26的表面，通过进行光刻而形成树脂凸起12。通过这样，能够在半导体装置121的有源面中的电极焊盘列24a的内侧，高精度地设置树脂凸起12。另外，最好通过进行使用灰掩膜(gary-mask)的光刻，如图1(b)所示，使得树脂凸起12的剖面为梯形或半圆形等容易弹性变形的上部较细的形状。
另外，在从各个电极焊盘24的表面到树脂凸起12的表面之间，形成有多个导电膜20。该导电膜20由Au或TiW、Cu、Ni、Pd、Al、Cr、Ti、W、NiV等，或无铅焊锡等导电材料制成。另外，导电膜20可以是TiW/Au等2层构造。导电膜20的形成，首先通过蒸镀或喷溅等在半导体装置121的有源面全体中形成导电膜，通过对其进行适当的成形处理来形成。
另外，最好在导电膜20的表面，形成金属镀膜等作为加强材料。具体的说，在半导体装置121的有源面全体中形成导电膜之后，在其全表面中涂布光阻材料，并在该光阻材料中形成导电膜图形的开口部。之后，在该光阻材料开口部中，通过电镀法等来堆积Au镀膜的金属镀膜。接下来将光阻材料剥离，将所堆积的金属镀膜作为掩膜，对导电膜进行蚀刻。另外，通过喷溅所形成的导电膜的厚度例如为0.3μm左右，与此相对，通过电镀所法形成的金属镀膜的厚度例如为数μm左右，因此，能够对导电膜进行蚀刻并同时保留金属镀膜。这样，如果对导电膜20的表面实施镀膜而增加导电膜20的膜厚，则能够防止因与检查用探针之间的接触所引起的导电膜20的破坏，还能够降低导电膜20的电阻。
之后，通过形成在树脂凸起12的表面的多个导电膜20，构成多个树脂凸起电极10。另外，凸条树脂凸起12与半球状的树脂凸起相比，由于能够高精度地形成高度尺寸，因此，通过使用凸条树脂凸起12来构成树脂凸起电极10，能够提高与对方侧基板之间的导电连接的可靠性。另外，由于树脂凸起12的剖面为上部较细的形状，因此，在与对方侧基板进行接触时，能够容易地让树脂凸起电极10弹性变形，从而能够提高与对方侧基板之间的导电连接的可靠性。
在直线状连续的树脂凸起12中形成了多个导电膜20之后，可以通过去除导电膜20的未形成区域中的树脂凸起12，来分离各个树脂凸起电极10。具体地说，通过进行将氧气作为处理气体的等离子蚀刻，来去除没有导电膜20的部分的树脂凸起12。由于金属材料所制成的导电膜20与树脂材料相比，难以被干蚀刻，因此能够有选择地只将导电膜20的未形成区域中的树脂凸起12去除。
但是，如图7所示，通过热硬化树脂所制成的密封树脂122，将所安装的半导体装置121与对方侧基板111之间密封起来。此时，如果预先去除凸条树脂凸起的一部分，则能够确保密封树脂122的流动。通过这样，能够可靠地将半导体装置121安装在对方侧基板111中。
回到图1，导电膜20夹持树脂凸起12从电极焊盘24中延伸到的其相反侧，形成检查用电极30。也即，从树脂凸起12的外侧中的各个电极焊盘24的表面开始，经树脂凸起12的表面，一直到树脂凸起12的内侧上的钝化膜26的表面，形成各个导电膜20。这样，通过形成在树脂凸起12的内侧的各个导电膜20，构成多个检查用电极30。检查用电极30用来与后述的检查用探针进行单独接触。因此，必须设置各个检查用电极30，使得1个检查用探针不会同时接触相邻的多个检查用电极30。
图3为检查用电极的再配置的说明图。图3中，设置在树脂凸起12的内侧的检查用电极30，在其内侧进行再设置，形成检查用再设置电极31。另外，检查用电极30沿着树脂凸起12设置成1列，而检查用再设置电极31设置为多列。通过这样，能够增加相邻的检查用再设置电极31互相之间的间隔，由于能够增加检查用探针的间隔，所以能够降低检查用探针的制造费用。另外，检查用再设置电极31与检查用电极30之间导电连接。
(半导体装置的检查方法)
接下来，对照图1对上述半导体装置的检查方法进行说明。作为半导体装置121的检查，需要进行构成半导体装置121的晶体管等电子元件(未图示)的动作检查，以及从与对方侧基板的连接部到电子元件之间的导通检查。另外，半导体装置121的电极焊盘24是从上述电子元件等中引出的。本实施方式中，通过让检查用探针接触上述多个检查用电极30(或检查用再设置电极)，进行上述动作检查以及导通检查。
本实施方式的半导体装置，导电膜20夹持树脂凸起12从电极焊盘24延伸到电极焊盘24相反侧，形成检查用电极30。通过让检查用探针接触该检查用电极30，能够进行电子元件的动作检查。另外，还能够进行从作为与对方侧基板之间的连接部的树脂凸起电极10到电子元件之间的导通检查。特别是，即使在树脂凸起电极10到电极焊盘24之间发生了断线的情况下，由于夹持树脂凸起12在电极焊盘24的相反侧设置检查用电极30进行导通检查，因此能够检查出该断线。
另外，以前通过让检查用探针与作为与对方侧基板之间的连接部的树脂凸起电极的顶部相接触，进行各种检查。但是，由于树脂凸起电极10中，树脂凸起12的表面的导电膜20非常薄，因此，有时候与检查用探针之间的接触会导致树脂凸起电极10的导电膜20的削去。通过这样，有可能会无法进行树脂凸起电极10与对方侧基板之间的导电连接。
但是，上述本实施方式的半导体装置中，即使由于与检查用探针之间的接触而导致构成检查用电极的的导电膜的一部分被削去，也不会给半导体装置的导通性能造成影响，因此，能够可靠地进行与对方侧基板之间的导电连接。
(实施方式2)
接下来对照图4，对本发明的实施方式2进行说明。
图4为说明实施方式2的相关半导体装置的说明图。图4(a)为树脂凸起电极10的周边的平面放大图，图4(b)为图4(a)的B-B线出的侧面剖视图。如图4所示，实施方式2中的半导体装置121，在有源面121a中的电极焊盘列24a的内侧形成树脂层32，在树脂层32的表面形成树脂凸起12，导电膜20从电极焊盘24夹持树脂凸起12延伸到相反侧，该导电膜20设置在树脂层32的表面，形成检查用电极30。另外，对于与实施方式1相同的构成的部分，省略其详细说明。
半导体装置121的有源面121a中形成有钝化膜26，该钝化膜26的表面中的电极焊盘列24a的内侧形成有树脂层32。该树脂层32由聚酰亚胺树脂或丙烯树脂、酚树脂、环氧树脂、硅树脂、改性聚酰亚胺树脂等弹性树脂材料制成。另外，树脂层32最好通过感光性树脂形成。这种情况下，能够在半导体装置121的有源面中的电极焊盘列24a的内侧，高精度地设置树脂层32。
该树脂层32的表面中，形成有与实施方式1相同的树脂凸起12。通过在半导体装置的有源面中形成树脂层32，能够让有源面平坦化，因此，通过在树脂层32的表面形成树脂凸起12，能够确保树脂凸起12的高度尺寸的精度。通过使用该树脂凸起12来构成树脂凸起电极10，能够提高与对方侧基板之间的电连接的可靠性。另外，最好通过与树脂层32相同的树脂材料来形成树脂凸起12。这种情况下，由于树脂凸起12与树脂层32之间互相密合，因此能够提高树脂凸起电极10的可靠性，从而能够可靠地进行与对方侧基板之间的导电连接。
另外，在从各个电极焊盘24的表面到树脂凸起12的表面，形成多个导电膜20，构成树脂凸起电极10。另外，导电膜20夹持树脂凸起12从电极焊盘24延伸到相反侧，形成检查用电极30。也即，检查用电极30形成在树脂层32的表面。
但是，钝化膜26是氧化硅或氮化硅等脆性材料所形成的。如果通过直接在其表面所形成的导电膜来构成检查用电极，则检查用探针对检查用电极之间的接触有可能会变成冲击，从而破坏钝化膜26。
与此相对，本实施方式的半导体装置中，在钝化膜26的表面经树脂层32形成导电膜20。由于该树脂层是弹性材料，因此具有作为探针对检查用电极的接触的缓冲材料的功能。因此，能够防止钝化膜26的破坏，提高半导体装置的可靠性。
(实施方式3)
接下来对照图5，对本发明的实施方式3进行说明。
图5为实施方式3的相关半导体装置的说明图。图5(a)为树脂凸起电极10的周边的平面放大图，图5(b)为图5(a)的C-C线处的侧面剖视图。如图5所示，实施方式3中的半导体装置121，在有源面121a中的电极焊盘24a的内侧形成树脂凸起12，在有源面121a中的树脂凸起12的内侧形成树脂层32，导电膜20夹持树脂凸起12从电极焊盘24延伸到相反侧，该导电膜20设置在树脂层32的表面，形成检查用电极30。另外，对于与实施方式1以及实施方式2相同的构成的部分，省略其详细说明。
半导体装置121的有源面121a中形成有钝化膜26，该钝化膜26的表面中的电极焊盘列24a的内侧形成有树脂凸起12。另外，钝化膜26的表面中的树脂凸起12的内侧，形成有比树脂凸起12的高度低的树脂层32。该树脂层32沿着树脂凸起12形成为带状，也可以连续形成在树脂凸起12的内侧到有源面的中央部之间。不管哪种情况，由于都隔着电极焊盘24相当的距离形成树脂层32，因此不需要为了让电极焊盘24的表面开口而高精度地形成树脂层32。因此，能够通过印刷法等简单的的方法来形成树脂层32，从而能够降低制造费用。
另外，在从各个电极焊盘24的表面到树脂凸起12的表面之间，形成多个导电膜20，构成树脂凸起电极10。另外，导电膜20从电极焊盘24中延伸到夹持树脂凸起12的相反侧，导电膜20形成在树脂层32的表面，形成检查用电极30。
实施方式3也和实施方式2一样，在钝化膜26的表面经树脂层32形成检查用电极，该树脂层32具有作为探针对检查用电极的接触的缓冲材料的功能。因此，能够防止钝化膜26的破坏，提高半导体装置的可靠性。
(电光学装置)
接下来，对具有上述各个实施方式的半导体装置的电光学装置进行说明。
图6为说明作为电光学装置的实施方式之一的液晶显示装置的模式图。图中的液晶显示装置100具有液晶屏110，以及作为液晶驱动用IC芯片的半导体装置121。另外，还可以根据需要设置图中所未显示的偏光板、反射板、背光等附带部件。
液晶屏110具有玻璃或塑料等所构成的基板111以及112。基板111与基板112相向设置，通过图中所未显示的密封材料等互相贴合在一起。基板111与基板112之间封入了作为电光学物质的液晶(未图示)。基板111的内面上形成有通过ITO(Indium Tin Oxide)等透明导电体所构成的电极111a，基板112的内面上设有与上述电极111a相向设置的电极112a。另外，电极111a与电极112a相垂直。将电极111a与电极112a从基板伸出部111T中引出，其端部中分别形成电极端子111bx以及电极端子111cx。另外，基板伸出部111T的边缘附近形成有布线111d，其内部也形成端子111dx。
基板伸出部111T上，经未硬化状态(A阶段状态)或半硬化状态(B阶段状态)的热硬化树脂所构成的密封树脂122，安装有半导体装置121。该半导体装置121例如是驱动液晶屏110的液晶驱动用IC芯片。半导体装置121的下面形成有图中未显示的多个树脂凸起电极，这些凸起分别与基板伸出部111T上的端子111bx、111cx、111dx导电连接。
另外，输入布线111d的外端部中所形成的输入端子111dy中，经各向异性导电膜124安装有挠性布线基板123。输入端子111dy，与设置在挠性布线基板123中的图中未显示的布线分别导电连接。从外部经弹性布线基板123将控制信号、影像信号、电源电位等提供给输入端子111dy，在半导体装置121中生成液晶驱动用驱动信号，提供给液晶屏110。
根据如上所构成的本实施方式的显示装置100，通过经半导体装置121在电极111a与电极112a之间加载适当的电压，能够让相向设置有两个电极111a、112a的象素部分的液晶进行再配向，对光进行调制，通过这样，能够在液晶屏110内的象素所排列的显示区域中形成所期望的图像。
图7为图6的H-H线处的侧面剖视图，是说明上述液晶显示装置100中的半导体装置121的安装构造的说明图。如图7所示，半导体装置121的有源面(图示的下面)中，设有多个树脂凸起电极10作为IC侧端子，其前端与上述基板111的端子111bx、111dx直接导电接触。树脂凸起电极10与端子111bx、111dx之间的导电接触部分的周围，填充有通过热硬化树脂等所构成的硬化了的密封树脂122。
(电子机器)
图8为说明一例本发明的电子机器的立体图。图中所示的移动电话1300，具有上述电光学装置作为小尺寸的显示部1301，具有多个操作按钮1302、听筒1303以及话筒1304。
上述电光学装置，并不仅限于上述移动电话，还能够适当用作具有电子书、个人计算机、数码相机、液晶电视、取景式或监视器直视式录像机、汽车导航装置、寻呼机、电子记事本、计算器、文字处理器、工作站、可视电话、POS终端、触摸屏的机器等图像显示装置，不管在哪种情况下，都能够提供电连接可靠性高的电子机器。
另外，本发明的技术范围并不通过上述各个实施方式进行限定，还包括在不脱离本发明的构思的范围内，在上述实施方式中添加各种变更。也即，各个实施方式中所举出的具体的材料或构成等只不过是一个例子，是可以进行适当变更的。

Claims (9)

1.一种半导体装置，具有：
电极焊盘以及树脂凸起，相邻配置，并形成在有源面上；和
导电膜，延续设置在上述电极焊盘的表面和上述树脂凸起的表面上；
上述半导体装置通过设置在上述树脂凸起的表面的上述导电膜与安装基板导电连接；
在上述有源面上形成有树脂层；
上述导电膜设置在上述树脂层的上方，从上述电极焊盘经过上述树脂凸起一直延伸到所述电极焊盘的相反一侧，形成检查用电极。
2.如权利要求1所述的半导体装置，其特征在于：
上述树脂凸起形成在上述树脂层的表面。
3.如权利要求1或2所述的半导体装置，其特征在于：
上述树脂凸起与上述树脂层，由相同的树脂材料构成。
4.如权利要求1或2所述的半导体装置，其特征在于：
上述树脂凸起和/或上述树脂层，由感光性树脂材料构成。
5.如权利要求1或2所述的半导体装置，其特征在于：
上述导电膜通过溅射法形成，并通过蚀刻法形成图形。
6.如权利要求1或2所述的半导体装置，其特征在于：
上述导电膜的表面中，利用导电材料形成有上述导电膜的加强部件。
7.一种电路基板，其特征在于：
安装有如权利要求1至权利要求6中的任一个所述的半导体装置。
8.一种电光学装置，其特征在于：
备有如权利要求1至权利要求6中的任一个所述的半导体装置或权利要求7中所述的电路基板。
9.一种电子机器，其特征在于：
备有权利要求7中所述的电路基板或权利要求8中所述的电光学装置。
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US20080012130A1 (en) 2008-01-17
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JP3994989B2 (ja) 2007-10-24
US20100252829A1 (en) 2010-10-07
US20050275115A1 (en) 2005-12-15
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TWI272686B (en) 2007-02-01
KR100729885B1 (ko) 2007-06-18

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