CN100461994C - Thermal gain thin-type electronic mechanism - Google Patents
Thermal gain thin-type electronic mechanism Download PDFInfo
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- CN100461994C CN100461994C CNB2005100746272A CN200510074627A CN100461994C CN 100461994 C CN100461994 C CN 100461994C CN B2005100746272 A CNB2005100746272 A CN B2005100746272A CN 200510074627 A CN200510074627 A CN 200510074627A CN 100461994 C CN100461994 C CN 100461994C
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Abstract
The invention supplies a configuration and forming method of a kind of thermal gain type and thin electronic element. The main design of electronic element configuration is that at least one electronic element system is installed on a metal layer between two layers of dielectric materials by pressing the two layers. Therefore, besides the excellent capability of signal transmission, this electronic element configuration has a distinct thermal gain efficacy.
Description
[technical field]
The present invention is about a kind of slimming electronic packaging, particularly about a kind of thin electronic encapsulation structure with thermal enhancement effect and forming method thereof.
[prior art]
The improvement of electronic packaging technology is considerable for the electronic industry technical development; Along with the miniaturization of electronic element products and demand such as lightening, the electronic packaging technology also must constantly be weeded out the old and bring forth the new, and to meet the needs of electronic element products, the beginning can further be brought into play functions such as its electric power transmission, signal transmission, heat radiation and protective circuit.
The miniaturization demand of electronic element products is also being represented the density that must improve interior connection (interconnect) circuit in the electronic component, to reach equal signal processing amount in a less component size.At present existing many documents have proposed in succession about connecting the assembling structure and the method for (HDI, high densitycircuit) circuit in the high density; For example, at United States Patent (USP) the 6th, 242, in No. 282, promptly disclosed a kind of formation method of superchip assembling structure; See also Fig. 1, it has shown the end view that utilizes the formed assembling structure of this method.In the method, circuit chip 10 and its chip pad 14 are placed an interior articulamentum 12 that has been pre-formed passage 122 and metal line 124, and with this passage 122 on this this interior articulamentum 12 of circuit chip 10 alignings, then utilize a bonding coat 16 and glutinous cover a structure package material 18 on this circuit chip 10, and form a complete assembling structure 1.
At United States Patent (USP) the 5th, 567, No. 657 and the 5th, 703, in No. 400, assembling structure of a kind of bilateral structure dress circuit module with articulamentum in the pliability and preparation method thereof is also proposed respectively; A structure package material is inserted in utilization between articulamentum in two pliabilities, be packaged in wherein with the circuit chip between will connecting in two possibilities, and then form passage and metal line etc. on interior articulamentum, and finish complete assembling structure.
In addition, the application applicant also proposed the Taiwan patent application (No. 93135698 application application) of " thin electronic encapsulation structure and preparation method thereof " on November 19th, 93 in the Republic of China, utilize an organic basal plate making process, mode with the relative pressing of two substrates, and when monolith substrate forms, finish the wiring of electronic component and structure dress simultaneously, simplified in the known structure packing technique relevant processing procedure as routing juncture, the automatic joining technique of coil type and chip bonding technology; In its formed electronic packaging structure of mat because of not having core layer (core layer) and projection (bump), thereby the overall volume of having reduced assembling structure, and make signal when transmitting, can not produce the phenomenon that the signal strength signal intensity ease is lost because of the conversion of contact interface, therefore can provide more superior performance.
Yet the correlation technique of above-mentioned various high density and slimming structure dress has only satisfied the demand about current density in the assembling structure and volume; And along with the lifting of current density in the electronic component and the minimizing of component size, more need to pay attention to the inside configuration heat dissipation problem that it is derived, influenced the overall performance of this electronic component because of the heat that is produced can't scatter and disappear in the time of just avoiding signal between circuit chip and assembling structure, to transmit.
The present application motivation promptly produces therefrom; The applicant is required in view of the tendency of the day, is through concentrated test and research, and a spirit of working with perseverance, and creates the application's " thermal gain thin-type electronic mechanism " finally.The present invention based on the applicant was proposed relevant before application-thin electronic encapsulation structure and preparation method thereof-and innovative techniques of further developing, its formed electronic packaging structure of mat except that have good signal transmit performance, have more significant thermal enhancement effect; In other words, the radiating effect that electronic packaging structure provided by the present invention is had obviously is better than the above-mentioned known techniques former of institute, thereby can further promote the performance of this electronic packaging structure and relevant electronic component thereof.
[summary of the invention]
First conception of the present invention is to provide a kind of electronic packaging structure, and this electronic packaging structure comprises one first dielectric materials layer, and it has one first upper surface and first lower surface; One second dielectric materials layer, it has one second upper surface and one second lower surface; One metal level, part are between this first lower surface and this second upper surface, and at least one electronic component between this first lower surface and this metal level, and is fixed in wherein by this first dielectric materials layer and this second dielectric materials layer are carried out pressing; A plurality of passages (Vias) run through this first dielectric materials layer and are connected to this electronic component; And a wiring layer, be positioned on this first upper surface of part, wherein have more a plurality of grooves on this second dielectric materials layer, and the position of these grooves corresponds to the position of these electronic components.
Second conception of the present invention is to provide a kind of electronic packaging structure, and this electronic packaging structure comprises one first dielectric materials layer, and it has one first upper surface and first lower surface; One second dielectric materials layer, it has one second upper surface and one second lower surface; One lead frame (leadframe-like carrier) between this first lower surface and this second upper surface, wherein have a plurality of groove (channel) on this lead frame, and these grooves is divided into a plurality of wire carriers with this lead frame; At least one electronic component, between this first lower surface and this lead frame, its position is corresponding to the position of these carriers, and is fixed in wherein by this first dielectric materials layer and this second dielectric materials layer are carried out pressing; A plurality of passages (Vias) run through this first dielectric materials layer and are connected to this electronic component; And a wiring layer, be positioned on this first upper surface of part.
According to above-mentioned conception, wherein this metal level more comprises a lead frame (leadframe-like carrier), has a plurality of groove (channel) on this lead frame, by this this lead frame is divided into a plurality of wire carriers.
According to above-mentioned conception, wherein this first dielectric materials layer and this second dielectric materials layer are made of a dielectric material.
According to above-mentioned conception, wherein this first dielectric materials layer comprise a gum Copper Foil (Resin CoatedCopper-foil, RCC) substrate, an ABF increase tunic (Ajinomoto Build-up Film, ABF) substrate and a bendable substrate one of them.
According to above-mentioned conception, wherein the material of this second dielectric materials layer is identical with this first dielectric materials layer.
According to above-mentioned conception, wherein this electronic component be an active electric sub-element and a passive type electronic component one of them.
According to above-mentioned conception, this electronic packaging structure comprises this a plurality of electronic components, and wherein these electronic components are selected from active electric sub-element, passive type electronic component and make up one of them.
According to above-mentioned conception, wherein this active electric sub-element be a chip, semiconductor, a transistor AND gate one integrated circuit one of them.
According to above-mentioned conception, wherein this passive type electronic component more comprise a separate type passive device and a built-in type passive device one of them.
According to above-mentioned conception, wherein this separate type passive device be a capacitor, a resistor and an inductance one of them.
According to above-mentioned conception, wherein this built-in type passive device be a capacitance material, an inductive material and a resistance material one of them.
According to above-mentioned conception, wherein, on this wiring layer, more comprise a plurality of tin balls (Ball).
According to above-mentioned conception, wherein this electronic component more is fixedly arranged on this wire carrier of this lead frame by a metal wire.
According to above-mentioned conception, wherein have more a groove on this wire carrier, and this electronic component is arranged in this groove.
The 3rd conception of the present invention is to provide a kind of electronic packaging method, and its step that comprises is: one first dielectric materials layer is provided; Provide a lead frame (Leadframe-like Carrier) on this first dielectric materials layer, wherein have a plurality of grooves on this lead frame, and these grooves are divided into a plurality of wire carriers with this lead frame; Provide an electronic component on these wire carriers; Provide one second dielectric materials layer on this electronic component, covering this first dielectric materials layer and this electronic component, and form a sandwich structure; This sandwich structure of pressing is so that this electronic component is fixed in wherein; Form a plurality of passages (Vias) on the sandwich structure of this pressing, these passages run through this second dielectric materials layer in this sandwich structure and are connected to this electronic component; Fill these passages; And form wiring figure (patterning) on this sandwich structure, with so in the enterprising row wiring of this sandwich structure.
According to above-mentioned conception, wherein this method more comprises a step: form a plurality of grooves respectively on these wire carriers.
According to above-mentioned conception, wherein this method is utilized an impact style (punching) or an etching mode (etching) and these groove shaped is formed on these wire carriers.
According to above-mentioned conception, wherein this electronic component is arranged in these grooves.
According to above-mentioned conception, wherein this method utilizes one to increase layer (Build-up) processing procedure and this second dielectric materials layer is formed on this electronic component.
According to above-mentioned conception, wherein this method is utilized a ultraviolet ray (UV) laser processing procedure, carbon dioxide (CO
2) gas laser processing procedure and a chemical etching processing procedure one of them and form these passages.
According to above-mentioned conception, wherein this method more comprises a step: this sandwich structure is carried out a green lacquer (Solder Mask) cover processing.
According to above-mentioned conception, wherein this method more comprises a step: this sandwich structure is carried out planting ball processing procedure (Ball Mounting).
According to above-mentioned conception, wherein this method more comprises a step: cut this sandwich structure, and form one of required electronic packaging element.
According to above-mentioned conception, wherein this method is filled these passages with a conductive material.
According to above-mentioned conception, wherein this first dielectric materials layer and this second dielectric materials layer comprise a gum copper clad laminate, an ABF increase tunic substrate and a bendable substrate one of them.
The application must be by following diagram and detailed description, in order to do a more deep understanding:
[description of drawings]
Fig. 1 one of is formed the assembling structure profile by utilizing known techniques;
Fig. 2 (a) is the electronic packaging structure fabrication flow chart according to one of the inventive method embodiment to Fig. 2 (h);
Fig. 3 is the profile according to the electronic packaging structure of first preferred embodiment of the present invention;
Fig. 4 is the profile according to the electronic packaging structure of second preferred embodiment of the present invention;
Fig. 5 is the profile according to the electronic packaging structure of the 3rd preferred embodiment of the present invention;
Fig. 6 (a)-(c) is the profile according to the electronic packaging structure of the 4th preferred embodiment of the present invention; And
Fig. 7 and Fig. 7 (a) be to (c), and the metal level in the electronic packaging structure of the present invention and the profile of lead frame are described.
[embodiment]
See also Fig. 2 (a) to (h), it has illustrated the manufacture method of thermal gain thin-type electronic mechanism of the present invention.At first the electronic component 20 of desiring to carry out the structure dress is placed institute one of to provide on the lead frame (leadframe-like carrier) 22, wherein this electronic component 20 is a chip (die); Shown in the vertical view of Fig. 2 (a), on this lead frame 22, have a plurality of groove 221, these grooves 221 are divided into a plurality of wire carrier 220 with this lead frame 22, and this electronic component 20 promptly places on these wire carriers 220.
Then, provide one first dielectric materials layer 24 and one second dielectric materials layer 26 in the outside of this electronic component 20 respectively with this lead frame 22, this electronic component 20 and this lead frame 22 are between this first dielectric materials layer 24 and this second dielectric materials layer 26 and formed a sandwich structure 2 by this, shown in Fig. 2 (b), wherein the dielectric material used by substrate of this first dielectric materials layer 24 and this second dielectric materials layer 26 is constituted; And then this sandwich structure 2 is carried out pressing (shown in the direction of arrow among the figure).
Shown in Fig. 2 (c), then remove this second dielectric materials layer 26 of part in the sandwich structure 2 of pressing, have a plurality of groove 261 on this dielectric materials layer 26 and make, this wire carrier 220 is exposed to these grooves 261 by this, is beneficial to the heat radiation of element.
No matter then, form a plurality of passages (Vias) on this first dielectric materials layer 24 in the sandwich structure of pressing, generally speaking, be ultraviolet ray (UV) laser, CO
2Gas laser or use chemical etching mode, all available so that these passages formation; So compared to other the two, utilize UV laser can form meticulousr between apart from (fine pitching), thereby in this example under not injuring under the prerequisite of square structure, forming these passages with UV laser is preferable selection.These passages run through this first dielectric materials layer 24 in this sandwich structure and are connected to this electronic component 20, and fill these passages with an electric conducting material, and form a plurality of conduction pathway 28, shown in Fig. 2 (d).
After these conduction pathways 28 form, wiring figureization (patterning) is carried out on these first dielectric materials layer, 24 surfaces that are formed with conduction pathway 28, and form a wiring layer 21, be beneficial to further at these sandwich structure 2 enterprising row wirings (wiring) and form stitching (trace), shown in Fig. 2 (e).
Carry out so far, begin to take shape with the formed electronic packaging structure of the inventive method; And be the protection internal structure that had of above-mentioned electronic packaging structure and avoid this electronic packaging structure in successive process, to be subjected to the influence of process conditions (as high temperature); method of the present invention also can cooperate a known green lacquer (SolderMask) to cover handling procedure; respectively at this first dielectric materials layer 24 and these second dielectric materials layer, 26 outer solder masks 23,25 that cover; to provide this electronic packaging structure one complete protection, shown in Fig. 2 (f).
And be the line-spacing (pitch) of keeping formed this electronic packaging structure, in the method for the invention, comprised one equally and planted ball processing procedure (ball mounting), so that a plurality of tin balls 27 are formed on the tin ball position pre-configured in this electronic packaging structure, shown in Fig. 2 (g); Then, with cutter sweep I above-mentioned this electronic packaging structure of finishing the structure dress is carried out cutting process (isolating/singulating) according to need, to form required single electronic packaging structure 200, shown in Fig. 2 (h).
In the method for the invention, this electronic component 20 is formed on this wire carrier 220 in the storing mode, and need not carry out (Bonding) program that engages with 220 of this wire carriers; So in a preferred embodiment, be subjected to the surrounding environment disturbance and be shifted for fear of this electronic component 20, also can further cooperate other junctures and this wire carrier 220 is engaged with this electronic component 20 of putting thereon, for example this electronic component 20 is connected on this wire carrier 220 with metal wire with routing juncture (Wire Bonding), and and then lead-in wire extended to whole electronic packaging structural outer, be beneficial to other electronic components between be connected.
In addition, structure dress mode of the present invention also is applicable to the dielectric material that multiple substrate is used; For example: gum Copper Foil (RCC, Resin Coated Copper-foil) substrate, ABF increase tunic (ABF, AjinomotoBuild-up Film) substrate and containing just like poly-vinegar ethamine (Polymide, PI), poly dimethyl silane (Polydimethylsiloxane, PDMS), liquid crystal polymer (Liquid Crystal Polymer, LCP) or poly-right-flexible base plate of phthalandione second diester organic materials such as (Polyethylene Terephthalate), to form a soft electronic element, will more expand its application.
See also Fig. 3, be profile according to the electronic packaging structure of first preferred embodiment of the present invention.This electronic packaging structure 300 is mainly adorned an electronic component 30 in order to structure, and this electronic component 30 sets in advance on a lead frame 32; This lead frame 32 is formed by a plurality of groove 321 and its a plurality of wire carriers 320 that are separated, and this electronic component 30 is positioned on these wire carriers 320.This electronic packaging structure 300 is by carrying out pressing to a dielectric materials layer 34 and this lead frame 32, and this electronic component 30 is fixed in wherein.In order to make this electronic packaging structure 300 can be connected in an external circuit or electronic installation (not shown), it has more a plurality of conduction pathway 38, these conduction pathways 38 run through this dielectric materials layer 34 and are connected to this electronic component 30 that is positioned at these electronic packaging structure 300 inside, and on the outer surface of these conduction pathways 38 and this dielectric materials layer 34, have wiring layer 31 and a plurality of tin balls 37, keep in order to the line-spacing of 38 of the connection of circuit and these conduction pathways; In addition; on the part outer surface of these conduction pathways 38 and this dielectric materials layer 34, also be covered with a solder mask 33; to protect the element and the circuit of these electronic packaging structure 300 inside, make it avoid being subjected to the interference of extraneous aqueous vapor, pollutant or follow-up high-temperature process.
See also Fig. 4, be profile according to the electronic packaging structure of second preferred embodiment of the present invention; What they were different with first embodiment (as shown in Figure 3) is that this electronic component 30 and this lead frame 32 are by being fixed between this first dielectric materials layer 34 and this second dielectric materials layer 36 pressing of one first dielectric materials layer 34 and one second dielectric materials layer 36.In addition, this second dielectric materials layer 36 is through partly removing and having more a plurality of groove 361, and 320 of this wire carriers are exposed to this groove 361 by this, in order to the usefulness of element radiating, reach the effect of thermal enhancement.Certainly, for avoiding extraneous aqueous vapor or pollutant one of this second dielectric materials layer 36 side in this electronic packaging structure 300 is produced harmful effect, thereby on this side, also be covered with a solder mask 35 equally.
See also Fig. 5, be profile according to the electronic packaging structure of the 3rd preferred embodiment of the present invention; This embodiment designs for the thermal enhancement effect that further promotes the electronic packaging structure.Different with aforementioned two embodiment (as shown in Figure 3 and Figure 4) be in, the metal level 52 that thickens with some replaces the use of this lead frame, wherein this electronic component 30 is positioned on the thickening 520 of this metal level 52, and this thickening 520 protrudes in the part surface of this second dielectric materials layer 36 and this solder mask 35, by this heat that this electronic component 30 is produced when operating is directly derived this electronic packaging structure 300.
See also Fig. 6 (a)-(c), be profile according to the electronic packaging structure of the 4th preferred embodiment of the present invention; In this electronic packaging structure 600, an electronic component 60 sets in advance on a metal level 62; The pressing welding that the dielectric materials layer of forming by a dielectric material 64 and this metal level are 62, this electronic component 60 thereby be fixed in wherein.This electronic packaging structure 600 has more a plurality of conduction pathway 68a and 68b, wherein conduction pathway 68a is connected to this electronic component 60, and conduction pathway 68b then runs through this dielectric materials layer 64 and is connected to a plurality of tin balls 67 that are positioned at these electronic packaging structure 300 bottoms; Same, have wiring layer 61 and these tin balls 67 in the outside of these conduction pathways 68a, 68b, in order to the connection of circuit.In addition; on the part outer surface of these conduction pathways 68a, 68b and this dielectric materials layer 64, also be covered with a solder mask 63; to protect the element and the circuit of these electronic packaging structure 600 inside, make it avoid being subjected to the interference of extraneous aqueous vapor, pollutant or follow-up high-temperature process.
In this embodiment, it is outer near one of these metal levels 62 side that these tin balls 67 are formed at this electronic packaging structure 600, and this electronic packaging structure 600 further is connected on the substrate 650 that a system or Barebone use (as Fig. 6 (b) with shown in Fig. 6 (c)) via these tin balls 67; Because this metal level 62 is connected with these substrate 650 direct contacts and metal gets the height heat conductivity, thereby the heat that produced in this electronic packaging structure 600 can be derived this electronic packaging structure 600 (shown in arrow direction among Fig. 6 (c)) in the mode of direct conduction, and produce tangible thermal enhancement, reach superior radiating effect.
Certainly, each above-mentioned embodiment is only for illustrating usefulness of the present invention, the modular construction of right electronic packaging of the present invention inside can be according to the actual functional capability demand design variation in addition, for example utilize multilayer dielectric material layer, lead frame and electronic component are carried out multiple-level stack and pressing, and form mentioned two-dimentional chip-stacked assembling structure and three-dimensional chip stacked structure structure in preceding application as the applicant, or even chip stack structure more multi-layered, diversified function, and more known person is provided better assembling structure size and radiating effect.
In addition, see also Fig. 7 and Fig. 7 (a) to (c), in the present invention, when avoiding that electronic component 70 is placed on the metal level or the wire carrier 72 of lead frame, can be subjected to external interference and depart from its position, can utilize punching press (punching) or etch processes modes such as (etching/half etching) on this metal level or this wire carrier 72, to form corresponding groove 725 earlier, and this electronic component 70 is positioned in this groove 725; Such design not only can be avoided electronic component 70 to be disturbed and be shifted, and also can reduce the whole height of formed electronic packaging structure, and then reduce its overall volume and promote its performance.
What is more, shown in Fig. 7 (c), can utilize the mode of routing joint and directly connect this electronic component 70 and this wire carrier 72 with metal wire 724, except the fixation degree that improves this electronic component 70, also can directly extend this metal wire 724 to the outside of these electronic packaging structure 700 integral body and become an I/O lead (Lead I/O) 726, be beneficial to other electronic components between be connected.
In the present invention, the formed dielectric materials layer of employed structure package material one dielectric material, the electronic component structure that will desire the structure dress by the pressing mode is loaded on wherein, to bring into play functions such as its electric power transmission, signal transmission, heat radiation and protective circuit; And except above-mentioned dielectric materials layer, also can use gum Copper Foil (RCC, Resin Coated Copper-foil) substrate, ABF increase tunic (ABF, Ajinomoto Build-upFilm) substrate, and other contain just like poly-vinegar ethamine (Polymide, PI), poly dimethyl silane (Polydimethylsiloxane, PDMS), liquid crystal polymer (Liquid Crystal Polymer, LCP) or poly-right-flexible base plate of phthalandione second diester organic materials such as (Polyethylene Terephthalate).
In addition, be applicable to that kinds of electronic components of the present invention is also quite extensive, except common chip (die), other electronic components of commonly using such as active electric sub-element and passive type electronic component etc. also can be separately or common combination and structure is loaded in the electronic packaging structure 6 of the present invention.For example, Chang Yong active element has more comprised semiconductor (Semiconductor), transistor (Transistor) and integrated circuit (IC) etc.; The passive type electronic component then comprises as separate type (Discrete) passive devices such as capacitor, resistor and inductance, and by the formed built-in type of capacitance material, inductive material or resistance material (Build-in) passive device etc.
Ball grid array (the BGA that is paid attention in the present industry, Ball Grid Array) structure packing technique, in utilizing the formed electronic packaging structure of the present invention, because of not needing core layer (core layer), and its needed structure dress size (PKG size) is less, thereby electronic packaging structure of the present invention can have smaller volume; In addition, more owing to the direct pressing of the present invention about electronic component and two dielectric material interlayers, therefore formed electronic packaging structure has less I/O apart from length, can present preferable performance and application.
On the other hand, the present invention arranged in pairs or groups metal level and lead frame design and form a thermal enhancement type electronic packaging structure, because the good heat conduction property of metal level and lead frame, thereby the heat that produces when executable operations of the electronic component of institute of the present invention structure dress can directly derive this electronic packaging structure by this metal level and lead frame, to reach superior radiating effect; And electronic packaging structure of the present invention forms in a mode that simply is easy to implement, and is suitable for the dielectric material that multiple substrate commonly used is at present used, and has the utilizability on the industry.Therefore the present invention is the invention of a novelty, progress and tool industrial applicability in fact, dark tool dynamogenetic value.
The present invention must be thought and is to modify as all by the people Ren Shi craftsman who is familiar with skill, does not so take off as Protector that attached application range is desired.
Claims (10)
1. electronic packaging structure comprises:
One first dielectric materials layer has one first upper surface and first lower surface;
One second dielectric materials layer has one second upper surface and one second lower surface;
One metal level, the part between this first lower surface and this second upper surface,
At least one electronic component between this first lower surface and this metal level, and is fixed in wherein by this first dielectric materials layer and this second dielectric materials layer are carried out pressing;
A plurality of passages run through this first dielectric materials layer and are connected to this electronic component; And
One wiring layer is positioned on this first upper surface of part,
Wherein have more a plurality of grooves on this second dielectric materials layer, and the position of this groove corresponds to the position of this electronic component.
2. structure according to claim 1 is characterized in that this metal level more comprises a lead frame, has a plurality of grooves on this lead frame, by this this lead frame is divided into a plurality of wire carriers, wherein:
The position of this electronic component is corresponding to the position of this carrier; Or
This electronic component more is fixedly arranged on this wire carrier of this lead frame by a metal wire; Or
Have more a groove on this wire carrier, and this electronic component is arranged in this groove.
3. structure according to claim 1 is characterized in that:
This first dielectric materials layer comprise a gum copper clad laminate, an ABF increase tunic substrate and a bendable substrate one of them; And
The material of this second dielectric materials layer is identical with this first dielectric materials layer.
4. structure according to claim 1 is characterized in that:
This electronic component be an active electric sub-element and a passive type electronic component one of them, wherein:
This active electric sub-element be a chip, semiconductor, a transistor AND gate one integrated circuit one of them; And
This passive type electronic component more comprise a separate type passive device and a built-in type passive device one of them, wherein:
This separate type passive device be a capacitor, a resistor and an inductance one of them; And
This built-in type passive device be a capacitance material, an inductive material and a resistance material one of them.
5. structure according to claim 1 is characterized in that, more comprises a plurality of tin balls on this wiring layer.
6. electronic packaging method, its step that comprises is:
(a) provide one first dielectric materials layer;
(b) provide a lead frame on this first dielectric materials layer, wherein have a plurality of grooves on this lead frame, and this groove is divided into a plurality of wire carriers with this lead frame;
(c) provide an electronic component on this wire carrier;
(d) provide one second dielectric materials layer on this electronic component, covering this first dielectric materials layer and this electronic component, and form a sandwich structure;
(e) this sandwich structure of pressing is so that this electronic component is fixed in wherein;
(f) form a plurality of passages on the sandwich structure of this pressing, this passage runs through this second dielectric materials layer in this sandwich structure and is connected to this electronic component;
(g) fill this passage; And
(h) form wiring figure on this sandwich structure, with so that in the enterprising row wiring of this sandwich structure.
7. method according to claim 6 is characterized in that:
This step (b) more comprises a step (b1): form a plurality of grooves respectively on this wire carrier, and this step (b1) is utilized an impact style or an etching mode and this groove shaped is formed on this wire carrier; And
This electronic component is arranged in this groove.
8. method according to claim 6 is characterized in that:
This step (d) utilizes one to increase layer processing procedure and this second dielectric materials layer is formed on this electronic component; Or
This step (f) utilize a ultraviolet laser processing procedure, carbon dioxide gas volumetric laser processing procedure and a chemical etching processing procedure one of them and form this passage; Or
After this step (h), more comprise a step: this sandwich structure is carried out a green lacquer cover processing.
9. method according to claim 6, it more comprises a step after step (h):
This sandwich structure is carried out planting the ball processing procedure; And/or
Cut this sandwich structure, and form one of required electronic packaging element.
10. method according to claim 6 is characterized in that:
This step (g) is filled this passage with a conductive material; And/or
This first dielectric materials layer and this second dielectric materials layer comprise a gum copper clad laminate, an ABF increase tunic substrate and a bendable substrate one of them.
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| CNB2005100746272A CN100461994C (en) | 2005-05-25 | 2005-05-25 | Thermal gain thin-type electronic mechanism |
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| CNB2005100746272A CN100461994C (en) | 2005-05-25 | 2005-05-25 | Thermal gain thin-type electronic mechanism |
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| CN100461994C true CN100461994C (en) | 2009-02-11 |
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