CN100499953C - A packaging method of organic electroluminescent display - Google Patents
A packaging method of organic electroluminescent display Download PDFInfo
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- CN100499953C CN100499953C CNB2007103077363A CN200710307736A CN100499953C CN 100499953 C CN100499953 C CN 100499953C CN B2007103077363 A CNB2007103077363 A CN B2007103077363A CN 200710307736 A CN200710307736 A CN 200710307736A CN 100499953 C CN100499953 C CN 100499953C
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- organic electroluminescence
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Abstract
The invention discloses an encapsulating method of an organic electroluminescence display which can obviously improve the service life of the device. The invention is characterized in that the upper surface of a glass baseplate is sequentially provided with an ITO conductive layer, a hole transport layer, a luminescent layer, an electron transport layer and a cathode layer from bottom to top; the cathode layer is provided with an eduction conductor diaphragm which is connected with the cathode of the DC voltage; after that, a film encapsulating layer is formed on the surface of the cathode layer by adopting the processes of vacuum evaporation, particle sputtering or magnetic-control sputtering. The film encapsulating layer seals the side edges of the hole transport layer, the luminescent layer, the electron transport layer and the cathode layer at the same time.
Description
Technical field
The present invention relates to a kind of method for packing of display of organic electroluminescence.
Background technology
Along with the day by day raising of people to the vision requirement, the Display Technique fast development, day by day, the situation that a hundred flowers blossom, show that from cathode-ray tube display (CRT), liquid crystal display (LCD), plasma (PDP) shows (FED) to ORGANIC ELECTROLUMINESCENCE DISPLAYS (OLED) and electroluminescent, numerous.Science and technology development is maked rapid progress, and the Display Technique field also a revolution is taking place, and various new technology of flat (FPD) are arisen at the historic moment.Cathode-ray tube display (CRT) exists that volume is big, power consumption is high and the shortcoming of radiativity, loses the dominance in demonstration field gradually; And flat panel display is described as a kind of Chaoyang technology, is the main flow of 21st century Display Technique development, thereby has been subjected to people's extensive attention, and it not only will have perfect display quality, and needs at volume, aspect such as energy-conservation more improvement is arranged.LCD, PDP and OLED are three big main flows of flat panel display, the OLED display device, comprise that PLED (macromolecule ORGANIC ELECTROLUMINESCENCE DISPLAYS) compares with other display device and has bigger advantage, be embodied in that operating voltage is low, cost of manufacture is low, energy consumption is little, thinner, brightness and definition advantages of higher more.It is one of developing direction of OLED/PLED display device that adagio shows, but owing to the present existing problem of encapsulation technology, has influenced the life-span of OLED flat-panel display device.
The life-span of OLED device is decided by selected organic material on the one hand, also depends on the method for packing of device on the other hand; Because organic material is very unstable, if the OLED device package is bad, organic material will react with gases such as water vapour in the vacuum chamber, oxygen, is easy to and will loses efficacy, and causes whole OLED to reduce device lifetime.Thereby, being inhibited for making the degeneration and the inefficacy of OLED in the long-term work process, steady operation reaches enough life-spans, and the barrier of encapsulating material is had high requirements.
Summary of the invention
The present invention provides a kind of method for packing that significantly improves the display of organic electroluminescence of device lifetime in order to solve low problem of OLED/PLED display device life-span.
For achieving the above object, the present invention takes following technical scheme to be achieved:
A kind of method for packing of display of organic electroluminescence, it is characterized in that, earlier set gradually ITO conductive layer, hole transmission layer, luminescent layer, electron transfer layer and cathode layer from bottom to top at the glass substrate upper surface, described cathode layer is provided for the conductor introduction diaphragm that is connected with the direct voltage negative pole, adopt vacuum evaporation, particle sputter or magnetron sputtering technique to form the thin film encapsulated layer on the cathode layer surface then, this thin-film encapsulation layer is simultaneously with hole transmission layer, luminescent layer, electron transfer layer and cathode layer side seals.
In the such scheme, described thin-film encapsulation layer is used in material selenium more stable in the air, tellurium, antimony etc. and forms by vacuum evaporation, particle sputter or magnetron sputtering technique; Vacuum degree during vacuum evaporation is 1 X 10
-3Below the Pa, vacuum evaporation thickness is more than the 80nm.Described cathode layer is made by metallic aluminium or calcium/aluminium, magnesium/silver-colored low-work-function material.
The present invention prepares one deck densification, is difficult for the thin-film encapsulation layer of oxidation by film build methods such as the vacuum evaporation under the high vacuum condition, particle sputter, magnetron sputterings in the outside of OLED/PLED negative electrode; realization is to the encapsulation of display device; reduce the erosion for device inside such as water, oxygen; form effective protection of target, organic material; degeneration and the inefficacy of OLED in the long-term work process is inhibited, realizes that steady operation reaches enough life-spans.
Description of drawings
Fig. 1 is the structure chart after a kind of display of organic electroluminescence adopts the inventive method thin-film package.
Embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
As shown in Figure 1, a kind of method for packing of display of organic electroluminescence, earlier set gradually ITO (indium oxide and tin oxide compound film material) conductive layer 5 from bottom to top at glass substrate 6 upper surfaces, hole transmission layer 4, luminescent layer (fluorescent material) 3, electron transfer layer 2 and by metallic aluminium or calcium/aluminium, low-work-function materials such as magnesium/silver are made cathode layer 1, on cathode layer 1, be provided for the conductor introduction diaphragm that is connected with the direct voltage negative pole again, adopt vacuum evaporation on cathode layer 1 surface then, particle sputter or magnetron sputtering technique form thin film encapsulated layer 7, and this thin-film encapsulation layer 7 is simultaneously with hole transmission layer 4, luminescent layer 3, electron transfer layer 2 and cathode layer 1 side seals.Thin-film encapsulation layer 7 can be used on material more stable in the air, as selenium, tellurium, antimony etc., forms by vacuum evaporation, particle sputter or magnetron sputtering technique.These thin-film materials have good barriers such as aqueous vapor, oxygen.
Specific embodiment of the present invention sets gradually ITO conductive layer 5, hole transmission layer 4, luminescent layer 3, electron transfer layer 2 from bottom to top and makes cathode layer 1 by metallic aluminum material at glass substrate 6 upper surfaces respectively for adopting conventional preparation technology, then in vacuum chamber on the metallic cathode 1 original position directly form thin-film encapsulation layer 7 by the vacuum evaporation process evaporation with the selenium material, the vacuum degree during vacuum evaporation is 1 X 10
-3Below the Pa; The thickness of vacuum evaporation rear film encapsulated layer 7 is 80nm.After encapsulation finished, ITO conductive layer 5 linked to each other with the positive and negative electrode of direct voltage respectively with cathode layer 1.
The present invention is from improving the barrier of OLED encapsulation, prolong OLED and set out device lifetime, by after finishing each functional layer and being provided with, the direct evaporated film encapsulated layer of original position on the metallic cathode in vacuum chamber, not only simplified production technology, the more effective life-span that prolongs the OLED device.
Claims (3)
1. the method for packing of a display of organic electroluminescence, it is characterized in that, earlier set gradually ITO conductive layer, hole transmission layer, luminescent layer, electron transfer layer and cathode layer from bottom to top at the glass substrate upper surface, described cathode layer is provided for the conductor introduction diaphragm that is connected with the direct voltage negative pole, on the cathode layer surface thin film encapsulated layer is set then, this thin-film encapsulation layer forms by vacuum evaporation, particle sputter or magnetron sputtering technique with the material of one of selenium, tellurium, antimony; Described thin-film encapsulation layer is simultaneously with hole transmission layer, luminescent layer, electron transfer layer and cathode layer side seals.
2. the method for packing of display of organic electroluminescence as claimed in claim 1 is characterized in that, described thin-film encapsulation layer forms by vacuum evaporation process with selenium, and the vacuum degree during vacuum evaporation is 1 X 10
-3Below the Pa.
3. the method for packing of display of organic electroluminescence as claimed in claim 2 is characterized in that, the vacuum evaporation thickness of described thin-film encapsulation layer is at least 80nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007103077363A CN100499953C (en) | 2007-12-26 | 2007-12-26 | A packaging method of organic electroluminescent display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007103077363A CN100499953C (en) | 2007-12-26 | 2007-12-26 | A packaging method of organic electroluminescent display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101217837A CN101217837A (en) | 2008-07-09 |
| CN100499953C true CN100499953C (en) | 2009-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007103077363A Expired - Fee Related CN100499953C (en) | 2007-12-26 | 2007-12-26 | A packaging method of organic electroluminescent display |
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| CN (1) | CN100499953C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436648B (en) * | 2008-12-09 | 2010-06-16 | 彩虹集团公司 | Encapsulation method for novel organic electroluminescence device film |
| CN101740729B (en) * | 2009-12-25 | 2012-05-09 | 彩虹集团公司 | Preparation method of white-light organic electroluminescence device |
| JP5854746B2 (en) | 2010-10-15 | 2016-02-09 | 日東電工株式会社 | Top emission type organic electroluminescence light emitting device and manufacturing method thereof |
| CN103904248B (en) * | 2012-12-25 | 2016-08-03 | 海洋王照明科技股份有限公司 | Organic electroluminescence device and preparation method thereof |
| CN105098096B (en) * | 2015-08-03 | 2018-03-30 | 京东方科技集团股份有限公司 | The distribution method of encapsulating compound, display panel and preparation method thereof, display device |
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2007
- 2007-12-26 CN CNB2007103077363A patent/CN100499953C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101217837A (en) | 2008-07-09 |
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