CN100449382C - Bonding apparatus and system for liquid crystal display device - Google Patents
Bonding apparatus and system for liquid crystal display device Download PDFInfo
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- CN100449382C CN100449382C CNB2006101382850A CN200610138285A CN100449382C CN 100449382 C CN100449382 C CN 100449382C CN B2006101382850 A CNB2006101382850 A CN B2006101382850A CN 200610138285 A CN200610138285 A CN 200610138285A CN 100449382 C CN100449382 C CN 100449382C
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- upper mounting
- binding appts
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
Abstract
A bonding apparatus for fabricating a liquid crystal display device includes a vacuum chamber for bonding first and second substrates together, an upper stage and a lower stage oppositely arranged in an upper space and a lower space of the vacuum chamber, and a pressure application system coupled to one of the upper and lower stages for applying first and second pressures to different parts of the one of the upper and lower stages.
Description
The application requires respectively the Korean application Nos.P2002-0012410, the P2002-0012439 that submit on March 8th, 2002, on March 8th, 2002 and on March 20th, 2002 and the rights and interests of P2002-0015081, in this article by with reference in addition combination.
Technical field
The present invention relates to a kind of binding appts, relate in particular to a kind of binding appts and system that is used to make liquid crystal indicator.
Background technology
Increase along with to the requirement of display device has proposed multiple panel display board device, such as LCD (LCD), Plasmia indicating panel (PDP), ELD electroluminescent display (ELD) and vacuum fluorescent display (VFD).Generally replace traditional cathode ray tube (CRT) device as mobile display, because the picture quality of LCD device excellence, light weight, thin outward appearance and low power consumption with the LCD device.In addition, exploitation such as the mobile model LCD that is used for notebook computer is used for that televisor receives and the display of broadcast signal, and as the monitor of computing machine.
Although the multiple technologies that have been the LCD device development,, the work that is used to strengthen the picture quality of LCD device is contradiction.Therefore, for the LCD device as general display device, the LCD device must have high image quality, i.e. high definition and brightness, and must be large scale and keep the characteristics of light weight, thin outward appearance and low power consumption.
Can make the LCD device with the LCD injection, wherein, with a substrate being formed with sealant pattern on it under vacuum with another base plate bonding, through injection orifice to wherein injecting liquid crystal material.Perhaps, can make the LCD device with the liquid crystal drip-injection method, as the open Nos.H11-089612 of Japanese Patent Laid and H11-172903 are disclosed, wherein, a substrate and another substrate of the liquid crystal that instiled on it are provided, and two base plate bondings vertically staggered relatively together.In these two methods, the advantage of liquid crystal drip-injection method can directly be distributed to different elements on the substrate surface.
Fig. 1 is according to prior art, the sectional view of LCD binding appts during load module.Among Fig. 1, binding appts is provided with framework 10, upper mounting plate 21, lower platform 22, sealant exit portion (not shown), liquid crystal drip-injection part 30, upper chamber portion 31, bottom section 32, chamber mobile system 40 and the platform mobile system 64 that forms profile.Sealant exit portion (not shown) and liquid crystal drip-injection part 30 are attached on the side of framework 10, upper and lower chamber part 31 and 32 is separated from each other.
Chamber mobile system 40 comprises: driving motor, be used for optionally falling the position during chamber part 32 moves to bonding program, and perhaps move to the position of the instillation of carrying out sealant release and liquid crystal material.
Platform mobile system 64 is provided with motor, axle 61, shell 62, line slideway 63, ball-screw 65 and nut shell 66.Upper mounting plate 21 is kept by the axle 61 that is attached on the shell 66.Shell 66 usefulness line slideways are attached on the framework 67, and motor 64 is attached on the support 68 on the framework 67, are used for along direction drive nut shell 66 up and down.With ball-screw 65 and nut shell 66 transmission driving powers, nut shell 66 is connected with shell 66 through load cell 69.
Explain the process steps of making LCD according to prior art with binding appts now.At first, upper substrate 51 is loaded on the upper mounting plate 21, infrabasal plate 52 is loaded on the lower platform 22.Therefore, as shown in Figure 1, the bottom section 32 that will have lower platform 22 with chamber mobile system 40 moves to the position that is used for sealant coating and liquid crystal drip-injection.
Below, as shown in Figure 2, when finishing sealant coating and liquid crystal drip-injection with sealant exit portion (not shown) and liquid crystal drip-injection part 30, bottom section 32 is moved to the position that is used for bonding upper and lower platform 51 and 52 with chamber mobile system 40.Then, aim at upper and lower chamber unit 31 and 32, upper and lower chamber part 31 and 32 is attached together to form airtight chamber with chamber mobile system 40.Below, reduce airtight indoor pressure with at airtight indoor generation vacuum state with vacuum system.Then, axle 61 is moved in a downward direction, upper and lower substrate 51 and 52 is bonded together thereby upper mounting plate 21 moved to motor 64.Load cell 69 plays pressure transducer, is used for the load signal control motor 64 that produces with reference to load cell 69.Therefore, the value that the amount control bit of loading pressure can be preset.
Yet, following problem is arranged according to the binding appts of prior art.At first, after the repeated use cycle, be used to make the change in location of upper mounting plate 21 along the system that direction up and down moves.Therefore, take place because of the mistake due to upper mounting plate smooth.In addition, because the transmission shaft 65 of platform mobile system receives driving force from driving motor 64,, before initial treatment, be difficult to realize the accurate smooth setting of upper mounting plate 21 so that upper mounting plate 21 is moved in a downward direction with accurate power.
Second, the wearing and tearing of the special part of upper mounting plate 21 can cause the special motivation 64 of upper and lower substrate 51 and 52 to receive driving force, so that with accurate power upper mounting plate 21 is moved in a downward direction, before initial treatment, is difficult to realize the accurate smooth setting of upper mounting plate 21.
The second, the wearing and tearing of the special part of upper mounting plate 21 can cause the special part place of upper and lower substrate 51 and 52 bonding bad.Therefore, when the difference in height that takes place along the lower surface of upper mounting plate 21, upper and lower substrate 51 and 52 bonding be defective.For example, as shown in Figure 3, during bonding upper and lower substrate 51 and 52, the disperse of liquid crystal material LC distributes not exclusively.Therefore, between adjacent seals agent part, form gap S, thereby stop the disperse of liquid crystal material LC equalization.For example, when a part that falls to having the infrabasal plate 52 of liquid crystal material LC thereon is higher than the part of sealant, even when being coated with the insufficient pressurized of the part of sealant thereon, load cell 69 (among Fig. 1 and 2) also is read as upper and lower substrate 51 and 52 bonding fully.Like this, the insufficient pressurized of sealant, hermetic unit breaks.The sealing of breaking causes the bonding inappropriate of upper and lower substrate 51 and 52, and surrounding air is infiltrated in the device.
Summary of the invention
The present invention relates to a kind of binding appts, be used to make liquid crystal indicator, it has avoided the restriction of prior art and the one or more problems due to the shortcoming substantially.
An object of the present invention is to provide binding appts, be used to make liquid crystal indicator, it can and compensate poor between a plurality of parts of a plurality of platforms in measuring table flatness before the base plate bonding.
Another object of the present invention is to provide additional device for exerting at the binding appts that is used for making liquid crystal indicator,, can apply the power of increase to the specified portions of bonding metacoxal plate here.
Other characteristics of the present invention and advantage are described in the following description, can from describe, part understand, perhaps can know from the practice of the present invention.Realize and obtain purpose of the present invention and other advantage with the structure that particularly points out in written description and claim and the accompanying drawing.
In order to realize these and other advantage and to follow purpose of the present invention, as concrete and general description, the binding appts that is used to make LCD comprises: vacuum chamber is used for first and second base plate bondings together; Upper mounting plate and lower platform are oppositely disposed in the upper space and lower space of vacuum chamber; At least one depression is formed in the upper and lower platform in the working surface of at least one; With additional compression system, be located in the depression of working surface projection, be used for during bonding first substrate and second substrate, providing supplementary pressure, wherein replenishing the part of exerting pressure comprises: pressing part is arranged in the described depression and can moves along direction up and down and is used for applying supplementary pressure or additonal pressure to the zone of first substrate and second substrate during the adhesion process of LCD; A plurality of rising axles pass upper mounting plate and are connected with one of lower platform and with pressing part; And a plurality of drive parts, each and the axle that raises couple and are used for driving pressing part by the axle edge direction up and down that raises.
Knowing that above-mentioned general description and following detailed all are exemplary and indicative, is in order to provide the of the present invention further explanation as claim.
Description of drawings
Comprise and be used to provide further understanding of the present invention and comprise and constitute its a part of accompanying drawing in this manual with working to explain that the description of the principle of the invention illustrates embodiments of the invention.Among the figure:
Fig. 1 is according to prior art, the sectional view of the LCD binding appts during load module;
Fig. 2 is according to prior art, the sectional view of the LCD binding appts during bonding program;
Fig. 3 is according to prior art, the amplification sectional view of the LCD binding appts during bonding program;
Fig. 4 is the skeleton view according to example compression system of the present invention;
Fig. 5 is the sectional view according to the example compression system in the vacuum chamber of the present invention;
Fig. 6 is according to the present invention, the sectional view of the compression system before bonding program;
Fig. 7 is according to the present invention, the sectional view of compression system during bonding program;
Fig. 8 is the sectional view that replenishes compression system according to example of the present invention;
Fig. 9 is the skeleton view according to additional compression system of the present invention;
Figure 10 is according to the present invention, the sectional view of the additional compression system before bonding program;
Figure 11 is according to the present invention, the sectional view of the additional compression system during bonding program;
Figure 12 is the planimetric map according to another additional compression system of the present invention;
Figure 13 is that explanation shows the planimetric map that replenishes compression system according to another example of the present invention;
Figure 14 is the planimetric map that replenishes compression system according to another example of the present invention;
Figure 15 is the perspective exploded view of replenishing compression system according to another example of the present invention;
Figure 16 is according to the present invention, the sectional view of another the additional compression system before bonding program;
Figure 17 is according to the present invention, replenishes the sectional view of compression system during bonding program; With
Figure 18 is the amplification sectional view according to example stationary of the present invention system.
Embodiment
Quote most preferred embodiment of the present invention now in detail, with the description of drawings example.
Fig. 4 is the skeleton view according to example compression system of the present invention.Among Fig. 4, compression system can be positioned in the vacuum chamber 100, be used for bonding upper and lower substrate 510 and 520.Compression system can comprise upper space and interior upper mounting plate 210 and the lower platform 220 of lower space that is positioned at vacuum chamber 100.In addition, compression system can comprise main compression system and a plurality of additional compression system.Platform 210 and 220 core above and/or under main compression system can be positioned at are used for during adhesion process upwards and infrabasal plate 510 and 520 is exerted pressure.
Main compression system can comprise: main screw axis 311 is used to make main compression system edge direction up and down to move; Driver motor 312 is used to make main screw axis 311 edge directions up and down to move; Nut shell 313 is with main screw axis 311 couplings connection; With main movable axle 314, be connected with nut shell 313.Driver motor 312 can and can be attached on the framework (not shown) with main screw axis 311 couplings connection.Main movable axle 314 can be connected with the core of the top surface of upper mounting plate 210, perhaps can be connected with the core of the basal surface of lower platform 220.In addition, main compression system can comprise main load cell 315, is used for changing applied pressure by main movable axle 314, and can be attached on the main screw axis 311.
Additional compression system can be adhered to along the outer surface of upper and lower platform 210 and 220, is used for applying compensatory pressure or additonal pressure during the adhesion process of upper and lower substrate 510 and 520.Additional compression system can comprise at least one secondary screw axis 321, at least one secondary driving motor 322, with the nut shell 323 of secondary screw axis 321 couplings connection, with secondary movable axle 324 and at least one secondary load cell 325 of nut shell 323 couplings connection.Secondary screw axis 321 can join with secondary driving motor 322 couplings, and secondary driving motor 322 can be attached on the framework (not shown).Secondary driving motor 322 can be optionally along up and down direction displaced spirals axle 321, be used for during adhesion process upwards and infrabasal plate 510 and 520 is exerted pressure.Secondary movable axle 324 can adhere to along the outer peripheral portion of the top surface of upper mounting plate 210, perhaps can adhere to along the outer peripheral portion of the basal surface of lower platform 220.For example, each secondary movable axle 324 can be at each angle of upper mounting plate 210 or the pars intermedia office of the minor face of the center section on the long limit of upper mounting plate 210 or upper mounting plate 210 be attached on the upper surface of upper mounting plate 210.In addition, each secondary movable axle 324 can be at each angle of lower platform 220 or the pars intermedia office of the minor face of the center section on the long limit of lower platform 220 or lower platform 220 be attached on the basal surface of lower platform 220.Therefore, can carry out the change in location formation compensation of upper and lower platform 210 and 220 because of the uneven wear of upper and lower platform 210 and 220.
In addition, can provide flatness measuring system (not shown),, be used for determining that the specific position place of upper and lower platform 210 and 220 takes place departs from or wear and tear such as position transducer (optical sensor), indicating gauge and feeling of stress machine-glazed paper.Can be attached to the inside or the outside of vacuum chamber 100 such as the multiple position transducer of optical sensor.Therefore, sensor provides the real-time measurement that departs from.
In the compression system of binding appts of the present invention, driving motor 312 and 322 can be attached on the framework (not shown), perhaps be attached on the outer wall of vacuum chamber 100, wherein, movable axle 314 can be connected with 220 with upper and lower platform 210 with 324, and they can be by the top or the bottom of vacuum chamber 100.Like this, upper and lower platform 210 and 220 can receive driving force with nut shell 313 and 323 through screw axis 311 and 321 respectively.Therefore, can seal the part of the vacuum chamber 100 that joins with movable axle 314 and 324 couplings, be used for during adhesion process, keeping the vacuum state of vacuum chamber 100.
Binding appts of the present invention can comprise: main screw axis 311 is used for moving upper mounting plate 210 along direction up and down; With 4 secondary screw axis 321, be used to provide because of upper mounting plate 210 lacks the correction that flatness caused, and be used for before the starting stage of beginning adhesion process, setting the flatness reference value of upper mounting plate 210.Therefore, when taking place because of the prolongation use or wearing and tearing departing from of causing, can during adhesion process, apply different pressure.
Explain the instantiation procedure of binding appts adhesive base plate of the present invention now.
Fig. 5 is the sectional view according to the example compression system of the present invention in vacuum chamber.Among Fig. 5, when repeating to drive binding appts, can wear and tear upper and lower platform 210 and 220.Therefore, upper and lower platform 210 can be not exclusively parallel with 220 surface.When the special part of determining upper mounting plate 210 when small part is worn and torn, departure degree S and the position coordinates that depart from part can be stored in the controller (not shown).
Fig. 6 is according to the present invention, the sectional view of compression system before bonding program.Among Fig. 6, when starting binding appts, can substrate 510 and 520 be loaded on upper and lower platform 210 and 220 with mechanical arm 300, upper and lower platform 210 and 220 is positioned at respectively in the vacuum chamber 100.Then, after respectively substrate 510 and 520 being loaded on upper and lower platform 210 and 220, can sealed vacuum chamber 100.
Fig. 7 is according to the present invention, the sectional view of the compression system during bonding program.Among Fig. 7, the vacuum chamber 100 of can finding time, the controller (not shown) can drive driving motor 312 and 322, so that the screw axis 311 and 321 that is connected with upper mounting plate 210 moves in a downward direction.During with controller drives screw axis 311 and 321, can determine the departure degree S of the special part of upper and lower platform 210 and 220.Then, can calculate the desired offset R of departure degree, can determine the position of departing from, be used for set that a secondary screw axis 321 moves down apart from the time compensation calculate value R.The calculating and the compensation method of offset be can carry out with auto-programming and automatic program control (not shown), calculating and the compensation method of carrying out offset with individual's manual operation perhaps can be calculated by hand.
During adhesion process, be attached to the amount that load cell 315 and 325 on main compression system and the additional compression system can continue to measure the pressure of screw axis 311 and 321 supplies of secondary screw axis.Therefore, load cell 315 and 325 can provide feedback signal to be transferred to the control signal of driving motor 312 and 322 with change to the controller (not shown).Like this, load cell 315 and 325, screw axis 311, secondary screw axis 321 and driving motor 312 and 322 can compensate irrelevance S (among Fig. 5).
For example, compare with the other parts of upper mounting plate 210 when the special angle part of upper mounting plate 210 and to depart from about 2mm, the controller (not shown) can be set the rotation amount of secondary screw axis 321, makes secondary movable axle 324 on the special angle part be attached to upper mounting plate 210 can move the distance corresponding to 2mm bias in a downward direction.In addition, nut shell 323 can move in a downward direction according to rotation amount, and purpose is that secondary movable axle 324 is moved in a downward direction.Therefore, after additional compression system compensation departs from, can drive driving motor 312 and 322 according to compensation settings, thereby substrate 510 and 520 is bonded together.
In addition, if the part of the upper mounting plate that departs from 210 is positioned at the office, bight of upper mounting plate 210, but, can compensate the setting value of the driving motor 322 of adjacent pair movable axle 324 at the part place that is positioned the upper mounting plate 210 between the adjacent pair movable axle 324.
Fig. 8 is the sectional view that replenishes compression system according to example of the present invention.Among Fig. 8, additional compression system can comprise upper and lower platform 210 and 220, and wherein, upper mounting plate 210 can comprise pressing part 410, at least one raise axle 420 and at least one drive part 430.Similarly, though do not show,, lower platform 220 can also comprise pressing part, at least one raise axle and at least one drive part.Pressing part 410 can form a unit, is used for by applying displacing force from the axle 420 that raises moving along direction up and down.The axle 420 that raises can pass through upper mounting plate 210, and upper mounting plate 210 can comprise that along the working face of upper mounting plate 210 promptly the depression 211 of basal surface location is used to hold pressing part 410.Pressing part 410 can comprise the material that prevents that upper substrate 510 from scratching.
Upper and lower substrate 510 that is pressed down by pressing part 410 and 520 part can comprise the superincumbent sealant material of coating, perhaps can comprise forming superincumbent virtual region.The depression 211 that is formed in the upper mounting plate 210 can be coated with sealant thereon corresponding to the part of upper and lower substrate 510 and 520, and the depression 211 that perhaps is formed in the upper mounting plate 210 can be corresponding to virtual region.
Fig. 9 is the skeleton view according to additional compression system of the present invention.Among Fig. 9, pressing part 410 can comprise the array of the crossbeam that interconnects.Each drive part 430 can be through the angle of raise axle 420 and the crossbeam of outermost and is connected at the infall of interior crossbeam.
Figure 10 is according to the present invention, the sectional view of the additional compression system before bonding program.Among Figure 10, during adhesion process, in case upper and lower substrate 510 and 520 is loaded on upper and lower platform 210 and 220 vacuum chamber 100 of just can finding time respectively.Then, main compression system just can mobile in a downward direction upper mounting plate 210, thereby the upper and lower substrate 510 and 520 that remains on respectively on upper and lower platform 210 and 220 is bonded together.
Figure 11 is according to the present invention, the sectional view of the additional compression system during bonding program.Among Figure 11, during adhesion process is carried out, can start additional compression system.For example, along with controller (not shown) controlling and driving part 430, drive part 430 can move the axle 420 that raises in a downward direction, and this controller separates with the controller (not shown) of the driver motor 312 that is used for main compression system.Below, along with the axle 420 that raises moves in a downward direction, the depression 211 interior pressing parts 410 that are positioned at upper mounting plate 210 can be prominent to a height from 211 (the Fig. 8) that cave in.Therefore, pressing part 410 can be from the baseplane projection of upper mounting plate 210.Like this, the special part of the upper substrate 510 relative with pressing part 410 can be provided with the pressure of the other parts that are higher than upper substrate 510, makes that the special part of upper substrate 510 can be more bonding with second substrate 520 more tightly than the other parts of upper substrate.For example, the special part that is provided with the upper substrate 510 of high pressure can comprise sealant material and/or dividing plate, and the other parts that are provided with the upper substrate 510 of low-pressure can comprise liquid crystal material.
One finishes adhesion process, and main compression system just can mobile in the upward direction upper mounting plate 210, and the drive part 430 that replenishes the compression system device can move in the upward direction to raise and spools 420 cave in 211 so that pressing part 410 is received into.In addition, along with discharging upper substrate 520 is appended on the upper mounting plate 210, upper substrate 520 separates with upper mounting plate 210, thereby bonding back upper and lower substrate 510 and 520 can remain on lower platform 220 places.Below, can remove bonding back upper and lower substrate 510 and 520 from vacuum chamber 100 making with the mechanical arm (not shown) after vacuum chamber 100 returns atmospheric pressure.
Needn't only during adhesion process, utilize and replenish compression system according to example of the present invention.For example, can after finishing substrate bonding, utilize according to additional compression system of the present invention.
Figure 12 is the planimetric map according to another additional compression system of the present invention.Among Figure 12, additional compression system can comprise: upper mounting plate 210, have a plurality of pressing parts 410, and be used to make each unit area pressurized that is coated with sealant material on it; With a plurality of drive parts 430, be connected with pressing part 410 through a plurality of risings axle 420.Therefore, because the eroded area of upper mounting plate 210, can each unit area of separate compensation.The advantage of replenishing compression system is and can only exerts pressure to the special element zone when being necessary to apply additonal pressure.
Figure 13 has illustrated and has shown the planimetric map that replenishes compression system according to another example of the present invention.Among Figure 13, additional compression system can comprise: upper mounting plate 210, a plurality of pressing parts 410 are arranged, with make be coated with sealant material on it respectively organize the unit area pressurized; With a plurality of drive parts 430, be connected with pressing part 410 through a plurality of risings axle 420.Therefore, because the eroded area of upper mounting plate 210, can every group of independent unit area of separate compensation.The advantage of replenishing compression system is and can only exerts pressure to the unit area of specific group when being necessary to apply additonal pressure.
Figure 14 is the planimetric map that replenishes compression system according to another example of the present invention.Among Figure 14, additional compression system can be used and the consistent form of sealant part, exerts pressure to the part that is coated with sealant of multi-form different substrate model.For example, can realize different sealing agent coating multi-form consistent selection projection partly by pressing part 410 being divided into a plurality of and optionally start these pieces by each drive part 430 and the axle 420 that raises with the different substrate model.
Figure 15 is the perspective exploded view of replenishing compression system according to another example of the present invention.Among Figure 15, additional compression system can comprise the removable mask 600 of exerting pressure, and it can be used for upper mounting plate 210 or lower platform 220, and jut 610 is from requiring to apply more each part projection of high pressure than other parts.Therefore, after finishing adhesion process, can apply to upper mounting plate 210 and exert pressure mask 600 and do not remove bonding back first and second substrates 510 and 520.In addition, can apply the mask 600 of exerting pressure, wherein, bonding back first and second substrates 510 and 520 can be placed on the top of the mask 600 of exerting pressure, apply the pressure of repetition once more to special part to lower platform 220.
The mask 600 of exerting pressure can comprise the system that covers whole upper mounting plate 210 that do not require.In this case, can be along the whole basal surface of upper mounting plate 210, promptly form a plurality of coupling connection groove (not shown), the projection with height of requirement can be inserted a plurality of couplings that can require in the stressed difference of heavy dressing and join in one of grooves with lower platform 220 facing surfaces.
Figure 16 is according to the present invention, the sectional view of another the additional compression system before bonding program.Among Figure 16, can be attached on the upper mounting plate 210 with fixed system 620 mask 600 of will exerting pressure, the mask 600 that is used to prevent to exert pressure drops out upper mounting plate 210 during the adhesion process to first and second substrates 510 and 520.Fixed system 620 can comprise: hook 621 is formed on exert pressure mask 600 or the upper mounting plate 210; (catch) 622 that catch is formed on another of exert pressure mask 600 and upper mounting plate 210.Perhaps, can be fixed on the upper mounting plate 210, as shown in figure 18 with screw 624 mask 600 of will exerting pressure.
The mask 600 of exerting pressure according to the present invention can be not limited to separate so that the system that cooperates with upper mounting plate 210 with upper mounting plate 210.For example, the mask 600 of exerting pressure can for good and all join with upper mounting plate 210 couplings, makes and can not remove the mask 600 of exerting pressure during the vacuum bonding process.Therefore, the mask 600 of exerting pressure can comprise the structure that allows vacuum suction or Electrostatic Absorption, and the substrate 510 of winning can be loaded on the upper mounting plate 210.
Explain that now the present invention with replenishing compression system, replenishes the instantiation procedure of exerting pressure to first and second substrates in series of steps, this series of steps is used for additional the exerting pressure of sealant the area of application to bonding back first and second substrates.
Figure 17 is according to the present invention, replenishes the sectional view of compression system during bonding program.Among Figure 17,, in the time of perhaps can requiring the entire portion of bonding back first and second substrates 510 and 520, can the mask 600 of exerting pressure according to the present invention be attached on the upper mounting plate 210 with the fixed system (not shown) when exerting pressure to special part.When the mask 600 of exerting pressure is attached on the upper mounting plate 210, can make the driver motor 312 of main compression system can move the main screw axis 311 that is connected with upper mounting plate 210 in a downward direction.Therefore, the mask 600 of exerting pressure can be pressed downwardly onto on first and second substrates 510 and 520 of bonding back again.Like this, with the special part of bonding back first and second substrates 510 and 520, that is, sealant coating part is compared, and the jut 610 of the mask 600 of exerting pressure can be to lower process, with bonding special part tightly.
Below, when finishing additional exerting pressure, can drive the driver motor 312 of main compression system once more, mobile in the upward direction upper mounting plate 210.Therefore, in case upper mounting plate 210 moves fully in the upward direction, just can be with the mechanical arm (not shown) from the bonding back of vacuum chamber 100 unloadings first and second substrates 510 and 520, a pair of first and second substrates that can be bonding are loaded on the vacuum chamber 100, to repeat adhesion process and additional exerting pressure.
The mask 600 of exerting pressure according to the present invention also can provide the compensating operation that departs to the special part place generation of upper and lower platform 210 and 220.For example, when the special part of worn and torn upper and lower platform 210 and 220, the mask 600 of exerting pressure can comprise the jut 310 at the special part place that is positioned at upper and lower platform 210 and 220, thereby compensates departing from that the wear branch of upper and lower platform 210 and 220 causes.
For those skilled in the art, clearly, can in LCD binding appts of the present invention, carry out numerous modifications and variations and do not deviate from the spirit or scope of the present invention.Like this, the present invention can cover modifications and variations of the present invention, as long as they are within the scope of claim of being added and equivalents thereof.
Claims (7)
1, a kind of binding appts that is used to make LCD comprises:
Vacuum chamber is used for first and second base plate bondings together;
Upper mounting plate and lower platform are oppositely disposed in the upper space and lower space of vacuum chamber;
At least one depression is formed in the upper and lower platform in the working surface of at least one; With
Replenish compression system, be located at from the depression of working surface projection, be used for during bonding first substrate and second substrate, providing supplementary pressure, wherein replenish compression system and comprise:
Pressing part is arranged in the described depression and can moves along direction up and down and is used for applying supplementary pressure or additonal pressure to the zone of first substrate and second substrate during the adhesion process of LCD;
A plurality of rising axles are connected with one of lower platform and with pressing part by upper mounting plate; And a plurality of drive parts, each and the axle that raises couple and are used for driving pressing part by the axle edge direction up and down that raises.
2, the binding appts that is used to make LCD according to claim 1 is characterized in that, additional compression system is positioned to aim at sealant the area of application of first or second substrate.
3, the binding appts that is used to make LCD according to claim 1 is characterized in that, the zone of first or second substrate comprises sealant.
4, the binding appts that is used to make LCD according to claim 1 is characterized in that, the zone of first or second substrate comprises virtual region.
5, the binding appts that is used to make LCD according to claim 1 is characterized in that, pressing part comprises the array of the crossbeam that interconnects.
6, the binding appts that is used to make LCD according to claim 1 is characterized in that, drive part comprises at least one in hydraulic cylinders, air pressure cylinder or the motor.
7, the binding appts that is used to make LCD according to claim 5 is characterized in that, the axle that raises is connected to the angle of outermost crossbeam and the infall of interior crossbeam.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020012410 | 2002-03-08 | ||
| KR1020020012439 | 2002-03-08 | ||
| KR1020020015081 | 2002-03-20 | ||
| KR1020020015081A KR100720417B1 (en) | 2002-03-20 | 2002-03-20 | bonding device for liquid crystal display |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN03105412A Division CN100592171C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus for liquid crystal display device and the system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1963644A CN1963644A (en) | 2007-05-16 |
| CN100449382C true CN100449382C (en) | 2009-01-07 |
Family
ID=32225515
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101382850A Expired - Fee Related CN100449382C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
| CNB2006101382846A Expired - Fee Related CN100456113C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101382846A Expired - Fee Related CN100456113C (en) | 2002-03-08 | 2003-02-20 | Bonding apparatus and system for liquid crystal display device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100720417B1 (en) |
| CN (2) | CN100449382C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9299594B2 (en) | 2010-07-27 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate bonding system and method of modifying the same |
| KR101437873B1 (en) * | 2012-12-27 | 2014-09-05 | 엘아이지에이디피 주식회사 | Apparatus for attaching substrates |
| KR101437872B1 (en) * | 2012-12-27 | 2014-09-05 | 엘아이지에이디피 주식회사 | Method for attaching substrates |
| KR102401042B1 (en) * | 2015-08-25 | 2022-05-24 | 엘지전자 주식회사 | Glass substrate bonding device |
| JP6737575B2 (en) * | 2015-09-30 | 2020-08-12 | Ａｉメカテック株式会社 | Board assembly system, board assembly apparatus used in the system, and board assembly method using the system |
| CN114211743A (en) * | 2021-12-16 | 2022-03-22 | 江苏唯侓机器人科技有限公司 | Automatic positioning type actuating mechanism |
| CN115167041B (en) * | 2022-08-02 | 2023-07-14 | 辛集冀雅电子有限公司 | Liquid crystal screen crystal box processing equipment and processing method |
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| US5231923A (en) * | 1991-07-12 | 1993-08-03 | Sintogokio Ltd. | Press apparatus used for manufacturing a liquid crystal panel |
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| US3629035A (en) * | 1966-12-19 | 1971-12-21 | Minoru Kuroda | Method of forming applique designs |
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- 2003-02-20 CN CNB2006101382850A patent/CN100449382C/en not_active Expired - Fee Related
- 2003-02-20 CN CNB2006101382846A patent/CN100456113C/en not_active Expired - Fee Related
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| US5231923A (en) * | 1991-07-12 | 1993-08-03 | Sintogokio Ltd. | Press apparatus used for manufacturing a liquid crystal panel |
| JPH05307160A (en) * | 1992-04-30 | 1993-11-19 | Ricoh Co Ltd | Apparatus and method for production of liquid crystal display element |
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| JPH08136937A (en) * | 1994-11-09 | 1996-05-31 | Shinetsu Eng Kk | Method for pressurizing and heating glass substrate for liquid crystal display plate and device therefor |
| US6001203A (en) * | 1995-03-01 | 1999-12-14 | Matsushita Electric Industrial Co., Ltd. | Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
| JP2000298272A (en) * | 1999-02-08 | 2000-10-24 | Dainippon Printing Co Ltd | Color liquid crystal display device |
| JP2001051284A (en) * | 1999-08-10 | 2001-02-23 | Matsushita Electric Ind Co Ltd | Device for manufacturing liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1963643A (en) | 2007-05-16 |
| KR20030075725A (en) | 2003-09-26 |
| CN100456113C (en) | 2009-01-28 |
| KR100720417B1 (en) | 2007-05-22 |
| CN1963644A (en) | 2007-05-16 |
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