CN100458538C - System and method of providing a regenerating protective coating in a MEMS device - Google Patents

Abstract

In various embodiments of the invention, a regenerating protective coating is formed on at least one surface of an interior cavity of a MEMS device 80. Particular embodiments provide a regenerating protective coating 170 on one or more mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. The protective coating can be regenerated through the addition of heat or energy to the protective coating.

Description

The system and method for one regeneration protective finish is provided in the MEMS device

Technical field

The field of the invention relates to MEMS (micro electro mechanical system) (MEMS).Particularly, the present invention relates to be used for apparatus and method at interferometric modulator regeneration protective finish.

Background technology

MEMS (micro electro mechanical system) (MEMS) comprises micromechanical component, driver and electronic equipment.Can use deposition, etching and/or etch away the part substrate and/or through deposited material layer or add layer and handle with other micromachinings that form electricity and electromechanical assembly and produce micromechanical component.One type MEMS device is called as interferometric modulator.As used herein, described term interferometric modulator or interferometric light modulator refer to that one uses interference of light principle selectivity to absorb and/or catoptrical device.In certain embodiments, an interferometric modulator can comprise the pair of conductive plate, and its one or two can all or part ofly be transparent and/or reflection, and can apply relative motion on the basis of suitable electric signal.In a specific embodiment, a plate can comprise a resistant strata that is deposited on the substrate, and another plate can comprise a metal film that separates with resistant strata by an air gap.As describing in detail herein, a plate can change the interference of light that is incident on the light on the interferometric modulator with respect to the position of another plate.Described device applied range, and it is useful utilizing and/or revising in the technology of these types of devices characteristics makes its feature to be developed improving existing product and produce in the untapped new product process.

Interferometric modulator can be worked by the distance that changes between two elements or the layer, and it can be reached near another layer by one deck being moved on to more.Contact between mobile and described two layers of two layers can cause the damage of described two laminar surfaces, thereby causes possible unwanted operation characteristic.

Summary of the invention

In system of the present invention, the method and apparatus each has some aspects, and single in described some aspects can not be realized the attribute that it is wanted separately.Under the situation that does not limit the scope of the invention, existing with its more outstanding feature of brief discussion.Consider after this argumentation, and especially be entitled as after the part of " DetailedDescription of Certain Embodiments ", will understand feature of the present invention is how the advantage that exceeds other display device is provided in reading.

One aspect of the present invention is a kind of system and method for the protective finish of regenerating on a MEMS device.Described method comprises the temperature such as the protective seam of autoregistration individual layer that periodically improves on the described MEMS device, make described protective seam evenly be distributed in again basically described MEMS device want on the surface.

In some respects, the present invention is an interferometric light modulating device, and it comprises: a transparent substrates; One is placed in the interferometric modulator array on the described transparent substrates, and described array comprises a transmission layer and a reflection horizon; One is placed in the protective finish between described transmission layer of at least a portion and the reflection horizon; With a well heater that is configured to increase described protective finish temperature.

In certain embodiments, described transparent substrates is sealed to a backboard to form an encapsulation, makes described interferometric modulator array be positioned at described encapsulation.In certain embodiments, described protective finish comprises an autoregistration individual layer.In certain embodiments, described autoregistration individual layer comprises in following one: polytetrafluoroethylene (PTFE), perfluoro decanoate, octadecyl trichlorosilane (OTS) or dichlorodimethylsilane.In certain embodiments, in described encapsulation, there is at least one hole.In certain embodiments, also there is a reservoir that is not positioned at the protective finish material on transmission layer or the reflection horizon; A source can be served as for the Additional Protection coating in the encapsulation in the reservoir of described protective finish material during reproducer.In certain embodiments, described protective finish is provided at least a portion of transmission layer.In certain embodiments, described protective finish is provided at least a portion in reflection horizon.In certain embodiments, described well heater is contained in the described encapsulation.In certain embodiments, described well heater comprises the lip-deep metal level in the described encapsulation.In certain embodiments, described metal level is one to be exclusively used in the part of the circuit that produces heat.In certain embodiments, the metal in the described metal level comprises chromium or nickel.In certain embodiments, described well heater comprises one and comprises that the ring-type of transmission layer goes between, and described ring-type lead-in wire is shorted to earthing potential.In described embodiment, described ring-type lead-in wire can be configured to switchably be shorted to earthing potential.In certain embodiments, a MEMS (micro electro mechanical system) (MEMS) is available so that the ring-type lead-in wire is switchable.In certain embodiments, described well heater comprises one and comprises that the ring-type of a mechanical layer that is associated with the reflection horizon goes between, and described ring-type lead-in wire can be shorted to earthing potential.In certain embodiments, a current-limiting resistor is included between a lead-in wire and the ground.In certain embodiments, described heating element is arranged on the pillar of described encapsulation.In certain embodiments, described well heater about with one without the reflection horizon under the driving condition in the identical plane.In certain embodiments, the well heater on the described pillar is positioned at top, reflection horizon and substrate top.In certain embodiments, described well heater is one to be positioned at the bus structure of a support member top and reflection horizon top.

In some respects, the present invention is the system that is formed at the one or more layers of autoregistration individual layer of MEMS (micro electro mechanical system) (MEMS) device that is used to regenerate.Described system comprises a MEMS device, and it comprises: a transmission layer, a reflection horizon and an autoregistration individual layer and are positioned at the well heater of contiguous MEMS device.The temperature that is enough to improve an autoregistration individual layer from the heat of described well heater emission.

In some respects, the present invention one comprises the electronic installation of the member that is used to support a MEMS device, and wherein, described MEMS device comprises a transmission layer and a reflection horizon.Described device advantageously comprises and is used to provide one to be placed in the member of the protective finish between at least a portion transmission layer and the reflection horizon, and the member of the described protective finish that is used to regenerate.

In some respects, the present invention be one in a MEMS device regeneration one individual layer method.Described method comprises provides a MEMS device that comprises an interferometric modulator and a well heater.Described interferometric modulator comprises an individual layer.Described method further comprises the described well heater of excitation to increase the temperature of described individual layer, the described individual layer of regenerating whereby.

In some respects, the present invention one is used on an interferometric devices system of regeneration one protective finish.Described system comprises an interferometric devices; it comprises a member and a protective finish that a member, that is used for optionally allowing the light of a certain wavelength to pass a ground floor is used for optionally reflecting the light of a certain wavelength, and a member that is used to heat described protective finish.

In some respects, the present invention one has an interferometric devices of regeneration protective finish at least once on the transmission layer of described interferometric devices or reflection horizon.

In some respects, the present invention one makes one and is used for the method that regeneration is formed at the system of the autoregistration individual layer on a MEMS (micro electro mechanical system) (MEMS) device one or more layers.Described method comprises provides one to comprise the MEMS device of a transmission layer, a reflection horizon and an autoregistration individual layer and place the feasible heat from described well heater emission of contiguous described MEMS device to be enough to improve the temperature of an autoregistration individual layer one well heater.

Description of drawings

Fig. 1 is the isometric view of a part of describing an embodiment of an interferometric modulator display, and wherein the removable reflection horizon of first interferometric modulator is in the off-position, and the removable reflection horizon of second interferometric modulator is in energized position.

Fig. 2 incorporates the system block diagram of an embodiment of the electronic installation of one 3 * 3 interferometric modulator displays into for explanation one.

Fig. 3 applies the diagram of voltage for the removable mirror position contrast of an one exemplary embodiment of the interferometric modulator of Fig. 1.

Fig. 4 is the diagram that can be used for driving one group of row and column voltage of an interferometric modulator display.

Fig. 5 A and 5B explanation can be used for a frame video data is write the exemplary sequential chart of row and column signal of 3 * 3 interferometric modulator displays of Fig. 2.

Fig. 6 A is the xsect of Fig. 1 device.

Fig. 6 B is the xsect of an alternate embodiment of an interferometric modulator.

Fig. 6 C is the xsect of another alternate embodiment of an interferometric modulator.

Fig. 7 A-7C is the synoptic diagram of a basic encapsulating structure of an interferometric modulator.

Fig. 8 is a detailed side view of an interferometric light modulator.

Fig. 9 illustrates one according to the interferometric modulator of one embodiment of the invention with the protective material coating.

Figure 10 illustrates an interferometric modulator that applies with protective material according to another embodiment of the present invention.

The interferometric modulator that Figure 11 A, 11B and 11C explanation one apply with protective material according to another embodiment of the present invention.

The interferometric modulator that Figure 12 A and 12B explanation one apply with protective material according to another embodiment of the present invention.

Figure 13 illustrates a protective finish system according to the interferometric modulator of one embodiment of the invention.

Figure 14 one is provided to a protective finish process flow diagram of the method for one MEMS device according to one embodiment of the invention.

Figure 15 one is provided to a protective finish process flow diagram of the method for one interferometric light modulating device according to one embodiment of the invention.

Figure 16 comprises the side view of another embodiment of conductor arrangement in indivedual chambeies of the interferometric modulator element of a protective finish for explanation one.

Figure 17 A is the side view of an embodiment of an encapsulating structure of explanation one interferometric modulator array.

Figure 17 B is the planimetric map of the encapsulating structure of key diagram 4A.

Figure 17 C illustrates that driving circuit wherein is positioned at the planimetric map of the embodiment on the substrate.

Figure 17 D is the process flow diagram of an embodiment of the method for regeneration one protective finish.

Figure 18 comprises the planimetric map of an embodiment through the interferometric modulator array of encapsulation of an individual layer regenerative heater element for explanation one.

Figure 19 A is explanation one planimetric map of an embodiment that is formed at the system of the individual layer on the conductive surface of an interferometric modulator array that is used to regenerate.

Figure 19 B is used for the skeleton view of an embodiment of mems switch of the system of Figure 19 A for explanation one.

Figure 20 A is explanation one side view of another embodiment that is formed at the system of the individual layer on the conductive surface of an interferometric modulator array that is used to regenerate.

Figure 20 B is the planimetric map of the heater grid system of key diagram 20A.In another embodiment, Figure 20 B is the planimetric map of explanation one heater grid, and wherein said heating element is arranged in the plane identical with secondary conductor.

Figure 21 can be again as the bus-structured side view on the interferometric devices of well heater for explanation one.

Figure 22 A and 22B comprise the system block diagram of an embodiment of the visual display unit of a plurality of interferometric modulators for explanation one.

Embodiment

Below describe in detail and be directed to some specific embodiment of the present invention.Yet the present invention much different modes specializes.In described description,, wherein come the designate similar part with similar numeral in the full text with reference to graphic.As will be apparent from following description, can in arbitrary device, implement described embodiment, thereby described device be configured the image that shows a motion (for example, video) or stable (for example, rest image) and text or picture.More particularly, expection can following various electronic installations be implemented described embodiment or described embodiment is associated with following various electronic installations: such as (but being not limited to) mobile phone, wireless device, personal digital assistant (PDA), hand-held or portable computer, gps receiver/omniselector, camera, the MP3 player, Video Camera, game console, wrist-watch, clock, counter, TV monitor, flat-panel monitor, computer monitor, automatic display (for example, mileometer display etc.), driving cabin controller and/or display, the camera view display (for example, vehicle rearview video camera display), electronic photo, electronic bill-board or symbol, projector, building structure, encapsulation and aesthetic structure (for example, the demonstration of the image on jewelry).The MEMS device that has a similar structures with those devices described herein also can be used in the non-display application as electronic switching device.

One embodiment of the present of invention relate to a kind of be used to regenerate one be deposited on the element of an interferometric devices or the method and apparatus of the protective finish on the layer.In certain embodiments, but the heated protective coating with the described protective finish of regenerating.Heat can be applied to the device zone that comprises described protective finish with the described protective finish of regeneration on a surface of described element or layer.Therefore, in one embodiment, with heat be used for distributing the again material of the protective finish on the surface that constitutes an interferometric modulator element or layer.Described processing allows along with filling the gap in the described protective finish and repair described gap through the protective finish of heating, and then cools off and become a solid layer.As be understood by those skilled in the art that thermal source, heating arrangement or well heater can be in a package outside or inside of containing described interferometric modulator.

As above mentioned, the repeated use of an interferometric device can cause reflecting the damage with each layer of transmissive element or layer.This is owing to the contact that repeats between the bending of element or the element.For reducing the damage that takes place between age at failure, a protective finish can be deposited on described transmission or the reflecting element to reduce wear.Described protective finish can (for example) on a conductor layer or an insulation course of described device.In addition, described protective finish can have other functions, prevents the anti-static friction coating that element adheres to each other as conduct.Although described protective finish can be protected its object that covers, it in use also can experience damage.Equally, be provided for the regenerating method and composition of described protective finish.

In certain embodiments, the well heater that increases the temperature of protective finish is one can be contained in the electric resistance heater in the seal interference formula modem devices.In certain embodiments, described well heater is for placing the heating element or the filament of (for example, on the substrate) in the display device.In other embodiments, can (for example) ring-type lead-in wire by one in short circuit reflection or the transmissive element, and with other circuit of described interferometric devices or wiring element in order to produce heat, whereby described element is become one one-tenth well heater.For example, described ring-type lead-in wire can comprise the material with the enough electrical resistance properties that are used for a transmission layer or a mechanical layer.

In other embodiments, described well heater can be placed on the one or more pillar of interferometric devices, make described well heater be enhanced substrate top and be positioned at more approaching described reflecting element part.In certain embodiments, described well heater and described reflecting element are in same level.In other embodiments, well heater is placed reflecting element and substrate top.In certain embodiments, described well heater covers or a surface of overlapping reflecting element substantially.

In certain embodiments, existence one is stored in the reservoir of the protective finish material in the described device.In this embodiment, when Regeneration Treatment began, described material reservoir can be used for more effectively shelving one and reproduces protective finish.In one embodiment, described protective finish is an individual layer.

A kind of method of an interferometric devices one protective finish that is used for regenerating is provided in other respects.Described method comprises uses one to have the protective finish that a state is temperature sensitive assembly, and the temperature that improves described interferometric devices is distributed on the required surface to allow described assembly self again.

Fig. 1 illustrates that one comprises the interferometric modulator display embodiment of an interfere type MEMS display element.In these devices, described pixel is in bright or dark state.At bright (" opening " or " unlatching ") state, described display element reflexes to the user with most of incident visible light.When being in dark (" pass " or " closing ") state, described display element can reflex to the user with the incident visible light hardly.According to described embodiment, can put upside down the light reflectance properties of "on" and "off" state.The MEMS pixel can be configured to the selected color of main reflection, shows thereby allow to remove black and ultrawhite colour.

Fig. 1 is an isometric view of describing two neighborhood pixels in a series of pixels of a visual displays, and wherein each pixel comprises a MEMS interferometric modulator.In certain embodiments, an interferometric modulator display comprises the delegation/column array of these interferometric modulators.Each interferometric modulator comprises that one is opposite to each other to sentence at a distance of a variable and controllable distance and forms a reflection horizon (being also referred to as reflection and transmission layer) with at least one variable-sized optical resonator.In one embodiment, in the reflection horizon can move between the two positions.In primary importance, be called release position herein, described displaceable layers place with a fixed transmittance layer at a distance of relatively large distance.In the second place, described displaceable layers places more contiguous described transmission layer.Constructively or devastatingly disturb from the incident light of described two layers reflection the position of depending on described removable reflection horizon, thereby produce a total reflection or non-reflective state for each pixel.

Institute's drawing section branch of pel array comprises two adjacent interferometric modulators 12a and 12b among Fig. 1.Among the interferometric modulator 12a of on the left side, a removable reflection horizon 14a is illustrated as and is in the release position of one and one fixed transmittance layer 16a at a distance of a preset distance.Among the interferometric modulator 12b on the right, described removable reflection (or " high reflection ") layer 14b is illustrated as the energized position that is in contiguous fixed transmittance (or " partial reflection ") layer 16b.

Fixed bed 16a, 16b are conduction, partially transparent and partial reflection, and can (for example) layer by one or more are respectively done for oneself chromium and tin indium oxide be deposited on the transparent substrates 20 and make.Described layer pattern is changed into parallel band, and as below further describe the column electrode that can form in the display device.Described displaceable layers 14a, 14b can form the series of parallel band that one or more depositing metal layers of being deposited on pillar 18 tops (and column electrode 16a, 16b quadrature) and is deposited on the intervention expendable material between the pillar 18.When expendable material was etched, deformable metal layers 14a, 14b separated with fixed metal layer by a gap of defining 19.The one highly conductive reflecting material such as aluminium can be used for described deformable layer, and described band can form the row electrode in the display device.

Do not applying under the voltage condition, chamber 19 remains between a layer 14a, the 16a, and deformable layer is in the illustrated mechanical relaxation state just like the pixel 12a of Fig. 1.Yet when a potential difference (PD) being applied to once the row and column selected, the capacitor that is formed at the interface point of the row at respective pixel place and row electrode becomes charged, and electrostatic force flocks together described electrode.If voltage is enough high, so displaceable layers distortion and compress as the pixel 12b on the right among Fig. 1 illustratedly as described in fixed bed (as described in unaccounted dielectric material can be deposited among the figure on the fixed bed to prevent short circuit and control interval distance).Ignore the polarity that applies potential difference (PD), described action is identical.Like this, the row/row of the non-reflective pixel state of may command reflection contrast are activated at a lot of aspects and are similar to employed row in conventional LCD and other display techniques/row excitation.

Fig. 2 illustrates that to Fig. 5 one is used for using in a display application exemplary treatments and the system of an interferometric modulator array.

Fig. 2 can incorporate the system block diagram of an embodiment of the electronic installation of aspect of the present invention into for explanation one.In an exemplary embodiment, described electronic installation comprises a processor 21, and it can be arbitrary general purpose single-chip or multicore sheet microprocessor, as ARM, Pentium

, Pentium II , Pentium III

, Pentium IV

, Pentium

Pro, 8051, MIPS

, Power PC

, ALPHA

, or arbitrary special microprocessor, as digital signal processor, microcontroller or programmable gate array.As the routine in this technology, processor 21 can be configured to carry out one or more software modules.Except that executive operating system, described processor can be configured to carry out one or more software application, comprises a web browser, a phone application, a mailer or any other software application.

In one embodiment, processor 21 also is configured to communicate by letter with array control unit 22.In one embodiment, array control unit 22 comprises that one provides the horizontal drive circuit 24 and the column drive circuit 26 of signal to display array or panel 30.The xsect of the illustrated array of Fig. 1 is by shown in the line 1-1 among Fig. 2.For the MEMS interferometric modulator, OK/the row excitation protocol can utilize the hysteresis property of these illustrated devices of Fig. 3.It can need the potential difference (PD) of (for example) 10 volts to cause a displaceable layers to be deformed to foment from relaxation state.Yet, when described voltage when described value reduces, described displaceable layers is lower than 10 volts and keep its state along with voltage drops to.In the one exemplary embodiment of Fig. 3, described displaceable layers is not exclusively loosened to drop to up to voltage and is lower than 2 volts.Therefore having scope in the illustrated example of Fig. 3 is the voltage of about 3V to 7V, wherein has a window that applies voltage, applies in the voltage window described device and is loosening or foment all is stable described.This is called " lag windwo " or " stability window " in this article.For the display array of hysteresis characteristic with Fig. 3, described row/row excitation protocol can be during designing the feasible gating of being expert at, the actuate pixel for the treatment of during gating is capable is exposed to about 10 a volts voltage difference, and pixel to be loosened is exposed to one near 0 volt voltage difference.After the gating, it is poor that described pixel is exposed to about 5 a volts steady state voltage, makes any state of being expert at its maintenance gating entering it.After writing, in described embodiment, each pixel all experiences " stability window " interior potential difference (PD) of 3-7 volt.The pixel design that described feature makes Fig. 1 illustrate is stabilized in an excitation or loosens in the state of being pre-stored under the identical voltage conditions that applies.Because no matter each pixel of interferometric modulator is to be essentially a capacitor that is formed by fixed reflector and removable reflection horizon at excitation or relaxation state, therefore described steady state (SS) can remain on the interior voltage of lag windwo that has power dissipation hardly.If the described voltage that applies is fixing, there is not electric current to flow into described pixel so basically.

In the typical case uses, can be by determining that according to the desired actuate pixel group in first row row electrode group produces a display frame.Then, a horizontal pulse is applied to row 1 electrode, excitation corresponding to the pixel of definite alignment.Then, with definite row electrode group change into corresponding to second the row in required actuate pixel group.Then, a pulse is applied to row 2 electrodes, according to the suitable pixel in the determined row electrode excitation capable 2.Row 1 pixel is not subjected to the influence of row 2 pulses, and the state that keeps its 1 impulse duration of being expert to set.Can be above for the capable repetition of full line in a continuous manner to produce frame.In general, by some are wanted constantly to repeat under the frame of number described processing and refresh with new video data and/or upgrade described frame at per second.The row and column electrode that is used to drive pel array is also known with the various protocols that produces display frame, and can use in conjunction with the present invention.

Fig. 4 and Fig. 5 illustrate that one is used to produce the possible excitation protocol of the display frame on 3 * 3 arrays of Fig. 2.Fig. 4 illustrates that one can be used for the possible row and the row voltage level group of the pixel of exploded view 3 hysteresis curves.In Fig. 4 embodiment, encourage a pixel to comprise suitable row are set at-V _{Bias voltage}And suitable row is set at+Δ V, it can correspond respectively to-5 volts and+5 volts.Loosening described pixel is set at+V by will suitably being listed as _{Bias voltage}And will suitably go and be set at identical+Δ V, realize thereby on pixel, produce one 0 volts potential difference (PD).The voltage of being expert at remains in 0 volt the described row, and no matter described row are in+V _{Bias voltage}Or-V _{Bias voltage}, described pixel is stable in its original residing state.Also illustrated as Fig. 4, should be appreciated that and can use voltage with polarity relative with above-mentioned voltage, for example, encourage a pixel to comprise suitable row are set at+V _{Bias voltage}And suitable row is set at-Δ V.In this embodiment, discharging described pixel is set at-V by will suitably being listed as _{Bias voltage}And will suitably go and be set at identical-Δ V, realize thereby on pixel, produce one 0 volts potential difference (PD).

Fig. 5 B is the sequential chart that shows a series of row and column signals of 3 * 3 arrays that are applied to Fig. 2, and it will produce the illustrated demonstration of Fig. 5 A and arrange that wherein actuate pixel is non-reflection.Before writing the illustrated frame of Fig. 5 A, described pixel can be any state, and in this example, and 0 volt of all behavior and all classify as+and 5 volts.Under these applied voltage, all pixels were stable in its existing excitation or relaxation state.

In Fig. 5 A frame, actuate pixel (1,1), (1,2), (2,2), (3,2) and (3,3).For finishing described excitation, during be expert at 1 " line time ", row 1 and 2 are set at-5 volts, and row 3 are set at+5 volts.This does not change the state of any pixel, because all pixels remain in the stability window of 3-7 volt.Then to rise to 5 volts of pulse gates capable 1 that return 0 volt from 0 volt.This excitation (1,1) and (1,2) pixel are also loosened (1,3) pixel.Other pixels in the described array are not affected.In order optionally to set row 2, row 2 are set at-5 volts, and row 1 and 3 are set at+5 volts.The same strobe that is applied to row 2 is then with actuate pixel (2,2) and loosen pixel (2,1) and (2,3).Again, other pixels of described array are not affected.Row 3 is by by being set at row 2 and 3-5 volts and row 1 are set at+5 volts of similar settings.Shown in Fig. 5 A, row 3 strobe sets row 3 pixels.Write after the incoming frame, described capable current potential is 0, and described row current potential can remain on+5 or-5 volts, and to follow described display be stable in the layout of Fig. 5 A.Should be appreciated that described same program can be used for tens of or hundreds of column array.Should be appreciated that also the sequential, sequence and the level that are used to carry out the voltage of row and column excitation can change greatly in the General Principle of above general introduction, and above-mentioned example only is exemplary, and any actuation voltage method can be used for system and method described herein.

Details according to the structure of the interferometric modulator of above-mentioned principle operation can change greatly.For example, Fig. 6 A-6C illustrates three different embodiment of mobile mirror surface structure.Fig. 6 A is the xsect of Fig. 1 embodiment, and wherein a metal material band 14 is deposited on the support member 18 of quadrature extension.In Fig. 6 B, described removable reflecting material 14 only is attached to the corner place of support member, on drift bolt 32.In Fig. 6 C, removable reflecting material 14 hangs from a deformable layer 34.This embodiment is useful, can be optimized aspect optical property because be used for the structural design and the material of reflecting material 14, and the structural design and the material that are used for deformable layer 34 can optimized aspect the required engineering properties.The production of various types of interferometric device has been described in comprising the various open document of the open application case 2004/0051929 of (for example) U.S..Multiple known technology can be used for producing said structure, comprises a series of material depositions, patterning and etching step.

Above-mentioned interference formula modem devices can be closed in the encapsulation together.The particular characteristics of anticipating various encapsulation and those skilled in the art will realize that described encapsulation can be depending on the special-purpose to described interferometric devices.

Fig. 7 A-7C is the synoptic diagram of the basic encapsulating structure of an interferometric modulator.Shown in Fig. 7 A, basic encapsulating structure 40 comprises a transparent substrates 41 (for example, glass) and a backboard or " lid " 42.As illustrated among Fig. 7 A-7C, an interferometric light modulator array 43 is sealed in the encapsulating structure 40.Backboard 42 can be formed by any suitable material, as glass, metal, paillon foil, polymkeric substance, plastics, pottery or semiconductor material (for example, silicon).

Thereby provide seal 44 usually to engage transparent substrates 41 and backboard 42 formation encapsulating structures 40.According to described embodiment, non-hermetic, half airtight or gas-tight seal that seal 44 can be.United States Patent (USP) the 6th, 589 has disclosed the example that gas-tight seal is handled in No. 625.

In one embodiment, in encapsulating structure 40, provide drying agent 46 to reduce the humidity in the encapsulating structure 40.In one embodiment, drying agent is between array 43 and backboard 42.Drying agent can be used for having encapsulation airtight or half gas-tight seal.Suitable desiccant material includes, but is not limited to zeolite, molecular sieve, surface adsorption agent, block adsorbent and chemical reactant.Described drying agent 46 also can be described as gettering material or can be used for a gettering material in addition, and wherein said gettering material is removed the other materials such as oxygen or particle.In one embodiment, the quantity of the drying agent that uses in encapsulation 40 is through selecting to infiltrate with the length of life that is absorbed in device 40 water vapour of seal 44.

In general, encapsulation process can vacuum, up to and comprise in the pressure of pressure between the vacuum of ambient pressure or projecting pressure and finishing.Described encapsulation process also can be during the encapsulation process various and finish in the high pressure of control or environment under low pressure.

Fig. 7 B explanation water vapour flows in the encapsulation 40 and drying agent 46 absorbs the water vapour that infiltrates.Referring to Fig. 7 B, drying agent 46 is absorbed in encapsulation and is present in water or the water vapour that encapsulates 40 inside when sealed.Drying agent 46 also absorbs as Fig. 7 B and is shown in sealed water or the water vapour 47 that has infiltrated encapsulation 40 inside afterwards of encapsulation.

In one embodiment, shown in Fig. 7 C, encapsulating structure 50 can be eliminated the demand to drying agent.In this embodiment, thus seal 44 be preferably a gas-tight seal prevent or minimize from atmosphere advance to the encapsulation 50 inside moisture.In another embodiment, replace an independent backboard 42 is sealed in transparent substrates 41, a film (not shown) is deposited on the transparent substrates 41 so that array 43 is sealed in the encapsulating structure 50.Therefore, the function of backboard can be finished by sealant.

As the existence that it will be understood by one of ordinary skill in the art that drying agent is useful for the amount that reduces the water vapour in the encapsulation, its cause again between transmission and the reflection horizon water still less.The minimizing of water can be favourable, because it helps to reduce the stiction that forms between transmission and the reflection horizon.Yet, also have the alternative route that reduces stiction.For example, below will describe in more detail, the purposes of protective finish not only can be served as an anti-static friction coating, and provides structural intergrity to other layers that are associated with reflection and transmission layer.Below will discuss described protective finish in more detail.

Fig. 8 is the detailed side view that comprises the interferometric light modulating device 80 in an optical modulation chamber 108, and wherein optical resonance betides between a fixed transmittance layer 102 and the removable reflection horizon 106.Transmission layer 102 sends light and can be partial reflection.Removable reflection horizon 106 reflected light and to can be part radioparent.Should be appreciated that as the those skilled in the art various terms can be used for describing described two layers.The principal element of need considering is that the description that described device should serve as " reflection " or " transmission " between an interferometric modulator and relevant described two layers is correlated with.Can indicate the alternative terms of transmission layer can comprise fixed bed, partially reflecting layer, transmissive element and main conductor.Can indicate the alternative terms in reflection horizon can comprise removable or deformable high reflection layer, reflecting element and secondary conductor.

Transmission layer 102 layering on a transparent substrates 100, described transparent substrates 100 can be can be with any transparent substrates of film MEMS device construction on it.Described transparency material includes, but is not limited to glass, plastics and transparent polymer.The reflection horizon 102 that is depicted as the stacks of thin films of a plurality of sublayers herein comprises an electrode sublayer 110 and a main minute surface sublayer (or transmission sublayer) 120 usually.Described main minute surface sublayer 120 can be made by metallic film.In certain embodiments, insulator layer 130 is placed in 120 tops, main minute surface sublayer and serves as an insulator, and also strengthens the reflection from transmission layer 102.The removable reflection horizon 106 that is depicted as the film of a plurality of sublayers herein generally includes one two a secondary mirror sublayer 140 and an electrode sublayer 150.Described two secondary mirror sublayers 140 can be made by metallic film.Form support member 104 to support described removable reflection horizon 106.In one embodiment, support member 104 is an insulator.Electrode layer 110 and 150 is connected to the voltage source shown in Fig. 1 (V) and makes and voltage (V) can be applied to two layers 102 and 106.United States Patent (USP) the 5th, 835 has disclosed other interferometric modulators configuration and operational modes in No. 255.

As used herein, term reflective layer and transmission layer will be given its ordinary meaning the most widely.One reflection horizon is that at least one reflected light also can be to the layer of light part transmission.The term reflective layer can refer to that (but being not limited to) is described as the layer of reflection horizon 106 or two secondary mirror sublayers 140 herein.But a transmission layer is the layer of at least one transmission light and partial reflection light.The term transmission layer can refer to that (but being not limited to) is described as the layer of transmission layer 102 or main minute surface sublayer 120 herein.When adopting term " element ", its general meaning is indicated the big or bigger part of part in the described device that relates to the one deck in the described layer.Therefore, as shown in Figure 8,106 can be described as reflecting element.Term " layer " can be in order to description entire emission layer 106 or for having reflexive certain layer (two secondary mirror or sublayer) 140 among Fig. 8 as in " reflection horizon ".Term " sublayer " or " sub-element " refer generally to have the certain layer (for example, object 140) of special properties.

Referring to Fig. 8, at the driving condition of an interferometric light modulating device 80, the reflection horizon 106 that is depicted as film herein can contact with the transmission layer 102 that is depicted as stacks of thin films herein.When a potential difference (PD) being applied to layer 102 and 106 the time, between described two layers, form a capacitor, it produces electrostatic force and reflection horizon 106 is pulled to transmission layer 102.This causes chamber 108 destroyed.If voltage is enough high, thus reflection horizon 106 deformables and compress transmission layer 102 and damage chamber 108 fully so.Yet when not applying potential difference (PD), the mechanical recovery force of described reflection horizon 106 and its surrounding structure can turn back to its original position with layer 106, recovers chamber 108 whereby.But even in driving condition not, layer 106 and 102 is closer to each other, for example about 0.2 μ m.Therefore, the mechanical recovery force of removable high reflection layer 106 should equate to guarantee the normal operation and the response of interferometric light modulating device 80 fully with the electrostatic force that produces between layer 106 and the transmission layer 102.

Protective finish

As time goes by, because wearing and tearing and general the use, different layers will begin to experience imperfection.In order to reduce the danger that one deck (for example, described insulation course) experience lost efficacy, a protective finish can be applied to the surface of the insulation course on the described transmission layer or be applied on the surface in reflection horizon.

Except that the physical protection of described layer, there are other purposes and the benefit that are associated with a protective finish.For example, existence can be upset the extra gravitation of above-mentioned equilibrium of forces.These extra gravitation can be poly-or two layers are retained on together Van der Waals force owing to the water-setting on each device.In the length of life of an interferometric light modulating device, water vapour (or water) can constantly infiltrate the inside (describing as Fig. 7 B) of described device, and the water vapour that infiltrates can be present on every one layer surface of layer 102 and 106.Poly-owing to water-setting, water vapour can cause two layers 102 and 106 to have an extra attractive capillary force between it.In addition, the Van der Waals force that causes adjacent material to become the short-range contingence of attraction at molecular level can cause layer 102 and 106 to have an extra gravitation between it.In an interferometric light modulating device 80, depend on running status, described removable reflection horizon 106 (comprising two secondary mirror sublayers 140) is shifted to the fixed transmittance layer 102 that comprises main minute surface sublayer 120 and is shifted out from it.If have extra gravitation between the layer 102 and 106, install 80 so and can not normally move, even for the point that described layer can adhere to each other.Therefore; in an embodiment of the present invention; the member that is used to reduce the gravitation between the layer 102 and 106 comprises a protective finish; it puts on one or more laminar surfaces (or sub-layer surface) of an interferometric light modulating device 80, so that the extra gravitation between the neighbouring surface can minimize or eliminate because of the effect as capillary water cohesion or Van der Waals force.

As used herein, term " protection " coating will be given its ordinary meaning the most widely, include, but is not limited to reduce the material of the gravitation between the surface and/or reduce the material of the fault of the layer that it covers.The term protective finish can refer to (but being not limited to) autoregistration individual layer (" SAM " is also referred to as automatic assembling individual layer).In certain embodiments, the example of a protective finish includes, but is not limited to one such as the one or more autoregistration individual layer in following: fluoro silane, chlorofluorosilane, methoxy silane, trichlorosilane, perfluoro decanoate, octadecyl trichlorosilane (OTS) or dichlorodimethylsilane.In certain embodiments; the example of protective finish includes, but is not limited to such as the one or more polymeric material in following: teflon, silicone, polystyrene, polycarbamate (standard and ultraviolet hardening), contain the block copolymer or the poly-silazane (especially having polysiloxane (polisiloxane)) of a hydrophobic assembly (for example, polymethylmethacrylate).In certain embodiments, an example of a protective finish includes, but is not limited to such as the one or more inorganic material in following: graphite, class are bored carbon (DLC), silit (SiC), hydrogenation brill coating or are fluoridized DLC.

In certain embodiments, protective finish is the optic response or the characteristic of remarkable adverse effect optical cavity 108 not, as the optic response and/or the characteristic of layer 102 or 106.In any case the change of the optical cavity characteristic that causes owing to the existence of protective finish can compensate by the parameter of regulating course and sublayer.Should be appreciated that as the those skilled in the art, is not all easy regeneration as other protective finish of all protective finish.The exemplary materials of protective finish of being used to regenerate comprises (for example) autoregistration individual layer, as polytetrafluoroethylene (PTFE), octadecyl trichlorosilane (OTS) and perfluoro decanoate, although the those skilled in the art also can determine substitute according to this announcement.In certain embodiments, the material that can serve as renewable protective finish makes the material of a monolayer deposition on an exposed areas to be covered of material for volitional check and autoregistration in its deposition.In addition, because Regeneration Treatment can be depending on temperature, therefore state also can be desirable from solid-state those materials that change to liquid state or gaseous state under enough low temperature.

Fig. 9 illustrates that one has respectively interferometric light modulating device 80 with the part of the layer 102 and 106 in protective finish 160 and the 170 optical modulation chambeies that apply 108 according to one embodiment of the invention.In other embodiments, at least a portion (comprising support member 104) of all surface in the optical modulation chamber 108 applies with a protective material.In another embodiment, an only surface of described device applies with protective finish.Should be appreciated that as the those skilled in the art a lot of benefits can reach by only covering a surface.

As mentioned above, insulator layer can be formed on the conductor layer, and described protective finish (for example, autoregistration individual layer) can be formed on the insulator layer.Yet, since during the general manufacturing of described interferometric modulator the described insulator layer of patternization at length, therefore can remove described insulator layer from arbitrary required layer-selective.Therefore, in the following description,, will suppose promptly situation for this reason when described protective finish most convenient with when being positioned on the conductor layer effectively.When described protective finish most convenient with when being positioned on the insulator layer effectively, will suppose promptly situation for this reason.Yet the those skilled in the art will recognize that also other variants also are possible.When described protective finish when one " element " or one " layer " are gone up, described coating can be on the arbitrary layer that is associated with described layer or element (for example, insulator, conductor, main protective finish etc.).When described protective finish in a sublayer or " directly " on one deck the time, then supporting the certain layer of appointment immediately and placing described coating.

Figure 10 illustrates that one has an alternate embodiment of the interferometric light modulating device 80 of the layer 102 and 106 that applies with protective material according to another embodiment of the present invention.In this embodiment, protective finish 160 and 170 is formed on layer 106 and 102 the surface of 108 inside, chamber.In this embodiment, removable reflection horizon 106 comprises himself the vertical support mechanism via a semisphere, its with exist Fig. 9 embodiment that is formed at the independent pillar 104 between two layers 106 and 102 different.Although Fig. 9 and 10 is depicted as the whole surface that covers the layer 102 and 106 in the optical modulation chamber 108 with protective finish 160 and 170, the part of coat 102 and/or layer 106 is contained by the present invention.For example, in one embodiment, only the part of layer 102 comprises a protective finish.In another embodiment, only the part of layer 106 comprises a protective finish.Should be appreciated that as the those skilled in the art other shapes (for example, except that semisphere) can be taked in described reflection horizon.For example, also can use a greater part of footpath (multi-radius) shape or a bent angle (curved corner) shape.The device of being advocated is not limited by the shape in reflection horizon need.

Figure 11 A, 11B and 11C explanation one has the interferometric light modulating device 80 of the selective coating of one or more layers according to embodiments of the invention.In Figure 11 A, protective finish 160 is provided on the surface in removable reflection horizon 106, and is not provided on the fixed transmittance layer 102.On the contrary, in Figure 11 B, protective finish 107 is provided on the surface of layer 102, and is not provided on the layer 106.In certain embodiments, protective seam optionally is provided on the certain material.In other embodiments, protective seam is provided in to be close on all material of coplane with a certain layer.In other embodiments, described protective seam all is applied in the whole encapsulation of described device.In certain embodiments, a plurality of layers of a protective finish are positioned on a reflection or the transmission layer.For example, on a reflection horizon, can there be two protective finish.In certain embodiments, can difficultly obtain required material and adhere to a required surface.In the case, can put down (put down) individual layer " tackifier " and revise described surface, and then put down described anti-static friction or protective finish.

As describing among Figure 11 C, a method finishing selective coating illustrated among Figure 11 A and the 11C is for using a cladding element 175.During coating is handled, can as cladding element as described in the expendable material 175 cover be depicted as herein fixed transmittance layer 102 do not desire the surface that is capped make described protective finish not be formed on the surface that is covered by cladding element 175.In other embodiments, described cladding element 175 can be provided in to need not on any surface in the chamber 108 of a protective finish, such as the surface of the pillar 104 in the chamber 108.

Figure 12 A and 12B explanation one have the interferometric light modulating device encapsulation 85 with the layer 102 and the layer 106 of protective material coating according to another embodiment of the present invention.In these embodiments, layer 102 and 106 is sealed in the encapsulation 85, and carry out the encapsulation 85 manufactured backs that are applied to of described protective finish.In one embodiment, backboard 42 is a sunk structure or a shaped structure, if but the quantity that encapsulates drying agent in 85 (in Figure 12 A and 12B, showing) reduce or remove, do not need so so.In this embodiment, the demand to cup depth can reduce or eliminate.In one embodiment, compare, use protective finish 160 and 170 (for example, autoregistration individual layer) can allow to change lid (backboard) and design to reduce essential depression with the depression required as if the use drying agent.

In the embodiment that Figure 12 A and 12B are described, hole 176 is defined in the encapsulation, for example is defined in the shown seal of Figure 12 A or 12B 44.In these embodiments, the protective finish material can be fed in the inside of encapsulation 85 via hole 176.In another embodiment, shown in Figure 12 B, (for example, in seal 44 and 45) produce two holes 176 and 177 to be used to transmit protective material in encapsulation 85.In another embodiment, plural hole (not shown) can be defined in the encapsulation 85, and via described hole with the protective finish material supplies in encapsulation 20 inside.In other embodiments, the hole can be formed in substrate 100 or the backboard 42.Therefore, in seal 44, substrate 100 and/or backboard 42, has the hole to be used to transmitting protective finish within the scope of the invention.

In these embodiments, being formed at the hole of encapsulation in 85 also can be in order to remove water vapor from encapsulating 85 inside.After no longer needing described hole, can it be blocked, weld or seal according to the character in described hole.

Figure 13 illustrates that one is used for the protective finish system of an interferometric light modulating device 80 according to one embodiment of the invention.Referring to Figure 13, system 180 comprises a chamber 181, a coating material container 182, a valve 184 and a carrier gas reservoir 186.Be understood by those skilled in the art that system 180 only is exemplary, but and can use the element of removal system 180 or in the layer some and/or comprise other coat systems of additional element.In one embodiment, system 180 can be the encapsulation execute protection coating of manufacturing as shown in Figure 11 A, 11B and 11C.

Valve 184 control coating material injecting chamber 181.In one embodiment, valve 184 is controlled by calculation element.In one embodiment, valve 184 can be the valve that is applicable to that described protective finish is handled.In another embodiment, valve 184 can be used for carrier gas and such as XeF ₂Etchant gas mix and regulate described carrier gas with described etchant gas.

Container 182 contains the protective finish material.In different embodiment, as discussed above, the example of a protective finish can include, but is not limited to following material: as autoregistration (or assembling automatically) individual layer of OTS, dichlorodimethylsilane etc.; Other polymeric materials as teflon, polystyrene etc.; Or as other inorganic material of graphite, DLC etc.In another embodiment, coating material comprises not the significantly optic response of adverse effect optical cavity 108 or arbitrary protective material of characteristic, as the optic response and/or the characteristic of layer 102 or 106.In a preferred embodiment, described protective finish material comprises an automatic assembling individual layer with a relatively low fusing point or evaporation point.This can allow under relatively low temperature assembling one to contain the protective finish of regenerating after the device of interferometric devices.

In one embodiment, carrier gas reservoir 186 is contained just like nitrogen (N ₂) or the carrier gas of argon, its week is to be sent to chamber 181 by a known pumping mechanism with described protective material.In another embodiment, described carrier gas can be incorporated the gettering material or the chemical substance of other types into, only otherwise the significantly execution of the described interferometric light modulating device 80 of adverse effect.In another embodiment, described carrier gas can with discharge etchant gas XeF ₂Chemical substance be integral.

Figure 14 one describes the indicative flowchart that a protective finish is handled according to one embodiment of the invention.Be understood by those skilled in the art that according to described embodiment and can add additional step, remove other steps or change the order of described step.According to embodiments of the invention with shown in Fig. 7-12, Figure 14 proves described protective finish program.

The protective finish material is provided in step 90.In step 92, will coated interferometric light modulating device 80 be placed such as the surface of layer 102 and/or 106 and force 181.In step 94, a protective finish is put on the surface to be coated.In one embodiment, can heat surface, make before the execute protection coating, to remove to be present in lip-deep water vapor to be coated such as the layer 102 and/or 106 of a specular surface or an insulator surface.In one embodiment, do not provide insulator layer 130, and described protective finish is formed on the surface of main minute surface sublayer 120 (describing among Fig. 8).In another embodiment, described protective finish is formed on the surface of two secondary mirror sublayers 140 (describing among Fig. 8).In another embodiment, described protective finish is formed on the surface of insulator layer 130 and two secondary mirror sublayers 140 (describing among Fig. 8).

In the embodiment that described protective finish is handled, described protective finish forms during an interferometric light modulating device manufacturing is handled.For example, described protective finish can be incorporated one " release " processing into.In described release was handled, use one is XeF for example ₂Gas one sacrifice layer 175 (describing among Figure 11 C) of interferometric light modulating device 80 is etched away.In one embodiment, available pump is with described protective finish material and XeF ₂A potpourri send in the chamber 181.In another embodiment, XeF can be finished ₂Apply described protective finish after the etching.Usually, discharge to handle by a MEMS etch system and carry out, for example the X3 series of X etch that can obtain from U.S. XACIX and the MEMS ETCHER that can obtain from Singapore Penta Vacuum.

In another embodiment that protective finish is handled, the thickness of described protective finish is even.In another embodiment, described protective finish is in uneven thickness.In general, even protective finish is inhomogeneous, be a film coating such as the protective finish of autoregistration individual layer, and therefore its not appreciable impact layer 102 or 106 optical characteristics (or response), comprise minute surface 120 and 140 (describing among Fig. 8).

In one embodiment; use " Dichlorodimethylsilane as an Anti-Stiction Monolayer for MEMS " and the United States Patent (USP) the 6th of the 1st phase the 10th volume MEMS (micro electro mechanical system) magazine in March calendar year 2001 for example; described protective finish is carried out in the processing that is disclosed in 335, No. 224.In another embodiment, use comes the execute protection coating just like the deposition processes of chemical vapor deposition or physical vapour deposition (PVD).In another embodiment, can use minute surface known or that will develop in the future or any suitable protective finish method on the insulator surface.Then in step 96, finish described protective finish and handle, and in step 98, remove interferometric light modulating device 80 from chamber 181.

Figure 15 describes one to be used for applying a method that is used for the protective finish of interferometric light modulating device according to one embodiment of the invention.Described figure explanation is used to reduce the other method of the gravitation between the interior layer of an optic modulating device.According to described method, can make interferometric light modulating device described in the present invention, comprise described device referring to Fig. 7-12.With the method, provide a transmissive element in the step 200.Can be by on a substrate, providing described transmissive element with a transmission layer layering.Described transmissive element can be any in (for example) whole fixed transmittance element 102 or its sublayer, as main minute surface sublayer (transmission sublayer) 120, insulator layer 130 or the electrode sublayer of describing among Fig. 8 110.One reflecting element is provided in step 210.Can provide described reflecting element on the described transmissive element by a stacks of thin films is formed at.Described reflecting element can be any in (for example) removable reflection horizon 106 or its sublayer, as two secondary mirror sublayers 140 or the electrode sublayer of describing among Fig. 8 150.Then provide a protective finish in step 220, wherein said protective finish is between described reflection horizon of at least a portion and described transmission layer.Can provide protective finish as described in this article referring to Figure 11-14.Be understood by those skilled in the art that method depicted in figure 15 only for exemplary, and can use some elements or the step that to get rid of in institute's plotting method and/or other coating processes that comprise additional element, layer or step.

For example, in other embodiments, can before being provided, transmissive element provide described reflecting element.Equally in other embodiments, after cremasteric reflex element or transmissive element, provide described protective finish.Equally in other embodiments, the cladding element such as sacrifice layer can be applied to the part of the coating that needs protection of interferometric light modulating device.Then if desired, after protective finish is provided, other elements can contacts with cladding element through applying, contact (transfer contact) protective finish is provided by changing whereby.Then, but described cladding element of etching and/or sacrifice layer.In other embodiments, between reflecting element and transmissive element, provide a sacrifice layer, and follow the described sacrifice layer of etching before protective finish is provided.In other embodiments, before protective finish is provided, described transmissive element and reflecting element are packaged in the interferometric light modulating device encapsulation of being described just like Figure 12 A and 12B.In other embodiments, supply described protective finish in described encapsulation prerequisite.

The regeneration of protective finish

Figure 16 shows that one can be used for simplification and the enlarged side view of another embodiment of transmissive element in the MEMS configuration or layer 102.Described transmissive element has a protective finish 908 that is deposited on for example individual layer on the insulator layer 904.Described insulator layer 904 is positioned at one on the transmission layer on the substrate 900 902.For example between layer 902 and substrate 900, can there be as shown in Figure 8 an electrode layer.If use aluminium can for example form insulation course 904 by the oxidation in the oxygen plasma so; Therefore, form an aluminium oxide thin layer.

Figure 17 A is that an explanation one is used for the side view of embodiment of encapsulating structure 340 that can contain the interferometric modulator array of transmissive element 102 depicted in figure 16.Be similar to said structure, encapsulating structure 340 comprises one and is formed at that the backboard of array covers or " lid " 346 as described in a interferometric modulator array 342 on the substrate (as glass) 344 of a substantially transparent and the sealing.Described encapsulating structure 340 can further have one and be formed at or put on the lining face of backboard 346 and the seal 348 between the substrate 344.In one embodiment, main seal 348 is a non-gas-tight seal, as the epoxy adhesive of a routine.Also can adopt above-mentioned various package system and other system.Different with above-mentioned package system, the device among Figure 17 A further contains just like following detailed description can be used for the regenerating optics well heater 350 of protective finish.

Figure 17 B is the planimetric map of the encapsulating structure 340 of a key diagram 17A.Illustrated as Figure 17 B, plurality of conductive leads 352 (part show) can be positioned on the substrate 344, and is configured to provide being electrically connected of element of one drive circuit (not shown) and interferometric modulator array 342.Described encapsulating structure 340 can comprise be formed at substrate 344 one with the conductive lead wire on the upper side 352, and described conductive lead wire only illustrate on the side of described substrate and for simplicity shown in configuration in.

Described driving circuit is configured to control the operation of the element of interferometric modulator array 342.As it will be understood by one of ordinary skill in the art that conductive lead wire 352 can be positioned on the substrate 344 in a plurality of configurations, and illustrated being configured in is exemplary in nature.In certain embodiments, described driving circuit is in order to control heater.In other embodiments, an independent device or element are in order to control heater.

As be understood by those skilled in the art that described driving circuit can be positioned at the zones of different of encapsulation.In certain embodiments, driving circuit 353 is positioned on the substrate shown in Figure 17 C.In this embodiment, the described driving circuit control heater of can being not difficult to be used for is if especially described well heater is positioned on the described substrate.As be understood by those skilled in the art that in certain embodiments, described well heater is controlled by a device except that driving circuit.For example, leave among the embodiment of substrate at well heater or heater lead, other discrete component can be in order to control heater.For example, a power transistor (power transistor) can be in order to control heater.Known announcement, the those skilled in the art is not difficult to discern and is used for power being provided or controlling its alternative means to well heater.

Although protective finish discussed above has a lot of possible advantages, have recognized that run duration in interferometric modulator element, protective finish 160,170 or 908 can be wiped or be cut, this owing to transmissive element and reflecting element repeat contact.Described friction or cutting can or not can be on the surface of described coating uniformly.Described protective finish can peel off from insulator layer above a period of time.Therefore, it is favourable to repair described protective finish aperiodically in the use of described device.Below disclose the distinct methods of the protective finish that is used for how to regenerate.

A kind ofly be used to regenerate or reallocate one protective finish 908,170 or 160 protective finish be (for example as shown; one embodiment of the method autoregistration individual layer) comprises: the temperature of protective finish 908,170 or 160 is brought up to a temperature; change to liquid, steam at the described protective finish material of this temperature from solid, or significantly increase vapour pressure and make described protective finish material reallocate in a basic configuration uniformly on its initial layer that applies.This allows to repair and the described protective finish of regenerating, even it still is contained in the encapsulation (for example, Figure 12 A, 12B, 17A or 17B).This can reach by different device.For example, shown in Figure 17 A, an optics well heater 350 can be included in the described encapsulation.

Figure 17 D describes an embodiment of described method.At first 300, an interferometric devices with protective finish (preferred be damaged or suspect impaired coating) is provided.Follow 310, the temperature of rising protective finish material makes described protective finish self to be distributed on the surface again.Described heated protective finish material can be protective finish (that is, the reflection or transmissive element on coating) self material or its can be from the reservoir of protective finish material.In case improved the material of described temperature with the protective finish that allows to distribute again in a period of time, promptly allow the described device 320 of cooling, it allows to solidify described protective finish; Therefore, the described protective finish of regenerating.As be understood by those skilled in the art that, if the method for being described among Figure 17 D helps to set up at first individual layer, so after its method that can in Figure 14 or 15, be described or even carry out during the program in early days.

As be understood by those skilled in the art that the raising of temperature can (for example) be measured by different way in the temperature at some some places of the temperature of heating element or device to be heated in the device.When going up in limited time of temperature has been discussed, it generally is the temperature about object to be heated rather than heating element self.Those skilled in the art will realize that in certain embodiments and generally heating element self can not can be heated to higher basically temperature with described device.In a preferred embodiment, by obtain the heat of aequum by specific heater running current known known time.Known announcement can be determined described electric current and time by routine test.

In some respects, the present invention is used as a kind of material the protective finish that can allow the regeneration protective finish after the described device of assembling.Therefore, in one embodiment, be encompassed in and be mainly solid-state under the relatively lower temp and at high temperature show relatively than the high volatile volatile and the protective finish that therefore can in a system, distribute again through heating.For example, but the protective finish material that self distributes again can be used to make a device with protective finish of power of regeneration when being heated to above 22-50,50-85,85-100,100-250,100-110,110-120,120-150,150-200,200-225,225-250 ℃ or higher temperature.As be understood by those skilled in the art that to have at a lower temperature more that the protective finish of high stability can help typical operating conditions, because described protective finish should be kept a relative solid-state form between the typical operating period of device.

Various protective finish above have been discussed.In a preferred embodiment, the material that is used for protective finish can form a self-assembled monolayer (SAM).Preferably, under the condition that is increasing energy (as heat) under the standard service condition for solid-state material, be easy to fusing or vaporization.Therefore, especially preferred material is to form SAM, can decompose and regenerate at various temperatures and not damage described interferometric devices, described encapsulation and/or contain the material of element of the described device of these objects.The exemplary materials of protective finish of being used to regenerate comprises (for example) autoregistration individual layer, such as polytetrafluoroethylene (PTFE) and octadecyl trichlorosilane (OTS).

Material comprises that further (for example) is F just like general formula ₃C (CF ₂) _XThe long-chain fat halogenation polar compound of the perfluoroalkane acid of COOH (perfluoroalkanoic acid), wherein X is preferably 10 or bigger (for example, perfluoro decanoate), and for example 10,12,14,16 or 18.COOH partly provides " grappling " preferably with the surface of transmission or reflecting element, and the free end of each molecule or residue provide the low-surface-energy that stops two elements to adhere to simultaneously.Can strengthen adhering to of COOH part by suitable pre-service is carried out on reflection or transmission layer surface.Discuss as this paper, select these molecules, but described molecule fully volatilizees to allow protective finish to move and to regenerate when being heated according under typical service condition, forming a stable protective finish.If known disclosure those skilled in the art will realize that how to select or revise this individual layer.For example, in the long-chain in the number of carbon or the long-chain number of two keys can change the stability of the protective finish that is produced.In addition, can add the fusing point of adjuvant with the described protective finish of further adjusting.

In certain embodiments, can use polytype protective finish material simultaneously.In certain embodiments, set up initial protective finish (for example, the Teflon of a more difficult life ^TM), and also add one second type the protective finish material that is easy to regenerate to described device.In certain embodiments, described second type protective finish material is through selecting to make it will preferably be bonded to Teflon ^TMTherefore any gap in the coating rebuilds a complete protective finish.In certain embodiments, described " bottom " coating can be selected to regulate such as other parameters such as clinging power and temperature dependencies.

Although embodiment discussed herein concentrates on the method and composition that uses the inner thermal source of an encapsulation, in certain embodiments, the thermal source or the energy can be positioned at encapsulation 85 outsides.Therefore, in certain embodiments, an external heat source can heat the part (for example, only reflection and/or transmissive element) of whole encapsulation or device.This can finish in many ways, for example uses the radiation as laser, or the atmosphere around the heating arrangement.Described heating can be arranged by backboard 346 by substrate 344 or (for example).Described heating can be arranged via radiation, conduction or convection current.

Figure 18 is an explanation another embodiment of system 354 that is formed at the lip-deep protective finish of interferometric modulator array 342 that is used to regenerate.System illustrated in fig. 18 comprises a well heater, for example is positioned at the heating element 355 of adjacent interferometric modulators array 342.Described heating element 355 can be made by the lithographic patterning of one or more metal levels of depositing during the manufacturing of interferometric modulator structure.Heating element 355 is configured to respond the current emission heat that produces by being applied in the electric current that defines in conductive lead wire 356A and 356B place; wherein the heat number launched of heating element 355 (for example is enough to raise protective finish; the autoregistration individual layer) temperature makes described coating be distributed on the described conductor layer again.

One electric current is applied to conductive lead wire 356A and 356B can (for example) control by described driving circuit (not shown), described driving circuit also is configured to the operation via the element of the described interferometric modulator array 342 of conductive lead wire 352 controls.When described interferometric modulator array 342 was implemented in an electronic installation, during its operating period, described driving circuit can be configured on a fixed cycle basis scheduled current is applied to heating element 355.In other embodiments, use applying of a predetermined voltage.As be understood by those skilled in the art that described driving circuit self can be positioned on glass.Yet, in certain embodiments, as when as described in well heater not when on glass, described driving circuit need not be positioned on glass.In certain embodiments, described driving circuit is not used in control heater and uses another current/voltage source.

In one embodiment, heating element 355 is positioned on the substrate 344.In other embodiments, can (for example) each edge of contiguous described interferometric modulator array 342 implement a plurality of heating elements.Technician as this skill will understand, and the configuration of heating element 355 is not limited to configuration shown or that describe, and contains additional configuration.According to required application, the actual disposition of described well heater and layout can change, and the those skilled in the art can determine suitable layout and configuration according to this announcement.For example; the adjacency of the amount of free space, heating element and other heat-sensing devices, vaporize or volatility, the composition of heating element and the composition of resistance and described substrate of the required heat levels of described protective finish of regenerating, protective finish material to be heated substantially, to specify a little factor.

Term in the time of suitable " well heater ", " heater assembly ", " heating element " and other similar terms are interchangeable.In general, " heating element " indicates by the actual contents that electric current or other members heated, and well heater can be indicated the more generally notion of whole heating arrangement or element self.

In another embodiment, well heater is not arranged on the substrate but is positioned at other places of described device.For example, described well heater can be positioned at backboard or cover on 346.For example, in one embodiment, the object 350 among Figure 17 A is a well heater; Therefore, described in certain embodiments well heater can be attached to backboard.

As be understood by those skilled in the art that, can determine the duration that required heat number and heat apply in many ways.For example, one contain an impaired protective finish (for the purpose of testing its can be by wilful damage) given encapsulation in, a large amount of heats are applied to described device and allow described device cooling.After this, can (for example) via on the microscope functions or directly check the surface and the consistance of described protective finish.Described processing be can in identical or different device, repeat and the duration and the amount of the required electric current of enough heats produced to be defined as specific heater in the special package protective finish of fully regenerating.The difference amount that contains regeneration, for example regeneration on the surface that turns back to its original covering state of percent 1-10,10-20,20-30,30-40,40-50,50-60,60-70,70-80,80-90,90-99 and 99-100.In certain embodiments, use the longest maximum current of duration.In a preferred embodiment, can be used to produce the heating agreement from above-mentioned data, wherein a scheduled current passes one period schedule time of described heating arrangement with the described layer of regenerating.In a preferred embodiment, need not the integrality of described layer is checked.

In certain embodiments, the extra reservoir with the protective finish material that can obtain in encapsulation is useful.This is to be particularly useful under the situation of individual layer at protective finish.In certain embodiments, the exposed surface of the exposed surface in reflection horizon and transmission layer all covers with protective finish.In certain embodiments, have a reservoir of protective finish material in described encapsulation, it is except that the amount on described transmission and the reflection horizon.In certain embodiments, described reservoir is than a single monolayer thick.Described reservoir can be allocated in and make superfluous protective finish can obtain and center on described interferometric devices array in the described encapsulation in encapsulation.Described reservoir can be positioned at the heating element top or near.Therefore, in certain embodiments,, need apply very low-level heat in order to have the protective finish material of the reservoir that can self distribute again.In certain embodiments, described reservoir only exists than the required more protective finish material of protective finish material in a surface that applies transmission or reflection horizon.

As be understood by those skilled in the art that, in the embodiment that uses a reservoir, any structure in described encapsulation or the interferometric devices can be used as a surface that is used to add the reservoir of encapsulating material, comprises various pillars, support member and package surface.As be understood by those skilled in the art that; can cause in the described encapsulation or superfluous protective finish material on the described interferometric devices by being blown into protective finish in the encapsulation or adding described protective finish on the interferometric devices, therefore set up a reservoir.In one embodiment, wherein add described protective finish by blowing the protective finish material via a hole in encapsulation, described protective finish material can be positioned on the different surfaces of described encapsulation.Before device being closed in the described encapsulation described protective finish is blown among the embodiment on the interferometric devices, only described interferometric devices can be coated with protective finish.As be understood by those skilled in the art that the protective finish that not is each type can adhere on obtainable each surface.Can be based on needing described protective finish with how many protective finish of needs to select the type of protective finish wherein in previously mentioned characteristic and the resulting device.In certain embodiments, adding the Additional Protection material to described device after the operative installations.In certain embodiments, before at first using described device, set up described protective finish for its desired purpose.In other embodiments, adopt heating or well heater described herein when at first setting up protective finish, to help to set up the uniform coating of described protective finish.

In certain embodiments, regeneration assembly and method are used for an interferometric devices with a getter or drying agent.As be understood by those skilled in the art that the temperature of described getter generally should not be elevated to the point that loses the water that has absorbed.This can by getter and heater system heat is isolated or with the temperature maintenance of described well heater a certain temperature with under reach.In certain embodiments, when adopting well heater, do not adopt drying agent or getter.

In certain embodiments, between described transmission and reflection horizon, only need a protective finish.Therefore, when covering one during, can be described additional materials and regard a reservoir as with surface area.As be understood by those skilled in the art that, when described reservoir is supplemental layers, heats described device and can cause protective finish to move to another layer from one deck.The loose protective finish of tolerable one deck makes another layer its protective finish of can regenerating.

As be understood by those skilled in the art that in certain embodiments, described protective finish is " fully " regeneration not.On the contrary, in certain embodiments, the coating layer portion that regeneration has damaged, another part of described coating simultaneously.This can take place under the situation of operation that does not have the described device of adverse effect when the part that obtains the protective finish material from it during from the layer that does not contact another layer a part of.This can comprise that (for example) contacts the part of the part of the reflection horizon 14b between the transmission layer 16b place with reflection horizon 14b at support member 18.It will be understood by one of ordinary skill in the art that to a certain extent; because will be in (for example) the described fact that comes in contact the place between two-layer to the position of the damage of described protective finish; therefore relocating of described protective finish material will be taken place; therefore produce the material of relatively low concentration therein, and the described protective finish that distributes again at random will cause reducing through the increase of the protective finish material of breakage with without the concentration of breakage.This can be not difficult by using its molecule that the automatic assembling individual layer that himself is distributed in again on one deck is reached.Therefore, in certain embodiments, the only regeneration or the contact region (element contacts the zone of another element) of the described protective finish of partial regeneration.

Figure 19 A shows another embodiment of system 362 of the protective finish of the interferometric modulator array 342 that is used to regenerate.In this embodiment, the existence conductive lead wire 352 that can re-use is with response predetermined voltage emission be enough to distribute the again heat of described protective finish.In one embodiment, element in described interferometric devices or layer are used as a well heater more.

Usually, described conductive lead wire extends through described interferometric modulator array from described driving circuit, and ends at the distal openings of described array.In certain embodiments, a plurality of these conductive lead wires can be delivered back the driving circuit around the described array periphery or " become the loop " with it.At normal operation period, described ring-type lead-in wire is isolated with earthing potential by the transistor switch (for example) of described driving circuit inside.When needs distribute protective finish again; encourage described transistor switch with described ring-type lead-in wire short circuit earthing potential, and a scheduled current or voltage application will cause distribute the again protective finish of interferometric modulator array 342 of the enough heats of one or more ring-types lead-in wire emissions.In certain embodiments, in the loop of a current-limiting resistor between lead-in wire and ground.

In one embodiment, described heat produces electric current and forms the loop by transmission layer.In a preferred embodiment, described heat produces electric current and forms the feasible heat that can produce aequum in loop by the circuit with relative high electrical resistance.As above mentioned, described transmission layer can comprise a relative high-resistance material, as chromium.Described therein protective finish directly or indirectly is attached among the embodiment of transmission layer, and this can be favourable, because will produce heat on the protective material that needs additional coatings or its surface that distributes again.In another embodiment, described heat produces electric current by having high-resistance relatively another conductive layer (as wherein having the layer of chromium or nickel) one-tenth loop, the mechanical layer (or displaceable layers) 34 in the device as described.

As be understood by those skilled in the art that, in certain embodiments, can use when electric current by the time with the interferometric devices of emitting heat quantity or any material or the part of encapsulation.As be understood by those skilled in the art that described interferometric devices need not and can move during regeneration step, therefore or even the device or the element that are used to move described interferometric devices and can need usually can be used as well heater.As be understood by those skilled in the art that, on surface to be repaired, have a large amount of relatively spaces can be required because it will allow to take place a more efficiently Regeneration Treatment.Therefore, in certain embodiments, during described Regeneration Treatment, described reflection and transmissive element by toward each other away from and place.

In certain embodiments, as illustrated among Figure 19 A, the disconnector that is used for the foregoing description can be embodied as mems switch 364 on substrate, and the common ground that wherein said mems switch is couple in driver or other places connects.Figure 19 B is the skeleton view of an explanation one exemplary mems switch 366.Mems switch 366 comprises a substrate 370 with a main conductor layer 372 formed thereon.One insulator layer can be formed on the main conductor layer 372.Yet, among Figure 19 B described insulator layer is not described for simplicity, and should be appreciated that the combination that comprises conductor layer 372 and insulator layer formed thereon referring to main conductor layer 372.

Be similar to reflection horizon illustrated in fig. 1 (or conductor layer) 14b, mems switch 366 further comprises a secondary conductor layer 374, and it is configured to applying of response voltage and is deformed into main conductor layer 372.Can be for example as United States Patent (USP) the 5th, 835, described in detail and make mems switch 366 in No. 255 referring to Figure 26 A-K.Described mems switch 366 also comprises one or more switch conductors 376 that are formed on the main conductor layer 372.At run duration, (see Fig. 1, for example) applying is deformed into main conductor layer 372 to described secondary conductor layer 374 response voltage V.When secondary conductor layer 374 touch switch conductor 376, mems switch 366 allows electric current to flow between conductor 376.Therefore, described mems switch 366 can respond the predetermined voltage that is applied to main conductor 372 and secondary conductor 374 and encourage.

In certain embodiments, described well heater or heating element are positioned to connect and are bordering on the reflection horizon.This can reach in many ways.For example, as discussed above, well heater can be positioned on the backboard of an encapsulation.

Figure 20 A is that wherein said well heater is positioned to connect and is bordering on another embodiment in reflection horizon.Figure 20 A is the side view diagram of another embodiment of system 380 that is used for the autoregistration individual layer of interferometric modulator array that is used to regenerate.Be similar to the interferometric modulator element of Fig. 1 explanation, system 380 comprises a transmission layer 502 and the reflection horizon 506 by insulated support 504 supports that is formed on the substrate 500.The insulator layer 382 that is similar to insulator layer 904 (Figure 16) is formed on the transmission layer 502, and also has the protective finish 384 (being similar to the protective finish 908 among Figure 16) such as an autoregistration individual layer, and it is formed on the insulator layer 382.In certain embodiments, protective finish is allocated on a plurality of surfaces, and is not limited to be formed on the top of insulation course 382.

Illustrated as Figure 20 A, system 380 can further comprise one or more pillars 386 on the insulator layer 382 that is formed between the near reflection layer 506 (seeing Figure 20 B).Pillar 386 extends away from insulator layer 382 and may extend into outside the height in reflection horizon 506.Described pillar 386 is configured to support heater grid 388 or indivedual heating element.Described heater grid 388 is configured to respond predetermined voltage or current emission heat.The heat of described emission be enough to the to raise temperature of protective finish makes described protective finish or Additional Protection coating evenly be distributed in basically on insulator layer 382 or the arbitrary layer that described protective finish covered again.In one embodiment, the described protective finish that distributes again is not heated to layer 384 largely arbitrary simultaneously.For example, the protective finish material of an additional quantity can be positioned on the described heater grid; And therefore, only need described heater grid is heated to arbitrary effective number of degrees.

Figure 20 B is a planimetric map diagram of the system 380 of Figure 20 A.The top that only shows pillar 386 for illustrative purposes.Substrate 500 can comprise the conductive lead wire (not shown) that is connected that is used between heater grid 388 and the driving circuit (not shown) that is used for interferometric modulator array.Described driving circuit is configured to control a curtage and is applied to heater grid 388, controls the regeneration of protective finish 384 whereby.As be understood by those skilled in the art that, need to can be used for these well heaters by the electric current that driver IC and other voltage provide.When described heater lead leaves glass, can be not difficult to supply voltage/current by instead of voltage/current source.

As be understood by those skilled in the art that according to this announcement, well heater or heater grid 388 can be positioned at not at the same level.For example, when showing that heater grid 388 is positioned on reflection horizon or the element 506, it also can be arranged under the plane identical with described reflection horizon or element, described reflection horizon or the element 506 or under the part.In addition, can change the position of described protective finish, maybe a protective finish can be applied in whole interferometric devices or the whole encapsulation.As be understood by those skilled in the art that protective finish being placed at the heat that can allow on the reflection horizon 506 of approaching heater grid 388 among the described embodiment from the lower amount of heater grid is enough to described protective finish is distributed on the described layer again.

In certain embodiments, in conjunction with above-mentioned different embodiment.For example, in certain embodiments, in conjunction with polytype well heater, or the several different methods of the execution heating simultaneously and the described device of regenerating.For example, can apply the external source of heat when using interior heater, this can allow to take place regeneration more efficiently.

In certain embodiments, one be similar to the bus system that is positioned at the reflecting element top shown in Figure 21 and can be used further to heat described protective finish.In this embodiment, described interferometric devices 600 is similar to other interferometric devices (it has a chamber 660 and reflection and transmission layer), but it further has bus structure 671 that are positioned at the support member top.Can reuse described bus structure (for example, specific mems switch or transistor) as described above.One advantage of described structure is the exceptional space that described well heater or heating element do not occupy described interferometric devices; Therefore, the resolution that does not have the described device of loss.In addition, because described bus structure 671 are positioned at the top of the support member in reflection horizon, need not to add additional support to described device to support described well heater.Disclosed bus structure and how to have made described bus-structured detailed description in No. the 10/644th, 312, the U.S. patent application case of on August 19th, 2003 application.

Some embodiment of the present invention has been described in aforementioned description in detail.Yet, should be appreciated that the present invention can implement in many ways no matter aforementioned description seems have how in detail in the literary composition.It should be noted that also not using the particular term of using when describing some feature of the present invention or aspect hints that described term is redefined in this article to be restricted to and comprise the feature of the present invention that is associated with described term or any special characteristics of aspect.

Figure 22 A and 22B are the system block diagram of an embodiment of explanation display device 2040.Display device 2040 can be (for example) honeycomb fashion or mobile phone.Yet the same components of display device 2040 or its slightly different variant also are illustrative for the dissimilar display device as TV and portable electronic device.。

Display device 2040 comprises a shell 2041, a display 2030, an antenna 2043, a loudspeaker 2045, an input media 2048 and a loudspeaker 2046.Described shell 2041 is formed by in handling for the known multiple manufacturing of one of ordinary skill in the art any usually, comprising injection moulding and vacuum forming.In addition, shell 2041 can by in the various materials any and make, comprising (but being not limited to) plastics, metal, glass, rubber and pottery or its combination.In one embodiment, shell 2041 comprises removable portion (not shown), and described removable portion can have different colours with other or contain the removable portion exchange of different identification, picture or symbol.

As described in this article, the display 2030 of exemplary display device 2040 can be any in the various displays, comprising bistable display.In other embodiments, display 2030 comprises flat-panel monitor as indicated above, as plasma, EL, OLED, STN LCD or TFT LCD, or comprises the non-tablet display, as CRT or other line device, knows as one of ordinary skill in the art.Yet for the purpose of describing present embodiment, as described herein, display 2030 comprises an interferometric modulator display.

The assembly of one embodiment of exemplary display device 2040 schematically is described among Figure 22 B.Illustrated exemplary display device 2040 comprises a shell 2041, and can comprise the additional assemblies that is closed at least in part wherein.For example, in one embodiment, exemplary display device 2040 comprises a network interface 2027, and it comprises that one is couple to the antenna 2043 of a transceiver 2047.Described transceiver 2047 is connected to the processor 2021 of regulating hardware 2052.Described adjusting hardware 2052 can be configured to regulate a signal (for example, filtering a signal).Regulate hardware 2052 and be connected to a loudspeaker 2045 and a loudspeaker 2046.Processor 2021 is connected to an input media 2048 and a driver controller 2029 again.Described driver controller 2029 is couple to one frame buffer 2028, and is couple to array driver 2022, and described array driver 2022 is couple to a display array 2030 again.As the designing institute requirement of particular exemplary display device 2040, a power supply 2050 is powered to all component.Networking interface 2027 comprises antenna 2043 and transceiver 2047, makes exemplary display device 2040 to communicate by letter with one or more device by a network.In one embodiment, network interface 2027 also can have some processing power to alleviate the demand to processor 2021.Described antenna 2043 is used to send any antenna with received signal for one of ordinary skill in the art are known.In one embodiment, described antenna sends and receives the RF signal according to IEEE 802.11 standards (comprising IEEE 802.11 (a) and (b) or (g)).In another embodiment, described antenna sends and receives the RF signal according to the BLUETOOTH standard.Under the situation of cellular phone, described antenna is used for known signal at a mobile phone intra network communication through being designed to receive CDMA, GSM, AMPS or other.Described transceiver 2047 is anticipated the signal that receives from antenna 2043, makes it to be received and further to be handled by it by processor 2021.The described transceiver 2047 same signals that receive from processor 2021 of handling make it to send from exemplary display device 2040 via antenna 2043.

In an alternate embodiment, transceiver 2047 can be replaced by a receiver.In another alternate embodiment, network interface 2027 can be replaced by the image source that can store or produce the view data that is sent to processor 2021.For example, described image source can be the software module that the digital video disk (DVD) that contains view data or a hard disk drive or produce view data.

Processor 2021 is the overall operation of control exemplary display device 2040 usually.Processor 2021 receives data, as the compressed view data from a networking interface 2027 or an image source, and described data processing is become raw image data or is processed into the form that is easy to be processed into raw image data.Then, processor 2021 treated data are sent to driver controller 2029 or send in order to the storage frame buffer 2028.Raw data is often referred to the information of the picture characteristics of each position in generation identification one image.For example, described picture characteristics can comprise color, saturation degree and gray level.

In one embodiment, processor 2021 comprises a microcontroller, CPU or logical block, with the operation of control exemplary display device 2040.Adjusting hardware 2052 generally includes and is used to send signal to loudspeaker 2045 and be used for from the amplifier and the filtrator of loudspeaker 2046 received signals.Adjusting hardware 2052 can be the dispersion assembly in the exemplary display device 2040, maybe can be incorporated in processor 2021 or other assemblies.

Driver controller 2029 directly obtains the raw image data that is produced by processor 2021 from processor 2021 or from frame buffer 2028, and suitably with described raw image data reformatting, to send to array driver 2022 at a high speed.Particularly, driver controller 2029 is reformatted as one with raw image data and has the data stream of similar raster format (raster-like format), makes it have one and is suitable for striding the time sequencing that display array 2030 scans.Then, driver controller 2029 will send to array driver 2022 through formative information.Although such as the driver controller 2029 of lcd controller usually as one independently integrated circuit (IC) be associated with system processor 2021, described controller can be implemented in many ways.It can be used as hardware and is embedded in the processor 2021, is embedded in the processor 2021 or can becomes one with array driver 2022 complete sets in hardware as software.

Usually, array driver 2022 receive from driver controller 2029 through formative information, and video data is reformatted as one group of parallel waveform, described waveform per second repeatedly is applied on hundreds of and thousands of sometimes lead-in wire from the x-y picture element matrix of display.

In one embodiment, driver controller 2029, array driver 2022 and display array 2030 are applicable to the display of any kind described herein.For example, in one embodiment, driver controller 2029 is the display controller or a bistable state display controller (for example, an interferometric modulator controller) of a routine.In another embodiment, array driver 2022 is the driver or a bistable state display driver (for example a, interferometric modulator display) of a routine.In one embodiment, a driver controller 2029 becomes one with array driver 2022.Described embodiment is ubiquitous in the system integrated such as cellular phone, wrist-watch and other small-area display equal altitudes.In another embodiment, display array 2030 is a typical display array or a bistable state display array (for example a, display that comprises an interferometric modulator array).

Input media 2048 allows the user to control the operation of exemplary display device 2040.In one embodiment, input media 2048 comprises that a keypad (such as qwerty keyboard or telephone keypad), a button, a switch, touch quick formula screen, a pressure-sensitive film or thermosensitive film.In one embodiment, loudspeaker 2046 is an input media of exemplary display device 2040.When loudspeaker 2046 was used for that data are inputed to described device, the user can provide voice command to control the operation of exemplary display device 2040.

As knowing in this technology, power supply 2050 can comprise various energy storing devices.For example, in one embodiment, power supply 2050 is a rechargeable battery, as nickel-cadmium battery or lithium ion battery.In another embodiment, power supply 2050 is the solar cell that a regenerative resource, a capacitor or comprise plastic solar cell and solar cell coating.In another embodiment, power supply 2050 is configured to receive electric energy from a wall outlet.

In some was implemented, the control programmability was present in several locational driver controllers that can be arranged in electronic display system as described above.In some cases, the control programmability is present in array driver 2022.Those one of ordinary skill in the art will recognize, above-mentioned optimization situation can be implemented in the hardware of any number and/or component software and various configuration.

Although show, described above detailed description, and pointed out to be applied to the novel feature of the present invention of each embodiment, but should understand, under the prerequisite that does not break away from spirit of the present invention, one of ordinary skill in the art can carry out various omissions, replacement and change for the form and the details of illustrated device or processing.It should be understood that because some feature can be independent of other features uses or implement, thereby the present invention can be embodied in the form of all features that do not provide this paper and set forth and benefit.

Claims (43)

1. electronic installation, it comprises:

One transparent substrates;

One is placed in the interferometric modulator array on the described transparent substrates, and wherein said array comprises one

A transmission layer and a reflection horizon;

One is placed in the protective finish between described transmission layer of at least a portion and the described reflection horizon; With

One is configured to increase the well heater of the temperature of described protective finish.

2. device according to claim 1, wherein said transparent substrates are sealed on the backboard forming an encapsulation, and wherein said interferometric modulator array is positioned at described encapsulation.

3. device according to claim 2, wherein said protective finish comprise an autoregistration individual layer.

4. device according to claim 3, wherein said autoregistration individual layer comprise a kind of in the following material: teflon, perfluoro decanoate, octadecyl trichlorosilane or dichlorodimethylsilane.

5. device according to claim 3, it further comprises at least one hole in the described encapsulation.

6. device according to claim 2, it further comprises the reservoir of a protective finish material, and a source of the Additional Protection coating in the described encapsulation can be served as in the described reservoir of wherein said protective finish material during a regeneration program.

7. device according to claim 1, wherein said protective finish is provided at least a portion of described transmission layer.

8. device according to claim 1, wherein said protective finish is provided at least a portion in described reflection horizon.

9. device according to claim 2, wherein said well heater is contained in the described encapsulation.

10. device according to claim 9, wherein said well heater comprise a lip-deep metal level in the described encapsulation.

11. device according to claim 10, wherein said metal level are one to be exclusively used in the part of the circuit that produces heat.

12. device according to claim 10, the described metal in the wherein said metal level comprises chromium or nickel.

13. device according to claim 1, wherein said well heater comprise one and comprise that the ring-type of described transmission layer goes between, wherein described ring-type lead-in wire is shorted to earthing potential when needs distribute described protective finish again.

14. device according to claim 13, wherein said ring-type lead-in wire is configured to changeable mode and is shorted to earthing potential.

15. device according to claim 14, wherein a MEMS (micro electro mechanical system) (MEMS) is used so that described ring-type lead-in wire is changeable.

16. device according to claim 1, wherein said well heater comprise one and comprise that the ring-type of a mechanical layer that is associated with described reflection horizon goes between, wherein described ring-type lead-in wire is shorted to earthing potential when needs distribute described protective finish again.

17. device according to claim 2, wherein said well heater are one to be arranged in the heating element on the pillar of described encapsulation.

18. device according to claim 2, wherein said well heater are positioned at top, described reflection horizon and described substrate top.

19. device according to claim 1, wherein said well heater are one to be positioned at the bus structure at a support member top, described support member is formed between described transmission layer and the described reflection horizon.

20. the method for regeneration one individual layer in a MEMS devices, it comprises:

One MEMS devices that comprises an interferometric modulator array and a well heater is provided, and wherein said interferometric modulator array comprises an individual layer; With

Encourage described well heater to increase the described temperature of described individual layer, the described individual layer of regenerating whereby.

Be sealed to a backboard to form the transparent substrates of an encapsulation 21. method according to claim 20, wherein said MEMS devices comprise one, and wherein said interferometric modulator array is positioned at described encapsulation.

22. method according to claim 20, wherein said individual layer comprise an autoregistration individual layer.

23. method according to claim 22, wherein said autoregistration individual layer comprise a kind of in the following material: teflon, perfluoro decanoate, octadecyl trichlorosilane or dichlorodimethylsilane.

24. method according to claim 21; wherein said interferometric modulator array comprises a reservoir of a monolayer material, and a source of the Additional Protection coating in the described encapsulation can be served as in the described reservoir of wherein said monolayer material in a regeneration program.

25. an electronic installation, it comprises:

Be used to support the member of a MEMS devices, wherein said MEMS devices comprises a transmission layer and a reflection horizon;

Be used to provide a member that is placed in the protective finish between described transmission layer of at least a portion and the described reflection horizon; With

Be used for by the regenerate member of described protective finish of the temperature that improves described protective finish.

26. electronic installation according to claim 25, wherein said supporting member comprises a transparent substrates.

27. electronic installation according to claim 25 wherein saidly is used to provide the member of a protective finish to be used to provide an autoregistration individual layer.

28. electronic installation according to claim 27, wherein said autoregistration individual layer comprise a kind of in the following material: teflon, perfluoro decanoate, octadecyl trichlorosilane or dichlorodimethylsilane.

29. electronic installation according to claim 25, wherein said regeneration member comprises a heating arrangement.

30. electronic installation according to claim 25, it further comprises:

One with the processor of described MEMS devices telecommunication, described processor is configured to image data processing; With

One with the storage arrangement of described processor telecommunication.

31. electronic installation according to claim 25, it further comprises one and is configured to the driving circuit that a near few signal sends to a display.

32. electronic installation according to claim 30, it further comprises a controller that is configured at least a portion of described view data is sent to described driving circuit.

33. electronic installation according to claim 30, it further comprises one and is configured to the image source module of described image data transmission to described processor.

34. electronic installation according to claim 33, wherein said image source module comprises at least one in a receiver, transceiver and the transmitter.

35. electronic installation according to claim 30, it further comprises an input media that is configured to receive the input data and described input data delivery is arrived described processor.

36. a method of making an electronic installation, it comprises:

One transparent substrates is provided;

Form a MEMS devices on described transparent substrates, wherein said array comprises a transmission layer and a reflection horizon;

One regeneration protective finish is provided between described transmission layer of at least a portion and described reflection horizon; With

One well heater is provided, and it is configured to heat described regeneration protective finish.

37. method according to claim 36, wherein said transparent substrates comprises glass.

38. method according to claim 36, wherein said MEMS devices are an interferometric modulator.

39. method according to claim 36, wherein said regeneration protective finish comprises an autoregistration individual layer.

40. method according to claim 36, wherein said regeneration protective finish comprise a kind of in the following material: teflon, perfluoro decanoate, octadecyl trichlorosilane or dichlorodimethylsilane.

41. method according to claim 36, the wherein temperature that increases of the response described protective finish of regenerating.

42. method according to claim 36 wherein is provided in described protective finish on the described transmission layer.

43. method according to claim 36 wherein is provided in described protective finish on the described reflection horizon.

Images