CN100504617C - Double platform system for rotary exchange - Google Patents
Double platform system for rotary exchange Download PDFInfo
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- CN100504617C CN100504617C CNB2007100417698A CN200710041769A CN100504617C CN 100504617 C CN100504617 C CN 100504617C CN B2007100417698 A CNB2007100417698 A CN B2007100417698A CN 200710041769 A CN200710041769 A CN 200710041769A CN 100504617 C CN100504617 C CN 100504617C
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Abstract
The invention provides a rotating dual-exchange system. The technology in the two-station system has complex structures, and the high costs and dual-exchange potential safety problems when there are problems. The invention of the rotary dual-exchange system for one of the main frame and has operations in the two electronic devices, including set up its main base on the framework of the operations of the two should be installed in the symmetry and the stage - The first and second operations desk, base stations used to drive along the base of the center-rotating drives used to control devices and base stations driven deviser base rotation in order to achieve the first - and second operation Taiwan transposition operation control module. By the invention of the rotary dual-exchange system can improve the efficiency and reduce costs.
Description
Technical field
The present invention relates to the semiconductor manufacturing facility field, particularly a kind of double platform system that rotates exchange.
Background technology
Photoetching is that the graphics chip on the mask is transferred on the silicon chip by litho machine, and it is the important procedure during semiconductor is made, so the efficient of photoetching and quality are to the manufacturing efficient and the quality important influence of semi-conductor chip.
Early stage litho machine adopts the single job platform usually, locating tab assembly and follow-up exposure are all carried out on this single job platform in the photoetching, this litho machine with single job platform once can only photoetching a slice silicon chip, this silicon chip just can carry out exposure process after the scan exposure zone is finished locating tab assembly, so this litho machine production efficiency with single job platform is low, it becomes the bottleneck that restriction photoetching efficient further improves.
Problem for the inefficiency that overcomes the single job platform, the litho machine that is provided with two operation posts is the development trend of photoetching machine technique, silicon pad alignment measures operation and the exposure process branch is located at parallel carrying out on two operation posts, so this litho machine with two operation posts can make two silicon chips carry out the photo-mask process of different phase respectively simultaneously, so can improve photoetching efficient greatly.
Existing normally used pair of operation post system of industry is shown in following patent:
The patent No. is that the European patent of WO98/40791 has proposed a kind of pair of operation post system, and each operation post is all fixing by the seat that is of coupled connections in this pair operation post system.Litho machine with this pair operation post system is when work, and the aligning before the silicon chip of operation post carrying can expose on to locating tab assembly operation position and measure operation, the silicon chip of another operation post carrying then carry out exposure process in exposure.After the operation on two operation posts was all finished, the seat that is of coupled connections separated with operation post, and two operation posts will move to switch respectively, the exchange of seat that is of coupled connections then, thus realize the exchange of two operation posts.Two operation post system in this patent can shorten the averaging time of the circulation exposure of silicon chip in the exposure system, not improving under the operation post movement velocity prerequisite, can improve the productive rate of system significantly.
Yet this patent No. is the European patent of WO98/40791 also exists some problems: owing to what adopt between each operation post and driver element is the mode of being of coupled connections, in exchange process, the seat that is of coupled connections needs of short duration the separation with operation post, after both separate, though guarantee maintaining static of its separation point position by clamping down on of locating device (patent No. is that the European patent of WO98/28665 and United States Patent (USP) that the patent No. is US6498350 are all described this locating device in detail), both separation still can impact the bearing accuracy of system.So just need correspondingly increase protective device and pick-up unit, so can cause the complicated of system architecture.There is the range of movement overlapping region in other two operation posts, in two platform motion processes the possibility that bumps are arranged.
The patent No. is that the United States Patent (USP) of US6654100 and European patent that the patent No. is WO01/40875 have proposed a kind of similar pair of operation post system, the distinguishing feature of the two operation post system that two patents are proposed is that each operation post all independently has one and puts sheet and a following sheet module and a cover aligning measurement module, one public exposure module is arranged on two and aims between measurement module, and the exposure position is arranged between two operation posts.When an operation post is carried out exposure process in the exposure position, another operation post can carry out last slice operation, sheet operation or to the locating tab assembly operation down simultaneously, after the operation of two operation posts is all finished, the operation post straight line that is in the exposure position shifts out the exposure position, aim at and measure the operation post that finishes simultaneously and will move on to the exposure position, and the operation post of finishing silicon wafer exposure is carried out down sheet and is gone up the new film operation, then its correspondence to the locating tab assembly position on aligning and measuring operation before exposing.The photoetching that all light requirements are carved silicon chip is finished in circulation and so forth.
Above-mentioned pair of platform structure, simple and reliable, mutually noninterfere when two operation posts move, and operating path is short, and exchange velocity is fast.Overcome the some shortcomings of the two platform technology of patent WO98/40791, aimed at measurement mechanism and sheet device up and down but but had more a cover, cost significantly increases.
The patent No. is that the United States Patent (USP) of US6788385 has also proposed a kind of pair of operation post patent, and this patent and the patent No. are that two operation posts that European patent proposed of WO98/40791 are similar, and whole double platform system comprises an exposure position and one to the locating tab assembly position.But with the patent No. by the European patent of WO98/40791 different be, the wafer-supporting platform of its two operation post is arranged on x on driver element in the mode of cantilever, simultaneously, the bottom of wafer-supporting platform exceeds x to the driver element top plan.By this kind layout type, can realize that two operation posts are to the mutual transposition of locating tab assembly position to exposure position.
With the patent No. is that the European patent of WO98/40791 is compared, and the patent No. is that two platforms of the United States Patent (USP) of US6788385 directly replace, and the transposition process of need not to be coupled coupling seat device and complicated operation post has been simplified system, has improved the efficient of two platforms transpositions.With the patent No. is that the United States Patent (USP) of US6654100 is compared, and this patent No. is that the United States Patent (USP) of US6788385 only needs a cover to aim at measurement module and cover sheet module up and down, and system cost and complicacy decrease.But also there is a problem in this pair platform technology, and the vibration problem that occurs so that the wafer-supporting platform of cantilevered fashion setting is in the leveling and focusing process need overcome exactly, needs to design especially silicon chip jack-up and hold down gag simultaneously.
In sum, how to provide a kind of double platform system of saving cost, location accurate and safe and simple rotation efficiently exchange, promptly become problem demanding prompt solution in the semicon industry.
Summary of the invention
The object of the present invention is to provide a kind of double platform system that rotates exchange, can raise the efficiency, reduce cost and improve security by the double platform system of described rotation exchange.
The object of the present invention is achieved like this: a kind of double platform system that rotates exchange, being used for one has main frame and has the electronic equipment of two operation positions, the double platform system of this rotation exchange comprises the base station that is arranged on the main frame, to should two operation positions and be symmetricly set on first and second operation post on this base station, be used to drive the base station drive unit that base station rotates along this base station center and be used to control the base station drive unit and drive base station and rotate control module to realize that first operation post and second operation post replace
Wherein this main frame comprises U type support, is evenly distributed in a plurality of shock-damping structures of U type frame bottom and is arranged on the brace table that is used to support base station on the shock-damping structure,
The double platform system of this rotation exchange also comprises and is arranged on the brace table and is used for the base station locking unit of base station locking on this brace table, this control module also control base station locking unit with the base station locking on brace table.
In the double platform system of above-mentioned rotation exchange, this first and second operation post include parallel arrangement two X of base station one side to guide rail, be crossed on this two X to the Y between guide rail to guide rail, be arranged on this Y on guide rail and be used to carry the wafer-supporting platform of silicon chip, respectively drive X that this wafer-supporting platform moves along directions X and Y direction to driver element and Y to driver element.
In the double platform system of above-mentioned rotation exchange, this X satisfies barycenter driving principle to driver element and Y to the motion of drive unit drives wafer-supporting platform.
In the double platform system of above-mentioned rotation exchange, this X is linear electric motors to driver element and Y to driver element.
In the double platform system of above-mentioned rotation exchange, this control module comprises that one is arranged on the base station and the detecting unit and that is used to detect the base station rotational angle is used to control the base station drive unit and drives the control module that base station rotates.
In the double platform system of above-mentioned rotation exchange, this brace table is the air supporting brace table.
In the double platform system of above-mentioned rotation exchange, this base station drive unit is arranged on the bottom of this brace table.
In the double platform system of above-mentioned rotation exchange, this base station locking unit is an electromagnetic coupling device.
In the double platform system of above-mentioned rotation exchange, this U type support end also is provided with and is used to drive the slowdown module that base station slows down.
In the double platform system of above-mentioned rotation exchange, this base station drive unit is a servomotor.
In the double platform system of above-mentioned rotation exchange, this base station drive unit comprises a servomotor and a speed change gear that links to each other with servomotor.
In the double platform system of above-mentioned rotation exchange, this electronic equipment is a litho machine.
In the double platform system of above-mentioned rotation exchange, this litho machine has last slice module and sheet module once.
In the double platform system of above-mentioned rotation exchange, this two operations position is respectively locating tab assembly position and exposure position.
There is complex structure with of the prior art pair of operation post system, cost is too high and has problems such as potential safety hazard and compare, two operation posts shared one of the double platform system of rotation exchange of the present invention put sheet and reach sheet module down, saved cost greatly, moreover the double platform system of rotation exchange of the present invention drives the base station rotation by the base station drive unit, can finish the transposition that is arranged on two operation posts on the base station, two operation posts do not have the motion overlapping region, avoided the potential safety hazard of two operation posts collisions, moreover the structure of the double platform system of rotation exchange also is simplified.
Description of drawings
The double platform system of rotation exchange of the present invention is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of first embodiment of the double platform system of rotation of the present invention exchange;
Fig. 2 is the front view of first and second operation post in the double platform system of rotation of the present invention exchange;
Fig. 3 is the synoptic diagram that first operation post is in a position;
Fig. 4 is that first operation post is in the synoptic diagram to the locating tab assembly position;
Fig. 5 is the synoptic diagram that first operation post is in the position of berthing;
Fig. 6 is the synoptic diagram that first operation post is in the exposure position;
Fig. 7 is that first operation post is in the synoptic diagram of sheet position down;
Fig. 8 is equiped with litho machine photoetching silicon chip W1, the W2 of double platform system of rotation of the present invention exchange and the process flow diagram of W3;
Fig. 9 is the structural representation of second embodiment of the double platform system of rotation of the present invention exchange.
Embodiment
Below will the double platform system of rotation exchange of the present invention be described in further detail.
Referring to Fig. 1, it has shown the structural representation of first embodiment of the double platform system that rotation of the present invention exchanges, as shown in the figure, the double platform system of described rotation exchange is used for a litho machine, the double platform system of described rotation exchange comprises base station 10, base station drive unit 11, base station locking unit 12, first operation post 13, second operation post 14, control module 15, slowdown module 16, wherein, described litho machine comprise main frame 20, aim at measurement module 21, exposure module 22, last slice module (not shown), sheet module (not shown) down.
Main frame 20 comprises U type support 20a, be evenly distributed in a plurality of shock-damping structure 20b of U type frame bottom and be arranged on brace table 20c on the shock-damping structure.In the present embodiment, described brace table 20c is the air supporting brace table, and the quantity of described shock-damping structure 20b is 3, and described shock-damping structure 20b is except that the spring section with passive energy dissipation, also be provided with the active vibration damping mechanism of active vibration damping, be used for initiatively balancing out the low-frequency vibration that base station 10 is produced.
Aim at measurement module 21 before active vibration damping shock isolation system (not shown) is hung on the main frame 20 and is used to treat the photoetching silicon chip and exposes to the locating tab assembly operation.
Exposure module 22 is hung on the main frame 20 and is used for treating the photoetching silicon chip according to the measurement result of aiming at measurement module 21 through active vibration damping shock isolation system (not shown) carries out exposure process.
The sheet module all was arranged on the outside of U type support 20a under described last slice module reached, described last slice module is used for and will treats that the photoetching silicon chip is carried on the double platform system of rotation exchange to carry out photoetching, and described sheet module down is used for finishing the silicon chip of exposure from base station 10 unloadings.In the present embodiment, the sheet module was separately positioned on the outside of the U type support 20a in base station 10 left sides under described last slice module reached.
Below the present invention is rotated the double platform system of exchange above-mentioned constitutive requirements be elaborated:
Base station drive unit 11 is arranged on the bottom of described brace table 20c and is used to drive base station 10 and rotates along its center.In the present embodiment, described base station drive unit 11 comprises DC servo motor 11a and DC servo motor 11a is fixed on fixed mount 11b on the brace table 20c.
Base station locking unit 12 is arranged on brace table 20c edge and is used for base station is locked in main frame 20.In the present embodiment, described base station locking unit 12 is an electromagnetic coupling device.
First and second operation post 13 and 14 alignment measurement modules 21 and exposure module 22 and be symmetricly set on the described base station 10, first and second operation post 13 and 14 all can be measured or exposes by exposure module 22 by aiming at measurement module 21, but can only having when carrying out operation simultaneously, two operation posts one measure (or exposure), another person expose (or measurement).
Referring to Fig. 2, the detailed structure that has shown first and second operation post 13 and 14, as shown in the figure, described first operation post 13 comprise parallel arrangement two X in base station 10 left sides to guide rail 13a and 13b, be crossed on the Y of described two X between guide rail 13a and 13b to guide rail 13c, be arranged on described Y is used to carry silicon chip on guide rail the first wafer-supporting platform 13d, drive X that the described first wafer-supporting platform 13d moves along directions X to driver element 13e and drive Y that the first wafer-supporting platform 13d moves along the Y direction to driver element 13f.The X of described first operation post 13 to and the Y motion that drives the first wafer-supporting platform 13d to driver element 13e and 13f satisfy barycenter and drive principle.
Second operation post 14 comprise parallel arrangement two X on base station 10 right sides to guide rail 14a and 14b, be crossed on the Y of described two X between guide rail 14a and 14b to guide rail 14c, be arranged on described Y is used to carry silicon chip on guide rail the second wafer-supporting platform 14d, drive X that the described second wafer-supporting platform 14d moves along directions X to driver element 14e and drive Y that the second wafer-supporting platform 14d moves along the Y direction to driver element 14f.The X of described second operation post 14 to and the Y motion that drives the second wafer-supporting platform 14d to driver element 14e and 14f also satisfy barycenter and drive principle.
Above-mentioned X is linear electric motors to driver element 13e and 14e and Y to driver element 13f and 14f, the X of corresponding above-mentioned first operation post 13 all can be the stator of linear electric motors to the X of guide rail 13a and 13b, second operation post 14 to guide rail 14a and 14b, also can be the guide rail of independent setting, and the stator of linear electric motors is arranged on the described guide rail.
Described first and second operation post 13 and 14 is provided with locking part (not shown) at the center position near base station 10, before base station drive unit 11 drives base station 10 rotations, or first and second operation post 13 and 14 is not when using, all by X to driver element and Y near driver element is driven into operation post locking part, by described locking part described wafer-supporting platform is locked the moment of inertia when so helping reducing base station 10 rotations then.
Control module 15 comprises detecting unit 15a and control module 15b, wherein, described detection measurement unit 15a is arranged on the base station 10 and is used to detect the rotational angle of base station 10, described control module 15b is used for finishing the situation accessory drive according to the corresponding operation of aligning measurement module 21 and exposure module 22 and drives base station 10 rotations, and described control module 15b also locks base station 10 on main frame 20 according to the testing result control base station locking unit 12 of detecting unit 15a.In the present embodiment, described detecting unit 15a is a circular arc grating chi.
The litho machine that use is equiped with the double platform system of rotation of the present invention exchange carry out photoetching mainly comprise an operation, to locating tab assembly operation, the operation of berthing, operation post transposition operation, exposure process and following sheet operation, wherein, to locating tab assembly operation and exposure process is the master operation of litho machine, and other operations are aided process.
Described first operation post 13 and second operation post 14 include corresponding above-mentioned operation and cooperate respectively a module carry out silicon chip carry into last slice position, cooperate aim at that measurement module 21 treats that the photoetching silicon chip measures to the locating tab assembly position, cooperate locking part locking wafer-supporting platform the position of berthing, cooperate the exposure position that 22 pairs of silicon chips of exposure module expose and cooperate sheet module down to descend following position of sheet, wherein, to locating tab assembly position and exposure position is the key operation position of litho machine, and other operations are the less important work position.
Referring to Fig. 3 to Fig. 7, cooperate referring to Fig. 1 and Fig. 2, Fig. 3 to Fig. 7 shown respectively first operation post 13 be in a position, to locating tab assembly position, the position of berthing, exposure position, the arrange state of each parts on base station 10 on first operation post 13 during the sheet position down.Second operation post, 14 each operation position are identical with first operation post 13, so be not described in detail in this.
Below treat photoetching silicon chip W1 with what three of photoetching on the double platform system of rotation of the present invention exchange were coated with photoresistance, W2 and W3 illustrate characteristics of the present invention and effect, it should be noted that, be simplified illustration, the simplification photoetching that is lithographically only photoetching one figure herein (promptly need not to change the mask in the exposure module 22), when not carrying out the photoetching operation, described first and second operation posts 13 and 14 are separately positioned on the left and right sides of base station 10 and all are in the position of berthing, photoetching silicon chip W1, the process flow diagram of W2 and W3 as shown in Figure 8, referring to Fig. 8, after the photoetching task begins, at first first operation post 13 carries out last slice operation (S10) earlier, detailed process is: the first wafer-supporting platform 13d moves to last slice position from the position of berthing, and will treat that by last slice module photoetching silicon chip W1 is loaded on the first wafer-supporting platform 13d.
Described first operation post 13 is proceeded locating tab assembly operation (S11), detailed process is: the first wafer-supporting platform 13d moves to the locating tab assembly position, treat the surface topography of photoetching silicon chip W1 measures by aligning measurement module 21, wherein, described aligning measurement module 21 sends a measurement and finishes trigger pip to control module 15b after the measurement of finishing silicon chip W1.
Described first operation post 13 operation (S12) of proceeding to berth, detailed process is: the first wafer-supporting platform 13d that finishes measurement moves to the position of berthing, and by the locking part locking in the position of berthing.
The double platform system of rotation exchange of the present invention is afterwards proceeded operation post transposition operation (S20), and detailed process is: control base station drive unit 11 drove base station 10 is finished first operation post 13 and second operation post 14 along its central axis Rotate 180 degree transposition after control module 15b received the trigger pip of aiming at measurement module 21 transmissions.In this step, the detecting unit that is arranged on the base station 10 detects the angle that base station 10 rotates, control module 15b drives slowdown module 16 according to detected rotational angle so that base station 10 slows down, and base station 10 rotated 180 base station of control when spending locking unit 12 with base station 10 lockings on brace table 20c.
After this first operation post 13 and 14 parallel runnings of second operation post.Described first operation post 13 is proceeded exposure process (S13), detailed process is: the first wafer-supporting platform 13d moves to the exposure position from the position of berthing, and carry out exposure process by 22 couples of silicon chip W1 of exposure module, wherein, described exposure module 22 sends an exposure and finishes trigger pip to control module 15b behind the exposure process of finishing silicon chip W1.
Described first operation post 13 operation (S14) of proceeding to berth, detailed process is: the first wafer-supporting platform 13d moves to the position of berthing from the exposure position, and by the locking part locking in the position of berthing.
And described second operation post 14 carries out last slice operation (S30) earlier, and detailed process is: the second wafer-supporting platform 14d moves to last slice position from the position of berthing, and will treat that by last slice module photoetching silicon chip W2 is loaded on the second wafer-supporting platform 14d.
Described second operation post 14 is proceeded locating tab assembly operation (S31), detailed process is: the second wafer-supporting platform 14d moves to the locating tab assembly position, treat the surface topography of photoetching silicon chip W2 measures by aligning measurement module 21, wherein, described aligning measurement module 21 sends a measurement and finishes trigger pip to control module 15b after the measurement of finishing silicon chip W2.
Described second operation post 14 operation (S32) of proceeding to berth, detailed process is: the second wafer-supporting platform 14d that finishes measurement moves to the position of berthing, and by the locking part locking in the position of berthing.
The double platform system of rotation exchange of the present invention afterwards carries out operation post transposition operation (S21), detailed process is: control module 15b receives and aims at after measurement that measurement module 21 sends finishes exposure that trigger pip and exposure module 22 send and finish trigger pip, and control base station drive unit 11 drives base stations 10 are finished first operation post 13 and second operation post 14 along its central axis Rotate 180 degree transposition.
First operation post 13 and 14 concurrent workings of second operation post afterwards.
Described first operation post 13 is proceeded down sheet operation (S15), and detailed process is: the first wafer-supporting platform 13d moves to down the sheet position from the position of berthing, and the silicon chip W1 that will finish photoetching by following sheet module unloads from wafer-supporting platform.
First operation post 13 is proceeded an operation (S16), and detailed process is: the first wafer-supporting platform 13d moves to last slice position from following sheet position, and will treat that by last slice module photoetching silicon chip W3 is loaded on the first wafer-supporting platform 13d.
First operation post 13 is proceeded locating tab assembly operation (S17), detailed process is: the first wafer-supporting platform 13d moves to the locating tab assembly position, treat the surface topography of photoetching silicon chip W3 measures by aligning measurement module 21, wherein, described aligning measurement module 21 sends a measurement and finishes trigger pip to control module 15b after the measurement of finishing silicon chip W3.
Described first operation post 13 operation (S18) of proceeding to berth, detailed process is: the first wafer-supporting platform 13d is from moving to the position of berthing to the locating tab assembly position, and by the locking part locking in the position of berthing.
And described second operation post 14 is proceeded exposure process (S33), detailed process is: the second wafer-supporting platform 14d moves to the exposure position from the position of berthing, and expose by 22 couples of silicon chip W2 of exposure module, wherein, described exposure module 22 sends an exposure and finishes trigger pip to control module 15b after the exposure of finishing silicon chip W2.
Described second operation post 14 operation (S34) of proceeding to berth, detailed process is: the second wafer-supporting platform 14d moves to the position of berthing from the exposure position, and by the locking part locking in the position of berthing.
The double platform system of rotation exchange of the present invention afterwards carries out operation post transposition operation (S22), detailed process is: control module 15b receives and aims at after measurement that measurement module 21 sends finishes exposure that trigger pip and exposure module 22 send and finish trigger pip, and control base station drive unit 11 drives base stations 10 are finished first operation post 13 and second operation post 14 along its central axis Rotate 180 degree transposition.
First operation post 13 and 14 concurrent workings of second operation post afterwards.
Described first operation post 13 is proceeded exposure process (S19), detailed process is: the first wafer-supporting platform 13d moves to the exposure position from the position of berthing, and carry out exposure process by 22 couples of silicon chip W3 of exposure module, wherein, described exposure module 22 sends an exposure and finishes trigger pip to control module 15b behind the exposure process of finishing silicon chip W3.
Described first operation post 13 operation (S110) of proceeding to berth, detailed process is: the first wafer-supporting platform 13d moves to the position of berthing from the exposure position, and by the locking part locking in the position of berthing.
Described second operation post 14 is proceeded down sheet operation (S35), and detailed process is: the second wafer-supporting platform 14d moves to down the sheet position from the position of berthing, and the silicon chip W2 that will finish photoetching by following sheet module unloads from wafer-supporting platform.
Described second operation post 14 operation (S36) of proceeding to berth, detailed process is: the second wafer-supporting platform 14d moves to the position of berthing from sheet position down, and by the locking part locking in the position of berthing.
The double platform system of rotation exchange of the present invention afterwards carries out operation post transposition operation (S23), detailed process is: control module 15b receives after exposure that exposure module 22 sends finishes trigger pip, and control base station drive unit 11 drives base stations 10 are finished first operation post 13 and second operation post 14 along its central axis Rotate 180 degree transposition.
Described first operation post 13 is proceeded down sheet operation (S111), and detailed process is: the first wafer-supporting platform 13d moves to down the sheet position from the position of berthing, and unloads from wafer-supporting platform by the silicon chip W3 that last slice module will be finished photoetching.
Described first operation post 13 operation (S112) of proceeding to berth, detailed process is: the first wafer-supporting platform 13d moves to the position of berthing from sheet position down, and by the locking part locking in the position of berthing.
Hereto, the double platform system of the rotation of invention exchange has been finished the silicon chip W1, the W2 that are coated with photoresistance and the photoetching of W3.
When the double platform system that uses rotation exchange of the present invention carries out photoetching to large batch of silicon chip, aiming at measurement module 21 sides, carry out last slice operation in an orderly manner, following sheet operation, to the locating tab assembly operation and the operation of berthing, and in exposure module 22 sides, carry out exposure process in an orderly manner and the operation of berthing, the double platform system of rotation exchange simultaneously carries out operation post transposition operation in an orderly manner and descends the sheet operation for the silicon chip of finishing exposure process, and carry out exposure process for the silicon chip finished the locating tab assembly operation, so the carrying out of the photoetching of batch silicon wafer highly effective and safe on the double platform system of rotation exchange of the present invention.
It should be noted that base station drive unit 11 drives base stations 10 when its central axis Rotate 180 is spent, can turn clockwise also can be rotated counterclockwise.
Referring to Fig. 8, it has shown the structural representation of second embodiment of the double platform system that rotation of the present invention exchanges, the second embodiment of the present invention mainly is the big quality operation post at the high acceleration start-stop, the double platform system of the rotation exchange in the present embodiment is used for a litho machine, the double platform system of rotation exchange of the present invention comprises base station 30, base station drive unit 31, base station locking unit 32, first operation post 33, second operation post 34, control module 35, slowdown module 36, linkage unit 37, wherein, described control module 35 comprises detecting unit 35a and control module 35b, wherein, described litho machine comprises main frame 40, aim at measurement module 41, exposure module 42, last slice module (not shown), following sheet module (not shown).
Second embodiment and the first embodiment difference are as follows:
Described base station 30 is one the motion counter-force of operation post 13,14 can be converted into the balance mass body that internal force is eliminated.
Described base station drive unit 31 comprises servomotor 31a and the speed change gear 31b that links to each other with servomotor 31a.In the present embodiment, can drive the rotation of base station 30 by the operate together of servomotor 31a and speed change gear 31b.
For the vibrations that reduce base station drive unit 31 impact base station 30, output shaft 31c that can speed change gear 31b is set to lifting shaft, when need drive the base station rotation, starting lifting shaft makes linkage unit 37 contact with base station 30, formation base station 30 is connected with base station drive unit 31, if base station rotates when finishing, lifting shaft can be put down, linkage unit 37 is not contacted with base station 30, so can avoid the vibration influence base station 30 of base station drive unit 31.
The vibration problems that the double platform system of the rotation exchange among above-mentioned second embodiment has avoided big quality operation post transposition to be caused has improved the stability of rotation transposition greatly.
In sum, two operation posts shared one of the double platform system of rotation exchange of the present invention put sheet and reach sheet module down, saved cost greatly, moreover the double platform system of rotation exchange of the present invention drives the base station rotation by the base station drive unit, can finish the transposition that is arranged on two operation posts on the base station, two operation posts do not have the motion overlapping region, have avoided the hidden danger of two operation posts collisions, moreover the structure of the double platform system of rotation exchange also is simplified.
Claims (14)
1, a kind of double platform system that rotates exchange, being used for one has main frame and has the electronic equipment of two operation positions, it is characterized in that, the double platform system of this rotation exchange comprises the base station that is arranged on the main frame, to should two operation positions and be symmetricly set on first and second operation post on this base station, be used to drive the base station drive unit that base station rotates along this base station center and be used to control the base station drive unit and drive base station and rotate control module to realize that first operation post and second operation post replace
Wherein this main frame comprises U type support, is evenly distributed in a plurality of shock-damping structures of U type frame bottom and is arranged on the brace table that is used to support base station on the shock-damping structure,
The double platform system of this rotation exchange also comprises and is arranged on the brace table and is used for the base station locking unit of base station locking on this brace table, this control module also control base station locking unit with the base station locking on brace table.
2, the double platform system of rotation exchange as claimed in claim 1, it is characterized in that, this first and second operation post include parallel arrangement two X of base station one side to guide rail, be crossed on this two X to the Y between guide rail to guide rail, be arranged on this Y on guide rail and be used to carry the wafer-supporting platform of silicon chip, respectively drive X that this wafer-supporting platform moves along directions X and Y direction to driver element and Y to driver element.
3, the double platform system of rotation exchange as claimed in claim 2 is characterized in that, this X all satisfies barycenter driving principle to driver element and Y to the motion of drive unit drives wafer-supporting platform.
4, the double platform system of rotation exchange as claimed in claim 2 is characterized in that this X is linear electric motors to driver element and Y to driver element.
5, the double platform system of rotation exchange as claimed in claim 1, it is characterized in that this control module comprises that one is arranged on the base station and the detecting unit and that is used to detect the base station rotational angle is used to control the base station drive unit and drives the control module that base station rotates.
6, the double platform system of rotation exchange as claimed in claim 1 is characterized in that this brace table is the air supporting brace table.
7, the double platform system of rotation exchange as claimed in claim 1 is characterized in that this base station drive unit is arranged on the bottom of this brace table.
8, the double platform system of rotation exchange as claimed in claim 1 is characterized in that, this base station locking unit is an electromagnetic coupling device.
9, the double platform system of rotation exchange as claimed in claim 1 is characterized in that, this U type support end also is provided with and is used to drive the slowdown module that base station slows down.
10, the double platform system of rotation exchange as claimed in claim 1 is characterized in that this base station drive unit is a servomotor.
11, the double platform system of rotation exchange as claimed in claim 1 is characterized in that this base station drive unit comprises a servomotor and a speed change gear that links to each other with servomotor.
12, the double platform system of rotation exchange as claimed in claim 1 is characterized in that this electronic equipment is a litho machine.
13, the double platform system of rotation as claimed in claim 12 exchange is characterized in that, this litho machine has last slice module and sheet module once.
14, the double platform system of rotation exchange as claimed in claim 12 is characterized in that, this two operations position is respectively locating tab assembly position and exposure position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100417698A CN100504617C (en) | 2007-06-08 | 2007-06-08 | Double platform system for rotary exchange |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100417698A CN100504617C (en) | 2007-06-08 | 2007-06-08 | Double platform system for rotary exchange |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101071275A CN101071275A (en) | 2007-11-14 |
| CN100504617C true CN100504617C (en) | 2009-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100417698A Active CN100504617C (en) | 2007-06-08 | 2007-06-08 | Double platform system for rotary exchange |
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| CN (1) | CN100504617C (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101727019B (en) * | 2009-12-15 | 2011-05-11 | 清华大学 | Double-platform exchange system for silicon chip platform of lithography machine and exchange method thereof |
| CN101718959B (en) * | 2009-12-15 | 2011-05-11 | 清华大学 | Method and system for exchanging two silicon wafer stages of photoetching machine |
| CN102069425B (en) * | 2010-12-07 | 2013-06-05 | 天津大学 | Precise combined-machining equipment for complicated profiles made of hard and brittle materials |
| CN102141739B (en) | 2011-04-01 | 2013-01-16 | 清华大学 | Double-stage exchange system for lithography machine silicon wafer stages |
| CN102520587B (en) * | 2011-11-12 | 2013-09-18 | 哈尔滨工业大学 | Two-workpiece-platform rotary exchange method and device based on cable-box anti-rotation mechanisms |
| CN102393613B (en) * | 2011-11-12 | 2014-02-05 | 哈尔滨工业大学 | Double workpiece stage rotary exchange device based on synchronous gear direction adjustment |
| CN102508414B (en) * | 2011-11-12 | 2013-09-18 | 哈尔滨工业大学 | Rotary exchanging method and rotary exchanging device for double workpiece platforms based on synchronous steering of turntable gear |
| CN102495528B (en) * | 2011-11-12 | 2014-02-05 | 哈尔滨工业大学 | Double-workpiece-table same-phase rotation exchange method and device based on follow-up rotation-resisting mechanisms |
| CN103197506B (en) * | 2012-01-10 | 2015-11-18 | 上海微电子装备有限公司 | A kind of litho machine adopting mirror image silicon wafer stage |
| CN103454862B (en) * | 2012-06-05 | 2015-11-18 | 上海微电子装备有限公司 | For the workpiece table position error compensation method of lithographic equipment |
| CN105300435B (en) * | 2014-06-11 | 2018-01-19 | 京元电子股份有限公司 | Test system with non-contact conversion electric power |
| CN105319857B (en) * | 2014-07-11 | 2018-12-14 | 上海微电子装备（集团）股份有限公司 | Overloading platform lithography system and exposure method |
| CN104950599B (en) * | 2015-07-21 | 2019-07-19 | 合肥芯硕半导体有限公司 | A kind of LDI dual-workpiece exposure device and exposure method |
| CN108700827B (en) * | 2016-02-24 | 2020-07-24 | Asml荷兰有限公司 | Substrate processing system and lithographic apparatus |
-
2007
- 2007-06-08 CN CNB2007100417698A patent/CN100504617C/en active Active
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| CN101071275A (en) | 2007-11-14 |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |