CN100474185C - Method for inspecting substrate processing apparatus - Google Patents
Method for inspecting substrate processing apparatus Download PDFInfo
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- CN100474185C CN100474185C CNB200610001489XA CN200610001489A CN100474185C CN 100474185 C CN100474185 C CN 100474185C CN B200610001489X A CNB200610001489X A CN B200610001489XA CN 200610001489 A CN200610001489 A CN 200610001489A CN 100474185 C CN100474185 C CN 100474185C
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The present invention provides a method of inspecting a substrate processing apparatus that enables a reduction in operator labor time to be achieved. A host computer instructs a substrate processing apparatus to prohibit transfer of a product wafer into the substrate processing apparatus during a period of cleaning the substrate processing apparatus. The substrate processing apparatus notifies the host computer of a number and types of inspection wafers to be used in inspections for predetermined inspection items. The host computer notifies the substrate processing apparatus that preparation of the inspection wafers has been completed.
Description
Technical field
The present invention relates to the inspection method of substrate board treatment and store the recording medium of implementing the scrutiny program that this method uses, particularly relate to the inspection method of the substrate board treatment that communicates mutually with principal computer.
Background technology
Present stage, in making the factory of semiconductor device, dispose the wafer that is used to make semiconductor device is carried out the substrate board treatment of etch processes and will be supplied to the wafer feedway etc. of this substrate board treatment as accommodating the wafer transfer box (FOUP:Front Opening UnifiedPod) of a plurality of goods with the accepting container of wafer.In addition, in factory, also dispose the principal computer (hereinafter to be referred as " main frame ") of the work of control basal plate treating apparatus and wafer feedway, when making semiconductor device, main frame and substrate board treatment and the collaborative work of wafer feedway.
Substrate board treatment comprises: as the treatment chamber of application of vacuum chamber; Be connected on this treatment chamber, as the load lock chamber of conveying chamber; Place the wafer transfer box mounting table of wafer transfer box; And be configured between load lock chamber and the wafer transfer box mounting table, as the charging unit of conveying chamber, communicate by telecommunication cable and main frame.In addition, wafer transfer device is the mechanical arm that oneself moves that can place wafer transfer box, and carries out radio communication with main frame.
Yet in substrate board treatment, along with the passing of working time, particle can change with the etching speed of wafer because of this particle that adheres to causes goods attached in the treatment chamber, and goods increase with the particle adhesion amount on the wafer.Therefore, after working time, be necessary to open the lid of treatment chamber,, for example, carry out wet-cleaned with alcohol to cleaning in the chamber through regulation.
Given this, main frame managed the working time of substrate board treatment, and under the situation through the regulation working time, the indication substrate board treatment is transferred to the hold mode of carrying out cleaning usefulness in the chamber.In the substrate board treatment of transferring to hold mode, carry out the cleaning in the chamber, after in to this chamber, having carried out cleaning, be not to carry out the etch processes of goods at once, but at first check the inspection processing that substrate board treatment is used with wafer.Particularly, the known inspection that substrate board treatment is carried out is automatically handled and is called automatic recovery processing (to call " adjusting automatically " in the following text), being used to implement this self-adjusting enforcement (for example triggers, open the 2002-25878 communique with reference to the Jap.P. spy), under the situation of the working time that process is stipulated, be sent to substrate board treatment.
Yet in substrate board treatment, present stage is in carrying out self-adjusting process, owing to not carrying out communicating by letter of main frame and substrate board treatment, so produced following problem.
In self-regulating process, content according to the inspection of substrate board treatment, be necessary will with goods with the different inspection of wafer with wafer transport in substrate board treatment, but, even main frame will contain goods by the wafer feedway mistakenly and be supplied to substrate board treatment with the wafer transfer box of wafer, substrate board treatment can not be known the kind that is housed in the wafer in the wafer transfer box of being supplied with.Therefore, in adjusting automatically, give substrate board treatment with wafer transport with goods.
In addition, automatically the scope of examination in adjusting, promptly contents processing (method) is only managed by substrate board treatment, so, main frame can not be known the scope of examination, can not be supplied to substrate board treatment with the wafer transfer box of wafer with containing corresponding to the inspection of the scope of examination.
In order to address these problems, in adjusting automatically, main frame and substrate board treatment are under the jurisdiction of operator (operator) respectively, these operators work in coordination, the scope of examination according to substrate board treatment, decision is housed in the kind and the number of the inspection usefulness wafer in the wafer transfer box, confirms to contain which kind of wafer in the wafer transfer box.Therefore, there is operator's problem that needs spend a large amount of man-hours in order to adjust automatically.
Summary of the invention
The object of the present invention is to provide a kind of inspection method of the substrate board treatment that can reduce operator labor time and the storage medium of the scrutiny program that this method of storage implementation is used.
To achieve these goals, first kind of mode of the present invention, provide a kind of inspection method of substrate board treatment, this method is the inspection method of the substrate board treatment that communicates mutually with the external control device, it is inspection method to the substrate board treatment checked of inspection item of regulation, wherein, the inspection method of this substrate board treatment comprises the following steps: in cleaning period of aforesaid substrate treating apparatus, the said external control device to the aforesaid substrate treating apparatus indication forbid in this substrate board treatment, carrying goods to forbid indicating step with the substrate conveying with the goods of substrate; The aforesaid substrate treating apparatus will be in the inspection of the inspection item of afore mentioned rules employed inspection with the kind and the number of substrate, be notified to the inspection substrate notifying process of said external control device; And the said external control device finishes the above-mentioned inspection preparation with substrate, and the inspection that is notified to the aforesaid substrate treating apparatus is prepared the end notification step with substrate.
If adopt the structure of above-mentioned first kind of mode, then in cleaning period of substrate board treatment, from the external control device substrate board treatment indication is forbidden carrying the goods substrate in this substrate board treatment, from substrate board treatment will be the inspection of inspection item of regulation employed inspection with the kind and the number of substrate, be notified to the external control device, to check that from the external control device preparation with substrate finishes, and is notified to substrate board treatment.Therefore, can not only forbid in substrate board treatment, carrying the goods substrate, and because substrate board treatment can be notified the kind of the substrate of preparing, so can prevent from reliably goods are transported in the substrate board treatment with substrate.In addition, because the external control device can be notified kind and the number of checking with substrate, so can prepare inspection substrate corresponding to inspection item.Therefore, can reduce operator labor time.
The inspection method of substrate board treatment preferably includes the following step: the inspection end notification step of said external control device given the inspection end notification of above-mentioned inspection item by the aforesaid substrate treating apparatus; And the notice that finishes according to above-mentioned inspection, the said external control device to the aforesaid substrate treating apparatus indication remove and forbid in this substrate board treatment, carrying said products to carry to forbid removing with substrate indicating step with the goods of substrate.
If adopt the structure of above-mentioned first kind of mode, then since from substrate board treatment with the inspection end notification of inspection item to the external control device, according to checking the notice that finishes, from the external control device substrate board treatment indication releasing is forbidden carrying the goods substrate in this substrate board treatment, so after the inspection of substrate board treatment, the processing of goods can be automatically begun, thereby more operator labor time can be reduced with substrate.
The inspection method of substrate board treatment preferably includes: when carrying out the inspection of above-mentioned inspection item, under the also unripe situation, the aforesaid substrate treating apparatus is to the warning notice step of above-mentioned external control device notification alert with substrate in the inspection of using in this is checked.
If adopt the structure of above-mentioned first kind of mode, then because when carrying out the inspection of inspection item, the inspection of using in this is checked is with substrate under the also unripe situation, from substrate board treatment to outside control device notification alert, so the external control device can be warned according to this, prepare to check and use substrate, therefore, can reduce the stand-by time of substrate board treatment.
The inspection method of substrate board treatment preferably includes: the aforesaid substrate treating apparatus stores the inspection item edited as the inspection item of afore mentioned rules edit check project storing step.
If adopt the structure of above-mentioned first kind of mode, then owing to substrate board treatment stores the inspection item of being edited as the inspection item of stipulating, so in the inspection of later next time substrate board treatment, the inspection item of being edited can be used neatly, thereby operator labor time can be further reduced.
To achieve these goals, the second way of the present invention, provide a kind of inspection method of substrate board treatment, this method is the inspection method of the substrate board treatment that communicates mutually with the external control device, it is inspection method to the substrate board treatment checked of inspection item of regulation, the inspection method of this substrate board treatment comprises the following steps: that according to the input signal to the aforesaid substrate treating apparatus aforesaid substrate treating apparatus is forbidden carrying goods to be carried with substrate with the goods of substrate and forbidden step in this substrate board treatment; The aforesaid substrate treating apparatus will be in the inspection of the inspection item of afore mentioned rules employed inspection with the kind and the number of substrate, be notified to the inspection substrate notifying process of said external control device; And the said external control device finishes the above-mentioned inspection preparation with substrate, and the inspection that is notified to the aforesaid substrate treating apparatus is prepared the end notification step with substrate.
If adopt the structure of the above-mentioned second way, then according to input signal to substrate board treatment, forbid in this substrate board treatment, carrying the goods substrate, from kind and the number of will be the inspection of inspection item the employed inspection of substrate board treatment with substrate, be notified to the external control device, to check that from the external control device preparation with substrate finishes, and is notified to substrate board treatment.Therefore, because substrate board treatment can be known the kind of the substrate of being prepared, so can prevent that goods are transported in the substrate board treatment with substrate.In addition, because the external control device can be known kind and the number of checking with substrate, so can prepare inspection substrate corresponding to inspection item.Therefore, can reduce operator labor time.In addition, owing to, can forbid in substrate board treatment, carrying the goods substrate, so can not increase operator labor time, sequential that can be according to the rules, the inspection of the inspection item of stipulating according to the input signal of substrate board treatment.
The inspection method of substrate board treatment preferably includes: when carrying out the inspection of above-mentioned inspection item, under the also unripe situation, the aforesaid substrate treating apparatus is to the warning notice step of above-mentioned external control device notification alert with substrate in the inspection of using in this is checked.
If adopt the structure of the above-mentioned second way, then because when carrying out the inspection of inspection item, the inspection of using in this is checked is with substrate under the also unripe situation, from substrate board treatment to outside control device notification alert, so the external control device can be warned according to this, prepare to check and use substrate, therefore, can reduce the stand-by time of substrate board treatment.
The inspection method of substrate board treatment preferably includes: the aforesaid substrate treating apparatus stores the inspection item edited as the inspection item of afore mentioned rules edit check project storing step.
If adopt the structure of the above-mentioned second way, then owing to substrate board treatment stores the inspection item of being edited as the inspection item of stipulating, so in the inspection of later next time substrate board treatment, the inspection item of being edited can be used neatly, thereby operator labor time can be further reduced.
To achieve these goals, the third mode of the present invention, provide a kind of storage medium, this storage medium is to calculate the storage medium that function reads, in this storage medium, store in the inspection method of the substrate board treatment that communicates mutually with the external control device, carry out the scrutiny program of inspection method of substrate board treatment of the inspection of the inspection item stipulate by computing machine, said procedure comprises: in cleaning period of aforesaid substrate treating apparatus, the said external control device to the aforesaid substrate treating apparatus indication forbid in this substrate board treatment, carrying goods to forbid indicating module with the substrate conveying with the goods of substrate; The aforesaid substrate treating apparatus will be in the inspection of the inspection item of afore mentioned rules employed inspection with the kind and the number of substrate, be notified to the inspection substrate notification module of said external control device; And the said external control device finishes the above-mentioned inspection preparation with substrate, and the inspection that is notified to the aforesaid substrate treating apparatus is prepared the end notification module with substrate.
To achieve these goals, the 4th kind of mode of the present invention, provide a kind of storage medium, this storage medium is to calculate the storage medium that function reads, store in this storage medium in the inspection method of the substrate board treatment that communicates mutually with the external control device, carry out the scrutiny program of inspection method of substrate board treatment of the inspection of the inspection item stipulate by computing machine, said procedure comprises: according to the input signal to the aforesaid substrate treating apparatus, the aforesaid substrate treating apparatus will be forbidden in this substrate board treatment that the goods of carrying goods to be notified to the said external control device with substrate are carried with substrate and forbid notification module; The aforesaid substrate treating apparatus will be in the inspection of the inspection item of afore mentioned rules employed inspection with the kind and the number of substrate, be notified to the inspection substrate notification module of said external control device; And the said external control device finishes the above-mentioned inspection preparation with substrate, and the inspection that is notified to the aforesaid substrate treating apparatus is prepared the end notification module with substrate.
Other purposes of the present invention, feature and advantage can obtain clear and definite from the following detailed description of being carried out with reference to accompanying drawing time the of the present invention.
Description of drawings
Fig. 1 is the planimetric map of brief configuration of substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to first embodiment of the invention.
Fig. 2 is the sequence chart of inspection method of the substrate board treatment of expression present embodiment.
Fig. 3 is the figure of display part of operation control of substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to second embodiment of the invention.
Fig. 4 is the sequence chart of inspection method of the substrate board treatment of expression present embodiment.
Fig. 5 A and 5B are the brief configuration planimetric maps of another substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to the present invention first and second embodiment, Fig. 5 A is the figure of the combined substrate board treatment of expression, and Fig. 5 B is the figure of the substrate board treatment that transfer arm is arranged of expression both arms type.
Fig. 6 is the planimetric map of brief configuration of variation of substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to first embodiment of the invention.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.
At first, the inspection method to the substrate board treatment of first embodiment of the invention describes.
Fig. 1 is the planimetric map of brief configuration of substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to first embodiment of the invention.
In Fig. 1, comprise as the substrate board treatment 10 of etch processes device: two processing boats (process ship) 14 that wafer (to call " goods wafer " in the following text) W that semiconductor device is used handles; Place three wafer transfer box mounting tables 15 of aftermentioned wafer transfer box 23 respectively in the above; The calibration in advance goods steady arm (orienter) 16 of the position of wafer W; And the charging unit 18 of the general conveying chamber of conduct of rectangular shape.
Handling boat 14 comprises: block by block to goods with wafer W carry out etch processes, as the processing unit 11 of substrate processing chamber; With handing-over goods in this processing unit 11 with the ring-like type load lock chamber (link-type single pick type), that be built-in with conveying arm 12 (load lock chamber) 13 of selecting separately of wafer W.
In substrate board treatment 10, two processing boats 14, three wafer transfer box mounting tables 15 and steady arm 16 releasably are connected on the charging unit 18, handle boat 14 and wafer transfer box mounting table 15 unit 18 of will feed and be clipped in the middle and relative configuration, steady arm 16 is configured in vertical end of the unit 18 of feeding.
In processing unit 11, will handle gas and import in the chamber, by producing electric field between upper electrode and lower electrode, and the processing gas that will import activates, thereby produces plasma, with this plasma goods is carried out etch processes with wafer W.
The internal pressure of charging unit 18 maintains atmospheric pressure, and on the other hand, the internal pressure of processing unit 11 maintains vacuum.For this reason, each handles the load lock chamber 13 of boat 14 by having vacuum family of power and influence (not shown) at the connecting portion with processing unit 11, having atmosphere family of power and influence (not shown) at the connecting portion with the unit 18 of feeding simultaneously, is used as can adjusting the vacuum preparation conveying chamber of its internal pressure and constituting.
Conveying arm 12 is set at the substantial middle position of load lock chamber 13 inside, and first impact damper 20 is arranged on processing unit 11 1 sides near this conveying arm 12, and second impact damper 21 is arranged on charging unit 18 1 sides near conveying arm 12.First impact damper 20 and second impact damper 21 are configured on the moving track of the support goods that dispose on the leading section of conveying arm 12 with support portion (pick-up) 12a of wafer W.
In addition, substrate board treatment 10 has the control part 17 of the work of each inscape of control, also has the operation control 22 on the vertical end that is configured in charging unit 18.
In addition, control part 17 is connected control basal plate treating apparatus 10 or the described AGV as the wafer feedway in back (Automated Guided Vehicle: automatic guided vehicle) on the principal computer of 25 work (hereinafter to be referred as " main frame ") 26, communicate by telecommunication cable and this main frame 26.AGV25 is an automatic control type conveying mechanical arm of carrying wafer transfer box 23, carries out radio communication with main frame 26.
In substrate board treatment 10, carrying out under the situation of etch processes with wafer W to goods, conveying arm mechanism 19 takes out a goods wafer W from wafer transfer box 23, and be sent in the steady arm 16, steady arm 16 calibration in advance goods are used the position of wafer W, and conveying arm mechanism 19 sends into goods in the load lock chamber 13 of a processing boat 14 with wafer W from steady arm 16 again.
Secondly, the conveying arm 12 of this processing boat 14 receives the goods wafer W of sending in the load lock chamber 13, and it is sent into processing unit 11,11 pairs of goods of sending into of processing unit carry out etch processes with wafer W, conveying arm 12 will carry out the goods of etch processes and send load lock chamber 13 with wafer W, and give conveying arm mechanism 19.Receiving the goods that carry out etch processes is sent to goods in the wafer transfer box 23 with wafer W with the conveying arm mechanism 19 of wafer W.
In this substrate board treatment 10, after the working time through regulation, the lid of the chamber of processing unit 11 is opened, and indoor alcohol carries out wet-cleaned in the chamber.In addition, after wet-cleaned, carry out returning processings (to call " adjustment (auto setup) automatically " in the following text) automatically as what judge that substrate board treatment 10 inspection whether operate as normal is used handles.
In adjusting automatically, carry out the inspection of a plurality of inspection items successively.The inspection item that carries out in adjusting automatically is divided into: do not use and check the inspection item of using wafer and use the inspection item of checking with wafer.
As not using the inspection item of checking with wafer, be fit to vacuum tightness inspection, leak test, pressure gauge inspection and flowmeter inspection etc.
In vacuum tightness is checked, when reducing pressure in the chamber of substrate board treatment 10, check the vacuum tightness that this chamber may reach; In leak test, when reducing pressure in the chamber, check that leakages such as whether air takes place advance in the chamber.In addition, in pressure gauge is checked, carry out the inspection of manometric or sensitivity in the chamber at 0, in flowmeter is checked, carry out to handle indoor FCS (the Flow Control System: the inspection of the stability of 0 in flowmeter flow control system) or flow of gas feeding chamber.
As the inspection item of use inspection, be fit to ageing, particle inspection, etching speed inspection and test processing etc. with wafer.
In ageing, the polylith inspection is carried out predetermined processing with wafer by processing unit 11, whether the atmosphere in the inspection chamber etc. are stable, so that it is consistent with the defined terms of suitable etch processes, in particle is checked, check since will check with wafer send into substrate board treatment 10 interior and attached to this inspection with the number of particles on the wafer, in etching speed is checked, inspection is carried out the etching speed of the inspection of etch processes with wafer by processing unit 11, in test is handled, in ageing, after particle and etching speed inspection finish, carry out etch processes to checking with wafer under with the identical condition of the treatment conditions of wafer W, check whether can obtain desirable quality with goods.
The inspection that ageing, particle inspection, etching speed inspection and test are used in handling is different mutually with the kind of wafer, and the inspection of using in certain inspection item can not be used for other inspection items with wafer.Therefore, in automatically adjusting, be necessary with the management of wafer corresponding to the inspection of inspection item.
In adjusting automatically, do not need all to implement above-mentioned each inspection item, also can change the inspection item of implementing corresponding to the state of substrate board treatment 10, for example corresponding to the kind of the chamber interior part that exchanges in the wet-cleaned.
In substrate board treatment 10, the HDD of control part 17 stores the different a plurality of automatic adjusting method (contents processing) of inspection item of enforcement, and before implementing adjustment automatically, the operator selects desirable automatic adjusting method in operation control 22.In addition, automatic adjusting method can be edited in operation control 22, specifically, and operator's deletion by carrying out inspection item and appending in operation control 22, and can edit automatic adjusting method.The automatic adjusting method of being edited by the operator is stored among the HDD of control part 17 (edit check project storing step).
Fig. 2 is the sequence chart of inspection method of the substrate board treatment of expression present embodiment.
At first, main frame 26 is judged necessary cycle of wet-cleaned of the chamber of the processing unit 11 whether the accumulative total working time of substrate board treatment 10 is fit to predesignate, its result, under the situation of concluding the suitable necessary cycle of wet-cleaned, promptly begin under the situation in period (S201) in the wet-cleaned of confirming to reach chamber, main frame 26 sends to substrate board treatment 10 to be forbidden sending into goods in the processing unit 11 (to call " object handles unit " in the following text) that wet-cleaned begins the chamber in period and forbidding trigger pulse (S202) (goods are sent into substrate and forbidden indicating step) with sending into of wafer W to having to be identified to arrive.
In S201, also can not main frame 26 but judge necessary cycle of wet-cleaned of the chamber whether working time of substrate board treatment 10 is fit to predesignate by the operator, in the case, if the operator confirms the wet-cleaned that reaches chamber and begins the cycle that then the operator sends into to substrate board treatment 10 to main frame 26 transmissions and forbids trigger pulse.
Forbid in the trigger pulse information of the indication of the atmosphere opening that the additional lid that has substrate board treatment 10 automatically to open chamber is used sending into.In addition, forbid in the trigger pulse sending into, can be attached to also that self-adjusting execution finishes the back, indication substrate board treatment 10 also can automatically be removed and forbid sending into the information of goods with wafer W in the object handles unit.
Received that sending into the substrate board treatment 10 of forbidding trigger pulse transfers to the state (S203) of forbidding sending into goods usefulness wafer W in the object handles unit, forbids sending into the notice (S204) of goods with wafer W to the object handles unit to main frame 26 reports.At this moment, substrate board treatment 10 also can will send to main frame 26 about forbidding sending into goods with the alarm of wafer W to the operator.
Receive from substrate board treatment 10 and to forbid sending into the main frame 26 of goods, stop by storing the conveying to substrate board treatment 10 (S205) that the AGV25 of goods with the new wafer transfer box 23 of wafer W carries out with the report of the notice of wafer W to the object handles unit.
After this, substrate board treatment 10 judges whether all to send from the object handles unit goods that carry out etch processes with wafer W (S206), under situation about not sending, proceed the etch processes of goods with wafer W, under situation about having sent, make the object handles unit transfer to hold mode, open the atmosphere opening (S207) that the lid of chamber is used, the notice of carrying out the atmosphere opening of chamber is reported to main frame 26 (S208).In addition, in order to carry out atmosphere opening, be necessary the temperature in the chamber is adjusted into normal temperature in advance, so, before the report of the notice of the atmosphere opening that carries out chamber, make the temperature variation in the chamber, in the moment that reaches normal temperature, substrate board treatment 10 reports to main frame 26 with the notice that the temperature in the chamber arrives normal temperature, also can make the operator of main frame 26 know the notice of carrying out the atmosphere opening of chamber soon.
Secondly, in substrate board treatment 10, carry out the interior wet-cleaned (S209) of chamber of object handles unit, operator by substrate board treatment 10 selects, perhaps confirm the content of the automatic adjusting method edited, confirm to use inspection in adjusting automatically corresponding to this with the kind and the number (S210) of the inspection wafer of the inspection item (hereinafter referred to as " wafer use inspection item ") of wafer.
After this, substrate board treatment 10 reports to main frame 26 (S211) with beginning to carry out self-adjusting notice, in addition, carry to store to main frame 26 request and use the wafer transfer box 23 (to call " test wafer transfer box " in the following text) of the inspection wafer of the kind of inspection item and number (to check and use the substrate notifying process) (S212) that substrate board treatment 10 begins to adjust automatically (S213) corresponding to wafer.If main frame 26 has been received the transportation request of test wafer transfer box, then prepare the test wafer transfer box, carry by AGV25, this test wafer transfer box is placed on the wafer transfer box mounting table 15 of a substrate board treatment 10, and be installed in the corresponding load ports 24.
In adjusting automatically, at first, substrate board treatment 10 does not use the inspection of checking with the inspection item of wafer (S214), secondly, before the inspection of carrying out wafer use inspection item, judge whether the test wafer transfer box is installed in (S215) in the load ports 24.Substrate board treatment 10 validation test wafer transfer box before the inspection of carrying out wafer use inspection item is installed to the reason of the situation in the load ports 24, be because the preparation of the test wafer transfer box that is undertaken by main frame 26 needs the time, the inspection of the installation of this test wafer transfer box and wafer use inspection item the term of execution inconsistent.
In S215, be not installed under the situation in the load ports 24 at the test wafer transfer box, substrate board treatment 10 will be tested test wafer transfer box that wafer transfer box is not installed in the notice in the load ports 24 and alert report is not installed is given main frame 26, and temporarily interrupt self-adjusting execution (S216) (warning notice step).
Receive the test wafer transfer box main frame 26 preparation test wafer transfer boxes of alarm are not installed, carry by AGV25, this test wafer transfer box is placed on the wafer transfer box mounting table 15 of a substrate board treatment 10, is installed in the corresponding load ports 24 (S217).
Detect the test wafer transfer box and be installed in substrate board treatment 10 on the load ports 24, carry out the mapping (S218) of the inspection usefulness wafer in this test wafer transfer box by the mapping device, because substrate board treatment 10 can not be known the kind of wafer of the inspection in the test wafer transfer box, so by reporting to main frame 26 (S219) by the number of the wafer in the expression test wafer transfer box of mapping device acquisition and the mapping information of configuring condition, requesting host 26 sends about the notice of the inspection in the test wafer transfer box with the kind of wafer.
The main frame 26 that has received the report of mapping information will be installed in the object handles unit that should be admitted to wafer etc. is checked in the inspection of storing in the test wafer transfer box in the load ports 24 with the kind of wafer and each information, send to substrate board treatment 10 (S220) as the particular path declaration.Thus, give substrate board treatment 10 (check with substrate and prepare the end notification step) with checking with the preparation end notification of wafer.
Not only then afterwards corresponding to the installation (S217) of the test wafer transfer box of the uninstalled alarm of acceptance test wafer transfer box, carry out above-mentioned S218 to S220, and main frame 26 is not before the acceptance test wafer transfer box is installed alarm, main frame 26 is according to the transportation request (S212) of the test wafer transfer box that receives, even be installed under the situation in the load ports 24 will testing wafer transfer box, also carry out above-mentioned S218 to S220.
The substrate board treatment 10 termination test wafer transfer boxes that receive the particular path declaration are not installed the report of alarm, carry out the inspection (S221) that wafer uses inspection item.
Secondly, substrate board treatment 10 judges wafer uses the execution of the inspection of inspection item whether to finish, whether self-adjusting execution finishes (S222), use at wafer under the unclosed situation of execution of inspection of inspection item, proceed automatic adjustment, use at wafer under the situation that the execution of the inspection of inspection item finishes, the notice that self-adjusting execution has been finished reports to main frame 26 (S223) (checking the end notification step).
Receive the main frame 26 of the report of self-adjusting execution end, recovery contains have been carried out in wafer uses the inspection of inspection item corresponding to the inspection of the processing of projects test wafer transfer box with wafer, by confirming that with the analyzer (not shown) of substrate board treatment 10 separate configuration inspection in the test wafer transfer box of this recovery is with the state (S224) of wafer.Thus, main frame 26 judges whether substrate board treatment 10 normally recovers.
Concluding under the situation that substrate board treatment 10 normally recovers that main frame 26 sends the goods removed in the object handles unit and forbids removing trigger pulse (S225) (goods are sent into to forbid removing with substrate and indicated step) with sending into of forbidding of sending into of wafer W.
Receive and send into the substrate board treatment 10 of forbidding removing trigger pulse, after the goods of releasing in the object handles unit are forbidden with sending into of wafer W, transfer to as receiving the idle condition (S226) of goods, removed the notice (S227) that the goods in the object handles unit are forbidden with sending into of wafer W to main frame 26 reports with the state of wafer W.At this moment, substrate board treatment 10 also can stop sending the alarm of forbidding with sending into of wafer W about goods to the operator.
If adopt the inspection method of the substrate board treatment of present embodiment, then be equivalent under the wet-cleaned situation in necessary cycle in the accumulative total working time of having concluded substrate board treatment 10, send the goods of indication in the object handles unit from main frame 26 to substrate board treatment 10 and forbid removing trigger pulse (S202) with sending into of forbidding of sending into of wafer W, confirm the content of automatic adjusting method, if confirmed to use the kind and the number of the inspection wafer of inspection item corresponding to wafer, then send the transportation request (S212) of test wafer transfer box to main frame 26 from substrate board treatment 10, if reported the mapping information of the test wafer transfer box that is installed in the load ports 24 to main frame 26 from substrate board treatment 10, then be stored in inspection in this test wafer transfer box and check the information of the object handles unit that should be admitted to etc. with the kind of wafer and each, be sent to substrate board treatment 10 (S220) as the particular path declaration with wafer.
Thus, not only forbid in the object handles unit, sending into the goods wafer W, and substrate board treatment 10 can know and be stored in the inspection of test in the wafer transfer box with the kind of wafer etc., so can prevent reliably that goods are with wafer W sending into to the object handles unit.In addition, main frame 26 uses the test wafer transfer box of the inspection of inspection item with wafer owing to can know the inspection kind and the number of wafer of using inspection item corresponding to wafer so can prepare to store corresponding to wafer.
Therefore, the operator of substrate board treatment 10 does not need to cooperate with the operator of main frame 26, can reduce operator labor time, can prevent simultaneously owing to the test wafer transfer box is not installed in the waste that the stand-by time of substrate board treatment 10 takes place in the load ports 24.
In the inspection method of the substrate board treatment of above-mentioned present embodiment, from the notice (S223) of substrate board treatment 10 to the self-adjusting execution end of main frame 26 reports, report according to self-adjusting execution end, send the goods that indication removes in the object handles unit from main frame 26 to substrate board treatment 10 and forbid removing trigger pulse (S225) with sending into of forbidding of sending into of wafer W, so, after the self-adjusting execution of substrate board treatment 10, substrate board treatment 10 is transferred to as receiving the idle condition of goods with the state of wafer W, can automatically begin the etch processes of goods with wafer W, therefore, can further reduce operator labor time.
In addition, in the inspection method of the substrate board treatment of above-mentioned present embodiment, in self-adjusting execution, use at wafer before the inspection execution of inspection item, the test wafer transfer box is not installed under the situation in the load ports 24, as the test wafer transfer box that the test wafer transfer box is not installed in the notice the load ports 24 alarm (S216) is not installed to main frame 26 reports from substrate board treatment 10, so, main frame 26 is not installed alarm according to the test wafer transfer box, and can prepare to test wafer transfer box, therefore, can further reduce the stand-by time of substrate board treatment 10.
In addition, in aforesaid substrate treating apparatus 10, the automatic adjusting method of being edited by the operator is stored among the HDD of control part 17, so, therefore the automatic adjusting method that the editor that can apply in a flexible way in later next time automatic adjustment stores, can further reduce operator labor time.
In the inspection method of the substrate board treatment of above-mentioned present embodiment, though substrate board treatment 10 is corresponding to sending into the reception of forbidding removing trigger pulse, and goods the sending into wafer W in the object handles unit forbidden in releasing, but, in S202, forbid in the trigger pulse that additional indication is after self-adjusting execution finishes sending into, substrate board treatment 10 also can automatically be removed under the situation of goods with the information of sending into of wafer W of forbidding in the object handles unit, substrate board treatment 10 also can automatically be removed goods the sending into wafer W of forbidding in the object handles unit after the notice that self-adjusting execution has been finished reports to main frame 26.
In addition, in the inspection method of the substrate board treatment of above-mentioned present embodiment, though main frame 26 contains the test wafer transfer box of checking with wafer, with confirming that with the analyzer of substrate board treatment 10 separate configuration inspection in the test wafer transfer box of this recovery is with the state of wafer, but, as shown in Figure 6, substrate board treatment 10 also can have analyzer, for example has IMS (Integrated Metrology System, the Therma-Wave corporate system) 61, substrate board treatment 60 is measured by the state of the inspection of object handles cell processing with wafer by IMS61, the result of this mensuration is sent to main frame 26, main frame 26 judges according to the measurement result of sending whether substrate board treatment 60 normally recovers.Thus, owing to do not need the recovery test wafer transfer box, can promptly begin the etch processes of automatic adjusted goods with wafer W.
In addition, in the inspection method of the substrate board treatment of above-mentioned present embodiment, though main frame 26 monitors the accumulative total working time of substrate board treatment 10, comparison according to this accumulative total working time and necessary cycle of wet-cleaned, to send into and forbid that trigger pulse sends to substrate board treatment 10, but, the project that main frame 26 monitors is not limited thereto, for example, also can be the etch processes of accumulated discharge time, processing unit 11 in the processing unit 11 cumulative number, handle the accumulative total use amount of gas etc.
Secondly, the inspection method of the substrate board treatment of second embodiment of the present invention is described.
The structure of present embodiment and effect and above-mentioned first embodiment are basic identical, and the place different with above-mentioned first embodiment is: according to the desirable sequential of operator, carry out to carry out automatically and adjust; And the interior wet-cleaned of chamber of not carrying out processing unit 11.Therefore,, omit explanation, below different structures, effect are described about structure, the effect that repeats.
Fig. 3 is the figure of display part of operation control of substrate board treatment of the inspection method of the expression substrate board treatment that is applicable to present embodiment.
In Fig. 3, the model of display part 27 patterns of operation control 22 ground display base plate treating apparatus 10.In addition, display part 27 has touch panel function, if by the part of operator's touch corresponding to each textural element of shown model, then show the subwindow corresponding to this part, for example displayed pop-up window 28.This subwindow also shows the menu about the operation of this textural element in the working condition that shows corresponding textural element.
The operator is by selecting the desired procedure method from shown menu, and can the operating structure key element.For example, in the displayed pop-up window 28 corresponding to processing unit 11, can show: " usually " button 29 of execution indication usefulness of the common processing of etch processes is carried out in input with wafer W to goods; And " AUTOSETUP " button 30 of the self-adjusting execution of input processing unit 11 indication usefulness, the operator is by pushing certain button, and can make substrate board treatment 10 carry out desirable processing.
In addition, displayed pop-up window 28 has utilizes tabular form to show corresponding to the method display part of handling usually or self-adjusting method is used 31, this method display part 31 shows corresponding to the tabulation of processing or self-adjusting method usually according to the selection of the button 29,30 that is undertaken by the operator.The operator selects desirable method by the tabulation of the method that shows from method display part 31, and disposal route that can setting substrate treating apparatus 10, for example automatic adjusting method.
In addition, on method display part 31, in the tabulation of shown method, if double-click desirable method, the processing project that then can show the method for this hope for example, is represented method editor's displayed pop-up window 32 of inspection item by tabular form in the automatic adjusting method.The operator carries out the deletion of inspection item or appending of new inspection item in method editor displayed pop-up window 32, carry out the editor of method.This editor's method is set at the disposal route of substrate board treatment 10, simultaneously by pushing " preservation " button (not shown), and can be stored among the HDD etc. of control part 17 (edit check project storing step).
In the present embodiment, be at processing unit 11 under the situation of idle condition, if the operator pushes " AUTO SETUP " button 30, even then the necessary cycle of the wet-cleaned of the accumulative total working time of substrate board treatment 10 chamber that is not suitable for predesignating, substrate board treatment 10 is also implemented the inspection method of the substrate board treatment of the described present embodiment in back.
Fig. 4 is the sequence chart of inspection method of the substrate board treatment of expression present embodiment.
At first, if the operator is by pushing " AUTO SETUP " button 30, self-adjusting execution being begun to indicate (S401) in the input substrate treating apparatus 10 in display part 27, then substrate board treatment 10 is transferred to and forbid sending into the hold mode (S402) (goods with substrate send into forbid step) of goods with wafer W, S204 and the S206 in the execution graph 2 once more in the object handles unit.In addition, at this moment, the S205 in main frame 26 execution graphs.
Secondly, the operator is by the method display part 31 in the display part 27, select desirable automatic adjusting method, perhaps edit automatic adjusting method, if automatic adjusting method that will select or editor is set at disposal route, then confirm the content of this automatic adjusting method, confirm to use the kind and the number (S210) of the inspection wafer of inspection item corresponding to this self-adjusting wafer.
After this, the S211 to S227 in substrate board treatment 10 and main frame 26 execution graphs 2.
If adopt the inspection method of the substrate board treatment of present embodiment, then begin indication corresponding to the self-adjusting execution of being undertaken by the operator to substrate board treatment 10 inputs, forbid in the object handles unit, sending into goods wafer W (S402), if confirmed the content of automatic adjusting method and confirmed to use the kind and the number of the inspection wafer of inspection item corresponding to wafer, then send test wafer transfer box transportation request (S212) to main frame 26 from substrate board treatment 10, if reported the mapping information of the test wafer transfer box that is installed in the load ports 24 to main frame 26 from substrate board treatment 10, then be stored in inspection in this test wafer transfer box and check the information of the object handles unit that should be admitted to etc. with the kind of wafer and each, be sent to substrate board treatment 10 (S220) as the particular path declaration with wafer.
Thus, because substrate board treatment 10 can be known the inspection that is stored in the test wafer transfer box kind of wafer etc., so can prevent from reliably to send into the goods wafer W to the object handles unit.In addition, main frame 26 uses the test wafer transfer box of the inspection of inspection item with wafer owing to can know the inspection kind and the number of wafer of using inspection item corresponding to wafer so can prepare to store corresponding to wafer.Therefore, the operator of the operator of main frame 26 and substrate board treatment 10 does not need to work in coordination with, can reduce operator labor time, can prevent simultaneously owing to the test wafer transfer box is not installed in the waste that the stand-by time of substrate board treatment 10 takes place in the load ports 24.
In addition, corresponding to beginning indication to the self-adjusting execution of substrate board treatment 10 inputs, forbid in the object handles unit, sending into goods wafer W (S402), after this, owing to adjust automatically, so do not increase operator labor time, just can adjust automatically according to the desirable sequential of operator.Therefore, the operator can utilize automatic adjustment like a cork the making regular check on of substrate board treatment 10, for example in the inspection in every day.
In the inspection method of the substrate board treatment of the respective embodiments described above, though between main frame 26 and substrate board treatment 10, communicate, but, the external server that also can dispose the work of control basal plate treating apparatus 10 replaces main frame 26, by between this external server and substrate board treatment 10, communicating, also can realize each embodiment.
In the inspection method of the substrate board treatment of the respective embodiments described above, though send into the inspection of carrying out the processing unit 11 of substrate board treatment 10 in the chamber of processing unit 11 by checking with wafer, but also can be by only in load lock chamber 13 or charging unit 18, carrying the inspection wafer, measure inspection with the particle adhesion amount on the wafer etc., carry out the inspection of the state of the induction system that constitutes by load lock chamber 13 and charging unit 18.
In the inspection method of the substrate board treatment of the respective embodiments described above,, also can use other accepting containers that to accommodate wafer hermetically though use wafer transfer box 23 as the accepting container of checking with wafers.
In addition, be applicable to the substrate board treatment of inspection method of the substrate board treatment of each embodiment, be not limited to have two processing boats 14 shown in Figure 1, each handles the substrate board treatment of the parallel type of boat 14 configurations parallel to each other, also can be such shown in Fig. 5 A and 5B, have carry goods with the conveying chamber of the transfer arm of the frog geometric pattern (frog leg type) of wafer W around, roughly dispose the combined substrate board treatment (Fig. 5 A) of a plurality of processing units radially, or the conveying chamber with both arms type that the conveying arm by two SCARA types constitutes is arranged, and round the substrate board treatment (Fig. 5 B) of a plurality of processing units of conveying chamber configuration etc.In addition, the substrate board treatment shown in Fig. 5 A or Fig. 5 B is identical with substrate board treatment among Fig. 1, also comprises wafer transfer box mounting table 15, steady arm 16, charging unit 18 and operation control 22 certainly.
Flat-panel monitor) in addition, in the respective embodiments described above, though the wafer that processed substrate is a semiconductor device to be used, processed substrate is not limited thereto, and for example, also can be LCD or FPD (Flat Panel Display: glass substrate such as.
The storage medium of procedure code of the software of the function that realizes the respective embodiments described above will be recorded, be supplied to system or device (control part 17 or main frame 26), the computing machine of this system or device (or CPU or MPU) also can be realized purpose of the present invention by reading and carry out the procedure code that is stored in the storage medium.
In this case, become the function that the procedure code of reading from storage medium itself is realized the respective embodiments described above, become this procedure code and the storage medium of the sign indicating number that has program stored therein constitutes the present invention.
In addition, as supplying with the storage medium that procedure code is used, for example can use: CD, tape, Nonvolatile memory card, ROM etc. such as soft (registered trademark) dish, hard disk, photomagneto disk, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW.In addition, also can pass through the network download procedure code.
In addition, also comprise such situation: the procedure code of reading by object computer, not only can realize the function of the respective embodiments described above, and according to the indication of this procedure code, the OS that work on computers (operating system) etc. implement part or all of actual treatment, can realize the function of the respective embodiments described above by this processing.
In addition, also comprise such situation: after the procedure code of reading is written into the function expansion card that can insert in the computing machine or can connects in the storer that is had on computers the functional expansion unit from storage medium, indication according to this procedure code, the CPU that have in this function expansion card or the functional expansion unit etc. implement part or all of actual treatment, can realize the function of the respective embodiments described above by this processing.
The form of said procedure sign indicating number also can be by object code, by the procedure code of translater execution, the morphosises such as original text data of supply OS.
Claims (7)
1. the inspection method of a substrate board treatment is characterized in that:
This inspection method is the inspection method of the substrate board treatment that communicates mutually with the external control device, is used for the inspection item of regulation is checked that wherein, this inspection method comprises the following steps:
Goods are carried with substrate and are forbidden indicating step, and in cleaning period of described substrate board treatment, described external control device forbids carrying the goods substrate to described substrate board treatment indication in this substrate board treatment;
Check and use the substrate notifying process, described substrate board treatment will be in the inspection of the inspection item of described regulation the kind and the number of employed inspection usefulness substrate, be notified to described external control device; And
Inspection is prepared the end notification step with substrate, and described external control device finishes the preparation of described inspection with substrate, is notified to described substrate board treatment.
2. the inspection method of substrate board treatment according to claim 1 is characterized in that, comprising:
Check the end notification step, described substrate board treatment is given described external control device with the inspection end notification of described inspection item; And
Goods are carried with substrate and are forbidden removing the indication step, and according to the notice that described inspection finishes, described external control device is removed described substrate board treatment indication and forbid carrying described goods substrate in this substrate board treatment.
3. the inspection method of substrate board treatment according to claim 1 is characterized in that, comprising:
The warning notice step, when carrying out the inspection of described inspection item, under the also unripe situation, described substrate board treatment is to described external control device notification alert with substrate in the inspection of using in checking at this.
4. the inspection method of substrate board treatment according to claim 1 is characterized in that, comprising:
Edit check project storing step, described substrate board treatment stores the inspection item the edited inspection item as described regulation.
5. the inspection method of a substrate board treatment is characterized in that:
This inspection method is the inspection method of the substrate board treatment that communicates mutually with the external control device, is used for the inspection item of regulation is checked that wherein, this inspection method comprises the following steps:
Goods are carried with substrate and are forbidden step, and according to the input to described substrate board treatment, described substrate board treatment forbids carrying the goods substrate in this substrate board treatment;
Check and use the substrate notifying process, described substrate board treatment will be in the inspection of the inspection item of described regulation the kind and the number of employed inspection usefulness substrate, be notified to described external control device; And
Inspection is prepared the end notification step with substrate, and described external control device finishes the preparation of described inspection with substrate, is notified to described substrate board treatment.
6. the inspection method of substrate board treatment according to claim 5 is characterized in that, comprising:
The warning notice step, when carrying out the inspection of described inspection item, under the also unripe situation, described substrate board treatment is to described external control device notification alert with substrate in the inspection of using in this is checked.
7. the inspection method of substrate board treatment according to claim 5 is characterized in that, comprising:
Edit check project storing step, described substrate board treatment stores the inspection item the edited inspection item as described regulation.
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| JP2005011951A JP5192122B2 (en) | 2005-01-19 | 2005-01-19 | Inspection method and inspection program for substrate processing apparatus |
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| CN108072399A (en) * | 2016-11-10 | 2018-05-25 | 欧姆龙株式会社 | Inspection system, the control method of check device and computer readable storage medium |
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| JP2008306137A (en) * | 2007-06-11 | 2008-12-18 | Hitachi Kokusai Electric Inc | Substrate treating equipment |
| US9514355B2 (en) | 2009-01-05 | 2016-12-06 | Apple Inc. | Organizing images by correlating faces |
| JP5965680B2 (en) * | 2012-03-08 | 2016-08-10 | 東京エレクトロン株式会社 | Processing chamber part cooling method, processing chamber part cooling program, and storage medium |
| KR102128722B1 (en) * | 2012-08-21 | 2020-07-02 | 세메스 주식회사 | Inspection method of Apparatus for Processing Substrate |
| JP6148991B2 (en) * | 2014-01-31 | 2017-06-14 | 東京エレクトロン株式会社 | Substrate processing apparatus, editing method, and storage medium |
| JP6446334B2 (en) * | 2015-06-12 | 2018-12-26 | 東京エレクトロン株式会社 | Plasma processing apparatus, plasma processing apparatus control method, and storage medium |
| JP7126466B2 (en) * | 2018-12-12 | 2022-08-26 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING SYSTEM, TRANSFER METHOD, AND TRANSFER PROGRAM |
| CN112364606B (en) * | 2019-07-25 | 2024-03-12 | 上海微电子装备（集团）股份有限公司 | Loading method and device for measurement prescription and measurement equipment |
| JP7399012B2 (en) * | 2020-03-30 | 2023-12-15 | 東京エレクトロン株式会社 | Substrate processing system, substrate processing method, and control device |
| WO2021240572A1 (en) * | 2020-05-25 | 2021-12-02 | 株式会社日立ハイテク | Semiconductor apparatus manufacturing system and semiconductor apparatus manufacturing method |
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| JP2006202912A (en) | 2006-08-03 |
| KR20060084388A (en) | 2006-07-24 |
| JP5192122B2 (en) | 2013-05-08 |
| KR100755535B1 (en) | 2007-09-06 |
| CN1811622A (en) | 2006-08-02 |
| TWI421905B (en) | 2014-01-01 |
| TW200631070A (en) | 2006-09-01 |
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