CN100507574C - Probe card capable of transmitting differential signal pairs - Google Patents
Probe card capable of transmitting differential signal pairs Download PDFInfo
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- CN100507574C CN100507574C CNB2005101248433A CN200510124843A CN100507574C CN 100507574 C CN100507574 C CN 100507574C CN B2005101248433 A CNB2005101248433 A CN B2005101248433A CN 200510124843 A CN200510124843 A CN 200510124843A CN 100507574 C CN100507574 C CN 100507574C
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- sleeve pipe
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Abstract
The invention is a probe card which can transfer the differential signal pairs, it includes a circuit board and several differential probes, electronic circuit is laid on the circuit board and possesses several first and second wire, the first wires are duplicated adjacent and at least one second wire is surrounded the first wires, the second wire is electric-earthed; the differential probe possesses two needles and a coaxial line, the coaxial line includes two signal lines and a cannula, needle is mounted on one end of the signal line, the other end is electric-connected with the first wire which is duplicated adjacent, the cannula is electric-connected with the second wire, the adjacent two first wires and two signal wires which are connected with the two first wires have the same impedance matching; the needles are electric-contacted with electronic package, so the probe card can transfer the differential signal to the electronic package.
Description
Technical field
The present invention is relevant with probe, is meant a kind of probe that is transmitted into right differential wave especially.
Background technology
The design of general probe is considered with the volume production test that makes things convenient for semiconductor production line, be at the line design of electronic package to be measured and provide the test contacts can corresponding probe, transmission medium as output or acceptance test signal, few actual electrical operational function of considering electronic package, the circuit design of its probe is cooperated the measurement characteristics of signals, provide electronic package actual required electrical measurement condition.
Especially for the display panel that opto-electronics is produced, general display panel is to scan signal with high frequency to drive display frame, its employed chip for driving with output at a high speed, the differential wave of low noise and low electromagnetic interference (EMI) (Differential Signaling) is main, the quality of electronic package and fiduciary level necessary conditions more in the chip for driving simultaneously, for this reason, the shipment quality that chip provides manufacturer need guarantee electronic package, make those electronic packages all by accurate testing electrical property, so test signal need be stablized really and undistorted in the electrical measurement process, just can provide electronic package actual required electrical measurement condition; Test the employed differential wave of above-mentioned electronic package, be required to be that one group of size of current is identical, to flow to opposite signal right, signal is to also having specific impedance (impedance) coupling and electrical couplings effect mutually, therefore existing probe is only considered and the corresponding line design of the test contacts of testing component, can't make the circuit of transmission differential signal keep its characteristic impedance coupling and electrical couplings effect, only can test suite normally whether, actually can't determination component whether can operate in the required electrical specification, make the reliability that loses its electrical measurement.
Summary of the invention
Therefore, but fundamental purpose of the present invention is that the probe that provides a kind of transmitting differential signal right is provided, making provides the condition characteristic that has required test signal to the testing electrical property of electronic package to be measured, therefore keeps the reliability of electrical measurement.
Take off purpose for before reaching, but the right probe of a kind of transmitting differential signal provided by the present invention, include a circuit board and a plurality of differential probe, this circuit board is laid with electronic circuit, and have a upper surface and a lower surface, this two surface is to be provided with a plurality of and the contacted solder joint of this electronic circuit, this electronic circuit has a plurality of first and second leads, those first leads are adjacent right in order to transmit above-mentioned differential wave in pairs, adjacent two these first leads are also kept specific impedance matching mutually, and each is to being provided with at least one this second lead around this first lead, and those second leads are in order to electrical ground connection (ground); Those differential probes are located at the lower surface of this circuit board, respectively this differential probe has two syringe needles and a coaxial cable, respectively this coaxial cable has a sleeve pipe, binary signal line and at least one insulator, this sleeve pipe is to be equipped with this binary signal line and this insulator, respectively this signal wire correspondence is provided with respectively this syringe needle, this insulator is located at this sleeve pipe and respectively between this signal wire and for not having the insulating material of electric conductivity, this sleeve pipe, these two syringe needles and respectively this signal wire be all the metal material of tool electric conductivity, this sleeve pipe and respectively this signal wire be connected to respectively this solder joint of lower surface, make this sleeve pipe be electrically connected at respectively this second lead, this binary signal line is electrically connected at two adjacent these first leads, and the relative electrical resistance (impedance) of this binary signal line is kept and continuous two impedance matchings that this first lead is identical for adjusting to make; Therefore be electrically connected in order to measuring the tester table of above-mentioned electronic package by the solder joint with this upper surface, and respectively this syringe needle electrically contacts with this electronic package, then this probe can contact this electronic package of detection.
Below, cooperate diagram to enumerate some preferred embodiments now, in order to structure of the present invention and effect are elaborated, wherein used illustrated brief description is as follows:
Description of drawings
Fig. 1 is the side view of first preferred embodiment provided by the present invention;
Fig. 2 is the top view of above-mentioned first preferred embodiment;
Fig. 3 is the backplan of above-mentioned first preferred embodiment;
Fig. 4 is the electronic circuit schematic of above-mentioned first preferred embodiment, is illustrated as the topological design of first and second lead in the circuit board upper surface;
Fig. 5 is the online cut-open view of the 5-5 of Fig. 4;
Fig. 6 is the differential probe synoptic diagram of above-mentioned first preferred embodiment, is illustrated as the annexation of circuit board wiring district and probe base and differential probe;
Fig. 7 is the online cut-open view of the 7-7 of Fig. 6;
Fig. 8 is the coaxial probe synoptic diagram of above-mentioned first preferred embodiment, is illustrated as the annexation of circuit board wiring district and probe base and coaxial probe;
Fig. 9 is the online cut-open view of the 9-9 of Fig. 8;
Figure 10 is the side view of second preferred embodiment provided by the present invention;
Figure 11 is the top view of above-mentioned second preferred embodiment;
Figure 12 is the wire jumper synoptic diagram of above-mentioned second preferred embodiment, is illustrated as the set-up mode of wire jumper in circuit board wiring district and jumper zone, and with the annexation of differential probe;
Figure 13 is the online cut-open view of the 13-13 of Figure 12;
Figure 14 is the electric circuit construction synoptic diagram of the 3rd preferred embodiment provided by the present invention;
Figure 15 is the electric circuit construction synoptic diagram of the 4th preferred embodiment provided by the present invention;
Figure 16 is the electric circuit construction synoptic diagram of the 5th preferred embodiment provided by the present invention;
Figure 17 is the electric circuit construction synoptic diagram of the 6th preferred embodiment provided by the present invention;
Figure 18 is the electric circuit construction synoptic diagram of the 7th preferred embodiment provided by the present invention;
Figure 19 is the probe base synoptic diagram of the 8th preferred embodiment provided by the present invention;
Figure 20 is the differential probe structure synoptic diagram of the 9th preferred embodiment provided by the present invention;
Figure 21 is the differential probe structure synoptic diagram of the tenth preferred embodiment provided by the present invention;
Figure 22 is the differential probe structure synoptic diagram of the 11 preferred embodiment provided by the present invention;
Figure 23 is the differential probe structure synoptic diagram of the 12 preferred embodiment provided by the present invention.
Embodiment
See also Fig. 1 to first preferred embodiment provided by the present invention shown in Figure 3, be one in order to the right probe 1 of transmission differential signal, include a circuit board 10, one probe base, 20 a plurality of differential probes 30 and a plurality of coaxial probes 40, this circuit board 10 can define a upper surface 101, a lower surface 102, the test section 103 of one outer ring and the wiring region 104 of an inner ring, this circuit board 10 also is laid with electronic circuit 11, Fig. 2 reference, and this two surface 101 of 103 in the test section, be formed with most and these electronic circuit 11 contacted metal solder joints 51 on 102 respectively, 52, this two surface 101 in wiring region 104, be formed with most and these electronic circuit 11 contacted metal solder joints 53 on 102 respectively, 54, the part solder joint 51 of this upper surface 101 is to be electrically connected to a tester table (not shown), this tester table is for exporting differential wave to this probe 1, the part solder joint 54 of this lower surface 102 is to be electrically connected to those probes 30,40, Fig. 3 reference, wherein:
This electronic circuit 11 as shown in Figure 4, have a plurality of first and second leads 12,13, distribute and connect the solder joint 51 of this test section 103 and this wiring region 104,53, those first leads 12 are adjacent to transmit above-mentioned differential wave in pairs, adjacent spacing is the live width of each lead 12 approximately slightly, and along each to the both sides and the below of two these first leads 12 and be provided with this second lead 13, respectively between this second lead 13 and this first lead 12 apart from and greater than distance between adjacent two these first leads 12, Fig. 5 reference, those second leads 13 include ground wire 130 in order to electrical ground connection (ground) on the structure, grounding through hole 131 and ground plane 132; Ground wire 130 is positioned at this upper surface 101 and two these first lead, 12 sides is laid along each, grounding through hole 131 is for vertically running through this circuit board 10 to this two surface 101, on 102, ground plane 132 is for being laid in the circuit board 10, be formed at each to two these first lead, 12 belows and be connected in grounding through hole 131 with same layer plane processing procedure, the ground plane 132 of ground wire 130 and two these first lead, 12 belows is all as the electrical resistance reference data of this first lead 12 respectively, and the electrical protective action that prevents that the external noise undesired signal from transmitting arranged, the zero potential point that 132 of ground planes connect conducting to tester table, and when two these first leads 12 need vertically run through the lower surface 102 of conducting to circuit board 10 in wiring region 104, both sides are provided with respectively these grounding through hole 131 conducts respectively the electrical resistance reference data and the electrical protective action of this first lead 12, Fig. 6 reference equally.
As Fig. 3 and this probe base 20 shown in Figure 6, be to be arranged on the wiring region 104 of lower surface 102 of this circuit board 10, have a set collar 21 and a sticker 22, the material that is all tool electric conductivity is made, this set collar 21 is electrical ground connection also, this sticker 22 is in order to be fixedly connected on those probes 30,40 on this set collar 21, and those coaxial probes 40 are to be staggered to arrange with those differential probes 30.
Respectively this differential probe 30 as Figure 6 and Figure 7, have two syringe needles 31 and a coaxial cable 32, respectively this coaxial cable 32 is that a sleeve pipe 33 is arranged, two insulators 34 that this sleeve pipe 33 is coated and the signal wire 35 that coated of this insulator 34 respectively, and this sleeve pipe 33, respectively this insulator 34 reaches and respectively between this signal wire 35 suitable gap is arranged all, respectively this insulator 34 is not have an insulating material of electric conductivity, this sleeve pipe 33 and this signal wire 35 respectively are all the metal material of tool electric conductivity, the two ends of this signal wire 35 are to stretch out in outside this insulator 34 not coated by this insulator 34, and can define one first end 351 and one second end 352 that exposes, first end 351 is provided with respectively this syringe needle 31 by being electrically connected at solder joint 54, the second ends 352 of these first lead, 12 corresponding connections; The conductor of this syringe needle 31 for having suitable hardness and electric conductivity, test position in order to contact measured electronic package (not shown), this sleeve pipe 33 is electrically connected at the solder joint 54 with 131 corresponding connections of this grounding through hole, this sleeve pipe 33 also is fixedly connected on this set collar 21 by this sticker 22, therefore in the electrical signal process of these binary signal line 35 conduction, 33 conducts of this sleeve pipe are the electrical resistance reference data and the electrical protective action of this signal wire 35 respectively, and can adjust the relative electrical resistance of this binary signal line 35 by the change of these sleeve pipe 33 caliber structure size, make the relative electrical resistance that is same as this 2 first lead 12.
As Fig. 8 and respectively this coaxial probe 40 shown in Figure 9, have single core coaxial cable 41 and this syringe needle 31, the structure of this list core coaxial cable 41 is coaxial cables 32 of similar this differential probe 30, but only coat each this insulator 34 and signal wire 35 of one with a sleeve pipe 42, this sleeve pipe 42 is all the metal material of tool electric conductivity and is electrically connected at this grounding through hole 131, and be fixedly connected on this set collar 21 by this sticker 22, the signal wire 35 of this coaxial probe 40 sees through solder joint 54 and is electrically connected to electronic circuit 11, therefore when the test signal of the syringe needle 31 contact measured electronic packages of this coaxial probe 40 is exported the position, then can return test signal to tester table, the structure that this sleeve pipe 42 is coating this signal wire 35 then can be kept not induced attenuation and be not subjected to noise of return path signal, in addition in this electronic package must receive from this electronic circuit 11 during other signal except differential wave, this coaxial probe 40 also can in order to transmit other signal to this electronic package and keep signal not induced attenuation reach and be not subjected to noise.
Therefore the test section 103 of this probe 1 is connected to output the right tester table of differential wave is arranged, then by the signal wire 35 of those first lead, 12 transmitting differential signals to those differential probes 30, cooperation is with the topological design of second lead 13 around first lead 12, and with the structure of sleeve pipe 33 around this binary signal line 35, then 35 of two these signal wires of 12 in two these first leads and differential probe 30 all can be kept specific electric capacity in this transmitting differential signal process, the inductive coupling effect, make the characteristic of keeping impedance matching, then the electronic package of display panel chip for driving can obtain to meet the differential wave that measures specification, and also can keep the actual return path signal that records by the structure of this coaxial probe 40, therefore make this probe 1 have splendid electrical measurement reliability.
Certainly if electronic package has different test contacts designs, then the position of those syringe needle 31 transmission differential signals just needs realistic detection contact point, therefore the present invention also provides another preferred embodiment that can cooperate electronic package contact design to be measured, as Figure 10 and probe 2 shown in Figure 11, have a circuit board 60, this probe base 20, those probes 30,40 and a plurality of wire jumpers 70, wherein:
This circuit board 60 is to define this upper surface 101 and this lower surface 102 equally, and by this test section 103, outer ring to the inner ring distribution, one wiring region 601 and a jumper zone 602, this circuit board 60 also is laid with electronic circuit 61, and as Figure 11 and shown in Figure 12, this two surface 101 of 103 in the test section, be formed with respectively on 102 and this electronic circuit 61 contacted those solder joints 51,52, this two surface 101 in wiring region 601, be formed with respectively on 102 and this electronic circuit 61 contacted those solder joints 53,54, this two surface 101 in jumper zone 602, be formed with respectively on 102 and this electronic circuit 61 contacted solder joints 55,56, the solder joint 51 of this upper surface 101 is electrically connected to the tester table (not shown) equally, 56 of the solder joints of this lower surface 102 are electrically connected to those probes 30,40, this electronic circuit 61 has those first and second leads 12,13, the solder joint 53 to this wiring region 601 from the solder joint 51 of this test section 103 distributes.
Those wire jumpers 70 are to be located at this upper surface 101 and to connect the solder joint 55 to this jumper zone 602 from the solder joint 53 of this wiring region 601; respectively this wire jumper 70 is except having an outermost diaphragm 71 and not being provided with respectively this syringe needle 31; its inner structure is identical with coaxial cable 32 structures of above-mentioned this differential probe 30; repeat no more in this; Figure 13 reference; this diaphragm 71 is coated with this coaxial cable 32; and be not have an insulating material of electric conductivity; can make unlikely scratch or damage in order to protect its inner coaxial cable 32; two these signal wires 35 that this wire jumper 70 exposes except two ends, these sleeve pipe 33 two ends link to each other more respectively and are connected to a metal wire 72 identical with its material.
So those first and second leads 12, after 13 self-test districts 103 are connected to the solder joint 53 of wiring region 602 upper surfaces 101, directly do not run through conducting to lower surface 102, but will be respectively two these signal wires 35 of this wire jumper 70 1 ends and this metal wire 72 respectively correspondence be connected in two these first leads 12 and this second lead 13 and be welded in respectively this solder joint 53, respectively two of these wire jumper 70 other ends these signal wires 35 and 72 of this metal wires are welded in the solder joint 55 of jumper zone 602, and correspond respectively to two these signal wires 35 of this differential probe 30 respectively and each solder joint 56 that this sleeve pipe 33 was connected and run through conducting mutually; Therefore the test contacts of visual testing component design, at respectively these syringe needle 31 positions of the required correspondence of this test contacts respectively, design solder joint 55 positions of the jumper zone 602 that those wire jumpers 70 are connected, make this probe 2 not only can be, and can be applicable to the electronic package of multiple different topological design in order to the right test signal of transmission differential signal.
Other sees also as shown in figure 14 and to be the electronic circuit 14 of the 3rd preferred embodiment provided by the present invention, be to consider in above-mentioned first preferred embodiment with the spatial design of saving circuit layout, article two, this first lead 12 only is laid with the ground plane 132 of this second lead 13 in the below, other signal wire is then laid in both sides, these ground plane 132 same conducts are the electrical resistance reference data of this first lead 12 respectively, to keep the impedance matching that differential wave is transmitted.
Other sees also the electronic circuit 15 of the 4th preferred embodiment provided by the present invention as shown in figure 15, those first leads 12 are not to be located on this upper surface 101, but two these first leads 12 are located between two ground planes 132, in test section 103 only conducting in the solder joint 51 that is connected with tester table, in wiring region 104 only conducting in solder joint 54 (not shown) that are connected with those probes 30,40, not only keep the impedance matching property that differential wave is transmitted, and better electrical protective action is arranged along the upper and lower electrical ground connection of differential wave; Certainly if consider with the spatial design of saving circuit layout, then can be as the structural change of above-mentioned the 3rd preferred embodiment, lay in two these first lead, 12 both sides other signal wire but not those second leads 13, the electronic circuit 16 of the 5th preferred embodiment provided by the present invention shown in the 16 figure.
Other sees also the electronic circuit 17 of the 6th preferred embodiment provided by the present invention as shown in figure 17, have the signal conducting path of broad in 12 in those first leads of above-mentioned the 4th preferred embodiment, this electronic circuit 17 is to have the paired first neighbouring lead 171 to be located between two these ground planes 132, and the rough respectively thickness of this first lead 171 that is same as of adjacent segment, keep the impedance matching property of differential wave equally, and the signal conducting path of broad can reduce parasitic resistance effect and increase its electric conductivity; Certainly if consider with the spatial design of saving circuit layout, then can be as the structural change of above-mentioned the 3rd preferred embodiment, lay in two these first lead, 171 both sides other signal wire but not those second leads 13, the electronic circuit 18 of the 7th preferred embodiment provided by the present invention shown in the 18 figure.
Other sees also the probe base 80 of the 8th preferred embodiment provided by the present invention as shown in figure 19, be to have a set collar 81, a sticker 82 and a metallic film 83, its functional structure this probe base 20 in above-mentioned first preferred embodiment is this set collar 81 and the sticker 82 that does not have electric conductivity, is the metal material of tool electric conductivity as for 83 of this metallic films; After this sticker 82 is fixedly connected on those probes 30,40 on this set collar 81, again metallic film 83 sputters are made with the sleeve pipe 33 of this differential probe 30 (or sleeve pipe 42 of coaxial probe 40) respectively in the skin of this set collar 81 and sticker 82 and electrically conduct mutually, therefore this set collar 81 and sticker 82 can be not limited to metal material in taking of material, and have the characteristic of fixing respectively this probe 30,40 and electrical ground connection equally.
What deserves to be mentioned is, differential probe provided by the present invention is to adjust relative impedance between the binary signal line by the structure that changes insulator in the coaxial cable, as Figure 20 to Figure 23 respectively shown in each differential probe 90,91,92,93 of the 9th to 12 preferred embodiment provided by the present invention; This differential probe 90 is not to be coated with insulator 34 in the border of wherein this signal wire 35, is attached to these sleeve pipe 33 inwalls and Figure 20 reference is set and change into; This differential probe 91 is in respectively directly being attached with respectively this insulator 34 outside this signal wire 35, therefore only leaving the gap, Figure 21 reference between insulator 34 and the sleeve pipe 33; This differential probe 92 is above-mentioned this differential probe 91, and another changes structure, and the border of this signal wire 35 wherein is non-cohesive insulator 34, is attached to this sleeve pipe 33 internal layers and change into, Figure 22 reference; This differential probe 93 is not leave space, Figure 23 reference between the three fully in respectively filling up insulator 34 between this signal wire 35 and this sleeve pipe 33, making; So the purpose of those differential probe 90,91,92,93 same attainable costs inventions, and have more the function of adjusting the relative impedance between the binary signal line.
The above only is a preferable possible embodiments of the present invention, changes so use the equivalent structure that instructions of the present invention and claim do such as, ought to be included in the claim of the present invention.
Claims (58)
1. but the probe that transmitting differential signal is right is surveyed electronic package in order to contact, it is characterized in that, includes:
One circuit board, be laid with electronic circuit, this electronic circuit has a plurality of first and second leads, those first leads are adjacent right in order to transmit above-mentioned differential wave in pairs, adjacent two these first leads are also kept specific impedance matching mutually, and each is to being provided with at least one this second lead around this first lead, and those second leads are in order to electrical ground connection;
Described this circuit board can define relative a upper surface and a lower surface, and have the test section and the wiring region that distribute from outside to inside, be formed with most and the contacted metal solder joint of this electronic circuit on this two surface, the solder joint on surface is to be electrically connected to a tester table on this test section, this tester table is for exporting differential wave to this probe, and the solder joint of the lower surface of this wiring region is to be electrically connected to those differential probes; And
A plurality of differential probes are electrically connected at two these first leads respectively, and in order to contacting above-mentioned electronic package, and this probe can see through respectively should differential probe exports differential wave to this electronic package;
Described those second leads include ground wire, grounding through hole and ground plane, this ground wire is located at this upper surface, this grounding through hole is for vertically running through this circuit board to this two lip-deep solder joint, and this ground plane parallels with this two surface in the circuit board and is connected with this grounding through hole for being laid in.
2. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that described those first and second leads connect the solder joint of the upper surface of this test section and this wiring region.
3. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that described adjacent two these first leads are located between two these ground wires.
4. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that described adjacent two these first leads below is provided with this ground plane.
5. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that described adjacent two these first leads are to be located between two these ground planes.
6. but according to the right probe of the described transmitting differential signal of claim 5, it is characterized in that described two these first leads are neighbouring in pairs and are parallel to this ground plane.
7. but according to the right probe of the described transmitting differential signal of claim 5, it is characterized in that distance is same as the respectively thickness of this first lead between described adjacent two these first leads.
8. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that the solder joint of the described lower surface that is connected with this grounding through hole is to be connected with those differential probes.
9. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that described respectively this ground plane electrically conducts to the zero potential point of this tester table.
10. but according to the right probe of the described transmitting differential signal of claim 1, it is characterized in that, more include a probe base, be to be arranged on the lower surface of this circuit board, this probe base also has a set collar and a sticker, this set collar is electrical ground connection, and this sticker is in order to be connected in those differential probe stationary on this set collar.
But 11., it is characterized in that described this probe base has more a metallic film according to the right probe of the described transmitting differential signal of claim 10, being the metal material of tool electric conductivity, is that sputter is on this set collar and sticker.
12. but, it is characterized in that it is made that described this set collar and sticker are all the material of tool electric conductivity according to the right probe of the described transmitting differential signal of claim 10.
13. but, it is characterized in that the adjacent spacing of described adjacent two these first leads is same as the respectively live width of this first lead according to the right probe of the described transmitting differential signal of claim 1.
14. but, it is characterized in that distance is greater than the spacing of adjacent two these first leads between described respectively this second lead and adjacent this first lead according to the right probe of the described transmitting differential signal of claim 1.
15. but the probe that transmitting differential signal is right is surveyed electronic package in order to contact, it is characterized in that, include:
One circuit board, be laid with electronic circuit, this electronic circuit has a plurality of first and second leads, those first leads are adjacent right in order to transmit above-mentioned differential wave in pairs, adjacent two these first leads are also kept specific impedance matching mutually, and each is to being provided with at least one this second lead around this first lead, and those second leads are in order to electrical ground connection;
A plurality of differential probes are electrically connected at two these first leads respectively, and in order to contacting above-mentioned electronic package, and this probe can see through respectively should differential probe exports differential wave to this electronic package;
Described respectively this differential probe has one first coaxial cable, this first coaxial cable has a sleeve pipe, binary signal line and at least one insulator, this insulator is not have an insulating material of electric conductivity, this sleeve pipe and this binary signal line are all the metal material of tool electric conductivity, and this insulator is located at this sleeve pipe and respectively between this signal wire;
The two ends of described respectively this signal wire are to stretch out in this insulator not coated by this insulator, and define one first end and one second end that exposes, this first end is for being electrically connected at this first lead, this second end is provided with a syringe needle in order to contact this electronic package, and this syringe needle is the metal material of tool electric conductivity;
Distance is greater than the spacing of adjacent two these first leads between described respectively this second lead and adjacent this first lead.
16. but, it is characterized in that described this sleeve pipe is for being electrically connected at this second lead according to the right probe of the described transmitting differential signal of claim 15.
17. but, it is characterized in that the relative electrical resistance that the caliber of described this sleeve pipe of change can be adjusted this binary signal line makes the relative electrical resistance that is same as pairing two these first leads according to the right probe of the described transmitting differential signal of claim 15.
But 18., it is characterized in that described respectively this differential probe has two insulators according to the right probe of the described transmitting differential signal of claim 15, respectively this insulator is coaxial and be located at respectively around this signal wire with this signal wire respectively.
19. but, it is characterized in that described respectively this insulator is to be attached to respectively this signal wire according to the right probe of the described transmitting differential signal of claim 18.
20. but according to the right probe of the described transmitting differential signal of claim 15, it is characterized in that, described respectively this differential probe has two insulators, and wherein this first insulator is located at this internal surface of sleeve pipe, and this second insulator is coaxial and be located at around this signal wire with this signal wire wherein.
21. but, it is characterized in that described this second insulator is to coat pairing this signal wire according to the right probe of the described transmitting differential signal of claim 20.
22. but, it is characterized in that the insulator of described respectively this differential probe is to contact with this sleeve pipe and this binary signal line according to the right probe of the described transmitting differential signal of claim 15.
23. but according to the right probe of the described transmitting differential signal of claim 15, it is characterized in that, described this circuit board can define relative a upper surface and a lower surface, and have a test section, a wiring region and a jumper zone that ecto-entad distributes, be formed with most and the contacted metal solder joint of this electronic circuit on this two surface, the solder joint of the upper surface of this test section is to be electrically connected to a tester table, this tester table is for exporting differential wave to this probe, and the solder joint of the lower surface of this jumper zone is to be electrically connected to those differential probes.
24. but according to the right probe of the described transmitting differential signal of claim 23, it is characterized in that, more include a plurality of wire jumpers, be located at this upper surface and connect the solder joint to this jumper zone from the solder joint of this wiring region.
25. but according to the right probe of the described transmitting differential signal of claim 24, it is characterized in that, described respectively this wire jumper has one second coaxial cable and two metal wires, this second coaxial cable is to have a sleeve pipe, binary signal line and at least one insulator, this insulator is not have an insulating material of electric conductivity, this sleeve pipe, this two metal wire and this binary signal line are all the metal material of tool electric conductivity, and this sleeve pipe is located at by this insulator and respectively between this signal wire, this two metal wire is located at this sleeve pipe two ends respectively.
26. but according to the right probe of the described transmitting differential signal of claim 25, it is characterized in that, the two ends of the binary signal line of described respectively this wire jumper are to be electrically connected to two these first leads respectively to reach the respectively binary signal line of this differential probe, and respectively two of this wire jumper these metal wires are to be electrically connected to this second lead respectively to reach the respectively sleeve pipe of this differential probe.
27. but, it is characterized in that described respectively this wire jumper has more a diaphragm for not having the insulating material of electric conductivity, is in order to coat this second coaxial cable according to the right probe of the described transmitting differential signal of claim 25.
28. but according to the right probe of the described transmitting differential signal of claim 15, it is characterized in that, more include a plurality of coaxial probes, respectively this coaxial probe has a single core coaxial cable and a syringe needle, and this list core coaxial cable has a sleeve pipe, an insulator and a signal wire, and this insulator is not have an insulating material of electric conductivity, this sleeve pipe, this syringe needle and this signal wire are all the metal material of tool electric conductivity, this sleeve pipe coats this insulator, and this insulator coats this signal wire, and this signal wire is provided with this syringe needle.
But 29., it is characterized in that the sleeve pipe of described respectively this coaxial probe is electrical ground connection according to the right probe of the described transmitting differential signal of claim 28, respectively the syringe needle of this coaxial probe is in order to contact this electronic package.
30. but, it is characterized in that described respectively this coaxial probe can be in order to receive this electronic circuit that outputs signal to of this electronic package according to the right probe of the described transmitting differential signal of claim 29.
31. a probe is surveyed electronic package in order to contact, it is characterized in that, includes:
One circuit board is laid with electronic circuit, and has a upper surface and a lower surface, and this two surface is to be provided with a plurality of and the contacted solder joint of this electronic circuit;
Described this electronic circuit has a plurality of first and second leads, those first leads are adjacent in pairs, be provided with at least one this second lead around adjacent two these first leads, and adjacent two these first leads are electrically connected at respectively this binary signal line of this differential probe, those second leads are electrical ground connection, and are electrically connected at the respectively sleeve pipe of this differential probe;
A plurality of differential probes, be located at the lower surface of this circuit board, respectively this differential probe has two syringe needles and one first coaxial cable, respectively this first coaxial cable has a sleeve pipe, binary signal line and at least one insulator, this sleeve pipe is to be equipped with this binary signal line and this insulator, respectively this signal wire correspondence is provided with respectively this syringe needle, this insulator is located at this sleeve pipe and respectively also is insulating material between this signal wire, this sleeve pipe, these two syringe needles and respectively this signal wire be all the metal material of tool electric conductivity, and this sleeve pipe and respectively this signal wire be connected to respectively this solder joint of lower surface, the relative electrical resistance of this binary signal line is for adjusting;
Be electrically connected in order to measuring the tester table of above-mentioned electronic package by solder joint, and respectively this syringe needle electrically contacts with this electronic package, make this probe can contact this electronic package of detection this upper surface.
32. according to the described probe of claim 31, it is characterized in that, described this circuit board has a test section and a wiring region that distributes from outside to inside, and the solder joint of the upper surface of this test section is electrically connected to this tester table, and the solder joint of the lower surface of this wiring region is electrically connected to those differential probes.
33., it is characterized in that described those first and second leads are the solder joints that connect the upper surface of this test section and this wiring region according to the described probe of claim 32.
34. according to the described probe of claim 31, it is characterized in that, described those second leads include ground wire, grounding through hole and ground plane, this ground wire is located at this upper surface, this grounding through hole is for vertically running through this circuit board to this two lip-deep solder joint, and this ground plane parallels with this two surface in the circuit board and is connected with this grounding through hole for being laid in.
35., it is characterized in that described adjacent two these first leads are to be located between two these ground wires according to the described probe of claim 34.
36., it is characterized in that described adjacent two these first leads below is to be provided with this ground plane according to the described probe of claim 34.
37., it is characterized in that described adjacent two these first leads are to be located between two these ground planes according to the described probe of claim 34.
38., it is characterized in that described adjacent two these first leads are neighbouring in pairs and are parallel to this ground plane according to the described probe of claim 37.
39., it is characterized in that the rough respectively thickness of this first lead that is same as of distance between described adjacent two these first leads according to the described probe of claim 38.
40., it is characterized in that the solder joint of the described lower surface that is connected with this grounding through hole is that the sleeve pipe of those differential probes with each is connected according to the described probe of claim 34.
41., it is characterized in that described respectively this ground plane electrically conducts to the zero potential point of this tester table according to the described probe of claim 34.
42., it is characterized in that the adjacent spacing of described adjacent two these first leads is same as the respectively live width of this first lead according to the described probe of claim 31.
43., it is characterized in that the spacing of described respectively this second lead and adjacent this first lead is greater than the spacing of adjacent two these first leads according to the described probe of claim 31.
44. according to the described probe of claim 31, it is characterized in that, the two ends of described respectively this signal wire are to stretch out in this insulator not coated by this insulator, and can define one first end and one second end that exposes, this first end is that the solder joint that sees through lower surface is electrically connected at this first lead, and this second end is provided with this syringe needle.
45., it is characterized in that the relative electrical resistance that the caliber that changes this sleeve pipe is adjusted this binary signal line makes the relative electrical resistance that is same as pairing two these first leads according to the described probe of claim 44.
46., it is characterized in that described respectively this differential probe has two insulators according to the described probe of claim 44, respectively this insulator is coaxial and be located at respectively around this signal wire with this signal wire respectively.
47., it is characterized in that described respectively this insulator is to be attached to respectively this signal wire according to the described probe of claim 46.
48., it is characterized in that described respectively this differential probe has two insulators according to the described probe of claim 44, wherein this first insulator is located at this internal surface of sleeve pipe, this second insulator is coaxial and be located at around this signal wire with this signal wire wherein.
49., it is characterized in that described this second insulator is to coat pairing this signal wire according to the described probe of claim 48.
50., it is characterized in that the insulator of described respectively this differential probe is to contact with this sleeve pipe and this binary signal line according to the described probe of claim 44.
51. according to the described probe of claim 31, it is characterized in that, more include a probe base, be to be arranged on the lower surface of this circuit board, this probe base also has a set collar and a sticker, this set collar is electrical ground connection, and this sticker is in order to be connected in those differential probe stationary on this set collar and to make respectively that this sleeve pipe is electrically connected at this set collar.
52., it is characterized in that described this probe base has more a metallic film according to the described probe of claim 51, be the metal material of tool electric conductivity, be that sputter is on this set collar and sticker.
53., it is characterized in that it is made that described this set collar and sticker are all the material of tool electric conductivity according to the described probe of claim 51.
54. according to the described probe of claim 31, it is characterized in that, described this circuit board has a test section, a wiring region and the jumper zone that ecto-entad distributes, the solder joint on surface is electrically connected to this tester table on this test section, and the solder joint of the lower surface of this jumper zone is electrically connected to those differential probes.
55., it is characterized in that according to the described probe of claim 54, more include a plurality of wire jumpers, be located at this upper surface and connect the solder joint to this jumper zone from the solder joint of this wiring region.
56. according to the described probe of claim 55, it is characterized in that, described respectively this wire jumper has one second coaxial cable and two metal wires, this second coaxial cable is to have a sleeve pipe, binary signal line and at least one insulator, this insulator is an insulating material, this sleeve pipe, this two metal wire and this binary signal line are all the metal material of tool electric conductivity, and this sleeve pipe is located at by this insulator and respectively between this signal wire, this two metal wire is located at this sleeve pipe two ends respectively.
57., it is characterized in that the binary signal line of described respectively this wire jumper is to be electrically connected to respectively each signal wire of this differential probe respectively according to the described probe of claim 56, respectively the metal wire of this wire jumper is to be electrically connected to the respectively sleeve pipe of this differential probe.
58., it is characterized in that described respectively this wire jumper has more a diaphragm according to the described probe of claim 56, be in order to coat this second coaxial cable and to be insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101248433A CN100507574C (en) | 2005-11-22 | 2005-11-22 | Probe card capable of transmitting differential signal pairs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101248433A CN100507574C (en) | 2005-11-22 | 2005-11-22 | Probe card capable of transmitting differential signal pairs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1971285A CN1971285A (en) | 2007-05-30 |
| CN100507574C true CN100507574C (en) | 2009-07-01 |
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ID=38112200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101248433A Expired - Fee Related CN100507574C (en) | 2005-11-22 | 2005-11-22 | Probe card capable of transmitting differential signal pairs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100507574C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI444625B (en) * | 2012-03-20 | 2014-07-11 | Mpi Corp | High frequency probe card |
| US9429534B2 (en) * | 2013-05-16 | 2016-08-30 | Fluke Corporation | Method and apparatus for determining wire resistance |
| TW201500739A (en) * | 2013-06-24 | 2015-01-01 | Mpi Corp | Inspection device |
| TWI617811B (en) * | 2016-04-22 | 2018-03-11 | 新特系統股份有限公司 | Probe card |
-
2005
- 2005-11-22 CN CNB2005101248433A patent/CN100507574C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1971285A (en) | 2007-05-30 |
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